NV color center current sensor packaging protection structure based on nanocrystalline soft magnetism and superstructure comb-shaped ground

By using a nanocrystalline soft magnetic material and a superstructure comb-like encapsulation and protection structure, the differences in the thermal expansion coefficients of materials and thermal management issues are mitigated, and multi-dimensional electromagnetic shielding is provided. This solves the encapsulation failure and measurement instability of traditional current sensors under extreme conditions, and improves measurement accuracy and stability.

CN122449167AActive Publication Date: 2026-07-24SOUTHERN POWER GRID DIGITAL GRID RESEARCH INSTITUTE CO LTD
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Patent Information

Application Number
CN202610946348.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-06-29
Publication Date
2026-07-24
Estimated Expiration
2046-06-29

AI Technical Summary

Technical Problem

Traditional current sensors suffer from packaging failure due to differences in the thermal expansion coefficients of materials under high voltage, high frequency, and high power density environments. Improper thermal management leads to a decrease in the signal-to-noise ratio, and electromagnetic interference affects measurement accuracy and stability.

Method used

The encapsulation and protection structure employs nanocrystalline soft magnets and a superstructure comb-like ground, including a stress buffer layer, a multi-layer physical shielding shell, and a thermally conductive via design, to alleviate thermal stress, improve thermal conductivity, and provide multi-dimensional electromagnetic shielding.

Benefits of technology

It effectively avoids packaging structure cracking and electromagnetic interference, improves the measurement accuracy and stability of the current sensor, and extends its service life.

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Abstract

The invention relates to an NV color center current sensor packaging protection structure based on nanocrystalline soft magnetism and a superstructure comb-shaped ground, a stress buffer layer is arranged to relieve cyclic thermal stress generated by thermal expansion coefficient differences between different materials, the structure is prevented from cracking, layering and losing efficacy, heat conduction efficiency in the vertical direction is improved through heat conduction through holes formed in a substrate, and the reliability of the NV color center current sensor packaging protection structure is improved. The multi-dimensional electromagnetic shielding is realized by matching with a multi-physical shielding shell, so that the problems of easy failure due to thermal stress accumulation, measurement performance degradation caused by insufficient heat dissipation and measurement precision instability caused by incomplete electromagnetic shielding of an existing packaging protection structure are effectively solved; the environmental adaptability of the current sensor is improved, the service life is prolonged, and the measurement precision and stability are guaranteed.
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