Dual gantry chip mounter and method thereof

Abstract

The application relates to the technical field of chip mounting, and discloses a double-gantry chip mounting device and a method thereof, which comprises a double-gantry structure and two sets of independent dispensing and mounting modules, the two sets of dispensing and mounting modules are arranged on the two gantry structures, when the two sets of modules are parallel mounted, each set can independently complete dispensing and mounting work, thereby parallel processing different areas of a PCB; when the two sets of modules are cooperatively used, the two sets of modules can be respectively used for dispensing and chip mounting, parallel processing of different procedures of a patch process is realized, space utilization of a patch device is improved, patch efficiency of the chip mounting device is significantly improved, inertia forces generated by symmetrical movements in the double-gantry structure can be partially offset, dynamic load balance is realized, vibration sensitivity of the whole device is reduced, and chip mounting precision is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the chip mounting technical field, and in particular to a double-gantry chip mounting device and method thereof. BACKGROUND

[0002] The semiconductor chip mounter is an automatic device widely used in the electronic manufacturing field, mainly used in surface mount technology (SMT), and mainly used for accurately mounting electronic components on printed circuit boards (PCB). At present, the chip mounter mostly adopts turret type and arch type architecture. The turret type structure generally refers to configuring multiple mounting heads on a central rotating tower, and arranging component feeders in a ring around the rotating tower. The continuous motion mode of "mounting-take material" is adopted synchronously. This structure usually has the disadvantages of component type limitation, high mechanical complexity and poor scalability.

[0003] For the gantry type chip mounter, the core structure adopts an arch type design, which is a portal motion system composed of X / Y axes using a spanning mechanical frame. It follows the principle of Cartesian coordinate system motion. This structure can be configured with a single or multiple independent mounting heads and modularized feeders. The mounting shaft slides on the frame based on the X-Y axis movement system, and cooperates with the suction nozzle, feeding mechanism, conveying flow line and visual system to realize component picking, positioning and mounting.

[0004] However, the traditional gantry type chip mounter only contains one gantry frame, and adopts a one-way sequential mounting method, that is, the device only performs one process action to realize one-time mounting each time. The single mounting shaft needs to realize the entire mounting process, which has low mounting efficiency, poor running stability and low space utilization of the device. At the same time, the single gantry system has serious motion inertia problem, which cannot meet the mounting requirements of higher precision and higher speed. SUMMARY

[0005] The present application aims to overcome the shortcomings of the prior art and provide a double-gantry chip mounting device and method thereof. Two independent gantry systems can realize parallel mounting of the same process and can also divide the mounting process, which has the advantages of high mounting efficiency, high mounting precision and stable system operation.

[0006] To achieve the above-mentioned purpose, the technical scheme adopted by the present application is as follows:

[0007] In a first aspect, a double-gantry chip mounting device is provided. The device comprises a base, wherein a double-gantry structure is arranged on the base. The double-gantry structure comprises an X-axis module connected to the base. Two sets of Y-axis modules are connected to the output end of the X-axis module. The output end of each set of Y-axis modules is connected to a Z-axis module. The output end of the Z-axis module is connected to a dispensing and mounting module for dispensing and / or chip mounting. The two sets of dispensing and mounting modules can be mounted in parallel or in a cooperative manner. The dispensing and mounting module comprises a mounting shaft for picking up chips. One side of the mounting shaft is provided with a dispensing mechanism and an upper vision system for identifying the dispensing and mounting position.

[0008] A streamline conveying mechanism for conveying a jig is further arranged on the base. The streamline conveying mechanism passes through the double-gantry structure. Jig loading and unloading mechanisms are arranged at both ends of the streamline conveying mechanism. A chip loading mechanism and a lower vision system for identifying chips are arranged on one side of the streamline conveying mechanism.

[0009] Optionally, the streamline conveying mechanism comprises a bottom plate connected to the base. An independent feeding streamline, a mounting streamline, and a discharging streamline are sequentially arranged on the bottom plate. A discharging pushing mechanism is arranged below the discharging streamline to push the jig into the unloading mechanism. A streamline width adjusting mechanism is arranged on each of the feeding streamline, the mounting streamline, and the discharging streamline to adjust the width of the streamline.

[0010] Optionally, the mounting streamline comprises a second streamline main body for conveying the jig. A lifting mechanism for lifting the jig is arranged on the inner side of the second streamline main body. A second position sensing mechanism for sensing the position of the jig is arranged on one side of the lifting mechanism. A second streamline stop mechanism for stopping the jig is arranged on the other side of the lifting mechanism.

[0011] Optionally, the lifting mechanism comprises a lifting seat connected to the bottom plate. A camshaft is rotatably installed on the inner side of the lifting seat. A lifting plate for fixing the jig is arranged above the camshaft. The bottom of the lifting plate is in contact with the camshaft. The lifting plate is slidably connected to the lifting seat.

[0012] Optionally, the jig loading mechanism comprises a loading fixed table and a loading cage limiting assembly for receiving a cage. The loading fixed table is connected to the base. A loading cage lifting mechanism for driving the loading cage limiting assembly to lift is arranged on the loading fixed table. A loading pushing mechanism for pushing the jig in the cage into the feeding streamline is arranged on one side of the loading cage limiting assembly.

[0013] Optionally, the mounting shaft comprises a shaft seat connected with the output end of the Z-axis module, a Z-direction micro-motion table capable of moving along the Z-axis direction is installed on the shaft seat, and a hollow rotating platform is installed on the Z-direction micro-motion table, and the output end of the hollow rotating platform is connected with a mounting suction nozzle used for picking up the chip.

[0014] Optionally, the chip feeding mechanism adopts blue film feeding, and suction nozzle bank mechanisms for replacing the suction nozzles of the mounting shafts are arranged on the two sides of the chip feeding mechanism.

[0015] In a second aspect, a double-gantry chip mounting method is provided, which adopts the double-gantry chip mounting device of the first aspect and comprises the following steps:

[0016] S1, the jig feeding mechanism pushes the jig with products to the streamline conveying mechanism;

[0017] S2, the streamline conveying mechanism conveys the jig to the work station of the mounting streamline to realize positioning and fixing;

[0018] S3, the two sets of dispensing and mounting modules respectively dispense and / or mount chips on the products on the jig;

[0019] S4, after the chip mounting of the products is completed, the jig is conveyed to the discharge streamline and pushed into the discharging mechanism by the discharge pushing mechanism.

[0020] Optionally, when the two sets of dispensing and mounting modules are used for parallel mounting, the upper visual system is first moved to the position above the product to be dispensed, the dispensing position is identified, then the dispensing mechanism is moved to the position above the identified position to dispense, after the dispensing is completed, the mounting shaft picks up the chip from the chip feeding mechanism, and the lower visual system is used for chip identification, and after the identification is correct, the mounting shaft is moved to the identified position for chip mounting.

[0021] Optionally, when the two sets of dispensing and mounting modules are used for division and cooperation, the dispensing and mounting module close to the jig feeding mechanism is only used for dispensing, the other dispensing and mounting module is only used for chip mounting, and after the dispensing is completed, the jig is moved to the next work station for chip mounting.

[0022] Compared with the prior art, the beneficial effects of the present application are as follows:

[0023] (1) The double-gantry structure is adopted in the present application, parallel mounting under the double-gantry system can be realized, two sets of independent dispensing and mounting modules can process different areas of the PCB substrate and different processes of the mounting process in parallel, the space utilization of the mounting equipment is improved, the mounting efficiency and the UPH value of the chip mounting equipment are significantly improved, the inertial force generated by the symmetrical motion in the double-gantry structure can be partially counteracted, dynamic load balancing is realized, the vibration sensitivity of the whole machine is reduced, and the chip mounting precision is improved.

[0024] (2) The dispensing and mounting module of the application can dispense and / or mount chips under the guidance of vision, and when two sets of modules are mounted in parallel, each set can independently complete dispensing and mounting work, thereby processing different areas of the PCB in parallel; when the two sets of modules work together, they can be used for dispensing and chip mounting respectively, realizing parallel processing of different processes of the mounting process;

[0025] (3) In the application, the product size specification compatible with the equipment is greatly expanded by adjusting the width of the flow line, and different specifications of the PCB substrate can be adjusted to adapt to the width of the flow line, effectively improving the robustness of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is a structural schematic diagram of a double-gantry chip mounting equipment in an embodiment of the application;

[0027] Figure 2 is a structural schematic diagram of a double-gantry structure in an embodiment of the application;

[0028] Figure 3 is a structural schematic diagram of an X-axis module, a Y-axis module and a Z-axis module in an embodiment of the application;

[0029] Figure 4 is a structural schematic diagram of a mounting shaft in an embodiment of the application;

[0030] Figure 5 is a structural schematic diagram of an upper vision system in an embodiment of the application;

[0031] Figure 6 is a structural schematic diagram of a lower vision system in an embodiment of the application;

[0032] Figure 7 is a structural schematic diagram of a dispensing mechanism in an embodiment of the application;

[0033] Figure 8 is a structural schematic diagram of a jig loading mechanism in an embodiment of the application;

[0034] Figure 9 is a structural schematic diagram of an upper loading and pushing mechanism in an embodiment of the application;

[0035] Figure 10 is a structural schematic diagram of an upper loading cage lifting mechanism in an embodiment of the application;

[0036] Figure 11 is a structural schematic diagram of a chip loading mechanism in an embodiment of the application;

[0037] Figure 12 is a structural schematic diagram of a blue film disc in an embodiment of the application;

[0038] Figure 13is a structural schematic view of a blue film top head in an embodiment of the present application;

[0039] Figure 14 is a structural schematic view of a blue film plane movement mechanism in an embodiment of the present application;

[0040] Figure 15 is a structural schematic view of a blanking mechanism in an embodiment of the present application;

[0041] Figure 16 is a structural schematic view of a blanking cage lifting mechanism in an embodiment of the present application;

[0042] Figure 17 is a structural schematic view of a streamline conveying mechanism in an embodiment of the present application;

[0043] Figure 18 is a structural schematic view of a feed streamline in an embodiment of the present application;

[0044] Figure 19 is a structural schematic view of a first streamline width adjusting mechanism in an embodiment of the present application;

[0045] Figure 20 is a structural schematic view of a first streamline main body in an embodiment of the present application;

[0046] Figure 21 is a structural schematic view of a first driving mechanism in an embodiment of the present application;

[0047] Figure 22 is a structural schematic view of a mounting streamline in an embodiment of the present application;

[0048] Figure 23 is a structural schematic view of a jacking mechanism in an embodiment of the present application;

[0049] Figure 24 is a structural schematic view of a discharge pushing mechanism in an embodiment of the present application;

[0050] Figure 25 is a structural schematic view of a suction nozzle library mechanism in an embodiment of the present application;

[0051] Wherein, 1, base; 2, double-gantry structure; 21, X-axis module; 211, fixed front seat; 212, X-axis fixed rear seat; 213, X-axis crossbeam; 214, X-axis linear motor driving mechanism; 215, X-direction moving table;

[0052] 22, Y-axis module; 221, Y-axis crossbeam; 222, Y-direction moving table; 223, Y-axis linear motor driving mechanism;

[0053] 24, Z-axis module; 241, Z-direction moving table; 242, Z-axis linear motor driving mechanism;

[0054] 3, mounting shaft; 31, shaft seat; 32, voice coil motor; 33, micro guide rail; 34, hollow rotating platform; 35, Z direction micro motion table; 36, mounting suction nozzle;

[0055] 4, upper vision system; 41, first support; 42, first camera; 43, first lens; 44, first point light source; 45, first ring light source;

[0056] 5, lower vision system; 51, second support; 52, second camera; 53, second lens; 54, triangular prism; 55, second point light source; 56, second ring light source;

[0057] 6, dispensing mechanism; 61, dispensing support; 62, dispensing cylinder; 63, linear guide rail I; 64, laser displacement sensor; 65, glue cylinder; 66, fixing piece; 67, tightening bolt;

[0058] 7, jig loading mechanism; 71, loading pushing mechanism; 711, loading fixed seat; 712, linear guide rail II; 713, step motor I; 714, synchronous belt assembly I; 715, pushing rod;

[0059] 72, loading cage lifting mechanism; 721, ball screw I; 722, guide assembly; 723, Z direction moving plate; 724, loading servo motor; 725, synchronous belt assembly II; 726, hand wheel;

[0060] 73, loading fixed table; 74, loading cage limiting assembly;

[0061] 8, chip loading mechanism; 81, blue film disc; 811, blue film ring; 812, blue film limiting mechanism;

[0062] 82, blue film ejector pin; 821, blue film cylinder; 822, linear guide rail III; 823, ejector pin assembly; 824, step motor II; 826, ejector pin support;

[0063] 83, blue film planar motion mechanism; 831, X direction driving mechanism; 832, X direction guide mechanism; 833, Y direction driving mechanism; 834, Y direction guide mechanism; 835, blue film motion fixed table; 84, blue film fixed seat;

[0064] 9, unloading mechanism; 91, unloading cage lifting mechanism; 911, ball screw II; 912, linear guide rail IV; 913, Z direction moving block; 914, unloading servo motor; 915, synchronous belt assembly III; 916, lifting fixed table;

[0065] 92, unloading cage limiting assembly; 93, unloading fixed table;

[0066] 10, streamline conveying mechanism; 101, bottom plate;

[0067] 102. Feed line; 1021. First flow line width adjustment mechanism; 10211. Connecting block; 10212. Adjusting bolt; 10213. Fixing plate; 10214. Linear guide rail V;

[0068] 1022, First streamlined main body; 10221, Support base;

[0069] 1023. First position sensing mechanism; 1024. First stop mechanism;

[0070] 1025. First drive mechanism; 10251. Stepper motor III; 10252. Synchronous belt assembly IV; 10253. Drive shaft; 1026. Transmission mechanism;

[0071] 103. Mounting Flow Line; 1031. Second Flow Line Main Body; 1032. Second Stop Mechanism; 1033. Lifting Mechanism; 10331. Lifting Servo Motor; 10332. Synchronous Belt Assembly V; 10333. Camshaft; 10334. Lifting Seat; 10335. Lifting Plate;

[0072] 1034. Second position sensing mechanism; 1035. Second streamline width adjustment mechanism; 1036. Second drive mechanism;

[0073] 104. Discharge flow line; 105. Discharge pushing mechanism; 1051. Pushing support; 1052. Synchronous belt assembly VI; 1053. Linear guide VI; 1054. Pulling claw lifting cylinder; 1055. Pushing claw;

[0074] 11. Suction nozzle storage mechanism; 111. Cylinder drive assembly; 112. Translation table; 113. Suction nozzle seat. Detailed Implementation

[0075] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. These drawings are simplified schematic diagrams, which are only used to illustrate the basic structure of the present invention and therefore only show the components relevant to the present invention.

[0076] Example 1, as Figures 1-7 As shown, a dual-gantry chip mounting device includes a base 1, a dual-gantry structure 2, a dispensing and mounting module, a lower vision system 5, a fixture loading mechanism 7, a chip loading mechanism 8, a unloading mechanism 9, a streamlined conveying mechanism 10, and a nozzle storage mechanism 11.

[0077] The double gantry structure 2 is fixedly installed on the top side of the base 1, and the dispensing module is installed on the double gantry structure 2; the lower vision system 5, the fixture feeding mechanism 7, the chip feeding mechanism 8, the unloading mechanism 9, the streamline conveying mechanism 10, and the nozzle storage mechanism 11 are all installed on the base 1.

[0078] The jig loading mechanism 7 and the jig unloading mechanism 9 are located at two ends of the streamline conveying mechanism 10 and are located on the same straight line, and are located on both sides of the streamline conveying mechanism 10, the lower vision system 5 is located between the chip loading mechanism 8 and the streamline conveying mechanism 10, and the suction nozzle library mechanism 11 is located on both sides of the chip loading mechanism 8.

[0079] The dispensing and mounting module comprises a mounting shaft 3, an upper vision system 4 and a dispensing mechanism 6, which can realize dispensing and / or chip mounting functions under the guidance of vision; in the application, two sets of dispensing and mounting modules are provided, which are independently operated on two gantry structures, and the two sets of dispensing and mounting modules can realize parallel mounting or division and cooperation.

[0080] When the two sets of dispensing and mounting modules are used for parallel mounting, each set can independently complete dispensing and mounting work, so that different areas of the PCB substrate can be processed in parallel; when the two sets of dispensing and mounting modules are used for division and cooperation, one set is only used for dispensing, and the other set is only used for chip mounting, so that parallel processing of different processes of the mounting process can be realized.

[0081] Therefore, the application can realize parallel mounting under the double-gantry system, and the two independent dispensing and mounting modules can process different areas of the PCB substrate and different processes of the mounting process in parallel, improve the space utilization of the mounting equipment, and significantly improve the mounting efficiency and UPH (output per hour) value of the chip mounting equipment; and the inertial forces generated by the symmetrical motion in the double-gantry structure can be partially offset, dynamic load balancing can be realized, vibration sensitivity of the whole machine can be reduced, and chip mounting precision can be improved.

[0082] Working principle:

[0083] The jig loading mechanism 7 pushes the jig with products to the streamline conveying mechanism 10, the streamline conveying mechanism 10 conveys the jig to the first station and realizes positioning and fixing, under the drive of the double-gantry structure, the dispensing and mounting module first dispenses the products on the jig, after dispensing is completed, the jig moves to the second station, and after positioning and fixing are realized, the dispensing and mounting module mounts the products on the jig, and after the products complete chip mounting, they are pushed into the unloading mechanism 9 under the action of the streamline conveying mechanism 10.

[0084] The two sets of dispensing and mounting modules can dispense and / or mount chips on the products on the jig, when they process different areas on the same PCB substrate in parallel, each dispensing and mounting module dispenses and mounts chips. When they process different processes of the same mounting process in parallel, dispensing is first completed at the first station, and then chip mounting is completed at the second station, at this time, each dispensing and mounting module is only used for dispensing or chip mounting.

[0085] In the embodiment two, on the basis of the embodiment one, the application further provides the specific structure of each component of the double-gantry chip mounting equipment.

[0086] As shown in Figures 1-3 , the double-gantry structure 2 comprises an X-axis module 21 connected with the base 1, the output end of the X-axis module 21 is connected with two sets of Y-axis modules 22, the output end of each set of Y-axis module 22 is connected with a Z-axis module 24, and the dispensing and mounting module is arranged at the output end of the Z-axis module.

[0087] The X-axis module 21 comprises an X-axis fixed front seat 211, an X-axis fixed rear seat 212, an X-axis crossbeam 213, an X-axis linear motor driving mechanism 214 and an X-direction moving table 215, the X-axis fixed front seat 211 and the X-axis fixed rear seat 212 are both connected with the base 1, the X-axis crossbeam 213 is connected with the X-axis fixed rear seat 212, the X-direction moving table 215 is connected with the X-axis linear motor driving mechanism 214 and fixed on the X-axis crossbeam 213, and the X-direction moving table 215 moves left and right through the X-axis linear motor driving mechanism 214.

[0088] The Y-axis module 22 comprises a Y-axis crossbeam 221, a Y-direction moving table 222 and a Y-axis linear motor driving mechanism 223, one end of the Y-axis crossbeam 221 is connected with the X-direction moving table 215, the other end is connected with the linear guide rail on the X-axis fixed front seat 211, the Y-direction moving table 222 moves forward and backward through the Y-axis linear motor driving mechanism 223, and the structure and connection mode of the two sets of Y-axis modules 22 are completely consistent.

[0089] The Z-axis module 24 comprises a Z-direction moving table 241 and a Z-axis linear motor driving mechanism 242, the Z-direction moving table 241 is connected with the linear guide rail on the Y-direction moving table 222, the Z-axis linear motor driving mechanism 242 is fixedly connected with the Y-direction moving table 222, the Z-direction moving table 241 moves up and down through the Z-axis linear motor driving mechanism 242, and the structure and connection mode of the two sets of Z-axis linear modules 24 are completely consistent.

[0090] As shown in Figure 4 , the mounting shaft 3 comprises a shaft seat 31 connected with the Z-direction moving table 241, the Z-direction micro moving table 35 capable of moving along the Z-axis direction is installed on the shaft seat 31, the hollow rotating platform 34 is installed on the Z-direction micro moving table 35, and the mounting suction nozzle 36 for picking up the chip is connected with the output end of the hollow rotating platform 34.

[0091] Specifically, the mounting shaft 3 includes a shaft seat 31, a voice coil motor 32, a micro guide rail 33, a hollow rotating platform 34, a Z-direction micro stage 35 and a mounting suction nozzle 36. The shaft seat 31 is fixed on the Z-direction moving stage 241. The voice coil motor 32 is connected with the shaft seat 31. The shaft seat 31 is provided with a linear guide rail. The Z-direction micro stage 35 is connected with the voice coil motor 32 and the hollow rotating platform 34. The hollow rotating platform 34 is connected with the mounting suction nozzle 36. The Z-direction micro stage 35 moves up and down in a small range through the voice coil motor 32, thereby driving the mounting suction nozzle 36 to move up and down. The mounting suction nozzle 36 rotates in a certain angle range through the hollow rotating platform 34.

[0092] As shown in Figure 5 , the upper visual system 4 includes a first support 41, a first camera 42, a first lens 43, a first point light source 44 and a first ring light source 45, and there are two groups in total. The first support 41 is fixed on the Z-direction moving stage 241. The top end of the first lens 43 is connected with the first camera 42. The tail end is connected with the first ring light source 45. The lens body of the first lens 43 is connected with the first point light source 44. The up and down movement of the Z-direction moving stage 241 can realize the focusing of the upper visual lens. Each first lens 43 of the upper visual system 4 corresponds to an optical path, forming an imaging area on the product. The number of the first lens 43 of the upper visual system 4 in the application is 2.

[0093] As shown in Figure 6 , the lower visual system 5 includes a second support 51, a second camera 52, a second lens 53, a triangular prism 54, a second point light source 55 and a second ring light source 56. The lower visual system 5 is placed in a flat manner. The second camera 52 is connected to the upper end of the second lens 53. The second point light source 55 is connected to the side end of the lens body of the second lens 53. The triangular prism 54 is connected to the second support 51 and faces the second lens 53. The second ring light source 56 is connected above the triangular prism 54. Each second lens 53 of the lower visual system 5 corresponds to an optical path, forming an imaging area on the product. The number of the second lens 53 of the lower visual system 5 in the application is 2.

[0094] As shown in Figure 7 , the dispensing mechanism 6 includes a dispensing support 61, a dispensing cylinder 62, a linear guide rail I 63, a laser displacement sensor 64, a glue cylinder 65, a fixing part 66 and a tightening bolt 67. The dispensing support 61 is fixedly connected to the Z-direction moving stage 241. The dispensing support 61 is provided with the linear guide rail I 63. The dispensing cylinder 62 is fixed to the dispensing support 61. One end of the piston rod of the dispensing cylinder 62 is connected with the fixing part 66. The fixing part 66 is connected to the linear guide rail I 63. The tail end of the glue cylinder 65 is provided with a dispensing needle. The glue cylinder 65 is cooperatively connected with the tightening bolt 67 on the fixing part 66. The tightness of the glue cylinder 65 can be adjusted by the tightening bolt 67. The dispensing cylinder 62 can drive the dispensing needle to move up and down, thereby realizing the dispensing on the surface of the product.

[0095] Specifically, after the X, Y and Z axes of the double-gantry structure 2 are sequentially operated, the dispensing mechanism 6 can realize dispensing on the product mounting surface, the upper vision system 4 can identify the material after dispensing, the mounting shaft 3 can pick up the material, and the lower vision system 5 can identify the back of the material, and the mounting shaft 3 can mount the picked material on the designated position on the product surface. The sequential flow action can be selected to be parallel mounting, or the dispensing and mounting distributed process mode, the process mode includes the mounting process for UV glue and the mounting process for the combination of UV glue and other types of glue, and the left and right mounting modes can be selected according to the actual situation.

[0096] As shown in Figures 8-10 The jig feeding mechanism 7 includes a feeding pushing mechanism 71, a feeding cage lifting mechanism 72, a feeding fixed table 73, and a feeding cage limiting assembly 74. The feeding pushing mechanism 71, the feeding cage lifting mechanism 72, and the feeding cage limiting assembly 74 are all connected to the feeding fixed table 73, and the feeding fixed table 73 is connected to the base 1. The cage is placed in the designated position of the feeding cage limiting assembly 74.

[0097] The feeding pushing mechanism 71 includes a feeding fixed seat 711, a linear guide rail II 712, a stepping motor I 713, a synchronous belt assembly I 714, a pushing rod 715, and a photoelectric sensor. The feeding fixed seat 711 is connected to the feeding fixed table 73, the linear guide rail II 712 is fixed to the top surface of the feeding fixed seat 711, the stepping motor I 713 is connected to the side of the feeding fixed seat 711, the synchronous belt assembly I 714 includes a synchronous belt, a synchronous pulley, and an idler pulley, and is connected to the other side of the feeding fixed seat 711. The synchronous pulley of the synchronous belt assembly I 714 is connected to the stepping motor I 713, the pushing rod 715 is connected to the linear guide rail II 712 and is meshed with the synchronous belt of the synchronous belt assembly I 714, the synchronous belt assembly I 714 is driven by the rotation of the stepping motor I 713, and the photoelectric sensor is connected to the side of the feeding fixed seat 711 and is located on the same side as the stepping motor I 713. The pushing rod 715 moves left and right along the linear guide rail II 712 by the synchronous belt assembly I 714, and the photoelectric sensor signal is triggered when the pushing rod 715 reaches the corresponding position during the process, so as to realize the extension and retraction of the pushing rod 715.

[0098] The feeding cage lifting mechanism 72 comprises a ball screw I 721, a guide assembly 722, a Z-direction moving plate 723, a feeding servo motor 724, a synchronous belt assembly II 725 and a hand wheel 726. The guide assembly 722 is composed of a guide shaft and a linear bearing and is connected to the feeding fixed table 73. The ball screw I 721 is fixed at the center of the guide assembly 722 and is connected to the Z-direction moving plate 723. The top end is connected to the hand wheel 726 and the bottom end is connected to the synchronous pulley of the synchronous belt assembly II 725. The other synchronous pulley of the synchronous belt assembly II 725 is connected to the feeding servo motor 724. The Z-direction moving plate 723 is driven by the servo motor and realizes the up-down movement through the synchronous belt and the ball screw I 721.

[0099] Specifically, the feeding cage limiting assembly 74 is connected to the Z-direction moving plate 723. The product cage is placed in the fixed position of the feeding cage limiting assembly 74. During the feeding process, the product cage realizes the lifting and lowering of the cage through the Z-direction moving plate 723 driven by the feeding servo motor 724.

[0100] As shown in Figures 11-14 , the chip feeding mechanism 8 adopts blue film feeding, which comprises a blue film disc 81, a blue film ejector pin 82, a blue film plane movement mechanism 83 and a blue film fixed seat 84. The blue film fixed seat 84 is connected to the base 1. The blue film ejector pin 82 and the blue film plane movement mechanism 83 are connected to the blue film fixed seat 84.

[0101] The blue film disc 81 comprises a blue film ring 811 and a blue film limiting mechanism 812. The blue film ring 811 is positioned and fixed by the spring extension and contraction in the blue film limiting mechanism 812. The number of the blue film disc 81 on the device of the present application is 2.

[0102] The blue film ejector pin 82 comprises a blue film cylinder 821, a linear guide rail III 822, a ejector pin assembly 823, a step motor II 824 and an ejector pin support 826. The ejector pin support 826 is connected to the blue film fixed seat 84. The blue film cylinder 821 and the linear guide rail III 822 are fixed to the ejector pin support 826. The ejector pin assembly 823 is connected to the blue film cylinder 821 and the linear guide rail III 822. The ejector pin assembly 823 is composed of a tungsten steel ejector pin, an ejector pin seat, an ejector pin cover and a linear bearing. The tungsten steel ejector pin is fixed to the ejector pin seat and can move along the linear bearing. The step motor II 824 is connected to a rolling bearing and is located below the ejector pin assembly 823. The tungsten steel ejector pin realizes large range movement through the blue film cylinder 821 and realizes small range extension or retraction from the ejector pin cover through the rotation of the step motor II 824.

[0103] The blue film plane movement mechanism 83 comprises an X-direction driving mechanism 831, an X-direction guiding mechanism 832, a Y-direction driving mechanism 833, a Y-direction guiding mechanism 834 and a blue film movement fixing table 835, the linear guide rails of the X-direction driving mechanism 831 and the Y-direction driving mechanism 833 are composed of linear motors, grating scales and reading heads, etc., the X-direction guiding mechanism 832 and the Y-direction guiding mechanism 834 are mainly composed of linear guide rails, the X-direction driving mechanism 831 and the X-direction guiding mechanism 832 are connected to the blue film movement fixing table 835, the Y-direction driving mechanism 833 and the Y-direction guiding mechanism 834 are connected to the X-direction driving mechanism 831 and the X-direction guiding mechanism 832, and the blue film disc 81 is driven by the linear motor to move and position on a certain plane.

[0104] Specifically, the product chip is loaded on the blue film, the chip is placed on the surface of the blue film, the blue film plane movement mechanism 83 moves the chip to the top of the tungsten steel needle of the blue film top head 82, the tungsten steel needle ejects the chip to overcome the adhesion between the blue film and the chip, and cooperates with the mounting shaft 3 to pick up the chip.

[0105] As shown in Figure 15 and Figure 16 , the unloading mechanism 9 comprises an unloading cage lifting mechanism 91, an unloading cage limiting component 92 and an unloading fixing table 93, the unloading fixing table 93 is connected to the base 1, the unloading cage lifting mechanism 91 is connected to the unloading fixing table 93, and the unloading cage limiting component 92 is connected to the unloading cage lifting mechanism 91, and the upward and downward movement of the unloading cage lifting mechanism 91 can drive the unloading cage limiting component 92 to move.

[0106] The unloading cage lifting mechanism 91 comprises a ball screw II 911, a linear guide rail IV 912, a Z-direction moving block 913, an unloading servo motor 914, a synchronous belt component III 915 and a lifting fixing table 916, the ball screw II 911 and the linear guide rail IV 912 are connected to the lifting fixing table 916, the ball screw II 911 is fixed at the center of the two linear guide rails IV 912 and connected to the Z-direction moving block 913, the top end is connected to the synchronous wheel of the synchronous belt component III 915, the other synchronous wheel of the synchronous belt component III 915 is connected to the unloading servo motor 914, the Z-direction moving block 913 is driven by the unloading servo motor 914, and after transmission through the synchronous belt and the ball screw II 911, the upward and downward movement is realized.

[0107] The structure and mounting mode of the unloading cage limiting component 92 are consistent with those of the loading cage limiting component 74.

[0108] As shown in Figures 17-24As shown, the streamline conveying mechanism 10 comprises a bottom plate 101, an inlet streamline 102, a mounting streamline 103, an outlet streamline 104 and an outlet pushing mechanism 105, the bottom plate 101 is fixedly connected to the base 1, the inlet streamline 102, the mounting streamline 103 and the outlet streamline 104 are sequentially connected to the bottom plate 101 from left to right, the outlet pushing mechanism 105 is connected to the base 1 and is directly below the outlet streamline 104, the conveying streamline of the present application comprises two groups of mounting streamlines 103 and is sequentially connected, namely, has a first station and a second station, and the inlet streamline 102, the mounting streamline 103 and the outlet streamline 104 are all provided with streamline width adjusting mechanisms for adjusting the width of the streamline.

[0109] The inlet streamline 102 comprises two groups of first streamline width adjusting mechanisms 1021, a first streamline body 1022, a first position sensing mechanism 1023, a first stop mechanism 1024, a first driving mechanism 1025 and a transmission mechanism 1026, the first streamline width adjusting mechanisms 1021 and the first streamline body 1022 are both fixed to the bottom plate 101, and the end surface of the first streamline body 1022 is flush with the end surface of the bottom plate 101, the two groups of first streamline width adjusting mechanisms 1021 are connected to one side of the first streamline body 1022, the transmission mechanism 1026 is connected to the first streamline body 1022, the first position sensing mechanism 1023 and the first stop mechanism 1024 are fixed to the bottom plate 101 and are in the middle of the first streamline body 1022, the output shaft of the first driving mechanism 1025 is connected to the synchronous pulley of the transmission mechanism 1026, the inlet streamline 102 is rotated by the stepping motor of the first driving mechanism 1025, and the continuous translation of the synchronous belt of the transmission mechanism 1026 realizes the conveying of the material.

[0110] The mounting streamline 103 comprises a second streamline body 1031, a second stop mechanism 1032, a jacking mechanism 1033, a second position sensing mechanism 1034, a second streamline width adjusting mechanism 1035 and a second driving mechanism 1036, the second streamline body 1031, the second stop mechanism 1032 and the jacking mechanism 1033 are connected to the bottom plate 101 and are in the middle of the second streamline body 1031, the second streamline width adjusting mechanism 1035 is connected to the second streamline body 1031, and the second driving mechanism 1036 is connected to the synchronous pulley of the second streamline body 1031. The mounting streamline 103 realizes the conveying of the material by the rotation of the motor of the second driving mechanism 1036, and realizes the lifting and fixing of the material by the rotation of the motor of the jacking mechanism 1033, and the mounting streamline 103 in the present application comprises two groups and is sequentially connected.

[0111] The second flow line body 1031, the second stop mechanism 1032, the second position sensing mechanism 1034, the second flow line width adjusting mechanism 1035 and the second driving mechanism 1036 of the flow line 103 are identical with the feeding flow line 102 in structure, function and mounting mode; the function structure and mounting mode of the discharging flow line 104 are identical with the feeding flow line 102, and the difference is that the discharging flow line 104 is additionally connected with a surface light source illuminator above.

[0112] The position sensing mechanism is mainly composed of a photoelectric sensor, which is used for sensing and detecting the position information of the material on the flow line; the stop mechanism is mainly composed of a circular cylinder, which is extended after receiving the signal of the photoelectric sensor of the position sensing mechanism, thereby completing the stopping action of the material.

[0113] The jacking mechanism 1033 comprises a jacking servo motor 10331, a synchronous belt assembly V 10332, a camshaft 10333, a jacking seat 10334 and a jacking plate 10335; the jacking servo motor 10331 and the camshaft 10333 are connected by the synchronous belt assembly V 10332; the jacking plate 10335 is fixed on the linear guide rail of the jacking seat 10334 and is in contact with and above the camshaft 10333; the jacking plate 10335 is rotated by the jacking servo motor 10331 and is transmitted to the camshaft 10333 through the synchronous belt, thereby realizing the up-and-down movement of the jacking plate 10335 along the linear guide rail of the jacking seat 10334.

[0114] Further, the flow line body, the driving mechanism and the flow line width adjusting mechanism of the flow line conveying mechanism 10 are all identical in structure; here, the first flow line width adjusting mechanism 1021, the first flow line body 1022 and the first driving mechanism 1025 are taken as examples for illustration.

[0115] The first flow line width adjusting mechanism 1021 comprises a connecting block 10211, an adjusting bolt 10212, a fixed sheet 10213 and a linear guide rail V 10214; the linear guide rail V 10214 is fixed on the bottom plate 101; the connecting block 10211 is connected to the sliding block of the linear guide rail V 10214; the fixed sheet 10213 and the linear guide rail V 10214 are connected by the adjusting bolt 10212; and the adjusting bolt 10212 is twisted to realize the movement or fixation of the connecting block 10211 on the linear guide rail.

[0116] The first flow line body 1022 comprises a transmission mechanism 1026 and a support seat 10221; the synchronous belt conveying end of the transmission mechanism 1026 is fixed on the side of the support seat 10221; the motor driving end is fixed on the bottom plate 101; and the motor output force is output to the synchronous belt by the transmission shaft 10253.

[0117] The first driving mechanism 1025 comprises a stepper motor III 10251, a synchronous belt assembly IV 10252 and a transmission shaft 10253. One end of the synchronous belt assembly IV 10252 is connected with the stepper motor III 10251, and the other end is connected with the transmission shaft 10253. The streamlined synchronous belt is rotated by the stepper motor III 10251 and is sequentially transmitted by the synchronous belt assembly IV 10252 and the transmission shaft 10253 to realize the translation.

[0118] The discharge pushing mechanism 105 comprises a pushing support 1051, a synchronous belt assembly VI 1052, a linear guide rail VI 1053, a puller lifting cylinder 1054, a pushing puller 1055 and a sensor. The pushing support 1051 is fixed on the bottom plate 101. The linear guide rail VI 1053, the synchronous belt assembly VI 1052 and the sensor are fixed on the side of the pushing support 1051. The puller lifting cylinder 1054 is connected to the pushing support 1051. The pushing puller 1055 is connected to the puller lifting cylinder 1054 and the linear guide rail VI 1053. The pushing puller 1055 moves left and right through the synchronous belt assembly VI 1052 and moves up and down through the puller lifting cylinder 1054.

[0119] As shown in Figure 25 The suction nozzle bank mechanism 11 comprises a cylinder driving assembly 111, a translation table 112 and a suction nozzle seat 113, which are fixed on a workbench and the workbench is fixed on the base 1. The cylinder driving assembly 111 comprises a spring and a single-shaft cylinder. The translation table 112 moves left and right through the single-shaft cylinder and the spring, and finally switches the suction nozzle seat 113 between the limiting state and the active state. The number of the suction nozzle seat 113 in the present application is six.

[0120] The suction nozzle bank mechanism 11 can store various types of mounting nozzles 36. The mounting shaft 3 can replace different types of nozzles under the joint action of the X-axis module 21, the Y-axis module 22 and the Z-axis module 24.

[0121] In the third embodiment, on the basis of the first embodiment and the second embodiment, the present application further provides a double-gantry chip mounting method, which comprises jig loading, jig conveying, dispensing and mounting and jig unloading. The product is loaded on the jig, and the jig is stored in the cage.

[0122] Jig loading: the jig loading mechanism 7 pushes the jig with the product to the streamlined conveying mechanism 10.

[0123] The jig in the loading cage limiting assembly 74 is lifted to the height of the streamlined conveying synchronous belt by the loading cage lifting mechanism 72. The loading pushing mechanism 71 extends the pushing rod 715 to push the jig into the feeding streamlined channel 102.

[0124] Jig conveying: the streamlined conveying mechanism 10 conveys the jig to the work station of the mounting streamlined channel 103 to realize positioning and fixing.

[0125] The continuous rotation of the motor of the first driving mechanism 1025 transports the jig to the mounting flow line 103, and the first station triggers the photoelectric sensor signal to make the circular cylinder of the second stop mechanism 1032 extend, while the lifting servo motor 10331 in the lifting mechanism 1033 drives the camshaft 10333 to rotate, and the camshaft 10333 lifts the jig to cooperate with the flow line pressing plate to realize the positioning and fixing of the jig.

[0126] Dispensing and mounting: two sets of dispensing and mounting modules respectively dispense and / or mount chips on the products on the jig.

[0127] After the jig is lifted and fixed, the X-axis module 21 of the double-gantry structure 2 and the Y-axis module 22 on the left move, the upper vision system 4 moves above the position where the product on the jig needs to be dispensed, and the subsequent dispensing mechanism 6 moves above the recognized position to complete a dispensing action by extending and retracting the dispensing cylinder 62.

[0128] After the products in the jig are dispensed, they are transported to the second station through the flow line, the X-axis module 21 of the double-gantry structure 2 and the Y-axis module 22 on the right move, the upper vision system 4 moves above the product, and the subsequent mounting shaft 3 picks up the chip from the blue film of the chip feeding mechanism 8, moves to the lower vision system 5 for chip recognition, and after correct recognition, moves above the mounting position and completes a chip mounting by moving up and down with the Z-axis module 24 on the right.

[0129] Jig unloading: after the product completes chip mounting, the jig is transported to the discharge flow line 104 and pushed into the unloading mechanism 9 by the discharge pushing mechanism 105. After the product completes chip mounting, it is transported to the discharge flow line 104, and the pushing claw 1055 of the discharge pushing mechanism 105 is driven by the motor to push the product jig into the cage of the unloading mechanism 9.

[0130] As described above, the dispensing and mounting module can realize dispensing and chip mounting under the guidance of vision; therefore, two independent dispensing and mounting modules can process different areas of the PCB substrate and different processes of the patch process in parallel, improve the space utilization of the patch equipment, and significantly improve the mounting efficiency and UPH value of the chip mounting equipment.

[0131] When two sets of dispensing and mounting modules are used to process different areas of the PCB substrate in parallel, the upper vision system 4 is first moved above the position where the product needs to be dispensed, point recognition is completed, and then the dispensing mechanism is moved above the recognized position to dispense; after dispensing is completed, the mounting shaft 3 picks up the chip from the chip feeding mechanism 8, and the chip is recognized by the lower vision system 5, and then moved to the recognized position for chip mounting.

[0132] Specifically, after the jig is positioned and fixed at the first station, the upper vision system 4 of the first set (left side) is moved above the position where the product needs to be dispensed to complete point recognition, the subsequent dispensing mechanism 6 is moved above the recognized position to dispense the product, and then the mounting shaft 3 picks up the chip from the blue film of the chip feeding mechanism 8 and moves to the position of the lower vision system 5 for chip recognition, and then moves to the mounting position to complete the mounting of the chip once.

[0133] When two sets of dispensing and mounting modules are used to process different processes of the patch process in parallel, the dispensing and mounting module near the jig feeding mechanism 7 is only used for dispensing, and the other dispensing and mounting module is only used for chip mounting, and after dispensing is completed, the jig is moved to the next station for chip mounting.

[0134] Specifically, after the jig is positioned and fixed at the first station, the upper vision system 4 near the jig feeding mechanism 7 is moved above the position where the product needs to be dispensed to complete point recognition, and then the subsequent dispensing mechanism 6 is moved above the recognized position to dispense the product; after the product in the jig is dispensed, it is transported to the second station by the flow line, the upper vision system 4 near the unloading mechanism 9 is moved above the product to complete mounting position recognition, and then the mounting shaft 3 picks up the chip from the blue film of the chip feeding mechanism 8 and moves to the position of the lower vision system 5 for chip recognition, and then moves to the mounting position to complete the mounting of the chip once.

[0135] Among them, the application is applied to the mounting of the UV process, and the left and right stations can be arbitrarily switched between the dispensing mode and the mounting mode; and the product includes an optical module, and each jig can carry 5-8 optical modules.

[0136] In summary, the application provides a double-gantry chip mounting device and method, the glue dispensing and mounting module can dispense glue and / or mount chips under visual guidance, when two sets of modules are mounted in parallel, each set can independently complete glue dispensing and mounting work, thereby processing different areas of the PCB in parallel; when the two sets work together, they can be used for dispensing glue and mounting chips in the UV process, realizing parallel processing of different processes in the UV mounting process, thereby improving the space utilization of the mounting device, significantly improving the mounting efficiency of the chip mounting device and the UPH value of the device; and the inertial forces generated by the symmetrical motion in the double-gantry structure can be partially offset, realizing dynamic load balancing, reducing the vibration sensitivity of the whole machine device, and improving the chip mounting precision.

[0137] In the description of the application, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the application.

[0138] In the description of the application, it should be noted that unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0139] In addition, the terms "first", "second", etc. are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second", etc. can explicitly or implicitly include one or more features. In the description of the application, unless otherwise stated, the meaning of "multiple" is two or more.

[0140] The above is based on the ideal embodiment of the application, through the above description, relevant personnel can make various changes and modifications without deviating from the technical idea of the application. The technical scope of the application is not limited to the contents of the specification, and the technical scope must be determined according to the scope of claims.

Claims

1. A twin gantry die placement apparatus, characterized by: The application relates to a double-gantry structure, which comprises a base, an X-axis module connected with the base, two sets of Y-axis modules connected with the output end of the X-axis module, Z-axis modules connected with the output end of each set of Y-axis modules, dispensing and mounting modules for dispensing and / or chip mounting connected with the output end of the Z-axis modules, and two sets of dispensing and mounting modules capable of parallel mounting or cooperation. The dispensing and mounting module comprises a mounting shaft for picking up chips, a dispensing mechanism arranged on one side of the mounting shaft, and an upper visual system for identifying the dispensing and mounting positions. The mounting shaft comprises a shaft seat connected with the output end of the Z-axis module, a Z-direction micro-motion table movably arranged on the shaft seat in the Z-axis direction, a hollow rotating platform arranged on the Z-direction micro-motion table, and a mounting suction nozzle for picking up chips connected with the output end of the hollow rotating platform. The base is further provided with a streamline conveying mechanism for conveying a jig, the streamline conveying mechanism penetrates through the double-gantry structure, jig feeding and discharging mechanisms are arranged at the two ends of the streamline conveying mechanism respectively, and a chip feeding mechanism and a lower visual system for identifying chips are arranged on one side of the streamline conveying mechanism.

2. The twin gantry chip mounter according to claim 1, characterized by: The streamline conveying mechanism comprises a bottom plate connected with the base, an independent feeding streamline, a mounting streamline and a discharging streamline arranged on the bottom plate in sequence, a discharging pushing mechanism arranged below the discharging streamline and capable of pushing the jig into the discharging mechanism, and a streamline width adjusting mechanism arranged on the feeding streamline, the mounting streamline and the discharging streamline and capable of adjusting the width of the streamline.

3. The twin gantry chip mounter according to claim 2, characterized by: The mounting streamline comprises a second streamline main body for conveying the jig, a jacking mechanism arranged on the inner side of the second streamline main body and capable of jacking the jig, a second position sensing mechanism arranged on one side of the jacking mechanism and capable of sensing the position of the jig, and a second streamline stop mechanism arranged on the other side of the jacking mechanism and capable of stopping the jig.

4. The twin gantry chip mounter according to claim 3, characterized by: The jacking mechanism comprises a jacking seat connected with the bottom plate, a cam shaft rotatably arranged on the inner side of the jacking seat, a jacking plate arranged above the cam shaft and capable of fixing the jig, and the jacking plate is in sliding connection with the jacking seat.

5. The twin gantry chip mounter according to claim 1, characterized by: The jig feeding mechanism comprises a feeding fixing table and a feeding cage limiting assembly for receiving a feeding cage, the feeding fixing table is connected with the base, a feeding cage lifting mechanism is arranged on the feeding fixing table and capable of driving the feeding cage limiting assembly to lift, and a feeding pushing mechanism is arranged on one side of the feeding cage limiting assembly and capable of pushing the jig in the feeding cage into the feeding streamline.

6. A twin gantry die attach method using the twin gantry die attach apparatus according to any one of claims 1 to 5, characterized by, The chip feeding mechanism adopts blue film feeding, and suction nozzle library mechanisms are arranged on the two sides of the chip feeding mechanism and capable of replacing the suction nozzle of the mounting shaft. The application further discloses a double-gantry structure mounting method, which comprises the following steps: S1, the jig feeding mechanism pushes the jig with products to the streamline conveying mechanism; S2, the streamline conveying mechanism conveys the jig to the work position of the mounting streamline to realize positioning and fixing; S3, two sets of dispensing and mounting modules respectively dispense and / or mount the chips on the jig; and S4, the streamline conveying mechanism pushes the jig with products to the dispensing and mounting module. S4, after the product is completed chip mounting, the fixture is transported to the discharge flow line and pushed into the discharging mechanism by the discharge pushing mechanism.

7. The twin gantry die bonding method of claim 6, wherein When the two dispensing and mounting modules are used in parallel, the upper vision system is used to move to the position above the product to be dispensed, the dispensing mechanism is moved to the position above the recognized position to dispense, the dispensing is completed, the mounting shaft picks up the chip from the chip feeding mechanism, and the chip is recognized by the lower vision system. After correct recognition, the chip is mounted at the recognized position.

8. The twin gantry die attach method of claim 7, wherein: When the two dispensing and mounting modules are used in cooperation, the dispensing and mounting module close to the fixture feeding mechanism is only used for dispensing, the other dispensing and mounting module is only used for chip mounting, and after the dispensing is completed, the fixture is moved to the next station for chip mounting.

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