Thermal imaging method, device and storage medium for temperature measurement

Abstract

This application discloses a temperature measurement method, device, and storage medium for a thermal imager. The method includes: detecting a target in the current measurement environment and generating an original voltage value corresponding to the target; acquiring the ambient temperature and temperature rise state of the current measurement environment to obtain the current ambient temperature and current temperature rise state, and acquiring a temperature rise compensation coefficient table; querying the temperature rise compensation coefficient table based on the current ambient temperature and current temperature rise state to obtain a temperature rise compensation coefficient matching the current measurement environment; and correcting the original voltage value based on the temperature rise compensation coefficient to obtain a corrected voltage value. This application considers the influence of the ambient temperature rise state on temperature measurement, which can improve the temperature measurement accuracy of the thermal imager under different environments and different temperature rise states.

Description

Technical Field

[0001] This application relates to the field of infrared thermal imaging temperature measurement technology, and in particular to a temperature measurement method, device and storage medium for a thermal imager. Background Technology

[0002] Environmental changes are one of the important factors affecting the temperature measurement accuracy of infrared thermal imaging equipment. When using infrared thermal imaging equipment to measure the temperature of the object under test, temperature correction is required based on the ambient temperature.

[0003] Generally, temperature correction parameters need to be determined through testing and calibration in an experimental environment. However, there are significant differences between experimental environments and actual application scenarios, resulting in poor temperature correction performance. Summary of the Invention

[0004] To address the aforementioned technical problems, this application provides at least one method, device, and storage medium for measuring the temperature of a thermal imager, thereby improving the temperature correction effect of the thermal imager.

[0005] The first aspect of this application provides a temperature measurement method for a thermal imager, comprising: detecting a target in the current measurement environment and generating an original voltage value corresponding to the target; acquiring the ambient temperature and temperature rise state of the current measurement environment, obtaining the current ambient temperature and current temperature rise state, and acquiring a temperature rise compensation coefficient table; wherein the temperature rise state includes a heating state and / or a cooling state, and the temperature rise compensation coefficient table is used to store the values ​​of temperature rise compensation coefficients corresponding to different preset ambient temperatures and different temperature rise states; querying the temperature rise compensation coefficient table based on the current ambient temperature and current temperature rise state to obtain a temperature rise compensation coefficient matching the current measurement environment; and correcting the original voltage value based on the temperature rise compensation coefficient to obtain a corrected voltage value.

[0006] In one embodiment, the temperature of the calibration environment is adjusted to different preset ambient temperatures based on different temperature rise states, and the temperature of the calibration object in the calibration environment is adjusted to a preset target temperature; the voltage values ​​generated by the thermal imager detecting the calibration object at different preset target temperatures under different temperature rise states and different preset ambient temperatures are obtained, thus obtaining the detection voltage values; the reference voltage values ​​corresponding to different temperature rise states, different preset ambient temperatures, and different preset target temperatures are obtained respectively; the difference between the reference voltage values ​​and the detection voltage values ​​corresponding to different temperature rise states, different preset ambient temperatures, and different preset target temperatures is calculated to obtain the temperature rise compensation coefficients corresponding to different temperature rise states, different preset ambient temperatures, and different preset target temperatures.

[0007] In one embodiment, the temperature rise state also includes a normal temperature state; obtaining the reference voltage values ​​corresponding to different temperature rise states, different preset ambient temperatures, and different preset target temperatures respectively includes: obtaining the voltage values ​​generated by the thermal imager when detecting the calibrated object at normal temperature, different preset ambient temperatures, and different preset target temperatures, and obtaining the reference voltage values ​​corresponding to the temperature rise state or temperature drop state, different preset ambient temperatures, and different preset target temperatures respectively.

[0008] In one embodiment, a fan, and / or a vent communicating with the external environment and / or thermal insulation are provided in the calibration environment. By adjusting the fan speed, and / or the closure degree of the vent, and / or the thickness of the thermal insulation, the temperature rise state of the calibration environment can be converted into a heating state or a cooling state.

[0009] In one embodiment, the process of querying a temperature rise compensation coefficient table based on the current ambient temperature and the current temperature rise state to obtain a temperature rise compensation coefficient matching the current measurement environment includes: sorting multiple preset ambient temperatures sequentially based on their values ​​to obtain a sorting result; selecting a first preset ambient temperature and a second preset ambient temperature adjacent to the current ambient temperature from the sorting result; wherein the first preset ambient temperature is lower than the second preset ambient temperature, and the current ambient temperature is between the first preset ambient temperature and the second preset ambient temperature; obtaining the temperature rise compensation coefficient calculated under the first preset ambient temperature corresponding to the current temperature rise state to obtain a first temperature rise compensation coefficient; obtaining the temperature rise compensation coefficient calculated under the second preset ambient temperature corresponding to the current temperature rise state to obtain a second temperature rise compensation coefficient; and using the first temperature rise compensation coefficient and the second temperature rise compensation coefficient as the temperature rise compensation coefficient matching the current measurement environment.

[0010] In one embodiment, the original voltage value is corrected based on a temperature rise compensation coefficient to obtain a corrected voltage value. This includes: calculating a temperature rise correction coefficient based on a first temperature rise compensation coefficient, a second temperature rise compensation coefficient, a first preset ambient temperature, a second preset ambient temperature, and the current ambient temperature; acquiring the internal temperature of the thermal imager in the current measurement environment to obtain the actual equipment cavity temperature; calculating the difference between the actual equipment cavity temperature and the reference cavity temperature to obtain the equipment temperature rise coefficient; and correcting the original voltage value based on the temperature rise correction coefficient and the equipment temperature rise coefficient to obtain the corrected voltage value.

[0011] In one embodiment, a temperature rise correction coefficient is calculated based on a first temperature rise compensation coefficient, a second temperature rise compensation coefficient, a first preset ambient temperature, a second preset ambient temperature, and the current ambient temperature. This includes: calculating the difference between the current ambient temperature and the first preset ambient temperature to obtain the current ambient temperature difference; calculating the difference between the second preset ambient temperature and the first preset ambient temperature to obtain the preset ambient temperature difference; calculating the ratio of the current ambient temperature difference to the preset ambient temperature difference to obtain the ambient temperature ratio; calculating the difference between the second temperature rise compensation coefficient and the first temperature rise compensation coefficient to obtain the temperature rise compensation coefficient difference; and multiplying the temperature rise compensation coefficient difference and the ambient temperature ratio, then summing the product with the first temperature rise compensation coefficient to obtain the temperature rise correction coefficient.

[0012] In one embodiment, the temperature rise state also includes a normal temperature state; the original voltage value is corrected based on the temperature rise correction coefficient and the device temperature rise coefficient to obtain a corrected voltage value, including: acquiring the internal temperature of the thermal imager under different temperature rise states and different preset ambient temperatures in the calibration environment, and obtaining a calibration device temperature table corresponding to different temperature rise states and different preset ambient temperatures; querying the calibration device temperature corresponding to the current ambient temperature under the current temperature rise state from the calibration device temperature table to obtain the temperature rise device temperature, and querying the calibration device temperature corresponding to the current ambient temperature under the normal temperature state from the calibration device temperature table to obtain the reference cavity temperature; calculating the difference between the temperature rise device temperature and the reference cavity temperature to obtain the device temperature difference; calculating the ratio between the device temperature rise coefficient and the device temperature difference to obtain the device temperature ratio; multiplying the temperature rise correction coefficient and the device temperature ratio to obtain the temperature rise correction value; and summing the temperature rise correction value and the original voltage value to obtain the corrected voltage value.

[0013] A second aspect of this application provides a temperature measurement device for a thermal imager. The device includes: a detection module for detecting a target in the current measurement environment and generating an original voltage value corresponding to the target; an acquisition module for acquiring the ambient temperature and temperature rise state of the current measurement environment, obtaining the current ambient temperature and current temperature rise state, and acquiring a temperature rise compensation coefficient table; wherein the temperature rise state includes a heating state and / or a cooling state, and the temperature rise compensation coefficient table is used to store the values ​​of the temperature rise compensation coefficients corresponding to different preset ambient temperatures and different temperature rise states; a query module for querying the temperature rise compensation coefficient table based on the current ambient temperature and current temperature rise state to obtain a temperature rise compensation coefficient matching the current measurement environment; a correction module for correcting the original voltage value based on the temperature rise compensation coefficient to obtain a corrected voltage value; and a temperature calculation module for substituting the corrected voltage value into a pre-calibrated voltage-temperature conversion formula to calculate the temperature measurement value corresponding to the target.

[0014] A third aspect of this application provides an electronic device, including a memory and a processor, wherein the processor is configured to execute program instructions stored in the memory to implement the temperature measurement method described above.

[0015] The fourth aspect of this application provides a computer-readable storage medium having program instructions stored thereon, which, when executed by a processor, implement the above-described temperature measurement method.

[0016] The above scheme generates the original voltage value corresponding to the target by detecting the target in the current measurement environment; obtains the ambient temperature and temperature rise status of the current measurement environment, and obtains a temperature rise compensation coefficient table; queries the temperature rise compensation coefficient table based on the current ambient temperature and temperature rise status to obtain a temperature rise compensation coefficient that matches the current measurement environment; and corrects the original voltage value based on the temperature rise compensation coefficient to obtain a corrected voltage value. This scheme takes into account the influence of the ambient temperature rise status on temperature measurement, which can improve the temperature measurement accuracy of the thermal imager under different environments and different temperature rise statuses.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this application. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with this application and, together with the specification, serve to explain the technical solutions of this application.

[0019] Figure 1 This is a schematic diagram illustrating the implementation environment of the solution in an exemplary embodiment of this application;

[0020] Figure 2 This is a flowchart illustrating a temperature measurement method for a thermal imager, as shown in an exemplary embodiment of this application.

[0021] Figure 3 This is a schematic diagram illustrating a thermal imager temperature rise state adjustment device according to an exemplary embodiment of this application;

[0022] Figure 4 This is a block diagram illustrating a thermal imager temperature measurement device according to an exemplary embodiment of this application;

[0023] Figure 5 This is a schematic diagram of the structure of an electronic device shown in an exemplary embodiment of this application;

[0024] Figure 6 This is a schematic diagram illustrating the structure of a computer-readable storage medium, as shown in an exemplary embodiment of this application. Detailed Implementation

[0025] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0026] In the following description, specific details such as particular system architectures, interfaces, and technologies are presented for illustrative purposes rather than for limiting purposes, in order to provide a thorough understanding of this application.

[0027] In this document, the term "and / or" is merely a description of the association information of related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship. Furthermore, "many" in this document means two or more. Moreover, the term "at least one" in this document means any combination of at least two of any one or more of a plurality of elements. For example, including at least one of A, B, and C can mean including any one or more elements selected from the set consisting of A, B, and C.

[0028] The temperature measurement method provided in the embodiments of this application will be described below.

[0029] Please refer to Figure 1 , Figure 1 This is a schematic diagram illustrating an implementation environment of the scheme in an exemplary embodiment of this application. The implementation environment may include a thermal imager 110, a target under test 120, and a server 130.

[0030] A thermal imager 110 is deployed in the current measurement environment. The thermal imager 110 is used to measure the target 120 under test in the current measurement environment.

[0031] Server 130 can be a standalone physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, content delivery networks (CDN), and big data and artificial intelligence platforms.

[0032] The thermal imager 110 stores calibration data, which may include a temperature rise compensation coefficient table, voltage-temperature conversion formula, etc. The temperature of the target 120 under test is measured using the calibration data to obtain the corresponding temperature measurement value of the target. The temperature measurement value can be stored locally or sent to the server 130 or other terminals.

[0033] The calibration data can be pre-stored by the thermal imager 110 before it leaves the factory, or it can be sent to the thermal imager 110 by the server 130. This application does not limit this.

[0034] Please see Figure 2 , Figure 2 This is a flowchart illustrating a temperature measurement method for a thermal imager, as shown in an exemplary embodiment of this application. This temperature measurement method for the thermal imager can be applied to... Figure 1 The implementation environment shown is specifically executed by the thermal imager 110 in that implementation environment. It should be understood that this method can also be applied to other exemplary implementation environments and executed by devices in other implementation environments. This embodiment does not limit the implementation environment to which the method is applicable.

[0035] like Figure 2 As shown, the temperature measurement method of the thermal imager includes at least steps S210 to S250, which are described in detail below:

[0036] Step S210: Detect the target under test in the current measurement environment and generate the original voltage value corresponding to the target under test.

[0037] The current measurement environment refers to the environment in which the thermal imager can sense temperature, and the target to be measured refers to items, animals, etc., in the current measurement environment that require temperature measurement.

[0038] Thermal imagers measure temperature using non-contact temperature measurement technology. Their working principle is to focus the infrared radiation energy from the surface of an object onto the photodetector of the thermal imager through an optical system, convert it into an electrical signal, and then convert it into a temperature value through the internal temperature measurement algorithm of the thermal imager.

[0039] The target under test is detected in the current measurement environment using a thermal imager, and the original voltage value corresponding to the target under test is obtained.

[0040] Step S220: Obtain the ambient temperature and temperature rise status of the current measurement environment, obtain the current ambient temperature and current temperature rise status, and obtain the temperature rise compensation coefficient table; wherein, the temperature rise status includes the heating state and / or cooling state, and the temperature rise compensation coefficient table is used to store the values ​​of the temperature rise compensation coefficient corresponding to different preset ambient temperatures and different temperature rise statuses.

[0041] The thermal imager is equipped with an ambient temperature sensor, which measures the ambient temperature of the current measurement environment.

[0042] In addition, it measures the temperature rise of the current measurement environment.

[0043] For example, the ambient temperature of the current measurement environment is recorded at each time point to obtain a historical ambient temperature record table. The time corresponding to the current ambient temperature is taken as the current time. The ambient temperature of the current measurement environment collected before the current time is obtained from the historical ambient temperature record table to obtain the historical ambient temperature. Based on the historical ambient temperature, it is analyzed whether the current measurement environment is in a state of rising or falling temperature.

[0044] For example, if the current time is 9:00, the ambient temperature of the current measurement environment is 11℃. By retrieving the ambient temperatures of the current measurement environment collected before the current time from the historical ambient temperature record table, we can find that the ambient temperature of the current measurement environment collected at 8:55 is 10℃, the ambient temperature of the current measurement environment collected at 8:50 is 9℃, and the ambient temperature of the current measurement environment collected at 8:45 is 8℃. Based on the historical ambient temperature analysis, the current measurement environment is in a state of rising temperature.

[0045] For example, a reference cavity temperature is set, which is the cavity temperature at room temperature under the current ambient temperature. By comparing the current actual equipment cavity temperature with the reference cavity temperature, it is determined whether the current measurement environment is in a heating or cooling state. If the current actual equipment cavity temperature is greater than the reference cavity temperature, the current measurement environment is in a heating state; if the current actual equipment cavity temperature is less than the reference cavity temperature, the current measurement environment is in a cooling state.

[0046] Additionally, obtain the temperature rise compensation coefficient table, which stores the values ​​of the temperature rise compensation coefficient corresponding to different preset ambient temperatures and different temperature rise states.

[0047] Step S230: Based on the current ambient temperature and current temperature rise status, query the temperature rise compensation coefficient table to obtain the temperature rise compensation coefficient that matches the current measurement environment.

[0048] The temperature rise compensation coefficient table shows different preset ambient temperatures and different temperature rise states, each with a different temperature rise compensation coefficient.

[0049] Determine the preset ambient temperature that matches the current ambient temperature in the temperature rise compensation coefficient table, and determine the temperature rise state that matches the current temperature rise state in the temperature rise compensation coefficient table, thereby obtaining the temperature rise compensation coefficient.

[0050] For example, if the current temperature rise is in a heating state and the current ambient temperature is 11℃, and the preset ambient temperatures include 0℃, 5℃, 10℃, and 15℃, then the preset ambient temperature of 10℃ is taken as the preset ambient temperature that matches the current ambient temperature. The temperature rise compensation coefficient table is found to be a corresponding to the preset ambient temperature of 10℃ in the heating state. Therefore, the temperature rise compensation coefficient that matches the current measurement environment is a.

[0051] Step S240: Correct the original voltage value based on the temperature rise compensation coefficient to obtain the corrected voltage value.

[0052] The original voltage value is corrected based on the temperature rise compensation coefficient to obtain the corrected voltage value.

[0053] Specifically, a temperature rise compensation formula is pre-set. The temperature rise compensation coefficient is substituted into the temperature rise compensation formula to calculate the corrected voltage value.

[0054] Existing technologies in thermal imaging cameras often only consider changes in ambient temperature during temperature measurement, but lack consideration for temperature measurement deviations caused by other factors when the ambient temperature is the same. This application takes into account the temperature measurement deviations caused by differences in ambient temperature rise when the ambient temperature is the same, and corrects the temperature measurement results. By taking into account the ambient temperature and temperature rise state of the current measurement environment, the accuracy of the voltage value generated by the thermal imager can be improved, thereby improving the accuracy of temperature measurement.

[0055] Step S250: Substitute the corrected voltage value into the pre-calibrated voltage-temperature conversion formula to calculate the temperature measurement value corresponding to the target.

[0056] The voltage-temperature conversion formula is used to describe the conversion relationship between voltage and temperature.

[0057] The corrected voltage value, after being adjusted according to the temperature rise compensation coefficient, is substituted into the pre-calibrated voltage-temperature conversion formula to calculate the corresponding temperature measurement value of the target.

[0058] For example, the temperature measurement value can be calculated using the following formula 1:

[0059] T ′ =f(V ′ ,Tenv) (Formula 1).

[0060] Among them, T ′ V represents the measured temperature value of the target object. ′ Tenv is the corrected voltage value of the target under test, and Tenv is the current ambient temperature.

[0061] Next, some embodiments of this application will be described in detail.

[0062] In some implementations, step S220 obtains a temperature rise compensation coefficient table, including steps S221 to S224 below.

[0063] Step S221: Adjust the temperature of the calibration environment to different preset ambient temperatures based on different temperature rise states, and adjust the temperature of the calibration object in the calibration environment to the preset target temperature.

[0064] The calibration environment refers to the environment in which the parameters of a thermal imager are calibrated.

[0065] Adjust the ambient temperature and temperature rise of the calibration environment.

[0066] For example, the calibration environment is equipped with a fan, and / or vents communicating with the external environment, and / or insulation cotton. By adjusting the fan speed, and / or the closure degree of the vents, and / or the thickness of the insulation cotton, the temperature rise state of the calibration environment is converted into a heating state or a cooling state, and the temperature of the calibration environment is adjusted to different preset ambient temperatures, such as Tenv1, Tenv2, ..., Tenv m The preset ambient temperature is set based on experience, such as the upper and lower limits of the working ambient temperature (Tenv) of the thermal imager. max Tenv min and common operating temperature Tenv c This is the preset ambient temperature.

[0067] For example, the thermal imager can be calibrated using a thermal imager temperature rise adjustment device, which in turn serves as the calibration environment.

[0068] Specifically, please refer to Figure 3 , Figure 3 This is a schematic diagram illustrating a thermal imager temperature rise state adjustment device according to an exemplary embodiment of this application, as shown below. Figure 3 As shown, the thermal imager temperature rise adjustment device includes: thermal imager window, position adjuster 1, position adjuster 2, slide rail, ventilation hole, fan, and insulation cotton.

[0069] The thermal imager is placed on position adjusters 1 and 2, and is connected to power and for data communication via its power cord and network cable. Position adjusters 1 and 2 can be used to drive a motor with buttons to control their height, allowing for easy adjustment. Furthermore, position adjusters 1 and 2 are mounted on a slide rail, allowing them to slide. The distance between position adjusters 1 and 2 facilitates the placement of thermal imagers of different lengths.

[0070] Thermal imagers can observe the target under test through the thermal imager window and collect data.

[0071] Meanwhile, the thermal imager's temperature rise regulation device also includes a fan; by adjusting the fan speed, the temperature rise of the thermal imager can be controlled. Additionally, the thermal imager's temperature rise regulation device is equipped with insulation cotton on all sides. Figure 3For clarity, only the top layer of insulation is shown (insulation in the other three directions is omitted). The insulation is placed on a slide rail; its movement controls the closure and number of closed ventilation holes, thus controlling the thermal imager's temperature rise. Furthermore, the thermal imager's temperature rise adjustment device can be further adjusted to various temperature rise states based on factors such as the thickness of the insulation. Specifically, lower wind speed, thicker insulation, and / or fewer closed ventilation holes result in a greater temperature increase per unit time; conversely, higher wind speed, thinner insulation, and / or more closed ventilation holes result in a greater temperature decrease per unit time. Operators can switch between various temperature rise states as needed.

[0072] The following are examples of some temperature rise conditions:

[0073] (1) Turn off the fan and remove the insulation cotton around the room, keep all ventilation holes open, and record the temperature rise state as the normal temperature state, and mark it as 0;

[0074] (2) Turn on the fan and remove the insulation cotton around the room, keeping all ventilation holes open. This is recorded as a temperature rise state and a temperature drop state, and the corresponding mark is -1.

[0075] (3) Turn off the fan and move the insulation cotton to the ventilation hole, keep all ventilation holes closed, and record it as the temperature rise state, corresponding to the mark 1.

[0076] Of course, in addition to the temperature rise states exemplified above, more different temperature rise states can be set according to actual needs. For example, turning off the fan and moving the insulation cotton to the ventilation hole, keeping half of the ventilation hole closed, is recorded as temperature rise state 2; turning on the fan and removing the insulation cotton around the perimeter, keeping half of the ventilation hole open, is recorded as temperature rise state -2; adjusting the fan speed to the lowest setting and moving the insulation cotton to the ventilation hole, keeping half of the ventilation hole closed, is recorded as temperature rise state 3; adjusting the fan speed to the highest setting and removing the insulation cotton around the perimeter, keeping half of the ventilation hole open, is recorded as temperature rise state -3.

[0077] Step S222: Obtain the voltage values ​​generated by the thermal imager when detecting calibration objects with different preset target temperatures under different temperature rise states and different preset ambient temperatures, and obtain the detection voltage values.

[0078] The calibration object can be a blackbody that can be temperature-adjusted. Of course, other objects can also be used as calibration objects, and this application does not limit this.

[0079] For example, the temperature rise regulation device of the thermal imager is adjusted to a cooling state. The preset ambient temperature is Tenv1. The thermal imager is then powered off and left to stand for 1 hour to reach thermal equilibrium with the environment before being powered on. When the temperature of the thermal imager reaches thermal equilibrium and stops rising, the internal temperature of the thermal imager at this point is recorded. Using this as the calibration equipment temperature under cooling conditions and Tenv1, a thermal imager was used to collect different preset target temperatures t1, t2, t3, ..., t n The detection voltage value corresponding to the blackbody is denoted as:

[0080]

[0081] Where -1 indicates that the temperature rise state is a cooling state.

[0082] To illustrate further, the temperature rise setting of the thermal imager's internal temperature rise control device is adjusted to a rising state. The preset ambient temperature is Tenv1. The thermal imager is then powered off and left to stand for one hour until it reaches thermal equilibrium with the environment. After that, the imager is powered on again. When the thermal imager's temperature reaches thermal equilibrium and stops rising, the internal temperature of the thermal imager at this point is recorded. Using this as the calibration device temperature under the heating state and Tenv1, a thermal imager was used to collect different preset target temperatures t1, t2, t3, ..., t n The detection voltage value corresponding to the blackbody is denoted as:

[0083]

[0084] Where 1 indicates that the temperature rise is in the rising state.

[0085] Step S223: Obtain the reference voltage values ​​corresponding to different temperature rise states, different preset ambient temperatures, and different preset target temperatures.

[0086] The reference voltage value can be preset empirically or obtained through calibration.

[0087] For example, the temperature rise state also includes the normal temperature state; obtaining the reference voltage values ​​corresponding to different temperature rise states, different preset ambient temperatures and different preset target temperatures respectively includes: obtaining the voltage values ​​generated by the thermal imager when detecting the calibrated object at normal temperature, different preset ambient temperatures and different preset target temperatures, and obtaining the reference voltage values ​​corresponding to the temperature rise state or temperature drop state, different preset ambient temperatures and different preset target temperatures respectively.

[0088] For example, the temperature rise setting of the thermal imager's temperature rise control device is adjusted to a normal temperature state, with a preset ambient temperature of Tenv. jThen, power off the thermal imager and let it stand for 1 hour to allow it to reach thermal equilibrium with the environment before turning it on. When the temperature of the thermal imager reaches thermal equilibrium and stops rising, record the internal temperature of the thermal imager at this point. Treat it as a normal temperature state and Tenv j The calibration equipment temperature is set using a thermal imager to collect data at different preset target temperatures t1, t2, t3, ..., t. n The detection voltage value corresponding to the blackbody is denoted as:

[0089]

[0090] Where 0 indicates that the temperature rise is at room temperature.

[0091] Then when the preset ambient temperature is Tenv j The preset target temperature is t. i When the temperature rise state is either heating or cooling, the corresponding reference voltage value is Where i = 1, 2, ..., n, j = 1, 2, ..., m.

[0092] Step S224: Calculate the difference between the reference voltage value and the detection voltage value corresponding to different temperature rise states, different preset ambient temperatures and different preset target temperatures, and obtain the temperature rise compensation coefficient corresponding to different temperature rise states, different preset ambient temperatures and different preset target temperatures.

[0093] For example, let's assume the preset ambient temperature is Tenv. j When the thermal imager's temperature rise adjustment device is set to a cooling state (denoted as -1), the thermal imager collects data at the preset target temperature t. i The voltage value corresponding to the blackbody is This voltage value is used as the probe voltage value, and the reference voltage value is... The corresponding temperature rise compensation coefficient The calculation method is shown in Formula 2 below:

[0094]

[0095] To illustrate further, let's assume the preset ambient temperature is Tenv. j When the thermal imager's temperature rise adjustment device is set to a rising state (denoted as 1), the thermal imager collects data at the preset target temperature t. i The voltage value corresponding to the blackbody is This voltage value is used as the probe voltage value, and the reference voltage value is... The corresponding temperature rise compensation coefficient The calculation method is shown in Formula 3 below:

[0096]

[0097] Additionally, at different preset ambient temperatures Tenv1, Tenv2, ..., Tenv m In the calibration scenario, a thermal imager is used to collect data at different preset target temperatures t1, t2, t3, ..., t n The detection voltage values ​​V1, V2, V3, ..., V corresponding to the blackbody n By fitting the relationship between the preset ambient temperature, the preset target temperature and the detection voltage value, the voltage-temperature conversion formula T = f(V, Tenv) is obtained, where T represents the preset target temperature under the detection voltage value of V and the preset ambient temperature of Tenv.

[0098] In order to improve the calibration accuracy of the voltage-temperature conversion formula, the detection voltage values ​​under different preset ambient temperatures and different preset target temperatures were collected at room temperature to fit the voltage-temperature conversion formula.

[0099] By combining the various temperature rise compensation coefficients obtained from calibration, a temperature rise compensation coefficient table is obtained. The temperature rise compensation coefficient table, voltage-temperature conversion formula, and / or calibration equipment temperature are stored in the thermal imager or in the server corresponding to the thermal imager, so that the above calibration information can be used for temperature correction during temperature measurement.

[0100] In some implementations, step S230 involves querying a temperature rise compensation coefficient table based on the current ambient temperature and the current temperature rise status to obtain a temperature rise compensation coefficient that matches the current measurement environment, including steps S231 to S234 below.

[0101] Step S231: Sort multiple preset ambient temperatures sequentially based on their values ​​to obtain the sorting results.

[0102] Based on the magnitude of the measured ambient temperature values, arrange them from smallest to largest or largest to smallest to form an increasing or decreasing sequence. For example, the sorted result could be: Tenv1, Tenv2, Tenv3, ..., Tenv m .

[0103] Step S232: Select the first preset ambient temperature and the second preset ambient temperature that are adjacent to the current ambient temperature from the sorting results; wherein the first preset ambient temperature is lower than the second preset ambient temperature, and the current ambient temperature is between the first preset ambient temperature and the second preset ambient temperature.

[0104] Obtain the current ambient temperature Tenv, and select the first preset ambient temperature Tenv adjacent to Tenv from the above sequence. j Second preset ambient temperature Tenv j+1 The current ambient temperature is between the first preset ambient temperature and the second preset ambient temperature, i.e., Tenvj <Tenv≤Tenv j+1 Or Tenv j ≤Tenv <Tenv j+1 .

[0105] For example, if the sorting results are 0℃, 5℃, 10℃, 15℃, ..., and the current ambient temperature Tenv is 11℃, the Tenv selected from the sorting results... j At 10℃, Tenv j+1 The temperature is 15℃.

[0106] Step S233: Obtain the temperature rise compensation coefficient calculated under the first preset ambient temperature corresponding to the current temperature rise state, and obtain the first temperature rise compensation coefficient; obtain the temperature rise compensation coefficient calculated under the second preset ambient temperature corresponding to the current temperature rise state, and obtain the second temperature rise compensation coefficient.

[0107] For example, if the current ambient temperature is Tenv, and the current temperature rise state is a cooling state, the first preset ambient temperature Tenv is selected based on the current ambient temperature Tenv. j Second preset ambient temperature Tenv j+1 In addition, the original voltage value is converted to temperature using the voltage-temperature conversion formula to obtain the estimated temperature of the target. Then, the corresponding preset target temperature is determined based on the estimated temperature. For example, the preset target temperature with the smallest difference between the estimated and the estimated temperature is selected as the preset target temperature t corresponding to the estimated temperature. i Based on the aforementioned first preset ambient temperature Tenv j The estimated temperature corresponds to the preset target temperature t. i In the cooling state (marked as -1), the first temperature rise compensation coefficient is obtained by consulting the temperature rise compensation coefficient table. According to the aforementioned second preset ambient temperature Tenv j+1 The estimated temperature corresponds to the preset target temperature t. i In the cooling state, consult the temperature rise compensation coefficient table to obtain the second temperature rise compensation coefficient.

[0108] For example, if the current ambient temperature is Tenv, and the current temperature rise state is a rising state (marked as 1), the preset target temperature corresponding to the estimated temperature is t. i Then the first temperature rise compensation coefficient is obtained. Second temperature rise compensation coefficient

[0109] Step S234: Use the first temperature rise compensation coefficient and the second temperature rise compensation coefficient as the temperature rise compensation coefficient that matches the current measurement environment.

[0110] The corrected voltage value is calculated based on the first and second temperature rise compensation coefficients matched to the current measurement environment.

[0111] In some implementations, step S240 corrects the original voltage value based on the temperature rise compensation coefficient to obtain a corrected voltage value, including steps S241 to S244.

[0112] Step S241: Calculate the temperature rise correction coefficient based on the first temperature rise compensation coefficient, the second temperature rise compensation coefficient, the first preset ambient temperature, the second preset ambient temperature, and the current ambient temperature.

[0113] For example, based on a first temperature rise compensation coefficient, a second temperature rise compensation coefficient, a first preset ambient temperature, a second preset ambient temperature, and the current ambient temperature, a temperature rise correction coefficient is calculated, including: calculating the difference between the current ambient temperature and the first preset ambient temperature to obtain the current ambient temperature difference; calculating the difference between the second preset ambient temperature and the first preset ambient temperature to obtain the preset ambient temperature difference; calculating the ratio of the current ambient temperature difference to the preset ambient temperature difference to obtain the ambient temperature ratio; calculating the difference between the second temperature rise compensation coefficient and the first temperature rise compensation coefficient to obtain the temperature rise compensation coefficient difference; multiplying the temperature rise compensation coefficient difference and the ambient temperature ratio, and then summing the product result with the first temperature rise compensation coefficient to obtain the temperature rise correction coefficient.

[0114] For example, if the current ambient temperature is Tenv, and the current temperature rise state is a cooling state, the first preset ambient temperature Tenv is obtained based on the current ambient temperature Tenv. j Second preset ambient temperature Tenv j+1 First temperature rise compensation coefficient Second temperature rise compensation coefficient The temperature rise correction factor can then be calculated using the following formula 4:

[0115]

[0116] in, K is the temperature rise correction factor, B is the preset temperature rise correction gain factor, and B is the preset temperature rise correction bias factor.

[0117] To illustrate further, if the current ambient temperature is Tenv and the current temperature rise state is a warming state, the first preset ambient temperature Tenv is selected based on the current ambient temperature Tenv. j Second preset ambient temperature Tenv j+1 First temperature rise compensation coefficient Second temperature rise compensation coefficient The temperature rise correction factor can then be calculated using the following formula 5.

[0118]

[0119] Optionally, for thermal imagers that have already left the factory and have inaccurate temperature measurements due to temperature rise, the temperature rise correction gain factor K and temperature rise correction bias factor B can be finely adjusted according to the actual scenario, thereby adjusting the temperature rise correction coefficient and making the thermal imager's temperature measurement more accurate.

[0120] Step S242: Obtain the internal temperature of the thermal imager in the current measurement environment to get the actual equipment cavity temperature.

[0121] The internal temperature of a thermal imager can be detected by a temperature sensor deployed inside the thermal imager cavity.

[0122] Step S243: Calculate the difference between the actual equipment cavity temperature and the reference cavity temperature to obtain the equipment temperature rise coefficient.

[0123] For example, the equipment temperature rise coefficient T can be calculated using the following formula 6. rise :

[0124]

[0125] The reference cavity temperature is denoted as The actual temperature of the equipment cavity is denoted as TQ.

[0126] Step S244: Correct the original voltage value based on the temperature rise correction factor and the equipment temperature rise factor to obtain the corrected voltage value.

[0127] The temperature rise correction factor and the equipment temperature rise factor reflect the differences brought about by different temperature rise states. The original voltage value is corrected according to the temperature rise correction factor and the equipment temperature rise factor to obtain the corrected voltage value, so as to avoid the negative impact of different temperature rise states on temperature measurement and obtain a more accurate corrected voltage value.

[0128] For example, the temperature rise state also includes a normal temperature state; the original voltage value is corrected based on the temperature rise correction coefficient and the equipment temperature rise coefficient to obtain the corrected voltage value, including: acquiring the internal temperature of the thermal imager under different temperature rise states and different preset ambient temperatures in the calibration environment, and obtaining a calibration equipment temperature table corresponding to different temperature rise states and different preset ambient temperatures; querying the calibration equipment temperature corresponding to the current ambient temperature under the current temperature rise state from the calibration equipment temperature table to obtain the temperature rise equipment temperature, and querying the calibration equipment temperature corresponding to the current ambient temperature under the normal temperature state from the calibration equipment temperature table to obtain the reference cavity temperature; calculating the difference between the temperature rise equipment temperature and the reference cavity temperature to obtain the equipment temperature difference; calculating the ratio between the equipment temperature rise coefficient and the equipment temperature difference to obtain the equipment temperature ratio; multiplying the temperature rise correction coefficient and the equipment temperature ratio to obtain the temperature rise correction value; and summing the temperature rise correction value and the original voltage value to obtain the corrected voltage value.

[0129] The thermal imager was used in heating, cooling, and ambient temperature states, as well as at different preset ambient temperatures Tenv1, Tenv2, Tenv3, ..., Tenv. j The calibration equipment temperature of the thermal imager (i.e., the internal temperature of the equipment collected under the calibration environment) is used to obtain the calibration equipment temperature table.

[0130] The calibration equipment temperature is obtained by querying the calibration equipment temperature table to find the corresponding calibration equipment temperature under the current ambient temperature under the current temperature rise condition. The reference chamber temperature is obtained by querying the calibration equipment temperature table to find the corresponding calibration equipment temperature under the current ambient temperature under the current ambient temperature condition.

[0131] For example, if the current ambient temperature is Tenv and the current temperature rise state is in the rising state (denoted as 1), then the calibration equipment temperature corresponding to the current ambient temperature in the rising state is retrieved from the calibration equipment temperature table, and the temperature rise equipment temperature is obtained. Additionally, by consulting the calibration equipment temperature table to find the corresponding calibration equipment temperature under normal ambient temperature conditions, the reference chamber temperature is obtained. Among them, the calibration equipment temperature corresponding to the preset ambient temperature with the smallest difference from the current ambient temperature can be selected from the calibration equipment temperature table as the temperature rise equipment temperature or reference cavity temperature, and the temperature rise correction value can be calculated using the following formula 7:

[0132]

[0133] Where, ΔV i This is a temperature rise correction value. This is the temperature rise correction factor.

[0134] For example, if the current ambient temperature is Tenv and the current temperature rise state is cooling (denoted as -1), the temperature of the temperature rise device is... The reference cavity temperature is The temperature rise correction value can then be calculated using the following formula 8:

[0135]

[0136] Then, the temperature rise correction value and the original voltage value are summed to obtain the corrected voltage value.

[0137] For example, the temperature rise correction value can be calculated using the following formula 9:

[0138] V′ i =V i +ΔV i (Formula 9).

[0139] Where, ΔV i V is the temperature rise correction value. i The original voltage value, V′ i To correct the voltage value.

[0140] The corrected voltage value is substituted into the pre-calibrated voltage-temperature conversion formula to calculate the corresponding temperature measurement value of the target.

[0141] For example, use Formula 1 to calculate the temperature measurement value.

[0142] The temperature measurement method provided in this application generates the original voltage value corresponding to the target by detecting the target in the current measurement environment; obtains the ambient temperature and temperature rise state of the current measurement environment, and obtains a temperature rise compensation coefficient table; queries the temperature rise compensation coefficient table based on the current ambient temperature and temperature rise state to obtain a temperature rise compensation coefficient that matches the current measurement environment; and corrects the original voltage value based on the temperature rise compensation coefficient to obtain a corrected voltage value. This method takes into account the influence of the ambient temperature rise state on temperature measurement, which can improve the temperature measurement accuracy of the thermal imager under different environments and different temperature rise states.

[0143] Please see Figure 4 , Figure 4 This is a block diagram illustrating a thermal imager temperature measurement device according to an exemplary embodiment of this application. Figure 4 As shown, the exemplary thermal imaging temperature measurement device 400 includes:

[0144] The detection module 410 is used to detect the target under test in the current measurement environment and generate the original voltage value corresponding to the target under test.

[0145] The acquisition module 420 is used to acquire the ambient temperature and temperature rise status of the current measurement environment, obtain the current ambient temperature and current temperature rise status, and acquire the temperature rise compensation coefficient table; wherein, the temperature rise status includes the heating state and / or cooling state, and the temperature rise compensation coefficient table is used to store the values ​​of the temperature rise compensation coefficient corresponding to different preset ambient temperatures and different temperature rise statuses.

[0146] The query module 430 is used to query the temperature rise compensation coefficient table based on the current ambient temperature and the current temperature rise status, and obtain the temperature rise compensation coefficient that matches the current measurement environment.

[0147] The correction module 440 is used to correct the original voltage value based on the temperature rise compensation coefficient to obtain the corrected voltage value.

[0148] The temperature calculation module 450 is used to substitute the corrected voltage value into the pre-calibrated voltage-temperature conversion formula to calculate the temperature measurement value corresponding to the target under test.

[0149] It should be noted that the temperature measuring device and the temperature measuring method provided in the above embodiments belong to the same concept. The specific operation methods of each module and unit have been described in detail in the method embodiments and will not be repeated here. In practical applications, the temperature measuring device provided in the above embodiments can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. This is not a limitation.

[0150] Please see Figure 5 , Figure 5 This is a schematic diagram of an embodiment of the electronic device of this application. The electronic device 500 includes a memory 501 and a processor 502. The processor 502 is used to execute program instructions stored in the memory 501 to implement the steps in any of the temperature measurement method embodiments described above. In a specific implementation scenario, the electronic device 500 may include, but is not limited to, a microcomputer or a server. In addition, the electronic device 500 may also include mobile devices such as laptops and tablets, which are not limited here.

[0151] Specifically, processor 502 controls itself and memory 501 to implement the steps in any of the temperature measurement method embodiments described above. Processor 502 can also be referred to as a Central Processing Unit (CPU). Processor 502 may be an integrated circuit chip with signal processing capabilities. Processor 502 can also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. A general-purpose processor can be a microprocessor or any conventional processor. Furthermore, processor 502 can be implemented using integrated circuit chips.

[0152] Please see Figure 6 , Figure 6 This is a schematic diagram of a computer-readable storage medium according to an embodiment of the present application. The computer-readable storage medium 600 stores program instructions 610 that can be executed by a processor. The program instructions 610 are used to implement the steps in any of the above-described temperature measurement method embodiments.

[0153] In some embodiments, the functions or modules of the apparatus provided in this disclosure can be used to perform the methods described in the above method embodiments. The specific implementation can be referred to the description of the above method embodiments, and for the sake of brevity, it will not be repeated here.

[0154] The description of the various embodiments above tends to emphasize the differences between the various embodiments. The similarities or similarities between them can be referred to, and for the sake of brevity, they will not be repeated here.

[0155] In the several embodiments provided in this application, it should be understood that the disclosed methods and apparatus can be implemented in other ways. For example, the apparatus implementations described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection of devices or units may be electrical, mechanical, or other forms.

[0156] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute all or part of the steps of the methods in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

Claims

1. A temperature measurement method for a thermal imager, characterized in that, The method includes: The target under test in the current measurement environment is detected, and the original voltage value corresponding to the target under test is generated; The ambient temperature and temperature rise status of the current measurement environment are obtained, and the current ambient temperature and current temperature rise status are obtained, and a temperature rise compensation coefficient table is obtained; wherein, the temperature rise status includes a heating state and / or a cooling state, and the temperature rise compensation coefficient table is used to store the values ​​of the temperature rise compensation coefficients corresponding to different preset ambient temperatures and different temperature rise statuses. Based on the current ambient temperature and the current temperature rise status, the temperature rise compensation coefficient table is queried to obtain the temperature rise compensation coefficient that matches the current measurement environment; The original voltage value is corrected based on the temperature rise compensation coefficient to obtain the corrected voltage value; The corrected voltage value is substituted into the pre-calibrated voltage-temperature conversion formula to calculate the temperature measurement value corresponding to the target.

2. The method according to claim 1, characterized in that, The process of obtaining the temperature rise compensation coefficient table includes: The temperature of the calibration environment is adjusted to different preset ambient temperatures based on different temperature rise states, and the temperature of the calibration object in the calibration environment is adjusted to a preset target temperature. The voltage values ​​generated by the thermal imager when detecting the calibration object under different temperature rise states and different preset target temperatures under different preset ambient temperatures are obtained, and the detection voltage values ​​are obtained. Obtain the reference voltage values ​​corresponding to the different temperature rise states, the different preset ambient temperatures, and the different preset target temperatures, respectively; Calculate the difference between the reference voltage value and the detection voltage value corresponding to the different temperature rise states, the different preset ambient temperatures, and the different preset target temperatures to obtain the temperature rise compensation coefficients corresponding to the different temperature rise states, the different preset ambient temperatures, and the different preset target temperatures.

3. The method according to claim 2, characterized in that, The temperature rise state also includes a normal temperature state; obtaining the reference voltage values ​​corresponding to the different temperature rise states, the different preset ambient temperatures, and the different preset target temperatures respectively includes: The voltage values ​​generated by the thermal imager when detecting the calibrated object at the normal temperature, different preset ambient temperatures, and different preset target temperatures are obtained, and the reference voltage values ​​corresponding to the heating state or the cooling state, the different preset ambient temperatures, and the different preset target temperatures are obtained respectively.

4. The method according to claim 2, characterized in that, The calibration environment is equipped with a fan, and / or a vent connected to the external environment and / or insulation cotton. By adjusting the fan speed, and / or the closure degree of the vent, and / or the thickness of the insulation cotton, the temperature rise state of the calibration environment can be converted into a heating state or a cooling state.

5. The method according to claim 2, characterized in that, The step of querying the temperature rise compensation coefficient table based on the current ambient temperature and the current temperature rise status to obtain a temperature rise compensation coefficient that matches the current measurement environment includes: The preset ambient temperatures are sorted sequentially based on their values ​​to obtain a sorting result. Select a first preset ambient temperature and a second preset ambient temperature that are adjacent to the current ambient temperature from the sorting results; wherein, the first preset ambient temperature is less than the second preset ambient temperature, and the current ambient temperature is between the first preset ambient temperature and the second preset ambient temperature; Obtain the temperature rise compensation coefficient calculated at the first preset ambient temperature corresponding to the current temperature rise state to obtain the first temperature rise compensation coefficient; obtain the temperature rise compensation coefficient calculated at the second preset ambient temperature corresponding to the current temperature rise state to obtain the second temperature rise compensation coefficient. The first temperature rise compensation coefficient and the second temperature rise compensation coefficient are used as temperature rise compensation coefficients that match the current measurement environment.

6. The method according to claim 5, characterized in that, The step of correcting the original voltage value based on the temperature rise compensation coefficient to obtain the corrected voltage value includes: Based on the first temperature rise compensation coefficient, the second temperature rise compensation coefficient, the first preset ambient temperature, the second preset ambient temperature, and the current ambient temperature, the temperature rise correction coefficient is calculated. The internal temperature of the thermal imager in the current measurement environment is obtained to determine the actual equipment cavity temperature. The temperature difference between the actual equipment cavity temperature and the reference cavity temperature is calculated to obtain the equipment temperature rise coefficient; The original voltage value is corrected based on the temperature rise correction factor and the equipment temperature rise factor to obtain the corrected voltage value.

7. The method according to claim 6, characterized in that, The temperature rise correction coefficient is calculated based on the first temperature rise compensation coefficient, the second temperature rise compensation coefficient, the first preset ambient temperature, the second preset ambient temperature, and the current ambient temperature, including: The difference between the current ambient temperature and the first preset ambient temperature is calculated to obtain the current ambient temperature difference value; The difference between the second preset ambient temperature and the first preset ambient temperature is calculated to obtain the preset ambient temperature difference value; The ambient temperature ratio is obtained by calculating the ratio of the current ambient temperature difference to the preset ambient temperature difference. The difference between the second temperature rise compensation coefficient and the first temperature rise compensation coefficient is calculated to obtain the temperature rise compensation coefficient difference. After multiplying the difference in temperature rise compensation coefficients and the ratio of ambient temperature, the product is summed with the first temperature rise compensation coefficient to obtain the temperature rise correction coefficient.

8. The method according to claim 6, characterized in that, The temperature rise state also includes a normal temperature state; the step of correcting the original voltage value based on the temperature rise correction coefficient and the equipment temperature rise coefficient to obtain a corrected voltage value includes: The internal temperature of the thermal imager under different temperature rise states and different preset ambient temperatures in the calibration environment is obtained, and a calibration equipment temperature table corresponding to the different temperature rise states and different preset ambient temperatures is obtained. The calibration equipment temperature is obtained by querying the calibration equipment temperature table to find the calibration equipment temperature corresponding to the current ambient temperature under the current temperature rise state, and the reference cavity temperature is obtained by querying the calibration equipment temperature table to find the calibration equipment temperature corresponding to the current ambient temperature under the normal temperature state. The temperature difference between the temperature of the temperature riser and the temperature of the reference cavity is calculated to obtain the temperature difference of the equipment. The ratio of the temperature rise coefficient of the equipment to the temperature difference of the equipment is calculated to obtain the equipment temperature ratio. The temperature rise correction value is obtained by multiplying the temperature rise correction factor and the ratio of the equipment temperature. The corrected voltage value is obtained by summing the temperature rise correction value and the original voltage value.

9. An electronic device, characterized in that, The electronic device includes a memory and a processor, the processor being configured to execute program instructions stored in the memory to implement the steps of the method as described in any one of claims 1-8.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores program instructions that can be executed by a processor to implement the steps of the method as described in any one of claims 1-8.

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