Imaging assembly based on miniaturized CQFN packaging EBAPS device and manufacturing method thereof

By combining the CQFN-packaged EBAPS device with a circuit board and a high-voltage power supply module, the problem of traditional low-light devices being unable to be digitized and miniaturized is solved, and high-performance detection and digital output for both day and night are achieved, making it suitable for low-light-level night vision, lidar, astronomical observation and other fields.

CN120603348APending Publication Date: 2025-09-05NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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Patent Information

Application Number
CN202510778395.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-11
Publication Date
2025-09-05

AI Technical Summary

Technical Problem

The image output of traditional low-light devices cannot be digitized and cannot be used during the day, and the existing EBAPS packaging form is not conducive to component miniaturization and integration.

Method used

The EBAPS device in CQFN package is combined with a mixed-signal interface circuit board, a signal processing circuit board and a small high-voltage power supply component to achieve photoelectric conversion and digital image output, and realize day and night switching through high-voltage power supply module control.

Benefits of technology

The digital output of the EBAPS device is realized, supporting both day and night use, miniaturization and integration of components, and has the advantages of high gain, fast response, and low power consumption. It is suitable for low-light-level night vision, lidar, and astronomical observation.

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Abstract

The invention discloses an imaging assembly based on a miniaturized CQFN packaged EBAPS device and a manufacturing method of the imaging assembly. The imaging assembly comprises a CQFN packaged EBAPS whole tube, a mixed signal interface circuit board, a signal processing circuit board and a small high-voltage power supply part. Wherein the CQFN packaged EBAPS whole tube integrates a cathode component and an APS chip in a vacuum cavity through an indium sealing process, so that photoelectric conversion and digital image output are realized; the mixed signal interface circuit board adopts an inter-board connector to realize high and low voltage signal switching; the signal processing circuit board is responsible for image processing and power supply control; and the small high-voltage power supply component realizes cathode high-voltage power supply through modular design. Through the CQFN packaging technology, device miniaturization is achieved, the integration level is high, reliability is high, real-time imaging collection of day and night mode automatic switching is supported, and the device is suitable for a compact imaging system in a low-light environment.
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