Positive photosensitive resin composition

By using a positive photosensitive resin composition of a specific composition, the problems of insufficient hydrophobicity and oleophobicity of the cured film surface, ink droplet overflow and concave collapse in the prior art are solved, and efficient pattern formation and the applicability of the display assembly are achieved.

CN119768741APending Publication Date: 2025-04-04NISSAN CHEM CORP
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Patent Information

Application Number
CN202380056038.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2022-07-29
Filing Date
2023-07-11
Publication Date
2025-04-04

AI Technical Summary

Technical Problem

The prior art is difficult to achieve high hydrophobicity and high oleophobicity in liquid crystal display elements and organic EL display elements, while avoiding ink droplet overflow and concave collapse of cured films.

Method used

A positive photosensitive resin composition comprising an alkali-soluble polymer obtained by polymerization of a specific monomer mixture, a surfactant, a compound having a vinyl ether group, a photosensitive agent and a crosslinking agent is used. The composition is processed by specific component ratios and processes to form a cured film with high hydrophobicity and high oleophobicity.

Benefits of technology

It is achieved to reduce residue when pattern formation, ensure that ink does not overflow, and the cured film has good wet spreadability and high contact angle, and is suitable for interlayer insulating film and light-shielding materials in display components.

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Abstract

The present invention provides a positive photosensitive resin composition, which can be used for liquid crystal display elements, organic EL display elements, etc., and has a cured film surface with high hydrophobicity and high oleophobicity, less residue after pattern formation, and a cured film that does not overflow in the pattern after pattern formation and is well wetted and spread. The present invention is a positive photosensitive resin composition that can form a cured film, which contains the following (A) component, (B) component, (C) component, (D) component, (E) component and (F) solvent, but does not contain a photoacid generator, (A) component: at least one alkali-soluble polymer obtained by polymerizing a monomer mixture containing the following (A-I), (A-I): N-substituted maleimide compound, (B) component: surfactant, (C) component: compound having a vinyl ether group, (D) component: photosensitizer, (E) component: crosslinking agent, (F) solvent.
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