Hyperspectral modular imaging structure and system based on inverse piezoelectric effect

By introducing a hyperspectral module based on inverse piezoelectric effect in the imaging system, the light wave tuning and interference effects are used to solve the shortcomings in the information transmission and identification accuracy of existing imaging systems, and efficient and accurate object analysis and diversified application scenarios are achieved.

CN119697478AInactive Publication Date: 2025-03-25WUXI CAIHONG XINYU TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202411876655.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-19
Publication Date
2025-03-25
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

The existing imaging systems have distortion and errors in information transmission and identification accuracy, and cannot effectively identify the invisible light areas, limiting application scenarios.

Method used

Using a hyperspectral modular imaging structure based on the inverse piezoelectric effect, the optical wave tuning and interference effect are realized through the air separation method-amber cavity and the inverse piezoelectric mechanical axis in the hyperspectral module, a hyperspectral image is generated, and the chemical composition and characteristics of the object are analyzed.

Benefits of technology

It realizes the embedding of hyperspectral modules in existing imaging equipment and converting them into hyperspectral imaging systems, which improves recognition accuracy and applicability, reduces light losses, enhances light energy utilization, and expands application scenarios.

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Abstract

The invention discloses a hyperspectral modular imaging structure and system based on an inverse piezoelectric effect, and belongs to the field of imaging systems. A hyperspectral modular imaging structure based on an inverse piezoelectric effect comprises a measured object, and further comprises a lens group and a CMOS photosensitive element, the lens group serves as image transmission equipment, and a target phase surface is projected into the CMOS photosensitive element; the CMOS photosensitive element transmits image information to intelligent equipment for data analysis and processing; the hyperspectral module comprises a silicon-based substrate I and a silicon-based substrate II, and a reflector M1 and a reflector M2 are arranged between the silicon-based substrate I and the silicon-based substrate II; according to the invention, conversion from common imaging equipment to a hyperspectral system can be realized, the system is low in mass production price, high in adaptability, free of interference on the existing imaging system, light in size and multiple in application scenes, and the problem that the hyperspectral imaging detection technology cannot be popularized in consumer-level products is solved from multiple angles.
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