Infrared temperature measurement method and system suitable for environment temperature change

Abstract

The invention relates to an infrared temperature measurement method and system suitable for environment temperature change. The method comprises the following steps: constructing a mapping relation; the infrared thermal imaging equipment is moved from the first temperature environment to the second temperature environment, a plurality of shutter temperatures and a plurality of focal plane temperatures are obtained in real time, and a Y16 value is obtained through reverse checking of the mean value of the focal plane temperatures; moving the infrared thermal imaging equipment in the shutdown state to a second temperature environment, and obtaining a shutter temperature rise amount; obtaining a compensation coefficient in the first infrared temperature measurement result compensation model through a least square method; and compensating the current Y16 value acquired by the infrared thermal imaging equipment based on the second infrared temperature measurement result compensation model. According to the application, the infrared thermal imaging equipment can be ensured not to be influenced by the change of the environment temperature in use, when the temperature of the environment where the infrared thermal imaging equipment is located changes, the target temperature can be quickly and accurately obtained, and the measured target temperature meets the error requirement and can meet the temperature measurement precision requirement.

Description

Technical Field

[0001] The present invention relates to the field of infrared temperature measurement technology, and in particular to an infrared temperature measurement method and system suitable for ambient temperature changes. Background Art

[0002] At present, infrared devices are widely used in many fields, especially for measuring target temperature. However, when infrared temperature measuring devices are actually used for temperature measurement, they are affected by many conditions, such as atmospheric humidity, target emissivity, distance between target and device, and whether the ambient temperature of the device is constant. In particular, when infrared temperature measuring devices are moved from a constant ambient temperature to another ambient temperature, it is usually necessary to shut down the device for a period of time or place the device at another ambient temperature for more than half an hour to ensure the accuracy of temperature measurement, which affects work efficiency. Summary of the invention

[0003] The purpose of the present invention is to provide an infrared temperature measurement method and system suitable for changes in ambient temperature. The infrared temperature measurement result compensation model can ensure that the infrared thermal imaging device is not affected by changes in ambient temperature during use. When the ambient temperature of the infrared thermal imaging device changes, the target temperature can be obtained quickly and accurately, and the measured target temperature meets the error requirements and the temperature measurement accuracy requirements.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] On the one hand, an infrared temperature measurement method suitable for ambient temperature changes is provided, which includes:

[0006] Construct the mapping relationship ftemp=f(Y16,FpaTemp), where f temp is the target temperature output by the infrared thermal imaging device, Y16 is the Y16 value obtained by converting the infrared radiation signal of the target object by the infrared thermal imaging device, and FpaTemp is the focal plane temperature of the infrared detector of the infrared thermal imaging device;

[0007] The infrared thermal imaging device is moved from the first temperature environment to the second temperature environment, and the infrared thermal imaging device is operated in the second temperature environment, and the current target temperature f is output. temp0 , and obtain several shutter temperatures and several focal plane temperatures FpaTemp0 in real time;

[0008] Take the average of several focal plane temperatures FpaTemp0 to obtain the focal plane temperature mean FpaTemp0', and based on the mapping relationship f temp=f(Y16, FpaTemp), the Y16 value of the infrared thermal imaging device when working in the second temperature environment is obtained by reversely looking up the focal plane temperature average FpaTemp0';

[0009] The infrared thermal imaging device in the off state is moved to a second temperature environment, and after being placed in the second temperature environment for a certain period of time, it is turned on, and the shutter temperature rise is obtained after the power-on;

[0010] The compensation coefficients K1, K2 and K3 in the first infrared temperature measurement result compensation model are obtained by the least square method, wherein the expression of the infrared temperature measurement result compensation model is as follows:

[0011] Y16=Y16'+K1·ΔTemp·abs(ΔTemp)+K2·S rate +K3

[0012] Wherein, Y16 and Y16' are the values ​​of Y16 after compensation and before compensation respectively; ΔTemp=(T e +T m -T s ), where T e is the temperature of the second temperature environment, T s is the real-time shutter temperature of the infrared thermal imaging device at the current time t; S rate is the shutter temperature rise rate at the current time t; abs(*) means taking the absolute value;

[0013] The current Y16 value obtained by the infrared thermal imaging device is compensated based on the second infrared temperature measurement result compensation model to obtain a compensated Y16 value, and a compensated target temperature is output according to the compensated Y16 value. The expression of the second infrared temperature measurement result compensation model is as follows;

[0014] Y160=Y160'+K1·ΔTemp0·abs(ΔTemp0)+K2·S rate0 +K3

[0015] Wherein, Y160 and Y160' are the compensated Y16 value and the current Y16 value acquired by the infrared thermal imaging device respectively; ΔTemp0=(T e0 +T m0 -T s0 ), where T e0 is the temperature of the environment where the infrared thermal imaging device is currently located, T s0 is the real-time shutter temperature of the infrared thermal imaging device at the current time t0; S rate0 is the shutter temperature rise rate at the current time t0; abs(*) indicates the absolute value.

[0016] Preferably, the infrared thermal imaging device is in a shutdown state before being moved out of the first temperature environment and moved to the second temperature environment, and is turned on again to work after the infrared thermal imaging device is moved to the second temperature environment, or the infrared thermal imaging device is in a continuously powered-on state before being moved out of the first temperature environment and moved to the second temperature environment, and is continued to work after the infrared thermal imaging device is moved to the second temperature environment.

[0017] Preferably, the infrared thermal imaging device in the off state is moved to the second temperature environment, and is placed in the second temperature environment for more than 1-2 hours before being turned on.

[0018] Preferably, the shutter temperature rise is obtained according to formula (1):

[0019] T m =T ms -T m0 (1)

[0020] Among them, T m is the shutter temperature rise, T m0 、T ms They are respectively the shutter temperature when the infrared thermal imaging device in the off state is moved to the second temperature environment and turned on after being placed for a certain period of time, and the shutter temperature when the infrared thermal imaging device works in the second temperature environment for t2 time and is in a stable working state during this period.

[0021] Preferably, the shutter temperature rise rate S rate =|(T q -T p )| / ΔT, ΔT is the predetermined time interval before the current time t, T p 、T q They are respectively the first shutter temperature and the last shutter temperature recorded within the predetermined time interval ΔT.

[0022] Preferably, the shutter temperature rise rate S rate0 =|(T q0 -T p0) | / ΔT0, ΔT0 is the predetermined time interval before the current time t0, T p0 、T q0 They are respectively the first shutter temperature and the last shutter temperature recorded within the predetermined time interval ΔT0.

[0023] Preferably, the compensated target temperature T is obtained according to T=g(Y160), wherein g(*) is a curve formed by target Y16 data-target temperature T.

[0024] On the other hand, an infrared temperature measurement system is also provided, comprising:

[0025] Mapping relationship building module, which is used to build the mapping relationship f temp =f(Y16,FpaTemp), and store;

[0026] A data query module, which is used to obtain the Y16 value of the infrared thermal imaging device when it is working in the second temperature environment according to the focal plane temperature mean FpaTemp0' when the infrared thermal imaging device is moved from the first temperature environment to the second temperature environment and the infrared thermal imaging device is working in the second temperature environment;

[0027] A shutter temperature rise acquisition module, which is used to move the infrared thermal imaging device in a shutdown state to a second temperature environment, and acquire the shutter temperature rise when working in the second temperature environment;

[0028] A compensation coefficient determination module, which is used to obtain compensation coefficients K1, K2 and K3 in the first infrared temperature measurement result compensation model by least square method;

[0029] And a compensation module, which is used to compensate the current Y16 value obtained by the infrared thermal imaging device based on the second infrared temperature measurement result compensation model to obtain a compensated Y16 value, and output a compensated target temperature according to the compensated Y16 value.

[0030] In summary, the present invention has the following beneficial effects compared with the prior art:

[0031] The infrared temperature measurement result compensation model in the present invention can ensure that the infrared thermal imaging device is not affected by changes in ambient temperature during use. When the ambient temperature of the infrared thermal imaging device changes, the target temperature can be obtained quickly and accurately, and the measured target temperature meets the error requirements and the temperature measurement accuracy requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a flow chart of the steps of the infrared temperature measurement method of the present invention;

[0033] Figure 2 The black body temperature output by the unprocessed infrared thermal imaging device and the black body temperature processed by the second infrared temperature measurement result compensation model of the present invention;

[0034] Figure 3 It is a structural schematic diagram of the infrared temperature measurement system of the present invention. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0036] Example 1

[0037] like Figure 1 As shown, this embodiment provides an infrared temperature measurement method suitable for ambient temperature changes, wherein the infrared temperature measurement process is completed based on an infrared thermal imaging device, and the infrared thermal imaging device includes an infrared detector, which can sense the infrared radiation of the target object and convert it into an electrical signal, and further simulate the temperature distribution of the target object by related processing of the electrical signal, thereby obtaining the temperature of the target object. On this basis, the infrared temperature measurement method includes the following steps:

[0038] S1. Construct a mapping relationship ftemp=f(Y16,FpaTemp), where f temp is the target temperature output by the infrared thermal imaging device, Y16 is the Y16 value obtained by converting the infrared radiation signal of the target object by the infrared thermal imaging device, and FpaTemp is the focal plane temperature of the infrared detector of the infrared thermal imaging device; f(*) can be any function, including but not limited to a linear function, a quadratic polynomial function, etc.;

[0039] Place the infrared thermal imaging device in a corresponding working environment (such as a constant temperature environment) to detect the target temperature and output the target temperature f temp , and during the working process, the focal plane temperature FpaTemp and Y16 value at different times can be recorded in real time, and finally the above mapping relationship is constructed by fitting and other methods;

[0040] S2, moving the infrared thermal imaging device from the first temperature environment to the second temperature environment, and making the infrared thermal imaging device work for t1 time in the second temperature environment, and within the working time t1, the infrared thermal imaging device outputs the current target temperature f temp0 , and obtain several shutter temperatures and several focal plane temperatures FpaTemp0 in real time; wherein the first temperature environment and the second temperature environment are both constant temperature environments, and the temperature difference between the two is greater than or equal to 3°C;

[0041] At the same time, the infrared thermal imaging device is in a shutdown state before being moved out of the first temperature environment and moved to the second temperature environment, and is turned on again after the infrared thermal imaging device is moved to the second temperature environment, or the infrared thermal imaging device is in a continuously turned-on state before being moved out of the first temperature environment and moved to the second temperature environment, and is continued to work after the infrared thermal imaging device is moved to the second temperature environment;

[0042] S3, taking an average value of several focal plane temperatures FpaTemp0 when the infrared thermal imaging device is working in the second temperature environment to obtain a focal plane temperature mean value FpaTemp0', and based on the mapping relationship f temp =f(Y16, FpaTemp), the Y16 value of the infrared thermal imaging device when working in the second temperature environment is obtained by reversely looking up the focal plane temperature average FpaTemp0';

[0043] Because the Y16 value of the infrared thermal imaging device changes with the focal plane temperature during operation, in this embodiment, the focal plane temperature mean FpaTemp0' can be substituted into the mapping relationship, and the corresponding Y16 value can be further reversed to obtain the Y16 value. The Y16 value is a fixed value and can be used to determine the subsequent coefficients K1, K2, and K3.

[0044] S4, move the infrared thermal imaging device in the off state to the second temperature environment, and turn it on after leaving it in the second temperature environment for a period of time (such as more than 1-2 hours), and record the shutter temperature T when it is turned on m0 ;

[0045] After being turned on, the infrared thermal imaging device operates in the second temperature environment for t2 time, and within the operating time t2, the shutter temperature T when the infrared thermal imaging device is in a stable working state (ie, steady state) is obtained. ms ;

[0046] And the shutter temperature rise is obtained according to formula (1):

[0047] T m =T ms -T m0 (1)

[0048] Among them, T m is the shutter temperature rise, T m0 , T msThey are respectively the shutter temperature when the infrared thermal imaging device in the off state is moved to the second temperature environment and turned on after being placed for a certain period of time, and the shutter temperature when the infrared thermal imaging device is in a stable working state (i.e., steady state) during the period of working for t2 time in the second temperature environment; the infrared thermal imaging device is placed in a constant temperature environment for a certain period of time (e.g., more than 1-2 hours) and then turned on, so that the shutter temperature when turned on can be closer to the constant temperature environment temperature, thereby reducing the error;

[0049] S5. Obtain compensation coefficients K1, K2, and K3 in the first infrared temperature measurement result compensation model by least square method, wherein the expression of the infrared temperature measurement result compensation model is as follows:

[0050] Y16=Y16'+K1·ΔTemp·abs(ΔTemp)+K2·S rate +K3

[0051] Wherein, Y16 and Y16' are respectively the Y16 value after compensation and the Y16 value before compensation. In this embodiment, the Y16 value after compensation is the Y16 value of the infrared thermal imaging device when working in the second temperature environment obtained by reversely checking the focal plane temperature average FpaTemp0' in step S2. The Y16 value before compensation can be obtained by real-time conversion of the infrared radiation signal of the target object by the infrared thermal imaging device; ΔTemp=(T e +T m -T s ), where T e is the temperature of the second temperature environment, T s S is the real-time shutter temperature of the infrared thermal imaging device at the current time t when the infrared thermal imaging device works in the second temperature environment for t2 time; rate is the shutter temperature rise rate at the current time t when the infrared thermal imaging device works in the second temperature environment for t2 time, and S rate =|(T q -T p )| / ΔT, ΔT is the predetermined time interval (such as 30s) before the current time t, and for different times, ΔT is a constant value, T p , T q are the first shutter temperature and the last shutter temperature recorded within the predetermined time interval ΔT respectively; K1 is the coefficient of the difference between the shutter temperature and the real-time shutter temperature when the infrared thermal imaging device is in a stable working state under the current ambient temperature; K2 is the coefficient acting on the shutter temperature rise rate; K3 is the bias coefficient acting on the compensation result; abs(*) means taking the absolute value; Y16, Y16', S rate , ΔTemp are known values;

[0052] Due to the change of ambient temperature and the change of the temperature of the focal plane of the infrared thermal imaging device, there is a difference between the Y16 value before compensation (i.e., Y16') and the Y16 value after compensation (i.e., Y16). Therefore, this embodiment determines three compensation coefficients K1, K2, and K3 by the least square method, so that Y16' at any time is close to the value of Y16 after compensation (when the difference between the Y16 value after compensation and the Y16 value before compensation meets the predetermined condition, it is considered that Y16' is close to Y16), so that the temperature measurement result is constant;

[0053] S6. Compensating the current Y16 value obtained by the infrared thermal imaging device based on the second infrared temperature measurement result compensation model to obtain a compensated Y16 value, and outputting a compensated target temperature according to the compensated Y16 value;

[0054] Wherein, the expression of the second infrared temperature measurement result compensation model is as follows:

[0055] Y160=Y160'+K1·ΔTemp0·abs(ΔTemp0)+K2·S rate0 +K3

[0056] Wherein, Y160 and Y160' are respectively the Y16 value after compensation and the current Y16 value obtained by the infrared thermal imaging device (ie, the Y16 value before compensation); ΔTemp0=(T e0 +T m0 -T s0 ), where T e0 is the temperature of the environment where the infrared thermal imaging device is currently located, T s0 is the real-time shutter temperature of the infrared thermal imaging device at the current time t0 when the infrared thermal imaging device is working in the current environment; S rate0 is the shutter temperature rise rate at the current time t0 when the infrared thermal imaging device is working in the current environment, and S rate0 =|(T q0 -T p0 )| / ΔT0, ΔT0 is a predetermined time interval (such as 30s) before the current time t0, and for different times, ΔT0 is a constant value, T p0 , T q0 are the first shutter temperature and the last shutter temperature recorded within the predetermined time interval ΔT0, respectively; K1, K2 and K3 have been determined by step S4, and their meanings are the same as in step S4; abs(*) indicates taking the absolute value; Y160', S rate0 , ΔTemp0 are known values ​​and can be obtained through real-time calculation;

[0057] Furthermore, the compensated target temperature T can be obtained according to T=g(Y160), wherein g(*) is a curve formed by target Y16 data-target temperature T, which can be obtained by pre-construction.

[0058] like Figure 2 As shown, a black body with a temperature of 20°C is selected as the target object, and the infrared thermal imaging device is placed in an ambient temperature of 13°C for 1-2 hours, then taken out, transferred to an ambient temperature of 23°C, turned on for use, and the temperature of the black body is detected. Figure 2 Part (a) is the blackbody temperature output by the infrared thermal imaging device without being processed by the second infrared temperature measurement result compensation model in this embodiment, and part (b) is the blackbody temperature output by the infrared thermal imaging device after being processed by the second infrared temperature measurement result compensation model in this embodiment. It can be seen that as the working time of the equipment increases, the unprocessed output blackbody temperature is not within the error range (i.e., the range of 18°C ​​to 22°C between the red lines), and the blackbody temperature output after being processed by the model of this embodiment is basically within the range of 18°C ​​to 20°C, which meets the error requirements.

[0059] It can be seen that the second infrared temperature measurement result compensation model in this embodiment can ensure that the infrared thermal imaging device is not affected by changes in ambient temperature during use. When the ambient temperature of the infrared thermal imaging device changes, the target temperature can be obtained quickly and accurately, and the measured target temperature meets the error requirements and the temperature measurement accuracy requirements. The method is simple and easy to operate and can be implemented on multiple platforms.

[0060] Embodiment 2:

[0061] This embodiment provides an infrared temperature measurement system for implementing the infrared temperature measurement method described in Embodiment 1, such as Figure 3 As shown, the infrared temperature measurement system includes:

[0062] Mapping relationship building module 1, which is used to build the mapping relationship f temp =f(Y16,FpaTemp), and store;

[0063] Data query module 2, which is used to reversely query the Y16 value of the infrared thermal imaging device when it is working in the second temperature environment according to the focal plane temperature mean FpaTemp0' when the infrared thermal imaging device is moved from the first temperature environment to the second temperature environment and the infrared thermal imaging device is operated in the second temperature environment for t1 time, and the process is the same as step S2;

[0064] The shutter temperature rise acquisition module 3 is used to move the infrared thermal imaging device in the shutdown state to a second temperature environment, and acquire the shutter temperature rise when the device works in the second temperature environment for a time t2, and the process is the same as step S3;

[0065] A compensation coefficient determination module 4 is used to obtain the compensation coefficients K1, K2 and K3 in the first infrared temperature measurement result compensation model by the least square method, and the process is the same as step S4;

[0066] And a compensation module 5, which is used to compensate the current Y16 value obtained by the infrared thermal imaging device based on the second infrared temperature measurement result compensation model to obtain a compensated Y16 value, and output a compensated target temperature according to the compensated Y16 value. The process is the same as step S5.

[0067] In summary, the infrared temperature measurement result compensation model in the present invention can ensure that the infrared thermal imaging device is not affected by changes in ambient temperature during use. When the ambient temperature of the infrared thermal imaging device changes, the target temperature can be obtained quickly and accurately, and the measured target temperature meets the error requirements and the temperature measurement accuracy requirements. The method is simple to implement and easy to operate, and can be implemented on multiple platforms.

[0068] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An infrared temperature measurement method suitable for ambient temperature changes, characterized in that: include: Construct the mapping relationship ftemp=f(Y16,FpaTemp), where f temp is the target temperature output by the infrared thermal imaging device, Y16 is the Y16 value obtained by converting the infrared radiation signal of the target object by the infrared thermal imaging device, and FpaTemp is the focal plane temperature of the infrared detector of the infrared thermal imaging device; The infrared thermal imaging device is moved from the first temperature environment to the second temperature environment, and the infrared thermal imaging device is operated in the second temperature environment, and the current target temperature f is output. temp0 , and obtain several shutter temperatures and several focal plane temperatures FpaTemp0 in real time; Take the average of several focal plane temperatures FpaTemp0 to obtain the focal plane temperature mean FpaTemp0', and based on the mapping relationship f temp =f(Y16, FpaTemp), the Y16 value of the infrared thermal imaging device when working in the second temperature environment is obtained by reversely looking up the focal plane temperature average FpaTemp0'; The infrared thermal imaging device in the off state is moved to a second temperature environment, and after being placed in the second temperature environment for a certain period of time, it is turned on, and the shutter temperature rise is obtained after the power-on; The compensation coefficients K1, K2 and K3 in the first infrared temperature measurement result compensation model are obtained by the least square method, wherein the expression of the infrared temperature measurement result compensation model is as follows: Y16=Y16'+K1·ΔTemp·abs(ΔTemp)+K2·S rate +K3 Wherein, Y16 and Y16' are the values ​​of Y16 after compensation and before compensation respectively; ΔTemp=(T e +T m -T s ), where T e is the temperature of the second temperature environment, T s is the real-time shutter temperature of the infrared thermal imaging device at the current time t; S rate is the shutter temperature rise rate at the current time t; abs(*) means taking the absolute value; The current Y16 value obtained by the infrared thermal imaging device is compensated based on the second infrared temperature measurement result compensation model to obtain a compensated Y16 value, and a compensated target temperature is output according to the compensated Y16 value. The expression of the second infrared temperature measurement result compensation model is as follows; Y160=Y160'+K1·ΔTemp0·abs(ΔTemp0)+K2·S rate0 +K3 Wherein, Y160 and Y160' are the compensated Y16 value and the current Y16 value acquired by the infrared thermal imaging device respectively; ΔTemp0=(T e0 +T m0 -T s0 ), where T e0 is the temperature of the environment where the infrared thermal imaging device is currently located, T s0 is the real-time shutter temperature of the infrared thermal imaging device at the current time t0; S rate0 is the shutter temperature rise rate at the current time t0; abs(*) indicates the absolute value.

2. The infrared temperature measurement method according to claim 1, characterized in that: The infrared thermal imaging device is in a shutdown state before being moved out of the first temperature environment and moved to the second temperature environment, and is turned on again to work after the infrared thermal imaging device is moved to the second temperature environment, or the infrared thermal imaging device is in a continuously turned-on state before being moved out of the first temperature environment and moved to the second temperature environment, and continues to work after the infrared thermal imaging device is moved to the second temperature environment.

3. The infrared temperature measurement method according to claim 1, characterized in that: Move the infrared thermal imaging device that is in a turned-off state to a second temperature environment, and leave it in the second temperature environment for more than 1-2 hours before turning it on.

4. The infrared temperature measurement method according to claim 1, characterized in that: According to formula (1), the shutter temperature rise is obtained: T m =T ms -T m0 (1) Among them, T m is the shutter temperature rise, T m0 , T ms They are respectively the shutter temperature when the infrared thermal imaging device in the off state is moved to the second temperature environment and turned on after being placed for a certain period of time, and the shutter temperature when the infrared thermal imaging device works in the second temperature environment for t2 time and is in a stable working state during this period.

5. The infrared temperature measurement method according to claim 1, characterized in that: The shutter temperature rise rate S rate =|(T q -T p )| / ΔT, ΔT is the predetermined time interval before the current time t, T p , T q They are respectively the first shutter temperature and the last shutter temperature recorded within the predetermined time interval ΔT.

6. The infrared temperature measurement method according to claim 1, characterized in that: The shutter temperature rise rate S rate0 =|(T q0 -T p0) | / ΔT0, ΔT0 is the predetermined time interval before the current time t0, T p0 , T q0 They are respectively the first shutter temperature and the last shutter temperature recorded within the predetermined time interval ΔT0.

7. The infrared temperature measurement method according to claim 1, characterized in that: The compensated target temperature T is obtained according to T=g(Y160), wherein g(*) is a curve formed by target Y16 data-target temperature T.

8. An infrared temperature measurement system, characterized in that: include: Mapping relationship building module, which is used to build the mapping relationship f temp =f(Y16,FpaTemp), and store; A data query module, which is used to obtain the Y16 value of the infrared thermal imaging device when it is working in the second temperature environment according to the focal plane temperature mean FpaTemp0' when the infrared thermal imaging device is moved from the first temperature environment to the second temperature environment and the infrared thermal imaging device is working in the second temperature environment; A shutter temperature rise acquisition module, which is used to move the infrared thermal imaging device in a shutdown state to a second temperature environment, and acquire the shutter temperature rise when working in the second temperature environment; A compensation coefficient determination module, which is used to obtain compensation coefficients K1, K2 and K3 in the first infrared temperature measurement result compensation model by least square method; And a compensation module, which is used to compensate the current Y16 value obtained by the infrared thermal imaging device based on the second infrared temperature measurement result compensation model to obtain a compensated Y16 value, and output a compensated target temperature according to the compensated Y16 value.

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