High-voltage digital LED with built-in IC

Abstract

The invention relates to the technical field of digital LEDs, in particular to a high-voltage digital LED with a built-in IC. A containing groove is formed in the support, a circuit board is arranged on the groove wall of the bottom of the containing groove, a control IC and three or more LED chips with the working voltage larger than or equal to 6 V are installed on the circuit board, the control IC is electrically connected with the LED chips, a plurality of baffles are arranged in the containing groove to separate the adjacent LED chips, powder dispensing grooves are formed between the adjacent baffles, and the LED chips emit light in different colors through powder dispensing. One electrode of the circuit board is connected with the anodes of all the LEDs; and all the LED chips adopt a blue light LED chip and fluorescent powder coating technology to realize target color light and at least have red, green and blue light output capabilities. Through reasonable structural design and chip technology, stable electric connection is realized, different colored light output requirements are met, and the control IC can drive the LED chips to be mixed to realize change of any color.

Description

Technical Field

[0001] This application relates to the field of digital LED technology, and in particular to a high-voltage digital LED with an integrated IC. Background Technology

[0002] Digital LEDs generally refer to LED devices used to display numerical characters, such as LED digital tubes. They use an arrangement of light-emitting diodes (LEDs) to form a specific segmented structure, and control the light emission of different segments to display numbers, letters, or simple symbols. This technology is widely used in devices such as dashboards, calculators, and electronic clocks.

[0003] Currently, most digital LED devices adopt a 5V low-voltage design. High-voltage applications (such as 48V industrial lighting) require an external DC-DC module, resulting in energy efficiency losses exceeding 20% ​​and increased PCB layout complexity. In addition, tri-color LEDs rely on independent red, green, and blue light-emitting chips, and hardware redundancy increases costs by 30%-40%, while wavelength matching is more difficult.

[0004] Therefore, the industry urgently needs a built-in IC solution that supports high-voltage direct drive, while optimizing the cost of three primary colors through integrated powder dispensing process. However, existing technologies have not yet resolved the contradiction between different voltage-resistant colors emitting light and the uniformity of light mixing. Summary of the Invention

[0005] The purpose of this application is to overcome the above-mentioned technical problems and provide a high-voltage built-in IC digital LED that can achieve high voltage and long-distance applications, with low voltage drop, good consistency, and effective cost reduction.

[0006] A high-voltage built-in IC digital LED includes a bracket with a receiving slot. A circuit board is provided on the bottom wall of the receiving slot. The circuit board is equipped with a control IC and three or more LED chips. The control IC is electrically connected to the LED chips. Several baffles are also provided in the receiving slot, which separate two adjacent LED chips. A powder dotting groove is formed between two adjacent baffles. Different colors of light are emitted by the LED chips by dotting powder in the powder dotting groove. The operating voltage of the LED chips is ≥6V.

[0007] By adopting the above technical solution, the control IC and LED chip can be electrically connected to realize the control of the LED chip without the need for external driving circuit and additional driver settings, which lowers the threshold of use and realizes plug-and-play functionality; the baffle separates adjacent LED chips, which can prevent the light emitted by the LED chips from affecting each other; different colors of light are emitted by the LED chip by applying powder in the powder dispensing groove; the LED chip's working voltage ≥6V can meet certain high voltage working requirements.

[0008] Preferably, the circuit board is a metal circuit connection layer that extends through the bottom of the baffle to the electrodes of each LED chip, forming a stable electrical connection that is not affected by the physical isolation of the baffle.

[0009] By adopting the above technical solution, the circuit board is set as a metal circuit connection layer, which extends through the bottom of the baffle to the electrodes of each LED chip, thus forming a stable electrical connection that is not affected by the physical isolation of the baffle, ensuring a stable electrical connection between the control IC and the LED chip.

[0010] Preferably, all LED chips use blue LED chips with phosphor coating technology to achieve the target color light; the LED chips have at least the ability to output red, green and blue light.

[0011] By adopting the above technical solution, the cost of blue LED chips is lower than that of other color LED chips. Combined with phosphor coating technology, white light or other colors can be emitted. It is possible to achieve the output of red, green, and blue light and other target colors of LED chips at a lower cost.

[0012] Preferably, the cross-sectional height of the baffle is greater than the cross-sectional height of the LED chip.

[0013] By adopting the above technical solution, a circuit board is set in the bracket receiving groove, and a control IC and three or more LED chips with a working voltage ≥6V are installed. The control IC is electrically connected to the LED chips. A baffle is set in the receiving groove to separate adjacent LED chips and form a powder dotting groove to achieve different colors of light emission. The cross-sectional height of the baffle is greater than the cross-sectional height of the LED chip, which can reasonably ensure that the baffle does not affect each other when adjacent LED chips emit light, and also has a cost advantage.

[0014] Preferably, the phosphor coating comprises red phosphor and green phosphor, which are respectively coated on blue LED chips in different phosphor slots to achieve red and green light output.

[0015] By adopting the above technical solution, a circuit board, a control IC, and three or more LED chips are set in the bracket receiving slot. The control IC is electrically connected to the LED chips. A baffle is set in the receiving slot to separate adjacent LED chips. Different colors of light are emitted by the LED chips by applying phosphor in the phosphor dispensing slot, and the LED chip operating voltage is ≥6V. This can realize built-in control function, reduce size, and facilitate deployment. On this basis, red phosphor and green phosphor are coated on blue LED chips in different phosphor dispensing slots respectively. The low cost of blue LED chips can be used to realize red and green light output.

[0016] Preferably, at least one dotted powder groove is coated with white phosphor so that the corresponding blue LED chip outputs white light.

[0017] By adopting the above technical solution, white phosphor is coated in at least one dot powder groove, which enables the corresponding blue LED chip to output white light. Combined with the above solution, by setting a control IC and three or more LED chips in the bracket receiving groove, and electrically connecting the control IC to the LED chips, and separating adjacent LED chips with baffles, a high-voltage built-in IC digital LED with white light output can be realized to meet more lighting and display needs. At the same time, the low cost of blue LED chips is utilized to reduce the overall cost, and the built-in control IC lowers the technical threshold and makes it more convenient to use.

[0018] Preferably, the number of LED chips is four, which output red, green, blue and white light respectively.

[0019] By adopting the above technical solution, a receiving slot is set on the bracket, and a circuit board is set on the bottom wall of the receiving slot. The circuit board is equipped with a control IC and three or more LED chips. The control IC is electrically connected to the LED chips. A baffle is set in the receiving slot to separate adjacent LED chips. By applying powder in the powder dispensing slot, the LED chips can emit light of different colors and the LED chip operating voltage is ≥6V. This allows the product to have built-in control functions, lowers the threshold for use, reduces size, and facilitates deployment. On this basis, the number of LED chips is four, and they output red, green, blue, and white light respectively, which can meet more diverse color requirements and provide richer light information.

[0020] Preferably, the control IC has a decoding function, receives external control signals, and drives the LED chip to execute a carousel, dimming, or color-changing mode.

[0021] By adopting the above technical solution, a control IC and three or more LED chips with a working voltage of ≥6V are installed on the circuit board at the bottom of the bracket's accommodating slot. The control IC is electrically connected to the LED chips. A baffle is set in the accommodating slot to separate adjacent LED chips. Powder is applied in the powder dispensing slot to enable the LED chips to emit different colors. The control IC has a decoding function, receives external control signals, and drives the LED chips to execute a carousel, dimming, or color-changing mode. This achieves intelligent control functions with low technical threshold, small size, and convenient deployment, achieving a similar effect of plug-and-play, reducing usage costs and difficulty.

[0022] Preferably, the operating voltage range of the LED chip is 6V-48V.

[0023] By adopting the above technical solution, a control IC and three or more LED chips with working voltages of 6V-48V are installed on the circuit board of the bracket receiving slot. The control IC is electrically connected to the LED chips. A baffle is set in the receiving slot to separate adjacent LED chips. Different colors of light are emitted by the LED chips by applying powder through the powder dispensing slot. This can achieve the effect of intelligent products with low technical threshold, small size and convenient deployment. At the same time, the higher working voltage helps to meet the needs of different application scenarios, and limiting the working voltage to the range of 6V-48V can ensure the stable operation of the LED chips.

[0024] In summary, this application includes at least one of the following beneficial technical effects: 1. The control IC is electrically connected to the LED chip, and the control IC has a decoding function to receive external control signals and drive the LED chip to execute the carousel, dimming or color-changing modes. No additional driver settings are required, which lowers the technical threshold and achieves a similar plug-and-play effect, making it easy to use. 2. The target color light is achieved by using blue LED chips with phosphor coating technology. Blue LED chips are low in cost, which can reduce product costs. 3. A baffle is installed in the receiving slot to separate adjacent LED chips, so as to avoid mutual interference when they are emitting light. The height of the baffle, the distance between the LED chip and the baffle, and the relevant included angle have specific parameter ranges to accurately achieve the isolation effect. 4. It can achieve high voltage and long-distance applications with low voltage drop, good consistency, and effective cost reduction. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of the high-voltage built-in IC digital LED in an embodiment of this application.

[0026] Figure 2 This is a schematic diagram of the built-in circuit of a high-voltage built-in IC digital LED according to an embodiment of this application.

[0027] Figure 3 This is a schematic diagram of the external circuit for a high-voltage built-in IC digital LED according to an embodiment of this application.

[0028] Explanation of reference numerals in the attached diagram: 1. Bracket; 2. Receiving slot; 3. Circuit board; 4. Control IC; 5. LED chip; 6. Baffle; 7. Powder dispensing slot. Detailed Implementation

[0029] The technical solutions in the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. The described embodiments are only possible technical implementations of the present invention, but are not limited thereto. Other embodiments obtained by those skilled in the art in conjunction with the embodiments of the present invention without creative effort are also within the protection scope of the present invention.

[0030] This application mainly uses a control IC, which is integrated and packaged with multiple LED chips, achieving the effects of reducing size, lowering the threshold for use, and realizing diverse light emission control. The following is a further detailed description of this application.

[0031] Example 1 Reference Figure 1 and Figure 2 and combination Figure 3 The high-voltage built-in IC digital LED provided in this application embodiment includes a bracket 1, a receiving slot 2, a circuit board 3, a control IC 4, LED chips 5, baffles 6, and a powder dispensing slot 7. The receiving slot 2 is provided on the bracket 1, and the circuit board 3 is provided on the bottom wall of the receiving slot 2. The control IC 4 and three or more LED chips 5 are installed on the circuit board 3. The control IC 4 is electrically connected to the LED chips 5. Several baffles 6 are provided in the receiving slot 2, which separate adjacent LED chips 5. A powder dispensing slot 7 is formed between two adjacent baffles 6. Different colors of light emission of LED chips 5 are achieved by dispensing powder in the powder dispensing slot 7. The operating voltage of LED chips 5 is ≥6V, which realizes the effect of diverse light emission control and prevents mutual interference of light.

[0032] Therefore, by integrating the control IC4 and multiple LED chips 5 into the receiving slot 2 of the bracket 1, the setting of external driving circuits is reduced, thereby reducing the overall size; the built-in control IC4 has a decoding function and can receive external control signals without the need for additional driver programs and connecting driving circuits, thus lowering the technical threshold for use; the control IC4 can drive the LED chips 5 to mix and achieve arbitrary color changes; the setting of the baffle 6 effectively avoids mutual interference of light from adjacent LED chips 5.

[0033] Specifically, the bracket 1 is typically made of a material with certain strength and insulation properties, such as plastic or ceramic. The function of the bracket 1 is to provide a support and fixation base for the entire encapsulation structure. Its shape can be designed according to actual needs, generally a regular shape such as square or round, to facilitate installation and use. The receiving slot 2 is formed on the bracket 1 to accommodate components such as the circuit board 3, control IC 4, LED chip 5, and baffle 6. The size and depth of the receiving slot 2 need to be rationally designed according to the dimensions of the components to be installed, to ensure that each component can be stably installed and has a suitable spatial arrangement between them.

[0034] Furthermore, circuit board 3 is a metal circuit connection layer that extends through the bottom of baffle 6 to the electrodes of each LED chip 5, forming a stable electrical connection unaffected by the physical isolation of baffle 6. Circuit board 3 is generally manufactured using printed circuit board (PCB) technology, and its material can be glass fiber reinforced epoxy resin, etc. Conductive lines are etched on circuit board 3 to realize the electrical connection between control IC 4 and LED chip 5. Circuit board 3 is mounted on the bottom wall of receiving groove 2 and is firmly connected to bracket 1 by soldering or other fixing methods.

[0035] In addition, the control IC4 is the core component for realizing the control function of the LED chip 5. It has a decoding function, receives external control signals, and drives the LED chip 5 to perform functions such as a carousel, dimming or color changing.

[0036] Correspondingly, the control IC4 is typically manufactured using integrated circuit technology, featuring small size and powerful functionality. It is electrically connected to the LED chip 5 through conductive lines on the circuit board 3, enabling precise control of the LED chip 5.

[0037] LED chips 5 are the core light-emitting components, and there are three or more of them. In this embodiment, there are four LED chips 5, which output red, green, blue, and white light respectively. All LED chips 5 use blue LED chip 5 + phosphor coating technology to achieve the target color light, and have at least the ability to output red, green, and blue light.

[0038] Correspondingly, the blue LED chip 5 has a relatively low cost, and by coating its surface with different phosphors, it can emit light of different colors. For example, the phosphor coating includes red phosphor and green phosphor, which are coated on the blue LED chip 5 in different phosphor dotting slots 7 to achieve red and green light output; at least one phosphor dotting slot 7 is coated with white phosphor, so that the corresponding blue LED chip 5 outputs white light. The LED chip 5 is mounted on the circuit board 3 and electrically connected to the control IC 4 through the circuit board 3, receiving the drive signal from the control IC 4 to emit light.

[0039] The baffle 6 is generally made of insulating material, such as plastic or ceramic. The function of the baffle 6 is to separate adjacent LED chips 5, prevent the light emitted by them from interfering with each other, and ensure that the light emitted by each LED chip 5 can be displayed independently.

[0040] The phosphor dispensing tank 7 is the space formed between two adjacent baffles 6, used for phosphor dispensing operations. Phosphor dispensing is the process of coating phosphor onto the surface of the LED chip 5. By dispensing phosphor within the phosphor dispensing tank 7, precise coating of different colors of phosphor can be achieved, thereby enabling the LED chip 5 to emit light of the desired color. The phosphor dispensing operation is typically performed using automated equipment to ensure uniformity and accuracy of coating.

[0041] The implementation principle of this embodiment is as follows: The high-voltage built-in IC digital LED integrates the control IC4 and multiple LED chips5 within the receiving slot 2 of the bracket 1, and achieves electrical connection through the circuit board 3. This reduces the need for external driving circuitry, thereby reducing the overall size. It has decoding capabilities, receives external control signals, lowers the technical barrier to use, and achieves a near-plug-and-play effect.

[0042] Meanwhile, by utilizing blue LED chip 5 + phosphor coating technology, different phosphors are coated in different phosphor slots 7, enabling LED chip 5 to emit light of various colors such as red, green, blue, and white, thus meeting diverse light emission needs. The baffle 6 effectively avoids mutual interference between the light from adjacent LED chips 5, improving the light emission quality.

[0043] Example 2 The difference between this embodiment and the previous embodiment is that the operating voltage range of the LED chip 5 is 6V-48V. This voltage range can be flexibly adjusted according to different application scenarios and requirements to achieve different luminous brightness and effects. For example, in some applications with high brightness requirements, the operating voltage of the LED chip 5 can be appropriately increased; while in some applications with low power consumption requirements, the operating voltage can be decreased.

[0044] The implementation principle of this embodiment is as follows: By setting the operating voltage range of LED chip 5 to 6V-48V, the high-voltage built-in IC digital LED can adapt to more diverse application scenarios and needs. Under different voltages, the luminous brightness and power consumption of LED chip 5 will change accordingly. Users can select the appropriate operating voltage according to actual conditions to achieve optimal luminous effect and energy utilization efficiency. Compared with existing technologies, this adjustable operating voltage range provides users with more choices, improving the product's practicality and market competitiveness.

[0045] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A high-voltage built-in IC digital LED, characterized in that, The device includes a bracket (1), on which a receiving groove (2) is provided. A circuit board (3) is provided on the bottom wall of the receiving groove (2). A control IC (4) and three or more LED chips (5) are installed on the circuit board (3). The control IC (4) is electrically connected to the LED chips (5). Several baffles (6) are also provided in the receiving groove (2). The baffles (6) separate two adjacent LED chips (5). A powder dotting groove (7) is formed between two adjacent baffles (6). Different colors of light are emitted by the LED chips (5) by dotting powder in the powder dotting groove (7). The working voltage of the LED chips (5) is ≥6V.

2. The high-voltage built-in IC digital LED according to claim 1, characterized in that, The circuit board (3) is a metal circuit connection layer that extends through the bottom of the baffle (6) to the electrodes of each LED chip (5), forming a stable electrical connection that is not affected by the physical isolation of the baffle (6).

3. A high-voltage built-in IC digital LED according to claim 1, characterized in that, All LED chips (5) use blue LED chip + phosphor coating technology to achieve the target color light; The LED chip (5) has at least the ability to output red, green and blue light.

4. A high-voltage built-in IC digital LED according to claim 1, characterized in that, The cross-sectional height of the baffle (6) is greater than the cross-sectional height of the LED chip (5).

5. A high-voltage built-in IC digital LED according to claim 1, characterized in that, The phosphor coating contains red phosphor and green phosphor, which are coated on blue LED chips in different dotted powder slots (7) to achieve red and green light output.

6. A high-voltage built-in IC digital LED according to claim 1, characterized in that, At least one dotted powder groove (7) is coated with white phosphor, so that the corresponding blue LED chip outputs white light.

7. A high-voltage built-in IC digital LED according to claim 1, characterized in that, The number of LED chips (5) is 4, which output red, green, blue and white light respectively.

8. A high-voltage built-in IC digital LED according to claim 1, characterized in that, The control IC (4) has a decoding function, accepts external control signals, and drives the LED chip (5) to execute the carousel, dimming or color-changing modes.

9. A high-voltage built-in IC digital LED according to claim 1, characterized in that, The operating voltage range of the LED chip (5) is 6V-48V.

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