A lamp holder connecting piece forming device and a forming method

Abstract

The present application relates to a lamp holder connector forming device and method, belonging to the technical field of injection molding; the device comprises a lower mold assembly and an upper mold assembly; the lower mold assembly is provided with a mounting groove with a positioning block for fixing the metal inlay to prevent it from deflecting; the upper mold assembly is provided with a forming block and a second movable body, forming an inverted hook forming cavity after clamping; its forming method comprises: differentiating preheating the conductive seat and the metal plug to reduce the thermal stress with the injection body; adopting a multi-section pressure-velocity coordinated injection strategy to apply pulse pressure in the melt convergence area and combine vacuum exhaust to strengthen the weld line strength; adopting a double circuit cooling system to slow cool in the high temperature area around the inlay and fast cool in the low temperature area of the main body, and introducing a stress relaxation mechanism to control the cooling rate difference and reduce the residual stress; effectively improving the bonding force of the metal inlay and the plastic body, avoiding the weld line and internal stress defects, and ensuring the forming quality and reliability of the lamp holder connector.

Description

Technical Field

[0001] This invention relates to the field of mold injection technology, specifically to a lamp holder connector molding device and molding method. Background Technology

[0002] The plug-in automotive lamp connector is a core functional component in automotive lighting systems that enables electrical connection and mechanical fixation. Its main function is to establish a reliable connection between the lamp and the automotive circuit, ensuring stable power transmission and maintaining the lamp's stability under various driving conditions.

[0003] Structurally, in-line automotive lamp connectors typically consist of metal inserts and injection-molded bodies. The metal inserts are the core components that complete the connection function and are directly related to the stability of current transmission. The injection-molded body is responsible for arranging the metal inserts in the required positions and spacing, and ensuring the insulation performance between the metal inserts and with the external environment. The injection-molded body often has accessories, including structural accessories such as locating pins and sealing rings, as well as screws and nuts, to ensure that the in-line connector can maintain stability in the complex environment of automobile driving.

[0004] In existing technologies, metal inserts and injection molded bodies are usually integrated into one injection molding process to form a strong and fixed connection between the two. However, when performing integrated injection molding, the metal insert is usually placed in a groove before injection molding. This method can easily cause the metal insert to shift in position within the groove, resulting in a defective final product.

[0005] Chinese Patent CN110774538B discloses a precision injection mold, including a base, a lower mold, and an upper mold. A cavity for injection molding is formed between the upper and lower molds, and an injection channel is connected to the cavity. A positioning strip is provided on the lower mold, and the positioning strip is vertically slidably connected to the lower mold. A slot for the insertion part of the product is opened on the side of the positioning strip facing the cavity. By providing a positioning strip that can be raised and lowered on the lower mold, the insertion part (i.e., conductive sheet) of the socket product can be inserted into the slot of the positioning strip for positioning before injection molding. Then, after the mold is closed, injection molding is performed. During this process, the slot is used to properly position the insertion part, ensuring that it will not shift its position in the cavity during injection molding, thereby effectively improving the quality and pass rate of the molded product. After the mold is opened, the positioning strip can be lifted to allow the bottom of the product to be removed from the cavity, facilitating the product removal operation.

[0006] Although the aforementioned patent documents use positioning strips to position the insertion part, thereby improving the quality of the molded product, some technical problems still need to be solved in practical applications. Specifically:

[0007] Generally, metal inserts consist of a conductive base and a metal pin. These two components are installed by simply inserting them together. However, during injection molding, metal inserts assembled by inserting together can still experience misalignment. This is mainly because the molten plastic exerts a large impact force on the metal insert, causing the connection between the conductive base and the metal pin to be impacted and resulting in misalignment.

[0008] Meanwhile, after the injection molding process is completed, the molten plastic begins to cool and shrink until it reaches room temperature. Since the shrinkage of plastic is significantly greater than that of metal, and the presence of metal inserts restricts the free shrinkage process of plastic, a large residual tensile stress will inevitably be generated inside the plastic after the cooling and solidification process is completed. At the same time, there will be compressive stress on the metal side. This internal stress already exists at room temperature and will significantly weaken the actual bonding strength of the interface.

[0009] Furthermore, during the injection molding process, the injection molded body flows around the conductive base and metal pin. When they rejoin at the back, the fusion process is not sufficient due to the decrease in temperature, which will form a visible joint line. This joint line is not only a defect in appearance, but also a weak point in the structure. Its strength is relatively low, and it is very likely to have an adverse effect on the electrical insulation performance. Summary of the Invention

[0010] The purpose of this invention is to provide a lamp holder connector forming device and forming method, which aims to solve the problems mentioned in the background art.

[0011] To achieve the above objectives, the present invention provides the following technical solution:

[0012] The present invention provides a lamp holder connector forming device, including a metal insert and a lower mold assembly; the lower mold assembly includes a lower mold body, the lower mold body is provided with an array of placement grooves, and a positioning block is provided in the middle of the placement groove, the positioning block being used to position the metal insert;

[0013] The side of the mounting groove is provided with an array of grooves, and a first movable body that can move axially is provided in the groove. The side of the first movable body facing the positioning block is provided with a stop groove, which is used to limit the workpiece after injection molding.

[0014] Preferably, it also includes an upper mold assembly;

[0015] The upper mold assembly includes an upper mold body, on which are arranged an array of molding blocks, and at the bottom of each molding block are positioning posts; when the upper mold body and the lower mold body are closed, the positioning posts abut against the metal inserts.

[0016] The molded block has a socket molding cavity and a pin adapter groove inside, and a second movable body is provided on the outside of the molded block; the second movable body can move towards the central area of ​​the molded block, and when the second movable body contacts the molded block, the side of the second movable body facing the molded block will form an inverted hook molding cavity with the molded block.

[0017] Preferably, the side of the molded block facing the second movable body has an abutment surface;

[0018] The bottom of the second movable body is provided with a movable column, which can extend and retract within the second movable body;

[0019] When the movable column is in the extended state, the end of the movable column away from the second movable body abuts against the metal insert.

[0020] A molding method for producing lamp holder connectors using a lamp holder connector molding apparatus, the molding method comprising the following steps:

[0021] S100. Differential preheating is performed on the split metal insert, and the preheating temperature is calculated based on the difference between its thermal expansion rate and plastic shrinkage rate.

[0022] S200. When performing encapsulation injection molding on metal inserts, a multi-stage pressure-speed coordinated strategy is adopted. First, high-speed injection is used to quickly surround the microstructure of the insert surface with the melt. Pulsed pressure is applied in the melt confluence area. At the same time, the cavity pressure is monitored in real time by the cavity pressure sensor and the holding pressure is adjusted to track the ideal decay curve. During this stage, the mold vacuum valve is activated to remove trapped air and avoid weld line defects.

[0023] S300: During the injection molding cooling stage, a dual-circuit cooling system is adopted. High-temperature slow cooling is used in the area around the insert, while low-temperature rapid cooling is used in the main plastic area to control the difference in cooling rates. After the holding pressure is completed, the cooling time is delayed. During this period, the mold temperature is maintained at a high level to reduce residual stress in the plastic. The flow rate of the cooling medium is dynamically adjusted by the controller to ensure that the temperature gradient does not exceed the set threshold.

[0024] Preferably, a higher pulse pressure and a lower frequency are used for the conductive base, and a lower pulse pressure and a higher frequency are used for the metal pin; at the same time, the location of the weld line is predicted by mold flow analysis, and a heating device is added in this area to instantly raise the temperature of the junction point, so as to improve the weld line strength.

[0025] Preferably, the S300 stage also includes a stress relaxation mechanism, which dynamically adjusts the temperature of the high-temperature circuit cooling medium to match the plastic shrinkage curve by real-time monitoring of the temperature gradient around the inlay; at the same time, the optimal delayed cooling time is calculated based on the material thermal performance parameters.

[0026] Preferably, a collaborative mechanism with cavity pressure feedback as the priority is established. When the cavity pressure sensor detects that the pressure deviates from the ideal curve by more than the predetermined tolerance, the mold temperature system is automatically triggered to adjust, and the pulse pressure frequency is optimized simultaneously.

[0027] Preferably, it also includes S400, which collects the bonding force index in real time through a sensor network. If the index is lower than a set threshold, the system automatically adjusts the pulse pressure curve and cooling rate until the index reaches the optimization target.

[0028] Preferably, the vacuum valve is activated within a predetermined time after the injection begins, and the exhaust time is linked to the pulse pressure amplitude. When the pulse pressure is high, the vacuum level is increased to ensure that the trapped air on the back of the inlay is completely removed.

[0029] The technical effects and advantages of this invention are as follows:

[0030] 1. The molding device of the present invention achieves multi-directional constraint and stable positioning of the metal insert within the mold through the synergistic action of the positioning block and the limiting block in the lower mold assembly, and the secondary clamping design of the positioning post and the movable post in the upper mold assembly. Specifically, the trapezoidal positioning block in the middle of the placement groove is embedded inside the conductive seat, and together with the limiting block on the side, effectively prevents the metal insert from axially deflecting or misaligning within the placement groove before mold closing. During mold closing, the positioning post of the upper mold presses down on the conductive seat, making it in close contact with the bent part of the metal pin, enhancing the stability of the insertion part. After mold closing, the movable post inside the second movable body extends under the drive of the medium, performing secondary extrusion on the conductive seat, thereby further preventing displacement of the metal insert during the injection molding impact stage. This ensures that the metal insert always maintains the preset posture during the injection molding process, reducing defects such as uneven coverage and dimensional deviations caused by insert misalignment.

[0031] 2. The molding method provided by this invention solves the problems of internal stress concentration and insufficient bonding force caused by the huge difference in thermal expansion rates between metal and plastic materials through differentiated preheating, multi-stage pressure-speed coordinated injection molding, and dual-loop cooling stress management. Differential preheating of the conductive base and metal pin based on their material, surface area, and thermal parameters reduces the temperature difference when they come into contact with the melt, thereby reducing interfacial thermal stress at the source. In the injection molding stage, a high-speed injection and pulsed pressure coordinated strategy ensures that the melt fully fills the fine structure of the inlay surface, and local pressure and heating in the weld line area strengthen the molecular chain entanglement, effectively eliminating the visible weld line as a structural weakness. In the cooling stage, a dual-loop system implements differentiated cooling control around the inlay and the plastic body, and introduces a stress relaxation mechanism based on real-time temperature gradient feedback to actively manage the cooling rate difference, coordinating the shrinkage behavior of the plastic with the constraint of the metal inlay, thereby minimizing residual stress. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the main structure of the lamp holder connector of the present invention;

[0033] Figure 2 This is another schematic diagram of the lamp holder connector of the present invention;

[0034] Figure 3 This is an exploded structural diagram of the lamp holder connector of the present invention;

[0035] Figure 4 This is a schematic diagram of the exploded structure of the metal inlay of the present invention;

[0036] Figure 5 This is a schematic diagram of the molding device of the present invention;

[0037] Figure 6 This is a schematic diagram of the molding apparatus of the present invention from another perspective;

[0038] Figure 7 This is a schematic diagram of the structure of the lower mold assembly of the present invention.

[0039] Figure 8 This is a schematic diagram of the upper mold assembly of the present invention.

[0040] Figure 9 This is a schematic diagram of the structure of the molding block of the present invention.

[0041] Figure 10 This is a schematic diagram of the cross-sectional structure of the molding block of the present invention.

[0042] Figure 11 This is a schematic diagram of the cross-sectional structure of the second movable body of the present invention;

[0043] Figure 12 This is a system architecture design diagram of the molding method of the present invention;

[0044] Figure 13 This is a schematic diagram of the logic control for the multi-segment pressure-speed coordinated control of the present invention;

[0045] Figure 14 This is a schematic diagram of the logic control of the dual-loop cooling system of the present invention;

[0046] Figure 15 This is a schematic diagram of the logic control for automatically adjusting the pulse pressure curve and cooling rate according to the present invention.

[0047] In the picture:

[0048] 1. Metal inlay; 101. Conductive base; 102. Metal pin;

[0049] 2. Injection molded body; 201. Annular covering seat; 202. Insertion seat; 203. Barbed body; 204. Buckle;

[0050] 3. Lower mold assembly; 301. Lower mold body; 302. Mounting groove; 303. Positioning block; 304. First movable body; 305. Stop groove;

[0051] 4. Upper mold assembly; 401. Upper mold body; 402. Molding block; 403. Socket molding cavity; 404. Positioning post; 405. Second movable body; 406. Undercut molding cavity; 407. Abutment surface; 408. Movable post;

[0052] 5. Flow channel. Detailed Implementation

[0053] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0054] Example 1

[0055] This invention provides a lamp holder connector molding apparatus for injection molding lamp holder connectors with a specific structure.

[0056] Reference Figures 1 to 11 As shown, the present invention provides a lamp holder connector including a metal insert 1 and an injection-molded body 2 covering it.

[0057] The metal insert 1 includes a conductive base 101, on which symmetrically distributed metal pins 102 are provided. The metal pins 102 are inserted into the conductive base 101. The metal pins 102 are inserted into the conductive base 101 by bending.

[0058] The injection-molded body 2 includes an annular covering seat 201 that covers the conductive seat 101. The outer side of the annular covering seat 201 is provided with an array of buckles 204. The annular covering seat 201 is provided with a plug seat 202. The plug seat 202 is connected to the part of the metal pin 102 that extends out of the conductive seat 101. The outer side of the plug seat 202 is provided with a barb 203.

[0059] It should be noted that the metal pin 102 is provided with a positioning groove. When the injection molding machine injects the metal insert 1, after the injection solution has solidified, the positioning groove on the metal pin 102 is clamped to the injection molded body 2.

[0060] In view of the lamp holder connector with the above-mentioned unique structure, the present invention provides a molding device for injection molding the structure.

[0061] Reference Figures 1 to 4As shown, the present invention provides a lamp holder connector forming device, including a metal insert 1, the metal insert 1 including a conductive base 101 and a metal pin 102, the metal pin 102 being symmetrically inserted into the conductive base 101.

[0062] The lamp holder connector forming device also includes a lower mold assembly 3 and a mold assembly.

[0063] Reference Figures 5 to 7 As shown, the lower mold assembly 3 includes a lower mold body 301. The lower mold body 301 is provided with arrayed placement grooves 302. A positioning block 303 is provided in the middle of the placement groove 302. The positioning block 303 is used to position the metal insert 1. The cross-section of the positioning block 303 is trapezoidal. A limiting block is provided on the outside of the positioning block 303 to limit the position of the metal insert 1. When the metal insert 1 is placed on the positioning block 303, the positioning block 303 is located inside the conductive seat 101. The metal pin 102 contacts the top of the conductive seat 101 through the bent part. The part of the metal pin 102 and the conductive seat 101 that are inserted into each other contacts the limiting block. By setting the limiting block to limit the conductive seat 101, the phenomenon of axial deflection and misalignment of the metal insert 1 is avoided.

[0064] The side of the placement groove 302 is provided with an array of grooves, and a first movable body 304 that can move axially is provided in the groove. The side of the first movable body 304 facing the positioning block 303 is provided with a stop groove 305. The stop groove 305 is used to limit the workpiece after injection molding. After the injection solution solidifies, a buckle 204 will be formed at the stop groove 305 position on the first movable body 304.

[0065] The first movable body 304 includes a pusher, one end of which is connected to a groove, and the other end of which is provided with a movable block. A stop groove 305 is located on the movable block. The movable block is slidably connected to the side wall of the groove to limit the movement distance of the movable block. The arc of the side of the movable block away from the pusher corresponds to the arc of the placement groove 302.

[0066] It should be noted that the pusher can be driven by pneumatic, hydraulic or electric means. Using the pusher to drive the moving block is existing technology and will not be discussed further here.

[0067] Reference Figures 5 to 11 As shown, the upper mold assembly 4 includes an upper mold body 401, on which are arranged an array of molding blocks 402, and at the bottom of the molding blocks 402 are positioning posts 404. When the upper mold body 401 and the lower mold body 301 are closed, the positioning posts 404 abut against the metal insert 1. Multiple positioning posts 404 are provided, which can be arranged in an array or in a non-array arrangement.

[0068] The molded block 402 has a socket molding cavity 403 and a pin adapter groove inside, and a second movable body 405 is provided on the outside of the molded block 402. The second movable body 405 can move towards the center area of ​​the molded block 402. When the second movable body 405 contacts the molded block 402, the side of the second movable body 405 facing the molded block 402 will form an inverted hook molding cavity 406 with the molded block 402.

[0069] The pin adapter groove is used to cover the metal pin 102 to prevent the injection molding solution from covering the insertion part of the metal pin 102.

[0070] The second movable body 405 includes a telescopic component. One end of the telescopic component is connected to the upper mold body 401, and the other end of the telescopic component is connected to a moving block. After the moving block comes into contact with the molding block 402, it will form an undercut molding cavity 406 with the molding block 402.

[0071] It should be noted that the telescopic component can be driven by pneumatic or hydraulic means. Using the telescopic component to drive the moving block is existing technology and will not be discussed further here.

[0072] The side of the molded block 402 facing the second movable body 405 is provided with an abutment surface 407;

[0073] The bottom of the second movable body 405 is provided with a movable column 408, which can extend and retract within the second movable body 405; when the movable column 408 is in the extended state, the end of the movable column 408 away from the second movable body 405 abuts against the metal insert 1.

[0074] It should be noted that, referring to Figure 11 As shown, the movable block is provided with a channel that communicates with the telescopic component. A pressure valve is provided in the channel. When the movable block abuts against the forming block 402, the channel is opened by continuing to supply medium into the telescopic component, thereby driving the movable column 408 to extend out of the movable block. The extension of the movable column 408 by supplying medium is the prior art and will not be described in detail here.

[0075] In use, the metal insert 1 is placed on the positioning block 303 of the placement groove 302 by a robotic arm so that the bent part of the metal pin 102 contacts the top of the conductive seat 101. At the same time, the limiting block on the positioning block 303 limits the connection between the conductive seat 101 and the metal pin 102 to prevent axial rotation and misalignment.

[0076] After the metal insert 1 is placed, the control system drives the first movable body 304 to move so that the first movable body 304 surrounds the conductive seat 101 part of the metal insert 1; then the upper mold body 401 is controlled to move down to realize the mold closing of the upper mold body 401 and the lower mold body 301.

[0077] During the mold closing process of the upper mold body 401 and the lower mold body 301, the metal pin 102 enters the pin fitting groove on the molding block 402 to achieve the positioning of the metal pin 102. At the same time, the positioning post 404 on the molding block 402 gradually contacts the bottom of the conductive seat 101. The positioning post 404 squeezes the top of the conductive seat 101, thereby causing the conductive seat 101 to generate a downward force. Due to the pushing action of the positioning block 303, the conductive seat 101 and the bent part of the metal pin 102 are tightly connected, thereby avoiding the metal insert 1 from being misaligned during the injection molding process, and reducing the unevenness of the non-insertion part of the conductive seat 101 and the metal pin 102 after injection molding.

[0078] After the mold is closed, the control system drives the second movable body 405 to move so that the second movable body 405 contacts the abutment surface 407 of the molding block 402, thereby forming an undercut molding cavity 406 between the movable block and the molding block 402. After the second movable body 405 contacts the abutment surface 407 of the molding block 402, a medium (gas or liquid) is continuously injected into the telescopic part so that the movable column 408 extends. The movable column 408 performs secondary extrusion positioning on the conductive seat 101 to prevent the metal insert 1 from being misaligned.

[0079] The injection molding machine injects the injection solution into the cavity formed after the upper mold body 401 and the lower mold body 301 are closed through the flow channel 5. After the solution enters the cavity, it forms an annular covering seat 201 of the injection body 2 in the placement groove 302, and a buckle 204 is formed at the stop groove 305 of the first movable body 304. A plug seat 202 is formed in the socket molding cavity 403 of the molding block 402, and a barb body 203 is formed in the barb molding cavity 406.

[0080] It should be noted that the injection molding machine used in this application is a vertical injection molding machine.

[0081] After the injection molding solution solidifies into injection body 2, the mold separation operation is performed. Specifically, firstly, the control system drives the telescopic component to retract in one stage. At this time, the second movable body 405 and the abutment surface 407 are still in contact, and only the movable column 408 retracts into the interior of the second movable body 405. Then, the telescopic component is driven to retract in two stages so that the second movable body 405 is no longer in contact with the abutment surface 407, thus preventing the second movable body 405 from interfering with the demolding of the undercut body 203 when the upper mold body 401 moves upward. After the second movable body 405 is in the initial state, the control system moves the upper mold body 401 upward to achieve the mold separation of the upper mold body 401. During this process, since the injection molding solution forms a buckle 204 at the stop groove 305, the buckle 204 restrains the injection body 2 when the upper mold body 401 moves upward, preventing the injection body 2 from detaching from the lower mold as the upper mold moves.

[0082] After the upper mold body 401 moves to the initial position, the control system drives the first movable body 304 to move backward, that is, the stop groove 305 on the first movable body 304 disengages from the buckle 204, and finally the robot arm removes the injection molded body 2 from the placement groove 302, realizing complete demolding.

[0083] Example 2

[0084] Although the above embodiments can achieve integral injection molding of the metal insert 1, after the injection molding process is completed, due to the significant difference between the shrinkage range of the plastic and the shrinkage range of the metal material, the plastic will generate large tensile stress after curing, while the metal side will have corresponding compressive stress, resulting in a significant weakening effect on the bonding strength between the two. In addition, during the injection molding process, the injection molded body will bypass the conductive seat 101 and the metal pin 102 when it flows. When they rejoin behind, due to the decrease in temperature, the fusion process is not sufficient, which will form a visible joint line. This joint line is not only a defect in appearance, but also a weak part in the structure. Its strength is relatively low, and it is very likely to have an adverse effect on the electrical insulation performance.

[0085] Reference Figures 1 to 15 As shown, the present invention provides a molding method for producing lamp holder connectors using a lamp holder connector molding device, the molding method comprising the following steps:

[0086] S100. Differential preheating is performed on the split metal insert 1, and the preheating temperature is calculated according to the difference between its thermal expansion rate and plastic shrinkage rate.

[0087] Specifically, in this embodiment, the metal insert 1 is a socket fit between the conductive base 101 and the metal pin 102. These two components are made of different materials. If the same preheating temperature is used for heating, the bonding strength between one component and the injection molded body 2 will still not be guaranteed. Moreover, due to the difference in materials and size, if the same temperature is used for heating, insufficient temperature may easily lead to insufficient bonding force with the injection molded body 2; if the temperature is too high, it may cause damage to the surface coating of the metal insert 1 and charring of the plastic. In view of this, this embodiment performs differentiated preheating on the conductive base 101 and the metal pin 102 to eliminate the inherent problems such as internal stress and insufficient bonding force caused by the huge difference in thermal expansion rate between the metal insert 1 and the injection molded body 2.

[0088] Specifically, the preheating temperatures of the conductive base 101 and the metal pin 102 need to be calculated separately in order to accurately preheat them in the future.

[0089] Among them, the preheating temperature of the conductive base 101 The calculation formula is:

[0090]

[0091] Preheating temperature of metal pin 102 The calculation formula is:

[0092]

[0093] in, This is the base temperature of the mold; and These are the thermal conductivity correction coefficients for different metal inlay materials and shapes; and The thermal expansion coefficients of the materials of conductive base 101 and metal pin 102 are respectively. The shrinkage rate of the plastic material used. and The effective contact surface area between the respective metal inlay 1 and the injection molded body 2. The selected reference area is used for dimensionless processing.

[0094] This differentiated preheating reduces the sharp temperature difference when the high-temperature injection molded body 2 comes into contact with the relatively low-temperature metal insert 1, thereby effectively reducing the internal stress formed in the interface area due to the huge difference in the thermal expansion rates of the two, preventing cracking of the product, and improving the wetting and micro-penetration ability of the injection molded body 2 on the surface of the metal insert 1.

[0095] In this embodiment, a combined heating method of infrared heating and hot air circulation is used to preheat the metal inlay 1 to ensure that the heat can be transferred evenly and efficiently to the entire metal inlay 1, avoiding the problems of local overheating or insufficient preheating.

[0096] Since the conductive base 101 and the metal pin 102 are inserted together, and the two metal materials, thicknesses and structures are different, their expansion and shrinkage rates during the injection molding process will also have significant differences, so they need to be treated differently.

[0097] During preheating, the preheating temperature of the conductive base 101 and the metal pin 102 needs to be precisely controlled so that they reach the thermal state most conducive to bonding with the plastic during injection molding, thereby minimizing internal stress and enhancing mechanical locking force.

[0098] During the preheating process, the preheating temperature is set so as not to damage the surface coating of the metal insert 1. For metal inserts 1 without a surface coating, the preheating temperature can be appropriately increased. Meanwhile, since the conductive seat 101 is in direct contact with the high-temperature injection molding solution, its target preheating temperature is set to a higher value. However, the metal pin 102 is less affected by the impact of the high-temperature injection molding solution due to the constraints of the conductive seat 101 and the positioning block 303, so its target preheating temperature is set to a lower value.

[0099] The preferred device for preheating the metal inlay 1 is a closed-type metal inlay 1 preheating device. This type of device can provide a stable and uniform preheating environment and support multi-temperature zone control to achieve differentiated preheating. If a multi-temperature zone device is not used, step-by-step preheating can also be used. First, the inserted metal inlay 1 is placed into the preheating device and heated uniformly at a lower temperature for a period of time to allow the temperature of the internal metal inlay 1 to rise steadily. Then, the external metal inlay 1 area is quickly exposed to hot air or infrared heating at a higher temperature to raise its temperature to the target value. Due to thermal inertia, the temperature rise of the internal metal inlay 1 will be less than that of the external metal inlay 1, thereby achieving a temperature difference.

[0100] Before preheating, the surface of the metal insert 1 is treated to enhance the mechanical interlocking force; the surface treatment includes sandblasting to improve the surface roughness of the area where the metal insert 1 is embedded, thereby increasing the actual contact area between the injection molded body 2 and the metal insert 1. When the melt penetrates these micro-uneven structures and cools and solidifies, it can form a strong mechanical anchor.

[0101] S200. When performing encapsulation injection molding on the metal insert 1, a multi-stage pressure-speed coordinated strategy is adopted. First, high-speed injection is used to make the melt quickly surround the surface microstructure of the metal insert 1. Pulse pressure is applied in the melt confluence area. At the same time, the cavity pressure is monitored in real time by the cavity pressure sensor and the holding pressure is adjusted to track the ideal decay curve. During this stage, the mold vacuum valve is activated simultaneously to remove trapped air and avoid weld line defects.

[0102] Specifically, in this embodiment, during the injection molding dynamic filling control stage, a collaborative control strategy is used to actively intervene in the rheological behavior of the melt to optimize its wetting and encapsulation of the surface of the metal insert 1, while eliminating inherent defects caused by melt flow obstruction and convergence.

[0103] In the initial stage of filling, when the melt begins to contact and flow through the metal insert 1, the purpose of high-speed injection is to enable the melt to flow quickly through the pre-set micro-grooves or knurled structures on the surface of the metal insert 1 with higher kinetic energy. This ensures that the melt can fully penetrate into these fine geometric features, laying the foundation for the formation of mechanical interlock. At the same time, high-speed injection filling reduces the thickness of the cooling layer caused by the melt front contacting the relatively low temperature of the metal insert 1 and the mold wall, which macroscopically manifests as the maintenance of melt viscosity and improves flow efficiency.

[0104] Subsequently, in the area where the melt flows behind the metal inlay 1 and is expected to re-merge to form a weld line, the system applies a pulse pressure. This pulse pressure is initiated when the leading edge of the main melt reaches a predetermined position. At the same time, the pressure amplitude of this pulse pressure is higher than the base injection pressure, so that the pulse pressure exerts a strong squeezing and shearing effect on the melt in the merging area, forcing the molecular chains at the interface of the two melts to diffuse and entangle with each other, thereby effectively strengthening the weld line. At the same time, the high pressure helps to eliminate the "wind trap" defect formed by air trapped on the back of the metal inlay 1 or at the end of the flow channel 5.

[0105] It should be noted that the mainstream melt front is usually triggered by a pressure sensor located inside the mold cavity. Once the pressure value detected by the sensor exceeds this threshold, the system determines that the mainstream melt front has reached the sensor position.

[0106] The entire process is monitored in real time and provides closed-loop feedback by pressure sensors installed inside the mold cavity. The pressure sensors continuously collect the actual pressure inside the mold cavity. The system continuously monitors and records actual pressure values ​​to generate a curve showing the actual change in melt pressure within the mold cavity. This curve is then compared with an ideal pressure decay model curve, pre-optimized through extensive process testing or mold flow analysis. The system dynamically adjusts the holding pressure of the injection molding machine. This allows the actual pressure curve to track the ideal target curve as closely as possible, thereby compensating for the pressure loss caused by the cooling and shrinkage of the melt in real time. It ensures that there is enough melt to be continuously added to the cavity before the gate freezes, thus compensating for the volume shrinkage of the melt during the cooling process and effectively reducing the residual stress inside the product, ensuring that the metal insert 1 is kept under uniform wrapping pressure.

[0107] In this embodiment, the ideal attenuation curve can be represented as:

[0108]

[0109] in, τ is the peak pressure reached within the cavity; τ is the time constant determined by the PVT (pressure-specific volume-temperature) characteristics of the plastic material and the actual cooling rate; n is an exponent reflecting the nonlinear behavior of the material.

[0110] The system dynamically adjusts the holding pressure output P_hold(t) of the injection molding machine through a closed-loop controller, so that the actual measured... The curve can track the ideal curve as closely as possible to compensate for pressure loss caused by melt cooling and shrinkage in real time. This ensures that sufficient melt is continuously replenished into the cavity before the gate freezes, thereby significantly reducing shrinkage marks and porosity inside the product and ensuring uniform encapsulation pressure on the metal insert.

[0111] It should be noted that in this embodiment, the pressure sensor can be embedded near the mold gate, behind the metal insert, or at the end of the product.

[0112] It should be noted that this embodiment also establishes a coordinated triggering mechanism with the vacuum exhaust system during the injection dynamic filling control stage. At the moment or slightly earlier when the injection action begins, the vacuum valve installed on the mold parting surface or the preset exhaust groove will be activated to draw the air in the cavity to a high vacuum level. Vacuum exhaust provides an escape channel for trapped air, while pulse pressure pushes these gases to the exhaust position. The synchronous action of the two minimizes the risk of material scorching caused by air compression heating, as well as the local material shortage caused by the inability of gas to be discharged.

[0113] S300: During the injection molding cooling stage, a dual-circuit cooling system is adopted. High-temperature slow cooling is used in the area around the metal insert 1, while low-temperature rapid cooling is used in the plastic body area to control the difference in cooling rates. After the holding pressure is completed, the cooling time is delayed. During this period, the mold temperature is maintained at a high level to allow the plastic molecular chains to rearrange and reduce residual stress. The flow rate of the cooling medium is dynamically adjusted by the controller to ensure that the temperature gradient does not exceed the set threshold.

[0114] This embodiment uses a systematic cooling strategy to actively manage the shrinkage behavior of the injection molded body 2 during the curing process, so as to coordinate it with the constraint of the metal insert 1, thereby minimizing the internal residual stress caused by the difference in thermal expansion rate and shrinkage rate between the two.

[0115] Specifically, a relatively high-temperature cooling medium is used for slow cooling in the area surrounding the metal inlay 1 (conductive base 101 and metal pin 102), with the medium temperature maintained between 60°C and 80°C. This slows down the curing speed of the injection-molded body 2 around the metal inlay 1, allowing it to better match the shrinkage process of the main body of the product, thereby reducing internal stress caused by asynchronous shrinkage. In contrast, a relatively low-temperature cooling medium is used for rapid cooling in the plastic main body area away from the metal inlay 1, with the medium temperature maintained between 10°C and 20°C. This quickly removes heat from the plastic main body, improving production efficiency. The difference in cooling rates between these two circuits is maintained within the range of ≤3°C / s to ensure that the area of ​​the metal inlay 1 and the main body area do not generate new shrinkage stress concentration points due to the significant difference in cooling rates.

[0116] To achieve precise temperature gradient control, this stage introduces an active feedback mechanism based on real-time monitoring; temperature sensors are placed at key locations in the mold cavity, particularly around the metal insert 1, to continuously monitor the temperature gradient in that area. This data is transmitted to the controller, which then dynamically adjusts the flow rate of the cooling medium accordingly. ), ensuring the temperature gradient around the metal inlay 1 The cooling temperature does not exceed the set threshold, thus ensuring uniformity of cooling in space and avoiding excessive local stress.

[0117] The control logic for the cooling medium flow rate can be expressed as follows:

[0118]

[0119] in, , , These are the proportional, integral, and differential coefficients, respectively. For temperature gradient.

[0120] It is important to note that this implementation introduces a stress relaxation mechanism, which allows the plastic molecular chains to rearrange and relax their orientation, thereby effectively releasing some of the internal stress accumulated during the filling and holding stages. Specifically, after the holding pressure is released, a delay time is set, during which the mold temperature is maintained at a relatively high level, providing a relatively mild thermodynamic window for the plastic molecular chains to rearrange and relax their orientation, thereby effectively releasing some of the internal stress accumulated during the filling and holding stages.

[0121] Furthermore, the embedded area of ​​the conductive base 101 is designed as a multi-level groove, and the groove distribution density satisfies a functional relationship with the preheating temperature; the surface of the metal pin 102 is knurled, and the bonding force is enhanced through cleaning and coating processes.

[0122] This embodiment fundamentally enhances the mechanical locking force between the metal inlay 1 and the plastic substrate through the synergistic effect of micro-geometric structure design and surface treatment process, thereby overcoming the problem of insufficient bonding force caused by the difference in thermal expansion coefficient of materials.

[0123] Specifically, multi-level grooves are set in the contact area between the conductive base 101 and the injection body 2, and the melt flow behavior is controlled by specific geometric parameters to ensure that the injection body 2 has sufficient fluidity to fill the grooves at the preset preheating temperature, while avoiding local stress concentration caused by excessively deep grooves.

[0124] The functional relationship between the groove distribution density and the preheating temperature is as follows:

[0125]

[0126] Where C is the flow channel correction coefficient calibrated by melt rheology experiments; Preheating temperature for metal inlay 1; This refers to the base temperature of the mold. The length of the flow path of the melt in the region of metal insert 1.

[0127] Higher preheating temperatures reduce melt viscosity, allowing the melt to penetrate more easily into high-density groove structures; while longer flow paths require lower groove density to avoid excessive flow resistance; through the above functional relationship, the system can dynamically adjust the groove layout to achieve optimal micro-filling effect of the melt under specific temperature-pressure conditions.

[0128] Furthermore, a higher pulse pressure and a lower frequency are used for the conductive base 101, and a lower pulse pressure and a higher frequency are used for the metal pin 102; at the same time, the location of the weld line is predicted by mold flow analysis, and a heating device is added in this area to instantly increase the temperature at the junction point, so as to improve the weld line strength.

[0129] This embodiment precisely matches the dynamic pressure control during the injection molding process with the physical properties and melt flow behavior of the metal insert 1 to solve microscopic interface problems such as uneven melt filling and insufficient weld line strength caused by differences in the size and shape of the metal insert 1.

[0130] Specifically, for metal parts like the conductive base 101, which are large in size and have high heat capacity, the surrounding melt flow path is long and the cooling rate is fast, making it easy to form obvious weld lines and insufficient filling. Therefore, a higher pulse pressure amplitude and a lower pulse frequency are required. The pressure amplitude is preferably 1.5 to 1.8 times the base injection pressure, and the pulse frequency is preferably 5 to 8 Hz. The higher pressure can overcome the flow resistance of the melt when it flows through the surface of the large-sized metal insert 1, ensuring that the melt fully penetrates the micro-groove structure on the surface of the metal insert 1. The lower frequency pulse can provide sufficient relaxation time for the melt, avoiding molecular chain breakage or local scorching due to excessive shearing.

[0131] For small metal parts like the metal pin 102, which have low heat capacity and large specific surface area, the temperature drop is drastic during the molten encapsulation process, which can easily lead to a decrease in interfacial bonding force. Therefore, a relatively low pulse pressure and a high pulse frequency should be used. The pulse pressure should be 1.3 to 1.5 times the base injection pressure, and the pulse frequency should preferably be 8 to 10 Hz. The higher frequency pulse can continuously disturb the melt, enhance the diffusion ability of the molecular chain, and at the same time avoid the risk of displacement of small metal parts caused by excessive static pressure.

[0132] When implementing pressure control, the dynamic distribution of the melt flow front, temperature field changes, and predicted location of weld lines can be obtained through simulation using mold flow analysis software. Based on the simulation results, a micro heating device, such as an induction coil or ceramic heating plate, can be embedded inside the mold in the area where the weld line is expected to form. This heating device can be activated instantaneously during the melt merging stage, raising the melt temperature in the merging area by 15 to 25 degrees Celsius within 0.1 to 0.5 seconds. This reduces melt viscosity, extends the mobility of molecular chains, and promotes the mutual diffusion and entanglement of molecules at the interface of the two melts, thereby enhancing the mechanical properties of the weld line.

[0133] It is important to note that the expected weld line formation area is the part where the front edges of the two melt flows finally converge.

[0134] It is important to note that the simulation requires setting the PVT (pressure-volume-temperature) parameters of the plastic material, the rheological curve, and the cooling circuit layout of the mold to ensure the reliability of the prediction results.

[0135] It should be noted that in this embodiment, the pulse pressure and local heating are executed synchronously. The pulse pressure is triggered when the melt flow front reaches the confluence point, and local heating is started at the same time. This allows the melt to withstand high pressure at a low viscosity, effectively eliminating air gaps at the interface, and forcing the melt to better adhere to the surface of the metal inlay 1, thereby forming stronger mechanical interlocking and physical adsorption at the microscopic level. The parameters of the entire control process are all pre-calculated and set based on the rheological properties of the material and the geometric features of the metal inlay 1 through the aforementioned simulation software, and can be finely adjusted through closed-loop feedback by the pressure-temperature sensor installed on the mold to ensure the stability and repeatability of the process.

[0136] The parameters of the control process include pulse pressure amplitude, frequency, heating temperature, and duration.

[0137] Furthermore, the cooling stress management in the S300 stage also includes a stress relaxation mechanism, which dynamically adjusts the temperature of the high-temperature circuit cooling medium to match the plastic shrinkage curve by real-time monitoring of the temperature gradient around the metal inlay 1; at the same time, the optimal delayed cooling time is calculated based on the material thermal performance parameters.

[0138] Specifically, multiple temperature sensors are embedded in the periphery of the metal inlay 1 (including the conductive base 101 and the metal pin 102) in the mold cavity. The temperature sensors are radially distributed around the metal inlay to measure the temperature at each point in real time and calculate the radial temperature gradient. This directly reflects the degree of uneven cooling between the metal insert 1 and the injection molded body 2. When the threshold is exceeded, it indicates that local thermal stress is accumulating and a control response needs to be triggered immediately.

[0139] Temperature gradient The calculation formula is:

[0140]

[0141] in, The temperature of the outer region of the metal inlay 1, d represents the temperature of the plastic layer that is in close contact with the surface of the metal inlay 1, and d represents the distance between the temperature measuring points.

[0142] Based on real-time temperature gradient data, the system dynamically adjusts the temperature of the cooling medium in the high-temperature circuit to track the shrinkage curve of the plastic. The shrinkage behavior of the plastic can be described by its PVT relationship, where the rate of change of specific volume v(T) during the cooling stage, dv / dT, determines the shrinkage rate. The adjustment objective of the ideal cooling medium temperature T_cool is to minimize the deviation between the actual temperature field and the ideal shrinkage curve, and its control law can be expressed as:

[0143]

[0144] in, Set the temperature based on the baseline; , , For the proportional, integral, and derivative coefficients of the PID controller, This is the target gradient tolerance.

[0145] The control algorithm is executed by an embedded processor, and the output signal adjusts the heating power of the high-temperature oil temperature controller or the opening of the three-way valve to synchronize the temperature change of the cooling medium with the phase change point of the plastic. For example, when ΔT_g rises sharply, the controller will instantaneously increase the medium temperature by 2-5°C to slow down the curing speed around the metal inlay 1, thereby balancing the overall shrinkage.

[0146] At the same time, the settling time from the end of the pressure holding period to the start of forced cooling is calculated using the material's thermal performance parameters; this is the optimal delayed cooling time.

[0147] The formula for calculating the optimal delayed cooldown time is:

[0148]

[0149] in, The viscosity of injection molded part 2 at its softening point temperature; For cavity volume, The heat transfer coefficient at the metal-plastic interface is . Let be the surface area of ​​the metal inlay, and C be the shape correction factor determined experimentally. and These are the coefficients of thermal expansion of the metal inlay and the shrinkage rate of the plastic, respectively. denoted as , where is the melt flow path length and 'a' is the thermal diffusivity of the plastic.

[0150] It is important to note that The stress relaxation timescale, viscosity η, and volume of the melt under constraint are described. The larger the value, the longer the relaxation time required; the interfacial heat transfer coefficient and surface area The larger the size, the faster the heat is lost. The corresponding shortening; and This quantifies the cumulative strain effect caused by differences in material shrinkage, and the path... The longer the delay, the slower the heat diffusion, and the longer the delay needs to be to allow strain release; through multi-parameter closed-loop control, it is ensured that the plastic body is always in a low stress state during the curing process.

[0151] Furthermore, a collaborative mechanism prioritizing cavity pressure feedback is established. When the cavity pressure sensor detects that the pressure deviates from the ideal curve by more than the predetermined tolerance, the mold temperature system is automatically triggered to adjust, and the pulse pressure frequency is optimized simultaneously.

[0152] This embodiment establishes a decision-making mechanism with cavity pressure feedback as the highest priority, realizing deep linkage and real-time interlocking between the injection molding dynamic filling stage (S200) and the cooling stress management stage (S300), ensuring that the thermodynamic behavior of the metal insert 1 and the plastic body at the bonding interface is always in the optimal trajectory, thereby systematically solving the problem of insufficient internal stress and bonding force.

[0153] Specifically, pressure sensors are embedded in key locations within the mold cavity, particularly around the metal insert 1 (conductive seat 101 and metal pin 102) and in the expected weld line formation area, to capture in real time the subtle changes in melt pressure within the cavity during injection, holding, and initial cooling phases. Meanwhile, temperature sensors are placed at the inlet and outlet of the mold cooling circuit and at specific points on the mold surface to monitor the temperature field distribution in real time. The sensor data is transmitted to the central controller via a high-speed bus. The controller has a built-in collaborative control algorithm, and its output signal directly controls the servo injection system, pressure holding valve, and mold temperature control unit of the injection molding machine.

[0154] In this embodiment, cavity pressure is the most direct macroscopic manifestation of all thermodynamic and rheological behaviors, such as melt filling, compression, and cooling contraction. Therefore, cavity pressure feedback is set as the highest priority. An ideal cavity pressure-time curve is preset based on the material's PVT properties, the structure of the metal inlay 1, and the target product quality requirements. As a benchmark, the curve includes a rapid rise segment, a plateau holding segment, and an exponential decay segment, which are compared with actual monitored pressure in real time. and When the absolute value of the deviation exceeds the preset tolerance range, it is considered that the trigger condition is met, and the collaborative mechanism is immediately activated.

[0155] Once the coordination mechanism is activated, the system will perform cross-stage linkage adjustments, that is, when the pressure holding stage is detected... If the rate of decrease is faster than the ideal curve, it indicates that the melt is cooling and shrinking too quickly, which may lead to insufficient shrinkage compensation and the formation of shrinkage marks or a decrease in interfacial bonding force. At this time, the system automatically triggers the adjustment of the mold temperature system. That is, the central controller sends a command to the mold temperature controller in the high temperature circuit of the mold to moderately increase the medium temperature in this area. The purpose is to slow down the cooling and solidification rate of the melt around the metal insert 1, create a longer time window for the effective transmission of the holding pressure, and allow the pressure to act more fully on the compensation shrinkage.

[0156] At the same time, the system will simultaneously optimize the pulse pressure frequency. That is, if the pressure fluctuation amplitude is found to be less than expected or the attenuation is abnormal during the pulse holding period in stage S200, the controller will dynamically adjust the pulse pressure frequency. For example, for large metal parts such as conductive base 101, if the interface bonding pressure is insufficient, the pulse frequency may be appropriately reduced and the action time of a single pulse may be extended to ensure that the melt can penetrate more fully into the micro-grooves on the surface of the metal insert 1. For small metal parts such as metal pin 102, if the weld line strength is to be improved, the pulse frequency may be increased to promote the entanglement and diffusion of molecular chains through more frequent pressure disturbances.

[0157] Furthermore, this method also includes S400, which collects the bonding force index in real time through a sensor network. If the index is lower than a set threshold, the system automatically adjusts the pulse pressure curve and cooling rate until the index reaches the optimization target.

[0158] Specifically, inside the mold cavity, especially in the surrounding area of ​​the metal insert 1 (including the conductive seat 101 and the metal pin 102), the end of the melt flow path, and the area where the expected weld line is formed, various types of micro sensors are embedded and transmit real-time data to the central processing unit via a high-speed bus.

[0159] Binding force index The calculation of this is the core algorithm of this stage. It is defined as a function of interfacial bonding strength, residual stress, and effective bonding area, and the formula is:

[0160]

[0161] in, Indicates the bonding strength at the metal-plastic interface; This is residual stress; To determine the effective bonding area, the depth of melt penetration into the surface microstructure of metal inlay 1 under pulse pressure was analyzed. The nominal combined area; The process synergy efficiency factor reflects the degree of matching between temperature and pressure parameters and is calculated from the deviation between actual sensor data and the ideal PVT curve.

[0162] The bonding strength index is updated in real time and compared with a preset threshold. When the system detects that the bonding strength index is continuously lower than the threshold, an adaptive adjustment mechanism is automatically triggered.

[0163] For the pulse pressure curve, the system according to deviation size The pressure parameters during the pressure holding stage are dynamically adjusted.

[0164]

[0165] Specifically, the new pulse pressure amplitude is calculated using a PID algorithm:

[0166]

[0167] in, , , These are control coefficients that are tuned for a specific injection molding machine model.

[0168] Meanwhile, the pulse frequency is adjusted using the following formula:

[0169]

[0170] in, The material sensitivity coefficient is determined by PVT experiments.

[0171] To adjust the cooling rate, the cooling medium flow rate Q_cool is controlled by a mold temperature controller to coordinate with the corrected pulse pressure, for example:

[0172]

[0173] in, This is a heat transfer correction factor to ensure that cooling contraction and pressure compensation are synchronized and matched.

[0174] Furthermore, the vacuum valve is activated within a predetermined time after the injection begins, and the exhaust time is linked to the pulse pressure amplitude. When the pulse pressure is high, the vacuum level is increased to ensure that the trapped air on the back of the metal insert 1 is completely removed.

[0175] Specifically, when the molten flow front is about to reach but has not yet completely covered the complex cavity structure on the back of the metal inlay 1, the vacuum system is activated in advance to remove most of the air in the cavity area in advance, making room for the subsequent filling of high-pressure molten material and creating a negative pressure environment.

[0176] It is important to note that higher pulse pressure causes the melt to rush towards and compress the back area of ​​the metal insert 1 with greater kinetic energy and faster speed. If there is still residual gas in this area, the instantaneous temperature rise of the compressed gas will be more significant, making it easier for the material to scorch. Therefore, when the preset or real-time calculated Ppulse is higher, the corresponding exhaust time will also be automatically extended. By extending the exhaust time, the vacuum system has more time to completely extract any trace amounts of residual gas that may be trapped by the melt before extreme pressure conditions arrive. Conversely, when the pulse pressure is set lower, the exhaust time can be shortened accordingly to optimize the production cycle.

[0177] Furthermore, the method employs a digital twin model for real-time simulation, automatically switching to a backup parameter set when the deviation exceeds the limit by comparing actual sensor data with virtual data.

[0178] Specifically, by constructing a virtual simulation system that is highly synchronized with the physical injection molding process, and based on real-time data interaction and dynamic decision-making mechanisms, the production process can be adaptively optimized and kept safe and controllable under fluctuating environments.

[0179] Specifically, the establishment of a digital twin model is first based on the physical characteristics of the injection molding system. It is then transformed into a high-precision virtual model using 3D modeling software and embedded with a physics engine to simulate melt flow, cooling shrinkage, and stress distribution behavior.

[0180] The physical properties include the geometric parameters of the mold cavity, the thermodynamic properties of the metal insert 1, the rheological curve of the plastic material, and the working logic of the injection molding machine.

[0181] During the real-time simulation, the actual sensor data of the pressure sensor deployed in the mold cavity and the thermocouples around the metal inlay 1 are transmitted to the central processor via the bus and are synchronously compared with the predicted cavity pressure curve and temperature field distribution generated by the digital twin model.

[0182] Deviation calculation uses normalized root mean square error As an evaluation indicator, its formula is:

[0183]

[0184] in and These represent the actual and virtual data sequences, respectively, and represent the upper limit temperature within the temperature variation range. Represents the lower limit temperature within the range of temperature variation, when When the value exceeds the preset threshold, the system first diagnoses the source of the deviation. If the deviation continues to exceed the threshold for a predetermined time, the system automatically calls the backup parameter set from the encrypted parameter library.

[0185] The backup parameter set contains process combinations optimized for different abnormal scenarios. For example, in the case of increased melt viscosity, the backup set may include higher injection speeds and adjusted pulse pressure frequencies.

[0186] Real-time simulation of digital twin models not only serves deviation correction, but also uses historical data to machine learn and predict potential process drift, optimizing parameter sets in advance. For example, the system can train a model based on accumulated production data to predict the heat exchange efficiency changes of a specific metal inlay 1 under different ambient humidity, thereby dynamically adjusting the cooling circuit temperature setpoint and achieving proactive control.

[0187] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

[0188] Although embodiments of the invention have been shown and described, those skilled in the art will recognize that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A lamp holder connection piece forming device comprising a metal inlay (1), characterized in that, It also includes a lower mold assembly (3); the lower mold assembly (3) includes a lower mold body (301), the lower mold body (301) is provided with an array of placement grooves (302), the middle of the placement grooves (302) is provided with a positioning block (303), the positioning block (303) is used to position the metal insert (1); The side of the mounting groove (302) is provided with an array of grooves, and the grooves are provided with a first movable body (304) that can move axially. The side of the first movable body (304) facing the positioning block (303) is provided with a stop groove (305), and the stop groove (305) is used to limit the workpiece after injection molding. It also includes an upper mold assembly (4), which includes an upper mold body (401). The upper mold body (401) is provided with an array of molding blocks (402). The bottom of the molding blocks (402) is provided with positioning posts (404). When the upper mold body (401) and the lower mold body (301) are closed, the positioning posts (404) abut against the metal insert (1). The interior of the molding block (402) is provided with a socket molding cavity (403) and a pin fitting groove. The outer side of the molding block (402) is provided with a second movable body (405). The second movable body (405) can move toward the central area of ​​the molding block (402). After the two movable bodies (405) come into contact with the molding block (402), the side of the second movable body (405) facing the molding block (402) will form an undercut molding cavity (406) with the molding block (402); the side of the molding block (402) facing the second movable body (405) is provided with an abutment surface (407); the bottom of the second movable body (405) is provided with a movable column (408), which can extend and retract within the second movable body (405). When the movable column (408) is in the extended state, the end of the movable column (408) away from the second movable body (405) abuts against the metal insert (1).

2. A forming method for producing lamp holder connectors using the lamp holder connector forming apparatus according to claim 1, characterized in that, The molding method includes the following steps: S100. Differential preheating is performed on the split metal insert (1), and the preheating temperature is calculated according to the difference between its thermal expansion rate and plastic shrinkage rate. S200. When the metal insert (1) is encapsulated by injection molding, a multi-stage pressure-speed synergy strategy is adopted. First, high-speed injection is used to make the melt quickly surround the microstructure of the insert surface. Pulse pressure is applied in the melt confluence area. At the same time, the cavity pressure is monitored in real time by the cavity pressure sensor and the holding pressure is adjusted so that it tracks the ideal decay curve. During this stage, the mold vacuum valve is started to remove trapped air and avoid weld line defects. S300: During the injection molding cooling stage, a dual-circuit cooling system is adopted. High-temperature slow cooling is used in the area around the insert, while low-temperature rapid cooling is used in the plastic body area to control the difference in cooling rates. After the holding pressure is completed, the cooling time is delayed. During this period, the mold temperature is maintained at a high level to reduce the residual stress of the plastic. The flow rate of the cooling medium is dynamically adjusted by the controller to ensure that the temperature gradient does not exceed the set threshold.

3. The molding method according to claim 2, characterized in that, High pulse pressure and low frequency are used for the conductive base (101), and low pulse pressure and high frequency are used for the metal pin (102). At the same time, the location of the weld line is predicted by mold flow analysis, and a heating device is added to the weld line area to instantly raise the temperature at the junction point in order to improve the weld line strength.

4. The molding method according to claim 2, characterized in that, The S300 stage also includes a stress relaxation mechanism, which dynamically adjusts the temperature of the high-temperature circuit cooling medium to match the plastic shrinkage curve by real-time monitoring of the temperature gradient around the inlay; at the same time, it calculates the optimal delayed cooling time based on the material's thermal performance parameters.

5. The molding method according to claim 2, characterized in that, A collaborative mechanism prioritizing cavity pressure feedback is established. When the cavity pressure sensor detects that the pressure deviates from the ideal curve by more than the predetermined tolerance, the mold temperature system is automatically triggered to adjust, and the pulse pressure frequency is optimized simultaneously.

6. The molding method according to claim 2, characterized in that, It also includes S400: it collects the bonding force index in real time through a sensor network. If the index is lower than the set threshold, the system automatically adjusts the pulse pressure curve and cooling rate until the index reaches the optimization target.

7. The molding method according to claim 2, characterized in that, The vacuum valve activates within a predetermined time after injection begins. The venting time is linked to the pulse pressure amplitude. When the pulse pressure is high, the vacuum level is increased to ensure that trapped air on the back of the inlay is completely removed.

8. The molding method according to claim 2, characterized in that, The method uses a digital twin model for real-time simulation: by comparing actual sensor data with virtual data, it automatically switches to a backup parameter set when the deviation exceeds the limit.

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