Display panel, manufacturing method thereof and display device

Abstract

The invention provides a display panel, a manufacturing method thereof and a display device. The display panel comprises an organic packaging layer located on the side, away from the substrate, of the light-emitting device, the organic packaging layer comprises a first part and a second part, the first part surrounds the second part, the first part is located in a frame area of the display panel, and the first part is of a pre-curing structure. According to the embodiment of the invention, the part of the organic packaging layer in the frame area of the display panel is preferentially cured to form the self-blocking structure for preventing the overflow of the organic components, so that a dam structure in the prior art can be omitted, and a narrow frame effect is realized. Besides, compared with the prior art, the side edge of the side, away from the display area, of the self-blocking structure has a large gradient, so that the risk that the side edge enters a large-view-angle view field is reduced, and the edge color cast phenomenon of the display panel is effectively improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0002] In recent years, with the development of display technology, the application and penetration rate of display devices has also increased. At present, more and more users are not only concerned about the types of functions and performance requirements of display devices, but also gradually pay attention to product parameters such as the thinness and overall narrow bezel of display devices. "Full screen" technology has continued to develop in the past two years. In order to increase the proportion of display area of ​​consumer electronics, compressing the screen bezel is an effective direction. In this way, the smaller the bezel, the larger the display area when the screen size remains unchanged. Therefore, the existing market has a more urgent demand for the narrow bezel design of the screen.

[0003] However, the overall narrow bezel design of existing display panels has little benefit. Summary of the invention

[0004] Embodiments of the present application provide a display panel and a method for manufacturing the same, as well as a display device, to further reduce the frame size of the display panel.

[0005] In a first aspect, a display panel is provided, wherein the display panel has a display area and a frame area surrounding the display area; the display panel comprises a substrate, a light-emitting device located on one side of the substrate, and an organic encapsulation layer located on a side of the light-emitting device away from the substrate; wherein the organic encapsulation layer comprises a first part and a second part, the first part surrounds the second part, the first part is located in the frame area, and the first part is a pre-cured structure.

[0006] In combination with the first aspect, in certain implementations of the first aspect, in a thickness direction of the substrate, a first height of the first portion is not less than a second height of the second portion.

[0007] In combination with the first aspect, in some implementations of the first aspect, a first width of an orthographic projection of the first portion on the substrate is not less than the first height.

[0008] In combination with the first aspect, in some implementations of the first aspect, the border area includes a first border sub-area and a second border sub-area that are adjacent to each other, the first border sub-area is located between the display area and the second border sub-area; and the first portion is located in the second border sub-area.

[0009] In combination with the first aspect, in certain implementations of the first aspect, the second portion includes a frame self-leveling portion, and the frame self-leveling portion is located in the first frame sub-area.

[0010] In combination with the first aspect, in some implementations of the first aspect, the second portion further includes a display self-leveling portion, and the display self-leveling portion is located in the display area.

[0011] In combination with the first aspect, in certain implementations of the first aspect, on a side of the second border sub-area away from the display area, the border area also includes an adjacent third border sub-area and a cutting area, and the third border sub-area is located between the second border sub-area and the cutting area; the orthographic projection of the organic encapsulation layer on the substrate does not overlap with the third border sub-area.

[0012] In combination with the first aspect, in certain implementations of the first aspect, the display panel also includes a first inorganic encapsulation layer and a second inorganic encapsulation layer, and in the third frame sub-area, the second inorganic encapsulation layer is located on the side of the first inorganic encapsulation layer away from the substrate, and the first inorganic encapsulation layer and the second inorganic encapsulation layer are bonded to each other.

[0013] In combination with the first aspect, in some implementations of the first aspect, the first inorganic encapsulation layer is located between the organic encapsulation layer and the substrate, and the second inorganic encapsulation layer is located on a side of the organic encapsulation layer away from the substrate.

[0014] In combination with the first aspect, in some implementations of the first aspect, the substrate includes a substrate and an inorganic film layer disposed on the substrate, and a portion of the inorganic film layer located in the third frame sub-region has a concave-convex structure.

[0015] In combination with the first aspect, in certain implementations of the first aspect, the inorganic film layer is an array inorganic film layer.

[0016] In combination with the first aspect, in some implementations of the first aspect, the display panel further includes at least one dam structure, the dam structure is located on a side of the first portion away from the display area, and the dam structure is located between the substrate and the first inorganic encapsulation layer.

[0017] In a second aspect, a method for manufacturing a display panel is provided, wherein the display panel includes a display area and a frame area surrounding the display area, the frame area includes a first frame sub-area and a second frame sub-area that are adjacently arranged, and the first frame sub-area is located between the display area and the second frame sub-area, and the method for manufacturing the display panel includes:

[0018] providing a substrate;

[0019] Prepare a light-emitting device layer in the display area on one side of the substrate;

[0020] An organic encapsulation material layer is prepared on a side of the light-emitting device layer away from the substrate, wherein the organic encapsulation material layer is located in the display area and a part of the frame area;

[0021] Curing the organic encapsulation material layer located in the second frame sub-region to obtain a first part;

[0022] The portion of the organic encapsulation material layer except the first portion is cured to obtain a second portion, and the second portion and the first portion constitute an organic encapsulation layer.

[0023] In combination with the second aspect, in certain implementations of the second aspect, preparing an organic encapsulation material layer on a side of the light-emitting device layer away from the substrate includes: preparing an organic encapsulation material layer in a frame area on a side of the light-emitting device layer away from the substrate; preparing an organic encapsulation material layer in a display area on a side of the light-emitting device layer away from the substrate.

[0024] In combination with the second aspect, in some implementations of the second aspect, before the step of preparing the organic encapsulation material layer in the display area on the side of the light-emitting device layer away from the substrate, the organic encapsulation material layer located in the second frame sub-area is cured to obtain the first part.

[0025] In combination with the second aspect, in some implementations of the second aspect, while preparing the organic encapsulation material layer in the border area on the side of the light-emitting device layer away from the substrate, the organic encapsulation material layer located in the second border sub-area is cured to obtain the first part.

[0026] In combination with the second aspect, in certain implementations of the second aspect, curing a portion of the organic packaging material layer located in the border area to obtain the first part includes: performing at least one of ultraviolet light curing, thermal curing, and chemical initiator curing on the organic packaging material layer located in the second border sub-area to obtain the first part.

[0027] In combination with the second aspect, in certain implementations of the second aspect, an organic encapsulation material layer is prepared on a side of the light-emitting device layer away from the substrate, and the organic encapsulation material layer is located in the display area and part of the frame area, including: an organic encapsulation material layer is prepared on a side of the light-emitting device layer away from the substrate, and the organic encapsulation material layer is located in the display area, the first frame sub-area and the second frame sub-area.

[0028] In combination with the second aspect, in some implementations of the second aspect, the border area further includes a third border sub-area and a cutting area, the third border sub-area surrounds the second border sub-area, and the cutting area surrounds the third border sub-area.

[0029] In combination with the second aspect, in certain implementations of the second aspect, before the step of preparing an organic encapsulation material layer on the side of the light-emitting device layer away from the substrate, wherein the organic encapsulation material layer is located in the display area and part of the border area, it also includes: preparing a first inorganic encapsulation layer on the side of the light-emitting device layer away from the substrate, wherein the first inorganic encapsulation layer is located in the display area, the first border sub-area, the second border sub-area and the third border sub-area.

[0030] In combination with the second aspect, in certain implementations of the second aspect, after the step of preparing an organic encapsulation material layer on the side of the light-emitting device layer away from the substrate, wherein the organic encapsulation material layer is located in the display area and part of the border area, it also includes: preparing a second inorganic encapsulation layer on the side of the organic encapsulation layer away from the substrate, wherein the second inorganic encapsulation layer is located in the display area, the first border sub-area, the second border sub-area and the third border sub-area.

[0031] In a third aspect, a display device is provided, comprising any one of the display panels mentioned above.

[0032] The present application provides a display panel and a manufacturing method thereof and a display device. The display panel includes an organic encapsulation layer located on a side of the light-emitting device away from a substrate, the organic encapsulation layer includes a first portion and a second portion, the first portion surrounds the second portion, and the first portion is located in a border area of ​​the display panel; the preparation process of the organic encapsulation layer includes a curing step, and the first portion performs the curing step prior to the second portion.

[0033] The embodiment of the present application preferentially solidifies a portion of the organic encapsulation layer located in the border area of ​​the display panel to form a self-blocking structure that prevents the overflow of organic components, thereby eliminating the dam structure in the prior art, thereby achieving a narrow border effect. In addition, compared with the prior art, the side of the self-blocking structure away from the display area has a larger slope to reduce the risk of the side entering the wide viewing angle field, thereby effectively improving the edge color shift phenomenon of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0035] Figure 1a It is a schematic diagram of the cross-sectional structure of a display panel in the prior art.

[0036] Figure 1b for Figure 1a A top view of the panel is shown in FIG.

[0037] Figure 2 FIG. 1 is a schematic diagram of a cross-sectional structure of a display panel in an embodiment of the present application.

[0038] Figure 3 FIG. 4 is a schematic diagram of a cross-sectional structure of a display panel in another embodiment of the present application.

[0039] Figure 4 FIG. 4 is a schematic diagram of a cross-sectional structure of a display panel in another embodiment of the present application.

[0040] Figure 5 FIG. 4 is a schematic diagram of a cross-sectional structure of a display panel in another embodiment of the present application.

[0041] Figure 6 This is a process flow chart of a method for manufacturing a display panel in yet another embodiment of the present application.

[0042] Figure 7 This is a schematic diagram of the preparation process of the first part in another embodiment of the present application.

[0043] Figure 8 This is a top view of a display device provided in yet another embodiment of the present application. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application. The features and exemplary embodiments of various aspects of the present application will be described in detail below.

[0045] Figure 1a is a schematic diagram of a cross-sectional structure of a display panel in the prior art, Figure 1b for Figure 1a The top view of the panel is shown in Figure . Figure 1a As shown, the display panel includes a stacked substrate 100 and a light emitting device 200, and an organic encapsulation layer 300 located on a side of the light emitting device 200 away from the substrate 100. The display panel has a display area AA and a frame area NA surrounding the display area. In the frame area NA, the display panel further includes a dam-shaped structure 400 located on a side of the organic encapsulation layer away from the display area AA.

[0046] The purpose of setting the dam-like structure 400 is to prevent the overflow of the organic material in the organic encapsulation layer. In order to achieve a good blocking effect, the overall length of the dam-like structure 400 cannot be too short. Therefore, the setting of the dam structure affects the narrow frame effect of the display panel, such as Figure 1b In addition, the side slope of the organic encapsulation layer away from the display area AA cannot be too large, which increases the risk of the side entering the wide viewing angle field during the use of the display device, causing edge color deviation under wide viewing angles, thereby affecting the display effect of the display panel.

[0047] In view of this, the present application provides a display panel and a manufacturing method thereof, as well as a display device, to further reduce the frame size of the display panel.

[0048] Figure 2 FIG. 1 is a schematic diagram of a cross-sectional structure of a display panel in an embodiment of the present application. Figure 2As shown, the display panel has a display area AA and a frame area NA surrounding the display area. The display panel includes a substrate 100, a light emitting device 200 located on one side of the substrate 100, and an organic encapsulation layer 300 located on a side of the light emitting device 200 away from the substrate 100. The organic encapsulation layer 300 includes a first portion 310 and a second portion 320, the first portion 310 surrounds the second portion 320, the first portion 310 is located in the frame area NA, and the first portion 310 is a pre-cured structure.

[0049] In this embodiment, the first part of the organic encapsulation layer is set by preferential curing to form a self-blocking structure to prevent the organic component from overflowing, and the dam structure in the prior art can be omitted, thereby achieving a narrow frame effect. In addition, compared with the prior art, the side of the self-blocking structure away from the display area has a larger slope to reduce the risk of the side entering the wide viewing angle field, thereby effectively improving the edge color shift phenomenon of the display panel.

[0050] In this embodiment, the pre-cured structure refers to that the curing time of the first part 310 and the second part 320 are different (cured twice), the first part 310 and the second part 320 are continuous along the plane direction of the organic encapsulation layer 300, and the structure formed by the first part 310 with an earlier curing time is defined as the pre-cured structure. Taking the inkjet printing method as an example, the organic coating can be sprayed once or twice, and the area where the first part 310 is located is first cured, so as to form a pre-cured structure to prevent the components of the second part 320 from overflowing.

[0051] In one embodiment, in the thickness direction of the substrate 100, the first height H1 of the first portion 310 is not less than the second height H2 of the second portion 320. In this embodiment, by setting the height of the first portion 310 to be not less than the height of the second portion 320, the first portion 310 can effectively block the overflow of organic components.

[0052] In one embodiment, in the thickness direction of the substrate 100 , the height of the first portion 310 is between 10 micrometers and 12 micrometers, such as 11 micrometers.

[0053] In one embodiment, the first width D1 of the orthographic projection of the first portion 310 on the substrate 100 is not less than the first height H1. In this embodiment, the width of the first portion 310 is set to be not less than the height of the first portion 310, in order to ensure the structural stability of the first portion 310 of the self-blocking structure, thereby ensuring the reliability of the display panel and further improving the effect of blocking the overflow of organic components.

[0054] In one embodiment, a minimum value of the first width D1 of the orthographic projection of the first portion 310 on the substrate 100 is 10 micrometers.

[0055] In one embodiment, the frame area NA includes a first frame sub-area NA1 and a second frame sub-area NA2 that are adjacent to each other, the first frame sub-area NA1 is located between the display area AA and the second frame sub-area NA2, and the first portion 310 is located in the second frame sub-area NA2. In this embodiment, a certain interval is provided between the first portion 310 as a self-blocking structure and the display area AA to reduce the probability that the side of the first portion 310 of the organic encapsulation layer 300 enters the wide viewing angle field, thereby reducing the risk of color deviation at the edge of the display panel.

[0056] In one embodiment, the second portion 320 includes a frame self-leveling portion 321 and a display self-leveling portion 322 , wherein the frame self-leveling portion 321 is located in the first frame sub-area NA1 , and the display self-leveling portion 322 is located in the display area AA.

[0057] In one embodiment, the orthographic projection of the frame self-leveling portion 321 on the substrate 100 is recorded as the second width D2, and the sum of the second width D2 and the first width D1 is between 150 microns and 200 microns. The value of the second width D2 is set in this way to ensure that the cathode layer of the light-emitting device is effectively overlapped in the frame area NA. Figure 2 As shown, in the frame area NA, the light emitting device 200 includes a cathode layer, and the cathode layer is overlapped with the frame area electrode in the frame area NA, in order to ensure the current continuity and stability of the display panel, prevent edge light emission, and improve the overall performance and reliability of the display panel. In the display area AA, the light emitting device 200 includes an anode layer, a light emitting functional layer, and a cathode layer stacked in sequence in a direction away from the substrate 100. Since it is a common technology in the art, it is not shown one by one in the figure.

[0058] In one embodiment, on the side of the second border sub-area NA2 away from the display area AA, the border area NA also includes a third border sub-area NA3 and a cutting area NA4 that are adjacently arranged, the third border sub-area NA3 is located between the second border sub-area NA2 and the cutting area NA4, and the orthographic projection of the organic encapsulation layer 300 on the substrate 100 does not overlap with the third border sub-area NA3.

[0059] In one embodiment, the display panel further includes a first inorganic encapsulation layer 500 and a second inorganic encapsulation layer 600. In the third frame sub-area NA3, the second inorganic encapsulation layer 600 is located on a side of the first inorganic encapsulation layer 500 away from the substrate 100, and the first inorganic encapsulation layer 500 and the second inorganic encapsulation layer 600 are attached to each other. The first inorganic encapsulation layer 500 is located between the organic encapsulation layer 300 and the substrate 100, and the second inorganic encapsulation layer 600 is located on a side of the organic encapsulation layer 300 away from the substrate 100.

[0060] In this embodiment, the first inorganic encapsulation layer 500 and the second inorganic encapsulation layer 600 are bonded to each other. On the one hand, the encapsulation effect can be improved and the influence of water and oxygen in the environment on the display panel can be reduced; on the other hand, the mechanical strength of the display panel can also be improved.

[0061] In one embodiment, the first inorganic encapsulation layer 500, the organic encapsulation layer 300 and the second inorganic encapsulation layer 600 together form the encapsulation structure of the display panel. The first inorganic encapsulation layer 500 and the second inorganic encapsulation layer 600 generally have high hardness and wear resistance, and mainly play the role of blocking external water and ions; the organic encapsulation layer 300 generally has good flexibility, and mainly plays a flattening role, and can also serve as a buffer layer between the inorganic encapsulation layer and the light-emitting device 200 to reduce the influence of stress on the light-emitting device 200.

[0062] In one embodiment, the organic encapsulation layer 300 is generally made of a polymer material, such as polyimide, polyamide, polyparaxylene, etc.; the first inorganic encapsulation layer 500 and the second inorganic encapsulation layer 600 are mainly composed of inorganic materials, such as metal oxides, nitrides or carbides, etc.

[0063] Figure 3 FIG. 1 is a schematic diagram of a cross-sectional structure of a display panel in another embodiment of the present application. Figure 2 compared to, Figure 3 The side edge 311 of the first portion 310 of the organic encapsulation layer 300 away from the display area AA is perpendicular to the substrate 100. Such a configuration can further reduce the risk of the side edge 311 entering the wide viewing angle field, thereby effectively improving the edge color shift phenomenon of the display panel.

[0064] It should be noted that in the actual production process of the display panel, a solution in which the side 311 has a larger slope is generally chosen rather than a solution in which the side 311 is perpendicular to the substrate 100. The reason is that in this solution, the risk of film cracking will increase during the subsequent preparation of the second inorganic encapsulation layer 600.

[0065] Figure 4 FIG. 1 is a schematic diagram of a cross-sectional structure of a display panel in another embodiment of the present application. Figure 2 compared to, Figure 4 The display panel shown further includes a dam structure 700, which is located in the third frame sub-area NA3 and is disposed between the substrate 100 and the first inorganic encapsulation layer 500. Figure 4 As shown, the dam structure 700 is composed of two sub-dams arranged at intervals. The dam structure 700 increases the mutual bonding area between the first inorganic encapsulation layer 500 and the second inorganic encapsulation layer 600, thereby further improving the barrier effect of the inorganic encapsulation layer against external water, oxygen, etc., and further improving the reliability of the encapsulation layer.

[0066] In addition, unlike the dam-like structure 400 shown in FIG. 1 , Figure 4 The dam structure 700 is no longer used to block the overflow of organic components, so relative to FIG. 1, Figure 4 The dam structure shown may have a shorter length, thereby facilitating the realization of a narrow frame effect of the display panel.

[0067] In one embodiment, the dam structure 700 can be obtained by etching and patterning the substrate 100 , or can be obtained by patterning the substrate 100 through steps such as deposition, coating, exposure, development, and etching.

[0068] In one embodiment, the substrate 100 includes a substrate and an inorganic film layer (not shown in the figure) disposed on the substrate, and a portion of the inorganic film layer located in the third frame sub-region has a concave-convex structure.

[0069] In this embodiment, by forming a concavo-convex structure on the inorganic film layer located in the third frame sub-region, the bonding area between the inorganic film layer and the first inorganic encapsulation layer 500 can be increased, thereby improving the bonding strength between the two and ensuring the effectiveness of the encapsulation.

[0070] In one embodiment, the inorganic film layer is an array inorganic film layer, which is compatible with the pixel layout of the display panel.

[0071] In one embodiment, the concave-convex structure is obtained by patterning the inorganic film layer, for example, by a photolithography process.

[0072] Figure 5 FIG. 1 is a schematic diagram of a cross-sectional structure of a display panel in another embodiment of the present application. Figure 2 compared to, Figure 5 The dam structure 800 of the display panel shown includes a sub-dam located in the third frame sub-area NA3. Figure 4 , under the condition that the length of the third frame sub-area NA3 is certain, adopt Figure 5 The manufacturing process of the dam structure 800 with a longer single sub-dam is simpler. Figure 4 Similar to the dam structure 700 of the illustrated embodiment, the provision of the dam structure 800 also increases the mutual bonding area between the first inorganic encapsulation layer 500 and the second inorganic encapsulation layer 600, thereby further improving the barrier effect of the inorganic encapsulation layer against external water, oxygen, etc., and further improving the reliability of the encapsulation layer.

[0073] In one embodiment, the dam structure of the display panel may also include three or even more sub-dams, which may be selected according to actual requirements of the inorganic encapsulation layer.

[0074] In one embodiment, in the thickness direction of the substrate 100 , the height of the dam structure 700 is between 6 micrometers and 7 micrometers.

[0075] In one embodiment, the dam structure 700 is disposed on an inorganic film layer. Optionally, a concave-convex structure is disposed on the inorganic film layer between two adjacent dam structures 700 .

[0076] The present application also provides a method for manufacturing a display panel, such as Figure 6 shown. Figure 6 This is a process flow chart of a method for manufacturing a display panel in another embodiment of the present application. The display panel includes a display area and a border area surrounding the display area. The border area NA includes a first border sub-area NA1 and a second border sub-area NA2 that are adjacent to each other. The first border sub-area NA1 is located between the display area AA and the second border sub-area NA2. The specific manufacturing steps of the display panel are described as follows.

[0077] S610: providing a substrate;

[0078] S620: preparing a light-emitting device layer in the display area on one side of the substrate;

[0079] S630: preparing an organic encapsulation material layer on a side of the light-emitting device layer away from the substrate, wherein the organic encapsulation material layer is located in the display area and a portion of the frame area;

[0080] S640: curing the organic encapsulation material layer located in the second frame sub-region to obtain a first part;

[0081] S650: curing the portion of the organic encapsulation material layer except the first portion to obtain a second portion, wherein the second portion and the first portion constitute an organic encapsulation layer.

[0082] In this embodiment, the first part of the organic encapsulation layer is set by preferentially solidifying the organic encapsulation layer located in the frame area to form a self-blocking structure to prevent the overflow of the organic component, which can omit the dam structure in the prior art, thereby achieving a narrow frame effect. In addition, compared with the prior art, the side of the self-blocking structure away from the display area has a larger slope to reduce the risk of the side entering the wide viewing angle field, thereby effectively improving the edge color shift phenomenon of the display panel.

[0083] In one embodiment, in step 630, preparing an organic encapsulation material layer on a side of the light-emitting device layer away from the substrate includes: preparing an organic encapsulation material layer in a frame area on a side of the light-emitting device layer away from the substrate; and preparing an organic encapsulation material layer in a display area on a side of the light-emitting device layer away from the substrate. In this embodiment, by preferentially preparing the organic encapsulation material layer in the frame area, the risk of organic component overflow can be avoided before the barrier structure is set.

[0084] In one embodiment, before the step of preparing the organic encapsulation material layer in the display area on the side of the light-emitting device layer away from the substrate, the organic encapsulation material layer located in the second frame sub-area NA2 is cured to obtain the first part. In this embodiment, the organic encapsulation material layer is prepared in a part of the frame area and then cured. When the width of the first part is narrow, the organic component overflow phenomenon hardly occurs. After the first part is formed, it can serve as a blocking structure to prevent the organic component from overflowing.

[0085] In one embodiment, while preparing the organic encapsulation material layer in the frame area on the side of the light-emitting device layer away from the substrate, the organic encapsulation material layer located in the second frame sub-area NA2 is cured to obtain the first part, specifically as follows: Figure 7 shown. Figure 7 This is a schematic diagram of the preparation process of the first part in another embodiment of the present application. Figure 7 As shown, during the production process of the first part of the display panel 10, the curing equipment 1 and the organic material preparation equipment 2 are combined together, and the preparation process of the organic encapsulation material layer and the curing process of the organic encapsulation material layer are carried out simultaneously, which can further avoid the overflow of organic components during the first preparation process.

[0086] In one embodiment, the organic encapsulation material layer is prepared by coating or inkjet printing.

[0087] In one embodiment, the organic encapsulation material layer located in the second frame sub-area NA2 is cured to obtain the first part including:

[0088] The organic encapsulation material layer partially located in the frame area is subjected to at least one of ultraviolet light curing, thermal curing and chemical initiator curing to obtain a first part.

[0089] In one embodiment, before the step S650 of curing the portion of the organic encapsulation material layer except the first portion, the step further includes: allowing the portion of the organic encapsulation material layer except the first portion to stand still to allow it to level itself.

[0090] In one embodiment, an organic encapsulation material layer is prepared on a side of the light-emitting device layer away from the substrate, and the organic encapsulation material layer is located in the display area and part of the frame area, including: an organic encapsulation material layer is prepared on a side of the light-emitting device layer away from the substrate, and the organic encapsulation material layer is located in the display area, the first frame sub-area, and the second frame sub-area.

[0091] In one embodiment, the border area also includes a third border sub-area and a cutting area, the third border sub-area surrounds the second border sub-area, and the cutting area surrounds the third border sub-area; before the step of preparing an organic encapsulation material layer on the side of the light-emitting device layer away from the substrate, the organic encapsulation material layer is located in the display area and part of the border area, it also includes: preparing a first inorganic encapsulation layer on the side of the light-emitting device layer away from the substrate, the first inorganic encapsulation layer is located in the display area, the first border sub-area, the second border sub-area and the third border sub-area.

[0092] The present application also provides a display device, comprising any one of the display panels described above, referring to Figure 8 As shown, Figure 8 FIG. 1 is a top view of a display device provided in another embodiment of the present application. Figure 8 As shown, a display device using any display panel of the present application has a smaller frame than the prior art. The display device provided in the embodiment of the present application can be a mobile terminal, such as a mobile phone.

[0093] The display device provided in the embodiment of the present invention may also be a notebook, a tablet computer, a computer, a wearable device, etc., and this application does not make any specific restrictions on this.

[0094] It should be noted that in the drawings of the present application document, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0095] In addition, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0096] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel has a display area and a frame area surrounding the display area, and includes: substrate; a light emitting device, located on one side of the substrate; and An organic encapsulation layer, located on a side of the light-emitting device away from the substrate; The organic encapsulation layer includes a first portion and a second portion, the first portion surrounds the second portion, the first portion is located in the frame area, and the first portion is a pre-cured structure.

2. The display panel according to claim 1, characterized in that: In the thickness direction of the substrate, a first height of the first portion is not less than a second height of the second portion; Preferably, a first width of an orthographic projection of the first portion on the substrate is not less than the first height.

3. The display panel according to claim 1, characterized in that: The frame area includes a first frame sub-area and a second frame sub-area that are adjacently arranged, the first frame sub-area is located between the display area and the second frame sub-area; the first portion is located in the second frame sub-area; Preferably, the second portion includes a frame self-leveling portion, and the frame self-leveling portion is located in the first frame sub-area; Preferably, the second portion further comprises a display self-leveling portion, and the display self-leveling portion is located in the display area.

4. The display panel according to claim 3, characterized in that: On a side of the second frame sub-region away from the display region, the frame region further includes a third frame sub-region and a cutting region that are adjacently arranged, and the third frame sub-region is located between the second frame sub-region and the cutting region; the orthographic projection of the organic encapsulation layer on the substrate does not overlap with the third frame sub-region; Preferably, the display panel further comprises a first inorganic encapsulation layer and a second inorganic encapsulation layer, and in the third frame sub-region, the second inorganic encapsulation layer is located on a side of the first inorganic encapsulation layer away from the substrate, and the first inorganic encapsulation layer and the second inorganic encapsulation layer are attached to each other; Preferably, the first inorganic encapsulation layer is located between the organic encapsulation layer and the substrate, and the second inorganic encapsulation layer is located on a side of the organic encapsulation layer away from the substrate; Preferably, the substrate comprises a substrate and an inorganic film layer disposed on the substrate, and a portion of the inorganic film layer located in the third frame sub-region has a concave-convex structure; Preferably, the inorganic film layer is an array inorganic film layer.

5. The display panel according to claim 4, characterized in that: The display panel further includes at least one dam structure, wherein the dam structure is located at a side of the first portion away from the display area, and the dam structure is located between the substrate and the first inorganic encapsulation layer.

6. A method for manufacturing a display panel, characterized in that: The display panel includes a display area and a frame area surrounding the display area, the frame area includes a first frame sub-area and a second frame sub-area that are adjacently arranged, the first frame sub-area is located between the display area and the second frame sub-area, and the manufacturing method of the display panel includes: providing a substrate; Prepare a light-emitting device layer in the display area on one side of the substrate; Preparing an organic encapsulation material layer on a side of the light-emitting device layer away from the substrate, wherein the organic encapsulation material layer is located in the display area and a portion of the frame area; Curing the organic encapsulation material layer located in the second frame sub-region to obtain a first part; The portion of the organic encapsulation material layer except the first portion is cured to obtain a second portion, and the second portion and the first portion constitute an organic encapsulation layer.

7. The method for manufacturing a display panel according to claim 6, characterized in that: The step of preparing an organic encapsulation material layer on a side of the light-emitting device layer away from the substrate comprises: Preparing an organic encapsulation material layer in the frame area on a side of the light-emitting device layer away from the substrate; An organic encapsulation material layer is prepared in the display region on a side of the light emitting device layer away from the substrate.

8. The method for manufacturing a display panel according to claim 7, characterized in that: Before the step of preparing an organic encapsulation material layer in the display area on the side of the light-emitting device layer away from the substrate, curing the organic encapsulation material layer located in the second frame sub-area to obtain the first part; Preferably, while preparing the organic encapsulation material layer in the frame region on the side of the light-emitting device layer away from the substrate, the organic encapsulation material layer located in the second frame sub-region is cured to obtain the first part; Preferably, curing the organic encapsulation material layer located in the second frame sub-region to obtain the first part comprises: The organic encapsulation material layer located in the second frame sub-region is subjected to at least one of ultraviolet light curing, thermal curing, and chemical initiator curing to obtain a first part.

9. The method for manufacturing a display panel according to claim 6, wherein: The step of preparing an organic encapsulation material layer on a side of the light-emitting device layer away from the substrate, wherein the organic encapsulation material layer is located in the display area and a portion of the frame area, comprises: Preparing an organic encapsulation material layer on a side of the light-emitting device layer away from the substrate, wherein the organic encapsulation material layer is located in the display area, the first frame sub-area, and the second frame sub-area; Preferably, the border area further includes a third border sub-area and a cutting area, the third border sub-area surrounds the second border sub-area, and the cutting area surrounds the third border sub-area; Preferably, before the step of preparing an organic encapsulation material layer on a side of the light-emitting device layer away from the substrate, wherein the organic encapsulation material layer is located in the display area and a portion of the frame area, the method further comprises: A first inorganic encapsulation layer is prepared on a side of the light-emitting device layer away from the substrate, wherein the first inorganic encapsulation layer is located in the display area, the first frame sub-area, the second frame sub-area and the third frame sub-area; Preferably, the step of preparing an organic encapsulation material layer on a side of the light-emitting device layer away from the substrate, wherein the organic encapsulation material layer is located in the display area and a portion of the frame area, further comprises: A second inorganic encapsulation layer is prepared on a side of the organic encapsulation layer away from the substrate, and the second inorganic encapsulation layer is located in the display area, the first frame sub-area, the second frame sub-area and the third frame sub-area.

10. A display device, characterized in that: The invention comprises a display panel as claimed in any one of claims 1 to 5.

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