Condenser and refrigeration system

Abstract

This invention relates to the field of refrigeration technology, specifically disclosing a condenser and a refrigeration system. The condenser comprises a cooling medium cavity and a refrigerant cavity, which exchange heat with each other via heat exchange walls. The heat exchange wall facing the refrigerant cavity forms a condensation wall surface. The cooling medium cavity is used for the flow of liquid cooling medium; the refrigerant cavity is used for the flow of refrigerant, and the refrigerant vapor in the refrigerant cavity can condense into liquid refrigerant on the condensation wall surface. At least a portion of the condensation wall surface has hydrophilic and hydrophobic surfaces, which are alternately distributed. By applying the condenser provided by this invention, and by providing at least a portion of the condensation wall surface with alternately distributed hydrophilic and hydrophobic surfaces, film condensation is less likely to form on the condensation wall surface, allowing for rapid and long-lasting maintenance of bead-like condensation. This reduces liquid film thermal resistance and thereby improves vapor condensation efficiency.

Description

Technical Field

[0001] This invention relates to the field of refrigeration technology, and more specifically, to a condenser and a refrigeration system. Background Technology

[0002] A condenser is an important component of a refrigeration system and a type of heat exchanger that converts gas or vapor into liquid. Condensers are classified according to their structure, including shell-and-tube condensers and double-tube condensers.

[0003] In the process of developing this application, the inventors discovered at least the following problems in the prior art:

[0004] Taking a shell-and-tube condenser as an example, when the condensation rate is high, film condensation easily forms on the surface of the heat exchange tubes. During film condensation, a continuous liquid film always exists on the wall of the heat exchange tubes, with its thickness increasing along the direction of gravity. This means that the latent heat of phase change released during condensation must pass through the liquid film to be transferred to the cooling medium in the heat exchange tubes, making the liquid film layer the main thermal resistance for heat transfer. In summary, film condensation easily forms on the surface of the condenser's heat exchange tubes, resulting in high liquid film thermal resistance and thus reducing the condensation efficiency of the condenser. Summary of the Invention

[0005] In view of this, the purpose of the present invention is to provide a condenser and a refrigeration system, the structural design of which can effectively solve the problem that the condenser's condensation efficiency is reduced due to the easy formation of film condensation on the surface of the heat exchange pipes.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A condenser having a cooling medium cavity and a refrigerant cavity that can exchange heat with each other through a heat exchange wall, wherein a condensation wall is formed on the wall surface of the heat exchange wall facing the refrigerant cavity;

[0008] The cooling medium chamber is used for the flow of liquid cooling medium;

[0009] The refrigerant chamber is used for refrigerant flow, and the refrigerant vapor in the refrigerant chamber can be condensed into liquid refrigerant on the condensing wall surface;

[0010] At least a portion of the condensation wall surface is provided with a hydrophilic surface and a hydrophobic surface, and the hydrophilic surface and the hydrophobic surface are alternately distributed.

[0011] Optionally, in the above-mentioned condenser, the condensing wall surface is provided with micro-nano pits, the hydrophilic surface includes the inner surface of the micro-nano pits, and the hydrophobic surface includes the condensing wall surface surrounding the micro-nano pits.

[0012] Optionally, in the above-described condenser, at least the portion of the condenser wall facing upwards is provided with the micro-nano pits.

[0013] Optionally, in the above-mentioned condenser, the width of the micro-nano pits ranges from 100 to 200 μm; the depth of the micro-nano pits ranges from 50 to 80 μm; and the spacing between adjacent micro-nano pits ranges from 200 to 300 μm.

[0014] Optionally, in the above-mentioned condenser, the condensation wall surface is provided with micro-nano protrusions, the hydrophilic surface includes the outer surface of the micro-nano protrusions, and the hydrophobic surface includes the condensation wall surface surrounding the micro-nano protrusions.

[0015] Optionally, in the condenser described above, at least the portion of the condenser wall facing downwards is provided with the micro-nano protrusions.

[0016] Optionally, in the above-mentioned condenser, the hydrophilic surface includes a hydrophilic coating disposed on the condenser wall, and the hydrophobic surface includes a hydrophobic coating disposed on the condenser wall.

[0017] Optionally, in the above-mentioned condenser, the hydrophilic surface is a micro / nano hydrophilic surface, and / or the hydrophobic surface is a micro / nano hydrophobic surface.

[0018] Optionally, the above-mentioned condenser includes:

[0019] Equipment housing or refrigerant piping;

[0020] A cooling medium pipe, in which a cooling medium cavity is formed, is disposed within the equipment housing or the refrigerant pipe, and the refrigerant cavity is formed between the equipment housing or the refrigerant pipe and the cooling medium pipe, and the outer wall of the cooling medium pipe is the condensation wall surface.

[0021] The condenser provided by this invention has a cooling medium cavity and a refrigerant cavity that can exchange heat with each other through a heat exchange wall. The heat exchange wall facing the refrigerant cavity has a condensation wall surface; the cooling medium cavity is used for the flow of liquid cooling medium; the refrigerant cavity is used for the flow of refrigerant, and the refrigerant vapor in the refrigerant cavity can condense into liquid refrigerant on the condensation wall surface; at least a portion of the condensation wall surface has a hydrophilic surface and a hydrophobic surface, and the hydrophilic and hydrophobic surfaces are alternately distributed.

[0022] The condenser provided by this invention mainly comprises two parts of working fluid flow: cooling medium flow and refrigerant flow. Refrigerant vapor can exchange heat with the cooling medium through the heat exchange wall, increasing the temperature of the cooling medium. The refrigerant vapor condenses into liquid refrigerant at the condensation wall surface. In this application, by providing at least a portion of the condensation wall surface with alternately distributed hydrophilic and hydrophobic surfaces, condensation nuclei tend to occur on the hydrophilic surface, while liquid condensed on the hydrophobic surface is difficult to adhere to. Therefore, the condensate, i.e., the liquid refrigerant, is less likely to form a film-like condensation, and more likely to form droplets that rapidly drip under gravity.

[0023] In summary, the condenser provided in this application, due to the alternating distribution of hydrophilic and hydrophobic surfaces, does not easily form film condensation on the condenser wall, and can quickly and for a long time maintain bead-like condensation, thus reducing the liquid film thermal resistance and thereby improving the steam condensation efficiency.

[0024] To achieve the above objectives, the present invention also provides a refrigeration system comprising any of the aforementioned condensers. Since the aforementioned condensers possess the above-described technical effects, the refrigeration system having such condensers should also possess the corresponding technical effects. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of a condenser according to a specific embodiment of the present invention;

[0027] Figure 2 This refers to the mass transfer path of refrigerant vapor condensing into liquid refrigerant;

[0028] Figure 3 This is a schematic diagram of the structure of a condensation wall surface according to a specific embodiment of the present invention;

[0029] Figure 4 for Figure 3 A schematic diagram of the longitudinal section;

[0030] Figure 5 This is a schematic diagram of the structure of the condensation wall surface according to another specific embodiment of the present invention;

[0031] Figure 6 for Figure 5 A schematic diagram of the cross-section.

[0032] Figure label:

[0033] 1-Heat exchange wall; 11-Condensation wall; 2-Cooling medium cavity; 3-Refrigerant cavity; 111-Hydrophilic surface; 112-Hydrophobic surface; 113-Micro-nano pits; 114-Micro-nano protrusions; d-Width of micro-nano pits; h-Depth of micro-nano pits; s-Spacing between adjacent micro-nano pits;

[0034] 01-Equipment housing; 02-Cooling medium diversion device; 03-Cooling medium transfer device; 04-Tube sheet; 05-Cooling medium pipe; 06-Cooling medium; 071-Liquid refrigerant; 072-Refrigerant vapor; 011-Refrigerant return port; 012-Refrigerant vapor outlet; 021-Cooling medium inlet; 022-Cooling medium outlet; 023-Diversion baffle; 031-Transfer baffle. Detailed Implementation

[0035] This invention discloses a condenser and a refrigeration system to reduce liquid film thermal resistance and improve the condensation efficiency of the condenser.

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] A condenser is a heat exchanger that releases heat to the cooling medium flowing through it while allowing the refrigerant to condense from vapor into liquid. The condenser provided in this application can be used as a heat exchanger in, but is not limited to, vapor compression systems and adsorption refrigeration systems.

[0038] Please see Figure 1 and Figure 2 The condenser provided in this application has a cooling medium chamber 2 and a refrigerant chamber 3 that can exchange heat with each other through a heat exchange wall 1. The cooling medium chamber 2 is used for the flow of liquid cooling medium 06, and the refrigerant chamber 3 is used for the flow of refrigerant. It is understood that the shapes of the cooling medium chamber 2 and the refrigerant chamber 3 can be set as needed, and are not specifically limited here. The cooling medium 06 in the cooling medium chamber 2 and the refrigerant in the refrigerant chamber 3 can exchange heat with each other through the heat exchange wall 1. The wall surface of the heat exchange wall 1 facing the refrigerant chamber 3 is formed with a condensation wall surface 11, and the refrigerant vapor 072 in the refrigerant chamber 3 can be condensed into liquid refrigerant 071 on the condensation wall surface 11.

[0039] In one approach, please refer to Figure 1The condenser includes a housing 01 and a cooling medium pipe 05. A cooling medium cavity 2 is formed inside the cooling medium pipe 05. The cooling medium pipe 05 is located inside the housing 01, and a refrigerant cavity 3 is formed between the housing 01 and the cooling medium pipe 05. The outer wall of the cooling medium pipe 05 is a condensation wall surface 11. The housing 01 provides a large space for the refrigerant, has high heat transfer efficiency, and is easy to clean. The shape of the housing 01 can be set as needed, such as using a square shell.

[0040] For example, the equipment housing 01 is provided with a refrigerant return port 011 and a refrigerant vapor outlet 012. The refrigerant return port 011 is used to connect to the return pipeline, and the refrigerant vapor outlet 012 is used to connect to the vapor adsorption device. A cooling medium distribution device 02 is provided on one side of the equipment housing 01, which has a cooling medium inlet 021 and a cooling medium outlet 022. A distribution baffle 023 can be installed inside the cooling medium distribution device 02. A cooling medium transfer device 03 is provided on the other side of the equipment housing 01, which has a transfer baffle 031 inside. The distribution baffle 023 and the transfer baffle 031 can be set according to the number of tube passes required for condensation performance. Figure 1 The number of tube passes is 4. The cooling medium distribution device 02 and the cooling medium transfer device 03 are respectively assembled and connected to the equipment housing 01 to form a condenser frame. Tube sheets 04 are respectively installed at the connection points between the cooling medium distribution device 02, the cooling medium transfer device 03 and the equipment housing 01. A cooling medium tube assembly is provided inside the equipment housing 01. The tube sheet 04 has tube sheet holes, and each cooling medium tube 05 of the cooling medium tube assembly is sealed and connected to the corresponding tube sheet hole. The cooling medium tubes 05 connect the cooling medium distribution device 02 and the cooling medium transfer device 03 to each other.

[0041] Please see Figure 2 Because of the high pressure in the condenser, the evaporation temperature of the refrigerant is higher than the temperature of the cooling medium 06 flowing in through the cooling medium inlet 021. Cooling medium 06 enters the cooling medium distribution device 02 through the cooling medium inlet 021, then flows through the cooling medium pipe 05 to the cooling medium transfer device 03, and then back to the cooling medium distribution device 02 from the cooling medium pipe 05. This cycle continues until cooling medium 06 exits the condenser through the cooling medium outlet 022. Since the temperature of cooling medium 06 is lower than that of refrigerant vapor 072, the heat from the high-temperature refrigerant vapor 072 on the outer wall of the cooling medium pipe 05 is conducted to its inner wall and further absorbed by the cooling medium 06, causing the temperature of cooling medium 06 to gradually increase. The refrigerant vapor 072 condenses into liquid refrigerant 071 on the outer wall of the cooling medium pipe 05. The condensed liquid refrigerant 071 flows out of the condenser through the refrigerant return port 011 and enters the return pipeline.

[0042] For example, the cooling medium pipes 05 are arranged in multiple rows within the equipment housing 01. The spacing between adjacent cooling medium pipes 05 in a single row ranges from 5mm to 7mm, and the spacing between adjacent rows ranges from 9mm to 12mm. The refrigerant return port 011 and the refrigerant vapor outlet 012 are located at the bottom of the equipment housing 01. A refrigerant return channel of 10-15mm is provided between the cooling medium pipes 05 directly above the refrigerant return port 011 and the refrigerant vapor outlet 012 and the equipment housing 01.

[0043] In another embodiment, the condenser includes a refrigerant tube and a cooling medium tube 05. A cooling medium cavity 2 is formed inside the cooling medium tube 05, which is located within the refrigerant tube. A refrigerant cavity 3 is formed between the refrigerant tube and the cooling medium tube 05. The outer wall of the cooling medium tube 05 is a condensation wall 11, where refrigerant vapor 072 condenses into liquid refrigerant 071. The refrigerant tube and the cooling medium tube 05 are nested together, with the refrigerant tube surrounding the cooling medium tube 05. This arrangement provides high heat exchange efficiency, a simple structure, and a small condenser footprint.

[0044] In another embodiment, the condenser includes a refrigerant pipe and a cooling medium pipe 05. The cooling medium pipe 05 is sleeved outside the refrigerant pipe, and a refrigerant cavity 3 is formed inside the refrigerant pipe. A cooling medium cavity 2 is formed between the refrigerant pipe and the cooling medium pipe 05. The inner wall of the refrigerant pipe is a condensation wall surface 11, and refrigerant vapor 072 condenses into liquid refrigerant 071 on the inner wall of the refrigerant pipe. In this embodiment, the refrigerant pipe and the cooling medium pipe 05 are sleeved together, with the refrigerant pipe sleeved inside the cooling medium pipe 05.

[0045] In another embodiment, the condenser includes a refrigerant pipe and a cooling medium pipe 05, which are fitted together. A refrigerant cavity 3 is formed inside the refrigerant pipe, and a cooling medium cavity 2 is formed inside the cooling medium pipe 05. The inner wall of the refrigerant pipe is a condensation wall surface 11, and refrigerant vapor 072 condenses into liquid refrigerant 071 on the inner wall of the refrigerant pipe. In this embodiment, the heat exchange wall 1 includes the wall of the fitted refrigerant pipe and the wall of the cooling medium pipe 05. The heat from the high-temperature refrigerant vapor 072 inside the refrigerant pipe is transferred to the wall of the cooling medium pipe 05 through the refrigerant pipe wall, and is further absorbed by the cooling medium 06 through its inner wall surface.

[0046] The condenser provided in this application provides alternating hydrophilic surfaces 111 and hydrophobic surfaces 112 on at least a portion of the condensing wall 11 to promote the formation of liquid droplets on the condensing wall 11, thereby forming bead-like condensation that is difficult to generate and maintain for a long time on conventional metal surfaces. The thermal resistance of film condensation is more than an order of magnitude greater than that of bead-like condensation. Therefore, the formation of bead-like condensation on the condensing wall 11 significantly reduces the thermal resistance. The following embodiments mainly describe the specific structure of the condensing wall 11, and the condensing wall 11 is applicable to, but not limited to, any of the condensers in the above embodiments.

[0047] In some embodiments, please refer to Figures 1-4 The condenser provided by the present invention has a cooling medium cavity 2 and a refrigerant cavity 3 that can exchange heat with each other through a heat exchange wall 1. The heat exchange wall 1 has a condensation wall surface 11 on its surface facing the refrigerant cavity 3. The cooling medium cavity 2 is used for the flow of liquid cooling medium 06; the refrigerant cavity 3 is used for the flow of refrigerant, and the refrigerant vapor 072 in the refrigerant cavity 3 can condense into liquid refrigerant 071 on the condensation wall surface 11.

[0048] At least a portion of the condensation wall surface 11 is provided with a hydrophilic surface 111 and a hydrophobic surface 112, and the hydrophilic surface 111 and the hydrophobic surface 112 are alternately distributed. In this embodiment, at least a portion of the condensation wall surface 11 differs from a conventional metal surface, instead having an alternating distribution of hydrophilic and hydrophobic surfaces 111 and 112. For example, through hydrophilic-hydrophobic treatment, at least a portion of the condensation wall surface 11 exhibits alternating hydrophilic and hydrophobic properties. In one example, the entire condensation wall surface 11 is provided with alternating hydrophilic and hydrophobic surfaces 112. In another example, a portion of the condensation wall surface 11 is provided with alternating hydrophilic and hydrophobic surfaces 112. It is understood that the alternating distribution here means that at least one adjacent side of the hydrophilic surface 111 is set as a hydrophobic surface 112, and at least one adjacent side of the hydrophobic surface 112 is set as a hydrophilic surface 111.

[0049] The condenser provided by this invention mainly includes two parts of working fluid flow: cooling medium 06 flow and refrigerant flow. Refrigerant vapor 072 can exchange heat with the cooling medium 06 through the heat exchange wall 1, causing the temperature of the cooling medium 06 to rise. The refrigerant vapor 072 condenses into liquid refrigerant 071 at the condensing wall surface 11. In this application, by providing at least a portion of the condensing wall surface 11 with alternately distributed hydrophilic surfaces 111 and hydrophobic surfaces 112, condensation nuclei tend to occur on the hydrophilic surface 111, while the liquid condensed on the hydrophobic surface 112 is difficult to adhere to. Therefore, the condensate, i.e., the liquid refrigerant 071, is unlikely to form a film-like condensation, and is more likely to form droplets that quickly drip off under gravity.

[0050] In summary, the condenser provided in this application has a hydrophilic surface 111 and a hydrophobic surface 112 that are alternately distributed, so the condensation wall 11 is not prone to forming film condensation, and can maintain bead-like condensation quickly and for a long time, thus reducing the liquid film thermal resistance and improving the steam condensation efficiency.

[0051] In some embodiments, the hydrophilic surface 111 is a micro / nano hydrophilic surface, and / or the hydrophobic surface 112 is a micro / nano hydrophobic surface. In one example, the hydrophilic surface 111 is a micro / nano hydrophilic surface. In another example, the hydrophobic surface 112 is a micro / nano hydrophobic surface. In yet another example, the hydrophilic surface 111 is a micro / nano hydrophilic surface, and the hydrophobic surface 112 is a micro / nano hydrophobic surface. It is understood that, here, a micro / nano hydrophilic surface refers to the length and width of the hydrophilic surface 111 being on the micrometer or nanometer scale, and a micro / nano hydrophobic surface refers to the length and width of the hydrophobic surface 112 being on the micrometer or nanometer scale. The shapes of the hydrophilic surface 111 and the hydrophobic surface 112 can be set as needed, such as rectangular, circular, etc., and the length and width of the hydrophilic surface 111 and the hydrophobic surface 112 refer to the farthest distance between their two ends in two mutually perpendicular directions. For example, micro / nano hydrophilic surfaces and micro / nano hydrophobic surfaces are alternately distributed, that is, micron-scale hydrophilic surfaces 111 and hydrophobic surfaces 112 are alternately distributed, or nano-scale hydrophilic surfaces 111 and hydrophobic surfaces 112 are alternately distributed, or micron-scale and nano-scale hydrophilic surfaces 111 and micron-scale and nano-scale hydrophobic surfaces 112 are alternately distributed. By setting at least one of the hydrophilic surface 111 and hydrophobic surface 112 to the micro / nano scale, film-like condensation is better avoided, and it is more conducive to maintaining bead-like condensation quickly and for a long time.

[0052] In some embodiments, please refer to Figure 3 and Figure 4The condensation wall 11 is provided with micro-nano pits 113. The hydrophilic surface 111 includes the inner surface of the micro-nano pits 113, and the hydrophobic surface 112 includes the condensation wall 11 surrounding the micro-nano pits 113. Traditional smooth condensation wall 11 has a slow condensation nucleation rate, and under high subcooling, the condensate cannot detach from the surface in time, resulting in aggregation. In the process of developing this application, the inventors discovered that condensation nucleation is more likely to occur at the corners or edges of microstructures, and more likely to occur on the hydrophilic surface 111. Therefore, in this embodiment, micro-nano pits 113 are provided on the condensation wall 11, and the inner surface of the micro-nano pits 113 is set as a hydrophilic surface 111, i.e., a micro-nano hydrophilic surface, which helps to form condensate within the pits and facilitates condensate aggregation. Simultaneously, the condensation wall 11 surrounding the micro-nano pits 113 uses a hydrophobic surface 112. For example, the condenser wall 11 is provided with multiple micro-nano pits 113, with the spacing between adjacent micro-nano pits 113 on the micrometer or nanometer scale, to form a micro-nano hydrophobic surface. When the size of the droplet in the micro-nano pit 113 exceeds the size of the micro-nano pit 113, it contacts the hydrophobic surface 112, which allows the condensed liquid refrigerant 071 to detach rapidly. In summary, by setting up the micro-nano pits 113 and treating the hydrophilic and hydrophobic surfaces, higher nucleation efficiency can be provided, and the condensate can be quickly removed from the condenser wall 11.

[0053] In some embodiments, at least a portion of the condensing wall surface 11 facing upwards is provided with micro-nano recesses 113. It is understood that "facing upwards" here refers to being directly above or diagonally above the vertical direction when the condenser is operating; that is, when the condenser is operating, at least a portion of the condensing wall surface 11 facing directly above or diagonally above the vertical direction is provided with micro-nano recesses 113. When the condenser is not operating, the orientation of the condensing wall surface 11 is not specifically limited. In other words, in this embodiment, at least a portion of the condensing wall surface 11 is provided with micro-nano recesses 113, and when the condenser is installed, the portion with at least the micro-nano recesses 113 is oriented directly above or diagonally above the vertical direction. Specifically, the orientation of the condensing wall surface 11 can be determined by the position of the condenser's mounting surface, thereby setting the position of the micro-nano recesses 113. Since the condensate flows or detaches from the condenser wall 11 under the action of gravity, the condensate is relatively more difficult to detach from the part of the condenser wall 11 facing upward. Therefore, by setting micro-nano pits 113 on it and forming a hydrophilic surface 111 and a hydrophobic surface 112, the condensate is easier to detach, thereby improving the heat exchange efficiency of the condenser.

[0054] In some embodiments, the width d of the micro-nano pit 113 ranges from 100 to 200 μm. Preferably, the width d of the micro-nano pit 113 ranges from 130 to 170 μm. For example, the width d of the micro-nano pit 113 is 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, or 200 μm.

[0055] The depth h of the micro-nano pit 113 ranges from 50 to 80 μm, preferably from 60 to 70 μm. For example, the depth h of the micro-nano pit 113 is 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm or 80 μm.

[0056] The spacing s between adjacent micro-nano pits 113 ranges from 200 to 300 μm, preferably from 230 to 370 μm. For example, the spacing s between adjacent micro-nano pits 113 is 200 μm, 210 μm, 220 μm, 23 μm, 240 μm, 250 μm, 260 μm, 270 μm, 280 μm, 290 μm or 300 μm.

[0057] The micro-nano pits 113, designed as described above, can provide high nucleation efficiency and ensure that the condensate is quickly removed from the condensation wall 11, working together to achieve excellent condensation-enhanced heat transfer effect.

[0058] In some embodiments, please refer to Figure 5 and Figure 6 The condensation wall 11 is provided with micro-nano protrusions 114. The hydrophilic surface 111 includes the outer surface of the micro-nano protrusions 114, and the hydrophobic surface 112 includes the condensation wall 11 surrounding the micro-nano protrusions 114. The above embodiment describes the provision of micro-nano pits 113 on the condensation wall 11. In this embodiment, by providing micro-nano protrusions 114 on the condensation wall 11, condensation nucleation is more likely to occur in the microstructure, thus improving the nucleation efficiency. Furthermore, the outer surface of the micro-nano protrusions 114 is at least partially hydrophilic, forming a micro-nano hydrophilic surface. Preferably, the outer surface of the micro-nano protrusions 114 is entirely a micro-nano hydrophobic surface. The condensate can continuously accumulate on the micro-nano hydrophilic surface, and the micro-nano protrusions 114 reduce the contact area between the condensate and the condensation wall 11. Therefore, as the condensate accumulates and combines, it can quickly drip off the condensation wall 11 under gravity. In summary, with the above configuration, the condenser wall 11 can maintain bead-like condensation quickly and for a long time, reducing liquid film thermal resistance and improving steam condensation efficiency. For example, the condenser wall 11 is provided with multiple micro / nano protrusions 114, and the spacing between adjacent micro / nano protrusions 114 is at the micrometer or nanometer level to form a micro / nano hydrophobic surface.

[0059] In some embodiments, at least a portion of the condenser wall surface 11 facing downwards is provided with micro-nano protrusions 114. It is understood that "facing downwards" here refers to being directly below or diagonally below the vertical direction when the condenser is in operation; that is, when the condenser is in operation, at least a portion of the condenser wall surface 11 facing directly below or diagonally below the vertical direction has micro-nano protrusions 114. When the condenser is not in operation, the orientation of the condenser wall surface 11 is not specifically limited. In other words, in this embodiment, at least a portion of the condenser wall surface 11 is provided with micro-nano protrusions 114, and when the condenser is installed, the portion with at least the micro-nano protrusions 114 faces directly below or diagonally below the vertical direction. Specifically, the orientation of the condenser wall surface 11 can be determined by the position of the condenser's mounting surface, thereby determining the position of the micro-nano recesses 113. After the refrigerant vapor 072 condenses into liquid refrigerant, the liquid refrigerant, i.e. the condensate, can collect downward along the condenser wall 11 under the action of gravity. Therefore, micro-nano protrusions 114 are provided on the condenser wall 11 facing directly downward or diagonally downward in the vertical direction, which can guide the condensate to the end of the micro-nano protrusions 114, thereby allowing the condensate to detach more quickly.

[0060] In some embodiments, please refer to Figure 5 and Figure 6 The condensation wall surface 11 facing downwards has micro-nano protrusions 114, and the condensation wall surface 11 facing upwards has micro-nano pits 113. The hydrophilic surface 111 includes the outer surface of the micro-nano protrusions 114 and the inner surface of the micro-nano pits 113. The portion of the condensation wall surface 11 other than the micro-nano pits 113 and micro-nano protrusions 114 is a hydrophobic surface 112. For example, the condensation wall surface 11 facing directly downwards and diagonally downwards in the vertical direction has micro-nano protrusions 114, and the condensation wall surface 11 facing directly upwards and diagonally upwards in the vertical direction has micro-nano pits 113. With this configuration, under high subcooling, condensation easily occurs on the inner surface of the micro-nano pit 113, and the condensate rapidly accumulates. When the droplet size exceeds the micro-nano pit 113, it comes into contact with the hydrophobic surface 112, and the condensate can flow rapidly along it to the outer surface of the micro-nano protrusion 114. As the condensate continuously accumulates and combines on the micro-nano protrusion 114, it quickly drips off the condensation wall 11 under the action of gravity.

[0061] In some embodiments, micro-nano pits 113 or micro-nano protrusions 114 are fabricated on the condensation wall 11 using micro-nano fabrication techniques such as electrochemical etching or laser ablation. Alternatively, micro-nano protrusions 114 can be fabricated on the condensation wall 11 using additive manufacturing. Then, the micro-nano protrusions 114 or micro-nano pits 113 and the surrounding condensation wall 11 are selectively treated with hydrophilic or hydrophobic properties using chemical modification methods such as self-assembled monolayers or sol-gel methods to form the aforementioned hydrophilic surface 111 and hydrophobic surface 112.

[0062] In some embodiments, the hydrophilic surface 111 includes a hydrophilic coating disposed on the condensation wall surface 11, and the hydrophobic surface 112 includes a hydrophobic coating disposed on the condensation wall surface 11. The above embodiments illustrate the provision of micro-nano pits 113 or micro-nano protrusions 114 on the condensation wall surface 11 as the hydrophilic surface 111. In this embodiment, alternating hydrophilic and hydrophobic surfaces, i.e., hydrophilic and hydrophobic coatings, can also be directly formed by spraying, which can also promote the formation of bead-like condensation on the condensation wall surface 11 and is easy to shape. In one example, the condensation wall surface 11 is provided with multiple hydrophilic coatings, and the condensation wall surface 11 other than the multiple hydrophilic coatings is provided with a hydrophobic coating. In another example, the condensation wall surface 11 is provided with multiple hydrophobic coatings, and the condensation wall surface 11 other than the multiple hydrophobic coatings is provided with a hydrophilic coating.

[0063] In some embodiments, the hydrophilic surfaces 111 and / or hydrophobic surfaces 112 are arranged in an array. The array distribution of the hydrophilic surfaces 111 facilitates molding and promotes the nucleation and detachment of condensate, preventing the formation of film condensation and enhancing steam condensation heat transfer. Correspondingly, the array distribution of the hydrophobic surfaces 112 facilitates molding and promotes the nucleation and detachment of condensate, preventing the formation of film condensation and enhancing steam condensation heat transfer.

[0064] Based on the condensers provided in the above embodiments, the present invention also provides a refrigeration system, which includes any of the condensers described in the above embodiments. Since this refrigeration system uses the condensers described in the above embodiments, the beneficial effects of this refrigeration system are explained in the above embodiments.

[0065] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0066] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A condenser characterized by, A cooling medium cavity (2) and a refrigerant cavity (3) are formed, which can exchange heat with each other through a heat exchange wall (1). A condensation wall surface (11) is formed on the wall surface of the heat exchange wall (1) facing the refrigerant cavity (3). The cooling medium chamber (2) is used for the flow of liquid cooling medium (06); The refrigerant chamber (3) is used for refrigerant circulation, and the refrigerant vapor (072) in the refrigerant chamber (3) can be condensed into liquid refrigerant (071) on the condensing wall (11). At least a portion of the condensation wall surface (11) is provided with a hydrophilic surface (111) and a hydrophobic surface (112), and the hydrophilic surface (111) and the hydrophobic surface (112) are alternately distributed.

2. The condenser of claim 1, wherein The condensation wall (11) is provided with micro-nano pits (113), the hydrophilic surface (111) includes the inner surface of the micro-nano pits (113), and the hydrophobic surface (112) includes the condensation wall (11) surrounding the micro-nano pits (113).

3. The condenser of claim 2, wherein, The condensation wall surface (11) facing upwards is provided with the micro-nano pits (113).

4. The condenser according to claim 2, characterized in that, The width of the micro-nano pit (113) ranges from 100 to 200 μm; the depth of the micro-nano pit (113) ranges from 50 to 80 μm; and the spacing between adjacent micro-nano pits (113) ranges from 200 to 300 μm.

5. The condenser according to any one of claims 1-4, characterized in that, The condensation wall surface (11) is provided with micro-nano protrusions (114), the hydrophilic surface (111) includes the outer surface of the micro-nano protrusions (114), and the hydrophobic surface (112) includes the condensation wall surface (11) around the micro-nano protrusions (114).

6. The condenser according to claim 5, characterized in that, The condensation wall surface (11) facing downwards is provided with the micro-nano protrusions (114).

7. The condenser according to claim 1, characterized in that, The hydrophilic surface (111) includes a hydrophilic coating disposed on the condensation wall (11), and the hydrophobic surface (112) includes a hydrophobic coating disposed on the condensation wall (11).

8. The condenser according to claim 1, characterized in that, The hydrophilic surface (111) is a micro / nano hydrophilic surface, and / or the hydrophobic surface (112) is a micro / nano hydrophobic surface.

9. The condenser according to claim 1, characterized in that, include: Equipment housing (01) or refrigerant pipe; Cooling medium pipe (05), cooling medium cavity (2) is formed inside the cooling medium pipe (05), the cooling medium pipe (05) is disposed in the equipment housing (01) or the refrigerant pipe, the refrigerant cavity (3) is formed between the equipment housing (01) or the refrigerant pipe and the cooling medium pipe (05), and the outer wall of the cooling medium pipe (05) is the condensation wall surface (11).

10. A refrigeration system, characterized in that, Includes the condenser as described in any one of claims 1-9.

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