An automatic inspection apparatus for a circuit board with integrated contact bump

Abstract

The present application relates to the technical field of circuit board detection, and specifically relates to an integrated contact buffer circuit board automatic detection equipment, which comprises a detection cabinet and a rotary table arranged in the detection cabinet, a plurality of placement positions are equidistantly arranged on the rotary table in a circumferential direction, and a plurality of detection toolings for detecting circuit boards in the placement positions are further arranged in the detection cabinet; the integrated contact buffer circuit board automatic detection equipment further comprises two groups of circuit board transfer toolings arranged in the detection cabinet, the two groups of circuit board transfer toolings are used for transferring to-be-detected circuit boards into the placement positions; a pressing and stabilizing mechanism is arranged, and the circuit board is pre-pressed and further pressed and limited before and after a probe contact detection point, the pre-pressing serves as protective adaptation, can eliminate the elastic warping of the circuit board, enables the detection point to enter the contactable range of the probe, provides protection for reliable electrical contact between the probe and the detection point, and improves the detection accuracy.

Description

Technical Field

[0001] This invention relates to the field of circuit board testing technology, specifically an automatic circuit board testing device with integrated contact buffer. Background Technology

[0002] During the production of printed circuit boards (PCBs), defects such as short circuits, open circuits, and poor soldering are easily caused by factors such as process fluctuations and material differences, directly affecting product performance and reliability. Therefore, full-process testing is crucial. The mainstream automated testing solution adopts probe contact testing: metallized test points are reserved at specific locations on the PCB. When the board under test is accurately positioned under the probe, the probe module moves vertically downward and makes electrical contact with the test point. The equipment applies test signals to the circuit through the probe, and collects parameters such as the continuity status, impedance value, voltage and current of the circuit in real time. These parameters are then compared with design standards, and the circuit continuity, component performance, and soldering quality are quickly determined within seconds, achieving efficient and accurate batch online testing.

[0003] However, existing testing methods still have inherent limitations: probes are usually directly driven by rigid lifting mechanisms. Due to the unavoidable movement gaps in the placement position of the circuit board under test, coupled with the objective influence of the board's own warping and deformation, the actual contact pressure between the probe and the test point is difficult to control precisely. This pressure imbalance manifests in two typical problems: when the pressure is too high, the probe tip is prone to damaging the surface plating of the test point, weakening its solderability and long-term reliability; when the pressure is too low, the electrical contact is unstable, and the contact resistance fluctuates significantly, thereby introducing testing errors or even misjudgments, directly affecting the accuracy and consistency of the test. Summary of the Invention

[0004] The purpose of this invention is to provide an automatic circuit board testing device with integrated contact buffer to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: An automatic circuit board testing device with integrated contact buffer includes a testing cabinet and a turntable inside the testing cabinet. Multiple placement positions are equidistantly arranged along the circumference of the turntable. The testing cabinet is also equipped with multiple sets of testing fixtures for testing the circuit boards in the placement positions. The integrated contact buffer circuit board automatic testing equipment also includes: Two sets of circuit board transfer fixtures are installed inside the testing cabinet. These two sets of circuit board transfer fixtures are used to transfer the circuit board to be tested into the placement position. The testing fixtures include: The first support plate is fixed inside the testing cabinet, the assembly plate is set on the first support plate and can be raised and lowered, and the two sets of testing structures are set on the assembly plate. The testing structure includes multiple probes that are movably set on the assembly plate, and each of the multiple probes is connected to a set of elastic buffer mechanisms set on the assembly plate. The two sets of pressing and stabilizing mechanisms on the assembly plate act on the non-detection point positions of the circuit board when the assembly plate moves down. After the probe makes electrical contact with the detection point, the transmission mechanism on the assembly plate is triggered, which can drive the connecting plate connected to the elastic buffer mechanism to move relative to the assembly plate.

[0006] The integrated contact buffer circuit board automatic testing equipment as described above: the elastic buffer mechanism includes a guide plate fixed to the assembly plate and a first slider and a second slider slidably disposed on the guide plate; The first slider is fixedly connected to the probe via a connector, and a buffer is connected between the first slider and the second slider.

[0007] The integrated contact buffer circuit board automatic testing equipment described above includes a column fixed to the guide plate and a second spring sleeved on the outer periphery of the column. The column passes through the first slider and the second slider. The two ends of the second spring abut against the first slider and the second slider, respectively. The first slider and the second slider are slidably connected to the column, and the second slider is fixed to the connecting plate.

[0008] The integrated contact buffer circuit board automatic testing equipment described above: the pressing and stabilizing mechanism includes a guide cylinder fixed to the assembly plate and an insulating pressure rod slidably fitted with the guide cylinder. The upper end of the insulating pressure rod is fixed with a drive column connected to the transmission mechanism. The guide cylinder is also provided with an elastic pressure member connected to the insulating pressure rod.

[0009] The integrated contact buffer circuit board automatic testing equipment as described above: the elastic pressure component includes a frustum fixed to the insulating pressure rod and slidably connected to the inner wall of the guide cylinder, and a first spring sleeved on the outer periphery of the insulating pressure rod, the two ends of the first spring being connected to the inner wall of the guide cylinder and the frustum respectively.

[0010] The integrated contact buffer circuit board automatic testing equipment described above: the transmission mechanism includes a transmission shaft rotatably mounted on the mounting plate, and the transmission shaft is connected to the connecting plate through a push-pull structure; The drive shaft has a groove on its outer wall that is adapted to the drive column. The drive column extends into the groove and is connected to the drive shaft. The groove includes a first slide groove and a second slide groove connected to each other. The first slide groove is arranged along the axial direction of the drive shaft, and the second slide groove is arranged in a spiral shape.

[0011] The integrated contact buffer circuit board automatic testing equipment described above: the push-pull structure includes a lead screw rotatably mounted on the assembly plate and a movable block slidably disposed on the assembly plate and threadedly connected to the lead screw; the lead screw is connected to the transmission shaft through a bevel gear set. The movable block is fixed with a vertical arm, and a connecting rod is provided between the vertical arm and the connecting plate. The two ends of the connecting rod are respectively hinged to the vertical arm and the connecting plate.

[0012] As described above, the integrated contact buffer circuit board automatic testing equipment has the following features: a first cylinder is mounted on the first support plate, the movable end of the first cylinder is fixed to the assembly plate, and two guide posts are fixed to the bottom of the assembly plate. The guide posts are fixed to the guide seats on the first support plate and are slidably connected to the guide seats.

[0013] The integrated contact buffer automatic circuit board testing equipment described above: the testing cabinet is further provided with a first feeding tray and a second feeding tray for conveying the circuit board to be tested, and the two sets of circuit board transfer fixtures are respectively used to transfer the circuit board to be tested in the first feeding tray and the second feeding tray to the placement position.

[0014] The integrated contact buffer circuit board automatic testing equipment described above: the circuit board transfer fixture includes a second support plate fixed inside the testing cabinet and a first movable plate slidably disposed on the second support plate, a second cylinder is mounted on the second support plate, and the movable end of the second cylinder is fixed to the first movable plate; The first movable plate is also slidably provided with a second movable plate, which is fixed to the movable end of a third cylinder mounted on the first movable plate, and a plurality of clamping cylinders for picking up and placing circuit boards are installed on the side of the second movable plate.

[0015] Compared with the prior art, the beneficial effects of the present invention are: This invention incorporates a pressing and stabilizing mechanism. Before and after the probe contacts the detection point, the circuit board is pre-pressed and further pressed and limited. The pre-pressing serves as a protective adaptation, eliminating elastic warping of the circuit board and allowing the detection point to enter the probe's contact range while avoiding impact vibration caused by direct heavy pressure. The further pressing and limiting is a functional reinforcement, forming a micro-rigid support around the detection point to resist the reverse force and mechanical micro-vibration when the probe is pressed down. This, in turn, ensures reliable electrical contact between the probe and the detection point, improving the accuracy of the detection. Secondly, an elastic buffer mechanism is set up to realize the contact buffer function between the probe and the detection point, avoiding the problem of excessive contact pressure caused by rigid contact between the probe and the detection point. Furthermore, when the pressing stabilizing mechanism performs further pressing and limiting, the transmission mechanism can realize automatic compensation and balance of the compression of the second spring through the connecting plate, ensuring that the probe and the detection point maintain a suitable electrical contact pressure. Attached Figure Description

[0016] Figure 1 A schematic diagram of one embodiment of an automatic circuit board testing device with integrated contact buffer; Figure 2 A schematic diagram of the internal structure of the testing cabinet in one embodiment of an automatic circuit board testing device with integrated contact buffer; Figure 3 A schematic diagram of the internal structure of the testing cabinet from another angle in one embodiment of an automatic circuit board testing device with integrated contact buffer; Figure 4 This is a schematic diagram showing the distribution of two sets of circuit board transfer fixtures, a straightening fixture, multiple sets of testing fixtures, and two sets of unloading fixtures in one embodiment of an automatic circuit board testing equipment with integrated contact buffer.

[0017] Figure 5 A schematic diagram of the circuit board transfer fixture in one embodiment of an automatic circuit board testing device with integrated contact buffer; Figure 6 A schematic diagram of the circuit board transfer fixture from another angle in one embodiment of an automatic circuit board testing device with integrated contact buffer; Figure 7 A schematic diagram of the structure of the testing fixture in one embodiment of an automatic circuit board testing device with integrated contact buffer; Figure 8 A schematic diagram of the structure of the detection fixture at another angle in one embodiment of an automatic circuit board inspection device with integrated contact buffer; Figure 9 A front view of the inspection fixture in one embodiment of an automated circuit board inspection device with integrated contact buffer; Figure 10 A side view of the inspection fixture in one embodiment of an automated circuit board inspection device with integrated contact buffer; Figure 11 for Figure 7 Enlarged view of the structure at point A in the middle; Figure 12 for Figure 10 Enlarged view of the structure at point B; Figure 13 A schematic diagram illustrating the connection state of the elastic buffer mechanism and the pressing stabilizing mechanism in one embodiment of an automatic circuit board testing device with integrated contact buffer; Figure 14An exploded view of the pressing stabilizing mechanism in one embodiment of an automatic circuit board testing device with integrated contact buffer.

[0018] In the diagram: 1. Testing cabinet; 2. First feeding tray; 3. Second feeding tray; 4. First track; 5. Second track; 6. Turntable; 7. Placement position; 8. Receiving box; 9. First support plate; 901. Guide seat; 10. Second support plate; 11. First cylinder; 12. Assembly plate; 1201. Guide column; 13. Guide cylinder; 1301. Strip groove; 14. Insulating pressure rod; 1401. Drive column; 1402. Frustum; 1403. Protrusion; 15. Probe; 16. 17. First spring; 18. Second spring; 19. Drive shaft; 10. First slide groove; 11. Second slide groove; 12. Bevel gear set; 23. Lead screw; 24. Movable block; 25. Vertical arm; 26. Connecting rod; 27. Guide plate; 28. Column; 29. ​​First slider; 20. Connecting piece; 21. Second slider; 22. Connecting plate; 23. First movable plate; 24. Second movable plate; 25. Second cylinder; 36. Third cylinder; 37. Clamping cylinder. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Furthermore, elements in this invention are referred to as being "fixed to" or "set on" another element, which may be directly on the other element or may also include an intervening element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or may also include an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0021] Please see Figures 1-14 In this embodiment, an automatic circuit board testing device with integrated contact buffer includes a testing cabinet 1 and a turntable 6 disposed in the testing cabinet 1. Multiple placement positions 7 are equidistantly arranged along the circumference of the turntable 6. The testing cabinet 1 is also provided with multiple sets of testing fixtures for testing the circuit boards in the placement positions 7. The integrated contact buffer circuit board automatic testing equipment also includes: Two sets of circuit board transfer fixtures are installed in the testing cabinet 1. The two sets of circuit board transfer fixtures are used to transfer the circuit board to be tested into the placement position 7. The testing fixtures include: The first support plate 9 is fixed inside the testing cabinet 1, the assembly plate 12 is provided on the first support plate 9 and can be raised and lowered, and two sets of testing structures are provided on the assembly plate 12. The testing structure includes multiple probes 15 movably provided on the assembly plate 12, and each of the multiple probes 15 is connected to a set of elastic buffer mechanisms provided on the assembly plate 12. The two sets of pressing and stabilizing mechanisms on the assembly plate 12 act on the non-detection point position of the circuit board when the assembly plate 12 moves down. After the probe 15 makes electrical contact with the detection point, the transmission mechanism on the assembly plate 12 is triggered, which can drive the connecting plate 26 connected to the elastic buffer mechanism to move relative to the assembly plate 12.

[0022] In this embodiment, it should be noted that during actual operation, the turntable 6 rotates intermittently, causing the circuit board to pass through the testing fixture. When the circuit board reaches below the probe 15, the assembly plate 12 moves down. Subsequently, the pressing and stabilizing mechanism first acts on the non-detection point position on the circuit board to perform preliminary stabilization and limit on the circuit board, and eliminates board warping through pre-pressure. Then, the probe 15 acts on the detection point on the circuit board. During this process, the elastic buffer mechanism can buffer the probe 15 to avoid rigid contact between the probe 15 and the detection point. Subsequently, the assembly plate 12 moves further down to further press and stabilize the circuit board. During this process, the transmission mechanism is triggered, which can balance the pressure of the probe 15 on the test point and prevent the probe 15 from applying too much pressure to the test point during the further downward movement of the assembly plate 12, which could cause the probe tip to easily damage the surface coating of the test point and weaken its solderability and long-term reliability.

[0023] It should be noted that during testing, the pressing stabilizing mechanism performs preliminary pre-pressure on the circuit board before the probe 15 contacts the detection point to eliminate board warping. After the probe 15 makes electrical contact with the detection point, further pressing and limiting are performed, which strictly controls the contact timing between the probe 15 and the detection point. This further pressing and limiting can improve the local stiffness of the detection point area, avoid the circuit board still having some elastic rebound after pre-pressure, and avoid the problem of contact resistance fluctuation caused by the reaction force of the probe 15 and the micro-vibration of the equipment. It can further lock the relative position of the probe 15 and the detection point, and eliminate data jumps and misjudgments.

[0024] As a further embodiment of the present invention, please refer again. Figure 13The elastic buffer mechanism includes a guide plate 23 fixed on the assembly plate 12 and a first slider 24 and a second slider 25 slidably disposed on the guide plate 23. The first slider 24 is fixedly connected to the probe 15 through a connector 2401, and a buffer is connected between the first slider 24 and the second slider 25.

[0025] The buffer includes a column 2301 fixed on the guide plate 23 and a second spring 17 sleeved on the outer periphery of the column 2301. The column 2301 passes through the first slider 24 and the second slider 25. The two ends of the second spring 17 abut against the first slider 24 and the second slider 25 respectively. The first slider 24 and the second slider 25 are slidably connected to the column 2301. The second slider 25 is fixed to the connecting plate 26.

[0026] In this embodiment, during the detection process, when the assembly plate 12 moves down, after the probe 15 contacts the detection point, the first slider 24 will slide relative to the guide plate 23 and the column 2301, so that the second spring 17 is compressed, thereby realizing the contact buffer function between the probe 15 and the detection point, avoiding the problem of excessive contact pressure caused by rigid contact between the probe and the detection point; After the pre-compression is completed, the transmission mechanism is triggered. The transmission mechanism can drive the connecting plate 26 to drive the second slider 25 to slide relative to the guide plate 23, and automatically compensate and balance the compression of the second spring 17 that was originally further compressed, so as to prevent the compression of the second spring 17 from increasing and causing the pressure of the probe 15 on the detection point to increase too much.

[0027] To address this, the present invention employs a pressing stabilizing mechanism. Before and after the probe 15 contacts the detection point, the circuit board is pre-pressed and further pressed to limit its movement. The pre-pressing serves a protective function, eliminating elastic warping of the circuit board and allowing the detection point to enter the contactable range of the probe 15. This also prevents impact vibration caused by direct heavy pressure. The further pressing to limit its movement provides functional reinforcement, forming a micro-rigid support around the detection point to resist the reverse force and mechanical micro-vibration when the probe 15 is pressed down. This, in turn, ensures reliable electrical contact between the probe 15 and the detection point, improving the accuracy of the detection. Secondly, the elastic buffer mechanism is set up to realize the contact buffer function between the probe 15 and the detection point, avoiding the problem of excessive contact pressure caused by rigid contact between the probe and the detection point. When the pressing stabilizing mechanism performs further pressing limit, the transmission mechanism can realize automatic compensation and balance of the compression of the second spring 17 through the connecting plate 26, ensuring that the probe 15 and the detection point maintain a suitable electrical contact pressure.

[0028] As a further embodiment of the present invention, please refer again. Figure 13 and Figure 14 The pressing and stabilizing mechanism includes a guide cylinder 13 fixed to the assembly plate 12 and an insulating pressure rod 14 slidably fitted with the guide cylinder 13. A drive column 1401 connected to the transmission mechanism is fixed to the upper end of the insulating pressure rod 14. An elastic pressure-applying component connected to the insulating pressure rod 14 is also provided inside the guide cylinder 13. The elastic pressure-applying component includes a frustum 1402 fixed to the insulating pressure rod 14 and slidably connected to the inner wall of the guide cylinder 13, and a first spring 16 sleeved on the outer periphery of the insulating pressure rod 14. The two ends of the first spring 16 are respectively connected to the inner wall of the guide cylinder 13 and the frustum 1402.

[0029] It should be noted that multiple protrusions 1403 are formed on the frustum 1402, and multiple strip-shaped grooves 1301 adapted to the protrusions 1403 are provided on the inner wall of the guide cylinder 13. The strip-shaped grooves 1301 are arranged along the axial direction of the guide cylinder 13 to effectively guide the insulating pressure rod 14. Furthermore, when the assembly plate 12 moves down, the lower end of the insulating pressure rod 14 first contacts the non-detection point position of the circuit board. As a result, the insulating pressure rod 14 slides relative to the guide cylinder 13, and the first spring 16 is compressed to realize the pressing and limiting function of the circuit board. After the pre-pressing is completed, the probe 15 then contacts the detection point. It should be noted that the spring constant of the first spring 16 is larger than that of the second spring 17; After the probe 15 makes contact with the detection point, as the first spring 16 continues to be compressed, the insulating pressure rod 14 further presses and limits the circuit board, forming a micro-rigid support around the detection point. During this process, the drive column 1401 will trigger the transmission mechanism, and the connecting plate 26 will automatically compensate and balance the compression of the second spring 17, ensuring that the probe 15 and the detection point maintain a suitable electrical contact pressure.

[0030] As a further embodiment of the present invention, please refer again. Figures 11-13 The transmission mechanism includes a transmission shaft 18 rotatably mounted on the mounting plate 12, and the transmission shaft 18 is connected to the connecting plate 26 through a push-pull structure; the outer wall of the transmission shaft 18 is provided with a groove adapted to the drive column 1401, the drive column 1401 extends into the groove and is connected to the transmission shaft 18, and the groove includes a first sliding groove 1801 and a second sliding groove 1802 connected to each other, the first sliding groove 1801 is arranged along the axial direction of the transmission shaft 18, and the second sliding groove 1802 is arranged in a spiral shape.

[0031] The push-pull structure includes a lead screw 20 rotatably mounted on the assembly plate 12 and a movable block 21 slidably disposed on the assembly plate 12 and threadedly connected to the lead screw 20. The lead screw 20 is connected to the transmission shaft 18 through a bevel gear set 19. A vertical arm 2101 is fixed on the movable block 21, and a connecting rod 22 is provided between the vertical arm 2101 and the connecting plate 26. The two ends of the connecting rod 22 are respectively hinged to the vertical arm 2101 and the connecting plate 26.

[0032] In detail, the bevel gear set 19 includes a first bevel gear fixed on the transmission shaft 18 and a second bevel gear fixed on the lead screw 20, and the second bevel gear meshes with the first bevel gear; In this embodiment, during the process of the insulating pressure rod 14 applying pressure to the circuit board, the insulating pressure rod 14 slides relative to the guide cylinder 13, and the drive column 1401 moves relative to the drive shaft 18 in the axial direction of the drive shaft 18. When the drive column 1401 moves relative to the transmission shaft 18 in the first slide groove 1801, the transmission shaft 18 does not rotate. This process is the pre-compression process described above. Subsequently, after the probe 15 contacts the detection point, the drive column 1401 corresponds to the second slide groove 1802. Since the second slide groove 1802 is spirally arranged, the drive column 1401 will slide with the transmission shaft 18, causing the transmission shaft 18 to rotate. Then, the transmission shaft 18 drives the lead screw 20 to rotate through the bevel gear set 19. The movable block 21 slides towards the transmission shaft 18 through the threaded engagement with the lead screw 20. Correspondingly, the upright arm 2101 pushes the connecting plate 26 through the connecting rod 22, causing the second slider 25 to slide relative to the guide plate 23. That is, the second slider 25 slides upward relative to the guide plate 23, realizing automatic compensation and balance of the compression of the second spring 17, and ensuring that the probe 15 and the detection point maintain a suitable electrical contact pressure.

[0033] The threaded engagement between the lead screw 20 and the movable block 21 has a self-locking characteristic, which enables accurate control of the position of the connecting plate 26.

[0034] As a further embodiment of the present invention, please refer again. Figure 8 and Figure 9 A first cylinder 11 is installed on the first support plate 9. The movable end of the first cylinder 11 is fixed to the assembly plate 12. Two guide posts 1201 are also fixed at the bottom of the assembly plate 12. The guide posts 1201 pass through and are fixed to the guide seat 901 on the first support plate 9, and the guide posts 1201 and the guide seat 901 are slidably connected.

[0035] In this embodiment, when the circuit board under test is brought to the bottom of the probe 15 by the rotation of the turntable 6, the first cylinder 11 drives the assembly plate 12 to move down, thereby enabling the insulating pressure rod 14 and the probe 15 to contact the non-detection point displacement and detection point of the circuit board respectively. During this process, the guide post 1201 and the guide seat 901 can provide precise guidance for the downward movement of the assembly plate 12.

[0036] Please see Figures 1-4 and with Figure 4 From a top-down perspective, the outer side of the turntable 6 is provided with two sets of circuit board transfer fixtures, a correction fixture, three sets of testing fixtures, and two sets of unloading fixtures for unloading defective and qualified products, respectively, arranged in a clockwise direction.

[0037] As a further embodiment of the present invention, please refer again. Figure 2 and Figure 3 The testing cabinet 1 is also equipped with a first feeding tray 2 and a second feeding tray 3 for conveying the circuit board to be tested. The two sets of circuit board transfer fixtures are respectively used to transfer the circuit board to be tested in the first feeding tray 2 and the second feeding tray 3 to the placement position 7.

[0038] It should be noted that the first feeding tray 2 and the second feeding tray 3 are respectively equipped with a first track 4 and a second track 5. Each placement position 7 can hold two circuit boards. During operation, the two sets of circuit board transfer fixtures corresponding to the first track 4 and the second track 5 are used to clamp the circuit boards to be tested in the first track 4 and the second track 5, so as to place the circuit boards to be tested into the placement position 7. Secondly, the testing cabinet 1 is also equipped with a correction fixture. After two circuit boards to be tested are placed on the placement position 7, the two circuit boards will pass through the correction fixture and the testing fixture in sequence. When passing through the correction fixture, the correction fixture can correct the position of the two circuit boards in the placement position 7 to ensure that the tested area on the circuit board can be effectively aligned with the probe 15 during subsequent testing. In addition, the testing cabinet 1 is equipped with two sets of unloading fixtures. After the circuit board has completed the testing, it will pass through the two sets of unloading fixtures. Both sets of unloading fixtures are used to remove the circuit boards that have been tested and are located in the placement position 7. The difference between the two sets of unloading fixtures is that one set is used to remove defective products and the other set is used to remove qualified products. Thus, the circuit boards are classified according to the test results. For this purpose, the testing cabinet 1 is also equipped with a receiving box 8, which is used to collect qualified products. For defective products, they can be directly transferred to the conveyor belt to be transported to the rework end.

[0039] As a further embodiment of the present invention, please refer again. Figure 5 and Figure 6 The circuit board transfer fixture includes a second support plate 10 fixed inside the testing cabinet 1 and a first movable plate 27 slidably disposed on the second support plate 10. A second cylinder 29 is installed on the second support plate 10, and the movable end of the second cylinder 29 is fixed to the first movable plate 27. The first movable plate 27 is also slidably provided with a second movable plate 28. The second movable plate 28 is fixed to the movable end of the third cylinder 30 installed on the first movable plate 27, and a plurality of clamping cylinders 31 for picking up and putting down the circuit board are installed on the side of the second movable plate 28.

[0040] In this embodiment, when the second cylinder 29 is working, it can drive the first movable plate 27 to move laterally so that the clamping cylinder 31 reaches above the placement position 7 or is offset from the turntable 6. When the third cylinder 30 is working, it can drive the second movable plate 28 to rise and fall relative to the first movable plate 27, thereby realizing the height adjustment of the clamping cylinder 31.

[0041] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0042] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An automatic circuit board testing device with integrated contact buffer, comprising a testing cabinet and a turntable disposed within the testing cabinet, wherein multiple placement positions are equidistantly arranged along the circumference of the turntable, and the testing cabinet is further provided with multiple sets of testing fixtures for testing the circuit boards in the placement positions. Its features are, Also includes: Two sets of circuit board transfer fixtures are installed inside the testing cabinet. These two sets of circuit board transfer fixtures are used to transfer the circuit board to be tested into the placement position. The testing fixtures include: The first support plate is fixed inside the testing cabinet, the assembly plate is set on the first support plate and can be raised and lowered, and the two sets of testing structures are set on the assembly plate. The testing structure includes multiple probes that are movably set on the assembly plate, and each of the multiple probes is connected to a set of elastic buffer mechanisms set on the assembly plate. The two sets of pressing and stabilizing mechanisms on the assembly plate act on the non-detection point positions of the circuit board when the assembly plate moves down. After the probe makes electrical contact with the detection point, the transmission mechanism on the assembly plate is triggered, which can drive the connecting plate connected to the elastic buffer mechanism to move relative to the assembly plate.

2. The automatic circuit board testing equipment with integrated contact buffer according to claim 1, characterized in that, The elastic buffer mechanism includes a guide plate fixed to the assembly plate and a first slider and a second slider slidably disposed on the guide plate. The first slider is fixedly connected to the probe via a connector, and a buffer is connected between the first slider and the second slider.

3. The automatic circuit board testing equipment with integrated contact buffer according to claim 2, characterized in that, The buffer includes a column fixed to the guide plate and a second spring sleeved on the outer periphery of the column. The column passes through the first slider and the second slider. The two ends of the second spring abut against the first slider and the second slider, respectively. The first slider and the second slider are slidably connected to the column. The second slider is fixed to the connecting plate.

4. The automatic circuit board testing equipment with integrated contact buffer according to claim 1, characterized in that, The pressing and stabilizing mechanism includes a guide cylinder fixed to the assembly plate and an insulating pressure rod slidably fitted with the guide cylinder. The upper end of the insulating pressure rod is fixed with a drive column connected to the transmission mechanism. The guide cylinder is also provided with an elastic pressure member connected to the insulating pressure rod.

5. The automatic circuit board testing equipment with integrated contact buffer according to claim 4, characterized in that, The elastic pressure-applying component includes a frustum fixed to the insulating pressure rod and slidably connected to the inner wall of the guide cylinder, and a first spring sleeved on the outer periphery of the insulating pressure rod. The two ends of the first spring are respectively connected to the inner wall of the guide cylinder and the frustum.

6. The automatic circuit board testing equipment with integrated contact buffer according to claim 4, characterized in that, The transmission mechanism includes a transmission shaft rotatably mounted on the mounting plate, and the transmission shaft is connected to the connecting plate via a push-pull structure. The drive shaft has a groove on its outer wall that is adapted to the drive column. The drive column extends into the groove and is connected to the drive shaft. The groove includes a first slide groove and a second slide groove connected to each other. The first slide groove is arranged along the axial direction of the drive shaft, and the second slide groove is arranged in a spiral shape.

7. The automatic circuit board testing equipment with integrated contact buffer according to claim 6, characterized in that, The push-pull structure includes a lead screw rotatably mounted on the assembly plate and a movable block slidably disposed on the assembly plate and threadedly connected to the lead screw. The lead screw is connected to the drive shaft through a bevel gear set. The movable block is fixed with a vertical arm, and a connecting rod is provided between the vertical arm and the connecting plate. The two ends of the connecting rod are respectively hinged to the vertical arm and the connecting plate.

8. The automatic circuit board testing equipment with integrated contact buffer according to claim 1, characterized in that, A first cylinder is mounted on the first support plate. The movable end of the first cylinder is fixed to the assembly plate. Two guide posts are also fixed to the bottom of the assembly plate. The guide posts are fixed through the guide seats on the first support plate and are slidably connected to the guide seats.

9. The automatic circuit board testing equipment with integrated contact buffer according to claim 1, characterized in that, The testing cabinet is also equipped with a first feeding tray and a second feeding tray for conveying the circuit board to be tested. The two sets of circuit board transfer fixtures are used to transfer the circuit board to be tested in the first feeding tray and the second feeding tray to the placement position.

10. The automatic circuit board testing equipment with integrated contact buffer according to claim 9, characterized in that, The circuit board transfer fixture includes a second support plate fixed inside the testing cabinet and a first movable plate slidably disposed on the second support plate. A second cylinder is installed on the second support plate, and the movable end of the second cylinder is fixed to the first movable plate. The first movable plate is also slidably provided with a second movable plate, which is fixed to the movable end of a third cylinder mounted on the first movable plate, and a plurality of clamping cylinders for picking up and placing circuit boards are installed on the side of the second movable plate.

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