Back splatter defect monitoring method, controller, and back splatter defect monitoring apparatus

Abstract

Embodiments of the present application provide a back-splashing defect monitoring method, a controller and a back-splashing defect monitoring device. The method comprises obtaining a droplet sensing signal representing a shielding state of a splashing droplet generated by wafer rotation and generating coordinate distribution information corresponding to each splashing droplet, analyzing the droplet movement direction of each splashing droplet in combination with time sequence image information of the splashing droplet, identifying the droplets moving away from the side wall of the cavity in a preset limited area during the coating process and counting the number of the droplets, and then sending the wafer into a detection machine to confirm whether there is a droplet splashing defect when the number of the droplets reaches a preset number threshold, so as to improve the real-time performance and accuracy of back-splashing defect monitoring and improve the process monitoring efficiency.