Resin sealing device and resin sealing method

Abstract

The present invention addresses the problem of providing a resin sealing device and a resin sealing method capable of reliably releasing a workpiece on which a vertical terminal is mounted during mold opening. As a solution, the present invention is provided with a film supply mechanism (211) for supplying a film (F) to be adsorbed to a mold surface (204a) of a first mold (204), a second mold (206) having a workpiece holding part (205) for holding a workpiece (W), the first mold (204) having: an insertion hole (406) through which a vertical terminal (Wc) is inserted from a first end part (406a) facing the workpiece holding part (205); and an ejector pin (230) which is inserted from a second end portion (406b) of the insertion hole (406) and can move in the mold opening and closing direction in the insertion hole (406), when the mold is closed, the ejector pin (230) is withdrawn so that the vertical terminal (Wc) can be inserted into the insertion hole (406), and when the mold is opened, the ejector pin (230) pushes the vertical terminal (Wc) so that the molded article (Wp) is released from the first mold (204).

Description

Technical Field

[0001] This invention relates to a resin sealing device and a resin sealing method. Background Technology

[0002] As an example of a resin sealing device and resin sealing method that seals a workpiece with electronic components mounted on a substrate by means of a sealing resin (hereinafter, sometimes simply referred to as "resin") to form a molded article, there are known examples of those using a transfer molding method.

[0003] The transfer molding method is as follows: a can is provided to supply a predetermined amount of resin to a pair of sealing areas (mold cavities) of a sealing mold consisting of an upper mold and a lower mold; workpieces are respectively arranged at positions corresponding to each sealing area; and resin sealing is performed by clamping the workpieces with the upper mold and the lower mold and injecting resin from the can into the mold cavity (see Patent Document 1: Japanese Patent Application Publication No. 2015-000520).

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2015-000520 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] One method for molding workpieces with exposed vertical terminals (electrical terminals that are vertically erected from a substrate or electronic component) used in power devices is by casting liquid resin. However, since no pressure is applied within the mold, it is difficult to maintain a consistent molded shape of the sealing resin. Furthermore, voids are easily generated, resulting in low reliability of the molded product. In contrast, another method involves clamping the vertical terminals around them and molding the resin while the vertical terminals are exposed. However, if resin burrs are generated around the vertical terminals, narrowing the gap between the vertical terminals and the surrounding clamping members, the molded product becomes difficult to demold.

[0009] Technical means to solve the problem

[0010] The present invention was made in view of the above circumstances, and its object is to provide a resin sealing device and resin sealing method that enables a workpiece equipped with a vertical terminal to be reliably demolded during mold opening.

[0011] The present invention solves the aforementioned problem through a solution described below as one embodiment.

[0012] One embodiment of the resin sealing device uses a sealing mold and a sealing resin to seal a workpiece having a structure with vertically erected terminals to process it into a molded article. The sealing mold has a first mold and a second mold, one of which is an upper mold and the other is a lower mold. The essential condition of the resin sealing device is that it is configured to include a film supply mechanism that supplies a release film to be adsorbed to the mold surface of the first mold, and the second mold has a workpiece holding portion for holding the workpiece. The first mold has an insertion hole for the vertical terminals to be inserted from a first end opposite to the workpiece holding portion; and an ejector pin that is inserted from a second end of the insertion hole and is movable in the mold opening and closing direction within the insertion hole. When the sealing mold is closed, the ejector pin is retracted so that the vertical terminals can be inserted into the insertion hole. When the sealing mold is opened, the ejector pin pushes the vertical terminals to demold the molded article from the first mold.

[0013] According to the described embodiment, the workpiece equipped with the vertical terminal can be reliably demolded during mold opening.

[0014] Alternatively, preferably, the first mold has a plurality of suction holes around the insertion hole, the plurality of suction holes suctioning and stretching the release film.

[0015] Alternatively, it is preferable that when the sealing mold is closed, the vertical terminal penetrates the release film to form a film through hole, and is simultaneously inserted into the insertion hole, and the release film around the film through hole is pulled into the gap between the insertion hole and the vertical terminal, thereby sealing the gap.

[0016] Alternatively, preferably, the insertion hole is formed in the sleeve member, and the sleeve member is fitted into the fitting hole provided at a predetermined position in the first mold.

[0017] Alternatively, preferably, in the sleeve member, the first end of the insertion hole is formed as a tapered surface that gradually expands in diameter toward the workpiece holding portion.

[0018] In addition, preferably, the suction hole is provided at least at two locations opposite each other, separated by the fitting hole, when viewed from above.

[0019] Another embodiment of the resin sealing method uses a sealing mold and a sealing resin to seal a workpiece having a structure with vertically erected vertical terminals to process it into a molded article. The sealing mold has a first mold and a second mold, one of which is an upper mold and the other is a lower mold. The resin sealing method is necessary in that it includes: a film supply step, supplying a release film to the mold surface of the first mold and adsorbing the release film; a workpiece / sealing resin placement step, holding the workpiece and the sealing resin in the second mold; a mold closing step, closing the sealing mold; and a mold opening step, opening the sealing mold. The mold closing step includes a step of inserting the vertical terminals into an insertion hole in the first mold, and the mold opening step includes a step of pushing the vertical terminals with an ejector pin that can move in the insertion hole along the mold opening and closing direction, thereby demolding the molded article from the first mold.

[0020] Alternatively, preferably, the mold closing process includes the following steps: the vertical terminal passes through the release film to form a film through hole, and is simultaneously inserted into the through hole, and the release film around the film through hole is pulled into the gap between the through hole and the vertical terminal, thereby sealing the gap.

[0021] The effects of the invention

[0022] According to the present invention, a resin sealing device and a resin sealing method are provided, which enable a workpiece equipped with a vertical terminal to be reliably demolded during mold opening. Attached Figure Description

[0023] [ Figure 1 ] Figure 1 This is a plan view illustrating an example of a resin sealing device according to an embodiment of the present invention.

[0024] [ Figure 2 ] Figure 2 This is a side view showing an example of a pressing device of a resin sealing apparatus according to an embodiment of the present invention.

[0025] [ Figure 3 ] Figure 3 This is a front cross-sectional view showing an example of a sealing mold for a resin sealing device according to an embodiment of the present invention.

[0026] [ Figure 4 ] Figure 4 This is a front cross-sectional view showing an example of the chamber of the sealing mold and the workpiece holding part of the resin sealing device according to an embodiment of the present invention.

[0027] [ Figure 5 ] Figure 5 A is Figure 4 An enlarged view of the V section. Figure 5B is a plan view showing examples of fitting holes, through holes, and suction holes.

[0028] [ Figure 6 ] Figure 6 This is an explanatory diagram of the resin sealing method according to an embodiment of the present invention.

[0029] [ Figure 7 ] Figure 7 It is a continuation Figure 6 Explanatory diagram.

[0030] [ Figure 8 ] Figure 8 yes Figure 7 Enlarged view of section VIII.

[0031] [ Figure 9 ] Figure 9 It is a continuation Figure 7 Explanatory diagram.

[0032] [ Figure 10 ] Figure 10 yes Figure 9 An enlarged view of the X-section.

[0033] [ Figure 11 ] Figure 11 It is a continuation Figure 9 Explanatory diagram.

[0034] [ Figure 12 ] Figure 12 yes Figure 11 Enlarged view of section XII.

[0035] [ Figure 13 ] Figure 13 It is a continuation Figure 11 Explanatory diagram.

[0036] [ Figure 14 ] Figure 14 A is a perspective view showing an example of a workpiece used in a resin sealing device and resin sealing method according to an embodiment of the present invention. Figure 14 B is a perspective view showing an example of a molded article formed in a resin sealing device and resin sealing method according to an embodiment of the present invention. Detailed Implementation

[0037] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Figure 1 This is a plan view (schematic view) showing an example of the resin sealing device 1 according to this embodiment. Furthermore, for ease of explanation, arrows are used in the figure to indicate the left-right direction (X direction), front-back direction (Y direction), and up-down direction (Z direction) of the resin sealing device 1. Additionally, in all the figures used to explain each embodiment, components with the same function are sometimes labeled with the same symbol, and repeated descriptions are omitted.

[0038] The resin sealing device 1 of this embodiment is a device for sealing a workpiece (molded article) W with resin using a sealing mold 202 comprising a first mold (upper mold in this embodiment) 204 and a second mold (lower mold in this embodiment) 206. Hereinafter, as an example of the resin sealing device 1, a resin sealing device using a transfer molding method will be described. This resin sealing device holds the workpiece W using a workpiece holding portion 205 provided in the second mold 206, covers the mold cavity 208 (including a portion of the mold surface 204a) of the first mold 204 with a release film (hereinafter sometimes simply referred to as "film") F, performs a clamping action between the first mold 204 and the second mold 206, and seals the workpiece W with sealing resin R. Furthermore, in this embodiment, a structure will be described as follows: two mold cavities 208 are provided in one first mold 204, and two workpieces W are arranged in one second mold 206 and resin sealed together to obtain a molded article Wp. However, this is not a limitation; multiple sets of the above structures (not shown) may be arranged side by side.

[0039] First, such as Figure 14 As shown in Figure A, the workpiece W, which is to be sealed, includes a structure in which electronic components Wb and vertical terminals Wc are disposed on a substrate Wa (or a structure in which vertical terminals Wc are disposed on electronic components Wb). The number of electronic components Wb disposed on a substrate Wa is set to one or more (e.g., in a matrix shape), and the number of vertical terminals Wc disposed on a workpiece W is set to one or more (six in this embodiment).

[0040] Examples of substrates Wa include: resin substrates, ceramic substrates, metal substrates, transport plates, lead frames, wafers, and other plate-shaped components. The shape of substrate Wa can be rectangular (strip-shaped), square, circular, etc. Examples of electronic components Wb include: semiconductor chips, microelectromechanical system (MEMS) chips, passive components, heat sinks, conductive components, spacers, etc. Examples of vertical terminals Wc include pin terminals (lead pins). The shape of vertical terminals Wc can be cylindrical, prismatic, or wire-like.

[0041] Examples of methods for mounting (or attaching) electronic components Wb on a substrate Wa include wire bonding mounting, flip chip mounting, and other methods. Alternatively, in cases where the substrate (glass or metal carrier plate) Wa is peeled off from the molded article Wp after resin sealing, methods can be used to attach the electronic components using heat-removable adhesive tape or UV-curable resin that hardens under ultraviolet light.

[0042] In this embodiment, the sealing resin R can be a sheet-shaped (e.g., cylindrical) thermosetting resin (e.g., an epoxy resin containing fillers, but not limited thereto). Furthermore, the sealing resin R is not limited to the aforementioned state; it can also be a shape other than cylindrical, or a resin other than an epoxy thermosetting resin.

[0043] In addition, as an example of membrane F, membrane materials with excellent heat resistance, ease of peeling, flexibility, and stretchability can be preferred, such as polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene (ETFE) (polytetrafluoroethylene polymer), polyethylene terephthalate (PET), fluorinated ethylene propylene (FEP), fluorinated glass cloth, polypropylene, polyvinylidene chloride, etc.

[0044] Next, a general overview of the resin sealing device 1 of this embodiment will be described. For example... Figure 1 As shown, the resin sealing device 1 includes the following main components: a supply unit 100A for supplying workpiece W and sealing resin R, a pressing unit 100B for sealing the workpiece W with the sealing resin R and processing it into a molded product Wp, and a storage unit 100C for storing the molded product Wp. As an example, along... Figure 1 In the X direction, a supply unit 100A, a pressing unit 100B, a pressing unit 100C, and a storage unit 100C are arranged sequentially. However, the structure is not limited to the above, and the equipment structure or the number of units (especially the number of pressing units), the arrangement order of the units, etc., can be changed. In addition, it can also be configured with a structure that includes units other than those described above (none of which are shown).

[0045] In addition, in the resin sealing device 1, the control unit 150 that performs the operation control of each mechanism in each unit is arranged in the supply unit 100A (or may be configured to be arranged in other units).

[0046] Furthermore, in the resin sealing device 1, the guide rail 300 is arranged in a straight line spanning between each unit. The conveying device (first loader) 302 for conveying the workpiece W and the sealing resin R, and the conveying device (second loader) 304 for conveying the molded product Wp, are arranged in a manner that allows them to move along the guide rail 300 between predetermined units. However, the structure is not limited to the above, and it may also be configured to include a common (one) conveying device (loader) for conveying the workpiece W, the sealing resin R, and the molded product Wp (not shown). In addition, the conveying device may also be configured to include a robot or the like instead of a loader.

[0047] (Supply Unit)

[0048] Next, the supply unit 100A included in the resin sealing device 1 will be described in detail.

[0049] The supply unit 100A includes a workpiece supply box 102 that holds multiple workpieces W. Here, the workpiece supply box 102 uses known stacking boxes, slot boxes, etc. The workpieces W taken from the workpiece supply box 102 are placed on the workpiece worktable 104.

[0050] Additionally, the supply unit 100A (or other unit) includes a resin supply section 112 that supplies sealing resin R at a side position on the workpiece table 104. The resin supply section 112 uses a known hopper, feeder, etc. Multiple (for example, four are given, but not limited to this, or an odd number may also be used) portions of sealing resin R supplied from the resin supply section 112 are held at a predetermined position on the resin table 114.

[0051] The workpiece W, placed on the workpiece worktable 104, and the sealing resin R, held on the resin worktable 114, are held in the first loader 302 and transported to the pressing unit 100B, whereby they are installed in a predetermined position on the sealing mold 202. In this embodiment, the workpiece W is placed in the workpiece holding part 205 of the second mold 206, and the sealing resin R is contained in the can 240 of the second mold 206 (details of the process will be described later).

[0052] As an example of the structure of the first loader 302, two rows of workpiece holding parts 302A and 302B are provided, each capable of holding one workpiece W, arranged side by side in the left-right direction. Additionally, a resin holding part 302C is provided between the two rows of workpiece holding parts 302A and 302B. This resin holding part 302C can hold multiple (for example, four, but not limited to this, or an odd number) of sealing resin R in the front-back direction. Furthermore, the workpiece holding parts 302A, 302B, and 302C can use known holding mechanisms (e.g., structures with holding claws for clamping, or structures with suction holes communicating with a suction device for adsorption, etc.) (not shown).

[0053] As a variation of the conveying device, it may also be configured to replace the first loader 302 that moves in the X and Y directions, and include a conveying device (loader) that moves in the X direction to carry out inter-unit transport, and a conveying device (loader) that moves in the Y direction to carry out loading and setting into the second mold 206 (not shown).

[0054] (Suppression unit)

[0055] Next, the pressing unit 100B included in the resin sealing device 1 will be described in detail.

[0056] The pressing unit 100B includes a sealing mold 202 having a pair of molds that can be opened and closed (e.g., a mold assembled with multiple mold blocks, mold plates, other components, etc., containing alloy tool steel). It also includes a pressing device 250 that drives the opening and closing of the sealing mold 202 to seal the workpiece W with resin. As an example, it is configured to include one pressing device 250, but it may also be configured to include multiple pressing devices 250 (not shown). Figure 2 The diagram shows a side view (schematic view) of the pressing device 250 installed on the pressing unit 100B. Figure 3 The diagram shows a front cross-sectional view (schematic view) of the sealing mold 202. Additionally, in... Figure 4 The diagram shows a front cross-sectional view (schematic view) of the cavity 208 and the workpiece holding part 205 of the sealing mold 202.

[0057] Here, as Figure 2As shown, the pressing device 250 comprises a pair of pressing plates 254 and 256, a plurality of pull rods 252 supporting the pair of pressing plates 254 and 256, and a drive device for making the pressing plate 256 movable (lifting and lowering). Specifically, the drive device comprises a drive source (e.g., an electric motor) 260 and a drive transmission mechanism (e.g., a ball screw or toggle mechanism) 262, etc. (however, it is not limited to this). In this embodiment, the pressing plate 254 on the upper side in the vertical direction is set as a fixed pressing plate (the pressing plate fixed to the pull rod 252), and the pressing plate 256 on the lower side is set as a movable pressing plate (the pressing plate that can be slidably held in place by the pull rod 252 and lifted and lowered). However, it is not limited to this, and the top and bottom sides can be reversed, that is, the upper side can be set as a movable pressing plate and the lower side as a fixed pressing plate, or both the upper and lower sides can be set as movable pressing plates (neither shown).

[0058] On the other hand, such as Figure 3 As shown, the sealing mold 202 includes a first mold 204 and a second mold 206 as a pair of molds disposed between the pair of pressure plates 254 and 256 in the pressing device 250. In this embodiment, the upper side in the vertical direction is the first mold (upper mold) 204, and the lower side is the second mold (lower mold) 206. That is, the first mold 204 is assembled on the upper pressure plate (fixed pressure plate 254 in this embodiment), and the second mold 206 is assembled on the lower pressure plate (movable pressure plate 256 in this embodiment). Mold closing / opening occurs by the first mold 204 and the second mold 206 approaching / moving away from each other (the vertical direction (up and down direction) is the mold opening and closing direction).

[0059] In addition, in this embodiment, as an example, a film supply mechanism 211 is provided to transport (supply) the roller-shaped film F into the interior of the sealing mold 202. Furthermore, regarding the film F, depending on the structure of the workpiece W, a strip-shaped film is sometimes used instead of a roller-shaped film.

[0060] Next, the second mold (lower mold) 206 of the sealing mold 202 will be described in detail. For example... Figure 3 and Figure 4 As shown, the second mold 206 includes a mold base 212, a slotted section 216, a clamping section 220, etc., and these are assembled to form the mold. As an example, the slotted section 216 is fixed on the mold base 212, and the mold base 212 is fixed on the movable pressure plate 256.

[0061] Here, in the second mold 206, multiple (for example, four are listed, but it is not limited to this, or there may be an odd number) cylindrical cans 240 for containing sealing resin R are provided along the front-to-back direction. The cans 240 are formed as through holes that are continuous with the sleeve block 216 and the clamping block 220. In addition, within the cans 240, the sealing resin R is supplied to the mold cavity 208 (described later) by pushing the plunger 242 through a known conveying mechanism (not shown).

[0062] Additionally, in the second mold 206, a workpiece holding portion 205 is provided, which holds one or more workpieces W, in a configuration surrounded by a clamping block 220 fixed to the sleeve block 216. More specifically, two workpiece holding portions 205 (first workpiece holding portion 205A and second workpiece holding portion 205B) are provided in a configuration that clamps the can 240 in the left-right direction. As an example, the workpiece holding portion 205 has a suction path (hole or groove, etc.) (not shown) communicating with a suction device. Specifically, one end of the suction path passes through the mold surface 206a of the second mold 206, and the other end is connected to a suction device disposed outside the second mold 206. Thus, the suction device can be driven to suck up the workpiece W from the suction path, and the workpiece W can be adsorbed and held on the mold surface 206a (here, the workpiece holding portion 205). It is also possible to configure it to include a holding claw that clamps the outer periphery of the workpiece W instead of the adsorption and holding mechanism, or to include a holding claw that clamps the outer periphery of the workpiece W and an adsorption and holding mechanism (not shown). Furthermore, the shape or number of workpiece holding portions 205 provided in a second mold 206 are appropriately set (one or more) according to the shape or number of workpieces W.

[0063] In addition, this embodiment includes a second mold heating mechanism (not shown) for heating the second mold 206 to a predetermined temperature. The second mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by a control unit 150. As an example, the heater is built into the mold base 212 and applies heat to the sealing resin R within the entire second mold 206 and the can 240. Heating by the heater brings the second mold 206 to a predetermined temperature (e.g., 100°C to 300°C).

[0064] Next, the first mold (upper mold) 204 of the sealing mold 202 will be described in detail. For example... Figure 3 and Figure 4As shown, the first mold 204 includes a mold base 210, a guide block 213, a sleeve block 214, a clamping block 218, etc., and these are assembled together. As an example, the periphery of the sleeve block 214 is surrounded and fixed by the guide block 213, and is supported by a plurality of support columns 228 erected on the mold base 210. In addition, the guide block 213 is fixed to the lower surface of the mold base 210, and the mold base 210 is fixed to the lower surface of the fixed pressure plate 254.

[0065] Here, a rejection pool block 244 is provided in the first mold 204. The rejection pool block 244 is fixed to the sleeve block 214 (including the component fixed to the sleeve block 214) at a position directly above the can 240 of the second mold 206 (here referring to a region of a predetermined width directly above). A rejection pool 246 and a part of a sprue 247 communicating with the rejection pool 246 are provided through the lower surface. Furthermore, a mold cavity 208 is provided that communicates with the sprue 247 and accommodates a predetermined portion of the workpiece W (the portion equipped with electronic component Wb and vertical terminal Wc). In addition, the boundary position (boundary region) between the sprue 247 and the mold cavity 208 is referred to as the gate 248.

[0066] In this embodiment, the mold cavity 208 extends through the lower surface of the mold cavity block 226, which is surrounded by a clamping block 218 fixed under the sleeve block 214. More specifically, corresponding to the positions of the two workpiece holding portions 205 (first workpiece holding portion 205A and second workpiece holding portion 205B) of the second mold 206, mold cavities 208 (first mold cavity 208A and second mold cavity 208B) are respectively provided on both sides in the left-right direction (or front-back direction) across the ejector pool block 244 when viewed from above. These workpiece holding portions 205A, workpiece holding portions 205B, and mold cavities 208A and 208B form a set of structural units that are resin-sealed by a can 240 and its corresponding ejector pool 246, sprue 247, and gate 248. In this embodiment, multiple sets of these structural units are arranged side by side in the front-back direction (or left-back direction). However, it is not limited to these structures. It can also be configured such that the workpiece holding part 205 and the mold cavity 208 are arranged on only one side of the ejector box block 244 in the left-right direction (or front-back direction) (not shown). Alternatively, it can be configured to provide only one set of the above structural units (not shown).

[0067] Suction paths (holes or grooves, etc.) communicating with a suction device are provided on the lower surface of the clamping block 218 or at the corner of the recess of the mold cavity 208 in the mold cavity block 226. This allows the membrane F supplied from the membrane supply mechanism 211 to be adsorbed and held on the mold surface 204a, which includes the inner surface of the recess of the mold cavity 208. Alternatively, a mold structure that degasses the mold cavity 208 during resin sealing by mold closing can also be used.

[0068] like Figure 5 As shown in Figure A, a fitting hole 402 is formed at a predetermined position in the mold cavity block 226. The "predetermined position" mentioned here corresponds to the position of the vertical terminal Wc of the workpiece W held by the workpiece holding portion 205 of the second mold 206. A sleeve member 404 is fitted into the fitting hole 402, and a through hole 406 is formed in the sleeve member 404. The through hole 406 serves as a clearance hole for the vertical terminal Wc to pass through (from the first end 406a facing the workpiece holding portion 205) when the mold is closed, and also serves as a passage for the ejector pin 230, which will be described later. Furthermore, if the through hole 406 is directly provided on the mold cavity block 226, the sleeve member 404 may not be necessary. Additionally, as... Figure 5 As shown in Figure B, a plurality of suction holes 408 are provided at specified intervals around the through hole 406. The suction holes 408 further suction and attach the membrane F adsorbed and held on the mold surface 204a.

[0069] The resin sealing device 1 of this embodiment is configured such that, when the sealing mold 202 is closed, the vertical terminal Wc passes through the membrane F stretched on the mold surface 204a of the first mold 204 to form a membrane through hole Fa, and simultaneously inserts into the insertion hole 406; at the same time, the membrane F around the membrane through hole Fa is pulled into the gap between the insertion hole 406 and the vertical terminal Wc, thereby sealing the gap. This prevents the sealing resin R from leaking into the gap between the vertical terminal Wc and the insertion hole 406, and also prevents the formation of resin burrs (especially resin protrusions around the vertical terminal Wc) on the molded article Wp.

[0070] Here, the sleeve member 404 can also be configured to be detachable from the fitting hole 402. Therefore, by changing the sleeve member 404 according to the type or shape of the vertical terminal Wc of the workpiece W, the diameter or inner surface shape of the insertion hole 406 can be changed. Furthermore, the cleanability of the first mold 204 in case of accidental injection can be improved.

[0071] In this embodiment, the sleeve member 404 is formed in a cylindrical shape, but it can be made into an angled cylindrical shape or other cylindrical shapes depending on the shape of the fitting hole 402. Furthermore, in the sleeve member 404, the first end 406a of the insertion hole 406 is formed as a tapered surface 404a that gradually expands towards the workpiece holding portion 205. This allows for correction of the front end offset of the vertical terminal Wc of the workpiece W with low installation position or perpendicularity accuracy during mold closing, and proper guidance from the first end 406a into the insertion hole 406. The sleeve member 404 is formed of the same material as the sealing mold 202 (e.g., alloy tool steel), but it can also be formed of other materials (e.g., resin materials).

[0072] Furthermore, when viewed from above, the suction holes 408 are provided at least at two locations opposite each other across the fitting holes 402 (in this embodiment, four locations are arranged at an angle of 90°). Therefore, since the membrane F around the insertion hole 406 can be stretched, the membrane through-hole Fa can be easily formed during mold closing. In other words, it prevents the membrane F from not being formed (preventing the membrane through-hole Fa) and from being excessively pulled into the gap between the vertical terminal Wc and the insertion hole 406. Additionally, it prevents the sealing resin R from entering the gap between the membrane through-hole Fa and the mold surface 204a through the membrane through-hole Fa during molding, and allows for reliable demolding of the membrane F and the molded article Wp during mold opening after molding.

[0073] Here, as a characteristic structure of this embodiment, the first mold 204 is provided with an ejection mechanism that ejects the molded product Wp from the first mold 204 simultaneously with mold opening. The ejection mechanism includes an ejector pin 230, an ejector pin plate 232, a support plate 234, a spring 236, a shoulder bolt 237, and a reset pin 238. As an example, one end (upper side) of the ejector pin 230 becomes the base end of the expanded diameter portion and is held by the ejector pin plate 232 and the support plate 234, while the other end (lower side) is inserted into the through hole 406 in a movable manner along the mold opening and closing direction (inserting from the second end 406b into the through hole 406). In addition, a countersunk hole is made on the ejector pin plate 232, and the external thread of the shoulder bolt 237 is screwed and fixed to the sleeve block 214. A spring 236 is inserted around the shoulder bolt 237. The spring 236 is elastic between the enlarged diameter portion of the head of the shoulder bolt 237 and the countersunk hole, so the ejector pin plate 232 always applies force in the mold closing direction (downward direction) and abuts against the sleeve block 214. In addition, the shoulder bolt 237 can replace the collar, washer and bolt. One end (upper side) of the reset pin 238 becomes the base end of the enlarged diameter portion and is fixed to the ejector pin plate 232, and the front end (lower side) inserts through the sleeve block 214 and protrudes from the mold surface 204a.

[0074] According to the ejection mechanism, during mold closing, the reset pin 238 protrudes from the mold surface 204a of the first mold 204 and abuts against the mold surface 206a of the second mold 206, pushing the ejector pin plate 232 up by a corresponding protrusion. This allows the vertical terminal Wc of the workpiece W held by the workpiece holding portion 205 of the second mold 206 to be inserted into the insertion hole 406 (first end 406a). On the other hand, during mold opening, the ejector pin 230, along with the ejector pin plate 232 and the support plate 234, moves in the mold closing direction (towards the first end 406a of the insertion hole 406) by the force applied by the spring 236. This pushes the vertical terminal Wc of the molded article Wp after resin sealing, reliably demolding the molded article Wp from the first mold 204. However, the structure where the reset pin 238 protrudes during mold opening causes a problem of the film F elongating by a corresponding protrusion. To avoid the aforementioned situation, as a variation, the lower end of the reset pin 238 may be configured to be the same as the mold surface 204a of the first mold 204. The reset pin 238 is pushed up by a push pin provided on the second mold 206 (which is pushed towards the first mold 204 side by a movable mechanism (not shown) when the mold is closed) (not shown). As a result, the ejector pin 230, along with the ejector pin plate 232 and the support plate 234, moves in the mold opening direction (towards the second end 406b of the insertion hole 406).

[0075] In addition, in this embodiment, a first mold heating mechanism (not shown) is provided to heat the first mold 204 to a predetermined temperature. The first mold heating mechanism includes a heater (e.g., an electric heating wire heater), a temperature sensor, a power supply, etc., and the heating is controlled by a control unit 150. As an example, the heater is built into the mold base 210, forming a structure that applies heat to the entire first mold 204, as well as to the molten sealing resin R filled in the mold cavity 208 and resin flow paths 246, 247, and 248. Heating by the heater brings the first mold 204 to a predetermined temperature (e.g., 100°C to 300°C).

[0076] (Storage unit)

[0077] Next, the storage unit 100C included in the resin sealing device 1 will be described in detail.

[0078] The molded article Wp (including the portion that does not require resin) formed by the pressing unit 100B is held in the second loader 304 and removed from the sealing mold 202, and then transferred to the storage unit 100C. Furthermore, the holding mechanism for the molded article Wp in the second loader 304 can use known holding mechanisms (e.g., a structure with holding claws for clamping, a structure with suction holes communicating with a suction device for adsorption, etc.) (not shown).

[0079] As a variation of the conveying device, it may also be configured to replace the second loader 304 that moves in the X and Y directions, and include a conveying device (loader) that moves in the X direction to carry out inter-unit transport, and a conveying device (loader) that moves in the Y direction to remove from the sealing mold 202 (not shown).

[0080] The storage unit 100C includes: a molding worktable 122 for holding molded parts Wp transported by a second loader 304; and a gate-removing mechanism 124 for removing unwanted resin portions from the molded parts Wp placed on the molding worktable 122. The molded parts Wp with the unwanted resin portions removed are stored in a storage box 126 containing multiple molded parts Wp. Here, the storage box 126 can be a known stacking box, slotted box, etc.

[0081] (Resin sealing action)

[0082] Next, the steps of the resin sealing method of this embodiment implemented using the resin sealing device 1 will be described. Here, an example is given where two sets of mold cavities 208 are provided in a first mold (upper mold) 204, and two workpieces W are arranged side by side in a second mold (lower mold) 206 and resin sealed together to obtain a molded product Wp. However, the structure is not limited to this, and it is also possible to arrange one workpiece W or to arrange multiple workpieces W side by side in a front-back and left-right matrix for resin sealing. Figures 6 to 13 These are explanatory diagrams of each process, and are used as a reference for... Figure 3 The diagram shows a frontal cross-section view taken in the same direction.

[0083] First, a first preparation step is performed. This first preparation step includes the following steps: A heating step (first mold heating step) is performed whereby the first mold 204 is heated to a specified temperature (e.g., 100°C to 300°C) using a first mold heating mechanism. Additionally, a heating step (second mold heating step) is performed whereby the second mold 206 is heated to a specified temperature (e.g., 100°C to 300°C) using a second mold heating mechanism. Furthermore, a film supply step is performed whereby a new film F is supplied by operating the film supply mechanism 211 and adsorbed onto a specified area of ​​the mold surface 204a, which includes the inner surface of the mold cavity 208, in the first mold 204. The film supply step includes the following steps: a film F is drawn from and stretched through a suction hole 408 provided between the inner peripheral surface of the fitting hole 402 and the outer peripheral surface of the sleeve member 404.

[0084] The second preparation step is performed before, after, or in parallel with the first preparation step. The second preparation step includes the following steps: A step is performed in which workpieces W are individually removed from the workpiece supply box 102 and placed on the upper surface of the workpiece worktable 104 using a known pusher (not shown) (or a known pick-up mechanism, etc., may be used). Additionally, a step is performed in which cylindrical tablet sealing resin R is individually removed from the resin supply section 112 using a known feeder, elevator, etc. (not shown) and multiple (four in one example) sealing resin R are held at a predetermined position on the resin worktable 114.

[0085] Following the second preparation step, a workpiece / sealing resin pick-up step is performed, where the workpiece W and sealing resin R are held on the first loader 302. Specifically, the first loader 302 is moved directly above the workpiece worktable 104. Next, the workpiece worktable 104 is raised (or the first loader 302 is lowered), and the workpiece W is held by the workpiece holding parts 302A and 302B (in this embodiment, each of the workpiece holding parts 302A and 302B holds one workpiece W). Next, the first loader 302 is moved directly above the resin worktable 114. Next, the resin worktable 114 is raised (or the first loader 302 is lowered), and the sealing resin R is held by the resin holding part 302C (in this embodiment, four sealing resins R are held by the resin holding part 302C).

[0086] After the workpiece / sealing resin pick-up process, a workpiece / sealing resin placement process is performed, in which the workpiece W and the sealing resin R are transferred into the sealing mold 202 and held at a predetermined position in the second mold 206. Specifically, a first loader 302 holding multiple (two in this embodiment) workpieces W and multiple (four in this embodiment) sealing resins R is moved into the sealing mold 202. Next, the workpieces W are respectively held (placed) in each workpiece holding part 205 (workpiece holding part 205A and workpiece holding part 205B in this embodiment) in the second mold 206, and the sealing resins R are respectively held (received) in multiple (four in this embodiment) cans 240 (see reference) in the second mold 206. Figure 6 In addition, during the transport process, a preheating process (preheating process) can be carried out by preheating the workpiece W or the sealing resin R by a heater (not shown) installed on the first loader 302.

[0087] After the workpiece / sealing resin loading process, a mold closing process is performed to close the sealing mold 202. Specifically, the drive source 260 and the drive transmission mechanism 262 are driven to move the movable pressure plate 256 upward, causing the second mold 206 to move toward the first mold 204 (i.e., upward). Here, the reset pin 238 of the first mold 204 abuts against the mold surface 206a of the second mold 206 and is pushed upward (or, in the case where the second mold 206 has an ejector pin (the aforementioned variation), the ejector pin of the second mold 206 pushes the reset pin 238 of the first mold 204), thereby causing the ejector pin 230, along with the ejector pin plate 232 and the support plate 234, to move in the mold opening direction (towards the second end 406b of the insertion hole 406). Additionally, simultaneously, the vertical terminal Wc of the workpiece W held by the workpiece holding portion 205 of the second mold 206 penetrates the film F to form a film through hole Fa, and the vertical terminal Wc is inserted into the insertion hole 406 (first end 406a) of the first mold 204 (see reference). Figure 7 and Figure 8 The movement of the second mold 206 continues until the cavity block 226, which becomes the first mold 204, comes into contact with the workpiece W (substrate Wa), thus clamping the workpiece W (see reference). Figure 9 and Figure 10 Here, the membrane F, which forms the periphery of the membrane through-hole Fa of the second mold 206, is pulled into the gap between the insertion hole 406 and the vertical terminal Wc, thereby closing the gap.

[0088] After the mold closing process, a resin sealing process is performed to seal the workpiece W with sealing resin R, thereby processing it into a molded product Wp. Specifically, the injection drive mechanism is operated to push the plunger 242 toward the first mold 204, pushing the molten sealing resin R toward the ejector pool 246 of the first mold 204, and forcing it into the mold cavity 208 through the sprue 247 and the like, which communicate with the ejector pool 246 (see reference). Figure 11 and Figure 12 Thus, the sealing resin R is thermocured, thereby completing the resin seal (transfer molding).

[0089] Following the resin sealing process, a mold opening process (including separation from the used membrane F) is performed to open the sealing mold 202. Specifically, the drive source 260 and drive transmission mechanism 262 are driven to move the movable pressure plate 256 downward, causing the second mold 206 to separate from the first mold 204. During separation, the reset pin 238 embedded in the mold surface 204a protrudes due to the force applied by the spring 236, thereby allowing the ejector pin 230 to push out the vertical terminal Wc for reliable demolding (see reference). Figure 13Alternatively, in the case where the second mold 206 has an ejector pin (as described in the modified example), during separation, the push of the reset pin 238 of the first mold 204 caused by the ejector pin of the second mold 206 is released, thereby causing the ejector pin 230, along with the ejector pin plate 232 and the support plate 234, to move in the mold-closing direction (towards the first end 406a of the insertion hole 406) by the force applied in the mold-closing direction by the spring 236, and push the vertical terminal Wc of the molded article Wp after resin sealing, thus demolding the molded article Wp from the first mold 204. The reason for providing the ejector pin is that the demolding timing can be set separately from the mold opening timing.

[0090] After the mold opening process, the following molded product removal process is performed: the molded product Wp (in this embodiment, including the sprue section, runner section, gate section, etc., which do not require resin, and two workpieces W are connected by these sections) is removed from the sealed mold 202 by the second loader 304 and moved to the molded product worktable 122. In addition, after the molded product removal process, or in parallel with it, the film supply mechanism 211 is operated to send the used film F out of the sealed mold 202 and send a new film F into and install it in the sealed mold 202.

[0091] After the molded part removal process, a gate-removing process is performed in which the gate mechanism 124 removes the resin-discarding parts, runners, and gates from the molded part Wp. Next, the molded parts Wp (with the resin-discarded parts removed) are individually moved into the receiving box 126 using a known pusher or the like (not shown). Furthermore, a post-curing process for the molded parts Wp can be performed before these processes.

[0092] The above are the main steps of the resin sealing method using resin sealing device 1. However, the order of the steps described is only one example, and the order can be changed or the steps can be performed in parallel as long as there is no hindrance.

[0093] As explained above, according to the present invention, a resin sealing device and a resin sealing method are provided, which enable a workpiece equipped with a vertical terminal to be reliably demolded during mold opening.

[0094] Furthermore, the present invention is not limited to the described embodiments, and various modifications can be made without departing from the scope of the invention. In the described embodiments, during the mold closing process of the resin sealing step, a membrane through-hole Fa is formed on the membrane F through the vertical terminal Wc of the workpiece W, but a membrane with a pre-formed membrane through-hole Fa can also be used (a mechanism for forming the membrane through-hole Fa can also be configured). Alternatively, after the membrane F is adsorbed onto the first mold 204, and before the membrane through-hole Fa is formed on the membrane F through the vertical terminal Wc, a drilling jig (not shown) can be used to form the membrane through-hole Fa on the membrane F. Thus, especially when the front end shape of the vertical terminal Wc is not a tapered shape (e.g., conical or ball-shaped), it is possible to prevent the membrane F from not being penetrated (not forming the membrane through-hole Fa), and to prevent the membrane F from being excessively pulled into the gap between the vertical terminal Wc and the through-hole 406 following the vertical terminal Wc.

[0095] Furthermore, while the above embodiments are illustrated using resin sealing devices and methods based on transfer molding, they can also be applied to resin sealing devices and methods based on compression molding.

Claims

1. A resin sealing apparatus that processes a work having a structure with a vertical terminal provided upright into a molded product by sealing resin against the work using a sealing mold having a first mold and a second mold with either one being an upper mold and the other being a lower mold, the resin sealing apparatus characterized by being configured so that: a film supply mechanism that supplies a release film to be adsorbed to a mold face of the first mold is included, the second mold has a work holding portion that holds the work, the first mold has a penetration hole through which the vertical terminal is to be inserted from a first end portion facing the work holding portion and an ejection pin that penetrates from a second end portion of the penetration hole and is movable in the mold opening and closing direction within the penetration hole, the ejection pin is retracted so that the vertical terminal can be inserted into the penetration hole when the sealing mold is closed, and the ejection pin pushes the vertical terminal to release the molded product from the first mold when the sealing mold is opened.

2. The resin sealing apparatus according to claim 1, characterized in that: the first mold has a plurality of suction holes around the penetration hole that suction and stretch the release film. configured so that: the vertical terminal forms a film penetration hole through the release film while being inserted into the penetration hole when the sealing mold is closed, and the release film of the periphery of the film penetration hole is drawn into a gap between the penetration hole and the vertical terminal, thereby closing the gap.

4. The resin sealing apparatus according to claim 3, characterized in that: the penetration hole is formed in a sleeve member, and the sleeve member is fitted into a fitting hole provided at a prescribed position of the first mold.

5. The resin sealing apparatus according to claim 4, characterized in that: the first end portion of the penetration hole is formed as a tapered surface that gradually expands in diameter toward the work holding portion in the sleeve member.

6. The resin sealing apparatus according to claim 5, characterized in that: the suction holes are provided at least at two portions opposite across the fitting hole when viewed from above.

7. A resin sealing method that processes a work having a structure with a vertical terminal provided upright into a molded product by sealing resin against the work using a sealing mold having a first mold and a second mold with either one being an upper mold and the other being a lower mold, the resin sealing method characterized by including: a film supply step of supplying a release film to a mold face of the first mold and adsorbing the release film, a work / sealing resin placement step of holding the work and the sealing resin in the second mold, a mold closing step of closing the sealing mold, and a mold opening step of opening the sealing mold, the mold closing step having a step of inserting the vertical terminal into a penetration hole of the first mold, and the mold opening step having a step of pushing the vertical terminal by an ejection pin that is movable in the mold opening and closing direction within the penetration hole, thereby releasing the molded product from the first mold.

8. The resin sealing method according to claim 7, characterized in that:

3. The resin sealing apparatus according to claim 2, wherein ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ The closing process has a process of making the vertical terminal pass through the demolding film to form a film through hole, and at the same time, the vertical terminal is inserted into the insertion hole, and the demolding film at the periphery of the film through hole is pulled into the gap between the insertion hole and the vertical terminal, so as to close the gap.

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