LED display screen, LED display module and preparation method thereof

Abstract

The application provides an LED display screen, an LED display module and a preparation method thereof. The LED display module comprises a PCB substrate, a plurality of LED lamp beads and a protective layer. The outer surface of the PCB substrate comprises a first surface and a second surface arranged oppositely, and a plurality of hollow holes are arranged on the PCB substrate, each of which penetrates the first surface and the second surface. The plurality of LED lamp beads are arranged on the first surface of the PCB substrate at intervals. The protective layer is formed by coating an adhesive on the outer surface of the PCB substrate, and the protective layer on the first surface is distributed between two adjacent LED lamp beads. The protective layer on the first surface and the protective layer on the second surface are both penetrated by the hollow holes, and the protective layer is filled in the hollow holes. The protective layer formed by curing the adhesive on the surface of the PCB substrate replaces the mask and the bottom shell in the prior art, which not only has a simple structure, but also provides better display effect.

Description

Technical Field

[0001] This invention relates to the field of LED display technology, and mainly to an LED display screen, an LED display module, and a method for manufacturing the same. Background Technology

[0002] LED stage rental transparent screens consist of display modules and a cabinet frame. The display module comprises a light panel, a faceplate covering the light panel, and a base shell on the back of the light panel. Currently, the production and maintenance processes for display modules are relatively cumbersome. The light panel is fixed to the back shell with screws, then glue is applied, and finally, the faceplate is fixed to the base shell with screws. Maintenance requires removing the screws securing the faceplate, removing the glue, and then removing the screws securing the light panel, making the maintenance process quite troublesome.

[0003] Furthermore, in the structure of the display module of the LED stage rental transparent screen, the hollow part of its bottom shell has insufficient strength and poor support, leading to deformation problems. When the light board is fixed to the bottom shell, it cannot be completely fitted, resulting in gaps. This causes glue leakage during potting, requiring rework and seriously affecting production efficiency. At the same time, the hollow part of the LED stage rental transparent screen's mask cannot be fixed with screws or clips, easily warping and obstructing the light-emitting surface of the LED beads, thus affecting the display effect and viewing experience of the LED stage rental transparent screen. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this invention is to provide an LED display screen, an LED display module and a method for manufacturing the same.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] One aspect of the present invention provides an LED display module, comprising: a PCB substrate, the outer surface of the PCB substrate including a first surface and a second surface disposed opposite to each other, the PCB substrate having a plurality of cutout holes, each of the cutout holes penetrating the first surface and the second surface; a plurality of LED beads disposed at intervals on the first surface of the PCB substrate; and a protective layer formed by coating the outer surface of the PCB substrate with an adhesive, wherein the protective layer located on the first surface is distributed between two adjacent LED beads, wherein the protective layer located on the first surface and the protective layer located on the second surface are both penetrated by the cutout holes, and the protective layer fills the cutout holes.

[0007] According to an embodiment of the present invention, the protective layer includes a first sub-protective layer, a second sub-protective layer, a third sub-protective layer, and a fourth sub-protective layer; the first sub-protective layer covers a first surface of the PCB substrate and fills the connection between the LED bead and the PCB substrate, thereby covering the outside of the first surface; the second sub-protective layer covers a second surface of the PCB substrate, thereby covering the outside of the second surface; the outer surface of the PCB substrate includes a peripheral side surface connecting the first surface and the second surface, the third sub-protective layer covers the outside of the peripheral side surface and connects between the first sub-protective layer and the second sub-protective layer; the fourth sub-protective layer covers the cutout hole and connects the cutout hole connection between the first sub-protective layer and the second sub-protective layer.

[0008] According to an embodiment of the present invention, the fourth sub-protective layer is provided with a connection hole, the connection hole passing through the first sub-protective layer, the PCB substrate and the second sub-protective layer, and the connection hole is used for a connector to pass through.

[0009] According to an embodiment of the present invention, the connecting hole includes a first through portion and a second through portion disposed along its axial direction, the first through portion and the second through portion are connected, and both the first through portion and the second through portion penetrate the PCB substrate along the thickness direction of the PCB substrate;

[0010] The first through portion is adapted to the head of the connector, the second through portion is adapted to the connecting portion of the connector, and the thickness of the fourth sub-protective layer in the second through portion is 0.5mm to 1mm.

[0011] According to an embodiment of the present invention, the ratio of the thickness of the first sub-protective layer to the height of the LED bead is in the range of 1 / 2 to 1 / 3.

[0012] According to an embodiment of the present invention, the thickness of the second sub-protective layer ranges from 0.5 mm to 2 mm.

[0013] According to an embodiment of the present invention, the thickness of the third sub-protective layer ranges from 0.5 mm to 1 mm.

[0014] According to an embodiment of the present invention, the hardness range of the first sub-protective layer, the second sub-protective layer, the third sub-protective layer and the fourth sub-protective layer is 40D~80D.

[0015] According to an embodiment of the present invention, the optical density of the first sub-protective layer, the second sub-protective layer, the third sub-protective layer and the fourth sub-protective layer is 2.5-3.0.

[0016] According to an embodiment of the present invention, the LED display module further includes a driver IC disposed on the second surface, the driver IC being electrically connected to a plurality of LED beads, and the second sub-protective layer covering the outer surface of the driver IC.

[0017] According to an embodiment of the present invention, the adhesive includes an encapsulating adhesive, which is black and matte.

[0018] According to an embodiment of the present invention, the encapsulating adhesive includes one of epoxy adhesive, polyurethane adhesive, and acrylate adhesive.

[0019] A second aspect of the present invention provides a method for manufacturing an LED display module, used to manufacture the LED display module described in any of the above embodiments, the method comprising the following steps:

[0020] Multiple LED beads are soldered alternately onto a PCB substrate to form an LED light board, wherein the PCB substrate has multiple cutout holes;

[0021] Under vacuum conditions, the adhesive is applied to the outer surface of the LED light panel, and the adhesive is cured on the outer surface of the LED light panel to form the protective layer.

[0022] According to an embodiment of the present invention, the adhesive is cured by one of the following methods: room temperature curing, heat curing, and ultraviolet curing.

[0023] According to an embodiment of the present invention, the adhesive is a black matte polyurethane adhesive.

[0024] According to an embodiment of the present invention, the adhesive curing includes: applying ultraviolet light to the LED light panel, wherein the curing wavelength of the ultraviolet light is in the range of 340 nm to 400 nm.

[0025] A third aspect of the present invention provides an LED display screen, including an LED display module, a cabinet frame, and a connector as described in any of the above embodiments, wherein the connector passes through the connection hole of the LED display module to fix the LED display module to the cabinet frame.

[0026] Beneficial effects:

[0027] In the LED display module disclosed in this application, a protective layer is formed by curing adhesive onto the surface of a PCB substrate, replacing the bottom shell and face mask of the existing LED display module. Specifically, the protective layer located on the first surface covers and protects the LED chips and the PCB substrate, thus replacing the face mask on the first surface in the prior art. Similarly, the protective layer located on the second surface covers and protects the second surface of the PCB substrate, replacing the bottom shell on the second surface in the prior art. This eliminates the need for a bottom shell and face mask in the LED display module by providing a protective layer, effectively reducing problems such as adhesive leakage due to deformation of the cutout portion of the bottom shell and warping of the cutout portion of the face mask that obstructs the light-emitting surface of the LED chips, thus significantly improving the display effect of the LED display screen. Furthermore, the protective layer fills the various cutout holes on the PCB substrate, providing coverage and protection for the cutout holes. Furthermore, the protective layer covering the outer surface of the PCB substrate prevents damage from the external environment and serves as structural support, enhancing the overall strength of the LED display module. The protective layer also simplifies the module structure, thereby reducing production costs and assembly complexity. Simultaneously, the protective layer protects both the PCB substrate and the LED chips mounted on its first surface. Attached Figure Description

[0028] Figure 1 This is a top view of an LED display module according to an embodiment of this application;

[0029] Figure 2 yes Figure 1 Enlarged view of section A in the image;

[0030] Figure 3 yes Figure 1 A cross-sectional view of point AA in the diagram;

[0031] Figure 4 for Figure 3 A magnified view of section B;

[0032] Figure 5 for Figure 3 A magnified view of a portion at point C;

[0033] Figure 6 This is a flowchart of a method for manufacturing an LED display module according to one embodiment of this application;

[0034] Figure 7 This is a schematic diagram of an LED display screen in one embodiment of this application;

[0035] The correspondence between the reference numerals and the component names is as follows:

[0036] 100. LED display module;

[0037] 1. PCB substrate; 101. First surface; 102. Second surface; 103. Peripheral side surface;

[0038] 2. LED beads;

[0039] 3. Protective layer; 301. Connecting hole; 3011. First shaft segment hole; 3012. Second shaft segment hole; 31. First sub-protective layer; 32. Second sub-protective layer; 33. Third sub-protective layer; 34. Fourth sub-protective layer;

[0040] 200. Box frame;

[0041] 300. Connectors. Detailed Implementation

[0042] This invention provides an LED display screen, an LED display module, and a method for manufacturing the same. To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the scope of protection of the invention.

[0043] In the description of this invention, it should be understood that the terms "upper", "lower", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0044] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0045] In existing technology, the display module of an LED stage rental transparent screen consists of a light panel, a faceplate on the surface of the light panel, and a base shell on the back of the light panel. The light panel is fixed to the back shell with screws, then glue is applied, and finally, the faceplate is fixed to the base shell with screws. Maintenance requires removing the screws securing the faceplate, removing the glue, and then removing the screws securing the light panel, making the maintenance process quite cumbersome.

[0046] Furthermore, in the structure of the display module of the LED stage rental transparent screen, the hollow part of its bottom shell has insufficient strength and poor support, leading to deformation problems. When the light board is fixed to the bottom shell, it cannot be completely fitted, resulting in gaps. This causes glue leakage during potting, requiring rework and seriously affecting production efficiency. At the same time, the hollow part of the LED stage rental transparent screen's mask cannot be fixed with screws or clips, easily warping and obstructing the light-emitting surface of the LED beads, thus affecting the display effect and viewing experience of the LED stage rental transparent screen.

[0047] Therefore, it is necessary to design an LED display module that can solve the problems of mask warping blocking the light-emitting surface, incomplete bonding of the lamp board base shell leading to glue leakage during potting, and high maintenance efficiency.

[0048] Figure 1 This is a top view of an LED display module according to an embodiment of this application; Figure 2 yes Figure 1 Enlarged view of section A in the image; Figure 3 yes Figure 1 A cross-sectional view of point AA in the diagram.

[0049] Combination Figure 1 , Figure 2 and Figure 3 It is understood that one embodiment of the present invention provides an LED display module 100, including a PCB substrate 1, a plurality of LED beads 2 and a protective layer 3.

[0050] The PCB substrate 1 includes a first surface 101 and a second surface 102 disposed opposite to each other. The PCB substrate 1 has a plurality of cutout holes, each cutout hole penetrating the first surface 101 and the second surface 102.

[0051] The first surface 101 and the second surface 102 are respectively disposed on opposite sides of the PCB substrate 1. The first surface 101 can be represented as the upper surface of the PCB substrate 1, and the second surface 102 can be represented as the lower surface of the PCB substrate 1. A through hole is provided on the PCB substrate 1. Specifically, the two ends of the through hole pass through the first surface 101 and the second surface 102 respectively.

[0052] Multiple LED beads 2 are spaced apart on the first surface 101 of the PCB substrate 1. The spaced arrangement of multiple LED beads 2 can maintain good light emission effect and viewing angle uniformity of the LED beads 2. The multiple LED beads 2 and the PCB substrate 1 together constitute the lamp board of the LED display module 100.

[0053] Protective layer 3 is formed by applying an adhesive to the outer surface of the PCB substrate. It should be noted that adhesive generally refers to a substance that can bond two or more homogeneous or dissimilar materials together, possessing sufficient strength after curing. When the adhesive is applied to the outer surface of the PCB substrate, it forms a protective layer that is connected to the outer surface of the PCB substrate.

[0054] The protective layer on the first surface is distributed between two adjacent LED beads. Both the protective layer on the first surface and the protective layer on the second surface are penetrated by perforations, and the protective layer fills each perforation.

[0055] Specifically, a protective layer 3 is formed by applying an adhesive to the outer surface of the PCB substrate 1, thereby covering all surfaces of the PCB substrate 1. The protective layer 3 provides comprehensive protection for the PCB substrate 1. Furthermore, the protective layer 3 located on the first surface 101 is distributed between adjacent LED beads 2, which not only provides sufficient structural strength but also ensures a tight fit between the LED board and the protective layer 3, reducing gaps.

[0056] The protective layer 3 is filled into the cutout holes. By filling the inner surface of the cutout holes with the protective layer 3, the area of ​​the PCB substrate 1 with the cutout holes can be further protected, avoiding the problem of insufficient strength and easy damage to the PCB substrate 1 caused by the cutout holes.

[0057] In the LED display module 100 disclosed in this application, a protective layer 3 is formed by curing adhesive on the surface of the PCB substrate 1. This protective layer 3 replaces the bottom shell and face mask of the LED display module 100 in the prior art. The protective layer 3 not only covers and protects the LED beads 2 and the PCB substrate 1 from damage by the external environment, such as moisture, dust, and mechanical impact, but also serves as a structural support, enhancing the overall strength of the LED display module 100. This simplifies the module structure, thereby reducing production costs and assembly complexity. Simultaneously, it avoids problems such as adhesive leakage due to deformation of the hollowed-out portion of the bottom shell and warping of the hollowed-out portion of the face mask, which can obstruct the light-emitting surface of the LED beads 2.

[0058] Specifically, the protective layer 3 is formed by adhesive curing on the entire outer surface of the PCB substrate 1, which improves the adhesion between the protective layer 3 and the PCB substrate 1 and avoids the problem of gaps caused by incomplete adhesion when the PCB substrate 1 is fixed to the bottom shell. By providing cutouts on the PCB substrate 1 and filling the cutouts with the protective layer 3, the cutouts on the PCB substrate also serve to protect them.

[0059] In some embodiments, the protective layer includes a first sub-protective layer 31, a second sub-protective layer 32, a third sub-protective layer 33, and a fourth sub-protective layer 34.

[0060] The first sub-protective layer 31 covers the first surface of the PCB substrate and fills the connection between the LED beads and the PCB substrate, thus covering the outside of the first surface. The first sub-protective layer 31 can replace the face mask in the prior art, thus acting as a face mask covering the outside of the first surface and protecting the first surface of the PCB substrate.

[0061] The second sub-protective layer 32 covers the second surface of the PCB substrate, thus covering the outer side of the second surface. The second sub-protective layer 32 can replace the bottom shell in the prior art, and by covering the second surface, it acts as a bottom shell covering the outer side of the second surface, thereby protecting the second surface of the PCB substrate.

[0062] The outer surface of the PCB substrate includes a peripheral side surface connected between the first surface and the second surface. A third sub-protective layer 33 covers the outer side of the peripheral side surface and is connected between the first sub-protective layer and the second sub-protective layer. The third sub-protective layer 33 covers the peripheral side surface, providing protection for the peripheral side surface of the PCB substrate. Furthermore, the first sub-protective layer 31, the second sub-protective layer 32, and the third sub-protective layer 33 together constitute a protective structure for each surface of the PCB substrate, effectively preventing damage from the external environment. Simultaneously, it simplifies the overall structure of the LED display module and effectively reduces the risk of adhesive leakage due to deformation of the hollowed-out portion of the bottom shell, and the risk of warping of the hollowed-out portion of the face mask obstructing the light-emitting surface of the LED beads.

[0063] The fourth sub-protective layer 34 covers the cutout and connects the cutout connection points of the first sub-protective layer 31 and the second sub-protective layer 32. The fourth sub-protective layer 34 is correspondingly provided on the cutout of the PCB substrate. The fourth sub-protective layer 34 can cover and protect the walls of the cutout. Simultaneously, the two sides of the fourth sub-protective layer 34, respectively, connect with the first sub-protective layer 31 and the second sub-protective layer 32, forming a continuous protective layer with the PCB substrate. This prevents the protective layer from being broken at the connection points of different sides or at the cutout portion, thus avoiding any impact on the structural strength and protective function of the PCB substrate.

[0064] In some embodiments, the fourth sub-protective layer 34 is provided with a connection hole that passes through the first sub-protective layer 31, the PCB substrate, and the second sub-protective layer 32, and is used for a connector to pass through.

[0065] Specifically, the protective layer 3 located in the hollow hole is provided with a connection hole 301. The connection hole 301 passes through the first sub-protective layer 31, the PCB substrate and the second sub-protective layer 32. The connection hole 301 is used for the connector 300 to pass through so that the LED display module 100 is fixed on the housing frame 200 by the connector 300.

[0066] Furthermore, the connection hole 301 allows a connector 300, such as a screw or bolt, to pass through it for fixing.

[0067] In this way, even without the mask and bottom shell structure, the connection between the PCB substrate 1 and the fixing frame can be directly achieved through the connection hole 301 on the fourth sub-protective layer 34, which also improves the ease of installation. Compared with the prior art, where the hollow part of the mask cannot be fixed by screws or clips and is prone to warping and blocking the light-emitting surface of the LED beads 2, this embodiment, through the design of the connection hole and the hollow hole on the PCB substrate 1, can still achieve the fixing of the PCB substrate 1 through the connection hole 301 on the protective layer 3 after the mask and bottom shell are removed. This not only simplifies the structure of the LED display module 100, but also avoids the light-emitting effect being affected by the warping of the mask, thus improving the display effect and viewing experience of the LED display module 100.

[0068] In some other embodiments, the fourth sub-protective layer 34 may omit the connection hole, and the connection between the PCB substrate 1 and the fixing frame may be fixed by other adhesives.

[0069] Figure 4 for Figure 3 A magnified view of section B.

[0070] like Figure 4 As shown, in some embodiments, the connecting hole 301 includes a first through portion 3011 and a second through portion 3012 that are connected. The first through portion 3011 and the second through portion 3012 are connected, and both the first through portion 3011 and the second through portion 3012 penetrate the PCB substrate along the thickness direction of the PCB substrate. The first through portion 3011 may be disposed at one end of the second through portion 3012 near the first surface, and the central axes of the first through portion 3011 and the second through portion 3012 coincide.

[0071] The first through portion 3011 is adapted to the head of the connector 300, and the second through portion 3012 is adapted to the connecting portion of the connector 300. The fourth sub-protective layer 34 is located in the second through portion 3012 and has a thickness range of 0.5mm to 1mm.

[0072] Specifically, the connector 300 typically includes a head and a connecting portion. Taking a screw as an example, the connecting portion of the screw has threads, and the screw head is located at one end of the connecting portion. Since the head of the connector 300 is larger than the connecting portion, a first through portion 3011 is used to fit the head of the connector 300. The diameter of the first through portion 3011 is slightly larger to accommodate the head of the connector 300 and allow it to rotate or be positioned. A second through portion 3012 is used to fit the connecting portion of the connector 300. The diameter of this portion is typically matched to the diameter of the connecting portion of the connector 300 to ensure that the connector 300 can be securely fixed in the hole. The segmented design of the connecting hole 301 allows for better adaptation to the shape and size of the connector 300, enabling the connector 300 to be more securely inserted into the connecting hole 301.

[0073] Furthermore, since the fourth sub-protective layer 34 serves as the connection area of ​​the LED module, the thickness of the fourth sub-protective layer 34 located between the second through portion 3012 is set to a range of 0.5mm to 1mm. Within this thickness range, the connection hole 301 has sufficient strength to provide good support, ensuring that the protective layer 3 can effectively isolate external environmental interference (such as moisture, dust, etc.) while filling the hollow hole, and at the same time providing physical protection, thereby enhancing the durability and service life of the LED display module 100.

[0074] Understandably, please refer to the appendix. Figure 4 As shown, W1 indicates the diameter of the second through portion 3012, and W2 indicates the diameter of the cutout hole on the PCB substrate. The difference between W2 and W1, divided by 2, is the thickness of the protective layer 3 located between the cutout hole and the second through portion 3012.

[0075] Figure 5 for Figure 3 A magnified view of a portion at point C;

[0076] like Figure 5 As shown, in some embodiments, the ratio of the thickness of the first sub-protective layer 31 to the height of the LED bead 2 ranges from 1 / 2 to 1 / 3.

[0077] Please see the appendix Figure 5 As shown, H1 indicates the height of the LED bead 2, and H2 indicates the thickness of the first sub-protective layer 31. The ratio of the thickness of the protective layer on the first surface 101 to the height of the LED bead 2 can be understood as the ratio of the values ​​of H2 and H1.

[0078] LEDs are intermittently soldered onto the PCB substrate 1. The ratio of the thickness of the first sub-protective layer 31 to the height of the LED beads 2 is between 1 / 2 and 1 / 3, ensuring that the thickness of the first sub-protective layer 31 completely covers the connection between the LED beads 2 and the PCB substrate 1. By controlling this ratio, the connection strength between the LED beads 2 and the PCB substrate 1 can be improved. Thus, when the LED display module 100 of this application uses the protective layer 3 to replace the mask in the prior art, controlling the ratio of the thickness of the first sub-protective layer 31 to the height of the LED beads 2 to between 1 / 2 and 1 / 3 improves the impact resistance of the PCB substrate 1. Even without the mask, it still provides good protection for the LED beads 2, making the LED display module 100 both robust and durable, as well as lightweight and flexible.

[0079] It is understandable that the LED beads 2 will generate a certain amount of heat during operation. If the protective layer 3 is too thick, it may hinder heat dissipation, causing the temperature of the LED beads 2 to rise, affecting stability and service life. In this embodiment, by controlling the thickness of the protective layer 3 located on the first surface 101 within the above-mentioned range, it can not only provide good protection for the LED beads 2, but also ensure that the heat of the lamp board can be smoothly transferred to the external environment through the protective layer 3.

[0080] In some embodiments, the thickness of the third sub-protective layer 33 ranges from 0.5 mm to 1 mm. By controlling the thickness of the third sub-protective layer 33 within the range of 0.5 mm to 1 mm, it can effectively provide good protection for the peripheral surfaces of the PCB substrate.

[0081] In some embodiments, the hardness range of the first sub-protective layer 31, the second sub-protective layer 32, the third sub-protective layer 33, and the fourth sub-protective layer 34 is 40D to 80D. Thus, the protective layer 3 formed after the adhesive cures allows the LED display module 100 to have good overall strength, thereby enhancing its resistance to deformation. When subjected to certain pressure or bending, the protective layer 3 within the aforementioned hardness range can effectively maintain its shape, preventing damage to the surface of the LED beads 2 or the protective layer 3 due to external forces during transportation, installation, or use. This provides strength support for the protective layer 3 to replace the faceplate and base shell. Furthermore, the higher hardness of the protective layer 3 provides better wear resistance, resisting friction and scratches that may occur during use, thus extending the service life of the LED display module 100.

[0082] In some embodiments, the LED display module 100 further includes a driver IC (not shown in the figure). The driver IC is disposed on the second surface 102 and is electrically connected to a plurality of LED beads 2. A protective layer 3 located on the second surface 102 covers the outer surface of the driver IC.

[0083] By placing the driver IC on the second surface 102 of the LED display module 100 and electrically connecting it to multiple LED beads 2, the driver IC can efficiently control the switching, brightness adjustment, and other functions of the LED beads 2. The second sub-protective layer 32 not only covers the second surface 102 of the PCB substrate 1 but also covers the outer surface of the driver IC. After the encapsulant cures to form the protective layer 3, the driver IC and the PCB substrate 1 can be connected as one unit. In this way, not only is the driver IC effectively protected, but the assembly and production steps of assembling through the bottom shell and the front cover are also simplified, thereby improving production efficiency.

[0084] like Figure 5 As shown, in some specific embodiments, the thickness of the second sub-protective layer 32 ranges from 0.5mm to 2mm. By controlling the thickness of the protective layer 3 on the second surface 102, the driver IC is completely encapsulated, so that the driver IC is completely wrapped by the protective layer 3. This allows the LED display module 100 to still achieve good structural strength after the bottom shell is removed, thanks to the protective layer 3.

[0085] like Figure 5 As shown, H3 indicates the thickness of the protective layer 3 on the second surface 102, and the size of H3 is 0.5mm~2mm.

[0086] Furthermore, the LED display module 100 also includes a capacitor (not shown in the figure). The capacitor can be disposed on the second surface 102 of the PCB substrate 1, and the second sub-protective layer 32 completely encapsulates the capacitor.

[0087] In some embodiments, the adhesive may include encapsulating adhesive. The encapsulating adhesive is matte black. It should be noted that encapsulating adhesive refers to a type of electronic adhesive that can seal, encapsulate, or pot certain components (such as resistors, capacitors, and circuit boards in the electronics industry). The application of encapsulating adhesive can provide waterproofing, moisture protection, shockproofing, dustproofing, heat dissipation, and security for the PCB substrate.

[0088] The encapsulating adhesive includes one of epoxy-based adhesives, polyurethane-based adhesives, and acrylic-based adhesives. Using the above-mentioned encapsulating adhesives allows the cured protective layer 3 to adhere tightly to the PCB substrate 1, and also enables the PCB substrate 1, LED beads 2, driver IC, and other components to be integrally connected to form a robust LED display module 100.

[0089] Specifically, the encapsulating adhesive can be any of epoxy-based, polyurethane-based, or acrylic-based adhesives. In some specific applications, different adhesive systems can be modified individually. For example, polyurethane can be used to modify the epoxy adhesive matrix to obtain polyurethane-modified epoxy resin, which can achieve better results.

[0090] Epoxy-based adhesives typically possess excellent bonding strength, chemical resistance, and electrical insulation properties. The protective layer 3 formed by curing epoxy-based adhesives provides a robust protective layer, effectively protecting components such as LED beads 2 and driver ICs from physical damage and external environmental influences.

[0091] Polyurethane adhesives possess excellent elasticity, abrasion resistance, and weather resistance. The protective layer 3, cured using polyurethane adhesives, can withstand temperature changes and mechanical stresses that the LED display module 100 may encounter during use, maintaining the integrity and stability of the protective layer 3.

[0092] Acrylic adhesives typically feature rapid curing and UV resistance. The protective layer 3, cured with epoxy adhesive, can quickly form a matte black protective film on the PCB substrate 1, which neither affects the luminous effect of the LED beads 2 nor damages the components to ultraviolet light.

[0093] Preferably, the encapsulating adhesive is a polyurethane-based encapsulating adhesive.

[0094] In some embodiments, the optical density of the first sub-protective layer 31, the second sub-protective layer 32, the third sub-protective layer 33, and the fourth sub-protective layer is 2.5-3.0.

[0095] Since this application uses a protective layer instead of the face mask and bottom shell in the prior art, in order to prevent the protective layer from affecting the display effect of the LED light board, the light density of the first sub-protective layer 31, the second sub-protective layer 32, the third sub-protective layer 33 and the fourth sub-protective layer is controlled within the range of 2.5-3.0. In a well-lit environment, glare from the LED display module can be prevented, and the contrast of the LED display module can be increased. Compared with the existing technical solution of covering the face mask and bottom shell on the PCB substrate, this application has a better display effect.

[0096] Figure 6 This is a flowchart of a method for preparing an LED display module according to one embodiment of this application.

[0097] Please see the appendix Figure 6 The second aspect of this application provides a method for manufacturing an LED display module 100, used to manufacture the LED display module 100 of any of the above embodiments. The manufacturing method includes the following steps:

[0098] S1: Multiple LED beads 2 are soldered onto the PCB substrate 1 at intervals to form an LED light board. The PCB substrate 1 has multiple cutout holes.

[0099] S2: Under vacuum, adhesive is applied to the outer surface of the lamp board, and the adhesive is cured on the outer surface of the lamp board to form a protective layer 3. In step S1, multiple cutout holes can be pre-formed on the PCB substrate 1, or a PCB substrate 1 with multiple cutout holes can be used directly. First, multiple LED beads 2 are soldered alternately onto the first surface 101 of the PCB substrate 1 to form an LED lamp board. Specifically, the driver IC and capacitor can also be soldered onto the second surface 102 of the PCB substrate 1.

[0100] In step S2, an adhesive is applied to the outer surface of the lamp panel using a vacuum coating process. The adhesive used is a matte black polyurethane adhesive.

[0101] After applying the encapsulating adhesive to the surface of the LED light board, the encapsulating adhesive is cured.

[0102] Specifically, applying adhesive to the outer surface of the lamp panel under vacuum conditions allows the adhesive to be evenly covered on each surface of the lamp panel to form a reliable protective layer 3, and also avoids problems such as bubbles or unevenness in the cured protective layer 3.

[0103] The curing methods of adhesives can include one of the following: room temperature curing, heat curing, and ultraviolet curing.

[0104] Preferably, the adhesive is cured using ultraviolet light.

[0105] The specific steps for adhesive curing include: applying ultraviolet (UV) light to the LED panel, with the UV curing wavelength ranging from 340 nm to 400 nm. UV curing offers rapid curing; after irradiation, the adhesive quickly solidifies, significantly shortening the entire production cycle of the LED display module 100. Compared to traditional thermal or chemical curing methods, UV curing significantly improves efficiency on the production line. Furthermore, UV curing ensures uniform curing across all surfaces and areas of the LED panel, enhancing the appearance quality and structural stability of the LED display module 100.

[0106] In this embodiment, by controlling the wavelength range of ultraviolet light to 340nm~400nm, it is beneficial to control the curing depth and speed, which can prevent over-curing or under-curing, thereby achieving the best curing effect and improving the stability and long-term reliability of the product.

[0107] The method for manufacturing an LED display module further includes: S3: forming connection holes on the fourth sub-protective layer 34. Specifically, a mold can be provided, and the mold can be provided with protrusions. The lamp board is placed in the mold, and the protrusions are correspondingly inserted into the cutouts of the PCB substrate 1. Then, under vacuum, encapsulating adhesive is injected into the mold. At this time, due to the vacuum state, the lamp board is suspended in the mold, and the encapsulating adhesive injected into the mold can be evenly and comprehensively coated on all surfaces of the lamp board, covering the space between two adjacent LED beads 2, and covering the cutouts. Due to the setting of the protrusions, the protective layer 3 located in the cutouts can form corresponding connection holes 301, and also facilitates the positioning of the lamp board during the encapsulating adhesive coating process in the mold.

[0108] In some other embodiments, after the protective layer is cured in step S2, holes can be punched in the protective layer 3 located in the hollow hole to form a connecting hole.

[0109] Figure 7 This is a schematic diagram of an LED display screen in one embodiment of this application.

[0110] like Figure 7 As shown, an embodiment of the third aspect of this application provides an LED display screen, including an LED display module 100, a cabinet frame 200, and a connector 300 as described in any of the above embodiments. The connector 300 passes through a connection hole of the LED display module 100 and fixes the LED display module 100 to the cabinet frame 200.

[0111] In this embodiment, the LED display module 100 of any of the above embodiments is directly fixed to the housing frame 200 by the connector 300 to form an LED display screen. The protective layer 3 formed by the LED display module 100 through adhesive curing on the surface of the PCB substrate 1 replaces the mask and bottom shell in the prior art. This not only makes the LED display screen lighter, but also provides higher contrast and avoids the problem that the mask may block the light-emitting surface of the LED beads 2, resulting in a better overall display effect.

[0112] Specifically, since the adhesive can form a tightly bonded structure with the PCB substrate 1 after curing on each surface of the PCB substrate 1, it can solve the problem that the existing LED stage rental transparent screen is prone to deformation due to the hollow bottom shell, which leads to gaps when the light board bottom shell is not fully bonded. It also solves the problem that the LED stage rental transparent screen is prone to glue leakage during glue pouring due to the bottom shell, which requires secondary rework and seriously affects production efficiency.

[0113] Understandably, multiple LED beads 2 are soldered onto the PCB substrate 1 to form an LED light board. Adhesive directly covers and cures each surface of the light board. Since the cured adhesive forms an integrated LED display module 100 with the light board, it improves overall strength and support. Furthermore, by providing multiple perforations on the PCB substrate 1 and using adhesive to cover these perforations to form connection holes 301, even after removing the face mask and bottom shell, the connector 300 can still fix the LED display module 100 to the housing frame 200 through the connection holes 301, avoiding the problem of the module loosening or shifting due to external force or vibration. This solves the problem in existing technologies where the perforated parts of the face mask cannot be fixed with screws or clips, easily warping and obstructing the light-emitting surface of the LED beads 2.

[0114] It is understood that those skilled in the art can make equivalent substitutions or changes to the technical solution and inventive concept of the present invention, and all such changes or substitutions should fall within the protection scope of the present invention.

Claims

1. An LED display module, characterized in that, The LED display module comprises: a PCB substrate, an outer surface of the PCB substrate comprising oppositely arranged first and second surfaces, a plurality of hollow holes being provided on the PCB substrate, each of the hollow holes penetrating the first and second surfaces; a plurality of LED lamp beads being arranged at intervals on the first surface of the PCB substrate; a protective layer being formed on the outer surface of the PCB substrate by adhesive coating, the protective layer on the first surface being distributed between two adjacent LED lamp beads, wherein the protective layer on the first surface and the protective layer on the second surface are both penetrated by the hollow holes, and the protective layer is filled in the hollow holes; the protective layer comprising a first sub-protective layer, a second sub-protective layer and a fourth sub-protective layer, the first sub-protective layer being covered on the first surface of the PCB substrate and filled at the connection between the LED lamp bead and the PCB substrate to cover the outer side of the first surface; the second sub-protective layer being covered on the second surface of the PCB substrate to cover the outer side of the second surface; the fourth sub-protective layer being covered on the hollow hole and connected to the hollow hole connection between the first sub-protective layer and the second sub-protective layer; the fourth sub-protective layer being provided with a connecting hole penetrating the first sub-protective layer, the PCB substrate and the second sub-protective layer, the connecting hole being used for passing through a connecting member; the connecting hole comprising a first through portion and a second through portion arranged along the axial direction thereof, the first through portion and the second through portion being communicated, the first through portion and the second through portion both penetrating the PCB substrate along the thickness direction of the PCB substrate; the first through portion being used for adapting to the head of the connecting member, and the second through portion being used for adapting to the connecting portion of the connecting member, so that the PCB substrate is directly fixed and connected to a cabinet frame.

2. The LED display module according to claim 1, wherein the protective layer comprises a third sub-protective layer, the outer surface of the PCB substrate comprising a circumferential surface connected between the first and second surfaces, the third sub-protective layer being covered on the outer side of the circumferential surface and connected between the first and second sub-protective layers.

3. The LED display module according to claim 1, wherein the fourth sub-protective layer has a thickness ranging from 0.5 mm to 1 mm in the second through portion.

4. The LED display module according to claim 2, wherein a ratio of the thickness of the first sub-protective layer to the height of the LED lamp bead ranges from 1 / 2 to 1 / 3; and / or the thickness of the second sub-protective layer ranges from 0.5 mm to 2 mm; and / or the thickness of the third sub-protective layer ranges from 0.5 mm to 1 mm; and / or the hardness of the first, second, third and fourth sub-protective layers ranges from 40D to 80D; and / or The optical density of the first sub-protection layer, the second sub-protection layer, the third sub-protection layer and the fourth sub-protection layer is 2.5-3.0; and / or The LED display module further comprises a driving IC, the driving IC is arranged on the second surface, the driving IC is electrically connected with the plurality of LED lamp beads, and the second sub-protection layer covers the outer surface of the driving IC.

5. The LED display module of claim 1, wherein, The adhesive comprises encapsulation glue, and the encapsulation glue is black and matte.

6. The LED display module according to claim 5, wherein, The encapsulation glue comprises one of epoxy-based glue, polyurethane-based glue and acrylate-based glue. 7.A method for preparing the LED display module according to any one of claims 1 to 6, characterized in that, The preparation method comprises the following steps: A plurality of LED lamp beads are welded on the PCB substrate at intervals to form an LED lamp panel, and a plurality of hollow holes are arranged on the PCB substrate; In a vacuum state, the adhesive is coated on the outer surface of the LED lamp panel, and the adhesive is solidified on the outer surface of the LED lamp panel to form the protection layer.

8. The preparation method of the LED display module according to claim 7, wherein, The solidification mode of the adhesive comprises one of normal temperature solidification, heating solidification and ultraviolet solidification; and / or The adhesive is black and matte polyurethane-based glue; And / or The solidification of the adhesive comprises applying ultraviolet irradiation to the LED lamp panel, and the solidification wavelength range of the ultraviolet light is 340NM-400NM.

9. An LED display screen, characterized by The LED display module, the box frame and the connecting piece are provided, the connecting piece is arranged through the connecting hole of the LED display module to fix and connect the LED display module on the box frame.

Images