Resin composition

Abstract

The present invention provides: a resin composition which can provide a cured product having low dielectric loss tangent, can suppress warpage, and has excellent stain removal properties; a cured product of the resin composition; a resin sheet containing the resin composition; a circuit substrate containing the cured product of the resin composition; and a semiconductor device containing the circuit substrate. The present invention is a resin composition containing: (A) a compound having a radical-polymerizable group at a terminal, a weight average molecular weight (Mw) of more than 5,000 and 300,000 or less, and a tensile elastic modulus of 1 GPa or less as measured at 25°C according to JIS K7161, (B) an epoxy resin, (C) an active ester resin, and (D) an inorganic filler.

Description

Technical Field

[0001] This invention relates to resin compositions. Further, it relates to cured resin compositions, resin sheets, circuit boards, and semiconductor devices. Existing technology

[0002] Resin compositions containing epoxy resin and its curing agent are widely used as insulating materials for circuit boards such as printed wiring boards and rewiring substrates for semiconductor chip packaging because they can produce cured products with excellent insulation, heat resistance and adhesion.

[0003] On the other hand, with the increasing speed of communication in recent years, insulating materials for circuit boards need to have excellent dielectric properties (low dielectric loss tangent) in order to reduce transmission loss when operating in high-frequency environments. As insulating materials with excellent dielectric properties, specific curing agents such as reactive ester resins have been reported to reduce / inhibit the generation of polar groups such as secondary hydroxyl groups during the curing reaction of epoxy resins (for example, Patent Documents 1 and 2).

[0004] Existing technical documents Patent documents Patent Document 1: Japanese Patent No. 6205692 Patent Document 2: Japanese Patent No. 7259783. Summary of the Invention

[0005] The technical problem to be solved by the invention In this regard, if an active ester resin is combined to achieve good dielectric properties, the cured resin composition may warp. In addition, the stain removal properties tend to deteriorate during staining treatment.

[0006] The present invention was made in view of the above circumstances, and its object is to provide: a resin composition that can produce a cured product with low dielectric loss tangent, anti-warping properties, and excellent contamination removal; a cured product of the resin composition; a resin sheet comprising the resin composition; a circuit board comprising the cured product of the resin composition; and a semiconductor device comprising the circuit board.

[0007] Methods for solving technical problems The inventors conducted in-depth research to solve the aforementioned problems. As a result, the inventors discovered that the aforementioned problems can be solved by using a resin composition comprising (A) a compound having a terminal free radical polymerizable group, a weight-average molecular weight (Mw) exceeding 5,000 and below 300,000, and a tensile modulus of elasticity of 1 GPa or below as measured at 25°C according to JIS K7161; (B) an epoxy resin; (C) an reactive ester resin; and (D) an inorganic filler material. Thus, the present invention was completed. That is, the present invention comprises the following:

[0008] <1> A resin composition comprising: (A) a compound having a terminal free radical polymerizable group, a weight-average molecular weight (Mw) of more than 5,000 and less than 300,000, and a tensile modulus of elasticity of less than 1 GPa as determined by JIS K7161 at 25°C; (B) an epoxy resin; (C) an active ester resin; and (D) an inorganic filler. <2> according to <1> The resin composition wherein the content of component (D) is 50% by mass or more relative to 100% by mass of the non-volatile components of the resin composition; <3> according to <1> or <2> The resin composition wherein component (A) comprises an imide backbone; <4> according to <1> ~ <3> The resin composition described in any one of the following, wherein component (A) comprises an imide backbone in the main chain; <5> according to <1> ~ <4> The resin composition described in any one of the following statements, wherein component (A) comprises a structure represented by the following formula (A-1), [Chemical Formula 1] (In formula (A-1), R) A1 The symbol represents the tetravalent group remaining after removing the anhydride group from a tetracarboxylic dianhydride; * indicates a linking bond. <6> according to <5> The resin composition, wherein component (A) comprises a structure represented by the aforementioned formula (A-1) and a structure represented by the following formula (A-3), [Chemical Formula 2] (In formula (A-3), R) A3 This indicates a divalent group remaining after removing two or more hydroxyl groups from a polyol compound that has two or more hydroxyl groups in one molecule; * indicates a linking bond. <7> according to <1> ~ <6> The resin composition according to any one of the following, wherein component (A) comprises one or more structural units selected from polyolefin structural units, polycarbonate structural units, polyether structural units, polyester structural units, poly(meth)acrylic acid structural units and polysiloxane structural units. <8> according to <1> ~ <7> The resin composition according to any one of the following, wherein component (A) comprises a polyolefin structural unit; <9> according to <1> ~ <8> The resin composition according to any one of the following, wherein the content of component (A) is 0.1% by mass or more and 15% by mass or less relative to 100% by mass of the non-volatile components of the resin composition; <10> according to <1> ~ <9> The resin composition according to any one of the following, wherein the content of component (B) is 1% by mass or more and 20% by mass or less relative to 100% by mass of the non-volatile components of the resin composition; <11> according to <1> ~ <10> The resin composition according to any one of the following, wherein the content of component (C) is 1% by mass or more and 20% by mass or less relative to 100% by mass of the non-volatile components of the resin composition; <12> according to <1> ~ <11> The resin composition according to any one of the following methods, wherein the mass ratio of component (A) to component (C) (content of component (A)) / (content of component (C)) is 0.01 or more and 1 or less; <13> according to <1> ~ <12> The resin composition of any one of the following, wherein it further comprises (F) a compound having a free radical polymerizable group and a weight-average molecular weight (Mw) of 5,000 or less; <14> according to <1> ~ <13> The resin composition according to any one of the following, wherein it further comprises (G) a curing accelerator; <15> according to <1> ~ <14> The resin composition according to any one of the following, wherein it further comprises (H) a polymeric resin; <16> according to <1> ~ <15> The resin composition described in any one of the above statements is used to form an insulating layer on a circuit board. <17> <1> ~ <16> The cured product of the resin composition described in any one of the above statements; <18> A resin sheet comprising a support and a resin composition layer formed thereon. The resin composition layer contains <1> ~ <16> The resin composition described in any one of the following; <19> A circuit board, wherein, comprises <1> ~ <16> The cured product of the resin composition described in any one of the above statements; <20> A semiconductor device, wherein, includes <19> The circuit board mentioned above.

[0009] The effects of the invention According to the present invention, a resin composition that provides a cured product with low dielectric loss tangent, anti-warping properties, and excellent stain removal properties can be provided; a cured product of the resin composition; a resin sheet comprising the resin composition; a circuit board comprising the cured product of the resin composition; and a semiconductor device comprising the circuit board. Detailed Implementation

[0010] <Explanation of Terms> In this specification, the term "non-volatile component" in relation to a resin composition refers to the component constituting the resin composition other than the solvent described later. Furthermore, in this specification, the term "resin component" in relation to a resin composition refers to the component constituting the non-volatile component of the resin composition other than the inorganic filler.

[0011] Hereinafter, embodiments and examples of the present invention will be shown and described in detail. However, the present invention is not limited to the embodiments and examples described below, and may be modified and implemented in any way without departing from the scope of the claims and their equivalents.

[0012] [Resin Composition] The resin composition of the present invention is characterized by comprising: (A) a compound having a terminal free radical polymerizable group, a weight-average molecular weight (Mw) of more than 5,000 and less than 300,000, and a tensile modulus of elasticity of less than 1 GPa as measured at 25°C according to JIS K7161; (B) an epoxy resin; (C) an active ester resin; and (D) an inorganic filler. In the following description, “(A) a compound having a terminal free radical polymerizable group, a weight-average molecular weight (Mw) of more than 5,000 and less than 300,000, and a tensile modulus of elasticity of less than 1 GPa as measured at 25°C according to JIS K7161” is sometimes referred to as “(A) a high molecular weight / low elasticity compound having a terminal free radical polymerizable group”.

[0013] The resin composition of the present invention may be combined with components (A) to (D) to further include any components. Examples of such arbitrary components include: (E) other thermosetting resins, (F) compounds having free radical polymerizable groups and a weight-average molecular weight (Mw) of 5,000 or less (hereinafter, sometimes simply referred to as "(F) compounds having free radical polymerizable groups"), (G) curing accelerators, (H) polymeric resins, (I) any additives, (J) solvents, etc. The components contained in the resin composition will be described in detail below.

[0014] <(A) High molecular weight / low elasticity compounds with terminal free radical polymerizable groups (compounds with terminal free radical polymerizable groups, weight-average molecular weight (Mw) exceeding 5,000 and below 300,000, and tensile modulus of elasticity below 1 GPa as measured at 25°C according to JIS K7161)> The resin composition of the present invention, as component (A), comprises a high molecular weight / low elasticity compound having a free radical polymerizable group at its end. The weight-average molecular weight (Mw) of component (A) is greater than 5,000 and less than 300,000. Furthermore, the tensile modulus of elasticity of component (A), measured at 25°C according to JIS K7161, is less than 1 GPa. In the resin composition of the present invention, component (A) may be used alone or in combination of two or more components.

[0015] As mentioned above, the weight-average molecular weight (Mw) of component (A) is greater than 5,000 and less than 300,000. The lower limit of the weight-average molecular weight (Mw) of component (A) is preferably 6,000 or more, more preferably 8,000 or more, further preferably 10,000 or more, and the upper limit is preferably 250,000 or less, more preferably 200,000 or less, further preferably 150,000 or less, and even more preferably 100,000 or less, 80,000 or less, 60,000 or less, 50,000 or less, or 40,000 or less. The weight-average molecular weight of the high molecular weight / low elasticity compound (A) having a free radical polymerizable group at the end can be determined by gel permeation chromatography (GPC) as a value converted from polystyrene.

[0016] Furthermore, as mentioned above, the tensile modulus of elasticity of component (A), measured at 25°C according to JIS K7161, is 1 GPa or less. This tensile modulus of elasticity is preferably 0.5 GPa or less, more preferably 0.1 GPa or less, and even more preferably 0.05 GPa or less. There are no particular limitations on the lower limit of this tensile modulus of elasticity; it can be 0.01 MPa or more, etc. The method for determining the tensile modulus of elasticity of component (A) can be the method described later in <Synthesis Example 1: Synthesis of Elastomer A1>.

[0017] Component (A) has a free radical polymerizable group at its terminal. Examples of free radical polymerizable groups at the terminal of component (A) include vinyl, allyl, vinylphenyl, maleimide, and (meth)acryloyl. When component (A) contains two or more free radical polymerizable groups, these two or more free radical polymerizable groups may be the same or different. Among these, considering that the free radical polymerizable group at the terminal of component (A) can produce a cured product with a lower dielectric loss tangent, better warpage suppression, and better stain removal properties when combined with (B) epoxy resin, (C) reactive ester resin, and (D) inorganic filler material, (meth)acryloyl is preferred.

[0018] From the viewpoint that a cured product with low dielectric loss tangent, anti-warping properties, and excellent stain removal can be obtained in combination with (B) epoxy resin, (C) reactive ester resin, and (D) inorganic filler, component (A) is preferably containing an imide skeleton. An imide skeleton refers to a skeleton containing imide bonds. This imide skeleton may be contained in the main chain of component (A) or in the side chain of component (A). Examples of forms in which the imide skeleton is contained in the main chain of component (A) include, for example, a form in which maleimide groups are contained at the ends of the main chain, and also, for example, a form in which the imide skeleton is contained within the main chain. Preferably, component (A) contains an imide skeleton in the main chain, more preferably in the interior of the main chain, or both at the ends and inside the main chain.

[0019] From the viewpoint that a cured product with low dielectric loss tangent, anti-warping properties, and excellent stain removal can be obtained from the combination of (B) epoxy resin, (C) reactive ester resin and (D) inorganic filler material, component (A) is preferably an imide skeleton containing a structure represented by the following formula (A-1).

[0020] [Chemical Formula 3] .

[0021] (In formula (A-1), R) A1 This indicates the tetravalent group remaining after removing the anhydride group from the tetracarboxylic dianhydride; * indicates a linking bond.

[0022] In equation (A-1), R A1 This represents the tetravalent group remaining after removing the anhydride group from a tetracarboxylic dianhydride. (R...) A1 Among the indicated groups, aliphatic tetracarboxylic dianhydrides, aromatic tetracarboxylic dianhydrides, or combinations thereof can be used as tetracarboxylic dianhydrides. Furthermore, one type of tetracarboxylic dianhydride can be used alone, or two or more types can be used in combination. Specifically, R... A1The indicated group is preferably a tetravalent group obtained by removing the anhydride group from an aromatic tetracarboxylic dianhydride. Examples of aromatic tetracarboxylic dianhydrides include: phenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, anthracenetetracarboxylic dianhydride, and diphthalic dianhydride. Examples of diphthalic dianhydrides include: 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 3,3',4,4'-diphenyl ethertetracarboxylic dianhydride, 3,3',4,4'-diphenyl sulfonetetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride, 2,2',3,3'-biphenyltetracarboxylic dianhydride, 2,3,3',4'-biphenyltetracarboxylic dianhydride, 2,3 3',4'-Benzophenone tetracarboxylic dianhydride, 2,3,3',4'-Diphenyl ether tetracarboxylic dianhydride, 2,3,3',4'-Diphenyl sulfone tetracarboxylic dianhydride, 2,2'-Bis(3,4-dicarboxyphenoxyphenyl)sulfone dianhydride, 4,4'-Oxyphthalic anhydride, Methylene-4,4'-Diphthalic anhydride, 1,1-Ethynyl-4,4'-Diphthalic acid di- Anhydride, 2,2-propylidene-4,4'-diphthalic anhydride, 1,2-ethylidene-4,4'-diphthalic anhydride, 1,3-trimethylene-4,4'-diphthalic anhydride, 1,4-tetramethylene-4,4'-diphthalic anhydride, 1,5-pentamethylene-4,4'-diphthalic anhydride, 1,3-bis(3,4-dicarboxyphenyl)phthalide Anhydrides, 1,4-bis(3,4-dicarboxyphenyl)phenyl dianhydride, 1,3-bis(3,4-dicarboxyphenoxy)phenyl dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)phenyl dianhydride, 2,2-bis(2,3-dicarboxyphenyl)propane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 4,4'-(4,4'-isopropylidenediphenoxy)bisphthalic acid dianhydride, etc.

[0023] In a more suitable embodiment, R A1 The group represented is preferably a tetravalent group represented by the following formula (A-2-1) or the following formula (A-2-2).

[0024] [Chemical Formula 4] .

[0025] (In equations (A-2-1) and (A-2-2), R) A2 Indicates a single or divalent linking group; n A2 (Indicates 0, 1, or 2; * indicates a connection key).

[0026] In equation (A-2-1), n A2 Represents 0, 1, or 2. Where n A2 Preferably 0 or 1.

[0027] In equation (A-2-2), R A2This indicates a single or divalent linking group. As a group ending in R... A2 Examples of divalent linking groups include, for example, divalent groups containing one or more (e.g., 1 to 3000, 1 to 1000, 1 to 100, 1 to 50) skeletal atoms selected from carbon, oxygen, nitrogen, and sulfur atoms. Examples of divalent linking groups include, for example, alkylene, alkenylene, arylene, heteroarylene, -O-, -C(=O)-, -C(=O)-O-, and -N(R X )-(where R X This refers to a monovalent hydrocarbon group containing hydrogen atoms or 1-20 carbon atoms, or a monovalent halohydrocarbon group containing 1-20 carbon atoms. Examples include -C(=O)-NH- and -N(R). X )-C(=O)-N(R X -, -S-, -S(=O)-, -S(O)2-, etc., can also be groups formed by combining multiple of them. Among them, R A2 The indicated group is preferably a single bond, -O-, -C(=O)- or -C(=O)-O-CH2-CH2-OC(=O)-.

[0028] In combination with (B) epoxy resin, (C) reactive ester resin and (D) inorganic filler, from the viewpoint of obtaining a cured product with low dielectric loss tangent, suppression of warping and excellent stain removal, component (A) is preferably composed of one or more structural units selected from polyolefin structural units, polycarbonate structural units, polyether structural units, polyester structural units, poly(meth)acrylic acid structural units and polysiloxane structural units.

[0029] Examples of polyolefin structural units include: polyethylene structural units, polypropylene structural units, polybutadiene structural units, hydrogenated polybutadiene structural units, polyisopropylene structural units, and hydrogenated polyisopropylene structural units. Among these, a "hydrogenated polybutadiene structural unit" refers to a polybutadiene structural unit in which some or all of its unsaturated bonds are hydrogenated; similarly, a "hydrogenated polyisoprene structural unit" refers to a polyisoprene structural unit in which some or all of its unsaturated bonds are hydrogenated.

[0030] The polyolefin structural unit, for example, when using a polyol compound containing a polyolefin structure to manufacture component (A), can be the remaining structural unit obtained by removing two or more hydroxyl groups from the polyol compound containing the polyolefin structure. Commercially available polyol compounds containing polyolefin structures can be used; examples of such commercially available products include, for instance, "G-1000," "G-2000," "G-3000" (two-terminated hydroxyl polybutadiene), "GI-1000," "GI-2000," and "GI-3000" (two-terminated hydroxyl hydrogenated polybutadiene) manufactured by Nippon Soda Corporation.

[0031] Examples of polycarbonate structural units include aliphatic polycarbonates (polyethylene carbonate, polypropylene carbonate, polybutene carbonate, polycyclohexane carbonate, etc.) and aromatic polycarbonates (bisphenol A carbonate, bisphenol F carbonate, bisphenol S carbonate, etc.).

[0032] For polycarbonate structural units, for example, when using a polyol compound containing a polycarbonate structure to manufacture component (A), the remaining structural unit can be obtained by removing two or more hydroxyl groups from the polyol compound containing the polycarbonate structure. Commercially available polyol compounds containing a polycarbonate structure can be used, such as: Asahi Kasei Chemicals' "T6002" and "T6001" (two-terminated hydroxyl polycarbonate), and Kuraray's "C-1090," "C-2015N," "C-2090," and "C-3090" (two-terminated hydroxyl polycarbonate).

[0033] Examples of polyether structural units include: polyethylene glycol, polypropylene glycol, polytetramethylene glycol, and polybutanediol.

[0034] For polyether structural units, for example, when using a polyol compound containing a polyether structure to manufacture component (A), the remaining structural unit can be obtained by removing two or more hydroxyl groups from the polyol compound containing the polyether structure. Polyol compounds containing polyether structures can be commercially available products. Examples of such commercially available products include: "PLONON #102", "PLONON #104", "PLONON #201", "PLONON #202B", "PLONON #204", "PLONON #208", "Unilube 70DP-600B", "Unilube 70DP-950B" (polyethylene glycol-polypropylene glycol copolymer) manufactured by Nippon Oil Co., Ltd.; and "Pluronic (registered trademark) L-23", "Pluronic (registered trademark) L-31", "Pluronic (registered trademark) L-44", "Pluronic (registered trademark) L-61", "Adeka Pluronic (registered trademark) L-62", "Pluronic (registered trademark) L-64", "Pluronic (registered trademark) L-71", "Pluronic (registered trademark) L-72", "Pluronic (registered trademark) L-101", and "Pluronic (registered trademark)" manufactured by Adeka Co., Ltd. “L-121”, “Pluronic (registered trademark) P-84”, “Pluronic (registered trademark) P-85”, “Pluronic (registered trademark) P-103”, “Pluronic (registered trademark) F-68”, “Pluronic (registered trademark) F-88”, “Pluronic (registered trademark) F-108”, “Pluronic (registered trademark) 25R-1”, “Pluronic (registered trademark) 25R-2”, “Pluronic (registered trademark) 17R-2”, “Pluronic (registered trademark) 17R-3”, “Pluronic (registered trademark) 17R-4” (polyethylene glycol-polypropylene glycol copolymer).

[0035] Examples of polyester structural units include: polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polybutylene naphthalate, and polypropylene terephthalate.

[0036] For polyester structural units, for example, when using a polyol compound containing a polyester structure to manufacture component (A), the remaining structural unit can be obtained by removing two or more hydroxyl groups from the polyol compound containing the polyester structure. Commercially available polyol compounds containing polyester structures can be used; examples of such commercially available products include: VYLON (registered trademark) manufactured by Toyobo Co., Ltd., Polyester (registered trademark) manufactured by Nippon Synthetic Chemical Industry Co., Ltd., and Slack (registered trademark) manufactured by Hitachi Chemical Polymer Co., Ltd.

[0037] A poly(meth)acrylic acid structural unit refers to a structural unit that includes at least one of a plurality of acrylic acid structures and a methacrylic acid structure. This poly(meth)acrylic acid structural unit, for example, when using a polyol compound containing a poly(meth)acrylic acid structure to manufacture component (A), can be the remaining structural unit obtained by removing two or more hydroxyl groups from the polyol compound containing the poly(meth)acrylic acid structure. Commercially available products can be used as polyol compounds containing a poly(meth)acrylic acid structure. Examples of such commercially available products include: Teisan Resin “SG-600TEA” and “SG-790” (hydroxyl-containing acrylate copolymer resins) manufactured by Nagase ChemteX, and “W-197C” (hydroxyl-containing acrylate copolymer resin) manufactured by Negami Kogyo Co., Ltd.

[0038] Examples of polysiloxane structural units include: dialkyl polysiloxane structural units, diaryl polysiloxane structural units, monoalkyl monoaryl polysiloxane structural units, and monoalkyl polysiloxane structural units.

[0039] The polysiloxane structural unit, for example, when using a polyol compound containing a polysiloxane structure to manufacture component (A), can be the remaining structural unit obtained by removing two or more hydroxyl groups from the polyol compound containing the polysiloxane structure. Commercially available polyol compounds containing a polysiloxane structure can be used; examples of such commercially available products include, for instance, "X-21-5841" and "KF-9701" (two-terminated hydroxyl polysiloxane) manufactured by Shin-Etsu Chemical Industry Co., Ltd.

[0040] In combination with (B) epoxy resin, (C) reactive ester resin and (D) inorganic filler, from the viewpoint that a cured product with low dielectric loss tangent, anti-warping properties and excellent stain removal can be obtained, component (A) is preferably a structure represented by the following formula (A-3), and preferably a combination of a structure represented by the above formula (A-1) and a structure represented by the following formula (A-3).

[0041] [Chemical Formula 5] .

[0042] (In formula (A-3), R) A3 * indicates a divalent group remaining after removing two or more hydroxyl groups from a polyol compound that has two or more hydroxyl groups in one molecule; * indicates a linking bond.

[0043] In equation (A-3), R A3 This refers to the divalent group remaining after removing two or more alcoholic hydroxyl groups from a polyol compound that has two or more alcoholic hydroxyl groups in one molecule. (R) A3 The indicated functional group, as a polyol compound, preferably comprises one or more structural units selected from polyolefin, polycarbonate, polyether, polyester, poly(meth)acrylic acid, and polysiloxane structural units; more preferably, it comprises one or more structural units selected from polyolefin, polycarbonate, polyether, polyester, and polysiloxane structural units; even more preferably, it comprises one or more structural units selected from polyolefin, polycarbonate, and polysiloxane structural units; and even more preferably, it comprises a polyolefin structural unit. A single polyol compound may be used alone, or two or more may be used in combination; the polyolefin, polycarbonate, polyether, polyester, poly(meth)acrylic acid, and polysiloxane structural units are as described above.

[0044] In a more suitable embodiment, the structure shown in formula (A-3) above can be obtained by polycondensation of a polyol compound having two or more hydroxyl groups in one molecule with a polyisocyanate compound. Examples of such polyisocyanates include: aliphatic diisocyanate compounds such as butane diisocyanate, hexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, and 2,4,4-trimethylhexamethylene diisocyanate; alicyclic diisocyanate compounds such as norbornene diisocyanate, isophorone diisocyanate, hydrogenated xylene diisocyanate, and hydrogenated diphenylmethane diisocyanate; and phenylene diisocyanates such as p-phenylene diisocyanate or m-phenylene diisocyanate, xylene diisocyanates such as p-xylene diisocyanate or m-xylene diisocyanate, toluene-2,4-diisocyanate, or toluene-2,6-diisocyanate. Aromatic diisocyanate compounds such as toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, 3,3'-dimethyldiphenyl-4,4'-diisocyanate, 3,3'-diethyldiphenyl-4,4'-diisocyanate, m-xylene diisocyanate, 1,3-bis(α,α-dimethylisocyanate methyl)benzene, tetramethylphenyl dimethylene diisocyanate, diphenyl ether-4,4'-diisocyanate, and naphthalene diisocyanate; polymethylene polyphenyl polyisocyanates having a repeating structure represented by the following formula (A-4); and isocyanurate modified forms, biuret modified forms, and urea-formaldehyde modified forms of these compounds. Polyisocyanate compounds may be used alone or in combination of two or more.

[0045] [Chemical Formula 6] .

[0046] (In formula (A-4), R) A41 Each independently represents an alkyl group having 1 to 4 carbon atoms; R A42 Each can independently represent a hydrogen atom or a monovalent hydrocarbon group with 1 to 6 carbon atoms; n A41 n represents an integer from 0 to 1 to 3. A42 Represents an integer from 1 to 15; * represents a hyphen.

[0047] Among them, the polyisocyanate compound that can obtain the structure represented by formula (A-3) is preferably an alicyclic diisocyanate compound.

[0048] In combination with (B) epoxy resin, (C) reactive ester resin and (D) inorganic filler, from the viewpoint that a cured product with low dielectric loss tangent, anti-warping properties and excellent stain removal can be obtained, component (A) is preferably having a structure represented by the following formula (A-5).

[0049] [Chemical Formula 7] .

[0050] (In formula (A-5), n) A5 Represents integers from 4 to 90; * represents a hyphen.

[0051] (A) There are no restrictions on the method for manufacturing high molecular weight / low elasticity compounds with free radical polymerizable groups at the ends. Furthermore, (A) high molecular weight / low elasticity compounds with free radical polymerizable groups at the ends can also be purchased from the market.

[0052] The content of component (A) in the resin composition, relative to 100% by mass of the total of components (A) to (D), is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, even more preferably 1% by mass or more, preferably 15% by mass or less, more preferably 10% by mass or less, even more preferably 7% by mass or less or 6% by mass or less. When the content of component (A) is within the above range, the cured resin composition exhibits excellent dielectric loss tangent and contamination removal properties, while particularly suppressing warping after curing.

[0053] When the resin composition contains components other than (A) to (D), the content of component (A) in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, further preferably 1% by mass or more, more preferably 15% by mass or less, more preferably 10% by mass or less, and even more preferably 5% by mass or less, relative to 100% by mass of the non-volatile components of the resin composition. When the content of component (A) is within the above range, the cured resin composition exhibits excellent dielectric loss tangent and contamination removal properties, while particularly suppressing warping after curing.

[0054] When the resin composition contains components other than (A) to (D), the content of component (A) in the resin composition, relative to 100% by mass of the resin composition, is preferably 1% by mass or more, more preferably 2.5% by mass or more, further preferably 3.5% by mass or more, preferably 30% by mass or less, more preferably 25% by mass or less, further preferably 20% by mass or less, or 18% by mass or less. When the content of component (A) is within the above range, the cured resin composition exhibits excellent dielectric loss tangent and contamination removal properties, while particularly suppressing warping after curing.

[0055] <(B) Epoxy Resin> The resin composition of the present invention, as component (B), comprises epoxy resin (B). Epoxy resin (B) does not contain any substances belonging to component (A) above. In the resin composition of the present invention, component (B) may be used alone or in combination of two or more.

[0056] Examples of epoxy resins (B) include: bisphenol type epoxy resin, dicyclopentadiene type epoxy resin, triphenol type epoxy resin, naphthol phenolic varnish type epoxy resin, phenolic phenolic varnish type epoxy resin, tert-butyl-catechol type epoxy resin, naphthol type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, cresol phenolic varnish type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin, epoxy resin having a butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, epoxy resin containing spirocyclic ring, cyclohexane type epoxy resin, cyclohexanediethanol type epoxy resin, naphthyl ether type epoxy resin, tris(hydroxymethyl) type epoxy resin, and tetraphenylethane type epoxy resin. Bisphenol-type epoxy resins refer to epoxy resins with a bisphenol structure, such as bisphenol A, bisphenol F, bisphenol S, and bisphenol AF epoxy resins. Biphenyl-type epoxy resins refer to epoxy resins with a biphenyl structure, where the biphenyl structure may have substituents such as alkyl, alkoxy, or aryl groups. Therefore, xylenol-type epoxy resins and biphenyl aralkyl-type epoxy resins are also included in the category of biphenyl-type epoxy resins.

[0057] (B) The epoxy resin preferably has two or more epoxy groups in one molecule. When the total amount of (B) epoxy resin is set to 100% by mass, the proportion of epoxy resin having two or more epoxy groups in one molecule is preferably 50% by mass or more, more preferably 60% by mass or more, further preferably 70% by mass or more, and usually 100% by mass or less.

[0058] (B) Epoxy resins include epoxy resins that are liquid at 20°C (hereinafter referred to as "liquid epoxy resins") and epoxy resins that are solid at 20°C (hereinafter referred to as "solid epoxy resins").

[0059] As a liquid epoxy resin, it is preferred to be a liquid epoxy resin having two or more epoxy groups in one molecule.

[0060] As liquid epoxy resins, preferred types include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, phenolic varnish type epoxy resin, alicyclic epoxy resins with ester skeleton, cyclohexane type epoxy resin, cyclohexanediethanol type epoxy resin, and epoxy resins with butadiene structure.

[0061] Specific examples of liquid epoxy resins include: DIC's "HP-4032", "HP-4032-D", and "HP-4032-SS" (naphthalene-type epoxy resin); Mitsubishi Chemical's "828US", "jER828EL", "825", and "EPIKOTE828EL" (bisphenol A type epoxy resin); Mitsubishi Chemical's "jER807" and "1750" (bisphenol F type epoxy resin); Mitsubishi Chemical's "jER152" (phenolic varnish type epoxy resin); Mitsubishi Chemical's "630" and "630LSD" (glycidyl amine type epoxy resin); Nippon Steel Chemical Materials Co., Ltd.'s "ZX1059" (a mixture of bisphenol A and bisphenol F type epoxy resins); Nagase ChemteX's "EX-721" (glycidyl ester type epoxy resin); and Daicel's "CELLOXIDE". 2021P (alicyclic epoxy resin with an ester skeleton); PB-3600 (epoxy resin with a butadiene structure) manufactured by Daicel Corporation; ZX1658 and ZX1658GS (liquid 1,4-glycidylcyclohexane type epoxy resin) manufactured by Nippon Steel Chemical Materials Co., Ltd., etc.

[0062] As a solid epoxy resin, it is preferred to be a solid epoxy resin having three or more epoxy groups in one molecule, and more preferably an aromatic solid epoxy resin having three or more epoxy groups in one molecule.

[0063] Specific examples of solid epoxy resins include: DIC's "HP-4032H" (naphthalene-type epoxy resin); DIC's "HP-4700" and "HP-4710" (naphthalene-type tetrafunctional epoxy resins); DIC's "N-690" (cresol phenolic varnish type epoxy resin); DIC's "N-695" (cresol phenolic varnish type epoxy resin); and DIC's "HP-7200HH," "HP-7200H," and "HP-720" epoxy resins. 0" (dicyclopentadiene type epoxy resin); DIC's "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" (naphthalene ether type epoxy resin); Nippon Kayaku Co., Ltd.'s "EPPN-502H" (triphenol type epoxy resin); Nippon Kayaku Co., Ltd.'s "NC-7000L" (naphthol phenolic varnish type epoxy resin); Nippon Kayaku Co., Ltd.'s "NC-3000H", "N C-3000, NC-3000L, NC-3100 (biphenyl type epoxy resin); Nippon Steel Chemical Materials Co., Ltd.'s "ESN-475V" (naphthol type epoxy resin); Nippon Steel Chemical Materials Co., Ltd.'s "ESN-485" (naphthol phenolic varnish type epoxy resin); Mitsubishi Chemical Co., Ltd.'s "YL6121" (biphenyl type epoxy resin); Mitsubishi Chemical Co., Ltd.'s "YX4000H", "YX4000", "YX4000HK", "YL7890" (biphenyl type epoxy resin); Cresol-type epoxy resin; "YX8800" (anthracene-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "PG-100" and "CG-500" manufactured by Osaka Gas Chemical Co., Ltd.; "YL7760" (bisphenol AF-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL7800" (fluorene-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1010" (solid bisphenol A-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1031S" (tetraphenylethane-type epoxy resin) manufactured by Mitsubishi Chemical Corporation, etc.

[0064] In the resin composition, the epoxy resin (B) may consist only of liquid epoxy resin, only of solid epoxy resin, or a combination of liquid and solid epoxy resin. When liquid and solid epoxy resins are used in combination, their mass ratio (liquid epoxy resin: solid epoxy resin) is preferably 1:0.01 to 1:50, more preferably 1:0.05 to 1:20, and even more preferably 1:0.1 to 1:10.

[0065] (B) The epoxy equivalent of the epoxy resin is preferably 50 g / eq. to 5,000 g / eq., more preferably 50 g / eq. to 3,000 g / eq., even more preferably 80 g / eq. to 2,000 g / eq., and even more preferably 110 g / eq. to 1,000 g / eq. Epoxy equivalent refers to the mass of epoxy resin containing 1 equivalent of epoxy groups. This epoxy equivalent can be determined according to JIS K7236.

[0066] (B) The weight-average molecular weight (Mw) of the epoxy resin is preferably 100 to 5,000, more preferably 250 to 3,000, and even more preferably 400 to 1,500. (B) The weight-average molecular weight of the epoxy resin can be determined by gel permeation chromatography (GPC) using polystyrene equivalents.

[0067] The content of component (B) in the resin composition, relative to the total mass of components (A) to (D) of 100%, is preferably 1% by mass or more, more preferably 3% by mass or more, even more preferably 5% by mass or more, preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 10% by mass or less. When the content of component (B) is within the above range, the cured resin composition exhibits excellent dielectric loss tangent and contamination removal properties, while particularly suppressing warping after curing.

[0068] When the resin composition contains components other than (A) to (D), the content of component (B) in the resin composition is preferably 1% by mass or more, more preferably 3% by mass or more, further preferably 4% by mass or more, preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 10% by mass or less, relative to 100% by mass of the non-volatile components of the resin composition. When the content of component (B) is within the above range, the cured resin composition exhibits excellent dielectric loss tangent and contamination removal properties, while particularly suppressing warping after curing.

[0069] When the resin composition contains components other than (A) to (D), the content of component (B) in the resin composition is preferably 10% by mass or more, more preferably 15% by mass or more, further preferably 20% by mass or more, preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 35% by mass or less, relative to 100% by mass of the resin composition. When the content of component (B) is within the above range, the cured resin composition exhibits excellent dielectric loss tangent and contamination removal properties, while particularly suppressing warping after curing.

[0070] <(C) Active Ester Resin> The resin composition of the present invention, as component (C), comprises an active ester resin (C). The active ester resin (C) does not contain any substances belonging to components (A) and (B) above. In the resin composition of the present invention, component (C) may be used alone or in combination of two or more.

[0071] As the (C) active ester resin, a resin having one or more active ester groups in one molecule can be used. Among these, the (C) active ester resin is preferably a compound having two or more highly reactive ester groups in one molecule, such as phenolic esters, thiophenolic esters, N-hydroxyamine esters, or heterocyclic hydroxyl compounds. This active ester resin is preferably obtained through a condensation reaction of a carboxylic acid compound and / or a thiocarboxylic acid compound with a hydroxyl compound and / or a thiol compound. Furthermore, from the viewpoint of improved heat resistance, this active ester resin is preferably an active ester resin derived from a carboxylic acid compound, more preferably an active ester resin obtained from a carboxylic acid compound and a hydroxyl compound, and even more preferably an active ester resin obtained from a carboxylic acid compound and an aromatic hydroxyl compound.

[0072] Examples of carboxylic acid compounds include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid.

[0073] Examples of aromatic hydroxyl compounds include: (i) addition polymerization products of unsaturated aliphatic cyclic compounds containing two double bonds in one molecule and phenols; (ii) various bisphenol compounds; (iii) aromatic polyols with two or more hydroxyl groups bonded to the carbon atom of the aromatic ring; and (iv) aromatic monohydric alcohols with one hydroxyl group bonded to the carbon atom of the aromatic ring. Examples of addition polymerization products of unsaturated aliphatic cyclic compounds and phenols include: addition polymerization products of unsaturated aliphatic cyclic compounds such as dicyclopentadiene, tetrahydroindene, norbornene, limonene, and vinylcyclohexene with phenols (e.g., phenol, cresol, xylenol, ethylphenol, propylphenol, vinylphenol, allylphenol, phenylphenol, benzylphenol, halogenated phenols, etc.) optionally having substituents. Specifically, examples include dicyclopentadiene-phenol addition polymers. Examples of bisphenol compounds include bisphenol A, bisphenol F, bisphenol AF, bisphenol AP, bisphenol B, bisphenol BP, bisphenol C, and bisphenol M. Examples of aromatic polyols with two or more hydroxyl groups bonded to the carbon atom of the aromatic ring include hydroquinone, resorcinol, catechol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucinol, pyroglucinol, linear phenolic resins, o-phenylenebis(methylene)dinaphthol, m-phenylenebis(methylene)dinaphthol, and p-phenylenebis(methylene)dinaphthol. Examples of aromatic monohydric alcohols with a hydroxyl group bonded to a carbon atom on an aromatic ring include: phenol, cresol, xylenol, ethylphenol, propylphenol, vinylphenol, allylphenol, phenylphenol, benzylphenol, halogenated phenol, naphthol, methylnaphthol, dimethylnaphthol, ethylnaphthol, propylnaphthol, vinylnaphthol, allylnaphthol, phenylnaphthol, benzylnaphthol, and halogenated naphthol.

[0074] Specifically, the active ester resin is preferably selected from one or more of the following: dicyclopentadiene-type active ester resin, naphthalene-type active ester resin containing a naphthalene structure, active ester resin containing an acetylated linear phenolic resin, and active ester resin containing a benzoylated linear phenolic resin. As a dicyclopentadiene-type active ester resin, it is preferably an active ester resin containing a dicyclopentadiene-type diphenol structure. As a naphthalene-type active ester resin, it is preferably an active ester resin containing a naphthalene structure at the terminal and also containing a naphthalene structure in the structure other than at the terminal.

[0075] (C) The reactive ester resin may contain one or more structural units selected from polyolefin structural units, polycarbonate structural units, polyether structural units, polyester structural units, poly(meth)acrylic acid structural units, and polysiloxane structural units. Regarding polyolefin structural units, polycarbonate structural units, polyether structural units, polyester structural units, poly(meth)acrylic acid structural units, and polysiloxane structural units, as described in the item “(A) High molecular weight / low elasticity compound having a free radical polymerizable group at the end.” In one embodiment, (C) the reactive ester resin preferably contains polyolefin structural units, more preferably polybutadiene structural units and / or hydrogenated polybutadiene structural units.

[0076] Commercially available reactive ester resins include, for example: DIC's "EXB9451", "EXB9460", "EXB9460S", "EXB-8000L", "EXB-8000L-65M", "EXB-8000L-65TM", "HPC-8000L-65TM", "HPC-8000", "HPC-8000-65T", and "EXB-8000H" (reactive ester resins containing a dicyclopentadiene-type diphenol structure); and DIC's "EXB-8100L-65T", "EXB- The following are examples of active ester resins: “8150-60T”, “EXB-8150-62T”, “EXB-9416-70BK”, “HPC-8150-62T”, “HPC-8151-62T” (containing naphthalene structures); “EXB9401” (containing phosphorus active ester resin) manufactured by DIC Corporation; “DC808” (an active ester resin of acetylated linear phenolic resin) manufactured by Mitsubishi Chemical Corporation; “YLH1026”, “YLH1030”, “YLH1048” (an active ester resin of benzoylated linear phenolic resin) manufactured by Mitsubishi Chemical Corporation; and “PC1300-02-65MA” (containing styrene and naphthalene structures) manufactured by Air Water Corporation.

[0077] (C) The active ester equivalent of the active ester resin is preferably 50 g / eq. to 500 g / eq., more preferably 50 g / eq. to 400 g / eq., and even more preferably 100 g / eq. to 300 g / eq. The active ester equivalent refers to the mass of (C) active ester resin per 1 equivalent of active ester groups.

[0078] The ratio of component (B) to component (C), in terms of the ratio of [total number of epoxy groups in component (B)] to [total number of active ester groups in component (C)], is preferably in the range of 1:0.01 to 1:10, more preferably 1:0.05 to 1:8, and even more preferably 1:0.1 to 1:5. "Total number of epoxy groups in component (B)" refers to the sum of all values ​​obtained by dividing the mass of component (B) present in the resin composition by the epoxy equivalent. Similarly, "total number of active ester groups in component (C)" refers to the sum of all values ​​obtained by dividing the mass of component (C) present in the resin composition by the active ester equivalent. By controlling the ratio of component (B) to component (C) within the above ranges, the effects of the present invention can be significantly obtained.

[0079] The content of component (C) in the resin composition, relative to the total mass of components (A) to (D) of 100%, is preferably 1% by mass or more, more preferably 3% by mass or more, further preferably 5% by mass or more, or 6% by mass or more, preferably 20% by mass or less, more preferably 15% by mass or less, and further preferably 13% by mass or less. When the content of component (C) is within the above range, the cured resin composition exhibits excellent dielectric loss tangent and contamination removal properties, while particularly suppressing warping after curing.

[0080] When the resin composition contains components other than (A) to (D), the content of component (C) in the resin composition is preferably 1% by mass or more, more preferably 3% by mass or more, further preferably 5% by mass or more, or 6% by mass or more, preferably 20% by mass or less, more preferably 15% by mass or less, and further preferably 13% by mass or less, relative to 100% by mass of the non-volatile components of the resin composition. When the content of component (C) is within the above range, the cured resin composition exhibits excellent dielectric loss tangent and contamination removal properties, while particularly suppressing warping after curing.

[0081] When the resin composition contains components other than (A) to (D), the content of component (C) in the resin composition is preferably 10% by mass or more, more preferably 20% by mass or more, further preferably 25% by mass or more, more preferably 60% by mass or less, more preferably 50% by mass or less, and even more preferably 46% by mass or less, relative to 100% by mass of the resin composition. When the content of component (C) is within the above range, the cured resin composition exhibits excellent dielectric loss tangent and contamination removal properties, while particularly suppressing warping after curing.

[0082] The ratio of the content of component (A) to the content of component (C) in the resin composition (i.e., the mass ratio of component (A) to component (C) (content of component (A)) / (content of component (C))) is preferably 0.01 or more, more preferably 0.05 or more, further preferably 0.09 or more, preferably 1 or less, more preferably 0.7 or less, and further preferably 0.5 or less. When the mass ratio is within the above range, the cured resin composition exhibits excellent dielectric loss tangent and contamination removal properties, while particularly suppressing warping after curing.

[0083] <(D) Inorganic filler materials> The resin composition of the present invention, as component (D), includes an inorganic filler material (D). The inorganic filler material (D) does not contain any substances belonging to components (A) to (C) above. The inorganic filler material (D) is contained in the resin composition in a particle state and is contained in the cured product in a manner that maintains its particle morphology. In the resin composition of the present invention, component (D) may be used alone or in combination of two or more.

[0084] Inorganic compounds can be used as the inorganic filler material in (D). Examples of materials that can be used as the inorganic filler material in (D) include: silicon dioxide, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, materials selected from one or more of silicon dioxide and alumina are more suitable, and silicon dioxide is more suitable. Examples of silicon dioxide include: amorphous silicon dioxide, fused silicon dioxide, crystalline silicon dioxide, synthetic silicon dioxide, hollow silicon dioxide, etc. Furthermore, spherical silicon dioxide is preferred as silicon dioxide.

[0085] Commercially available products as (D) inorganic filler materials include: "SP60-05" and "SP507-05" manufactured by Nippon Steel Chemical Materials Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", "YA010C", "SC2500SQ", "SO-C4", "SO-C2", and "SO-C1" manufactured by Yatoma Co., Ltd.; "UFP-30", "DAW-03", and "FB-105FD" manufactured by DENKA Co., Ltd.; "Silfil NSS-3N", "Silfil NSS-4N", and "Silfil NSS-5N" manufactured by Tokuyama Co., Ltd.; "CellSpheres" and "MGH-005" manufactured by Pacific Cement Co., Ltd.; and "HipresicaFH" manufactured by UBE Exsymo Co., Ltd., etc.

[0086] (D) The average particle size of the inorganic filler material is not particularly limited, but is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less, 2 μm or less, 1 μm or less, or 0.7 μm or less. The lower limit of this average particle size is not particularly limited, but is preferably 0.01 μm or more, more preferably 0.05 μm or more, even more preferably 0.07 μm or more, 0.1 μm or more, or 0.2 μm or more. (D) The average particle size of the inorganic filler material can be determined by laser diffraction / scattering based on the Mie scattering theory. Specifically, the particle size distribution of the inorganic filler material can be prepared using a laser diffraction scattering particle size distribution measuring device with a volume reference, and the median diameter can be used as the average particle size for measurement. The test sample can be obtained by weighing 100 mg of the inorganic filler material and 10 g of methyl ethyl ketone into a small vial and dispersing it ultrasonically for 10 minutes. For the test sample, a laser diffraction particle size distribution measuring device is used. The wavelength of the light source is set to blue and red, and the particle size distribution of the inorganic filler material is measured in a flow cell manner based on a volume reference. The average particle size is then calculated from the obtained particle size distribution as the median diameter. Examples of laser diffraction particle size distribution measuring devices include the "LA-960" manufactured by Horiba Manufacturing Co., Ltd.

[0087] (D) The specific surface area of ​​the inorganic filler material is not particularly limited, but is preferably 0.1 m². 2 / g or more, more preferably 0.5m 2 / g or more, further preferably 1m 2 / g or more, 3m 2 / g or more or 5m 2 / g or more; there is no particular upper limit to this specific surface area, but it is preferably 100m². 2 / g or less, preferably 80m 2 / g or less, more preferably 60m 2 / g or less, 50m 2 / g or less or 40m 2 / g or less. (D) The specific surface area of ​​the component is obtained by using the BET method, using a specific surface area measuring device (Mountech "Macsorb HM-1210"), to adsorb nitrogen onto the sample surface, and then calculating the specific surface area using the BET multi-point method.

[0088] (D) The inorganic filler material is preferably surface-treated with a suitable surface treatment agent. Surface treatment can improve the moisture resistance and dispersibility of the (D) inorganic filler material. Examples of surface treatment agents include: vinyl silane coupling agents, epoxy silane coupling agents, styrene silane coupling agents, (meth)acrylic acid silane coupling agents, amino silane coupling agents, isocyanurate silane coupling agents, urea silane coupling agents, mercapto silane coupling agents, isocyanate silane coupling agents, anhydride silane coupling agents, etc.; non-silane coupling-alkoxy silane compounds such as methyltrimethoxysilane and phenyltrimethoxysilane; and silazane compounds. One surface treatment agent may be used alone, or two or more may be used in combination.

[0089] Commercially available surface treatment agents include, for example: "KBM403" (3-epoxypropoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd., "KBM803" (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd., "KBE903" (3-aminopropyltriethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd., "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd., and "SZ-31" (hexamethyldisilazane) manufactured by Shin-Etsu Chemical Industry Co., Ltd.

[0090] From the viewpoint of improving the dispersibility of inorganic filler materials, the degree of surface treatment with a surface treatment agent is preferably controlled within a specific range. Specifically, it is preferable to surface treat 100% by mass of the inorganic filler material with 0.2% to 5% by mass of a surface treatment agent.

[0091] The degree of surface treatment with a surface treatment agent can be evaluated by the carbon content per unit surface area of ​​the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the preferred carbon content per unit surface area is 0.02 mg / m². 2 The above, and more preferably, is 0.1 mg / m³ 2 The above, and more preferably, is 0.2 mg / m³ 2 That's all. On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin composition and the melt viscosity of the flake-shaped form, the upper limit of the carbon content per unit surface area of ​​the inorganic filler material (D) is preferably 1 mg / m². 2The following is more preferably 0.8 mg / m³ 2 The following is a further preferred value: 0.5 mg / m³ 2 The following (D) indicates that the carbon content per unit surface area of ​​the inorganic filler material can be determined after cleaning the surface-treated inorganic filler material with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK is added as a solvent to the surface-treated inorganic filler material, and ultrasonic cleaning is performed at 25°C for 5 minutes. After removing the supernatant and drying the solid components, the carbon content per unit surface area of ​​the inorganic filler material can be determined using a carbon analyzer. A carbon analyzer such as the "EMIA-320V" manufactured by Horiba Manufacturing Co., Ltd. can be used.

[0092] The content of component (D) in the resin composition, relative to 100% by mass of the total of components (A) to (D), is preferably 60% by mass or more, more preferably 70% by mass or more, further preferably 74% by mass or more, preferably 95% by mass or less, more preferably 90% by mass or less, and even more preferably 87% by mass or less. When the content of component (D) is within the above range, the cured resin composition exhibits excellent dielectric loss tangent and contamination removal properties, while particularly suppressing warping after curing.

[0093] When the resin composition contains components other than (A) to (D), the content of component (D) in the resin composition is preferably 50% by mass or more, more preferably 60% by mass or more, further preferably 65% ​​by mass or more, more preferably 90% by mass or less, more preferably 85% by mass or less, and even more preferably 81% by mass or less, relative to 100% by mass of the non-volatile components of the resin composition. When the content of component (D) is within the above range, the cured resin composition exhibits excellent dielectric loss tangent and contamination removal properties, while particularly suppressing warping after curing.

[0094] <(E) Other thermosetting resins> The resin composition of the present invention may include (E) other thermosetting resins as an optional component. The (E) other thermosetting resins as component (E) do not contain substances belonging to components (A) to (D) above. When the resin composition includes component (E), one type of (E) other thermosetting resin may be used alone, or two or more may be used in combination.

[0095] Examples of other thermosetting resins (E) include phenolic resins, naphthol resins, carbodiimide resins, acid anhydride resins, cyanate ester resins, and amine resins. Preferably, component (E) comprises one or more thermosetting resins selected from phenolic resins, naphthol resins, and carbodiimide resins.

[0096] From the viewpoint of heat resistance and water resistance, resins with a phenolic structure are preferred as phenolic and naphthol resins. Furthermore, from the viewpoint of adhesion to the conductor layer, nitrogen-containing phenolic resins and nitrogen-containing naphthol resins are preferred, and phenolic resins or naphthol resins containing a triazine backbone are more preferred.

[0097] Specific examples of phenolic and naphthol resins include: "MEH-7700", "MEH-7810", "MEH-7851", and "MEH-8000H" manufactured by Meiwa Chemical Co., Ltd.; "NHN", "CBN", and "GPH" manufactured by Nippon Kayaku Co., Ltd.; and "SN-170", "SN-180", "SN-190", "SN-475", "SN-485", "SN-495", "SN-495V", "SN-375", and "S" manufactured by Nippon Steel Chemical Materials Co., Ltd. N-395; DIC's "TD-2090", "TD-2090-60M", "LA-7052", "LA-7054", "LA-1356", "LA-3018", "LA-3018-50P", "EXB-9500", "HPC-9500", "KA-1160", "KA-1163", "KA-1165"; and Chung Yung Chemical's "GDP-6115L", "GDP-6115H", "ELPC75", etc.

[0098] Examples of carbodiimide resins include resins having one or more carbodiimide structures (-N=C=N-) in one molecule. Commercially available carbodiimide resins include, for example: Carbodilite (registered trademark) V-03 (carbodiimide equivalent: 216 g / eq.), V-05 (carbodiimide equivalent: 262 g / eq.), V-07 (carbodiimide equivalent: 200 g / eq.), and V-09 (carbodiimide equivalent: 200 g / eq.) manufactured by Nisshinbo Chemical Co., Ltd.; and Stabaxol (registered trademark) P (carbodiimide equivalent: 302 g / eq.) manufactured by Lanxess Co., Ltd.

[0099] As an anhydride resin, examples include resins having one or more anhydride groups in one molecule. Specific examples of anhydride resins include: phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenylsuccinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, and so on. Polymer-type acid anhydrides include benzophenone tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride, naphthalene tetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenylsulfone tetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(dehydrated trimellitate), and styrene-maleic acid resin copolymerized from styrene and maleic acid. Commercially available anhydride resins include, for example, "MH-700" manufactured by Shin Nippon Rikka Co., Ltd.

[0100] Examples of difunctional cyanate resins include: bisphenol A dicyanate, polyphenol cyanate, oligomeric (3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate-phenylpropane), 1,1-bis(4-cyanate-phenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanate-phenyl-1-(methylethylene))benzene, bis(4-cyanate-phenyl) sulfide, and bis(4-cyanate-phenyl) ether; polyfunctional cyanate resins derived from phenolic varnish resins and cresol varnish resins; prepolymers obtained by triazinizing a portion of these cyanate resins; etc. Commercially available cyanate ester resins include, for example: "PT30" and "PT60" (phenolic varnish type multifunctional cyanate ester resins) and "ULL-950S" (multifunctional cyanate ester resins) manufactured by Arxada Corporation; "BA230" and "BA230S75" (prepolymers of bisphenol A dicyanate partially or completely triazineized to become trimers); etc.

[0101] Examples of amine resins include resins having one or more amino groups in one molecule, such as aliphatic amines, polyether amines, alicyclic amines, and aromatic amines. Specific examples of amine resins include: 4,4'-methylenebis(2,6-dimethylaniline), diphenyldiaminosulfone, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, m-phenylenediamine, m-phenylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, 2,2-bis(3-amino- 4-Hydroxyphenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, etc. Commercially available amine resins can also be used, such as: KAYABOND C-200S, KAYABOND C-100, KAYAHARD AA, KAYAHARD A-B, KAYAHARD AS manufactured by Nippon Kayaku Co., Ltd., and Epicure W manufactured by Mitsubishi Chemical Co., Ltd., etc.

[0102] When the resin composition of the present invention contains other thermosetting resins (E), the ratio of components (B), (C), and (E), in terms of the ratio of [total number of epoxy groups in component (B)] to [total number of active groups in components (C) and (E)], is preferably in the range of 1:0.01 to 1:10, more preferably 1:0.05 to 1:8, and even more preferably 1:0.1 to 1:5. The "total number of epoxy groups in component (B)" is as described above. Furthermore, the "total number of active groups in components (C) and (E)" refers to the sum of the values ​​obtained by dividing the mass of component (C) present in the resin composition by the equivalent amount of active ester groups and the values ​​obtained by dividing the mass of component (E) by the equivalent amount of active groups. When the resin composition of the present invention contains component (E), the effects of the present invention can be significantly obtained by controlling the ratio of components (C) and (E) to component (B) within the above-mentioned range.

[0103] When the resin composition contains other thermosetting resins (E), the content of component (E) in the resin composition is preferably 1% or more by mass, more preferably 1.5% or more by mass, further preferably 2% or more by mass, more preferably 15% or less by mass, more preferably 10% or less by mass, and further preferably 7% or less by mass, relative to 100% by mass of the non-volatile components of the resin composition.

[0104] When the resin composition contains (E) other thermosetting resins, the content of component (E) in the resin composition is preferably 1% or more by mass, more preferably 3% or more by mass, further preferably 5% or more by mass or 7% or more by mass, more preferably 40% or less by mass, more preferably 30% or less by mass, and further preferably 25% or less by mass, relative to 100% by mass of the resin composition.

[0105] <(F) Compounds with free radical polymerizable groups (compounds with free radical polymerizable groups and a weight-average molecular weight (Mw) of less than 5,000)> The resin composition of the present invention may, as an optional component, include a compound having a free radical polymerizable group (F). Unless otherwise stated, the compound having a free radical polymerizable group (F) as component (F) does not include substances belonging to components (A) to (E) above. That is, the weight-average molecular weight (Mw) of component (F) is 5,000 or less. When the resin composition includes component (F), one type of compound having a free radical polymerizable group (F) may be used alone, or two or more may be used in combination.

[0106] As previously stated, the weight-average molecular weight (Mw) of the compound having free radical polymerizable groups (F) is 5,000 or less, preferably 4,000 or less, and more preferably 3,000 or less. The lower limit is not particularly limited, and for example, it can be 150 or more. The weight-average molecular weight of the compound having free radical polymerizable groups (F) can be determined by gel permeation chromatography (GPC) as a value converted from polystyrene.

[0107] As component (F), there is no particular limitation on the type of free radical polymerizable group, as long as it has one or more (preferably two or more) free radical polymerizable groups in one molecule. Examples of components (F) include compounds having one or more free radical polymerizable groups selected from vinyl, allyl, vinylphenyl, (meth)acryloyl, and maleimide. When component (F) contains two or more free radical polymerizable groups, these two or more free radical polymerizable groups may be the same or different.

[0108] (F) The compound having a free radical polymerizable group is preferably a compound selected from maleimide-based free radical polymerizable compounds, (meth)acrylic acid-based free radical polymerizable compounds, styrene-based free radical polymerizable compounds and allyl-based free radical polymerizable compounds, more preferably a compound containing maleimide-based free radical polymerizable compounds.

[0109] Maleimide-based free radical polymerizable compounds are, for example, compounds having one or more, preferably two or more, maleimide groups. Maleimide-based free radical polymerizable compounds may be aliphatic maleimide compounds containing an aliphatic amine skeleton, or aromatic maleimide compounds containing an aromatic amine skeleton. Commercially available maleimide-based free radical polymerizable compounds include, for example: Shin-Etsu Chemical Co., Ltd.'s "SLK-2600" and "SLK-6895-T90"; Designer Molecules Inc.'s "BMI-1500", "BMI-1700", "BMI-3000J", "BMI-689", and "BMI-2500" (maleimide compounds containing a dimeric diamine structure); Designer Molecules Inc.'s "BMI-6100" (aromatic maleimide compound); Nippon Kayaku Co., Ltd.'s "MIR-5000-60T" and "MIR-3000-70MT" (biphenyl aryl maleimide compounds); KI Chemical Co., Ltd.'s "BMI-70" and "BMI-80"; and Daiwa Chemical Industry Co., Ltd.'s "BMI-2300" and "BMI-TMH"; etc. In addition, as a maleimide-based free radical polymerizable compound, the maleimide resin (a maleimide compound containing an indane ring skeleton) disclosed in Japanese Invention Association Publication No. 2020-500211 can also be used.

[0110] Styrene-based free radical polymerizable compounds are, for example, compounds having one or more, preferably two or more, vinyl groups directly bonded to aromatic carbon atoms. Examples of styrene-based free radical polymerizable compounds include: low molecular weight (molecular weight less than 1000) styrene-based compounds such as divinylbenzene, 2,4-divinyltoluene, 2,6-divinylnaphthalene, 1,4-divinylnaphthalene, 4,4'-divinylbiphenyl, 1,2-bis(4-vinylphenyl)ethane, 2,2-bis(4-vinylphenyl)propane, and bis(4-vinylphenyl) ether; and high molecular weight (molecular weight 1000 or more) styrene-based compounds such as vinylbenzyl-modified polyphenylene ether resin and styrene-divinylbenzene copolymer. Commercially available styrene-based free radical polymerizable compounds include, for example: "ODV-XET(X03)", "ODV-XET(X04)", and "ODV-XET(X05)" (styrene-divinylbenzene copolymer) manufactured by Nippon Steel Chemical Materials Co., Ltd.; "OPE-2St", "OPE-2St1200", and "OPE-2St 2200" (vinyl benzyl modified polyphenylene ether resin) manufactured by Mitsubishi Gas Chemical Co., Ltd.; etc.

[0111] (Meth)acrylic acid is a free radical polymerizable compound, for example, a compound having one or more, preferably two or more, acryloyl groups and / or methacryloyl groups. Examples of low molecular weight (molecular weight less than 1000) aliphatic (meth)acrylate compounds that are free radical polymerizable by (meth)acrylate groups include: cyclohexane-1,4-diethanol di(meth)acrylate, cyclohexane-1,3-diethanol di(meth)acrylate, tricyclodecane-diethanol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, glycerol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, etc.; dioxanediol di(meth)acrylate, 3,6-dioxane-1,8- Low molecular weight (molecular weight less than 1000) ether-containing (meth)acrylate compounds such as octanediol di(meth)acrylate, 3,6,9-trioxaundecane-1,11-diol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, 9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorene, ethoxylated bisphenol A di(meth)acrylate, propoxylated bisphenol A di(meth)acrylate, etc.; low molecular weight (molecular weight less than 1000) isocyanurate-containing (meth)acrylate compounds such as tri(3-hydroxypropyl)isocyanurate tri(meth)acrylate, tri(2-hydroxyethyl)isocyanurate tri(meth)acrylate, ethoxylated isocyanurate tri(meth)acrylate, etc.; high molecular weight (molecular weight greater than 1000) acrylate compounds such as (meth)acrylate-modified polyphenylene ether resin; etc. Commercially available (meth)acrylic acid-based free radical polymerizable compounds include, for example: "A-DOG" (dioxanediol diacrylate) manufactured by Shin-Nakamura Chemical Industry Co., Ltd.; "DCP-A" (tricyclodecanediethanol diacrylate) and "DCP" (tricyclodecanediethanol dimethacrylate) manufactured by Kyoeisha Chemical Co., Ltd.; "KAYARAD R-684" (tricyclodecanediethanol diacrylate) and "KAYARAD R-604" (dioxanediol diacrylate) manufactured by Nippon Kayaku Co., Ltd.; "SA9000" and "SA9000-111" (methacrylic acid modified polyphenylene ether) manufactured by SABIC Co., Ltd.; etc.

[0112] Allyl-based free radical polymerizable compounds, for example, are compounds having one or more, preferably two or more, allyl groups. Examples of allyl-based free radical polymerizable compounds include, for example, aromatic carboxylic acid allyl ester compounds such as diallyl biphenyl, triallyl trimellitate, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, diallyl 2,6-naphthalenedicarboxylate, and diallyl 2,3-naphthalenedicarboxylate; and isocyanurate allyl ester compounds such as 1,3,5-triallyl isocyanurate and 1,3-diallyl-5-glycidyl isocyanurate; 2 Aromatic allyl compounds containing epoxy groups, such as 2-bis[3-allyl-4-(glycidoxy)phenyl]propane; aromatic allyl compounds containing benzoxazine, such as bis[3-allyl-4-(3,4-dihydro-2H-1,3-benzoxazine-3-yl)phenyl]methane; aromatic allyl compounds containing ethers, such as 1,3,5-triallyl ether benzene; allyl silane compounds, such as diallyl diphenylsilane; and resins containing multiple benzene rings and allyl groups, etc. Commercially available allyl-based free radical polymerizable compounds include, for example: TAIC (1,3,5-triallyl isocyanurate) manufactured by Nippon Chemical Co., Ltd.; DAD (dallyl biphenyl dicarboxylate) manufactured by Nippon Touch Technology Fine Chemical Co., Ltd.; TRIAM-705 (triallyl trimellitate) manufactured by Fujifilm and Koko Pure Chemical Co., Ltd.; DAND (dallyl 2,3-naphthoic acid) manufactured by Nippon Touch Technology Fine Chemical Co., Ltd.; RE-810NM (2,2-bis[3-allyl-4-(glycidoxy)phenyl]propane) manufactured by Nippon Chemical Co., Ltd.; DA-MGIC (1,3-diallyl-5-glycidyl isocyanurate) manufactured by Shikoku Chemical Industry Co., Ltd.; NE-V-1100-70T (a resin containing multiple benzene rings and allyl groups) manufactured by DIC Co., Ltd.; etc.

[0113] (F) The equivalent of free radical polymerizable groups in the compound having free radical polymerizable groups is preferably 20 g / eq. to 3,000 g / eq., more preferably 50 g / eq. to 2,500 g / eq., even more preferably 70 g / eq. to 2,000 g / eq., and even more preferably 90 g / eq. to 1,500 g / eq. The equivalent of free radical polymerizable groups indicates the mass of (F) the compound having free radical polymerizable groups per 1 equivalent of free radical polymerizable groups.

[0114] When the resin composition contains a compound having a free radical polymerizable group (F), the content of component (F) in the resin composition is preferably 1% by mass or more, more preferably 2% by mass or more, further preferably 2.3% by mass or more or 2.5% by mass or more, preferably 20% by mass or less, more preferably 15% by mass or less, and further preferably 10% by mass or less, relative to 100% by mass of the non-volatile components of the resin composition.

[0115] When the resin composition contains a compound having a free radical polymerizable group (F), the content of component (F) in the resin composition is preferably 1% by mass or more, more preferably 3% by mass or more, further preferably 5% by mass or more, further preferably 7% by mass or more, more preferably 10% by mass or more, more preferably 13% by mass or more, preferably 40% by mass or less, more preferably 30% by mass or less, and further preferably 26% by mass or less, relative to 100% by mass of the resin component in the resin composition.

[0116] <(G) Curing Accelerator> The resin composition of the present invention may also contain a (G) curing accelerator as an optional component. Unless otherwise stated, the (G) curing accelerator as component (G) does not contain substances belonging to components (A) to (F) above. When the resin composition contains component (G), one type of (G) curing accelerator may be used alone, or two or more types may be used in combination.

[0117] Examples of (G) curing accelerators include phosphorus-based curing accelerators, urea-based curing accelerators, guanidine-based curing accelerators, imidazole-based curing accelerators, metal-based curing accelerators, and amine-based curing accelerators. Preferably, the (G) curing accelerator includes one or more curing accelerators selected from imidazole-based and amine-based curing accelerators.

[0118] Examples of phosphorus-based curing accelerators include: tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, bis(tetrabutylphosphonium)pyromellitictate, tetrabutylphosphonium hexahydrophthalate, tetrabutylphosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenolate, di-tert-butylmethylphosphonium tetraphenylborate, and other aliphatic phosphonium salts; methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide, and p-phosphonium chloride. Aromatic phosphonium salts of tolyltriphenylphosphonium tetrap-tolylborate, tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetrap-tolylborate, triphenylethylphosphonium tetraphenylborate, tri(3-methylphenyl)ethylphosphonium tetraphenylborate, tri(2-methoxyphenyl)ethylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, etc.; aromatic phosphine-borane complexes of triphenylphosphine-triphenylborane, etc.; aromatic phosphine-quinone addition reactants of triphenylphosphine-p-benzoquinone, etc.; tributylphosphine, tri-tert-butylphosphine, trioctylphosphine, di... Aliphatic phosphines such as tert-butyl(2-butenyl)phosphine, di-tert-butyl(3-methyl-2-butenyl)phosphine, and tricyclohexylphosphine; dibutylphenylphosphine, di-tert-butylphenylphosphine, methyl diphenylphosphine, ethyl diphenylphosphine, butyl diphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tri(4-ethylphenyl)phosphine, tri(4-propylphenyl)phosphine, tri(4-isopropylphenyl)phosphine, tri(4-butylphenyl)phosphine, tri(4-tert-butylphenyl)phosphine, tri(2,4-dimethylphenyl)phosphine, tri(2,5-dimethylphenyl)phosphine, tri(2 Aromatic phosphines such as 6-dimethylphenyl)phosphine, tris(3,5-dimethylphenyl)phosphine, tris(2,4,6-trimethylphenyl)phosphine, tris(2,6-dimethyl-4-ethoxyphenyl)phosphine, tris(2-methoxyphenyl)phosphine, tris(4-methoxyphenyl)phosphine, tris(4-ethoxyphenyl)phosphine, tris(4-tert-butoxyphenyl)phosphine, diphenyl-2-pyridylphosphine, 1,2-bis(diphenylphosphine)ethane, 1,3-bis(diphenylphosphine)propane, 1,4-bis(diphenylphosphine)butane, 1,2-bis(diphenylphosphine)acetylene, and 2,2'-bis(diphenylphosphine)diphenyl ether.

[0119] Examples of urea-based curing accelerators include: 1,1-dimethylurea; aliphatic dimethylureas such as 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl-1,1-dimethylurea, and 3-cyclooctyl-1,1-dimethylurea; 3-phenyl-1,1-dimethylurea, 3-(4-chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, 3-(3-chloro-4-methylphenyl)-1,1-dimethylurea, 3-(2-methylphenyl)-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, and 3-(3,4-dimethylphenyl)-1,1-dimethylurea. Aromatic dimethylureas such as 1-dimethylurea, 3-(4-isopropylphenyl)-1,1-dimethylurea, 3-(4-methoxyphenyl)-1,1-dimethylurea, 3-(4-nitrophenyl)-1,1-dimethylurea, 3-[4-(4-methoxyphenoxy)phenyl]-1,1-dimethylurea, 3-[4-(4-chlorophenoxy)phenyl]-1,1-dimethylurea, 3-[3-(trifluoromethyl)phenyl]-1,1-dimethylurea, N,N-(1,4-phenylene)bis(N',N'-dimethylurea), N,N-(4-methyl-1,3-phenylene)bis(N',N'-dimethylurea)[toluenebisdimethylurea], etc.

[0120] Examples of guanidine-based curing accelerators include: dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanidine, 1-ethylbiguanidine, 1-n-butylbiguanidine, 1-n-octadecylbiguanidine, 1,1-dimethylbiguanidine, 1,1-diethylbiguanidine, 1-cyclohexylbiguanidine, 1-allylbiguanidine, 1-phenylbiguanidine, 1-(o-tolyl)biguanidine, etc.

[0121] Examples of imidazole-based curing accelerators include: 2-methylimidazolium, 2-undecylimidazolium, 2-heptadecylimidazolium, 1,2-dimethylimidazolium, 2-ethyl-4-methylimidazolium, 1,2-dimethylimidazolium, 2-ethyl-4-methylimidazolium, 2-phenylimidazolium, 2-phenyl-4-methylimidazolium, 1-benzyl-2-methylimidazolium, 1-benzyl-2-phenylimidazolium, 1-cyanoethyl-2-methylimidazolium, 1-cyanoethyl-2-undecylimidazolium, 1-cyanoethyl-2-ethyl-4-methylimidazolium, 1-cyanoethyl-2-phenylimidazolium, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolium-(1')] Imidazole compounds such as 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-triazine isocyanuric acid adduct, 2-phenylimidazolyl isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazolium, 2-phenyl-4-methyl-5-hydroxymethylimidazolium, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline, and adducts of imidazole compounds with epoxy resins. Commercially available imidazole-based curing accelerators include, for example: "1B2PZ", "2E4MZ", "2P4MZ", "2MZA-PW", "2MZ-OK", "2MA-OK", "2MA-OK-PW", "2PHZ", "2PHZ-PW", "Cl1Z", "Cl1Z-CN", "Cl1Z-CNS", and "C11Z-A" manufactured by Shikoku Chemical Co., Ltd.; and "P200-H50" manufactured by Mitsubishi Chemical Co., Ltd.

[0122] Examples of organometallic curing accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include: cobalt(II) acetylacetonate, cobalt(III) acetylacetonate, copper(II) acetylacetonate, zinc(II) acetylacetonate, iron(III) acetylacetonate, nickel(II) acetylacetonate, and manganese(II) acetylacetonate. Examples of organometallic salts include zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

[0123] Examples of amine-based curing accelerators include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo(5,4,0)-undecene. Commercially available amine-based curing accelerators can also be used, such as "DMAP" manufactured by Tokyo Chemical Industry Co., Ltd., and "MY-25" manufactured by Ajinomoto Fine-Techno Co., Ltd.

[0124] When the resin composition contains a (G) curing accelerator, the content of the (G) component in the resin composition is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, further preferably 0.1% by mass or more, preferably 3% by mass or less, more preferably 1% by mass or less, and further preferably 0.5% by mass or less, relative to 100% by mass of the non-volatile components of the resin composition.

[0125] When the resin composition contains a (G) curing accelerator, the content of the (G) component in the resin composition is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, further preferably 0.5% by mass or more, preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 1.6% by mass or less, relative to 100% by mass of the resin component in the resin composition.

[0126] <(H) Polymer Resin> The resin composition of the present invention may also include (H) polymeric resin as an arbitrary component. Unless otherwise specified, the (H) polymeric resin as a (H) component does not contain substances belonging to components (A) to (G) above. The (H) polymeric resin may be compatible with resin components other than (H) polymeric resin and may be included in the resin composition. When the resin composition includes (H) component, one type of (H) polymeric resin may be used alone, or two or more types may be used in combination.

[0127] (H) The weight-average molecular weight (Mw) of the polymer resin is, for example, greater than 5,000, preferably 8,000 or more, more preferably 10,000 or more, further preferably 20,000 or more, preferably 100,000 or less, more preferably 70,000 or less, and further preferably 60,000 or less. The weight-average molecular weight of (H) the polymer resin can be determined by gel permeation chromatography (GPC) as a value converted from polystyrene.

[0128] Examples of (H) polymeric resins include: resins containing oxazoline groups, phenoxy resins, polybutadiene resins, polyimide resins, polyvinyl alcohol acetal resins, polyolefin resins, polyamide-imide resins, polyether-imide resins, polysulfone resins, polyethersulfone resins, polyphenylene ether resins, polycarbonate resins, polyether ether ketone resins, polyester resins, etc. As mentioned above, (H) polymeric resins do not contain substances belonging to components (A) through (G). Therefore, among compounds with a tensile modulus of elasticity of 1 GPa or less as measured at 25°C according to JIS K7161, compounds with free radical polymerizable groups at their ends are not components (H) but are classified as components (A).

[0129] Resins containing oxazoline groups are obtained by polymerizing addition-polymerizable oxazoline compounds (monomers containing a vinyloxazoline skeleton), such as 2-isopropenyl-2-oxazoline, 5-methyl-2-isopropenyl-2-oxazoline, 4,4-dimethyl-2-isopropenyl-2-oxazoline, 4-methyl-2-isopropenyl-2-oxazoline, 4,4,5-trimethyl-2-isopropenyl-2-oxazoline, 2-vinyl-2-oxazoline, 5-methyl-2-vinyl-2-oxazoline, 4,4-dimethyl-2-vinyl-2-oxazoline, 4-methyl-2-vinyl-2-oxazoline, 4,4,5-trimethyl-2-vinyl-2-oxazoline, etc. Furthermore, resins containing oxazoline groups can also copolymerize any monomers such as styrene, α-methylstyrene, 4-methylstyrene, 3-methylstyrene, 2-methylstyrene, 4-ethylstyrene, 4-tert-butylstyrene, p-divinylbenzene, and m-divinylbenzene, as needed. Specific examples of resins containing oxazoline groups include, for instance, "PX-3-RP-61" manufactured by Nippon Shokubai Co., Ltd.

[0130] Examples of phenoxy resins include those having one or more skeletons selected from the following: bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenol acetophenone skeleton, phenolic skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene skeleton, and trimethylcyclohexane skeleton. The terminal group of the phenoxy resin can be any functional group such as a phenolic hydroxyl group or an epoxy group. Specific examples of phenoxy resins include: Mitsubishi Chemical's "1256" and "4250" (both phenoxy resins containing a bisphenol A backbone); Mitsubishi Chemical's "YX8100" (phenoxy resin containing a bisphenol S backbone); Mitsubishi Chemical's "YX6954" (phenoxy resin containing a bisphenol acetophenone backbone); Nippon Steel Chemical Materials' "FX280" and "FX293"; Mitsubishi Chemical's "YX7200B35", "YL7500BH30", "YX6954BH30", "YX7553BH30", "YL7769BH30", "YL6794", "YL7213", "YL7290", and "YL7482"; etc.

[0131] Examples of polybutadiene resins include: resins containing a hydrogenated polybutadiene backbone, hydroxyl-containing polybutadiene resins, phenolic hydroxyl-containing polybutadiene resins, carboxyl-containing polybutadiene resins, anhydride-containing polybutadiene resins, epoxy-containing polybutadiene resins, isocyanate-containing polybutadiene resins, urethane-containing polybutadiene resins, and polyphenylene ether-polybutadiene resins. However, polybutadiene resins containing component (H) do not contain substances belonging to component (A). Furthermore, polybutadiene resins with phenolic resin end caps can also be used.

[0132] As the polyimide resin, resins having an imide structure (preferably a cyclic imide structure) can be used, such as: imides of acid anhydrides and diamine compounds; imides of acid anhydrides and diisocyanate compounds; etc. However, the polyimide resin as component (H) does not contain substances belonging to component (A). Among them, the polyimide resin as component (H) is preferably an imide of acid anhydrides and diamine compounds. In addition, the polyimide resin may also contain an indane backbone such as a trimethyl indane backbone, for example, the structural unit formed by the polymerization of the diamine compound may contain an indane backbone.

[0133] As an acid anhydride used in the manufacture of polyimide resins, tetracarboxylic acid anhydrides are preferred. Examples of tetracarboxylic acid anhydrides include aromatic tetracarboxylic acid dianhydrides and aliphatic tetracarboxylic acid dianhydrides, with aromatic tetracarboxylic acid dianhydrides being preferred. Examples of aromatic tetracarboxylic acid dianhydrides include phenyltetracarboxylic acid dianhydrides, naphthalenetetracarboxylic acid dianhydrides, anthracenetetracarboxylic acid dianhydrides, and diphthalic acid dianhydrides, with diphthalic acid dianhydrides being preferred. Examples of diphthalic acid dianhydrides include 3,3',4,4'-benzophenone tetracarboxylic acid dianhydrides, 3,3',4,4'-diphenyl ether tetracarboxylic acid dianhydrides, 3,3',4,4'-diphenyl sulfone tetracarboxylic acid dianhydrides, 3,3',4,4'-biphenyltetracarboxylic acid dianhydrides, 2,2',3,3'-biphenyltetracarboxylic acid dianhydrides, 2,3',4'-biphenyltetracarboxylic acid dianhydrides, 2,3 3',4'-Benzophenone tetracarboxylic dianhydride, 2,3,3',4'-Diphenyl ether tetracarboxylic dianhydride, 2,3,3',4'-Diphenyl sulfone tetracarboxylic dianhydride, 2,2'-Bis(3,4-dicarboxyphenoxyphenyl)sulfone dianhydride, 4,4'-Oxyphthalic anhydride, Methylene-4,4'-Diphthalic anhydride, 1,1-Ethynyl-4,4'-Diphthalic anhydride 2,2-Propylene-4,4'-Diphthalic dianhydride, 1,2-Ethylene-4,4'-Diphthalic dianhydride, 1,3-Trimethylene-4,4'-Diphthalic dianhydride, 1,4-Tetramethylene-4,4'-Diphthalic dianhydride, 1,5-Pentamethylene-4,4'-Diphthalic dianhydride, 1,3-Bis(3,4-Dicarboxyphenyl)phthalic dianhydride, 1,4-bis(3,4-dicarboxyphenyl)phthalic anhydride, 1,3-bis(3,4-dicarboxyphenoxy)phthalic anhydride, 1,4-bis(3,4-dicarboxyphenoxy)phthalic anhydride, 2,2-bis(2,3-dicarboxyphenyl)propane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 4,4'-(4,4'-isopropylidenediphenoxy)bisphthalic anhydride, etc.

[0134] Examples of diamine compounds used in the manufacture of polyimide resins include aliphatic diamine compounds and aromatic diamine compounds, with aromatic diamine compounds being preferred. Examples of diphenylamine compounds include: 4,4'-diamino-2,2'-bis(trifluoromethyl)-1,1'-biphenyl, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfide, 4-aminophenyl-4-aminobenzoate, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 2,2-bis(4-aminophenyl)propane, 4,4'-(hexafluoroisopropylidene)diphenylamine, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(4-aminophenoxy)]propane, [Phenyl]hexafluoropropane, α,α-bis[4-(4-aminophenoxy)phenyl]-1,3-diisopropylbenzene, α,α-bis[4-(4-aminophenoxy)phenyl]-1,4-diisopropylbenzene, 4,4'-(9-fluoreneyl)diphenylamine, 2,2-bis(3-methyl-4-aminophenyl)propane, 2,2-bis(3-methyl-4-aminophenyl)benzene, 4,4'-diamino-3,3'-dimethyl-1,1'-biphenyl, 4,4'-diamino-2,2'-dimethyl-1,1'-biphenyl, 9,9'-bis(3-methyl-4-aminophenyl)fluorene, 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindene, etc.

[0135] Examples of commercially available polyimide resins include "Rikacoat SN20" and "Rikacoat PN20" manufactured by Shin Nippon Rika Co., Ltd. Other examples of polyimide resins include linear polyimides (as described in Japanese Patent Application Publication No. 2006-37083) obtained by reacting difunctional hydroxyl-terminated polybutadiene, diisocyanate compounds, and tetrabasic anhydrides, and modified polyimides containing a polysiloxane backbone (as described in Japanese Patent Application Publication Nos. 2002-12667 and 2000-319386, etc.).

[0136] (H) The polymer resin may also include an elastomer. The elastomer is a flexible resin, preferably a resin with rubber elasticity or a resin that exhibits rubber elasticity by polymerization with other components. Examples of rubber elasticity include resins that exhibit an elastic modulus of 1 GPa or less when subjected to a tensile test at 25°C and 40% RH according to Japanese Industrial Standard (JIS K7161). Specifically, the aforementioned range of elastic modulus of the elastomer is, for example, 1 GPa or less, preferably 0.9 GPa or less, more preferably 0.8 GPa or less, further preferably 0.7 GPa or less, preferably 0.01 GPa or more, more preferably 0.03 GPa or more, further preferably 0.05 GPa or more, and even more preferably 0.1 GPa or more.

[0137] The elastomer is preferably selected from one or more resins with a glass transition temperature (Tg) of 25°C or less and resins that are liquid at 25°C. The glass transition temperature of the resin with a Tg of 25°C or less is preferably 20°C or less, more preferably 15°C or less. The lower limit of the glass transition temperature is not particularly limited, and for example, it can be -15°C or more. Furthermore, as a resin that is liquid at 25°C, it is preferably a resin that is liquid at 20°C or less, more preferably a resin that is liquid at 15°C or less. The glass transition temperature can be measured by DSC (differential scanning calorimetry).

[0138] (H) polymeric resins can be included in resin compositions that are compatible with resin components other than (H) polymeric resins. Such compatible (H) polymeric resins can be included in cured products that are compatible with resin components other than (H) polymeric resins. Furthermore, (H) polymeric resins can be included in resin compositions in a particulate state that are incompatible with resin components other than (H) polymeric resins. Such particulate (H) polymeric resins can be included in cured products in a particulate state that are incompatible with resin components other than (H) polymeric resins. Furthermore, "(H) polymeric resins compatible with resin components other than (H) polymeric resins" and "particulate (H) polymeric resins" can also be used in combination.

[0139] Examples of particulate (H) polymer resins include rubber particles, polyamide microparticles, silicone particles, and core-shell particles. Rubber particles and core-shell particles are preferred, with core-shell particles being more preferred. Core-shell particles are particulate polymer resins having a core particle and one or more shell layers covering it. Core-shell particles are preferably core-shell graft copolymer particles having a "resin-containing core particle" and a "shell formed by graft copolymerization of monomer components that can copolymerize with the resin contained in the core particle." The term "core-shell type" does not necessarily refer only to those where the core particle and shell layer are clearly distinguishable; it also includes those where the boundary between the core particle and shell layer is indistinct. Furthermore, the core particle may not be completely covered by the shell layer.

[0140] Commercially available products containing core-shell graft copolymer particles include: Samsung SDI's "CHT"; Techno UMG's "B602"; Dow Chemical Japan's "Paraloid EXL2602", "Paraloid EXL2603", "Paraloid EXL2655", "Paraloid EXL2311", "Paraloid EXL2313", "Paraloid EXL2315", "Paraloid KM330", "Paraloid KM336P", and "Paraloid KCZ201"; Mitsubishi Rayon's "Metablen C-223A", "Metablen E-901", "Metablen S-2001", "Metablen W-450A", and "Metablen SRK-200"; and Kaneka's "KaneAce M-511", "Kane Ace M-600", "Kane Ace M-400", and "Kane Ace M-600". M-580", "Kane Ace MR-01"; etc.

[0141] When the resin composition contains (H) polymer resin, the content of (H) component in the resin composition relative to 100% by mass of the non-volatile components of the resin composition is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, further preferably 0.5% by mass or more or 0.7% by mass or more, preferably 5% by mass or less, more preferably 3% by mass or less, and further preferably 1.5% by mass or less.

[0142] When the resin composition contains (H) polymeric resin, the content of (H) component in the resin composition relative to 100% by mass of the resin component of the resin composition is preferably 1% by mass or more, more preferably 2% by mass or more, further preferably 2.5% by mass or more, preferably 10% by mass or less, more preferably 7% by mass or less, and further preferably 5% by mass or less.

[0143] <(I) Any additives> The resin composition of the present invention may further include, as an optional component, any of the additives in (I). The additives in (I) do not contain substances belonging to components (A) to (H) above. Examples of the additives in (I) include: polymerization initiators; organometallic compounds such as organocopper compounds, organozinc compounds, and organocobalt compounds; colorants such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium dioxide, and carbon black; polymerization inhibitors such as hydroquinone, catechol, pyrogallol, and phenothiazine; leveling agents such as silicone-based leveling agents and acrylic polymer-based leveling agents; thickeners such as bentonite and montmorillonite; defoamers such as silicone-based defoamers, acrylic defoamers, fluorinated defoamers, and vinyl resin-based defoamers; ultraviolet absorbers such as benzotriazole-based ultraviolet absorbers; adhesion promoters such as triazole-based, tetraazole-based, and triazine-based adhesion promoters; hindered phenolic... Antioxidants such as antioxidants; fluorescent whitening agents such as zirconia derivatives; surfactants such as fluorinated surfactants and organosilicon surfactants; flame retardants such as phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphonic acid compounds, red phosphorus), nitrogen-based flame retardants (e.g., melamine sulfate), halogen-based flame retardants, and inorganic flame retardants (e.g., antimony trioxide); dispersants such as phosphate ester dispersants, polyoxyethylene dispersants, acetylene dispersants, organosilicon dispersants, anionic dispersants, and cationic dispersants; stabilizers such as borate ester stabilizers, titanate stabilizers, aluminate stabilizers, zirconate stabilizers, isocyanate stabilizers, carboxylic acid stabilizers, and carboxylic anhydride stabilizers. (I) Any additive may be used alone or in combination of two or more.

[0144] <(J) Solvent> In addition to the non-volatile components including components (A) to (I) mentioned above, the resin composition may further include solvent (J) as an arbitrary volatile component. As solvent (J), for example, an organic solvent is used. Examples of organic solvents include: ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ester solvents such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, and γ-butyrolactone; ether solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, diphenyl ether, and anisole; alcohol solvents such as methanol, ethanol, propanol, butanol, and ethylene glycol; and 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, and carbitol acetate. Ether ester solvents such as acetate, γ-butyrolactone, and methyl methoxypropionate; ester alcohol solvents such as methyl lactate, ethyl lactate, and methyl 2-hydroxyisobutyrate; ether alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, and diethylene glycol monobutyl ether (butyl carbitol); amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone; sulfoxide solvents such as dimethyl sulfoxide; nitrile solvents such as acetonitrile and propionitrile; aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, and methylcyclohexane; and aromatic hydrocarbon solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene. (J) One solvent may be used alone, or two or more solvents may be used in combination.

[0145] The content of (J) solvent in the resin composition, relative to 100% by mass of all components of the resin composition, may be, for example, 60% by mass or less, 40% by mass or less, 30% by mass or less, 20% by mass or less, 15% by mass or less, or 10% by mass or less. Furthermore, the content of (J) solvent in the resin composition may also be 0% by mass.

[0146] [Method for manufacturing the resin composition] Resin compositions can be manufactured, for example, by mixing components that can be included in the resin composition. Therefore, a resin composition can be manufactured by a manufacturing method comprising the steps of mixing (A) a high molecular weight / low elastic modulus compound having free radical polymerizable groups at the ends, (B) an epoxy resin, (C) an active ester resin, and (D) an inorganic filler. This manufacturing method may also include a step of mixing any of the components (E) through (J). Components (A) through (J) may be mixed partially or entirely simultaneously, or they may be mixed sequentially.

[0147] [Characteristics of the Resin Composition] The resin composition of the present invention contains components (A), (B), (C) and (D) (and, as needed, components (E), (F), (G), (H), (I) and (J)), thus yielding a cured product with low dielectric loss tangent, anti-warping properties and excellent stain removal.

[0148] The cured resin composition of the present invention exhibits a low dielectric loss tangent. Therefore, an insulating layer with a low dielectric loss tangent can be obtained from this cured composition. For example, as described later in the section <Experimental Example 1: Test for Determination of Dielectric Loss Tangent Df>, when measured at 5.8 GHz and 23°C, the dielectric loss tangent of the cured product obtained by heat curing the resin composition (layer) at 190°C for 90 minutes is preferably 0.004 or less. The lower limit value of the dielectric loss tangent can be 0.0001 or more, etc.

[0149] The cured resin composition of the present invention can effectively suppress warping after curing. For example, when measuring the warping after curing as described in the <Experimental Example 2: Warping Measurement Test> section below, the warping of the cured product obtained by heating the resin composition (layer) at 100°C for 30 minutes and then further heating it at 200°C for 90 minutes is preferably less than 2,500, more preferably less than 2,500, and even more preferably less than 2,400. In the cured resin composition (layer), the lower limit value of the warping after curing can be 100 or more, etc.

[0150] The cured resin composition of the present invention exhibits excellent stain removal properties. The maximum stain length of the cured product is preferably less than 7 μm, more preferably less than 5 μm. "Maximum stain length" refers to the maximum length of stain from the circumference of the bottom surface of the through-hole to the center of the circle. The lower limit of the maximum stain length can be, for example, 0 μm, or, for example, 0.1 μm or more. The evaluation of the maximum stain length can be performed according to the method described in the <Experimental Example 3: Evaluation of Stain Removability> section below.

[0151] The cured resin composition of the present invention exhibits excellent adhesion strength to the conductor layer. Therefore, an insulating layer with excellent adhesion strength to the conductor layer can be obtained based on this cured product. For example, when measuring the adhesion strength (peel strength) to the conductor layer as described in the section "Test Example 4: Determination of Adhesion Strength (Peel Strength) to the Conductor Layer" below, the peel strength between the cured layer (insulating layer) obtained by heat curing the resin composition layer at 200°C for 90 minutes and the conductor layer is preferably 0.35 kgf / cm or more, more preferably 0.38 kgf / cm or more, and even more preferably 0.4 kgf / cm or more. The upper limit of the peel strength can be 10 kgf / cm or less, etc. The peel strength can be measured according to the method described in the section "Test Example 4: Determination of Adhesion Strength (Peel Strength) to the Conductor Layer" below.

[0152] [Uses of the resin composition] As previously stated, the resin composition of the present invention yields cured products with low dielectric loss tangent, anti-warping properties, and excellent contamination removal. Therefore, the resin composition of the present invention is suitably used as a resin composition for forming an insulating layer of a printed wiring board (resin composition for insulating layer of printed wiring board), and more suitably used as a resin composition for forming an interlayer insulating layer of a printed wiring board (resin composition for interlayer insulating layer of printed wiring board). The resin composition of the present invention is also suitably used as a resin composition for forming an insulating layer of a redistribution substrate for semiconductor packages (resin composition for insulating layer of redistribution substrate). It should be noted that in the present invention, printed wiring board or redistribution substrate is also generally referred to as "circuit board," therefore, the resin composition of the present invention is suitably used as an insulating layer for circuit boards.

[0153] Furthermore, the resin composition of the present invention can be widely used in applications requiring resin compositions, such as sheet laminates of resin sheets and prepregs, solder resists, underfill materials, chip bonding materials, hole-filling resins, sealing resins, and component embedding resins.

[0154] [Sheet-like laminated materials (resin sheets, prepregs)] The resin composition of the present invention can be used directly, but it can also be used in the form of a sheet-like laminate containing the resin composition.

[0155] As a sheet-like laminated material, resin sheets and prepregs as shown below are preferred.

[0156] In one embodiment, the resin sheet includes a support and a layer of resin composition disposed on the support (hereinafter simply referred to as the "resin composition layer"), characterized in that the resin composition layer is formed from the resin composition of the present invention.

[0157] The thickness of the resin composition layer varies depending on the application and can be appropriately determined accordingly. For example, from the viewpoint of thinning printed wiring boards or semiconductor packaging, the thickness of the resin composition layer is preferably 100 μm or less, 80 μm or less, 60 μm or less, 50 μm or less, 40 μm or less, or 30 μm or less. There is no particular limitation on the lower limit of the resin composition layer thickness, but it is generally acceptable to have a thickness of 1 μm or more, 5 μm or more, etc.

[0158] Examples of supports include thermoplastic resin films, metal foils, and release paper, with thermoplastic resin films and metal foils being preferred. Therefore, in a more suitable embodiment, the support is a thermoplastic resin film or a metal foil.

[0159] When a thermoplastic resin film is used as the support, examples of thermoplastic resins include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), acrylics such as polycarbonate (PC) and polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfides (PES), polyether ketones, and polyimides. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred.

[0160] When a metal foil is used as a support, examples of metal foils include copper foil and aluminum foil, with copper foil being preferred. As copper foil, foils containing a single metal such as copper can be used, or foils containing alloys of copper and other metals (e.g., tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) can be used.

[0161] For the support body, matte treatment, corona treatment, and antistatic treatment can be applied to the surface that bonds to the resin composition layer. Furthermore, a support body with a release layer on the surface that bonds to the resin composition layer can also be used. Examples of release agents used in the release layer of a support body with a release layer include, for example, one or more release agents selected from alkyd resins, polyolefin resins, polyurethane resins, and silicone resins. Commercially available release agents include, for example, "SK-1," "AL-5," and "AL-7" manufactured by Lintec Co., Ltd., which are alkyd resin-based release agents. Furthermore, commercially available supports with release layers include, for example, "SK-1," "AL-5," and "AL-7" manufactured by Lintec Co., Ltd., which are PET films having a release layer with an alkyd resin-based release agent as the main component; "Lumirror T60" manufactured by Toray Industries, Ltd.; "Purex" manufactured by Teijin Corporation; and "Unipeel" manufactured by Unitika Co., Ltd.

[0162] The thickness of the support is not particularly limited, but it is preferably in the range of 5μm to 75μm, and more preferably in the range of 10μm to 60μm. It should be noted that when using a support with a release layer, the overall thickness of the support with the release layer is preferably within the above range.

[0163] When a metal foil is used as a support, a metal foil with a support substrate can be used to bond a peelable support substrate onto a thin metal foil. In one embodiment, the metal foil with a support substrate includes a support substrate, a release layer disposed on the support substrate, and a metal foil disposed on the release layer. When a metal foil with a support substrate is used as a support, a resin composition layer is disposed on the metal foil.

[0164] In metal foils with a support substrate, the material of the support substrate is not particularly limited, but examples include copper foil, aluminum foil, stainless steel foil, titanium foil, and copper alloy foil. When copper foil is used as the support substrate, it can be electrolytic copper foil or rolled copper foil. Furthermore, the release layer is not particularly limited as long as the metal foil can be peeled off from the support substrate; examples include alloy layers selected from elements such as Cr, Ni, Co, Fe, Mo, Ti, W, and P; and organic films.

[0165] In metal foils with a supporting substrate, the preferred material for the metal foil is, for example, copper foil or copper alloy foil.

[0166] In metal foils with a supporting substrate, the thickness of the supporting substrate is not particularly limited, but is preferably in the range of 10 μm to 150 μm, more preferably in the range of 10 μm to 100 μm. Furthermore, the thickness of the metal foil can, for example, be in the range of 0.1 μm to 10 μm.

[0167] In one embodiment, the resin sheet may further include any layer as needed. Examples of such arbitrary layers include, for instance, a protective film disposed on the side of the resin composition layer that is not bonded to the support (i.e., the side opposite to the support). The thickness of the protective film is not particularly limited, but may be, for example, 1 μm to 40 μm. By laminating the protective film, the adhesion of dust and scratches to the surface of the resin composition layer can be suppressed.

[0168] Resin sheets can be manufactured, for example, by directly applying a liquid resin composition or by preparing a resin varnish in which the resin composition is dissolved in an organic solvent, applying it to a support using a die coater or the like, and then further drying it to form a resin composition layer.

[0169] As an organic solvent, examples can be the same as those described as components of the resin composition. One organic solvent may be used alone, or two or more may be used in combination.

[0170] Drying can be carried out by known methods such as heating or hot air blowing. There are no particular limitations on the drying conditions, but drying should be carried out in a manner that ensures the content of organic solvent in the resin composition layer is 10% by mass or less, preferably 5% by mass or less. The drying time varies depending on the boiling point of the organic solvent in the resin composition or resin varnish, but for example, when using a resin composition or resin varnish containing 30% to 60% by mass of organic solvent, a resin composition layer can be formed by drying at 50°C to 150°C for 3 to 10 minutes.

[0171] The resin sheet can be wound into rolls for storage. If the resin sheet has a protective film, it can be used by peeling off the protective film.

[0172] In one embodiment, the prepreg is formed by impregnating a sheet fiber substrate with the resin composition of the present invention.

[0173] The sheet fiber substrate used for prepregs is not particularly limited, and commonly used substrates such as glass cloth, aromatic polyamide nonwoven fabric, and liquid crystal polymer nonwoven fabric can be used. From the viewpoint of thinning printed wiring boards and semiconductor chip packaging, the thickness of the sheet fiber substrate is preferably 50 μm or less, more preferably 40 μm or less, further preferably 30 μm or less, and particularly preferably 20 μm or less. There is no particular limitation on the lower limit of the thickness of the sheet fiber substrate. The lower limit of the thickness of the sheet fiber substrate is generally 10 μm or more.

[0174] Prepregs can be manufactured using known methods such as hot-melt methods and solvent methods.

[0175] The thickness of the prepreg can be in the same range as the resin composition layer in the aforementioned resin sheet.

[0176] The sheet-like laminated material of the present invention is suitable for forming an insulating layer of a printed wiring board (for insulating layers of printed wiring boards), and is more suitable for forming an interlayer insulating layer of a printed wiring board (for interlayer insulating layers of printed wiring boards). The sheet-like laminated material of the present invention is also suitable for forming an insulating layer of a redistribution substrate of a semiconductor package (for insulating layers of a redistribution substrate). That is, the sheet-like laminated material of the present invention is suitable for use as an insulating layer of a circuit board.

[0177] [Circuit board] The resin composition of the present invention can be used to form an insulating layer of a circuit board. The present invention also provides a circuit board comprising an insulating layer containing a cured product of the resin composition of the present invention.

[0178] Printed wiring board In one embodiment, the circuit board of the present invention is a printed wiring board.

[0179] Printed wiring boards can be manufactured, for example, using the aforementioned resin sheet, by a method comprising the following steps (I) and (II): (I) A process of laminating a resin sheet onto an inner substrate in a manner that bonds the resin composition layer of the resin sheet to the inner substrate. (II) The process of curing (e.g., thermosetting) the resin composition layer to form an insulating layer.

[0180] The "inner layer substrate" used in step (I) refers to a component that serves as the substrate of a printed wiring board, such as glass epoxy substrate, metal substrate, polyester substrate, polyimide substrate, BT resin substrate, thermosetting polyphenylene ether substrate, etc. Furthermore, this substrate may have a conductor layer on one or both sides, and this conductor layer may be patterned. An inner layer substrate with a conductor layer (circuit) formed on one or both sides of the substrate is sometimes called an "inner layer circuit substrate." In addition, intermediate manufactured products that further form an insulating layer and / or a conductor layer during the manufacture of the printed wiring board are also included in the "inner layer substrate" as referred to in this invention. When the printed wiring board is a component-integrated circuit board, an inner layer substrate with integrated components may also be used.

[0181] The lamination of the inner substrate and the resin sheet can be achieved, for example, by heating and pressing the resin sheet onto the inner substrate from the support side. Examples of components for heating and pressing the resin sheet onto the inner substrate (hereinafter also referred to as "heat-pressing components") include, for example, heated metal plates (SUS end plates, etc.) or metal rollers (SUS rollers). It should be noted that the heat-pressing components can be directly pressed onto the resin sheet, or they can be pressed using an elastic material such as heat-resistant rubber, so that the resin sheet fully conforms to the surface irregularities of the inner substrate.

[0182] The lamination of the inner substrate and the resin sheet can be performed by vacuum lamination. In vacuum lamination, the heating and pressing temperature is preferably in the range of 60°C to 160°C, more preferably in the range of 80°C to 140°C; the heating and pressing pressure is preferably in the range of 0.098 MPa to 1.77 MPa, more preferably in the range of 0.29 MPa to 1.47 MPa; and the heating and pressing time is preferably in the range of 20 seconds to 400 seconds, more preferably in the range of 30 seconds to 300 seconds. Lamination is preferably performed under reduced pressure conditions below 26.7 hPa.

[0183] Lamination can be performed using commercially available vacuum laminators. Examples of commercially available vacuum laminators include: vacuum pressure laminators manufactured by Meiki Seisakusho Co., Ltd., vacuum coating machines manufactured by Nikko-Materials Co., Ltd., and batch vacuum pressure laminators.

[0184] After lamination, the laminated resin sheets can be smoothed under normal pressure (atmospheric pressure), for example, by pressing a heated bonding member from the support side. The pressing conditions for smoothing can be the same as the heating and pressing conditions for lamination described above. Smoothing can be performed using a commercially available laminator. It should be noted that lamination and smoothing can be performed continuously using the aforementioned commercially available vacuum laminator.

[0185] The support can be removed between steps (I) and (II), or after step (II). It should be noted that if a metal foil is used as the support, the conductor layer can be formed using the metal foil without peeling off the support. Furthermore, if a metal foil with a support substrate is used as the support, only the support substrate (and release layer) needs to be peeled off. Then, the conductor layer can be formed using the metal foil.

[0186] In step (II), the resin composition layer is cured (e.g., thermocure) to form an insulating layer comprising the cured resin composition. The curing conditions for the resin composition layer are not particularly limited, and conditions typically used when forming insulating layers for printed wiring boards can be used.

[0187] For example, the thermosetting conditions of the resin composition layer vary depending on the type of resin composition, but in one embodiment, the curing temperature is preferably 140°C to 250°C, more preferably 150°C to 240°C, and even more preferably 160°C to 230°C. The curing time is preferably 5 minutes to 240 minutes, more preferably 10 minutes to 150 minutes, and even more preferably 15 minutes to 120 minutes.

[0188] Before applying the thermosetting resin composition layer, the resin composition layer can be preheated at a temperature below the curing temperature. For example, before applying the thermosetting resin composition layer, the resin composition layer can be preheated at a temperature of 50°C to 140°C, preferably 60°C to 135°C, more preferably 70°C to 130°C for at least 5 minutes, preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes.

[0189] In the manufacture of printed wiring boards, steps (III) of opening holes in the insulating layer, (IV) of roughening the insulating layer, and (V) of forming the conductor layer may be further performed. These steps (III) to (V) may be performed according to various methods known to those skilled in the art for the manufacture of printed wiring boards. It should be noted that if the support is removed after step (II), the removal of the support may be performed between steps (II) and (III), between steps (III) and (IV), or between steps (IV) and (V). Furthermore, as needed, the formation of the insulating layer and conductor layer in steps (I) to (V) may be repeated to form a multilayer wiring board.

[0190] In other embodiments, the printed wiring board of the present invention can be manufactured using the aforementioned prepreg. The manufacturing method is essentially the same as that used with resin sheets.

[0191] Process (III) is the process of creating openings in the insulating layer, thereby forming through holes, vias, and other holes in the insulating layer. Process (III) can be performed, for example, using a drill bit, laser, plasma, or other methods, depending on the composition of the resin composition used to form the insulating layer. The size and shape of the holes can be appropriately determined according to the design of the printed circuit board.

[0192] Step (IV) is a roughening process for the insulating layer. Typically, contamination removal (decontamination) is also performed in this step (IV). The roughening process and conditions are not particularly limited; known steps and conditions commonly used in forming the insulating layer of a printed wiring board can be employed. For example, the insulating layer can be roughened sequentially by performing a swelling treatment using a swelling solution, a roughening treatment using an oxidizing agent, and a neutralization treatment using a neutralizing solution.

[0193] The swelling solution used in the roughening treatment is not particularly limited, and examples include alkaline solutions and surfactant solutions. An alkaline solution is preferred, and sodium hydroxide solution or potassium hydroxide solution is more preferred. Commercially available swelling solutions include, for example, "Swelling Dip Securiganth P" and "Swelling Dip Securiganth SBU" manufactured by Ammet Japan Co., Ltd. The swelling treatment using the swelling solution is not particularly limited; for example, it can be performed by immersing the insulating layer in a swelling solution at 30°C to 90°C for 1 to 20 minutes. From the viewpoint of suppressing the swelling of the resin in the insulating layer at an appropriate level, it is preferable to immerse the insulating layer in a swelling solution at 40°C to 80°C for 5 to 15 minutes.

[0194] The oxidant used in the roughening treatment is not particularly limited, and examples include alkaline permanganate solutions prepared by dissolving potassium permanganate or sodium permanganate in an aqueous sodium hydroxide solution. For roughening treatment using an oxidant such as an alkaline permanganate solution, it is preferable to immerse the insulating layer in an oxidant solution heated to 60°C to 100°C for 10 to 30 minutes. Furthermore, the concentration of permanganate in the alkaline permanganate solution is preferably 5% to 10% by mass. Commercially available oxidants include, for example, alkaline permanganate solutions such as "Concentrate Compact CP," "Concentrate Compact P," and "Dosing Solution Securiganth P" manufactured by Ammet Japan Co., Ltd.

[0195] Furthermore, the neutralizing liquid used in the roughening process is preferably an acidic aqueous solution, and commercially available products include, for example, "Reduction Solution Securiganth P" manufactured by Ammet Japan Co., Ltd.

[0196] Treatment using a neutralizing solution can be performed by immersing the roughened surface treated with an oxidant in a neutralizing solution at 30°C to 80°C for 5 to 30 minutes. From an operability perspective, it is preferable to immerse the roughened object treated with an oxidant in a neutralizing solution at 40°C to 70°C for 5 to 20 minutes.

[0197] Step (V) is the step of forming a conductor layer, which is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a more suitable embodiment, the conductor layer comprises one or more metals selected from gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductor layer can be a single metal layer or an alloy layer. Examples of alloy layers include layers formed from alloys of two or more metals selected from the above-mentioned metals (e.g., nickel-chromium alloys, copper-nickel alloys, and copper-titanium alloys). From the viewpoints of versatility, cost, and ease of patterning in conductor layer formation, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper is preferred, as is an alloy layer of nickel-chromium alloy, copper-nickel alloy, or copper-titanium alloy. More preferably, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of nickel-chromium alloy, is preferred. A single metal layer of copper is even more preferred.

[0198] The conductor layer can be a single-layer structure, or a multi-layer structure consisting of two or more single-metal layers or alloy layers of different types of metals or alloys. In the case of a multi-layer conductor layer, the layer in contact with the insulating layer is preferably a single-metal layer of chromium, zinc, or titanium, or an alloy layer of nickel-chromium alloy.

[0199] The thickness of the conductor layer varies depending on the design of the required printed wiring board, and is generally 3μm to 35μm, preferably 5μm to 30μm.

[0200] The conductor layer can be formed using metal foil. When using metal foil to form the conductor layer, it is preferable to perform step (V) between step (I) and step (II). For example, after step (I), the support is removed, and metal foil is laminated onto the surface of the exposed resin composition layer. The lamination of the resin composition layer and the metal foil can be performed by vacuum lamination. The lamination conditions can be the same as those described for step (I). Next, step (II) is performed to form an insulating layer. Then, using the metal foil on the insulating layer, a conductor layer with the desired wiring pattern can be formed using conventionally known techniques such as a modified-semi-additive process.

[0201] Metal foils can be manufactured using known methods such as electrolysis and rolling. Commercially available metal foils include, for example, HLP foil and JXUT-III foil manufactured by JX Metals Corporation, and 3EC-III foil and TP-III foil manufactured by Mitsui Metals & Mining Corporation.

[0202] Alternatively, as mentioned above, if a metal foil or a metal foil with a supporting substrate is used as the support for the resin sheet, the metal foil can be used to form a conductor layer.

[0203] In other embodiments, the conductor layer can be formed by plating. When the conductor layer is formed by plating, from the viewpoint of facilitating the formation of fine wiring, it is preferable to form it using a semi-additive method. An example of forming a conductor layer using a semi-additive method is shown below.

[0204] First, a seed layer is formed on the surface of the insulating layer by electroless plating. Next, a mask pattern is formed on the formed seed layer, exposing a portion of the seed layer corresponding to the desired wiring pattern. After forming a metal layer on the exposed seed layer by electrolytic plating, the mask pattern is removed. Then, the unwanted seed layer is removed by etching or the like, thus forming a conductor layer with the desired wiring pattern.

[0205] <Rewiring substrate for semiconductor packaging> In one embodiment, the circuit board of the present invention is a redistribution substrate (redistribution layer) for semiconductor packaging. Hereinafter, a method for manufacturing a semiconductor package will be described.

[0206] In semiconductor packaging, the insulating layer serving as a redistribution substrate includes a cured insulating layer containing the resin composition of the present invention. It should be noted that the semiconductor package may also include a sealing layer containing a cured resin composition of the present invention.

[0207] Semiconductor packages can be manufactured, for example, using the resin composition and resin sheet of the present invention, by a method comprising the steps (1) to (6) described below. The resin composition and resin sheet of the present invention can be used to form the redistribution layer (an insulating layer for forming a redistribution substrate) of step (5) or the sealing layer of step (3). An example of forming a redistribution layer or sealing layer using a resin composition or resin sheet is shown below, but the techniques for forming redistribution layers or sealing layers of semiconductor packages are well known, and those skilled in the art can use the resin composition or resin sheet of the present invention to manufacture semiconductor packages according to known techniques. (1) The process of laminating a temporary fixing film on a substrate; (2) The process of temporarily fixing the semiconductor chip onto the temporary fixing film. (3) The process of forming a sealing layer on a semiconductor chip. (4) The process of peeling the substrate and temporary fixing film off the semiconductor chip. (5) The process of forming a rewiring layer as an insulating layer on the surface of the stripped substrate and temporary fixing film of the semiconductor chip, and (6) The process of forming a redistribution layer as a conductor layer on the redistribution forming layer.

[0208] -Process(1)- There are no particular limitations on the materials used for the substrate. Examples of substrates include: semiconductor wafers such as silicon wafers; glass wafers; glass substrates; metal substrates such as copper, titanium, stainless steel, and cold-rolled steel sheets (SPCC); substrates made by impregnating glass fibers with epoxy resin and then performing a thermosetting process (e.g., FR-4 substrates); and substrates containing bismaleimide triazine resin (BT resin).

[0209] The material of the temporary fixing film is not particularly limited as long as it can be peeled off from the semiconductor chip in process (4) and can temporarily fix the semiconductor chip. Commercially available products can be used for the temporary fixing film. Examples of commercially available products include Revalpha manufactured by Nitto Denko Corporation.

[0210] -Process(2)- Temporary fixation of semiconductor chips can be performed using known devices such as flip chip bonders and die bonders. The arrangement and number of semiconductor chips can be appropriately set according to the shape and size of the temporary fixation film and the production quantity of the target semiconductor package. For example, they can be arranged in a matrix with multiple rows and columns for temporary fixation.

[0211] -Process(3)- The resin composition of the resin sheet of the present invention is laminated onto a semiconductor chip, or the resin composition of the present invention is coated onto a semiconductor chip and cured (e.g., thermosetting) to form a sealing layer.

[0212] For example, the stacking of a semiconductor chip and a resin sheet can be performed by removing the protective film from the resin sheet and then heating and pressing the resin sheet onto the semiconductor chip from the support side. Examples of components for heating and pressing the resin sheet onto the semiconductor chip (hereinafter also referred to as "heat-pressing components") include, for example, heated metal plates (SUS end plates, etc.) or metal rollers (SUS rollers). It should be noted that it is preferable not to directly press the heat-pressing component onto the resin sheet, but rather to press it through an elastic material such as heat-resistant rubber, so that the resin sheet fully conforms to the surface irregularities of the semiconductor chip. The stacking of the semiconductor chip and the resin sheet can be carried out by vacuum lamination, and the stacking conditions are the same as those described in the instructions for manufacturing printed wiring boards, and the preferred range is also the same.

[0213] After lamination, the resin composition is thermo-cured to form a sealing layer. The thermo-curing conditions are the same as those described in the instructions for manufacturing printed wiring boards.

[0214] The support for the resin sheet can be peeled off after the resin sheet is laminated onto the semiconductor chip and thermo-cured, or it can be peeled off before the resin sheet is laminated onto the semiconductor chip.

[0215] When the resin composition of the present invention is applied to form a sealing layer, the application conditions are the same as those described in the description of the resin sheet of the present invention for forming a resin composition layer, and the preferred range is also the same.

[0216] -Process(4)- The method for peeling off the substrate and the temporary fixing film can be appropriately changed depending on the material of the temporary fixing film. Examples include: heating, foaming (or expanding) the temporary fixing film to peel it off, and irradiating the substrate side with ultraviolet light to reduce the adhesion of the temporary fixing film to peel it off.

[0217] In methods involving heating, foaming (or expanding) a temporary fixing film for peeling, the heating conditions are typically 100°C to 250°C for 1 to 90 seconds or 5 to 15 minutes. Furthermore, in methods involving irradiating the temporary fixing film with ultraviolet light from the substrate side to reduce its adhesion and thus peeling, the ultraviolet irradiation dose is typically 10 mJ / cm². 2 ~1000mJ / cm 2 .

[0218] -Process(5)- The resin composition and resin sheet of the present invention are used to form a redistribution layer (an insulating layer of the redistribution substrate).

[0219] After the redistribution layer is formed, vias can also be formed in the redistribution layer to enable interlayer interconnection between the semiconductor chip and the conductor layer described later. The vias can be formed using known methods, depending on the material of the redistribution layer.

[0220] -Process(6)- The conductor layer is formed on the redistribution layer, which can be performed in the same manner as step (V) described in the manufacturing method of the printed wiring board. It should be noted that steps (5) and (6) can be repeated to alternately stack the conductor layer (redistribution layer) and the redistribution layer (insulating layer).

[0221] In the manufacture of semiconductor packages, the following steps may be further performed: (7) forming a solder mask layer on the conductor layer (rewiring layer), (8) forming bumps, and (9) dicing multiple semiconductor packages into individual semiconductor packages. These steps may be performed according to various methods known to those skilled in the art for the manufacture of semiconductor packages.

[0222] By using the resin composition and resin sheet of the present invention, which produce a cured product with low dielectric loss tangent, suppressing warpage and exhibiting excellent contamination removability, a redistribution layer (insulating layer) can be formed, enabling semiconductor packaging with extremely low transmission loss regardless of whether the semiconductor package is a fan-in or fan-out package. In one embodiment, the semiconductor package of the present invention is a fan-out package. The resin composition and resin sheet of the present invention are applicable to both fan-out panel-level packaging (FOPLP) and fan-out wafer-level packaging (FOWLP). In one embodiment, the semiconductor package of the present invention is a fan-out panel-level packaging (FOPLP) or a fan-out wafer-level packaging (FOWLP).

[0223] [Semiconductor Devices] The semiconductor device of the present invention comprises a layer of cured material containing the resin composition of the present invention. The semiconductor device of the present invention can be manufactured using the circuit board of the present invention.

[0224] Examples of semiconductor devices include various semiconductor devices used in electrical products (e.g., computers, mobile phones, digital cameras, and televisions) and vehicles (e.g., motorcycles, automobiles, trams, ships, and aircraft).

[0225] Example The following examples illustrate the invention in detail. However, the invention is not limited to these examples. In the following description, unless otherwise expressly stated, "parts" and "%" refer to "parts by mass" and "% by mass," respectively. Furthermore, unless otherwise specified, the temperature and pressure conditions are room temperature (23°C) and atmospheric pressure (1 atm).

[0226] <Synthesis Example 1: Synthesis of Elastomer A1> In a flask equipped with a stirrer, thermometer, and condenser, add 770.1 g of propylene glycol methyl ether acetate (hereinafter sometimes referred to as "PGMAc"), 67.5 g (0.30 mol) of isophorone diisocyanate (hereinafter sometimes referred to as "IPDI"), 562.6 g (0.15 mol) of OH-terminated polybutadiene (Nippon Soda Co., Ltd. "G-3000", Mn: 3,000, hydroxyl value: 30.3 mg KOH / g), 0.28 g of dibutoxybis(ethyl acetoacetate)zirconium (Matsumoto Fine Chemicals Co., Ltd. "ORGATIX ZC-580"), and 0.14 g of zinc complex (Kuzumoto Chemical Co., Ltd. "K-KAT XK-614"). Heat the mixture to 60°C and maintain this temperature for 4 hours. 16.6 g (0.076 mol) of pyromellitic anhydride was added to the mixed solution. The solution was then heated to 140 °C and reacted for 4 hours.

[0227] In the mixed solution, after confirming that the viscosity increase had stopped, the solution was cooled to 120°C. Then, 20.0 g of 2-hydroxyethyl methacrylate (0.15 mol) and 0.37 g of hydroquinone monomethyl ether were added, and the reaction was carried out at 120°C for 2 hours.

[0228] The characteristic absorption was determined by infrared spectroscopy, confirming the 2270 cm⁻¹ as the characteristic absorption of the isocyanate group. -1 The absorption peak completely disappeared, and the concentration was adjusted using PGMAc to make the non-volatile component 45% by mass. Through the above operations, elastomer A1 (a solution with 45% by mass of non-volatile component) with methacryloyl groups at the ends was obtained. The weight-average molecular weight (Mw) of elastomer A1, determined by GPC, was 13,000.

[0229] The elastic modulus of the obtained elastomer A1 was determined using the following method. A polyethylene terephthalate film (Toray Industries, Inc., "Lumirror R80", thickness 38 μm, softening point 130°C) that had undergone mold release treatment with an alkyd resin-based release agent (Lintec Corporation, "AL-5") was prepared. Elastomer A1 was uniformly coated onto this support using a die coater, resulting in a dried resin layer thickness of 50 μm. This layer was then dried in an oven at 10°C / min, increasing the temperature from 70°C to 120°C for a total of 10 minutes, thereby reducing the mass percentage of volatile components relative to 100% of the total components of elastomer A1 to less than 1% by mass, thus forming a resin layer of elastomer A1. The dried resin layer was peeled off from the support and stamped into the shape of specimen type 5 as described in JISK 7127. The elastic modulus was determined using a tensile test based on JIS K7161 (temperature 25℃, humidity 40%RH, tensile speed 5mm / min). The elastic modulus of elastomer A1 was 0.02 GPa.

[0230] <Synthesis Example 2: Synthesis of Elastomer A2> In a flask equipped with a stirrer, thermometer, and condenser, 727.2 g of PGMAc, 135.9 g (0.61 mol) of IPDI, 459.1 g (0.31 mol) of OH-terminated polybutadiene (Nippon Soda Co., Ltd. "G-1000", Mn: 1,400, hydroxyl value: 74.8 mg KOH / g), 0.26 g of dibutoxybis(ethyl acetoacetate)zirconium (Matsumoto Fine Chemicals Co., Ltd. "ORGATIX ZC-580"), and 0.13 g of zinc complex (Kuzumoto Chemical Co., Ltd. "K-KAT XK-614"). The mixture was heated to 60°C and maintained at this temperature for 4 hours. Then, 33.4 g (0.15 mol) of pyromellitic anhydride was added to the mixture. The mixture was then heated to 140°C and the reaction was continued for 4 hours.

[0231] In the mixed solution, after confirming that the viscosity increase had stopped, the solution was cooled to 120°C. Then, 40.2 g of 2-hydroxyethyl methacrylate (0.31 mol) and 0.34 g of hydroquinone monomethyl ether were added, and the reaction was carried out at 120°C for 2 hours.

[0232] The characteristic absorption was determined by infrared spectroscopy, confirming the 2270 cm⁻¹ as the characteristic absorption of the isocyanate group. -1 The absorption peak completely disappeared, and the concentration was adjusted using PGMAc to make the non-volatile component 45% by mass. Through the above operations, elastomer A2 (a solution with 45% by mass of non-volatile component) with terminal methacrylamide groups was synthesized. The weight-average molecular weight (Mw) of elastomer A2, determined by GPC, was 22,000.

[0233] The elastic modulus of elastomer A2 was determined using the same procedure as for elastomer A1. The elastic modulus of elastomer A2 was 0.01 GPa.

[0234] <Synthesis Example 3: Synthesis of Elastomer A3> In a flask equipped with a stirrer, thermometer, and condenser, 727.2 g of PGMAc, 135.9 g (0.61 mol) of IPDI, 459.1 g (0.31 mol) of OH-terminated polybutadiene (NH4O3 G-1000), 0.26 g of zirconium tetraacetylacetonate (ORGATIX ZC-150), and 0.13 g of diisopropoxybis(ethyl acetoacetate)titanium (ORGATIX TC-750), Matsumoto Fine Chemicals Co., Ltd. The mixture was heated to 60°C and maintained at this temperature for 4 hours. Then, 49.3 g (0.15 mol) of benzophenone tetracarboxylic dianhydride was added to the mixture. The mixture was then heated to 140°C and the reaction was continued for 4 hours.

[0235] In the mixed solution, after confirming that the viscosity increase had stopped, the solution was cooled to 120°C. Then, 34.8 g of 2-hydroxyethyl acrylate (0.30 mol) and 0.34 g of hydroquinone monomethyl ether were added, and the reaction was carried out at 120°C for 2 hours.

[0236] The characteristic absorption was determined by infrared spectroscopy, confirming the 2270 cm⁻¹ as the characteristic absorption of the isocyanate group. -1 The absorption peak completely disappeared. Then, the reactants were adjusted using PGMAc to make the non-volatile component 45% by mass. In the above manner, elastomer A3 (a solution with 45% by mass of non-volatile component) with acryloyl groups at the ends was obtained. The weight-average molecular weight (Mw) of elastomer A3, determined by GPC, was 16,000.

[0237] The elastic modulus of elastomer A3 was determined using the same procedure as for elastomer A1. The elastic modulus of elastomer A3 was 0.05 GPa.

[0238] <Synthesis Example 4: Synthesis of Elastomer A4> In a flask equipped with a stirrer, thermometer, and condenser, add 770.1 g of PGMAc, 67.5 g (0.30 mol) of IPDI, 300.0 g (0.15 mol) of polycarbonate diol (Kuraray Co., Ltd. "C-2015N", Mn: approx. 2000, hydroxyl equivalent: 1000 g / eq.), 0.28 g of dibutoxybis(ethyl acetoacetate)zirconium (Matsumoto Fine Chemicals Co., Ltd. "ORGATIX ZC-580"), and 0.14 g of zinc complex (Kuzumoto Chemical Co., Ltd. "K-KAT XK-614"). Heat the mixture to 60°C and maintain this temperature for 4 hours.

[0239] 16.6 g (0.076 mol) of pyromellitic anhydride was added to the mixed solution. The solution was then heated to 140 °C and reacted for 4 hours. Once the viscosity increase in the mixed solution had stopped, it was cooled to 120 °C. Then, 20.0 g of 2-hydroxyethyl methacrylate (0.15 mol) and 0.37 g of hydroquinone monomethyl ether were added, and the reaction was carried out at 120 °C for 2 hours.

[0240] The characteristic absorption was determined by infrared spectroscopy, confirming the 2270 cm⁻¹ as the characteristic absorption of the isocyanate group. -1 The absorption peak completely disappeared, and the concentration was adjusted using PGMAc to make the non-volatile component 45% by mass. Through the above operations, elastomer A4 (a solution with 45% by mass of non-volatile component) with methacryloyl groups at the ends was obtained. The weight-average molecular weight (Mw) of elastomer A4, determined by GPC, was 150,000.

[0241] The elastic modulus of elastomer A4 was determined using the same procedure as for elastomer A1. The elastic modulus of elastomer A4 was 0.05 GPa.

[0242] <Synthesis Example 5: Synthesis of Elastomer A5> In a reaction vessel, 69 g of OH-terminated polybutadiene (G-3000, manufactured by Nippon Soda Co., Ltd.), 40 g of propylene glycol monomethyl ether acetate (PGMEA, manufactured by Resonac Co., Ltd.), and 0.005 g of dibutyltin laurylate were added, mixed, and dissolved uniformly. After homogenization, the mixture was heated to 60°C. Then, while stirring, 8 g of isophorone diisocyanate (IPDI, manufactured by Evonik Degussa Japan Co., Ltd., isocyanate equivalent: 113 g / eq.) was added, and the reaction was carried out for approximately 3 hours.

[0243] Next, 23 g of cresol phenolic resin (DIC, "KA-1160", hydroxyl equivalent: 117 g / eq.) and 60 g of propylene glycol monomethyl ether acetate (Resonac, "PGMEA") were added to the reactants. The mixture was stirred and refluxed at 150 °C for approximately 10 hours. The reaction was then analyzed by FT-IR at 2250 cm⁻¹. -1 The disappearance of the NCO peak was confirmed. The reaction endpoint was considered to be the disappearance of the NCO peak, and the reactants were cooled to room temperature. Then, the reactants were filtered through a 100-mesh filter cloth to obtain elastomer A5 (butadiene resin containing phenolic hydroxyl groups: a solution of 50% by mass of non-volatile components) with a butadiene structure and phenolic hydroxyl groups. Elastomer A5 does not have free radical polymerizable groups at the molecular ends. The weight-average molecular weight (Mw) of elastomer A5, determined by GPC, was 27,000.

[0244] The elastic modulus of elastomer A5 was determined using the same procedure as for elastomer A1. The elastic modulus of elastomer A5 was 0.05 GPa.

[0245] <Synthesis Example 6: Synthesis of Maleimide Resin F> A MEK solution (60% by mass) of maleimide resin F (Mw / Mn=1.81, t"=1.47 (mainly 1, 2 or 3)) was prepared to be synthesized by the method described in Synthesis Example 1 of Japan Invention Patent Publication No. 2020-500211. The maleimide resin F has a structure represented by the following formula.

[0246] [Chemical Formula 8] .

[0247] <Examples 1-14, Comparative Examples 1-2: Preparation of Resin Compositions> Weigh each component according to the mass parts listed in Table 1 below. Further, mix 15 parts of MEK and 15 parts of cyclohexanone, and disperse them evenly using a high-speed rotary mixer to obtain a resin composition (resin varnish). The detailed contents of each component listed in Table 1 below are as follows.

[0248] (A) High molecular weight / low elasticity compounds with free radical polymerizable groups at the ends (compounds with free radical polymerizable groups at the ends, weight-average molecular weight (Mw) exceeding 5,000 and below 300,000, and tensile modulus of elasticity below 1 GPa as measured at 25°C according to JIS K7161) • "Elastomer A1": Elastomer A1 obtained in Synthesis Example 1 • "Elastomer A2": Elastomer A2 obtained in Synthesis Example 2 • "Elastomer A3": Elastomer A3 obtained in Synthesis Example 3 • "Elastomer A4": Elastomer A4 obtained in Synthesis Example 4.

[0249] (A') High molecular weight / low elasticity compounds that do not have free radical polymerizable groups at the ends (compounds that do not have free radical polymerizable groups at the ends, have a weight-average molecular weight (Mw) greater than 5,000 and less than 300,000, and have a tensile modulus of elasticity of less than 1 GPa as determined by JIS K7161 at 25°C). • "Elastomer A5": Elastomer A5 obtained in Synthesis Example 5.

[0250] (B) Epoxy resin • "ZX-1059": Bisphenol type epoxy resin (manufactured by Nippon Steel Chemical Materials Co., Ltd., a 1:1 mixture of bisphenol A and bisphenol F, epoxy equivalent: 169 g / eq.) • "NC-3000-L": Biphenyl aryl epoxy resin (manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent: approximately 271 g / eq.) • "HP4032SS": Naphthalene-type epoxy resin (manufactured by DIC, epoxy equivalent: approx. 144 g / eq.) • “YX4000H”: Bis(xylenol) type epoxy resin (manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: approximately 185 g / eq.).

[0251] (C) Active ester resin • "HPC-8000L-65TM": Reactive ester resin (manufactured by DIC, active group equivalent: approximately 220 g / eq., 65% by mass MEK / toluene solution of non-volatile components) • "Active ester resin C1": An active ester resin having a structure represented by the following formula (mainly composed of compounds with n being an integer from 0 to 6), a toluene solution of 60% by mass of non-volatile components, and an active group equivalent of approximately 250 g / eq.

[0252] [Chemical Formula 9] .

[0253] • "Active ester resin C2": An active ester resin containing polybutadiene structural units, having an active ester resin with a structure represented by the following formula (mainly composed of compounds in which m is an integer from 0 to 6 and n is an integer from 6 to 30), with an active ester equivalent of 1,002 g / eq.

[0254] [Chemical Formula 10] .

[0255] • "HPC-8150-62T": Reactive ester resin (manufactured by DIC, active group equivalent: approximately 229 g / eq., toluene solution with 62% by mass of non-volatile components).

[0256] (D) Inorganic filler materials • "SO-C2": Spherical silica (manufactured by Yaduma Corporation, average particle size 0.5 μm, specific surface area 5.8 m²) surface-treated with an aminosilane-based silane coupling agent (Shin-Etsu Chemical Industry Co., Ltd. "KBM-573"). 2 / g) • "Alumina D": Spherical alumina (average particle size 1.0 μm) that has been surface-treated with an aminosilane coupling agent ("KBM-573" manufactured by Shin-Etsu Chemical Co., Ltd.

[0257] (E) Other thermosetting resins • "KA-1160": Cresol phenolic resin (manufactured by DIC, hydroxyl equivalent: approx. 117 g / eq.) • “V-03”: Carbodiimide resin (manufactured by Nisshinbo Chemical Co., Ltd., a toluene solution with a solid content of 50%).

[0258] (F) Compounds with free radical polymerizable groups (compounds with free radical polymerizable groups and a weight-average molecular weight (Mw) of less than 5,000) • "OPE-2St 1200": Vinyl benzyl modified polyphenylene ether (manufactured by Mitsubishi Gas Chemical Co., Ltd., toluene solution with 65% non-volatile components, number average molecular weight (Mn): 1,200) • “MIR-3000-70MT”: Aromatic maleimide resin (manufactured by Nippon Kayaku Co., Ltd., a MEK / toluene mixed solution with 70% non-volatile components) • "A-DOG": Dioxanediol diacrylate (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) • "DAD": diallyl biphenyl ester (manufactured by Nichitsu Technology Fine Chemical Co., Ltd.) • "SLK-6895-T90": Aliphatic maleimide resin (bismaleimide resin with a carbon skeleton derived from dimer acid, manufactured by Shin-Etsu Chemical Industry Co., Ltd., toluene solution with 90% by mass of non-volatile components) • "Maleimide resin F": Maleimide resin F obtained in Synthesis Example 6.

[0259] (G) Curing Accelerator • "2P4MZ": 1-Benzyl-2-methylimidazolium (manufactured by Shikoku Chemical Industry Co., Ltd.) • "DMAP": 4-Dimethylaminopyridine (manufactured by Tokyo Chemical Co., Ltd.)

[0260] (H) Polymer Resin • "EXL2655": Core-shell graft copolymer rubber particles (manufactured by Dow Chemical Company).

[0261] <Preparation of Resin Sheets> As a support, a polyethylene terephthalate film (Toray Industries, Inc., "Lumirror R80", thickness 38 μm, softening point 130°C) was prepared and released using an alkyd resin-based release agent (Lintec Corporation, "AL-5"). Using a die coater, the resin compositions obtained in Examples 1-14 and Comparative Examples 1-2 were uniformly coated onto the support to make the thickness of the dried resin composition layer 50 μm, and dried at 70°C to 90°C for 3 minutes, thereby forming a resin composition layer on the support.

[0262] In the resin composition layer, on the surface of the resin composition layer that is not bonded to the support, a rough surface of a polypropylene film ("ALPHAN MA-411", 15 μm thick, manufactured by Oji F-Tex Co., Ltd.) serving as a protective film is laminated. Thus, a resin sheet having a support / resin composition layer / protective film in sequence is obtained.

[0263] <Experimental Example 1: Determination of Dielectric Loss Tangent Df> After peeling off the protective film from the resin sheet, the resin composition layer was thermocured by heating at 200°C for 90 minutes. The support was then peeled off to obtain the cured product. The cured product was cut into pieces 2 mm wide and 80 mm long to obtain evaluation specimens. For these specimens, the dielectric loss tangent (Df value) was measured using a measuring device (Agilent Technologies HP8362B) at a resonant cavity perturbation method at a measurement frequency of 5.8 GHz and a measurement temperature of 23°C. Measurements were performed on three specimens, and the average value was calculated. Based on this average value, the dielectric loss tangent was evaluated according to the following criteria. [Evaluation Criteria for Dielectric Loss Tangent Df] “○”: Dielectric loss tangent (Df value) is below 0.004. "×": Dielectric loss tangent (Df value) is greater than 0.004.

[0264] <Experimental Example 2: Warpage Measurement Test> Using a batch vacuum pressure laminator (Nikko-Materials' CVP700 2-process stacking laminator), a resin sheet with its protective film removed is laminated onto a single side of a 12-inch silicon wafer (775 μm thick). This lamination is performed by bonding the resin composition layer to the silicon wafer. The support of the resin sheet is peeled off, exposing the resin composition layer. On the surface of this exposed resin composition layer, another resin sheet with its protective film removed is further laminated, and the support is peeled off, forming two layers of resin composition (total thickness 100 μm) on a single side of the 12-inch silicon wafer. It should be noted that the above lamination is performed by depressurizing the pressure for 30 seconds to below 13 hPa, followed by pressing at 100°C and 0.74 MPa for 30 seconds.

[0265] Next, the silicon wafer with the resin composition layer is heated in an oven at 100°C for 30 minutes, and then further heated at 200°C for 90 minutes. Through the heating, the resin composition layer is cured to obtain a sample laminate X having a layer structure of "silicon wafer / cured layer".

[0266] The warpage of the obtained sample laminate X was measured using a Shadow Moire measuring device (Akorometrix Thermoire AXP). The measurement was performed according to JEITA EDX-7311-24 specification. Specifically, all data from the evaluation substrate surface (the side of the cured layer opposite to the silicon wafer) of the measurement area were used, and a virtual plane obtained using the least squares method was used as a reference plane. The difference between the minimum and maximum vertical heights from this reference plane to the evaluation substrate surface was calculated as the warpage. The measured warpage value was evaluated according to the following criteria. A smaller warpage indicates more effective warpage suppression. [Evaluation Criteria for Warpage] “○”: Warpage is greater than 0 μm and less than 2000 μm. “△”: Warpage is greater than 2000μm and less than 2500μm "×": Warpage is greater than 2500μm.

[0267] <Experimental Example 3: Evaluation of Stain Removal Performance> (1) Substrate treatment of inner layer circuit board The copper surface was roughened by etching 1 μm on both sides of the glass cloth substrate epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic R1515A) with inner layer circuitry formed using a micro etchant (MEC "CZ8101").

[0268] (2) Lamination of resin sheets Using a batch vacuum pressure laminator (Nikko-Materials, 2-process stacking laminator "CVP700"), resin sheets are laminated onto both sides of the inner layer substrate in a manner where the resin composition layer contacts the inner layer substrate. This lamination is performed by depressurizing for 30 seconds to adjust the pressure to below 13 hPa, followed by pressing at 100°C and 0.7 MPa for 30 seconds. Next, a hot press is performed at 100°C and 0.5 MPa for 60 seconds.

[0269] (3) Thermosetting of the resin composition layer The inner layer substrate with laminated resin sheet is placed in an oven at 130°C and heated for 30 minutes, then transferred to an oven at 170°C and heated for another 30 minutes to thermally cure the resin composition layer and form an insulating layer. The support is then peeled off to obtain a cured substrate Y1 having an insulating layer / inner layer substrate / insulating layer in sequence.

[0270] (4) Formation of through holes For the cured substrate Y1, a CO2 laser processing machine (Via Machinery Co., Ltd. "LK-2K212 / 2C") was used to perform hole drilling on the insulating layer under the conditions of 2000Hz frequency, 3μs pulse width, 0.95W output power, and 2 irradiations. Through this operation, through holes with a top diameter of 60μm on the surface of the insulating layer and a diameter of 50μm on the bottom surface of the insulating layer were formed, resulting in the circuit board Y2.

[0271] (5) Roughening treatment The insulating layer surface of circuit board Y2 was immersed in a swelling solution (Swelling Dip Securiganth P, manufactured by Amtec Japan, an aqueous solution of diethylene glycol monobutyl ether and sodium hydroxide) at 60°C for 10 minutes. Next, the insulating layer surface of the circuit board was immersed in an oxidizing agent solution (Concentrate Compact P, manufactured by Amtec Japan, an aqueous solution of approximately 6% potassium permanganate and approximately 4% sodium hydroxide) at 80°C for 15 minutes. Finally, the insulating layer surface of the circuit board was immersed in a neutralizing solution (Reduction Solution Securiganth P, manufactured by Amtec Japan, an aqueous solution of sulfuric acid) at 40°C for 5 minutes.

[0272] (6) Evaluation of stain removal performance In the roughened circuit board Y2, the area around the bottom of the via was observed using a scanning electron microscope (SEM), and the maximum contamination length from the wall surface of the bottom of the via was measured from the obtained images. The measured value of the maximum contamination length was evaluated according to the following criteria; [Evaluation Criteria for Stain Removal Performance] ○: Maximum contamination length is less than 5μm △: Maximum contamination length is 5μm or more but less than 7μm ×: The maximum contamination length is 7μm or more.

[0273] <Example 4: Determination of adhesion strength (peel strength) with conductor layer> (1) Substrate treatment of copper foil The glossy surface of an electrolytic copper foil (35 μm thick, manufactured by Mitsui Metals & Mining Co., Ltd., "3EC-III") was etched to a thickness of 1 μm using an etchant (MEC, "CZ8101") to roughen the copper surface. Next, a rust inhibitor (MEC, "CL8300") was applied to the roughened surface of the copper foil for rust prevention. The copper foil was then further heat-treated in an oven at 130°C for 30 minutes to obtain the CZ-treated copper foil.

[0274] (2) Preparation of inner layer substrate As the inner layer substrate, a glass cloth substrate epoxy resin double-sided copper-clad laminate (copper foil thickness 18μm, substrate thickness 0.4mm, Panasonic "R1515A") was prepared. The inner layer substrate was etched to 1μm on both sides using an etchant (MEC "CZ8101") to roughen the copper surface.

[0275] (3) Lamination of resin composition layers The protective film is peeled off from the resin sheet to expose the resin composition layer. Using a batch vacuum pressure laminator (Nikko-Materials, 2-process stacking laminator "CVP700"), the resin sheet is laminated onto both sides of the inner layer substrate in contact with the resin composition layer. The lamination is performed by depressurizing for 30 seconds to adjust the pressure to below 13 hPa, followed by pressing at 120°C and 0.74 MPa for 30 seconds. Next, hot pressing is performed at 100°C and 0.5 MPa for 60 seconds. Then, the support is peeled off to expose the resin composition layer.

[0276] (4) Lamination of copper foil and curing of resin composition layer On the exposed resin composition layer, the treated surface of the CZ-treated copper foil is laminated under the same conditions as described in "(3) Lamination of Resin Composition Layers" above. Then, the resin composition layer is heat-cured under curing conditions of 200°C and 90 minutes to form an insulating layer as a cured layer. Thus, an evaluation substrate Z having a layer structure of CZ-treated copper foil / insulating layer / inner substrate / insulating layer / CZ-treated copper foil is obtained.

[0277] (5) Determination of adhesion strength (peel strength) with conductor layer The evaluation substrate Z was cut into 150mm × 30mm pieces to obtain test pieces. A rectangular section, 10mm wide and 100mm long, was cut into the copper foil portion of the test piece using a cutting machine. One end of this rectangular section was peeled off, clamped with a jig (TSE, Autocom type testing machine "AC-50C-SL"). A 35mm length of the aforementioned rectangular section was peeled vertically, and the peel load (kgf / cm) was measured as the peel strength. The peeling was performed at room temperature at a speed of 50mm / min. The measured peel strength value was evaluated according to the following criteria; [Evaluation criteria for adhesion strength with conductor layer] ○: Peel strength value is 0.4 kgf / cm or higher. △: Peel strength is ≥0.35 kgf / cm and <0.4 kgf / cm ×: The peel strength value is less than 0.35 kgf / cm.

[0278] [Table 1-1] [Table 1-2] .

Claims

1. A resin composition, wherein, Include: (A) Compounds having a terminal free radical polymerizable group, a weight-average molecular weight (Mw) greater than 5,000 and less than 300,000, and a tensile modulus of elasticity of less than 1 GPa as determined by JIS K7161 at 25°C. (B) Epoxy resin, (C) Reactive ester resins, and (D) Inorganic filler materials.

2. The resin composition according to claim 1, wherein, (D) The content of component (D) is 50% or more by mass relative to 100% by mass of the non-volatile components of the resin composition.

3. The resin composition according to claim 1, wherein, (A) Component contains an imide skeleton.

4. The resin composition according to claim 1, wherein, (A) The main chain contains an imide backbone.

5. The resin composition according to claim 1, wherein, (A) The component contains a structure represented by the following formula (A-1). In equation (A-1), R A1 * indicates the tetravalent group remaining after removing the anhydride group from the tetracarboxylic dianhydride; * indicates a linking bond.

6. The resin composition according to claim 5, wherein, (A) The composition includes a structure represented by the aforementioned formula (A-1) and a structure represented by the following formula (A-3). In equation (A-3), R A3 * indicates a divalent group remaining after removing two or more hydroxyl groups from a polyol compound that has two or more hydroxyl groups in one molecule; * indicates a linking bond.

7. The resin composition according to claim 1, wherein, (A) The component contains one or more structural units selected from polyolefin structural units, polycarbonate structural units, polyether structural units, polyester structural units, poly(meth)acrylic acid structural units and polysiloxane structural units.

8. The resin composition according to claim 1, wherein, (A) The component contains polyolefin structural units.

9. The resin composition according to claim 1, wherein, (A) The content of component A is 0.1% by mass or more and 15% by mass or less relative to 100% by mass of the non-volatile components of the resin composition.

10. The resin composition according to claim 1, wherein, (B) The content of component B is more than 1% by mass and less than 20% by mass relative to 100% by mass of the non-volatile components of the resin composition.

11. The resin composition according to claim 1, wherein, (C) The content of component (C) is more than 1% by mass and less than 20% by mass relative to 100% by mass of the non-volatile components of the resin composition.

12. The resin composition according to claim 1, wherein, The mass ratio of component (A) to component (C), i.e., the content of component (A) / the content of component (C), is 0.01 or more and 1 or less.

13. The resin composition according to claim 1, wherein, Further comprising (F) compounds having radical polymerizable groups and a weight-average molecular weight (Mw) of less than 5,000.

14. The resin composition according to claim 1, wherein, It further includes (G) a curing accelerator.

15. The resin composition according to claim 1, wherein, It further includes (H) polymer resin.

16. The resin composition according to claim 1, used to form an insulating layer of a circuit board.

17. The cured product of the resin composition according to any one of claims 1 to 16.

18. A resin sheet, wherein, It comprises a support body and a resin composition layer formed on the support body. The resin composition layer comprises the resin composition according to any one of claims 1 to 16.

19. A circuit board, wherein, A cured product comprising the resin composition according to any one of claims 1 to 16.

20. A semiconductor device, wherein, It includes the circuit board as described in claim 19.

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