Trisection power divider
By combining microstrip lines and isolation resistors and setting inclination angle on the PCB board, the problem of difficult isolation resistance of the odd equal power splitter is solved, and the 3D model and application of the three equal power splitter is realized. , improves frequency and intermodulation values.
CN222168667UActive Publication Date: 2024-12-13HENGERWEI TECH (SUZHOU) CO LTD
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Patent Information
- Application Number
- CN202420139113.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-19
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-01-19
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Figure CN222168667U_ABST
Abstract
The utility model discloses a trisection power divider, which comprises a microstrip line, isolation resistors and a PCB (printed circuit board), the first isolation resistor is connected with the second isolation resistor, the second isolation resistor is connected with the third isolation resistor, the third isolation resistor is connected with the first isolation resistor, the microstrip line is arranged on the PCB, and the microstrip line is arranged on the PCB. Inclined included angles are formed between the first isolation resistor, the second isolation resistor, the third isolation resistor and the PCB; a first microstrip line, a second microstrip line, a third microstrip line, a first isolation resistor, a second isolation resistor and a third isolation resistor are combined to form a trisection power divider, and inclined included angles are arranged between the first isolation resistor, the second isolation resistor and the third isolation resistor and a PCB. The effect of connecting and conducting the first isolation resistor and the second isolation resistor, connecting and conducting the second isolation resistor and the third isolation resistor, and connecting and conducting the third isolation resistor and the first isolation resistor is achieved, and therefore the trisection power divider is achieved in a 3D model and a real object.
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