Chip bonding mechanism, die bonding apparatus, and chip bonding method

Abstract

This invention discloses a chip bonding mechanism, die bonding equipment, and chip bonding method, relating to the field of semiconductor processing technology. The chip bonding mechanism is used to bond chips to dispensing labels on a strip of material, the strip having multiple rows and columns of dispensing labels. The chip bonding mechanism includes a support structure, a moving component, a vision component, and a bonding module. The moving component can reciprocate along a first direction perpendicular to the strip transport direction. The vision component and the bonding module are mounted on the moving component. During the bonding process of a single row of multiple columns of dispensing labels, the strip position is fixed, and the moving component drives the bonding module and the vision component to move, so that the bonding module sequentially bonds chips to the single row of multiple columns of dispensing labels. This invention requires only a single set of vision components and bonding modules to reciprocate, achieving efficient and high-precision bonding of multiple rows of chips, solving the technical problem of chip bonding mechanisms struggling to balance cost and control accuracy during the bonding process.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a chip bonding mechanism, die bonding equipment, and chip bonding method. Background Technology

[0002] Chip bonding equipment has evolved from single-row processing to multi-row parallel processing. Early equipment mostly adopted a horizontal layout, arranging components such as adhesive spraying, chip bonding, and curing linearly along the direction of the material strip, and using ejector pins and flipping mechanisms to achieve chip-by-chip mounting in a single row. With the increasing demand for production capacity in fields such as display driver chips and memory chips, multi-row chip bonding equipment has become the industry mainstream. The core of multi-row chip bonding equipment lies in the dispensing of adhesive to multiple rows of labels on the substrate (i.e., the material strip) and the mounting of chips.

[0003] Currently, the chip bonding mechanism in multi-row chip bonding equipment mainly adopts two technical approaches. One is the parallel multi-mechanism type, where each row is independently configured with a complete chip placement mechanism, and multi-row parallel processing is achieved through hardware stacking. The other is the single-mechanism platform moving type, which uses only one placement mechanism. By driving the adsorption hub platform carrying the material tape to move back and forth over a wide range along the direction perpendicular to the material tape's running direction, the material tape and the labels on the material tape sequentially enter the processing head of the chip bonding mechanism to complete the bonding and placement.

[0004] However, both of the above-mentioned chip mounting and bonding methods in current multi-row chip bonding equipment have shortcomings. Although the multi-parallel solution is fast, the multiple sets of high-precision vision and mounting mechanisms lead to a sharp increase in equipment costs. While the single-mechanism platform moving solution saves hardware costs, the adsorption hub platform is a large inertia platform, and the long stroke reciprocating motion of the large inertia platform makes it difficult to guarantee control accuracy.

[0005] Therefore, there is an urgent need for a new chip bonding mechanism to solve the problem that chip bonding mechanisms cannot balance cost and control accuracy during the chip bonding process. Summary of the Invention

[0006] The main objective of this invention is to propose a chip bonding mechanism, a die bonding device, and a chip bonding method, aiming to solve the problem that chip bonding mechanisms are difficult to balance between cost and control accuracy during the chip bonding process.

[0007] To achieve the above objectives, the chip bonding mechanism proposed in this invention is used to bond chips to dispensing labels on a strip. The strip has a transport direction, and multiple rows and columns of dispensing labels are arrayed on the strip. The chip bonding mechanism includes a support structure, a moving component, a vision component, and a bonding module. The moving component is movably mounted on the support structure and can reciprocate along a first direction. The first direction is perpendicular to the transport direction and parallel to the surface of the strip. The vision component is mounted on the moving component. The bonding module is mounted on the moving component and is used to adsorb and place chips. During the chip bonding process of a single row and multiple columns of dispensing labels, the position of the strip is fixed, and the moving component drives the bonding module and the vision component to move, so that the bonding module sequentially bonds chips to the single row and multiple columns of dispensing labels.

[0008] In one embodiment, the bonding module includes a driving structure and a multi-arm bonding structure. The driving structure is mounted on a moving component and is drively connected to the multi-arm bonding structure. The multi-arm bonding structure has at least two bonding arms, and each bonding arm has a suction nozzle at its end. The suction nozzle is used to pick up and place chips. The driving structure is used to drive the multi-arm bonding structure to rotate so that at least two bonding arms pass through the die bonding station in sequence, thereby allowing the suction nozzles corresponding to each bonding arm to pick up chips from the chip transfer mechanism in sequence at the die bonding station. The driving structure is also used to drive the multi-arm bonding structure to rotate to the bonding station so that the suction nozzles rotate to correspond to the position of the dispensing label.

[0009] In one embodiment, the vision component includes a first vision sensor, a second vision sensor, and a mounting adjustment component. The first vision sensor is used to locate and identify dispensing labels on the material strip; the second vision sensor is used to perform quality inspection on the bonding labels of the bonded chips; the nozzle located at the bonding station is the target nozzle; the first and second vision sensors are mounted on a moving component via the mounting adjustment component; the mounting adjustment component is used to adjust the spatial pose of the first and second vision sensors relative to the target nozzle, so that the target nozzle, the first vision sensor, and the second vision sensor are arranged in the same row or staggered.

[0010] In one embodiment, the first vision sensor is locked onto the mounting adjustment member in a first pose, so that the field of view of the first vision sensor covers the target nozzle and the dispensing label corresponding to the target nozzle; in a same-row layout, the second vision sensor is locked onto the mounting adjustment member in a second pose, so that the center of the field of view of the second vision sensor, the center of the field of view of the first vision sensor, and the direction in which the target nozzle is facing converge at the same point; in a staggered layout, the second vision sensor is locked onto the mounting adjustment member in a third pose, so that the center of the field of view of the second vision sensor has a preset distance from the center of the field of view of the first vision sensor along the transport direction, so that when both the target nozzle and the first vision sensor correspond to the (m+n)th row of dispensing labels, the center of the field of view of the second vision sensor corresponds to the mth row of binding labels; wherein m and n are both positive integers, and the row numbers of the dispensing labels and binding labels gradually decrease along the transport direction.

[0011] In one embodiment, the mounting adjustment member has an arc-shaped adjustment hole, the plane of which the arc of the adjustment hole extends is perpendicular to the first direction, and the mounting adjustment member has an angle scale around the adjustment hole; a first visual sensor and a second visual sensor are each mounted on the mounting adjustment member through the adjustment hole; the first visual sensor is configured to be movable along the extension direction of the adjustment hole and rotatable about the mounting axis of the first visual sensor, and its position and angle can be locked; the second visual sensor is configured to be movable along the extension direction of the adjustment hole and rotatable about the mounting axis of the second visual sensor, and its position and angle can be locked; and / or, the moving component includes a first motion module and a second motion module, the first motion module is movably mounted on the support structure and can reciprocate along the first direction, and the first motion module is equipped with the mounting adjustment member; the second motion module is movably mounted on the support structure and can reciprocate along the first direction, and the second motion module is equipped with a drive structure.

[0012] The present invention also proposes a die bonding device, including a die picking mechanism, a chip transfer mechanism, and the aforementioned chip bonding mechanism; the die picking mechanism is used to eject the chip from the blue film; the chip transfer mechanism is provided with at least two flipping arms, and the chip transfer mechanism is used to drive at least two flipping arms to rotate sequentially to the die picking station so that at least two flipping arms sequentially adsorb the chip; the chip transfer mechanism is also used to drive at least two flipping arms to rotate sequentially to the die bonding station and release the chip.

[0013] The present invention also proposes a chip bonding method, applied to a chip bonding mechanism, the chip bonding method comprising: The multi-arm bonding structure is moved to the die bonding area and rotated so that multiple bonding arms on the multi-arm bonding structure pass through the die bonding station in sequence to adsorb chips in batches. The control vision component and the multi-arm binding structure move collaboratively along a first direction to the target mounting column on the material strip; wherein, the first direction is perpendicular to the transport direction of the material strip; The first vision sensor of the vision component is triggered to capture and locate the adhesive label on the material strip; Based on the positioning results, position and angle compensation are performed on the multi-arm bonding structure, so that one of the bonding arms moves to the bonding station and attaches the chip to the dispensing label; Control the vision component and the multi-arm bonding structure to move along the first direction to the next column of the dispensing labels in the same row, and simultaneously control the multi-arm bonding structure to rotate, switch the next bonding arm to the bonding station, and sequentially perform chip mounting on all columns of the dispensing labels in the same row; Once all the adhesive labels in the same row have been applied, the drive hub rotates, moving the next row of adhesive labels to the processing area, so that the chip is applied to each row and each column of adhesive labels in sequence.

[0014] In one embodiment, the chip bonding mechanism has a same-row layout mode and a staggered layout mode; In the same-row layout mode, after the step of performing position and angle compensation on the multi-arm bonding structure according to the positioning result, so that one of the bonding arms moves to the bonding station and the chip is attached to the dispensing label, the method further includes: The second vision sensor of the vision component is triggered to capture and detect the attached label of the chip; In the staggered layout mode, the step of performing position and angle compensation on the multi-arm bonding structure based on the positioning result, so that one of the bonding arms moves to the bonding station, and attaching the chip to the dispensing label includes: Based on the positioning results, position and angle compensation are performed on the multi-arm binding structure so that one of the binding arms is aligned with the dispensing label in the (m+n)th row; One of the binding arms is controlled to perform chip mounting on the dispensing labels in the (m+n)th row, and the second vision sensor is simultaneously triggered to capture and detect the binding labels in the mth row; where m and n are positive integers, and the row numbers of the dispensing labels and the binding labels gradually decrease in the transport direction.

[0015] In one embodiment, the step of sequentially attaching chips to each row and each column of the dispensing labels includes: After the batch of chips are mounted on the multi-arm bonding structure, the current mounting station is recorded as a chip-deficient station, and the multi-arm bonding structure is controlled to return to the die bonding area and rotate, so that multiple empty bonding arms pass through the die bonding station in sequence to load the next batch of chips in batches. After the chip is reloaded, the multi-arm bonding structure is moved to the missing chip station and the mounting operation continues to mount the chip on each row and column of the dispensing label in sequence.

[0016] In one embodiment, the step of moving the multi-arm bonding structure to the die-attachment area and rotating it, so that multiple bonding arms on the multi-arm bonding structure sequentially pass through the die-attachment station to batch-attach chips, includes: Move the multi-arm bonding structure to the junction region; The chip is ejected from the blue film and moved to the chip removal station; The multiple flipping arms of the control chip transfer mechanism rotate so that the multiple flipping arms pass through the chip picking station in sequence and pick up the chip, and then pass through the chip receiving station in sequence and release the chip. The multi-arm bonding structure is rotated so that multiple bonding arms pass sequentially through the die-attaching station to adsorb the chips in batches.

[0017] The technical solution of this invention involves setting up a movable component that can reciprocate along a first direction, and mounting a vision component and a bonding module together on this movable component, so that the vision component and the bonding module can move synchronously along the first direction as a whole structure. Since the first direction is perpendicular to the transport direction of the material strip, and the position of the material strip is fixed during chip bonding of a single row of multi-column dispensing labels, this whole structure can directly cover the processing positions of different columns in the same row of the material strip by moving. Compared with the traditional technology that drives a large-inertia adsorption hub platform carrying the material strip to move laterally, this solution changes the object of lateral movement from the entire large-mass platform to a lightweight movable component and its mounted functional modules, thereby significantly reducing the inertia of the moving parts. The lightweight, low-inertia moving component enables faster acceleration and deceleration response, higher reciprocating positioning accuracy, and smoother operation. Furthermore, through structural isolation design, the moving component avoids direct contact with the high-inertia adsorption hub platform and its feed strip. Therefore, vibrations and inertial impacts generated by the moving component's movement along the first direction are not directly transmitted to the feed strip, significantly reducing the interference of the reciprocating positioning motion along the first direction on the feed strip positioning reference during chip bonding. Simultaneously, the constant relative position between the vision component and the bonding module ensures a high degree of consistency between the vision component's measurement reference and the bonding module's execution reference, eliminating Abbe errors and dynamic positioning errors that may be introduced by platform movement and significantly shortening the accuracy transfer chain in multi-row processing. Therefore, this chip bonding mechanism requires only a single vision component and bonding module, combined with lightweight lateral movement, to achieve efficient and high-precision bonding of multiple rows of chips. This solves the technical problem of balancing cost and control accuracy in chip bonding mechanisms, achieving a leap in bonding accuracy while effectively controlling equipment costs. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 A schematic diagram of a chip bonding mechanism according to an embodiment of the present invention; Figure 2 This is a schematic diagram of a structure of an embodiment of the die bonding device provided by the present invention; Figure 3 This is a schematic diagram of the dispensing mechanism in one embodiment of the die bonding equipment provided by the present invention; Figure 4This is a flowchart illustrating the first embodiment of the chip bonding method provided by the present invention; Figure 5 This is a flowchart illustrating the third embodiment of the chip bonding method provided by the present invention. Figure 6 This is a flowchart illustrating the fourth embodiment of the chip bonding method provided by the present invention.

[0020] Explanation of icon numbers: 1. Chip bonding mechanism; 11. Support structure; 12. Moving component; 121. First motion module; 122. Second motion module; 13. Vision component; 131. First vision sensor; 132. Second vision sensor; 133. Mounting adjustment component; 1331. Adjustment hole; 14. Bonding module; 141. Drive structure; 142. Multi-arm bonding structure; 1421. Bonding arm; 1422. Nozzle; 2. Chip transfer mechanism; 3. Dispensing mechanism.

[0021] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0023] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0024] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0025] Chip bonding equipment has evolved from single-row processing to multi-row parallel processing. Early equipment mostly adopted a horizontal layout, arranging components such as adhesive spraying, chip bonding, and curing linearly along the direction of the material strip, and using ejector pins and flipping mechanisms to achieve chip-by-chip mounting in a single row. With the increasing demand for production capacity in fields such as display driver chips and memory chips, multi-row chip bonding equipment has become the industry mainstream. The core of multi-row chip bonding equipment lies in the dispensing of adhesive to multiple rows of labels on the substrate (i.e., the material strip) and the mounting of chips.

[0026] Currently, the chip bonding mechanism in multi-row chip bonding equipment mainly adopts two technical approaches. One is the parallel multi-mechanism type, where each row is independently configured with a complete chip placement mechanism, and multi-row parallel processing is achieved through hardware stacking. The other is the single-mechanism platform moving type, which uses only one placement mechanism. By driving the adsorption hub platform carrying the material tape to move back and forth over a wide range along the direction perpendicular to the material tape's running direction, the material tape and the labels on the material tape sequentially enter the processing head of the chip bonding mechanism to complete the bonding and placement.

[0027] However, both of the above-mentioned chip mounting and bonding methods in current multi-row chip bonding equipment have shortcomings. Although the multi-parallel solution is fast, the multiple sets of high-precision vision and mounting mechanisms lead to a sharp increase in equipment costs. While the single-mechanism platform moving solution saves hardware costs, the adsorption hub platform is a large inertia platform, and the long stroke reciprocating motion of the large inertia platform makes it difficult to guarantee control accuracy.

[0028] Therefore, there is an urgent need for a new chip bonding mechanism to solve the problem that chip bonding mechanisms cannot balance cost and control accuracy during the chip bonding process.

[0029] To address the above problems, this invention proposes a chip bonding mechanism.

[0030] Please see Figure 1 and Figure 2In one embodiment of the present invention, the chip bonding mechanism 1 is used to bond chips to adhesive labels on a strip. The strip has a transport direction and multiple rows and columns of adhesive labels are arrayed on the strip. The chip bonding mechanism 1 includes a support structure 11, a moving component 12, a vision component 13, and a bonding module 14. The moving component 12 is movably disposed on the support structure 11 and can reciprocate along a first direction. The first direction is perpendicular to the transport direction and parallel to the surface of the strip. The vision component 13 is mounted on the moving component 12. The bonding module 14 is mounted on the moving component 12 and is used to adsorb and place chips. During the chip bonding process of the single row and multiple columns of adhesive labels, the position of the strip is fixed, and the moving component 12 drives the bonding module 14 and the vision component 13 to move, so that the bonding module 14 sequentially bonds chips to the single row and multiple columns of adhesive labels.

[0031] It should be noted that the arrangement direction of each row of adhesive labels is perpendicular to the transport direction of the conveyor belt, that is, the arrangement direction of each row of adhesive labels is parallel to the first direction; the arrangement direction of each column of adhesive labels is parallel to the transport direction of the conveyor belt, that is, the arrangement direction of each column of adhesive labels is perpendicular to the first direction.

[0032] The technical solution of this invention provides a movable component 12 that can reciprocate along a first direction, and mounts a vision component 13 and a bonding module 14 together on the movable component 12, enabling the vision component 13 and the bonding module 14 to move synchronously along the first direction as a single structure. Since the first direction is perpendicular to the transport direction of the material strip, and the position of the material strip is fixed during chip bonding of a single-row, multi-column adhesive label, this overall structure can directly cover the processing positions of different columns in the same row of the material strip by moving. Compared to the conventional solution that drives a large-inertia adsorption hub platform carrying the material strip to move laterally, this solution changes the object of lateral movement from the entire large-mass platform to the lightweight movable component 12 and its mounted functional modules, thereby significantly reducing the inertia of the moving parts. The lightweight, low-inertia moving component 12 enables faster acceleration and deceleration response, higher reciprocating positioning accuracy, and smoother operation. Furthermore, through structural isolation design, the moving component 12 avoids direct contact with the high-inertia adsorption hub platform and the material strip on it. Therefore, the vibrations and inertial impacts generated by the movement of the moving component 12 along the first direction are not directly transmitted to the material strip, significantly reducing the interference of the reciprocating positioning motion along the first direction on the material strip positioning reference during chip bonding. Simultaneously, the relative position between the vision component 13 and the bonding module 14 remains constant, ensuring a high degree of consistency between the measurement reference of the vision component 13 and the execution reference of the bonding module 14. This eliminates Abbe errors and dynamic positioning errors that may be introduced by platform movement, significantly shortening the accuracy transmission chain in multi-row processing. Therefore, this chip bonding mechanism 1 requires only a single set of vision component 13 and bonding module 14, combined with lightweight lateral movement, to achieve efficient and high-precision bonding of multiple rows of chips. This solves the technical problem of balancing cost and control accuracy in the chip bonding mechanism 1 during the bonding process, achieving a leap in bonding accuracy while effectively controlling equipment costs.

[0033] It should be noted that the material strip refers to the flexible substrate or strip material that carries the chip, with multiple adhesive labels arrayed on its surface, each label corresponding to the position of a chip to be mounted. The transport direction refers to the direction in which the material strip continuously moves forward or progresses along the production line, usually denoted as the machine direction. The first direction refers to the horizontal direction perpendicular to the transport direction and parallel to the surface of the material strip, usually denoted as the transverse direction. The moving component 12 is a transmission platform that drives the vision component 13 and the bonding module 14 to move together along the first direction. The vision component 13 is an assembly containing one or more industrial cameras and image processing units, used to identify the target position. The bonding module 14 is an end effector that performs chip pick-and-place and pressing actions.

[0034] In the specific operation, the conveyor belt moves along its transport direction, causing a row of adhesive labels on it to enter the working area of ​​the chip bonding mechanism 1. The conveyor belt then remains stationary, waiting for the bonding module 14 to perform the chip bonding operation. The moving component 12 receives instructions from the control system and drives the vision component 13 and the bonding module 14, mounted on it, as a whole, to move rapidly along the first direction to directly above the adhesive label in the target column (e.g., column N) of the row. The vision component 13 takes a picture of the adhesive label in that column to determine its precise positional deviation. The bonding module 14 performs micro-motion compensation based on this deviation and then precisely bonds the adsorbed chip to the adhesive label. After completing the bonding of one column, the moving component 12 continues to move along the first direction to the next column in the same row (column N+1), repeating the above positioning and bonding process until all columns in the row are bonded and bonded. Subsequently, the tape moves along the transport direction to the next row, and the moving component 12 moves in the opposite or forward direction to begin binding and attaching the new row column by column; during the binding and attaching of the new row of adhesive labels, the tape position is fixed and remains stationary.

[0035] As an optional implementation, the support structure 11 can be a fixed frame made of aluminum alloy profiles or a marble platform, providing a rigid foundation for the entire mechanism. The moving component 12 may include linear guides, ball screws, and servo motors, or a linear motor module, to achieve high-precision linear reciprocating motion. The vision component 13 can be fixed to the mounting plate of the moving component 12 with screws, its optical axis perpendicular to the surface of the conveyor belt. The binding module 14 is also rigidly connected to the moving component 12 with screws, ensuring a constant relative positional relationship between it and the vision component 13. The vision component 13 and the binding module 14 can be arranged side by side along the first direction, or compactly stacked according to spatial layout requirements.

[0036] Please see Figures 1 to 3 In an embodiment of the present invention, the bonding module 14 includes a driving structure 141 and a multi-arm bonding structure 142. The driving structure 141 is mounted on the moving component 12 and is connected to the multi-arm bonding structure 142. The multi-arm bonding structure 142 has at least two bonding arms 1421, and each bonding arm 1421 has a suction nozzle 1422 at its end. The suction nozzle 1422 is used to adsorb and place chips. The driving structure 141 is used to drive the multi-arm bonding structure 142 to rotate so that at least two bonding arms 1421 pass through the die bonding station in sequence, so that the suction nozzle 1422 corresponding to each bonding arm 1421 adsorbs the chips from the chip transfer mechanism 2 in sequence at the die bonding station. The driving structure 141 is also used to drive the multi-arm bonding structure 142 to rotate to the bonding station so that the suction nozzle 1422 rotates to the position corresponding to the dispensing label.

[0037] In this embodiment, the bonding module 14 further employs a combination of a drive structure 141 and a multi-arm bonding structure 142. The drive structure 141 drives the multi-arm bonding structure 142 to rotate, allowing multiple bonding arms 1421 to sequentially pass through the die-attaching station, achieving batch sequential chip adsorption. This batch loading mode allows the multi-arm bonding structure 142 to carry multiple chips in a single loading stroke. In subsequent multi-column placement processes, the drive structure 141 only needs to rotate the multi-arm bonding structure 142 to quickly switch different bonding arms 1421 to the bonding station, sequentially placing the batch-loaded chips onto different columns of the same row. This process achieves decoupling and parallelization of chip loading before placement and chip supply during placement in terms of time and action. Compared to the traditional single-arm bonding head that needs to return to retrieve a chip after each chip is placed, this solution significantly reduces the number of long-distance reciprocating movements of the bonding module 14 between the placement station and the die-attaching station. The moving component 12 only needs to move a short distance between rows along the first direction, while the multi-arm bonding structure 142 can switch chips by rotation, significantly improving the overall cycle time and efficiency of multi-row placement. At the same time, the number of nozzles 1422 can be flexibly configured according to production capacity requirements (such as 6 arms, 8 arms, 10 arms), providing a high degree of flexibility for expanding the production capacity of the equipment.

[0038] It should be noted that the drive structure 141 is a device that provides rotational power, typically including a servo motor and a reducer. The multi-arm bonding structure 142 is a rotatable turntable or star-shaped support with multiple bonding arms 1421 evenly distributed along its circumference. The bonding arms 1421 are cantilevered components used to perform chip pick-and-place operations. The die bonding station is a fixed location in the space where the nozzles 1422 of the multi-arm bonding structure 142 mate with the upstream chip transfer mechanism 2 to receive chips. The bonding station is another fixed location in the space where the nozzles 1422 of the multi-arm bonding structure 142 align with the dispensing labels on the tape for chip mounting.

[0039] In the specific operation, when chips need to be loaded, the drive structure 141 drives the multi-arm bonding structure 142 to rotate, causing the bonding arms 1421 on it to pass through the die-attaching station in sequence. Whenever a bonding arm 1421 rotates to the die-attaching station, the suction nozzle 1422 on that arm activates a vacuum, adsorbing the chips delivered by the chip transfer mechanism 2, thus achieving batch loading of chips. After loading is complete, the moving component 12 moves as a whole, allowing the multi-arm bonding structure 142 to reach the target mounting position. Subsequently, the drive structure 141 drives the multi-arm bonding structure 142 to rotate again, precisely rotating one of the bonding arms 1421 with the adsorbed chip to the bonding station, aligning its end suction nozzle 1422 with the target adhesive label on the tape in space. After position compensation, the bonding arm 1421 descends for mounting. After mounting is completed, the drive structure 141 continues to rotate, switching the next bonding arm 1421 with the adsorbed chip to the bonding station, preparing for the next row of mounting.

[0040] As an optional implementation, the multi-arm bonding structure 142 can adopt a circumferentially distributed design with 6 or 8 arms. The drive structure 141 can adopt a hollow direct drive motor (DD motor) to simplify wiring and improve rotational accuracy. The multi-arm bonding structure 142 is directly mounted on the rotor of the DD motor. The end nozzle 1422 of the bonding arm 1421 can be designed as a mechanism capable of independent Z-axis lifting and rotation around its own axis to fine-tune the mounting height and chip angle. The die-attaching station and the bonding station can be arranged at two fixed angular positions on the rotation circumference of the multi-arm bonding structure 142, for example, the die-attaching station is located at 0° and the bonding station is located at 180°.

[0041] Please see Figure 1 In an embodiment of the present invention, the vision component 13 includes a first vision sensor 131, a second vision sensor 132, and a mounting adjustment component 133. The first vision sensor 131 is used to locate and identify the dispensing label on the material strip; the second vision sensor 132 is used to perform quality inspection on the bonding label of the bonded chip; the suction nozzle 1422 located at the bonding station is the target suction nozzle 1422; the first vision sensor 131 and the second vision sensor 132 are mounted on the moving component 12 through the mounting adjustment component 133; the mounting adjustment component 133 is used to adjust the spatial pose of the first vision sensor 131 and the second vision sensor 132 relative to the target suction nozzle 1422, so that the target suction nozzle 1422, the first vision sensor 131 and the second vision sensor 132 form a same-row layout or a staggered layout.

[0042] In this embodiment, the vision component 13 is further configured with a first vision sensor 131, a second vision sensor 132, and a mounting adjustment component 133 for adjusting their positions. Through this mounting adjustment component 133, the operator can flexibly configure the relative spatial positions of the target nozzle 1422, the first vision sensor 131, and the second vision sensor 132, thereby freely switching between two working modes: a same-row layout and a staggered layout. In the same-row layout, an integrated, real-time closed-loop system for positioning, attaching, and detecting labels in the same column can be achieved, ensuring controllable quality in this process. In the staggered layout, utilizing the continuous stepping characteristic of the conveyor belt along the transport direction, the detection position of the second vision sensor 132 is spatially staggered by the mounting adjustment component 133. This allows the equipment to perform quality re-inspection on the chips in the preceding column that have already been attached and transported multiple rows while attaching the current column. At this point, the adhesive layer in the preceding column has undergone sufficient compression and stabilization, and the detection results more accurately reflect the final product status. This approach allows for the parallel execution of both the mounting and re-inspection processes, increasing output per unit time, while also ensuring the accuracy and reliability of the inspection. The presence of the installation adjustment component 133 enables the equipment to quickly switch to the most suitable operating mode based on different process requirements such as adhesive characteristics and production line speed, greatly enhancing the equipment's process adaptability and intelligence level.

[0043] It should be noted that the first vision sensor 131 is a positioning camera used for pre-processing guidance. The second vision sensor 132 is an inspection camera used for post-processing inspection. The mounting adjustment component 133 is a mechanical connection assembly that allows the vision sensors to be adjusted and locked in multiple degrees of freedom. A parallel layout refers to a configuration where the detection / execution centers of the first vision sensor 131, the second vision sensor 132, and the target nozzle 1422 are on the same straight line or very close to each other along the first direction or perpendicular to the surface of the conveyor belt. A staggered layout refers to a configuration where the detection center of the second vision sensor 132 is intentionally separated from the positioning center of the first vision sensor 131 and the execution center of the target nozzle 1422 by a predetermined distance in the conveyor belt direction using the mounting adjustment component 133.

[0044] Operators or automated systems can adjust the position and angle of the first vision sensor 131 and the second vision sensor 132 relative to the target nozzle 1422 by installing the adjustment component 133, according to preset process requirements. When a parallel layout is selected, the three sensors are arranged along a first direction. During the placement process, the first vision sensor 131 first positions the dispensing labels in the same column, then the target nozzle 1422 places the labels, and subsequently, the second vision sensor 132 immediately detects the chips that have been placed in the same column. When a staggered layout is selected, the second vision sensor 132 is adjusted in the transport direction by installing the adjustment component 133 to a position that lags behind the target nozzle 1422 and the first vision sensor 131 by a certain distance. In this way, when the target nozzle 1422 and the first vision sensor 131 are applying and positioning a column in the current row (e.g., the Nth row), the field of view of the second vision sensor 132 just covers the binding label of the previous row (e.g., the N-3th row) that has been applied and has moved forward several rows with the conveyor belt, thus realizing parallel operation of application and re-inspection.

[0045] As an alternative implementation, the mounting adjustment element 133 can be a mounting plate with an arc-shaped groove and angle scale. The first visual sensor 131 is mounted on the arc-shaped groove via an adapter. After loosening the fastening screws, it can move along the groove or rotate around its own axis, and then lock in place once the position is determined. The second visual sensor 132 is also mounted on the same mounting adjustment element 133 using a similar structure.

[0046] Please see Figure 1 In an embodiment of the present invention, the first visual sensor 131 is locked onto the mounting adjustment member 133 in a first pose, so that the field of view of the first visual sensor 131 covers the target nozzle 1422 and the dispensing label corresponding to the target nozzle 1422; in a same-row layout, the second visual sensor 132 is locked onto the mounting adjustment member 133 in a second pose, so that the center of the field of view of the second visual sensor 132, the center of the field of view of the first visual sensor 131, and the direction in which the target nozzle 1422 is facing converge at the same point; in a staggered layout, the first... The second vision sensor 132 is locked on the mounting adjustment member 133 in a third pose, such that the field center of the second vision sensor 132 is at a preset distance from the field center of the first vision sensor 131 along the transport direction, so that when the target nozzle 1422 and the first vision sensor 131 both correspond to the (m+n)th row of dispensing labels, the field center of the second vision sensor 132 corresponds to the mth row of binding labels; where m and n are both positive integers, and the row numbers of the dispensing labels and binding labels gradually decrease along the transport direction.

[0047] In this embodiment, by locking the first vision sensor 131 in its first pose to the mounting adjustment member 133, its field of view can reliably cover the target nozzle 1422 and the corresponding dispensing label, ensuring accurate positional information is obtained before each chip bonding. In the same-row layout, the second vision sensor 132 is locked in its second pose to the mounting adjustment member 133, so that its field of view center converges with the field of view center of the first vision sensor 131 and the orientation direction of the target nozzle 1422 at the same point. This means that after chip bonding is completed, the tape does not need to be moved, and the second vision sensor 132 can perform high-precision imaging detection on the newly bonded label, realizing a three-in-one real-time closed loop of positioning, bonding, and detection in the same row, which facilitates timely detection and feedback of bonding defects. In the staggered layout, the second vision sensor 132 is locked in its third pose to the mounting adjustment member 133, so that its field of view center forms a preset row number difference n with the field of view center of the first vision sensor 131 in the tape transport direction. When the target nozzle 1422 and the first vision sensor 131 correspond to the (m+n)th row of dispensing labels, the second vision sensor 132 corresponds precisely to the mth row of bonding labels. This design allows the chip bonding mechanism 1 to simultaneously detect the chip position of bonding labels that have moved forward k rows while the multi-arm bonding structure 142 bonds the current dispensing label. This achieves complete time parallelism between processing and detection, effectively improving production efficiency. Furthermore, the preset distance n can be flexibly set according to actual process requirements by changing the locking posture of the second sensor, for example, setting n=1, 2, or 3, etc.

[0048] It should be noted that the first pose refers to the position and orientation of the first vision sensor 131 when it is fixed. Its core requirement is that its field of view must simultaneously cover the working point of the target nozzle 1422 and the dispensing label to be positioned. The field of view center refers to the geometric center point of the camera's field of view, which is usually also the target alignment point. "Converging at the same point" means that, in a row layout, the working center points of the three functional units ideally coincide at the same point in space, ensuring complete consistency in the benchmarks for measurement, execution, and detection. The preset distance refers to, in a staggered layout, through pose adjustment, ensuring that the projected distance between the field of view center of the second vision sensor 132 and the field of view center of the first vision sensor 131 in the transport direction is exactly equal to the displacement generated after the conveyor belt steps an integer number of rows (n rows).

[0049] Additionally, it should be noted that the row numbers of the dispensing labels and binding labels gradually decrease in the transport direction. This is because, when binding the dispensing labels on the conveyor belt, the labels at the front end along the conveyor belt transport direction are processed first, while those at the back end are processed later. Therefore, the row number is initially determined by the row number processed first, and gradually increases in the reverse direction of the conveyor belt transport direction.

[0050] During equipment debugging or mode switching, the first vision sensor 131 is first adjusted and locked in the first position to ensure that its field of view can completely cover the working area of ​​the target nozzle 1422 and the adhesive label to be applied. If it is necessary to switch to the same row layout, the second vision sensor 132 is adjusted to the second position and locked, so that the center of its field of view, the center of the field of view of the first vision sensor 131, and the axis of the target nozzle 1422 intersect at the same point in space. This point can be called the convergence point. When the equipment is running, the moving component 12 moves the first vision sensor 131, the second vision sensor 132, and the multi-arm binding structure 142 according to the preset program, so that the convergence point moves to the vicinity of the x-th row and y-th column to be processed. Then the first vision sensor 131 begins positioning and recognition, so that the moving component 12 compensates for the positioning error, so that the multi-arm binding structure 142 and the second vision sensor 132 can perform binding and quality inspection. If a staggered layout needs to be switched, the corresponding spatial distance is calculated based on the preset number of lag rows n. Then, the second vision sensor 132 is adjusted to the third pose so that its field of view center is precisely separated from the field of view center of the first vision sensor 131 in the transport direction by this distance. In this way, when the control system moves the moving component 12 to the (m+n)th row for operation, the first vision sensor 131 and the binding module 14 correspond to the (m+n)th row, while the second vision sensor 132 automatically corresponds to the mth row that has already stepped forward.

[0051] Please see Figure 1In an embodiment of the present invention, the mounting adjustment member 133 is provided with an arc-shaped adjustment hole 1331, the plane of the arc extension direction of the adjustment hole 1331 is perpendicular to the first direction, and the mounting adjustment member 133 is provided with an angle scale around the adjustment hole 1331; the first visual sensor 131 and the second visual sensor 132 are each mounted on the mounting adjustment member 133 through the adjustment hole 1331; the first visual sensor 131 is configured to be movable along the extension direction of the adjustment hole 1331 and rotatable about the mounting axis of the first visual sensor 131, and its position and angle can be locked; the second visual sensor... 132 is configured to be movable along the extension direction of the adjustment hole 1331 and rotatable about the mounting axis of the second vision sensor 132, and to lock its position and angle; and / or, the moving assembly 12 includes a first motion module 121 and a second motion module 122, the first motion module 121 being movably mounted on the support structure 11 and reciprocating along a first direction, and a mounting adjustment member 133 being mounted on the first motion module 121; the second motion module 122 being movably mounted on the support structure 11 and reciprocating along the first direction, and a drive structure 141 being mounted on the second motion module 122.

[0052] In this embodiment, by using an arc-shaped adjustment hole 1331 in conjunction with an angle scale design for the mounting adjustment component 133, a simple, intuitive, and quantifiable method is provided for adjusting the pose of the first vision sensor 131 and the second vision sensor 132. The vision sensors move and lock along the arc-shaped hole perpendicular to the first direction, precisely changing their relative position in the transport direction and ensuring stability after adjustment. The presence of the angle scale allows the process parameter of offsetting n rows to be directly converted into a mechanical adjustment amount, achieving a rapid and accurate mapping from process requirements to hardware configuration, and reducing the complexity of equipment debugging.

[0053] Furthermore, by dividing the moving component 12 into a first motion module 121 and a second motion module 122 with independent drives, mechanical decoupling of the vision component 13 and the bonding module 14 is achieved. The vision component 13 is sensitive to vibration, while the bonding module 14 generates impact during mounting. Placing them on independent motion modules avoids the vibration generated by the bonding action from being directly transmitted to the vision component 13, ensuring the stability of positioning and detection. At the same time, independent driving also gives the system a more flexible control strategy. For example, when high-precision detection is required, the vision platform can perform micro-scanning, while the bonding platform performs coarse following, with the two not interfering with each other and working together to complete complex actions.

[0054] It should be noted that the arc-shaped adjustment hole 1331 is a guide structure used to achieve angle adjustment, and in conjunction with the angle scale, it can achieve precise quantitative adjustment of the visual sensor angle. The first motion module 121 is a linear motion unit specifically used to drive the vision component 13 to move along the first direction. The second motion module 122 is another set of linear motion units specifically used to drive the bonding module 14 (especially its multi-arm bonding structure 142) to move along the first direction.

[0055] When adjusting the vision layout, the operator can loosen the fasteners of the first vision sensor 131 or the second vision sensor 132, allowing it to move along the arc-shaped adjustment hole 1331. Since the arc plane of the adjustment hole 1331 is perpendicular to the first direction, as the vision sensor moves along the hole, the angle between its optical axis and the surface of the conveyor belt, as well as its offset relative to the target nozzle 1422 in the transport direction, will change accordingly. The operator can refer to the angle scale next to the adjustment hole 1331 to precisely adjust the vision sensor to the required angle and then lock it. During the movement of the mechanism, the control system can independently control the first motion module 121 and the second motion module 122. For example, during mounting, the two can be linked to maintain synchronization between vision and bonding; or, when the second vision sensor 132 is performing detection, the focus can be optimized by independently fine-tuning the second motion module 122.

[0056] As an optional implementation, the mounting adjustment component 133 can be a fan-shaped metal block with a through-hole circular arc groove 1331 on its arc edge. Both the first visual sensor 131 and the second visual sensor 132 are fixed to the mounting adjustment component 133 by a screw with a bushing passing through the circular arc groove. Angle markings can be directly etched onto the surface of the fan-shaped metal block. For the moving assembly 12, the first motion module 121 and the second motion module 122 can be two independent linear modules arranged parallel to each other, both mounted on the same support beam.

[0057] Please see Figure 1 and Figure 2 The present invention also proposes a die bonding device, which includes a die-picking mechanism (not shown in the figure), a chip transfer mechanism 2, and the aforementioned chip bonding mechanism 1. The specific structure of the chip bonding mechanism 1 is as described in the above embodiments. Since this die bonding device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The die-picking mechanism is used to eject the chip from the blue film; the chip transfer mechanism 2 is provided with at least two flipping arms, which are used to drive at least two flipping arms to rotate sequentially to the die-picking station so that the at least two flipping arms sequentially adsorb the chip; the chip transfer mechanism 2 is also used to drive at least two flipping arms to rotate sequentially to the die-attaching station and release the chip.

[0058] In this embodiment, by integrating the aforementioned chip bonding mechanism 1 with the chip picking mechanism and the chip transfer mechanism 2 with at least two flipping arms into a complete die bonding device, a highly efficient and precise chip supply and mounting pipeline is constructed. The chip picking mechanism is responsible for the initial separation of the chips, and the chip transfer mechanism 2, utilizing its at least two flipping arms, achieves rapid and stable transport of chips from the chip picking station to the chip receiving station through rotational motion. The design of this transfer mechanism effectively connects the chip picking step and the bonding step. More importantly, the multiple flipping arms of the chip transfer mechanism 2 provide the prerequisite for the batch adsorption of the multi-arm bonding structure 142 of the chip bonding mechanism 1 in Embodiment 2. The multi-arm bonding structure 142 can rotate, allowing its multiple bonding arms 1421 to sequentially receive chips from multiple flipping arms at the chip receiving station, thereby achieving batch loading. This many-to-many relay transmission mode minimizes the chip transfer path and avoids the inefficient mode of a single bonding arm repeatedly picking chips. The entire die bonding equipment achieves a highly streamlined operation in terms of time and space for the chip picking, transfer, and mounting stages, significantly improving the overall capacity of the machine.

[0059] It should be noted that die bonding equipment is a complete production device used to pick up chips from wafer disks and precisely mount them onto substrates or tapes. The chip picking mechanism typically includes a ejector pin module and a wafer disk expansion mechanism, responsible for separating and lifting the chip from the blue film. The chip transfer mechanism 2 is a rotating device with multiple flipping arms, used to transfer chips between the chip picking mechanism and the chip bonding mechanism 1, and may enable chip flipping. The flipping arms are swing arms equipped with transfer nozzles, capable of rotational movement to transport chips between different workstations.

[0060] During equipment operation, the ejector pin in the chip-fetching mechanism moves upward, ejecting the chip from the blue film to the chip-fetching station. The chip transfer mechanism 2 drives its multiple flip arms to rotate. When one of the flip arms rotates to the chip-fetching station, the transfer nozzle at the end of the flip arm picks up the ejected chip. Subsequently, the flip arm rotates to the chip-attaching station. At this time, the multi-arm bonding structure 142 in the chip bonding mechanism 1, as described in any of embodiments 1 to 5, has also rotated one of its bonding arms 1421 to the same chip-attaching station. The flip arm releases the chip here, and the bonding arm 1421 initiates vacuum adsorption, completing the chip transfer. This process cyclically occurs between the multiple flip arms and the multiple bonding arms 1421, achieving continuous chip supply.

[0061] As an optional implementation, the chip transfer mechanism 2 can employ two symmetrically arranged flipping arms. The chip picking mechanism is located on one side of the equipment, and the chip bonding mechanism 1 is located on the other side. The two flipping arms alternately swing between the chip picking station and the chip bonding station to improve handling efficiency.

[0062] In addition, please see Figure 2 and Figure 3As an optional implementation, in the die bonding equipment, an adhesive dispensing mechanism 3 can be provided upstream of the chip bonding mechanism 1, so as to dispense adhesive onto the initial label on the strip to obtain an adhesive label.

[0063] This invention also proposes a chip bonding method. In a first embodiment of the chip bonding method of this invention, the chip bonding method is applied to a chip bonding mechanism. Please refer to [link to relevant documentation]. Figure 4 The chip bonding method includes steps S10 to S60: Step S10: Move the multi-arm bonding structure to the die bonding area and rotate it so that the multiple bonding arms on the multi-arm bonding structure pass through the die bonding station in sequence to adsorb chips in batches. Step S20: Control the vision component and the multi-arm binding structure to move collaboratively along a first direction to the target mounting column on the material strip; wherein, the first direction is perpendicular to the transport direction of the material strip; Step S30: Trigger the first vision sensor of the vision component to capture and position the adhesive label on the material strip; Step S40: Based on the positioning result, perform position compensation and angle compensation on the multi-arm bonding structure, so that one of the bonding arms moves to the bonding station and attaches the chip to the dispensing label; Step S50: Control the vision component and the multi-arm bonding structure to move along the first direction to the next column of the dispensing labels in the same row, and simultaneously control the multi-arm bonding structure to rotate, switch the next bonding arm to the bonding station, and sequentially perform chip mounting on all columns of the dispensing labels in the same row. Step S60: After all the dispensing labels in the same row have been applied, drive the rotating hub to rotate, so that the next row of dispensing labels moves to the processing area, so as to sequentially apply chips to each row and each column of dispensing labels.

[0064] It should be noted that the outer circumference of the rotating hub can have multiple openings, each used to provide negative pressure, thereby achieving a negative pressure adsorption function for the material belt, enabling the rotating hub to have a similar effect to an adsorption hub. Negative pressure can be achieved by creating a negative pressure chamber inside the rotating hub and connecting this chamber to a negative pressure device.

[0065] This embodiment provides a chip bonding method. First, a multi-arm bonding structure is used to batch-adsorb chips in the bonding area, achieving centralized chip loading and laying the foundation for subsequent high-speed placement. Then, by controlling the vision component and the multi-arm bonding structure to move collaboratively along a first direction, the consistency of positioning and execution references is ensured, avoiding errors that might be introduced by separate movements. Next, by first positioning with a first vision sensor and then performing multi-degree-of-freedom position and angle compensation based on the results, the placement accuracy of each chip is guaranteed. Then, the lateral movement and the rotational switching action of the multi-arm bonding structure are synchronized; as the moving component moves to the next column, the multi-arm bonding structure simultaneously completes the switching of bonding arms. This overlaps the inter-column movement time and the bonding arm switching time, greatly compressing the cycle time and achieving efficient continuous placement of multiple columns of chips within the same row. Finally, by driving the rotating hub to achieve inter-column stepping, the entire batch of material is incorporated into the automated production process.

[0066] Overall, this method forms a complete, efficient, and high-precision multi-column chip mounting process through batch loading, standardized collaborative movement, precise compensation mounting, and parallel processing of movement and switching.

[0067] It should be noted that the chip bonding area is the pre-defined spatial location where the multi-arm bonding structure loads the chip; it is usually located on one side of the equipment, separate from the mounting area. Cooperative movement refers to the synchronous movement of the vision component and the multi-arm bonding structure as a rigid whole to maintain their relative positions. Position compensation and angle compensation refer to driving the moving component to make slight XY displacements and driving the bonding arm to rotate along the θ-axis based on the positioning results of the first vision sensor, to eliminate alignment misalignment between the chip and the dispensing label. The rotating hub is a drive roller that drives the conveyor belt to step along its transport direction.

[0068] In one example, during actual operation, the multi-arm bonding structure first moves to a dedicated die-attachment area and begins to rotate, allowing each bonding arm of the multi-arm bonding structure to sequentially pass through the die-attachment station, adsorbing chips one by one until all arms are loaded. Then, the multi-arm bonding structure, together with its fixed vision component, moves along a first direction above the first column (e.g., column 1) of the current processing row of the strip. The first vision sensor is triggered to take a picture, and image processing calculates the precise position of the dispensing label for that column. Based on the calculation result, the control system drives the entire moving assembly to move slightly and adjusts the angle of the bonding arms, ensuring perfect alignment between the chip on one bonding arm and the dispensing label before placement. After placement of this column is completed, the entire assembly moves to the next column in the same row (column 2), while the multi-arm bonding structure rotates, switching the bonding arm with the next adsorbed chip to the working position, and then repeating the positioning and placement actions. This cycle continues until all columns in the row are placed. Subsequently, the rotating hub rotates, feeding a new row of dispensing labels into the working area, and the entire lateral movement and placement process is repeated on the new row.

[0069] Based on the first embodiment of the chip bonding method of the present invention, in the second embodiment of the chip bonding method, the contents that are the same as or similar to those in the first embodiment can be referred to the above description and will not be repeated hereafter. Furthermore, the chip bonding mechanism has a same-row layout mode and a staggered layout mode; In the same row layout mode, after step S40, step A41 is also included: Step A41: Trigger the second vision sensor of the vision component to capture and detect the bonding label of the attached chip; In the staggered layout mode, step S40 includes steps B41 to B42: Step B41: Based on the positioning result, perform position compensation and angle compensation on the multi-arm binding structure so that one of the binding arms is aligned with the dispensing label in the (m+n)th row. Step B42: Control one of the bonding arms to perform chip mounting on the dispensing labels in the (m+n)th row, and simultaneously trigger the second vision sensor to capture and detect the bonding labels in the mth row; where m and n are positive integers, and the row numbers of the dispensing labels and the bonding labels gradually decrease in the transport direction.

[0070] This embodiment provides specific process steps under two different working modes: a same-row layout mode and a staggered layout mode, improving the flexibility and adaptability of the method to different scenarios. In the same-row layout mode, the second vision sensor of the vision component is triggered to capture and detect the bound labels, achieving real-time detection after mounting. This detection can immediately confirm whether the mounting step was successful, providing the fastest feedback for timely on-site correction or shutdown alarms, forming an instantaneous quality closed loop for the machine and effectively preventing batch defects. In the staggered layout mode, a novel approach is achieved: dual-station parallel operation within a single time point. On one hand, the equipment normally performs chip mounting on the (m+n)th row of adhesive labels; on the other hand, due to the spatial lag of the second vision sensor, it is simultaneously triggered to detect the bound labels in the mth row, which has already completed multiple rows of transport. At this time, the adhesive layer in the mth row has undergone sufficient pressing and curing stabilization, making the detection results highly valuable. More importantly, this parallel operation of mounting the current row and inspecting the already mounted rows completes the quality re-inspection process that would otherwise require separate time, without increasing the cycle time. This achieves a significant reduction in process time and a dual guarantee of product accuracy.

[0071] It should be noted that the same-row layout mode refers to the second vision sensor, the first vision sensor, and the target nozzle being in the same row, performing immediate detection of the newly mounted chip. The staggered layout mode refers to the second vision sensor lagging behind the first vision sensor and the target nozzle by a certain number of rows in the transport direction, detecting labels in different rows. Synchronous triggering refers to issuing placement and detection trigger commands simultaneously or within a very short time interval within a control cycle, enabling parallel operations at different spatial locations and in time.

[0072] In one example, when the device operates in a same-row layout mode, after completing the chip bonding and mounting action of a certain adhesive label (i.e., after completing step S40), step A41 is executed, immediately triggering the second vision sensor to photograph and inspect the newly bonded label to check the bonding quality. When the device operates in a staggered layout mode, the control system will simultaneously monitor the (m+n)th row and the mth row during movement: In step B41, the positioning and compensation aims to align the bonding arm with the adhesive labels in the (m+n)th row. Then, in step B42, on the one hand, the bonding arm is controlled to mount the labels in the (m+n)th row; on the other hand, since the field of view of the second vision sensor is spatially preset to lag behind by n rows, the second vision sensor is now aligned with the bonding labels in the mth row, thus simultaneously triggering the second vision sensor to photograph and inspect.

[0073] Based on the first embodiment of the chip bonding method of the present invention, in the third embodiment of the chip bonding method, the contents that are the same as or similar to those in the first embodiment can be referred to the above description, and will not be repeated hereafter. Based on this, please refer to... Figure 5 The step of sequentially attaching chips to each row and each column of the adhesive labels, i.e., step S60, includes steps S61 to S62: Step S61: After the batch of chips are mounted on the multi-arm bonding structure, the current mounting station is recorded as a chip-deficient station, and the multi-arm bonding structure is controlled to return to the die bonding area and rotate, so that multiple empty bonding arms pass through the die bonding station in sequence to load the next batch of chips in batches. Step S62: After the chip is reloaded, the multi-arm bonding structure is moved to the missing chip station and the mounting operation continues to be performed to mount the chip on each row and column of the dispensing label in sequence.

[0074] This embodiment introduces an intelligent management mechanism for placement interruptions and recovery. When a batch of chips is used up, the system first records the chip shortage station, achieving accurate memorization of the production progress. Subsequently, the multi-arm bonding structure returns to the die bonding area for the batch loading of the next batch of chips. After reloading, the multi-arm bonding structure can directly move and position itself to the subsequent position of the chip shortage station to continue operation. This breakpoint-resumption design avoids the inefficient mode where the equipment must restart placement from the beginning of each row or each cycle after changing chip batches. Especially in multi-column, large-scale production scenarios, this mechanism effectively eliminates invalid idle strokes caused by chip depletion, ensuring a high degree of continuity and overall efficiency in placement operations. Simultaneously, this also demonstrates the high level of intelligence of the entire control method and its excellent fault tolerance and recovery capabilities for production interruptions.

[0075] It should be noted that a chip-missing station refers to the precise position where the last chip is mounted after all chips on the multi-arm bonding structure have been used. The system has a position memory function, which can record this interruption point.

[0076] During continuous placement, once all chips on all arms of the multi-arm bonding structure have been placed, the control system records the position where placement was just completed and marks it as a chip-deficient station. Then, the multi-arm bonding structure immediately returns from the placement area to the die-attaching area to begin batch chip loading again. After loading is complete, the multi-arm bonding structure does not return to the starting point of the row; instead, based on system memory, it moves directly to the next column position after the previously recorded chip-deficient station and continues the placement operation from that position.

[0077] Based on the first embodiment of the chip bonding method of the present invention, in the fourth embodiment of the chip bonding method, the contents that are the same as or similar to those in the first embodiment can be referred to the above description, and will not be repeated hereafter. Based on this, please refer to... Figure 6 Step S10 includes steps S11 to S14: Step S11: Move the multi-arm bonding structure to the junction region; Step S12: The chip is ejected from the blue film and moved to the chip removal station; Step S13: Control the rotation of multiple flipping arms of the chip transfer mechanism so that the multiple flipping arms pass through the chip picking station in sequence and pick up the chip, and then pass through the chip receiving station in sequence and release the chip. Step S14: Rotate the multi-arm bonding structure so that multiple bonding arms pass through the die-attaching station in sequence to adsorb the chips in batches.

[0078] In this embodiment, the specific implementation process of batch chip adsorption involves four coordinated actions: positioning of the multi-arm bonding structure, chip ejection by the chip-ejecting mechanism, transport of the flipping arm between the chip-ejecting and chip-attaching stations, and chip adsorption by the bonding arm at the chip-attaching station. The continuous rotation of multiple flipping arms provides a continuous chip supply to the multi-arm bonding structure at the chip-attaching station. This enables the multi-arm bonding structure to continuously and in batches complete chip adsorption within a short time interval.

[0079] It should be noted that ejection refers to the action of using ejector pins to lift the chip upwards from below the blue film, making it easier for the chip to be picked up by the transfer nozzle of the flip arm. The chip picking station is the fixed spatial position where the chip picking mechanism performs the ejection action. The flip arm is a swing arm-type component in the chip transfer mechanism used for flipping and transporting chips.

[0080] First, the multi-arm bonding structure moves to the die-attachment area and enters a standby state. The die-picking mechanism starts working, ejecting the chip to the die-picking station. Simultaneously, the chip transfer mechanism begins to rotate, driving its multiple flipping arms to rotate. When a flipping arm passes the die-attachment station, its central suction nozzle picks up the lifted chip; then it continues to rotate, and when the flipping arm passes the die-attachment station, it releases the chip. At the same time, the multi-arm bonding structure also rotates synchronously, with its bonding arms sequentially passing through the same die-attachment station. Through precise timing control, the moment the flipping arm releases the chip at the die-attachment station, the suction nozzle of the bonding arm passes by and picks up the chip, completing the transfer. Multiple flipping arms and multiple sets of bonding arms operate in turn until all bonding arms have picked up the chip.

[0081] As an optional implementation, a chip transfer mechanism with two flip arms can be used, with the two flip arms swinging alternately between the chip picking station and the chip receiving station. The multi-arm bonding structure can be a 6-arm structure, or it can use 2 to 10 arms or other arm numbers. Taking a 6-arm structure as an example, after one bonding arm of the multi-arm bonding structure completes chip adsorption at the chip receiving station, it immediately rotates by a division angle (60°) to allow the next bonding arm to take position. At the same time, the flip arm also swings, transporting the next chip from the chip picking station. This cycle is repeated 6 times to complete the loading of one batch.

[0082] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A chip bonding mechanism, characterized in that, This is used for chip bonding of dispensing labels on a material strip, the material strip having a transport direction, and the material strip having an array of multiple rows and columns of dispensing labels; The chip bonding mechanism includes: Support structure; A movable component is movably disposed on the support structure and is capable of reciprocating along a first direction; the first direction is perpendicular to the transport direction and parallel to the surface of the conveyor belt. A vision component, the vision component being mounted on the moving component; A bonding module is mounted on the movable component and is used to attach and place chips. During the chip bonding process of the single-row multi-column dispensing labels, the position of the material tape is fixed, and the moving component drives the bonding module and the vision component to move, so that the bonding module sequentially bonds the chips to the single-row multi-column dispensing labels.

2. The chip bonding mechanism as described in claim 1, characterized in that, The bonding module includes a driving structure and a multi-arm bonding structure. The driving structure is mounted on the moving component and is connected to the multi-arm bonding structure. The multi-arm bonding structure has at least two bonding arms, and each bonding arm has a suction nozzle at its end. The suction nozzle is used to adsorb and place the chip. The driving structure is used to drive the multi-arm bonding structure to rotate so that at least two of the bonding arms pass through the die bonding station in sequence, thereby allowing the nozzles corresponding to each bonding arm to sequentially pick up chips from the chip transfer mechanism at the die bonding station. The driving structure is also used to drive the multi-arm bonding structure to rotate to the bonding station, so that the nozzle rotates to correspond to the position of the dispensing label.

3. The chip bonding mechanism as described in claim 2, characterized in that, The vision component includes a first vision sensor, a second vision sensor, and a mounting adjustment component. The first vision sensor is used to locate and identify the dispensing label on the material strip; the second vision sensor is used to perform quality inspection on the bonding label that has been bonded to the chip. The nozzle located at the binding station is the target nozzle; the first vision sensor and the second vision sensor are mounted on the moving component through the mounting adjustment component; the mounting adjustment component is used to adjust the spatial pose of the first vision sensor and the second vision sensor relative to the target nozzle, so that the target nozzle, the first vision sensor and the second vision sensor form a same-row layout or a staggered layout.

4. The chip bonding mechanism as described in claim 3, characterized in that, The first vision sensor is locked onto the mounting adjustment member in a first orientation so that the field of view of the first vision sensor covers the target nozzle and the dispensing label corresponding to the target nozzle; In the same row layout, the second vision sensor is locked on the mounting adjustment member in a second pose so that the field center of the second vision sensor, the field center of the first vision sensor, and the direction in which the target nozzle is facing converge at the same point. In the staggered layout, the second vision sensor is locked on the mounting adjustment member in a third pose, such that the field center of the second vision sensor has a preset distance from the field center of the first vision sensor along the transport direction, so that when both the target nozzle and the first vision sensor correspond to the (m+n)th row of the dispensing label, the field center of the second vision sensor corresponds to the mth row of the binding label; where m and n are both positive integers, and the row numbers of the dispensing label and the binding label gradually decrease along the transport direction.

5. The chip bonding mechanism as described in claim 3, characterized in that, The mounting adjustment component has an arc-shaped adjustment hole, the plane of which the arc of the adjustment hole extends perpendicular to the first direction, and the mounting adjustment component has an angle scale around the adjustment hole; the first vision sensor and the second vision sensor are each mounted on the mounting adjustment component through the adjustment hole; the first vision sensor is configured to move along the extension direction of the adjustment hole and rotate about the mounting axis of the first vision sensor, and its position and angle can be locked; the second vision sensor is configured to move along the extension direction of the adjustment hole and rotate about the mounting axis of the second vision sensor, and its position and angle can be locked. And / or, the moving component includes a first motion module and a second motion module, the first motion module being movably mounted on the support structure and capable of reciprocating along the first direction, and the mounting adjustment component being mounted on the first motion module; The second motion module is movably mounted on the support structure and can reciprocate along the first direction. The drive structure is mounted on the second motion module.

6. A die bonding apparatus, characterized in that, The device includes a chip picking mechanism, a chip transfer mechanism, and a chip bonding mechanism as described in any one of claims 1 to 5; the chip picking mechanism is used to eject the chip from the blue film; the chip transfer mechanism is provided with at least two flipping arms, and the chip transfer mechanism is used to drive at least two of the flipping arms to rotate sequentially to the chip picking station so that at least two of the flipping arms sequentially adsorb the chip; the chip transfer mechanism is also used to drive at least two of the flipping arms to rotate sequentially to the chip receiving station and release the chip.

7. A chip bonding method, applied to a chip bonding mechanism, characterized in that, The chip bonding method includes: The multi-arm bonding structure is moved to the die bonding area and rotated so that multiple bonding arms on the multi-arm bonding structure pass through the die bonding station in sequence to adsorb chips in batches. The control vision component and the multi-arm binding structure move collaboratively along a first direction to the target mounting column on the material strip; wherein, the first direction is perpendicular to the transport direction of the material strip; The first vision sensor of the vision component is triggered to capture and locate the adhesive label on the material strip; Based on the positioning results, position and angle compensation are performed on the multi-arm bonding structure, so that one of the bonding arms moves to the bonding station and attaches the chip to the dispensing label; Control the vision component and the multi-arm bonding structure to move along the first direction to the next column of the dispensing labels in the same row, and simultaneously control the multi-arm bonding structure to rotate, switch the next bonding arm to the bonding station, and sequentially perform chip mounting on all columns of the dispensing labels in the same row; Once all the adhesive labels in the same row have been applied, the drive hub rotates, moving the next row of adhesive labels to the processing area, so that the chip is applied to each row and each column of adhesive labels in sequence.

8. The chip bonding method as described in claim 7, characterized in that, The chip bonding mechanism has a same-row layout mode and a staggered layout mode; In the same-row layout mode, after the step of performing position and angle compensation on the multi-arm bonding structure according to the positioning result, so that one of the bonding arms moves to the bonding station and the chip is attached to the dispensing label, the method further includes: The second vision sensor of the vision component is triggered to capture and detect the attached label of the chip; In the staggered layout mode, the step of performing position and angle compensation on the multi-arm bonding structure based on the positioning result, so that one of the bonding arms moves to the bonding station, and attaching the chip to the dispensing label includes: Based on the positioning results, position and angle compensation are performed on the multi-arm binding structure so that one of the binding arms is aligned with the dispensing label in the (m+n)th row. One of the binding arms is controlled to perform chip mounting on the dispensing labels in the (m+n)th row, and the second vision sensor is simultaneously triggered to capture and detect the binding labels in the mth row; where m and n are positive integers, and the row numbers of the dispensing labels and the binding labels gradually decrease in the transport direction.

9. The chip bonding method as described in claim 7, characterized in that, The step of sequentially attaching chips to each row and each column of the adhesive labels includes: After the batch of chips are mounted on the multi-arm bonding structure, the current mounting station is recorded as a chip-deficient station, and the multi-arm bonding structure is controlled to return to the die bonding area and rotate, so that multiple empty bonding arms pass through the die bonding station in sequence to load the next batch of chips in batches. After the chip is reloaded, the multi-arm bonding structure is moved to the missing chip station and the mounting operation continues to install the chip on each row and column of the dispensing label in sequence.

10. The chip bonding method as described in claim 7, characterized in that, The step of moving the multi-arm bonding structure to the die-attachment area and rotating it, so that multiple bonding arms on the multi-arm bonding structure sequentially pass through the die-attachment station to batch-attach chips, includes: Move the multi-arm bonding structure to the junction region; The chip is ejected from the blue film and moved to the chip removal station; The multiple flipping arms of the control chip transfer mechanism rotate so that the multiple flipping arms pass through the chip picking station in sequence and pick up the chip, and then pass through the chip receiving station in sequence and release the chip. The multi-arm bonding structure is rotated so that multiple bonding arms pass sequentially through the die-attaching station to adsorb the chips in batches.

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