Electronic device including heat dissipation member

By designing a slidable heat dissipation member in a portable electronic device, the problem of increasing heat generation density is solved, and more effective heat diffusion and overall heat dissipation performance are achieved.

CN119698932APending Publication Date: 2025-03-25SAMSUNG ELECTRONICS CO LTD
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Patent Information

Application Number
CN202380059241.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-08-01
Filing Date
2023-08-11
Publication Date
2025-03-25

AI Technical Summary

Technical Problem

While integrating high performance and high integration, portable electronic devices face the problem of increasing heat generation density, which makes it difficult for the heat dissipation structure to effectively dissipate heat.

Method used

A heat dissipation member including a first area S1 and a second area S2 is designed, the first area S1 is positioned overlapping with the first housing, the second area S2 extends from the first area S1 and overlaps with the second housing, and the second area of ​​the heat dissipation member is slidable to adapt to the deployed and folded state of the electronic device.

Benefits of technology

Through this design, heat can effectively spread to the entire electronic device, avoiding heat concentration in specific areas, and improving the overall heat dissipation performance of the electronic device.

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Abstract

An electronic device according to an embodiment of the present disclosure may include: a first housing; a second housing; a hinge structure connected to the first housing and the second housing to enable rotation of the first housing and the second housing when the electronic device changes its state between the unfolded state and the folded state; a flexible display accommodated in the first case and the second case and positioned to be unfolded or bent when a state of the electronic device is changed between an unfolded state and a folded state; and a heat dissipation member (310) including a first region (S1) positioned to overlap with at least a portion of the first case when viewed in a direction perpendicular to the first case, and a second region (S2) extending from the first region and positioned to overlap with at least a portion of the second case when viewed in a direction perpendicular to the second case. When a state of the electronic device is changed between an unfolded state and a folded state, a first region of the heat dissipation member may be fixed to the first housing or at least one component accommodated in the first housing, and a second region may be positioned to slide relative to the second housing.
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