Double-layer LED and preparation method thereof

By adopting a double-layer LED design in the LED light source, the high reflectivity of the aluminum plate and the diverse light colors of the fluorescent glue are used to solve the problem of improving the heat dissipation and light colors of the existing LED light sources, and achieve higher brightness, more uniform light colors and thinner LED products.

CN119730536APending Publication Date: 2025-03-28BRIDGELUX OPTOELECTRONICS (XIAMEN) CO LTD
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Patent Information

Application Number
CN202411904486.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-23
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

The room for improvement in existing LED light source products in terms of structure and materials is gradually reduced, especially in terms of heat dissipation capacity and light color improvement ratio, which is difficult to meet the demand for high-brightness and diverse light sources in complex environments.

Method used

A double-layer LED design is adopted, in which the substrate layer is composed of a second mirror aluminum plate and a first mirror aluminum plate. A through hole is set to form a concave lamp position, an LED chip is placed, and a first fluorescent glue and a second fluorescent glue are used in the fluorescent glue layer to emit single red fluorescent and single green fluorescent respectively, so that the diversified light color is achieved by adjusting the ratio and concentration of the phosphor.

Benefits of technology

It improves the brightness and heat dissipation ability of LEDs, enhances the light reflection ability and the uniformity of light color, realizes thinner and more efficient LED products, and also has the function of color temperature switching.

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Abstract

The invention discloses a double-layer LED and a preparation method thereof, and relates to the field of light-emitting devices, a substrate layer of the double-layer LED is composed of a second mirror surface aluminum plate and a first mirror surface aluminum plate, the second mirror surface aluminum plate is provided with a plurality of through holes in the bottom surface area of a bowl cup, and the lower ends of the through holes lead to the upper surface of the first mirror surface aluminum plate to form concave lamp positions. The first fluorescent glue layer is filled in part or all of the concave lamp positions, and positioning and quantitative filling of the first fluorescent glue layer are realized by means of the concave lamp positions, so that the LED chip is better covered, and the uniformity of light color is improved. And the bowl cup and the other concave lamp positions are filled with the second fluorescent glue layers, so that double-layer dispensing is realized, and the diversity of products is improved. Meanwhile, diffusion is conducted from the bottom through the first mirror face aluminum plate, transverse diffusion can also be conducted through the second mirror face aluminum plate, and the heat dissipation effect is good. And the concave lamp position can increase the depth of the bowl cup, so that a lower box dam and less fluorescent glue are allowed to be used under the condition of ensuring that the bonding wire is not exposed, and a thinner LED product is realized.
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