Air conditioner linkage heat dissipation device and vehicle-mounted semiconductor refrigerator

Abstract

The invention relates to an air conditioner linkage heat dissipation device and a vehicle-mounted semiconductor refrigerator. The technical problem that in the prior art, design is not reasonable enough is solved. Comprising a plurality of thermoelectric semiconductor sheets, a cold-end radiator, a cold-end radiating fan, a hot-end radiating device and a hot-end radiating fan, the hot-end radiating device and the hot-end radiating fan are installed in a radiating fan cover, a flow channel is arranged in the hot-end radiating device, the hot-end radiating device is connected with a refrigerating pipeline communicated with the flow channel, and the hot-end radiating fan is connected with the refrigerating pipeline. The refrigeration pipeline is connected with an air conditioner refrigeration system through an electromagnetic valve. The semiconductor refrigerator has the advantages that when the refrigerator starts refrigeration work, it is judged that the environment temperature is higher than a set threshold value, an air conditioner refrigeration system is started, air conditioner refrigerants are introduced into the heat dissipation end of the semiconductor refrigerator, the hot end heat dissipation fan is closed, and the thermoelectric semiconductor piece and the cold end heat dissipation fan are started to operate; the problem of poor refrigeration performance caused by insufficient heat dissipation of the refrigerator in a high-temperature environment is solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of inventing vehicle-mounted cooling and heating box equipment, and specifically relates to an air-conditioning linkage heat dissipation device and a vehicle-mounted semiconductor refrigerator. Background Art

[0002] As a kind of equipment that can effectively improve the user's driving experience, the on-board semiconductor refrigerator is widely used in high-end luxury models, commercial vehicles, long-distance trucks and other fields. During the operation of the on-board semiconductor refrigerator, the Peltier effect of the thermoelectric semiconductor is used to pump the heat inside the box out of the box to achieve cooling inside the box. When the thermoelectric semiconductor is reversely energized, the box can be heated again, that is, heat transfer is required between the refrigerator body and the external environment through heat exchange, so as to achieve temperature regulation inside the refrigerator. However, when the ambient temperature is high, the temperature of the heat dissipation end rises significantly, and then the temperature of the cold end rises accordingly, resulting in a significant reduction in the refrigeration performance of the semiconductor refrigerator, especially in summer. After exposure to the sun, the temperature inside the car is as high as 50-60°C, which greatly reduces the refrigeration effect of the on-board semiconductor refrigerator or even completely fails. Summary of the invention

[0003] The object of the present invention is to provide an air-conditioning linked heat dissipation device in view of the above problems.

[0004] Another object of the present invention is to provide a vehicle-mounted semiconductor refrigerator in view of the above-mentioned problem.

[0005] To achieve the above-mentioned purpose, the present invention adopts the following technical scheme: an air-conditioning linked heat dissipation device, comprising a plurality of thermoelectric semiconductor sheets, a cold-end radiator is provided on one side of the thermoelectric semiconductor sheet and a cold-end heat dissipation fan is provided on the outside of the cold-end radiator, a hot-end heat dissipation device is provided on the other side of the thermoelectric semiconductor sheet and a hot-end heat dissipation fan is provided on the outside of the hot-end heat dissipation device, the hot-end heat dissipation device and the hot-end heat dissipation fan are installed in a heat dissipation hood, the hot-end heat dissipation device has a flow channel inside, and a refrigeration pipeline connected to the flow channel is connected to the hot-end heat dissipation device, and the refrigeration pipeline is connected to the air-conditioning refrigeration system through a solenoid valve.

[0006] In the above-mentioned air-conditioning linked heat dissipation device, the number of the refrigeration pipelines is two, one end of one of the two refrigeration pipelines is the air-conditioning refrigeration system access end and one end of the other refrigeration pipeline is the air-conditioning refrigeration system return end.

[0007] In the above-mentioned air-conditioning linked heat dissipation device, the outer sides of the refrigeration pipelines are respectively wrapped with pipeline insulation layers.

[0008] In the above-mentioned air-conditioning linked heat dissipation device, the hot-end heat dissipation fan is arranged on one side of the hot-end heat dissipation device, one end of the heat dissipation hood has an opening and the side of the hot-end heat dissipation device in contact with the thermoelectric semiconductor sheet is located in the opening, one side of the heat dissipation hood is provided with an air inlet grille corresponding to the hot-end heat dissipation fan and the other side is provided with an air outlet grille corresponding to the side of the hot-end heat dissipation device away from the hot-end heat dissipation fan.

[0009] In the above-mentioned air-conditioning linked heat dissipation device, the flow channel is curved and formed in the hot-end heat dissipation device, and the hot-end heat dissipation device is respectively provided with a solenoid valve access end and a solenoid valve return end connected to the two ends of the flow channel, and the solenoid valve access end and the solenoid valve return end are respectively connected to the refrigeration pipeline.

[0010] In the above-mentioned air-conditioning linked heat dissipation device, the hot-end heat dissipation device includes a fin radiator having a plurality of heat dissipation fins, a plate heat exchanger is provided on the side of the fin radiator away from the heat dissipation fins, a curved groove is provided on the side of the plate heat exchanger corresponding to the fin radiator, and the groove is closed by one side of the fin radiator to form the above-mentioned flow channel.

[0011] In the above-mentioned air-conditioning linked heat dissipation device, the plate heat exchanger includes a large rectangular portion, a small rectangular portion connected to the large rectangular portion is provided in the middle of the lower end of the large rectangular portion, the groove is arranged in a curved shape on the large rectangular portion and the two ends extend to the small rectangular portion respectively, the side of the fin heat sink corresponding to the plate heat exchanger matches the shape of the large rectangular portion, and an extension portion corresponding to the small rectangular portion is provided at the lower end of the fin heat sink, and the solenoid valve access end and the solenoid valve return end are arranged on the extension portion.

[0012] In the above-mentioned air-conditioning linked heat dissipation device, the hot end heat dissipation device is an integrated fin heat sink, the flow channel is formed in the substrate of the integrated fin heat sink, and the solenoid valve access end and the solenoid valve return end are arranged on one side of the substrate.

[0013] A vehicle-mounted semiconductor refrigerator equipped with the above-mentioned air-conditioning linked heat dissipation device is as follows: a vehicle-mounted semiconductor refrigerator, comprising a refrigerator body, one side of the refrigerator body having an installation groove, a cold-end radiator and a cold-end heat dissipation fan being arranged in the installation groove, a heat dissipation hood being arranged through an insulation layer on one side of the refrigerator body, and the insulation layer being provided with installation holes for installing thermoelectric semiconductor sheets, a hot-end heat dissipation device and a hot-end heat dissipation fan being arranged in the heat dissipation hood, the hot-end heat dissipation device having a flow channel inside, and the flow channel being connected to a heat dissipation solenoid valve through a refrigeration pipeline and being connected to the whole vehicle air-conditioning refrigeration system.

[0014] In the above-mentioned vehicle-mounted semiconductor refrigerator, the cold end radiator and the cold end heat dissipation fan do not extend beyond the outside of the refrigerator body and the opening of the heat dissipation hood is closed by a heat insulation layer.

[0015] Compared with the prior art, the advantages of the present invention are:

[0016] 1. When the refrigerator starts refrigeration, it is judged that the ambient temperature is higher than the set threshold, the air conditioning refrigeration system is started, the air conditioning refrigerant is introduced to the heat dissipation end of the semiconductor refrigerator, the hot end heat dissipation fan is turned off, and the thermoelectric semiconductor chip and the cold end heat dissipation fan are started to solve the problem of poor refrigeration performance caused by insufficient heat dissipation of the refrigerator in a high temperature environment.

[0017] 2. According to the changes in ambient temperature, it can be judged whether the refrigerator heat dissipation requires air conditioning intervention, and the intervention control of air conditioning refrigeration can be realized through the solenoid valve, which will not affect the refrigeration and heating performance of the semiconductor refrigerator at all. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is an assembly diagram of the vehicle-mounted semiconductor refrigerator in the first embodiment of the present invention.

[0019] Figure 2 It is a structural explosion diagram of the vehicle-mounted semiconductor refrigerator in the first embodiment of the present invention.

[0020] Figure 3 It is a structural explosion diagram of the hot end heat dissipation device in the first embodiment of the present invention.

[0021] Figure 4 It is a schematic structural diagram of the hot end heat dissipation device in the second embodiment of the present invention.

[0022] In the figure: thermoelectric semiconductor sheet 1, refrigerator body 11, insulation layer 111, mounting hole 112, cold end radiator 2, cold end heat dissipation fan 3, hot end heat dissipation device 4, fin radiator 41, heat dissipation fin 411, plate heat exchanger 42, groove 43, large rectangular portion 44, small rectangular portion 45, extension portion 46, integrated fin radiator 47, base plate 48, hot end heat dissipation fan 5, heat dissipation hood 6, opening 61, air inlet grille 62, air outlet grille 63, flow channel 7, refrigeration pipeline 8, air conditioning refrigeration system access end 81, air conditioning refrigeration system return end 82, pipeline insulation layer 83, solenoid valve 9, solenoid valve access end 91, solenoid valve return end 92. DETAILED DESCRIPTION

[0023] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] Embodiment 1

[0025] like Figure 1-Figure 3As shown, an air-conditioning linked heat dissipation device comprises a plurality of thermoelectric semiconductor sheets 1, a cold-end heat sink 2 is provided on one side of the thermoelectric semiconductor sheet 1 and a cold-end heat dissipation fan 3 is provided on the outer side of the cold-end heat sink 2, a hot-end heat dissipation device 4 is provided on the other side of the thermoelectric semiconductor sheet 1 and a hot-end heat dissipation fan 5 is provided on the outer side of the hot-end heat dissipation device 4, the hot-end heat dissipation device 4 and the hot-end heat dissipation fan 5 are installed in a heat dissipation hood 6, a flow channel 7 is provided inside the hot-end heat dissipation device 4, and a refrigeration pipeline 8 connected to the flow channel 7 is connected to the hot-end heat dissipation device 4, and the refrigeration pipeline 8 is connected to the air-conditioning refrigeration system through a solenoid valve 9.

[0026] That is, the hot end heat sink 4 is connected to the solenoid valve 9 through the refrigeration pipeline 8 and is connected in parallel to the vehicle air conditioning refrigeration system, wherein the solenoid valve 9 is used to control the refrigerant to flow into the hot end heat sink 4, and by introducing the air conditioning refrigerant into the heat dissipation end of the semiconductor refrigerator, the problem of poor refrigeration performance caused by insufficient heat dissipation of the refrigerator in a high temperature environment is solved.

[0027] Preferably, there are two refrigeration pipelines 8, one end of one of the two refrigeration pipelines 8 is an air conditioning refrigeration system access end 81, and one end of the other refrigeration pipeline 8 is an air conditioning refrigeration system return end 82. The refrigeration pipelines 8 are respectively wrapped with pipeline insulation layers 83 on the outer sides. The pipeline insulation layers 83 are used for heat insulation of the refrigeration pipelines 8 and the solenoid valve 9.

[0028] The hot end heat dissipation fan 5 is arranged on one side of the hot end heat dissipation device 4, the heat dissipation hood 6 has an opening 61 at one end and the side of the hot end heat dissipation device 4 in contact with the thermoelectric semiconductor sheet 1 is located in the opening 61, the heat dissipation hood 6 has an air inlet grille 62 corresponding to the hot end heat dissipation fan 5 on one side and an air outlet grille 63 corresponding to the side of the hot end heat dissipation device 4 away from the hot end heat dissipation fan 5 on the other side. The heat dissipation hood 5 is used to separate the inlet and outlet air, that is, the ambient air is introduced into the hot end heat dissipation device 4, and after convection heat exchange, it is guided out to the external environment.

[0029] Furthermore, the flow channel 7 here is curved and formed in the hot end heat sink 4, and the hot end heat sink 4 is respectively provided with a solenoid valve access end 91 and a solenoid valve return end 92 connected to the two ends of the flow channel 7, and the solenoid valve access end 91 and the solenoid valve return end 92 are respectively connected to the refrigeration pipeline 8.

[0030] Among them, the hot end heat dissipation device 4 includes a fin radiator 41 having a plurality of heat dissipation fins 411, and a plate heat exchanger 42 is provided on the side of the fin radiator 41 away from the heat dissipation fins 411, and a groove 43 arranged in a curved shape is provided on the side of the plate heat exchanger 42 corresponding to the fin radiator 41, and the groove 43 is closed by one side of the fin radiator 41 to form the above-mentioned flow channel 7.

[0031] Specifically, the plate heat exchanger 42 here includes a large rectangular portion 44, and a small rectangular portion 45 connected to the large rectangular portion 44 is provided in the middle of the lower end of the large rectangular portion 44. The groove 43 is arranged in a curved shape on the large rectangular portion 44 and its two ends extend to the small rectangular portion 45 respectively. The side of the fin radiator 41 corresponding to the plate heat exchanger 42 matches the shape of the large rectangular portion 44, and an extension portion 46 corresponding to the small rectangular portion 45 is provided at the lower end of the fin radiator 41, and the solenoid valve access end 91 and the solenoid valve return end 92 are arranged on the extension portion 46.

[0032] In this embodiment, a vehicle-mounted semiconductor refrigerator includes a refrigerator body 11, one side of the refrigerator body 11 has an installation groove, a cold end radiator 2 and a cold end heat dissipation fan 3 are arranged in the installation groove, a heat dissipation hood 6 is arranged on one side of the refrigerator body 11 through a heat insulation layer 111, and a mounting hole 112 for installing a thermoelectric semiconductor sheet 1 is arranged on the heat insulation layer 111, a hot end heat dissipation device 4 and a hot end heat dissipation fan 5 are arranged in the heat dissipation hood 6, and the hot end heat dissipation device 4 has a flow channel 7 inside, and the flow channel 7 is connected to the heat dissipation solenoid valve 9 through a refrigeration pipeline 8 and connected to the vehicle air conditioning refrigeration system. Among them, the cold end radiator 2 and the cold end heat dissipation fan 3 do not extend beyond the outside of the refrigerator body 11, and the opening 61 of the heat dissipation hood 6 is closed by the heat insulation layer 111.

[0033] The principle of this embodiment is:

[0034] When the refrigerator starts refrigeration, it is judged that the ambient temperature is higher than the set threshold, the air conditioning refrigeration system is started, the heat dissipation solenoid valve 9 is opened, the hot end heat dissipation fan 5 is closed, and the thermoelectric semiconductor chip 1 and the cold end heat dissipation fan 3 start to operate. At this time, the hot end heat dissipation device 4 is equivalent to the air conditioning evaporator, that is, the air conditioning refrigerant flows into the hot end heat dissipation device 4, absorbs the hot end heat of the thermoelectric semiconductor chip 1, and reduces the hot end temperature of the thermoelectric semiconductor chip. The cold end of the thermoelectric semiconductor chip cools the cold end radiator 2, and enhances the convection heat exchange through the cold end heat dissipation fan 3, and the cold air is blown into the box body to improve the refrigeration effect inside the refrigerator. When it is judged that the ambient temperature is lower than the set threshold, the hot end heat dissipation fan 5 is started, and the heat dissipation solenoid valve 9 is closed. At this time, the hot end heat dissipation device 4 absorbs the heat dissipated by the thermoelectric semiconductor chip 1, and dissipates heat through air convection, reducing the hot end temperature of the thermoelectric semiconductor chip.

[0035] When the refrigerator starts the heating working mode, the hot end heat dissipation fan 5 is started, the heat dissipation solenoid valve 9 is closed, and the thermoelectric semiconductor sheet 1 and the cold end heat dissipation fan 3 start running. At this time, the hot end heat dissipation device 4 absorbs ambient heat through convection heat exchange, increases the temperature of the cold end of the thermoelectric semiconductor, and improves the heating efficiency.

[0036] Embodiment 2

[0037] like Figure 4As shown, the structure, principle and implementation steps of this embodiment are similar to those of the first embodiment, except that the hot end heat sink 4 is an integrated fin heat sink 47, the flow channel 7 is formed in the substrate 48 of the integrated fin heat sink 47, and the solenoid valve access end 91 and the solenoid valve return end 92 are arranged on one side of the substrate 48. That is, the flow channel 7 is arranged inside the substrate 48 of the integrated fin heat sink 47, and the flow channel 7 can be realized by an embedded welded copper tube or aluminum tube.

[0038] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the spirit of the present invention or exceed the scope defined by the appended claims.

[0039] Although the following terms are used more frequently in this article, such as thermoelectric semiconductor chip 1, refrigerator box 11, insulation layer 111, mounting hole 112, cold end radiator 2, cold end heat dissipation fan 3, hot end heat dissipation device 4, fin radiator 41, heat dissipation fin 411, plate heat exchanger 42, groove 43, large rectangular portion 44, small rectangular portion 45, extension portion 46, integrated fin radiator 47, substrate 48, hot end heat dissipation fan 5, heat dissipation hood 6, opening 61, air inlet grille 62, air outlet grille 63, flow channel 7, refrigeration pipeline 8, air conditioning refrigeration system access end 81, air conditioning refrigeration system return end 82, pipeline insulation layer 83, solenoid valve 9, solenoid valve access end 91, solenoid valve return end 92, etc., the possibility of using other terms is not excluded. These terms are used only to more conveniently describe and explain the essence of the present invention; interpreting them as any additional restrictions is contrary to the spirit of the present invention.

Claims

1. An air conditioning linked heat dissipation device, comprising a plurality of thermoelectric semiconductor sheets (1), wherein a cold end heat sink (2) is provided on one side of the thermoelectric semiconductor sheet (1) and a cold end heat dissipation fan (3) is provided on the outside of the cold end heat sink (2), and a hot end heat dissipation device (4) is provided on the other side of the thermoelectric semiconductor sheet (1) and a hot end heat dissipation fan (5) is provided on the outside of the hot end heat dissipation device (4), characterized in that: The hot end heat sink (4) and the hot end heat sink fan (5) are installed in a heat sink hood (6); a flow channel (7) is provided inside the hot end heat sink (4); and a refrigeration pipeline (8) connected to the flow channel (7) is connected to the hot end heat sink (4); and the refrigeration pipeline (8) is connected to the air conditioning refrigeration system via a solenoid valve (9).

2. The air conditioning linked heat dissipation device according to claim 1, characterized in that: The number of the refrigeration pipelines (8) is two, one end of one of the two refrigeration pipelines (8) is an air-conditioning refrigeration system access end (81), and one end of the other refrigeration pipeline (8) is an air-conditioning refrigeration system return end (82).

3. The air conditioning linked heat dissipation device according to claim 1, characterized in that: The refrigeration pipeline (8) is respectively wrapped with a pipeline insulation layer (83) on the outer side in the circumferential direction.

4. An air conditioning linked heat dissipation device according to claim 1, 2 or 3, characterized in that: The hot end heat dissipation fan (5) is arranged on one side of the hot end heat dissipation device (4); one end of the heat dissipation hood (6) has an opening (61) and the side of the hot end heat dissipation device (4) in contact with the thermoelectric semiconductor chip (1) is located in the opening (61); one side of the heat dissipation hood (6) has an air inlet grille (62) corresponding to the hot end heat dissipation fan (5) and the other side has an air outlet grille (63) corresponding to the side of the hot end heat dissipation device (4) away from the hot end heat dissipation fan (5).

5. The air conditioning linked heat dissipation device according to claim 4, characterized in that: The flow channel (7) is curved and formed in the hot end heat sink (4). The hot end heat sink (4) is provided with a solenoid valve access end (91) and a solenoid valve return end (92) respectively connected to the two ends of the flow channel (7). The solenoid valve access end (91) and the solenoid valve return end (92) are respectively connected to the refrigeration pipeline (8).

6. The air conditioning linked heat dissipation device according to claim 5, characterized in that: The hot end heat dissipation device (4) comprises a fin heat sink (41) having a plurality of heat dissipation fins (411); a plate heat exchanger (42) is provided on a side of the fin heat sink (411) away from the heat dissipation fins (411); a groove (43) arranged in a curved shape is provided on a side of the plate heat exchanger (42) corresponding to the fin heat sink (41); and the groove (43) is closed by one side of the fin heat sink (41) to form the above-mentioned flow channel (7).

7. The air conditioning linked heat dissipation device according to claim 6, characterized in that: The plate heat exchanger (42) comprises a large rectangular portion (44), a small rectangular portion (45) connected to the large rectangular portion (44) is provided in the middle of the lower end of the large rectangular portion (44), the groove (43) is arranged on the large rectangular portion (44) in a curved shape and the two ends extend to the small rectangular portion (45) respectively, the side of the fin heat sink (41) corresponding to the plate heat exchanger (42) matches the shape of the large rectangular portion (44), and an extension portion (46) corresponding to the small rectangular portion (45) is provided at the lower end of the fin heat sink (41), and the solenoid valve access end (91) and the solenoid valve return end (92) are arranged on the extension portion (46).

8. The air conditioning linked heat dissipation device according to claim 5, characterized in that: The hot end heat sink (4) is an integrated fin heat sink (47), the flow channel (7) is formed in a base plate (48) of the integrated fin heat sink (47), and the solenoid valve access end (91) and the solenoid valve return end (92) are arranged on one side of the base plate (48).

9. A vehicle-mounted semiconductor refrigerator equipped with an air-conditioning linked heat dissipation device as claimed in any one of claims 1 to 8, comprising a refrigerator body (11), characterized in that: The refrigerator body (11) has a mounting groove on one side, and a cold end radiator (2) and a cold end heat dissipation fan (3) are arranged in the mounting groove. A heat dissipation hood (6) is arranged on one side of the refrigerator body (11) through a heat insulation layer (111), and a mounting hole (112) for mounting a thermoelectric semiconductor chip (1) is arranged on the heat insulation layer (111). A hot end heat dissipation device (4) and a hot end heat dissipation fan (5) are arranged in the heat dissipation hood (6). The hot end heat dissipation device (4) has a flow channel (7) inside, and the flow channel (7) is connected to a heat dissipation solenoid valve (9) through a refrigeration pipeline (8) and is connected to the whole vehicle air conditioning refrigeration system.

10. The vehicle-mounted semiconductor refrigerator according to claim 9, characterized in that: The cold end radiator (2) and the cold end heat dissipation fan (3) do not extend beyond the outside of the refrigerator body (11), and the opening (61) of the heat dissipation hood (6) is closed by a heat insulation layer (111).

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