Halogen-free epoxy resin composition, transparent adhesive film and method for manufacturing the same

Abstract

The present application provides a kind of halogen-free epoxy resin composition, transparent adhesive film and its preparation method, the halogen-free epoxy resin composition, by solid weight parts, including the following components: halogen-free bisphenol A type epoxy resin 10~25 parts;Halogen-free hydrogenation bisphenol A type epoxy resin 10~30 parts;Halogen-free tetrahydrophthalic acid diglycidyl ester type epoxy resin 10~20 parts;Toughening agent 10~35 parts;Silicon dioxide 2~3 parts;Curing agent 1~10 parts;Curing accelerator 0.01~1 parts;Stabilizer 0.01~5 parts;Ultraviolet absorber 0.01~1 parts;Antioxidant 0.05~0.3 parts;Hindered amine stabilizer 0.2~0.8 parts.The transparent adhesive film includes the halogen-free epoxy resin composition layer prepared by the halogen-free epoxy resin composition.The transparent adhesive film of the present application has no tackiness at room temperature and will not stick to the adherend;It has excellent filling property, and the reaction can be activated at a relatively low temperature (80-120℃).After compression, the transmittance is >90%, and it also has high adhesive strength, excellent aging resistance, and can meet the use scenarios of most optical fields.