Coil assembly

Abstract

A coil assembly provided in an induction heating cooking apparatus is disclosed. The coil assembly has a structure in which wirings of a plurality of heating coils and wirings of a plurality of detecting coils are arranged in any one identical layer of a plurality of detecting coil layers in which the plurality of detecting coils are arranged. Thus, the connection between the heating coils can be optimized, and the thickness of the heating coil layer of the coil assembly can be reduced.

Description

Technical Field

[0001] This invention relates to a cooking device, and more specifically, to a coil assembly disposed in an induction heating cooktop. Background Technology

[0002] In recent years, induction cookers, which utilize induction heating technology, have attracted much attention as a new generation of cooking equipment that can replace gas stoves due to their advantages such as high heating efficiency, fast heating speed, stability, and convenience.

[0003] As an induction heating cooktop product, there is an induction heating cooktop with a heating coil made of Ritz wire, which heats the cooktop when a container specifically designed for induction cooktops is placed in a predetermined burner position. The drawback of this method is that the container can only be placed in a predetermined position; if the container's position deviates slightly, the heating efficiency will decrease.

[0004] Therefore, an all-free induction heating technology is currently under development. This technology allows for heating of containers even when placed anywhere on the induction heating panel, rather than in a predetermined area, and it has the advantage of being able to heat containers of various sizes and multiple containers of more than three. Summary of the Invention

[0005] The problem that the invention aims to solve

[0006] The present invention provides a coil assembly that can arrange heating coil wiring, detection coil wiring and detection coil in the same layer.

[0007] The present invention provides a coil assembly that can reduce the thickness of the heating coil layer.

[0008] The present invention provides a coil assembly capable of optimally configuring the wiring of a plurality of heating coils.

[0009] The present invention provides a coil assembly that can ensure space for a plurality of detection coils and a plurality of temperature sensors.

[0010] The present invention provides a coil assembly that can overlap the eddy currents of a container in a plurality of heating coils, thereby improving heating performance and efficiency.

[0011] The present invention provides a coil assembly that simplifies the manufacturing process by forming a plurality of heating coils, a plurality of detection coils and a plurality of temperature sensors into a single PCB pattern assembly.

[0012] The problems to be solved by one embodiment of this specification are not limited to those described above, and other issues not mentioned will be clearly understood by those skilled in the art from the following description.

[0013] Technical solutions to the problem

[0014] One embodiment of the present invention has a coil assembly having a structure of heating coil wiring, detection coil wiring, and detection coils disposed in any one of the same layers of a plurality of detection coil layers.

[0015] One embodiment of the coil assembly of the present invention can reduce the thickness of an integral PCB pattern assembly. Specifically, the heating coil is formed on a plurality of heating coil layers, and the heating coil wiring is disposed on one of the plurality of detection coil layers.

[0016] The coil assembly of one embodiment of the present invention can optimally configure the wiring of a plurality of heating coils. Specifically, the inner terminals between the heating coils are connected in one of the plurality of detection coil layers by wiring that traverses the heating coils.

[0017] In one embodiment of the present invention, the coil assembly ensures space for a plurality of detection coils and a plurality of temperature sensors. Specifically, the spacing between the patterns of the heating coils in the area overlapping with the detection coils and the spacing between the heating coils are separated by a predetermined distance or more.

[0018] In one embodiment of the present invention, the heating performance and efficiency can be improved by overlapping the eddy currents in the container. Specifically, the first heating coil is formed by a pattern in which the current rotates clockwise from the outside to the center, and the second heating coil is formed by a pattern in which the current rotates counterclockwise from the center to the outside.

[0019] An embodiment of the coil assembly of the present invention simplifies the manufacturing process by forming a plurality of heating coils, a plurality of detection coils, and a plurality of temperature sensors into a single PCB pattern assembly. Specifically, a temperature sensor is disposed at the center of each of the plurality of detection coils, a plurality of heating coil terminals connected to the plurality of heating coils are disposed on one side of the PCB pattern assembly in the front-rear direction, and a connector connected to the plurality of detection coils and temperature sensors is disposed on one side of the PCB pattern assembly in the front-rear direction.

[0020] Invention Effects

[0021] As described above, in this invention, the heating coil wiring that connects the heating coils to each other or connects the heating coils to the heating coil terminals is arranged in one of a plurality of detection coil layers, thereby eliminating the need for Litz wires to connect the heating coils.

[0022] In this invention, the heating coil can be disposed on the heating coil layer and the heating coil wiring can be disposed on one of the plurality of detection coil layers, thereby reducing the thickness of the integral PCB pattern assembly.

[0023] In this invention, the inner terminals between the heating coils can be connected to the inner terminals of one of the plurality of detection coil layers by wiring that runs through the heating coils, thereby enabling optimal wiring configuration of the plurality of heating coils.

[0024] In this invention, the spacing between the patterns of heating coils in the area overlapping with the detection coil and the spacing between the heating coils can be separated by a predetermined distance, thereby ensuring the configuration space for a plurality of detection coils and a plurality of temperature sensors.

[0025] In this invention, the first heating coil can be formed by a pattern in which the current rotates clockwise from the outside to the center, and the second heating coil can be formed by a pattern in which the current rotates counterclockwise from the center to the outside, thereby enabling the eddy currents in the container to overlap, thereby improving heating performance and efficiency.

[0026] In this invention, temperature sensors can be arranged at the center of a plurality of detection coils, and a plurality of heating coil terminals, a plurality of detection coils, and connectors connected to the temperature sensors can be arranged on one side of the PCB pattern assembly in the front-back direction. This ensures sufficient space for the plurality of detection coils and the plurality of temperature sensors, and allows for optimal configuration of the wiring of the plurality of heating coils, the plurality of detection coils, and the temperature sensors.

[0027] In addition, in this invention, a plurality of heating coils, a plurality of detection coils, and a plurality of temperature sensors can be formed into an integrated PCB pattern assembly, which can help simplify processes such as masking, printing, and etching.

[0028] In addition, in this invention, the heating coil wiring and the detection coil wiring can be formed on the same layer where the detection coil is formed, thereby minimizing the height of the heating coil pattern.

[0029] In addition, in this invention, the heating coil wiring that connects the heating coils in series can be arranged across the heating coil in the detection coil layer, thereby achieving the optimal wiring path.

[0030] In addition, in this invention, the heating coil terminals, which are respectively connected to the heating coils, can be arranged on one side of the PCB pattern assembly in the front-back direction, thereby ensuring the configuration space for the wiring of the plurality of detection coils and the wiring of the plurality of temperature sensors.

[0031] Furthermore, in this invention, by forming the heating coil wiring and the detection coil wiring on the same layer where the detection coil is formed, the number of multiple heating coil layers can be reduced.

[0032] In addition to the effects described above, the specific effects of the invention will be explained along with the following specific measures for carrying out the invention. Attached Figure Description

[0033] Figure 1 This is an exploded perspective view showing the stove in a cooking apparatus according to an embodiment of the present invention.

[0034] Figure 2 It is shown Figure 1 The diagram shows a top view of the stove and a diagram of the PCB pattern coil assembly.

[0035] Figure 3 This is a diagram illustrating the connection structure between heating coils connected in series in a coil assembly according to an embodiment of the present invention.

[0036] Figure 4 This is a diagram showing the spacing between the patterns of the heating coils in a coil assembly according to an embodiment of the present invention.

[0037] Figure 5 This is a diagram showing the spacing between heating coils in a coil assembly according to an embodiment of the present invention.

[0038] Figure 6 This is a diagram illustrating the connection structure between heating coils connected in series and parallel in a coil assembly according to an embodiment of the present invention.

[0039] Figure 7 This is a circuit diagram illustrating the connection relationship between the heating coils connected in series and parallel with the inverter circuit in a cooking device according to an embodiment of the present invention.

[0040] Figure 8 It is used for explanation Figure 2 The diagram shows a schematic cross-sectional view of the structure of an integrated PCB pattern assembly.

[0041] Figure 9 yes Figure 8 The image shows a top view of the first detection coil layer.

[0042] Figure 10 yes Figure 8 The top view of the second detection coil layer is shown in the figure.

[0043] Figure 11 yes Figure 8 The top view of the first to tenth heating coil layers shown in the figure. Detailed Implementation

[0044] Referring to the accompanying drawings, the foregoing objectives, features, and advantages will be described in detail, thereby enabling those skilled in the art to readily implement the technical concept of the present invention. In the process of describing the present invention, detailed descriptions of specific known technologies related to the present invention are omitted when they are deemed to obscure the main points of the invention. Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals denote the same or similar structural elements.

[0045] Although the terms "first," "second," etc., are used in this invention to describe multiple structural elements, these structural elements are not limited to these terms. These terms are used only to distinguish one structural element from other structural elements; therefore, unless otherwise stated, the "first structural element" mentioned below may also be a "second structural element" within the scope of the technical concept of this invention.

[0046] This invention is not limited to the embodiments disclosed below, and can be implemented in various ways and with different modifications. These embodiments are provided merely to fully disclose the invention and to completely reveal its scope to those skilled in the art. Therefore, this invention is not limited to the embodiments disclosed below, and should be understood to include not only the substitution or addition of the configuration of any one embodiment to the configuration of other embodiments, but also all modifications, equivalents, and substitutions made within the technical concept and scope of this invention.

[0047] The accompanying drawings are provided merely to facilitate understanding of the embodiments disclosed in this specification. The technical concepts disclosed in this specification are not limited to the drawings and should be understood as including all modifications, equivalents, and substitutions made within the technical concept and scope of this invention. In the drawings, for ease of understanding, the size or thickness of the constituent elements may be exaggerated or reduced, but the scope of protection of this invention should not be construed as restrictive.

[0048] The terminology used in this specification is for illustrative purposes only and is not intended to limit the invention. Furthermore, unless the context clearly specifies otherwise, singular expressions include plural expressions. In this specification, terms such as "comprising," "constituting," etc., are intended to indicate the presence of the features, numbers, steps, actions, constituent elements, components, or combinations thereof disclosed in the description. That is, the terms "comprising," "constituting," etc., in this specification should not be construed as precluding the existence or additional possibilities of one or more other features, numbers, steps, actions, constituent elements, components, or combinations thereof.

[0049] Terms such as "first," "second," etc., which include ordinal numbers, can be used to describe various constituent elements; however, these constituent elements are not limited to these terms. The terms are used only to distinguish one constituent element from others.

[0050] When a constituent element is referred to as being "connected" or "linked" to other constituent elements, it should be understood that the constituent element can be directly connected or linked to other constituent elements, or that there are other constituent elements between them. Conversely, when a constituent element is referred to as being "directly connected" or "directly linked" to other constituent elements, it should be understood that there are no other constituent elements between them.

[0051] When it is mentioned that a certain component is located "above" or "below" other components, it can be understood not only as the component being positioned directly above the other components, but also as the presence of other components between them.

[0052] Unless otherwise defined, all terms, including technical or scientific terms, shall have the same meaning as commonly understood by one of ordinary skill in the art. Commonly used terms, such as those defined in dictionaries, should be interpreted as consistent with their meaning in the context of the relevant art and should not be construed in an ideal or excessive manner unless expressly defined in this specification.

[0053] The present invention discloses a coil assembly and a cooking device including the same.

[0054] In this manual, with the cooking equipment placed on the ground, the directions forward and backward are defined as front-to-back, with the center of the cooking equipment as the reference. The directions orthogonal to the front-to-back directions are defined as left-to-right.

[0055] [The overall structure of an induction heating cooktop]

[0056] Figure 1 This is an exploded perspective view showing the induction heating stove 100 in a cooking apparatus according to an embodiment of the present invention.

[0057] One embodiment of the cooking device of the present invention may be an oven-type cooking device with a cooktop 100 arranged on the upper side and an oven section arranged on the lower side. The present invention is not limited thereto, and may also be configured as a cooking device with a cooktop 100 separately provided.

[0058] Reference Figure 1 The cooking apparatus of an embodiment of the present invention includes an induction heating cooktop 100. The induction heating cooktop 100 may include a housing 110 and a top plate 120.

[0059] According to this embodiment, the cooktop 100 can be formed by a housing 110 and a top plate 120. The housing 110 can be disposed below the top plate 120 and can form the front, back, sides, and bottom of the cooktop 100. The top plate 120 can be disposed at the upper end of the cooktop 100 and can form the top surface of the cooktop 100. The top plate 120 can be formed of ceramic glass to hold cooking containers.

[0060] An accommodating space can be formed inside the housing 110. The accommodating space formed inside the housing 110 can be open to the upper side. As an example, the housing 110 can be formed into a hexahedral shape that is open to the upper side. Various internal components constituting the stove 100 can be accommodated in the accommodating space surrounded by the top plate 120 and the housing 110.

[0061] Additionally, in the cooktop 100, an integrated PCB pattern coil assembly 140 can be disposed on the underside of the top plate 120. In the PCB pattern coil assembly 140, at least one heating coil for induction heating of the cooking container and at least one detection coil for detecting the cooking container can be integrally formed.

[0062] As an example, depending on the size of the top plate 120 of the cooktop 100, a plurality of PCB pattern coil assemblies 140 can be configured. For example, if the top plate 120 is divided into three regions—a left region, a central region, and a right region—three PCB pattern coil assemblies 140 can be arranged on the underside of the corresponding region. The PCB pattern coil assemblies 140 can be formed in different sizes to suit the dimensions of the left, central, and right regions. Each PCB pattern coil assembly 140 corresponding to each region can be driven independently.

[0063] In the PCB patterned coil assembly 140, a heating coil for induction heating, a detection coil for detecting the container, a temperature sensor for detecting temperature, and terminals for connecting with other components can be integrally formed. The PCB patterned coil assembly 140 can be divided into a plurality of unit blocks. As an example, one heating coil can be configured in one unit block. As an example, at least two detection coils can be configured in one unit block. As an example, two detection coils can be stacked on two unit blocks and configured between one unit block and another unit block.

[0064] Additionally, in the cooktop 100, the support member 150 can be disposed on the underside of the PCB patterned coil assembly 140. The support member 150 can form a skeleton inside the cooktop 100 to support the various internal components constituting the cooktop 100. As an example, the support member 150 can be formed into a hexahedral shape with an open underside. For example, the support member 150 can be formed in a shape that is roughly the inverted shape of the housing 110, and can be formed to be slightly smaller than the size of the housing 110.

[0065] According to this embodiment, the accommodating space can be formed inside the support member 150, and can be formed by the bottom of the housing 110 and the space surrounded by the support member 150. Various internal components constituting the cooktop 100 can be accommodated inside the support member 150.

[0066] As an example, the support member 190 may house a resonant PCB assembly 160 containing a capacitor for resonance or oscillation, an inverter PCB assembly 170 containing switching elements for applying current to the heating coil for induction heating, a fan 180 for cooling the heat of internal components, an electromagnetic interference (EMI) filter 190 for filtering and blocking various noises mixed in the power supply, and a control PCB assembly containing a controller for controlling the entire stove 100 and a circuit for detecting the container.

[0067] According to this embodiment, the support member 150 can also serve as a base for the PCB pattern coil assembly 140. More specifically, a ferrite core can be provided on the upper side of the support member 150, the PCB pattern coil assembly 140 can be provided on the upper side of the ferrite core, and a top plate 120 can be provided on the upper side of the PCB pattern coil assembly 140.

[0068] Additionally, the cooktop 100 may have a control panel 130. The control panel 130 may be located in an area on the top surface of the top panel 120. This control panel 130 may be equipped with a user interface (UI), which includes adjustment icons for adjusting the operation of the cooktop 100 by touch and a display for showing the operating status of the cooktop 100.

[0069] [PCB Patterned Coil Assembly]

[0070] Figure 2 It is shown Figure 1 The diagram shows a top view of the cooktop 100 and a diagram of the configuration of the PCB pattern coil assembly 140.

[0071] Reference Figure 2The cooktop 100 may include a housing 110, a support 150, and a PCB patterned coil assembly 140. The PCB patterned coil assembly 140 may be equipped with a heating coil 142 for induction heating of the cooktop 100 and a detection coil 143 for detecting cooking containers, and may be configured in a receiving space inside the cooktop 100.

[0072] The support member 150 can be disposed on the upper part of the housing 110, the PCB pattern coil assembly 140 can be disposed on the upper part of the support member 150, and the top plate 120 can be disposed on the upper part of the PCB pattern coil assembly 140.

[0073] Depending on the size and shape of the cooktop 100, the PCB pattern coil assembly 140 may include a plurality of units. In this embodiment, the cooktop 100 is shown divided into a left region, a central region, and a right region, and includes three PCB pattern coil assemblies 140. Each PCB pattern coil assembly 140 may include a plurality of heating coils 142 and a plurality of detection coils 143.

[0074] The PCB patterned coil assembly 140 can be divided into a plurality of unit blocks 141. The plurality of unit blocks 141 can be arranged in a matrix. As an example, at least one heating coil 142 can be arranged in one unit block 141. As an example, at least two detection coils 143 can be arranged in one unit block 141. In addition, at least two detection coils 143 can be stacked on two unit blocks and arranged between one unit block 141 and another unit block 141.

[0075] The respective heating coil 142 and detection coil 143 formed on the PCB patterned coil assembly 140 can be arranged in a patterned form on the substrate. For example, the heating coil 142 can be formed as a polygonal pattern, such as a square, rectangle, or hexagon. Alternatively, the heating coil 142 can be formed as a ring-shaped pattern. For example, the detection coil 143 can be formed as a circular pattern. Alternatively, the detection coil 143 can be formed as a circular, square, rectangular, or hexagonal pattern.

[0076] Additionally, the PCB patterned coil assembly 140 may include at least one heating coil terminal 145, at least one connector 146, at least one heating coil wiring 147, at least one detection wiring 148, and at least one via. The heating coil terminal 145 can be electrically connected to the heating coil 142 via the heating coil wiring 147, and can also be electrically connected to the resonant PCB assembly 160 and the inverter PCB assembly 170. The connector 146 is electrically connected to the detection coil 143 via the detection wiring 148, and is also electrically connected to the resonant PCB assembly 160 and the control PCB assembly.

[0077] As described above, the unit block 141 of the PCB patterned coil assembly 140 can not only form a heating coil 142, but also a detection coil 143. In the unit block 141, a plurality of detection coils 143 are arranged in the front-back direction and a plurality of detection coils 143 are also arranged in the left-right direction.

[0078] The PCB patterned coil assembly 140 may include a PCB with a heating coil 142 printed on it (hereinafter referred to as the "heating coil PCB") and a PCB with a detection coil 143 printed on it (hereinafter referred to as the "detection coil PCB"). In the PCB patterned coil assembly 140, the heating coil PCB and the detection coil PCB may be formed in a stacked manner in the vertical direction. As an example, the heating coil PCB may be formed by stacking 10 to 12 layers, and the heating coils 142 between the layers may be electrically connected via vias. As an example, the detection coil PCB may be formed by stacking two layers, and the detection coils 143 between the layers may be electrically connected via vias.

[0079] Additionally, at least one of the heating coil PCB and the detection coil PCB can be provided with coils printed on both sides of the substrate. In this embodiment, a case is shown where heating coils 142 are printed on both sides of the heating coil PCB and detection coils 143 are printed on both sides of the detection coil PCB.

[0080] Each detection coil 143 can be configured to overlap with the area formed by its respective heating coil 142. Additionally, each detection coil 143 can be configured to overlap with the areas formed by two adjacent heating coils 142.

[0081] In this embodiment, two detection coils 143 are respectively arranged inside the forming area of ​​each heating coil 142, and two detection coils 143 are respectively arranged between two adjacent heating coils 142 in the front-back direction. Additionally, a temperature sensor 144 may be provided in the PCB pattern coil assembly 140. As an example, the temperature sensor 144 may be arranged at the center of each detection coil 143.

[0082] As an example, in the PCB patterned coil assembly 140, the heating coil 142, the detection coil 143, and the temperature sensor 144 can be provided as a single unit. For instance, the heating coil PCB equipped with the heating coil 142, the detection coil 143, and the detection coil PCB equipped with the temperature sensor 144 can be stacked to form the PCB patterned coil assembly 140. The PCB patterned coil assembly 140 can be provided in a manner that includes at least one patterned coil PCB.

[0083] As described above, the PCB patterned coil assembly 140 has a structure in which a plurality of heating coils 142 for induction heating using a pattern printed on a PCB and a plurality of detection coils 143 for detecting a cooking container placed on a ceramic glass are integrally formed. The number of heating coils 142 and detection coils 143 can be determined according to the size of the cooktop 100.

[0084] For example, an integrated PCB patterned coil assembly 140 may include heating coil patterns arranged in a 10-layer structure, detection coil patterns arranged in a two-layer structure, and an insulating material disposed between the respective heating coil patterns and the respective detection coil patterns to insulate them. The insulating material may be formed by curing thermosetting resins commonly used for constructing printed circuit boards and prepregs made of glass fibers. For example, epoxy resin-based thermosetting resins are preferred as applicable; specifically, FR-4 may be used.

[0085] As described above, the insulating material formed by the prepreg can insulate the heating coil patterns arranged in a layered structure by being disposed between them, and can also insulate the detection coil patterns by being disposed between them. Furthermore, the insulating material can be configured to fill portions where patterns such as heating coil patterns and detection coil patterns are not formed, thereby forming a single-layered structure.

[0086] Therefore, based on the heating coil pattern and the detection coil pattern, the PCB pattern coil assembly 140 can have a layered structure of twelve layers from the first layer on the uppermost side of the forming layer to the twelfth layer forming the lowermost layer, with the vertical direction as the reference.

[0087] As described above, since the heating coil pattern and detection coil pattern of the embodiments of the present invention can be formed by an integral PCB pattern coil assembly formed as multiple layers, it helps to simplify processes such as masking, printing, and etching.

[0088] [Connection structure between heating coils in a PCB patterned coil assembly]

[0089] Figure 3 This is a diagram illustrating the connection structure between heating coils connected in series in a coil assembly according to an embodiment of the present invention. Figure 4 This is a diagram showing the spacing between the patterns of the heating coils in a coil assembly according to an embodiment of the present invention. Figure 5 This is a diagram showing the spacing between heating coils in a coil assembly according to an embodiment of the present invention. Figure 6 This is a diagram illustrating the connection structure between heating coils connected in series and parallel in a coil assembly according to an embodiment of the present invention.

[0090] Reference Figures 3 to 6 According to one embodiment of the present invention, a coil assembly includes a substrate and a plurality of heating portions disposed on the substrate. The coil assembly may be named PCB patterned coil assembly 140, and the heating portions may be named heating coil 142.

[0091] A plurality of heating coils 142 are formed by a rotating pattern and are electrically connected by at least two layers. The pattern of the plurality of heating coils 142 forms a plurality of turns on one layer, and an inter-turn region is formed between the plurality of turns. At least one detection coil 143 is disposed on other layers of the inter-turn region.

[0092] A patternless central region is formed in the center of a plurality of heating coils 142. On both sides of the central region of the plurality of heating coils 142, a plurality of inter-turn regions are formed, the width of which is wider than that of other turns. Detection coils 143 are arranged on other layers in the regions where the width of the inter-turn regions is wider than that of other turns.

[0093] The detection coil 143 is formed by a rotating pattern and is arranged apart from each other at predetermined intervals. As an example, the heating coil 142 and the detection coil 143 may be formed on the same substrate. As another example, the heating coil 142 and the detection coil 143 may be formed on different substrates. The substrate on which the heating coil 142 is formed and the substrate on which the detection coil 143 is formed can be electrically connected through a terminal portion.

[0094] A patterned area can be formed in one of the heating sections of the plurality of heating coils 142, and a patterned area can be formed in the boundary region between the plurality of heating sections.

[0095] The center of the detection coil 143 may be located in the unpatterned area within the heating coil 142 region, and the heating coil 142 and the detection coil may be configured to partially overlap. No detection coil may be located in the left-right boundary region between the heating coils. The center of the detection coil may be located in the front-back boundary region between the heating elements, and the heating elements and the detection coil may be configured to partially overlap.

[0096] In a plurality of heating sections, the unpatterned areas of two heating section regions arranged parallel in the left-right or front-back direction may be provided with the center portions of at least four and at most six detection coils. Here, detection coils may not be provided in the boundary regions between heating sections arranged parallel in the left-right direction.

[0097] When four heating elements are arranged in series or parallel, at least twelve and at most fourteen detection coils can be arranged at the center of the unpatterned area of ​​the heating element region. Here, detection coils may not be arranged in the boundary region between heating elements that are parallel in the left-right direction.

[0098] The heating element may include a first heating coil WC1 and a second heating coil WC2 arranged adjacent to each other in the front-back direction, and a third heating coil WC3 and a fourth heating coil WC4 arranged adjacent to each other in the front-back direction and adjacent to the first heating coil WC1 and the second heating coil WC2 in the left-right direction.

[0099] Two detection coils can be configured within the region of the first heating coil WC1 and the second heating coil WC2. Two detection coils can also be configured in the boundary region between the first heating coil WC1 and the second heating coil WC2.

[0100] Two detection coils may be configured within the region of the third heating coil WC3 and the fourth heating coil WC4. Two detection coils may also be configured in the boundary region between the third heating coil WC3 and the fourth heating coil WC4. No detection coils may be configured in the boundary region between the first heating coil WC1 and the second heating coil WC2, and between the third heating coil WC3 and the fourth heating coil WC4.

[0101] The detection coil 143 can be electrically connected on at least two layers, and a plurality of detection coils can be configured on one layer. On another layer, at least one of a plurality of detection coils, a plurality of heating coil wiring 147, and a plurality of detection coil wiring 148 can be configured.

[0102] At least one detection coil 143 may be provided in the patternless area within the heating section and the patternless area in the boundary area between the heating sections.

[0103] The plurality of heating elements includes a first heating coil WC1 and a second heating coil WC2. Two detection coils 143 are disposed on other layers in the unpatterned areas of the first heating coil WC1 and the second heating coil WC2. Additionally, two detection coils 143 are disposed on other layers in the boundary area between the first heating coil WC1 and the second heating coil WC2. Furthermore, a temperature sensor 144 is disposed at the center of each detection coil 143.

[0104] A first heating coil WC1 and a second heating coil WC2 are connected in series via wiring. The first heating coil WC1 includes a first outer terminal WC1a and a first inner terminal WC1b, and is formed by a pattern that rotates clockwise from the first outer terminal WC1a toward the first inner terminal WC1b. The second heating coil WC2 includes a second inner terminal WC2a and a second outer terminal WC2b, and is formed by a pattern that rotates counterclockwise from the second inner terminal WC2a toward the second outer terminal WC2b.

[0105] The currents in the first heating coil WC1 and the second heating coil WC2 rotate in opposite directions. For example, a resonant current is applied to the first outer terminal WC1a of the first heating coil WC1, and a ground voltage is applied to the second outer terminal WC1b of the second heating coil WC2. As a result, the currents in the first heating coil WC1 and the second heating coil WC2, which are connected in series, rotate in opposite directions.

[0106] The coil assembly also includes a first heating coil terminal 145a connected to a first outer terminal WC1a of a first heating coil WC1 via a first wiring, a second heating coil terminal 145b connected to a second outer terminal WC2b of a second heating coil WC2 via a second wiring, and a third heating coil terminal 145c connected to a first inner terminal WC1b of a first heating coil WC1 and a second inner terminal WC2a of a second heating coil WC2 via a third wiring.

[0107] The first, second, and third wirings can be formed as heating coil wiring 147 on the layer where the detection coil 143 is formed. The third wiring, as a wiring connecting the first heating coil WC1 and the second heating coil WC2 in series, can be formed on the layer where the detection coil 143 is formed, traversing the region through the center of the first heating coil WC1 and the second heating coil WC2. The third heating coil terminal 145c can be connected to other heating coils within the coil assembly via a relay. Additionally, the coil assembly includes a connector 146 connected to at least one detection coil 143 via detection coil wiring 148. Furthermore, the connector 146 is connected to a temperature sensor 144 via the detection coil wiring.

[0108] In one embodiment of the cooking apparatus, the PCB pattern coil assembly 140 includes a first heating coil WC1 and a second heating coil WC2. Additionally, the PCB pattern coil assembly 140 includes a first heating coil terminal 145a, a second heating coil terminal 145b, and a third heating coil terminal 145c connected to the first heating coil WC1 and the second heating coil WC2. Furthermore, the PCB pattern coil assembly 140 includes a plurality of detection coils 143, a plurality of temperature sensors 144, and connectors 146.

[0109] The first heating coil WC1 is formed by a pattern that rotates clockwise from the outer terminal WC1a towards the inner terminal WC1b. The outer terminal WC1a of the first heating coil WC1 is connected to the first heating coil terminal 145a via wiring. Current is applied to the first heating coil terminal 145a. The current applied to the first heating coil terminal 145a rotates clockwise along the pattern of the first heating coil WC1.

[0110] The second heating coil WC2 is formed by a pattern that rotates counterclockwise from the inner terminal WC2a to the outer terminal WC2b. The outer terminal WC2b of the second heating coil WC2 is connected to the second heating coil terminal 145b via wiring. A ground voltage is applied to the second heating coil terminal 145b. The second heating coil WC2 is connected in series with the first heating coil WC1 and receives the current transmitted through the first heating coil WC1. The current in the second heating coil WC2 rotates counterclockwise along the pattern of the second heating coil WC2.

[0111] The first heating coil WC1 and the second heating coil WC2 are connected in series. For example, the first heating coil WC1 and the second heating coil WC2 are connected in series by a wire that runs through the center of the first heating coil WC1 and the second heating coil WC2. The inner terminal WC1b of the first heating coil WC1 and the inner terminal WC2a of the second heating coil WC2 are connected to the third heating coil terminal 145c by a wire that runs through the center of the first heating coil WC1 and the second heating coil WC2.

[0112] The spacing of the regions overlapping the center of the detection coil 143 in the intervals between the patterns of the first heating coil WC1 can be separated by a first distance d1 that is wider than the spacing of the other non-overlapping regions.

[0113] The gap between the first heating coil WC1 and the second heating coil WC2 can be separated by a second distance d2, which is wider than the diameter of the space formed at the center of the detection coil 143.

[0114] The first distance d1 and the second distance d2 can be set to the same value. For example, the distance d1 between the areas overlapping the center of the detection coil 143 in the interval between the patterns of the first heating coil WC1 or the second heating coil WC2, and the distance d2 between the first heating coil WC1 and the second heating coil WC2, can be formed to be wider than the diameter of the space formed at the center of the detection coil 143, and their values ​​can be set to the same value.

[0115] The first heating coil terminal 145a, the second heating coil terminal 145b, and the third heating coil terminal 145c are disposed on one side of the PCB pattern coil assembly 140. For example, the third heating coil terminal 145c is disposed on one side of the PCB pattern coil assembly 140 in the front-rear direction, and the first heating coil terminal 145a and the second heating coil terminal 145b are disposed on the right side based on the third heating coil terminal 145c.

[0116] Furthermore, similar to the first heating coil terminal 145a, the second heating coil terminal 145b, and the third heating coil terminal 145c, the connector 146 is disposed on one side of the PCB pattern coil assembly 140 in the front-rear direction. The connector 146 is disposed on the left side relative to the third heating coil terminal 145c. Alternatively, conversely, the first heating coil terminal 145a and the second heating coil terminal 145b may be disposed on the left side relative to the third heating coil terminal 145c, and the connector 146 may be disposed on the right side relative to the third heating coil terminal 145c.

[0117] The first heating coil terminal 145a is connected to the output terminal of the inverter circuit disposed on the inverter PCB assembly 170. A first resonant capacitor may also be connected between the first heating coil terminal 145a and the output terminal of the inverter circuit.

[0118] The current applied from the inverter circuit resonates at the resonant frequency determined by the first heating coil WC1 and the first resonant capacitor, and is supplied to the first heating coil WC1 through the first heating coil terminal 145a.

[0119] The current in the first heating coil WC1 rotates clockwise from the outside to the center along the pattern of the rotating first heating coil WC1.

[0120] The second heating coil terminal 145b is connected to the ground voltage terminal. A second resonant capacitor may also be connected between the second heating coil terminal 145b and the ground voltage terminal.

[0121] The first heating coil terminal 145a, the first heating coil WC1, the second heating coil WC1, and the second heating coil terminal 145b form a current path. The resonant current output from the inverter circuit can flow through the first heating coil terminal 145a, the first heating coil WC1, the second heating coil WC1, and the second heating coil terminal 145b. At this time, the current in the first heating coil WC1 rotates clockwise, and the current in the second heating coil WC2 rotates counterclockwise.

[0122] The first heating coil WC1 and the second heating coil WC2 can be patterned by allowing current to flow in opposite directions, thereby generating magnetic fields whose directions cancel each other out. The first heating coil WC1 and the second heating coil WC2 can be connected in series with opposite polarities, thus generating magnetic fields whose directions cancel each other out. The first heating coil WC1 and the second heating coil WC2 can generate magnetic fields in directions that cancel each other out, thereby generating a magnetic field in the container under the influence of electromagnetic induction. The magnetic field generated under the influence of electromagnetic induction causes eddy currents in the container to overlap, and the overlapping eddy currents in the container can improve the heating performance and efficiency of the cooking equipment.

[0123] The third heating coil terminal 145c is connected to the first heating coil WC1 and the second heating coil WC2 via a wiring that crosses the center of the first heating coil WC1 and the second heating coil WC2. The third heating coil terminal 145c is disposed on one side of the PCB pattern coil assembly 140 to be connected to the center of the first heating coil WC1 and the second heating coil WC2.

[0124] The first heating coil terminal 145a and the second heating coil terminal 145b can be configured on the right side relative to the third heating coil terminal 145c. Alternatively, the first heating coil terminal 145a and the second heating coil terminal 145b can be configured on the left side relative to the third heating coil terminal 145c.

[0125] The connector 146 can be configured on the left side relative to the third heating coil terminal 145c. Alternatively, the connector 146 can be configured on the right side relative to the third heating coil terminal 145c. The connector 146 can have a plurality of connection ports. A plurality of detection coils 143 and a plurality of temperature sensors 144 can be connected to the corresponding connection ports of the connector 146 via their respective detection wiring 148.

[0126] The outer terminal WC1a of the first heating coil WC1 is connected to the first heating coil terminal 145a, and the inner terminal WC1b of the first heating coil WC1 is connected to the third heating coil terminal 145c via a heating coil wiring 147 that runs through the center of the first heating coil WC1. This connection structure provides an optimal configuration for the heating coil wiring connected to the first heating coil terminal 145a and the outer terminal WC1a of the first heating coil WC1, as well as the heating coil wiring connected to the second heating coil terminal 145b and the outer terminal WC2b of the second heating coil WC2.

[0127] The third heating coil terminal 145c is connected to the inner terminals of the first heating coil WC1 and the second heating coil WC2 via a heating coil wiring 147 that runs through the center of the first heating coil WC1 and the second heating coil WC2, and is positioned on one side of the PCB pattern assembly 140. This connection and configuration structure achieves an optimal wiring path.

[0128] The first heating coil terminal 145a and the second heating coil terminal 145b are positioned to the left or right of the third heating coil terminal 145c. This configuration ensures sufficient space for wiring of the plurality of detection coils 143 and the plurality of temperature sensors 144.

[0129] In addition, by configuring the first heating coil terminal 145a and the second heating coil terminal 145b, which are respectively connected to the first heating coil WC1 and the second heating coil WC2 connected in series, on the same side of the PCB pattern assembly 140, it is possible to ensure the configuration space for the wiring of the plurality of detection coils 143 and the plurality of temperature sensors 144.

[0130] like Figure 6 As shown, in one embodiment of the cooking device, the PCB patterned coil assembly 140 includes a first heating coil WC1, a second heating coil WC2, a third heating coil WC3, and a fourth heating coil WC4.

[0131] The first heating coil WC1 is connected to the first heating coil terminal 145a and is formed by a pattern that rotates clockwise from the outside to the center. The second heating coil WC2 is connected to the second heating coil terminal 145b and is formed by a pattern that rotates counterclockwise from the inside to the outside.

[0132] The third heating coil WC3 is connected to the fourth heating coil terminal 145d, and is formed by a pattern that rotates counterclockwise from the inner center to the outer center. The fourth heating coil WC4 is connected to the fifth heating coil terminal 145e, and is formed by a pattern that rotates clockwise from the outer center to the inner center.

[0133] The spacing of the regions overlapping the center of the detection coil 143 in the patterns of the first heating coil WC1, the second heating coil WC2, the third heating coil WC3, and the fourth heating coil WC4 can be separated by a first distance d1 that is wider than the spacing of the other non-overlapping regions.

[0134] The intervals between the first heating coil WC1 and the second heating coil WC2, as well as the intervals between the third heating coil WC3 and the fourth heating coil WC4, can be separated by a second distance d2, which is wider than the diameter of the space formed at the center of the detection coil 143.

[0135] The first heating coil WC1 and the second heating coil WC2 are connected in series, and the third heating coil WC3 and the fourth heating coil WC4 are connected in series. In addition, the first heating coil WC1 and the second heating coil WC2, which are connected in series, and the third heating coil WC3 and the fourth heating coil WC4, which are connected in series, are connected in parallel with each other.

[0136] For example, the inner terminal WC1b of the first heating coil WC1 and the inner terminal WC2a of the second heating coil WC2 are connected in series through heating coil wiring that runs through the center of the first heating coil WC1 and the second heating coil WC2.

[0137] The inner terminals WC3b of the third heating coil WC3 and WC4a of the fourth heating coil WC4 are connected in series through heating coil wiring that runs through the center of the third heating coil WC3 and the fourth heating coil WC4.

[0138] The first heating coil WC1 and the third heating coil WC3 are connected to the output terminal of the inverter circuit through the first heating coil terminal 145a and the fourth heating coil terminal 145d, and the second heating coil WC2 and the fourth heating coil WC4 are connected to the ground voltage terminal through the second heating coil terminal 145b and the fifth heating coil terminal 145e.

[0139] The first heating coil WC1 receives current supplied from the inverter circuit through the first heating coil terminal 145a. At this time, the current in the first heating coil WC1 flows in a clockwise direction along the heating coil pattern that rotates from the outside to the center in a clockwise direction.

[0140] The second heating coil WC2 receives current supplied from the first heating coil WC1 through its inner terminals. At this time, the current in the second heating coil WC2 flows counterclockwise along the heating coil pattern that rotates from the inner center to the outer side.

[0141] The third heating coil WC3 receives current supplied from the inverter circuit 320 through the fourth heating coil terminal 145d. At this time, the current in the third heating coil WC3 flows counterclockwise along the heating coil pattern that rotates from the outside to the center in a counterclockwise direction.

[0142] The fourth heating coil WC4 receives current supplied from the third heating coil WC3 through its inner terminals. At this time, the current in the fourth heating coil WC4 flows clockwise along the heating coil pattern that rotates from the inner center outwards.

[0143] As described above, the current in the first heating coil WC1 flows in the opposite direction to that in the second heating coil WC2, which is adjacent in the front-rear direction, and the third heating coil WC3, which is adjacent in the left-right direction. Furthermore, the current in the fourth heating coil WC1 flows in the opposite direction to that in the third heating coil WC3, which is adjacent in the front-rear direction, and the second heating coil WC2, which is adjacent in the left-right direction.

[0144] Additionally, the first heating coil WC1 and the second heating coil WC2 are connected in opposite polarities. The third heating coil WC3 and the fourth heating coil WC4 are connected in opposite polarities.

[0145] Additionally, the PCB pattern coil assembly 140 includes a first heating coil terminal 145a, a second heating coil terminal 145b, a third heating coil terminal 145c, a fourth heating coil terminal 145d, a fifth heating coil terminal 145e, and a sixth heating coil terminal 145f. Furthermore, the PCB pattern coil assembly 140 also includes a plurality of detection coils 143, a plurality of temperature sensors 144, and connectors 146.

[0146] The first heating coil terminal 145a, the second heating coil terminal 145b, the third heating coil terminal 145c, the fourth heating coil terminal 145d, the fifth heating coil terminal 145e, the sixth heating coil terminal 145f, and the connector 146 can be disposed on one side of the PCB pattern coil assembly 140.

[0147] For example, the first heating coil terminal 145a and the second heating coil terminal 145b are disposed on the right side relative to the third heating coil terminal 145c, and the connector 146 is disposed on the left side relative to the third heating coil terminal 145c. The fourth heating coil terminal 145d and the fifth heating coil terminal 145e are disposed on the left side relative to the sixth heating coil terminal 145f, and the connector 146 is disposed on the right side relative to the sixth heating coil terminal 145f.

[0148] [Connection relationship between inverter circuit and heating coil]

[0149] Figure 6 A diagram showing the connection structure between heating coils connected in series and parallel in a coil assembly according to an embodiment of the present invention. Figure 7 This is a circuit diagram illustrating the connection relationship between the heating coils connected in series and parallel with the inverter circuit in a cooking device according to an embodiment of the present invention.

[0150] Reference Figure 6 and Figure 7 The cooking equipment includes a load circuit, which includes a rectifier circuit (not shown), an inverter circuit 320, a plurality of resonant capacitors, a plurality of heating coils, and a plurality of relays.

[0151] The rectifier circuit converts an AC voltage whose magnitude and polarity (positive or negative voltage) vary over time into a DC voltage whose magnitude and polarity are constant, and converts an AC current whose magnitude and direction (positive or negative current) vary over time into a DC current whose magnitude is constant and provides it to the inverter circuit 320.

[0152] Inverter circuit 320 receives input voltage from rectifier circuit and, driven by control switches of controller, supplies resonant current to load circuit. Inverter circuit 320 may include a first inverter circuit and a second inverter circuit. The first inverter circuit can supply current to the first to fourth heating coils, and the second inverter circuit can supply current to the fifth to eighth heating coils.

[0153] This inverter circuit 320 includes a plurality of switching elements, such as a first switching element DS1 and a second switching element DS2. The first switching element DS1 and the second switching element DS2 are connected in series between a high-potential voltage terminal and a low-potential voltage terminal. This inverter circuit 320 outputs a resonant current based on the switching of the first switching element DS1 and the second switching element DS2.

[0154] The inverter circuit 320 supplies resonant current to the first heating coil WC1 and the second heating coil WC2, or the third heating coil WC3 and the fourth heating coil WC4, driven by the switching of the first switching element DS1 and the second switching element DS2. The resonant frequency of the resonant current depends on the inductance of the heating coil and the capacitance of the resonant capacitor.

[0155] Under the control of the controller, the first switching element DS1 and the second switching element DS2 can be alternately turned on and off. The alternating on and off of the first switching element DS1 and the second switching element DS2 can be referred to as the switching drive of the first switching element DS1 and the second switching element DS2.

[0156] A resonant current is generated by switching the first switching element DS1 and the second switching element DS2. If a resonant current is supplied to the heating coil, a magnetic field will be formed. Under the action of electromagnetic induction, eddy currents flow in the container provided above the heating coil and heat the container.

[0157] The inverter circuit 320 also includes a first buffer capacitor CS1 and a second buffer capacitor CS2. The first buffer capacitor CS1 is connected in parallel with the first switching element DS1, and the second buffer capacitor CS2 is connected in parallel with the second switching element SW2. The first buffer capacitor CS1 and the second buffer capacitor CS2 are connected in series with each other.

[0158] The first buffer capacitor CS1 and the second buffer capacitor CS2 serve to reduce the power consumption caused by hard switching when the first switching element DS1 and the second switching element DS2 are turned off.

[0159] The load circuit includes a plurality of resonant capacitors, a plurality of heating coils, and a plurality of relays.

[0160] A first resonant capacitor CS1 can also be connected between the output terminal of the inverter circuit 320 and the first heating coil WC1. Additionally, a second resonant capacitor CS2 and a first relay RL1 can be connected between the second heating coil WC2 and the ground voltage terminal.

[0161] Additionally, a third resonant capacitor CS3 can be connected between the output terminal of the inverter circuit 320 and the third heating coil WC3. Furthermore, a fourth resonant capacitor CS4 and a second relay RL2 can be connected between the fourth heating coil WC4 and the ground voltage terminal.

[0162] Additionally, a third relay RL3 may be connected between the third heating coil terminal 145c and the other heating coils of the PCB pattern coil assembly 140. Furthermore, a fourth relay RL4 may be connected between the sixth heating coil terminal 145f and the other heating coils of the PCB pattern coil assembly 140.

[0163] Depending on the size of the container, at least one of the first relay RL1, the second relay RL2, the third relay RL3, and the fourth relay RL4 can be switched on to form a current path.

[0164] For example, when the first relay RL1 is turned on, currents rotating in opposite directions flow in the first heating coil WC1 and the second heating coil WC2, forming a magnetic field. Under the influence of electromagnetic induction, a magnetic field is formed in the container. At this time, the first heating coil WC1 and the second heating coil WC2 generate magnetic fields in directions that cancel each other out, thereby causing the eddy currents in the container to overlap, thus improving the heating performance and efficiency of the cooking equipment.

[0165] When the first relay RL1 and the second relay RL2 are switched on, currents rotating in opposite directions flow in the first heating coil WC1 and the second heating coil WC2, forming magnetic fields. Similarly, currents rotating in opposite directions flow in the third heating coil WC3 and the fourth heating coil WC4, also forming magnetic fields. At this time, the first heating coil WC1 and the second heating coil WC2, as well as the third heating coil WC3 and the fourth heating coil WC4, generate magnetic fields that cancel each other out, causing the eddy currents in the container to overlap, thereby improving the heating performance and efficiency of the cooking equipment.

[0166] As described above, in this invention, heating coils can be connected in opposite polarities, causing current to flow in opposite directions between series-connected heating coils, between adjacent heating coils in the front-to-back direction, and between adjacent heating coils in the left-to-right direction, thereby canceling out the magnetic fields. This results in the superposition of eddy currents in the container, thereby improving the heating performance and efficiency of the cooking equipment.

[0167] The load circuit may include at least one of the following resonant capacitors CS1, CS2, CS3, and CS4 connected in series or in parallel, at least one of the following heating coils WC1, WC2, WC3, and WC4, and at least one of the following relays RL1, RL2, RL3, and RL4.

[0168] The first heating coil WC1 is connected to the first heating coil terminal 145a and is formed by a pattern that rotates clockwise from the outside to the center. The second heating coil WC2 is connected to the second heating coil terminal 145b and is formed by a pattern that rotates counterclockwise from the inside to the outside. The third heating coil WC3 is connected to the fourth heating coil terminal 145d and is formed by a pattern that rotates counterclockwise from the inside to the outside. The fourth heating coil WC4 is connected to the fifth heating coil terminal 145e and is formed by a pattern that rotates clockwise from the outside to the inside.

[0169] The spacing between the regions overlapping the center of the detection coil 143 in the patterns of the first heating coil WC1, the second heating coil WC2, the third heating coil WC3, and the fourth heating coil WC4 can be separated by a first distance d1 wider than the spacing of the other non-overlapping regions. The spacing between the first heating coil WC1 and the second heating coil WC2, and between the third heating coil WC3 and the fourth heating coil WC4, can be separated by a second distance d2 wider than the diameter of the space formed at the center of the detection coil 143.

[0170] The first heating coil WC1 and the third heating coil WC3 are connected to the output terminal of the inverter circuit 320 through the first heating coil terminal 145a and the fourth heating coil terminal 145d, and the second heating coil WC2 and the fourth heating coil WC4 are connected to the ground voltage terminal through the second heating coil terminal 145b and the fifth heating coil terminal 145e.

[0171] The first heating coil WC1 receives current supplied from the inverter circuit 320 through the first heating coil terminal 145a. The second heating coil WC2 receives current supplied from the first heating coil WC1 through its inner terminal. The third heating coil WC3 receives current supplied from the inverter circuit 320 through the fourth heating coil terminal 145d. The fourth heating coil WC4 receives current supplied from the third heating coil WC3 through its inner terminal.

[0172] Resonant capacitors CS1, CS2, CS3, and CS4 can be used to filter the DC component in the output current of inverter circuit 32. Heating coils WC1, WC2, WC3, and WC4 can be used to heat cooking containers using electromagnetic induction. Relays RL1, RL2, RL3, and RL4 can be used to selectively connect heating coils WC1, WC2, WC3, and WC4 in series or parallel with other heating coils driven by other inverter circuits. Furthermore, the resonant frequency of the output current of inverter circuit 320 can be determined based on the inductance values ​​of the selectively series- or parallel-connected heating coils WC1, WC2, WC3, and WC4 and the capacitance values ​​of the resonant capacitors CS1, CS2, CS3, and CS4.

[0173] The load circuit may include a first resonant capacitor CS1 that transmits the resonant current supplied from the inverter circuit 320, a first heating coil WC1 connected in series with the first resonant capacitor CS1, a second heating coil WC2 connected in series with the first heating coil WC1, a second resonant capacitor CS2 connected in series with the second heating coil WC2, and a first relay RL1 that switches the second resonant capacitor CS2 and the ground voltage terminal.

[0174] Additionally, the load circuit may include a third resonant capacitor CS3 for transmitting the resonant current supplied from the inverter circuit 320, a third heating coil WC3 connected in series with the third resonant capacitor CS3, a fourth heating coil WC4 connected in series with the third heating coil WC3, a fourth resonant capacitor CS4 connected in series with the fourth heating coil WC4, and a second relay RL2 for switching the fourth resonant capacitor CS4 and the ground voltage terminal.

[0175] Additionally, the load circuit may include a third relay RL3, which switches the connection between the node between the first heating coil WC1 and the second heating coil WC2 and other heating coils driven by other inverter circuits.

[0176] Additionally, the load circuit may include a fourth relay RL4, which switches the connection between the node between the third heating coil WC3 and the fourth heating coil WC4 and other heating coils driven by other inverter circuits.

[0177] The first relay RL1, the second relay RL2, the third relay RL3, and the fourth relay RL4 can be selectively activated according to the size of the container.

[0178] For example, when the first relay RL1 and the third relay RL3 are switched on, current flows through the first heating coil WC1, the second heating coil WC3, and the other heating coils. At this time, the currents in the first heating coil WC1 and the second heating coil WC2 rotate in opposite directions, and the currents in the second heating coil WC2 and the other heating coils rotate in opposite directions.

[0179] Additionally, for example, when the second relay RL2 and the fourth relay RL4 are switched on, current flows through the third heating coil WC3, the fourth heating coil WC4, and the other heating coils. At this time, the currents in the third heating coil WC3 and the fourth heating coil WC4 rotate in opposite directions, and the currents in the fourth heating coil WC2 and the seventh heating coil WC7 rotate in opposite directions.

[0180] [Stacking and connection structures of PCB pattern assemblies]

[0181] Figure 8 It is used for explanation Figure 2 The diagram shows a schematic cross-sectional view of the structure of an integrated PCB pattern assembly. Figure 9 yes Figure 8 The image shows a top view of the first detection coil layer. Figure 10 yes Figure 8 The top view of the second detection coil layer is shown in the figure. Figure 11 yes Figure 8 The top view of the first to tenth heating coil layers is shown in the figure.

[0182] Reference Figures 8 to 11 One embodiment of the cooking device includes an integral PCB pattern assembly 140 formed by a plurality of heating coils 142 and a plurality of detection coils 143.

[0183] The PCB pattern assembly 140 may include, for example, a first heating coil layer 142a, a second heating coil layer 142b, a third heating coil layer 142c, a fourth heating coil layer 142d, a fifth heating coil layer 142e, a sixth heating coil layer 142f, a seventh heating coil layer 142g, an eighth heating coil layer 142h, a ninth heating coil layer 142j, a tenth heating coil layer 142h, a first detection coil layer 143a, and a second detection coil layer 143b.

[0184] The first heating coil layer 142a, the second heating coil layer 142b, the third heating coil layer 142c, the fourth heating coil layer 142d, the fifth heating coil layer 142e, the sixth heating coil layer 142f, the seventh heating coil layer 142g, the eighth heating coil layer 142h, the ninth heating coil layer 142j, and the tenth heating coil layer 142h are stacked in the vertical direction, and each layer has a plurality of heating coils.

[0185] The first detection coil layer 143a and the second detection coil layer 143b are stacked on top of the first heating coil layer 142a, the second heating coil layer 142b, the third heating coil layer 142c, the fourth heating coil layer 142d, the fifth heating coil layer 142e, the sixth heating coil layer 142f, the seventh heating coil layer 142g, the eighth heating coil layer 142h, the ninth heating coil layer 142j, and the tenth heating coil layer 142h, and each layer has a plurality of detection coils.

[0186] One of the first detection coil layer 143a and the second detection coil layer 143b is provided with heating coil wiring that connects the heating coils to each other or connects the heating coils to heating coil terminals. For example, the first layer 143a, which is the uppermost layer of the stack, may be provided with heating coil wiring.

[0187] The first heating coil layer 142a, the second heating coil layer 142b, the third heating coil layer 142c, the fourth heating coil layer 142d, the fifth heating coil layer 142e, the sixth heating coil layer 142f, the seventh heating coil layer 142g, the eighth heating coil layer 142h, the ninth heating coil layer 142j, and the tenth heating coil layer 142h may include the first heating coil to the eighth heating coil.

[0188] The first heating coil WC1 is formed by a pattern that rotates clockwise from the outside to the inside. The second heating coil WC2 is connected in series with the first heating coil WC1 and is formed by a pattern that rotates counterclockwise from the inside to the outside.

[0189] The third heating coil WC3 is arranged adjacent to the first heating coil WC1 in the vertical direction and is formed by a pattern that rotates counterclockwise from the outside to the inside. The fourth heating coil WC4 is connected in series with the third heating coil WC3 and is formed by a pattern that rotates clockwise from the inside to the outside. The fifth to eighth heating coils can be formed by patterns with shapes symmetrical to the first to fourth heating coils.

[0190] The first heating coil layer 142a, the second heating coil layer 142b, the third heating coil layer 142c, the fourth heating coil layer 142d, the fifth heating coil layer 142e, the sixth heating coil layer 142f, the seventh heating coil layer 142g, the eighth heating coil layer 142h, the ninth heating coil layer 142j, the tenth heating coil layer 142h, the first detection coil layer 143a, and the second detection coil layer 143b include a first outer terminal WC1a connected in the vertical direction and connected to the outside of the first heating coil WC1, a first inner terminal WC1b connected in the vertical direction and connected to the inside of the first heating coil WC1, a second outer terminal WC2b connected in the vertical direction and connected to the outside of the second heating coil WC2, and a second inner terminal WC2a connected in the vertical direction and connected to the inside of the second heating coil.

[0191] Each of the first outer terminal WC1a, the first inner terminal WC1b, the second inner terminal WC2a, and the second outer terminal WC2b is connected in the vertical direction via at least one through hole in the first heating coil layer 142a, the second heating coil layer 142b, the third heating coil layer 142c, the fourth heating coil layer 142d, the fifth heating coil layer 142e, the sixth heating coil layer 142f, the seventh heating coil layer 142g, the eighth heating coil layer 142h, the ninth heating coil layer 142j, the tenth heating coil layer 142h, and the first detection coil layer 143a and the second detection coil layer 143b.

[0192] A first heating coil terminal 145a, a second heating coil terminal 145b, a third heating coil terminal 145c, and a connector 146 are arranged on one side of the first detection coil layer 143a in the front-back direction.

[0193] The first heating coil terminal 145a is connected to the output terminal of the inverter circuit, and the second heating coil terminal 145b is connected to the ground voltage terminal. The third heating coil terminal 145c is connected among the other heating coils. Connector 146 is connected to the container detection circuit. The container detection circuit can detect changes in the equivalent resistance and equivalent inductance of the detection coil, and can detect the presence of a container and at least one of the container materials based on the value of these changes.

[0194] A first heating coil wiring is disposed on the first detection coil layer 143a to connect the first heating coil terminal 145a and the first outer terminal WC1a. A second heating coil wiring is disposed on the first detection coil layer 143a to connect the second heating coil terminal 145b and the second outer terminal WC2b. A third heating coil wiring is disposed on the first detection coil layer 143a to connect the first inner terminal WC1b and the second inner terminal WC2a, and connects the first inner terminal WC1b and the second inner terminal WC2a to the heating coil terminal 145c. The third heating coil wiring is configured to pass through the first heating coil and the second heating coil in the front-back direction.

[0195] A temperature sensor 144 is also disposed at the center of the detection coil 143 in the first detection coil layer 143a. At least one of the first detection coil layer 143a and the second detection coil layer 143b may also be provided with detection coil wiring 148 connecting the detection coil 143 and the temperature sensor 144 to the connector 146. The first heating coil terminal 145a and the second heating coil terminal 145b may be disposed on the right or left side of the first detection coil layer 143a relative to the third heating coil terminal 145c. The connector 146 may be disposed on the left or right side of the first detection coil layer 143a relative to the third heating coil terminal 145c.

[0196] Additionally, for example, heating coil patterns can be formed in the first heating coil layer 142a, the second heating coil layer 142b, the third heating coil layer 142c, the fourth heating coil layer 142d, and the fifth heating coil layer 142e, and a first type of pattern can be configured, wherein the travel direction or winding direction of the individual pattern lines is a first direction. Furthermore, for example, heating coil patterns can be formed in the sixth heating coil layer 142f, the seventh heating coil layer 142g, the eighth heating coil layer 142h, the ninth heating coil layer 142j, and the tenth heating coil layer 142h, and a second type of pattern can be configured, wherein the travel direction or winding direction of the individual pattern lines is a second direction.

[0197] At this time, the first heating coil wiring to the third heating coil wiring formed in the first detection coil layer 143a, the first type pattern disposed in the first heating coil layer 142a, the second heating coil layer 142b, the third heating coil layer 142c, the fourth heating coil layer 142d, and the fifth heating coil layer 142e, and the second type pattern disposed in the sixth heating coil layer 142f, the seventh heating coil layer 142g, the eighth heating coil layer 142h, the ninth heating coil layer 142j, and the tenth heating coil layer 142h can be connected together by a via formed to continuously penetrate from the first detection coil layer 143a to the tenth heating coil layer 142h.

[0198] In addition, insulating layers may be formed between the first heating coil layer 142a, the second heating coil layer 142b, the third heating coil layer 142c, the fourth heating coil layer 142d, the fifth heating coil layer 142e, the sixth heating coil layer 142f, the seventh heating coil layer 142g, the eighth heating coil layer 142h, the ninth heating coil layer 142j, the tenth heating coil layer 142h, as well as the first detection coil layer 143a and the second detection coil layer 143b.

[0199] Additionally, a light-transmitting slot hole H_sl may be provided in the PCB pattern assembly 140. The light-transmitting slot hole H_sl is formed to extend from the first detection coil layer 143a and the second detection coil layer 143b to the first heating coil layer 142a, the second heating coil layer 142b, the third heating coil layer 142c, the fourth heating coil layer 142d, the fifth heating coil layer 142e, the sixth heating coil layer 142f, the seventh heating coil layer 142g, the eighth heating coil layer 142h, the ninth heating coil layer 142j, and the tenth heating coil layer 142h.

[0200] A light source module can be configured below the light-transmitting slit hole H_sl. Visible light generated by the light source module can shine through the light-transmitting slit hole onto the lower surface of the top plate. As a result, a linearly extending display line can be formed on the top plate.

[0201] To achieve a linearly extended display line, the light-transmitting slot hole H_sl can extend linearly corresponding to the shape of the display line. However, as shown in the figure, to prevent a sharp decrease in the rigidity of the PCB pattern assembly 140, the light-transmitting slot hole H_sl can be divided into multiple segments, and the segmented light-transmitting slot holes H_sl can be arranged linearly.

[0202] As described above, in the coil assembly of the embodiment, the heating coil wiring that connects the heating coils to each other or connects the heating coils to the heating coil terminals can be configured in one of the plurality of detection coil layers, thereby eliminating the need for Litz wires to connect the heating coils.

[0203] In addition, in the coil assembly of the embodiment, the heating coil can be disposed on the heating coil layer and the heating coil wiring can be disposed on one of the plurality of detection coil layers, thereby reducing the thickness of the integral PCB pattern assembly.

[0204] In addition, in the coil assembly of the embodiment, the inner terminals between the heating coils can be connected to the inner terminals of one of the plurality of detection coil layers by wiring that runs through the heating coils, thereby enabling optimal configuration of the wiring of the plurality of heating coils.

[0205] In addition, in the coil assembly of the embodiment, the spacing between the patterns of the heating coils in the area overlapping with the detection coil and the spacing between the heating coils can be formed separately by a predetermined distance, thereby ensuring the configuration space for a plurality of detection coils and a plurality of temperature sensors.

[0206] In addition, in the coil assembly of the embodiment, the first heating coil can be formed in a pattern in which the current rotates clockwise from the outside to the center inside, and the second heating coil can be formed in a pattern in which the current rotates counterclockwise from the center inside to the outside, thereby causing the eddy currents in the container to overlap, thereby improving heating performance and efficiency.

[0207] In addition, in the coil assembly of the embodiment, temperature sensors can be arranged at the center of the plurality of detection coils respectively, and a plurality of heating coil terminals connected to the plurality of heating coils, a plurality of detection coils, and connectors connected to the temperature sensors can be arranged on one side of the PCB pattern assembly in the front-back direction. This ensures space for the plurality of detection coils and the plurality of temperature sensors, thereby enabling optimal configuration of the wiring of the plurality of heating coils, the plurality of detection coils, and the temperature sensors.

[0208] In addition, in the coil assembly of the embodiment, a plurality of heating coils, a plurality of detection coils and a plurality of temperature sensors can be formed into an integrated PCB pattern assembly, which can help simplify processes such as masking, printing and etching.

[0209] In addition, in the coil assembly of the embodiment, the heating coil wiring and the detection coil wiring can be formed on the same layer where the detection coil is formed, thereby minimizing the height of the heating coil pattern.

[0210] In addition, in the coil assembly of the embodiment, the heating coil wiring connected in series with the heating coil can be arranged in the detection coil layer in a manner that crosses the heating coil, thereby achieving the optimal wiring path.

[0211] In addition, in the coil assembly of the embodiment, the heating coil terminals, which are respectively connected to the heating coil, can be arranged on one side of the PCB pattern assembly in the front-back direction, thereby ensuring the configuration space for the wiring of the plurality of detection coils and the wiring of the plurality of temperature sensors.

[0212] In addition, in the coil assembly of the embodiment, the heating coil wiring and the detection coil wiring can be formed on the same layer where the detection coil is formed, thereby reducing the number of multiple heating coil layers.

[0213] A coil assembly according to one embodiment of the present invention may include a plurality of heating coil layers formed thereon, stacked vertically and electrically connected, and a plurality of detection coil layers formed thereon, stacked vertically and electrically connected, and stacked on top of the plurality of heating coil layers. Here, the wiring of the plurality of heating coils and the wiring of the plurality of detection coils may be configured in any of the same layer of the plurality of detection coil layers.

[0214] According to one embodiment, a plurality of heating coil layers may include a first heating coil formed by a pattern rotating clockwise from the outside to the inside and a second heating coil formed by a pattern rotating counterclockwise from the inside to the outside.

[0215] According to one embodiment, a plurality of heating coil layers and a plurality of detection coil layers may include a first outer terminal connected in the vertical direction and connected to the outside of a first heating coil, a first inner terminal connected in the vertical direction and connected to the inside of a first heating coil, a second outer terminal connected in the vertical direction and connected to the outside of a second heating coil, and a second inner terminal connected in the vertical direction and connected to the inside of a second heating coil.

[0216] According to one embodiment, in one of a plurality of detection coil layers, a first heating coil terminal, a second heating coil terminal, a third heating coil terminal, and a connector may be disposed on one side in the front-back direction.

[0217] According to one embodiment, one of the plurality of detection coil layers may be configured with a first heating coil wiring connecting a first heating coil terminal and a first outer terminal, a second heating coil wiring connecting a second heating coil terminal and a second outer terminal, and a third heating coil wiring connecting a first inner terminal and a second inner terminal, and connecting the first inner terminal and the second inner terminal to a third heating coil terminal.

[0218] According to one embodiment, in one of the plurality of detection coil layers, a temperature sensor may also be disposed at the center of the detection coil.

[0219] According to one embodiment, at least one of the plurality of detection coil layers may also be configured with detection coil wiring that connects the detection coil and the temperature sensor to the connector.

[0220] According to one embodiment, the wiring of the third heating coil can be configured to traverse the first heating coil and the second heating coil in the front-back direction.

[0221] According to one embodiment, the first heating coil terminal can be connected to the output terminal of the inverter circuit, and the second heating coil terminal can be connected to the ground voltage terminal. The third heating coil terminal can be connected among the other heating coils.

[0222] According to one embodiment, the first heating coil terminal and the second heating coil terminal can be configured on the right or left side relative to the third heating coil terminal, and the connector can be configured on the left or right side relative to the third heating coil terminal.

[0223] According to one embodiment, each of the first outer terminal, the first inner terminal, the second inner terminal, and the second outer terminal can be connected in the vertical direction through at least one via in the plurality of heating coil layers and the plurality of detection coil layers.

[0224] According to one embodiment, a plurality of detection coil layers may include a first detection coil and a second detection coil arranged overlapping on both sides with reference to the center of a first heating coil, and a third detection coil and a fourth detection coil arranged overlapping between the first heating coil and the second heating coil.

[0225] According to one embodiment, the spacing between the patterns of the regions overlapping with the first and second detection coils in the pattern of the first heating coil can be separated by a predetermined distance or more, and the spacing between the first and second heating coils can be separated by a predetermined distance or more, so as to overlap with the third and fourth detection coils.

[0226] A coil assembly according to one embodiment of the present invention may include a first heating coil layer to a tenth heating coil layer having a plurality of heating coils stacked vertically, and a first detection coil layer and a second detection coil layer having a plurality of detection coils stacked on top of the first heating coil layer to the tenth heating coil layer. Here, the plurality of heating coil wiring that interconnects the plurality of heating coils or connects the plurality of heating coils to corresponding heating coil terminals may be configured in one of the first detection coil layer and the second detection coil layer.

[0227] According to one embodiment, the first heating coil layer to the tenth heating coil layer may include a first heating coil formed by a pattern rotating clockwise from the outside to the inside and a second heating coil formed by a pattern rotating counterclockwise from the inside to the outside, wherein the current may circulate in opposite directions in the first heating coil and the second heating coil.

[0228] According to one embodiment, the first heating coil layer to the tenth heating coil layer, the first detection coil layer and the second detection coil layer may include a first outer terminal connected in the vertical direction and connected to the outside of the first heating coil, a first inner terminal connected in the vertical direction and connected to the inside of the first heating coil, a second outer terminal connected in the vertical direction and connected to the outside of the second heating coil, and a second inner terminal connected in the vertical direction and connected to the inside of the second heating coil.

[0229] According to one embodiment, in one of the first detection coil layer and the second detection coil layer, a first heating coil terminal, a second heating coil terminal, a third heating coil terminal, and a connector may be disposed on one side in the front-back direction.

[0230] According to one embodiment, one of the first detection coil layer and the second detection coil layer may be configured with a first heating coil wiring connecting the first heating coil terminal and the first outer terminal, a second heating coil wiring connecting the second heating coil terminal and the second outer terminal, and a third heating coil wiring connecting the first inner terminal and the second inner terminal, and connecting the first inner terminal and the second inner terminal to the third heating coil terminal.

[0231] According to one embodiment, in one of the first detection coil layer and the second detection coil layer, a temperature sensor may be disposed at the center of the detection coil, and at least one of the first detection coil layer and the second detection coil layer may be disposed with a plurality of detection coil wirings that connect the detection coil and the temperature sensor to the connector.

[0232] The present invention has been described with reference to the embodiments shown in the accompanying drawings, but these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent embodiments are possible. Therefore, the true scope of protection of the present invention should be determined by the scope of the appended claims.

Claims

1. A coil assembly, wherein, include: Multiple heating coil layers are formed, which are stacked in the vertical direction and electrically connected; as well as A plurality of detection coil layers are formed with a plurality of detection coils, which are stacked vertically and electrically connected, and are stacked on top of the plurality of heating coil layers; The wiring of the plurality of heating coils and the wiring of the plurality of detection coils are arranged in any one of the same layers of the plurality of detection coil layers.

2. The coil assembly according to claim 1, wherein, The plurality of said heating coil layers include: The first heating coil is formed by a pattern rotating clockwise from the outside to the inside; and The second heating coil is formed by a pattern that rotates counterclockwise from the inside to the outside.

3. The coil assembly according to claim 2, wherein, The plurality of heating coil layers and the plurality of detection coil layers include: The first outer terminal is connected in the vertical direction and connected to the outer side of the first heating coil; The first inner terminal is connected in the vertical direction and is connected to the inner side of the first heating coil; The second outer terminal is connected vertically and to the outer side of the second heating coil; and The second inner terminal is connected in the vertical direction and is connected to the inner side of the second heating coil.

4. The coil assembly according to claim 3, wherein, In one of the plurality of detection coil layers, a first heating coil terminal, a second heating coil terminal, a third heating coil terminal, and a connector are arranged on one side in the front-back direction.

5. The coil assembly according to claim 4, wherein, One of the plurality of said detection coil layers is configured with: The first heating coil wiring connects the first heating coil terminal and the first outer terminal; The second heating coil wiring connects the second heating coil terminal and the second outer terminal; as well as The third heating coil wiring connects the first inner terminal and the second inner terminal, and connects the first inner terminal and the second inner terminal to the third heating coil terminal.

6. The coil assembly according to claim 5, wherein, In one of the plurality of detection coil layers, a temperature sensor is also disposed at the center of the detection coil.

7. The coil assembly according to claim 6, wherein, At least one of the plurality of detection coil layers is further provided with detection coil wiring that connects the detection coil and the temperature sensor to the connector.

8. The coil assembly according to claim 5, wherein, The wiring of the third heating coil is configured to traverse the first heating coil and the second heating coil in the front-to-back direction.

9. The coil assembly according to claim 5, wherein, The first heating coil terminal is connected to the output terminal of the inverter circuit, and the second heating coil terminal is connected to the ground voltage terminal.

10. The coil assembly according to claim 5, wherein, The third heating coil terminal is connected between the other heating coils.

11. The coil assembly according to claim 4, wherein, The first heating coil terminal and the second heating coil terminal are disposed on the right or left side relative to the third heating coil terminal; The connector is positioned on the left or right side relative to the third heating coil terminal.

12. The coil assembly according to claim 3, wherein, Each of the first outer terminal, the first inner terminal, the second inner terminal, and the second outer terminal is connected in the vertical direction through at least one through hole in the plurality of heating coil layers and the plurality of detection coil layers.

13. The coil assembly according to claim 2, wherein, The plurality of the detection coil layers include: The first detection coil and the second detection coil are arranged overlappingly on both sides with the center of the first heating coil as a reference; and The third and fourth detection coils are arranged overlappingly between the first and second heating coils.

14. The coil assembly of claim 13, wherein, The patterns of the first heating coil and the second heating coil are separated by a predetermined distance or more between the areas of their patterns that overlap with those of the first and second detection coils, and are configured to overlap with the third and fourth detection coils.

15. A coil assembly, wherein, include: From the first heating coil layer to the tenth heating coil layer, a plurality of heating coils are formed and stacked in the vertical direction; as well as The first detection coil layer and the second detection coil layer are formed with a plurality of detection coils and are stacked on the upper part of the first heating coil layer to the tenth heating coil layer; A plurality of heating coil wirings, which interconnect or connect the plurality of heating coils to corresponding heating coil terminals, are configured in one of the first detection coil layer and the second detection coil layer.

16. The coil assembly of claim 15, wherein, The first heating coil layer to the tenth heating coil layer include: The first heating coil is formed by a pattern rotating clockwise from the outside to the inside; and The second heating coil is formed by a pattern that rotates counterclockwise from the inside to the outside; In the first heating coil and the second heating coil, the current circulates in opposite directions.

17. The coil assembly of claim 16, wherein, The first heating coil layer to the tenth heating coil layer, as well as the first detection coil layer and the second detection coil layer, comprise: The first outer terminal is connected in the vertical direction and connected to the outer side of the first heating coil; The first inner terminal is connected in the vertical direction and is connected to the inner side of the first heating coil; The second outer terminal is connected vertically and to the outer side of the second heating coil; and The second inner terminal is connected in the vertical direction and is connected to the inner side of the second heating coil.

18. The coil assembly of claim 17, wherein, In one of the first detection coil layer and the second detection coil layer, a first heating coil terminal, a second heating coil terminal, a third heating coil terminal, and a connector are arranged on one side in the front-back direction.

19. The coil assembly of claim 18, wherein, One of the first detection coil layer and the second detection coil layer is configured with: The first heating coil wiring connects the first heating coil terminal and the first outer terminal; The second heating coil wiring connects the second heating coil terminal and the second outer terminal; as well as The third heating coil wiring connects the first inner terminal and the second inner terminal, and connects the first inner terminal and the second inner terminal to the third heating coil terminal.

20. The coil assembly of claim 19, wherein, In one of the first detection coil layer and the second detection coil layer, a temperature sensor is also disposed at the center of the detection coil. At least one of the first detection coil layer and the second detection coil layer is further configured with a plurality of detection coil wirings that connect the detection coil and the temperature sensor to the connector.

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