A liquid metal heat pipe and heat dissipation device used in space microgravity environment
By designing a liquid metal heat pipe composed of a multi-layer liquid absorbent core and a thermal conduction layer in a space microgravity environment, the problem of insufficient anti-gravity heat transfer performance in this environment is solved, and efficient heat dissipation and temperature stability are achieved.
Patent Information
- Application Number
- CN202411654176.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-19
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2044-11-19
AI Technical Summary
Existing heat pipes are difficult to ensure anti-gravity heat transfer performance in space microgravity environments, resulting in poor heat dissipation effect and affecting the temperature stability of satellite equipment.
A liquid metal heat pipe is designed, and a liquid absorbing core composed of a first sintered liquid absorbing core, a micro-groove liquid absorbing core and a second sintered liquid absorbing core is used to combine a sintered nanoporous copper powder layer and a metal copper mesh prepared by irregular copper powder to achieve efficient evaporation and condensation process.
This design effectively balances high capillary capacity and high permeability in the space microgravity environment, ensures the anti-gravity heat transfer performance of liquid metal heat pipes, and improves the heat dissipation efficiency and reliability of satellite equipment.