Radiator device

By designing the lead frame and arranging the heat sink, the problem of low heat conduction efficiency in semiconductor thermal management is solved, achieving more efficient heat conduction and dissipation, and is suitable for heat sink devices in semiconductor packaging.

CN120854397APending Publication Date: 2025-10-28NXP BV
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Patent Information

Application Number
CN202510530476.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-04-25
Filing Date
2025-04-25
Publication Date
2025-10-28

AI Technical Summary

Technical Problem

Existing technologies struggle to effectively transfer heat from the chip die to the heat sink in semiconductor thermal management, resulting in low heat dissipation efficiency.

Method used

The design employs a leadframe structure, which includes multiple heat sinks and insulators. Heat is conducted from the die pads to the heat sinks via tie rods and lead pads, and the heat sinks are coupled to the chip die via bonding wires to enhance heat conduction. The heat sinks are also exposed in the package to improve heat dissipation efficiency.

Benefits of technology

It improves the efficiency of heat conduction from the chip die to the heat sink, enhances the heat dissipation capability of the heat sink device, and improves thermal management performance, especially in square flat no-lead (QFN) packages.

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Abstract

One example discloses a heat sink device comprising: a lead frame having a die pad, a first edge, a second edge, a third edge, and a fourth edge; wherein the lead frame further comprises a group of radiators, and the group of radiators comprises a first radiator which is located at the position where the first edge and the fourth edge of the lead frame intersect and a second radiator which is located at the position where the second edge and the fourth edge intersect; the second radiator is positioned at a position where the first edge and the second edge of the lead frame intersect; and a third heat sink located at a position where the second edge and the third edge of the lead frame intersect.
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