Vacuum electron tubes to prevent electron sputtering

Abstract

The utility model relates to the technical field of vacuum electron tubes, specifically to a vacuum electron tube for preventing electron sputtering, comprising a base, a plurality of tube pins being arranged at the bottom of the base, a vacuum tube being arranged at the top of the base, a first mica sheet, a second mica sheet and a third mica sheet being arranged in sequence from bottom to top in the vacuum tube, a cathode rod being arranged at the middle of the top of the first mica sheet, a plurality of cathode sheets being arranged equidistantly up and down on the cathode rod, and two sputtering protection layers being arranged symmetrically front to back on the inner wall of the vacuum tube. In the vacuum electron tube for preventing electron sputtering, the cathode rod and the plurality of cathode sheets thereon are used as the emission source of electrons, and the cathode is designed to be composed of a plurality of cathode sheets, which can effectively disperse the electron flow passing through the cathode, thereby reducing the chance of forming a high-density electron flow in any given area, can effectively reduce the electron sputtering phenomenon, and further reduce the damage of the electron sputtering to the vacuum tube through the sputtering protection layer.

Description

Technical Field

[0001] The utility model relates to the technical field of vacuum electron tubes, in particular to a vacuum electron tube capable of preventing electron sputtering. Background Art

[0002] Vacuum electron tubes are key components widely used in circuits such as amplification, oscillation, and switching. During the operation of a vacuum electron tube, electrons are emitted from the cathode and accelerated toward the anode under the action of the electric field. During this process, some electrons collide with the anode material, resulting in electron sputtering. Electron sputtering can lead to several adverse consequences:

[0003] 1. Material degradation: Continuous electron sputtering will cause the surface degradation of the anode material, reduce the emission efficiency of the cathode, and thus affect the overall performance of the electron tube.

[0004] 2. Energy loss: During the electron sputtering process, part of the electron energy is converted into heat energy on the surface of the material, which increases the heat load of the device during operation and may cause overheating, further affecting its stability and life.

[0005] 3. Secondary electron emission: Electron sputtering may also cause the anode material to generate secondary electrons. These secondary electrons may flow back to the cathode, causing unstable current changes and affecting the performance of the electron tube.

[0006] At present, in order to solve the problem of electron sputtering, the methods used mainly include optimizing anode materials and improving the internal structure design of electron tubes. For example, by selecting high temperature resistant and corrosion resistant materials as anode materials, the damage caused by electron sputtering can be reduced to a certain extent. In addition, by changing the structure and layout of the electrodes in the electron tube, the electron flow path can be optimized and the direct contact with the anode can be reduced, thereby reducing the electron sputtering effect.

[0007] However, these traditional methods can only alleviate the problem to a certain extent, and cannot fundamentally prevent the electron sputtering phenomenon. In view of this, we propose a vacuum electron tube that prevents electron sputtering. Utility Model Content

[0008] The utility model aims to provide a vacuum electron tube for preventing electron sputtering, so as to solve the problems raised in the above background technology.

[0009] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0010] A vacuum electron tube for preventing electron sputtering comprises a base, wherein a plurality of pins are arranged at the bottom of the base, the base provides stable support for the entire vacuum electron tube, and the plurality of pins assembled at the bottom of the base can realize connection with a circuit board, ensure the correct installation of the electron tube and ensure smooth transmission of current, a vacuum tube is arranged at the top of the base, and the vacuum tube, as the main part of the vacuum electron tube, keeps the internal components working in a highly vacuum state, reduces the interference caused by gas molecules, and thus improves working efficiency and stability, a first mica sheet, a second mica sheet and a third mica sheet are arranged in sequence from bottom to top in the vacuum tube, the first mica sheet, the second mica sheet and the third mica sheet are used to isolate different internal components, prevent electrons from directly sputtering to parts that should not be reached, and also play a supporting role, and maintain the stability of the internal structure, four fixed vertical poles arranged in a matrix are arranged between the first mica sheet and the third mica sheet, the second mica sheet is close to the bottom of the third mica sheet, the second mica sheet is fixedly connected to the four fixed vertical poles, and the fixed vertical poles provide a stable support structure for multiple internal components, ensure that the mica sheet and other components maintain appropriate positions and spacings inside the vacuum tube, and thus optimize the path of the electron flow;

[0011] A cathode rod is provided in the middle of the top of the first mica sheet, and a plurality of cathode sheets are arranged equidistantly up and down on the cathode rod. The cathode rod and the plurality of cathode sheets thereon serve as electron emission sources, and the emission amount and emission direction of the electrons are controlled to achieve effective control of the current. The cathode is designed to be composed of a plurality of cathode sheets, and a certain distance is maintained between each cathode sheet. This design can effectively disperse the electron flow passing through the cathode, thereby reducing the chance of forming a high-density electron flow in any given area, which helps to smooth the electron flow in the entire vacuum electron tube, can effectively reduce the electron sputtering phenomenon, and balance the stress of the anode material, thereby extending the service life of the entire vacuum electron tube;

[0012] Two symmetrically arranged grid bars are provided on the top of the first mica sheet. The two grid bars are connected to a grid electrode. The grid bars and the grid electrode together constitute an important part for controlling the flow of electrons. By adjusting the potential, the number of electrons passing through can be controlled, thereby realizing precise regulation of the current.

[0013] Two anode rods are arranged symmetrically in front and back on the top of the first mica sheet, and two anode plates are connected to the two anode rods in left and right symmetrical arrangement. The anode rods and the anode plates serve as electron receiving ends, which collect electrons emitted by the cathode;

[0014] The inner wall of the vacuum tube is provided with two sputtering protection layers which are symmetrically arranged front to back, so as to further reduce the electron sputtering effect.

[0015] Preferably, a getter disk is provided on the top of the third mica sheet. The getter disk contains a substance that can absorb the internal residual gas, which can effectively reduce the gas content in the tube and help maintain a high vacuum inside the tube, thereby ensuring the normal operation of the electron tube.

[0016] Preferably, the tops of the cathode rods, the grid rods and the anode rods are all fixedly connected to the bottom of the second mica sheet, so that the positions of the cathode rods, the grid rods and the anode rods are fixed.

[0017] Preferably, two beam screens are arranged symmetrically between the two anode plates, the bottom of the beam screen is fixedly connected to the top of the first mica sheet, and the top of the beam screen is fixedly connected to the bottom of the second mica sheet. The beam screen can help focus the electron beam passing through the vacuum tube, that is, by adjusting its structure and arrangement, the beam screen can make the electron beam more concentrated, thereby improving the directionality and concentration of the electron flow. By optimizing the path of the electron beam, the direct contact between the electron and the inner wall of the vacuum tube and other non-target surfaces is reduced, thereby reducing the electron sputtering phenomenon.

[0018] Preferably, heat sinks are welded on the front and rear sides of the anode plate and located at the electron bombardment position. The heat sinks are welded to the front and rear sides of the anode plate and located at the electron bombardment position. Effective heat dissipation measures are taken to prevent heat accumulation due to electron sputtering, ensure that the anode plate operates within a reasonable temperature range, and extend its service life.

[0019] Preferably, the top of the sputtering protection layer is located above the second mica sheet, and the bottom of the sputtering protection layer is located below the first mica sheet, so as to ensure that the sputtering protection layer can effectively prevent electron sputtering.

[0020] Preferably, the sputtering protection layer includes a first thin film layer, a second thin film layer and a third thin film layer which are sequentially arranged from the inside to the outside.

[0021] Preferably, the concave surface of the first film is close to the anode plate, and the first film is made of a heavy metal material with a high electron absorption rate. The heavy metal material with a high electron absorption rate is tungsten, which absorbs most of the incoming high-speed electrons. Since the atomic nuclei of these heavy metals are relatively large, they can effectively absorb electrons.

[0022] Preferably, the second thin film layer is made of a high reflectivity material, and the high reflectivity material is aluminum, which can reflect part of the electrons and reflect part of the electrons back, thereby reducing the possibility of electron sputtering.

[0023] Preferably, the third layer of film is made of a polymer material with a buffering function. The polymer material with a buffering function is polyimide, which absorbs and buffers a small amount of electrons that are still moving at high speed through the first two layers. It can not only further absorb electrons and reduce the sputtering effect, but also weaken the thermal effect caused by the electron impact, thereby protecting the internal structure of the electron tube. The convex surface of the third layer of film is bonded to the inner wall of the vacuum tube, ensuring that the sputtering protection layer will not be displaced under high-speed electrons or high temperature conditions, and can maintain its stability in long-term operation.

[0024] Compared with the prior art, the beneficial effects of the utility model are:

[0025] 1. The vacuum electron tube that prevents electron sputtering effectively reduces the electron sputtering phenomenon by adopting a specific internal structure design, such as the separation of mica sheets, the support of fixed poles, and the electron beam focusing of the beam screen. These structures work together to reduce the direct contact between electrons and anode materials and other non-target surfaces, thereby reducing material degradation and energy loss, and improving the stability and working efficiency of the electron tube.

[0026] 2. The vacuum electron tube for preventing electron sputtering further reduces the damage of electron sputtering to the vacuum tube and maintains a high vacuum environment in the tube by providing a sputtering protection layer and a getter disk, slows down the degradation rate of the material, and prolongs the service life of the anode material and the entire vacuum electron tube.

[0027] 3. The vacuum electron tube for preventing electron sputtering, the cathode rod and the multiple cathode plates thereon serve as the electron emission source, and the effective control of the current is achieved by controlling the electron emission amount and emission direction. The cathode design adopts multiple cathode plates, and a certain distance is maintained between each cathode plate. This design can effectively disperse the electron flow through the cathode, thereby reducing the chance of forming a high-density electron flow in any given area, which helps to smooth the electron flow in the entire vacuum electron tube, can effectively reduce the electron sputtering phenomenon, and balance the stress of the anode material, thereby extending the service life of the entire vacuum electron tube.

[0028] 4. The overall design of the vacuum electron tube that prevents electron sputtering takes into account many factors such as slowing down electron sputtering, improving electron beam focusing, and optimizing electron flow paths, which not only reduces the adverse effects inside the device, but also improves the performance of the device. As a result, the vacuum electron tube has higher working efficiency, more stable operating performance and longer service life, meeting the increasingly stringent requirements of modern circuits for vacuum electron tubes. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0030] Figure 2It is a schematic diagram of the overall cross-sectional structure of the utility model;

[0031] Figure 3 For this utility model Figure 2 A schematic diagram of the structure enlargement at the center A;

[0032] Figure 4 It is one of the partial structural schematic diagrams of the utility model;

[0033] Figure 5 This is the second schematic diagram of the partial structure of the utility model;

[0034] Figure 6 This is the third schematic diagram of the partial structure of the utility model;

[0035] Figure 7 This is the fourth partial structural schematic diagram of the utility model.

[0036] In the figure: 1. base; 2. tube pin; 3. vacuum tube; 4. first mica sheet; 5. second mica sheet; 6. third mica sheet; 7. sputtering protection layer; 70. first film layer; 71. second film layer; 72. third film layer; 8. fixed vertical rod; 9. getter disk; 10. cathode rod; 11. cathode sheet; 12. grid rod; 13. grid; 14. beam screen; 15. anode rod; 16. anode plate; 17. heat sink. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0038] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0039] See also Figure 1-Figure 7 , the utility model provides a technical solution:

[0040] A vacuum electron tube for preventing electron sputtering comprises a base 1. A plurality of pins 2 are arranged at the bottom of the base 1. The base 1 provides stable support for the entire vacuum electron tube, and can be connected to a circuit board through the plurality of pins 2 assembled at the bottom thereof, so as to ensure that the electron tube is correctly installed and that the current is smoothly transmitted. A vacuum tube 3 is arranged at the top of the base 1. The vacuum tube 3, as the main part of the vacuum electron tube, keeps the internal components working in a highly vacuum state, reduces the interference caused by gas molecules, and thus improves the working efficiency and stability. A first mica sheet 4, a second mica sheet 5 and a third mica sheet are arranged in sequence from bottom to top in the vacuum tube 3. The mother sheet 6, the first mica sheet 4, the second mica sheet 5 and the third mica sheet 6 are used to isolate different internal components to prevent electrons from directly sputtering to parts that should not be reached. They also play a supporting role to maintain the stability of the internal structure. Four fixed vertical rods 8 arranged in a matrix are provided between the first mica sheet 4 and the third mica sheet 6. The second mica sheet 5 is close to the bottom of the third mica sheet 6. The second mica sheet 5 is fixedly connected to the four fixed vertical rods 8. The fixed vertical rods 8 provide a stable support structure for multiple internal components, ensuring that the mica sheets and other components maintain appropriate positions and spacings inside the vacuum tube, thereby optimizing the path of the electron flow;

[0041] A cathode rod 10 is provided in the middle of the top of the first mica sheet 4. A plurality of cathode sheets 11 are arranged equidistantly up and down on the cathode rod 10. The cathode rod 10 and the plurality of cathode sheets 11 thereon serve as electron emission sources. The emission amount and emission direction of electrons are controlled to achieve effective control of the current. The cathode is designed to be composed of a plurality of cathode sheets 11. A certain distance is maintained between each cathode sheet 11. This design can effectively disperse the electron flow passing through the cathode, thereby reducing the chance of forming a high-density electron flow in any given area. This helps to smooth the electron flow in the entire vacuum electron tube, effectively reduce the electron sputtering phenomenon, and balance the stress on the anode material, thereby extending the service life of the entire vacuum electron tube.

[0042] Two symmetrically arranged grid bars 12 are provided on the top of the first mica sheet 4. The two grid bars 12 are connected to a grid 13. The grid bars 12 and the grid 13 together constitute an important part for controlling the flow of electrons. By adjusting their potential, the number of electrons passing through can be controlled, thereby achieving precise regulation of the current.

[0043] Two anode rods 15 are arranged symmetrically in front and back on the top of the first mica sheet 4, and two anode plates 16 are connected to the two anode rods 15 in left and right symmetrical arrangement. The anode rods 15 and the anode plates 16 serve as electron receiving ends, which collect electrons emitted by the cathode.

[0044] The inner wall of the vacuum tube 3 is provided with two sputtering protection layers 7 which are symmetrically arranged front to back, in order to further reduce the electron sputtering effect.

[0045] In this embodiment, a getter disk 9 is provided on the top of the third mica sheet 6. The getter disk 9 contains a substance that can absorb the internal residual gas, which can effectively reduce the gas content in the tube and help maintain a high vacuum inside the tube, thereby ensuring the normal operation of the electron tube.

[0046] Specifically, the tops of the cathode rod 10 , the grid rod 12 and the anode rod 15 are fixedly connected to the bottom of the second mica sheet 5 , so that the positions of the cathode rod 10 , the grid rod 12 and the anode rod 15 are fixed.

[0047] Furthermore, two beam screens 14 are provided between the two anode plates 16 and are arranged symmetrically. The bottom of the beam screen 14 is fixedly connected to the top of the first mica sheet 4, and the top of the beam screen 14 is fixedly connected to the bottom of the second mica sheet 5. The beam screen 14 can help focus the electron beam passing through the vacuum tube 3, that is, by adjusting its structure and arrangement, the beam screen 14 can make the electron beam more concentrated, thereby improving the directionality and concentration of the electron flow. By optimizing the path of the electron beam, the direct contact between the electron and the inner wall of the vacuum tube 3 and other non-target surfaces is reduced, thereby reducing the electron sputtering phenomenon.

[0048] Furthermore, heat sinks 17 are welded on the front and rear sides of the anode plate 16 and at the position where electrons bombard. The heat sinks 17 are welded to the front and rear sides of the anode plate 16 and are located at the position where electrons bombard. Effective heat dissipation measures are taken to prevent heat accumulation due to electron sputtering, ensure that the anode plate 16 operates within a reasonable temperature range, and extend its service life.

[0049] Furthermore, the top of the sputtering protection layer 7 is located above the second mica sheet 5, and the bottom of the sputtering protection layer 7 is located below the first mica sheet 4, ensuring that the sputtering protection layer 7 can effectively prevent electron sputtering.

[0050] Furthermore, the sputtering protection layer 7 includes a first film layer 70 , a second film layer 71 and a third film layer 72 which are sequentially arranged from the inside to the outside.

[0051] Furthermore, the concave surface of the first film 70 is close to the anode plate 16. The first film 70 is made of a heavy metal material with a high electron absorption rate. The heavy metal material with a high electron absorption rate uses tungsten, which absorbs most of the incoming high-speed electrons. Since the atomic nuclei of these heavy metals are relatively large, they can effectively absorb electrons.

[0052] Furthermore, the second thin film 71 is made of a high reflectivity material, and the high reflectivity material is aluminum, which can reflect part of the electrons and reflect part of the electrons back, thereby reducing the possibility of electron sputtering.

[0053] Furthermore, the third film 72 is made of a polymer material with a buffering function. The polymer material with a buffering function adopts polyimide, which absorbs and buffers a small amount of electrons that are still moving at high speed through the first two layers. It can not only further absorb electrons and reduce the sputtering effect, but also weaken the thermal effect caused by the impact of electrons, thereby protecting the internal structure of the electron tube. The convex surface of the third film 72 is bonded to the inner wall of the vacuum tube 3, ensuring that the sputtering protection layer 7 will not be displaced under high-speed electrons or high temperature conditions, and can maintain its stability in long-term operation.

[0054] When the vacuum electron tube for preventing electron sputtering of the present embodiment is in use, the cathode rod 10 and the multiple cathode sheets 11 thereon serve as the electron emission source, and the emission amount and emission direction of the electrons are controlled to achieve effective control of the current. The cathode design is composed of multiple cathode sheets 11, which can effectively disperse the electron flow passing through the cathode, thereby reducing the chance of forming a high-density electron flow in any given area, which helps to smooth the electron flow in the entire vacuum electron tube and can effectively reduce the electron sputtering phenomenon. Under the action of the grid 13 and the two beam screens 14, the electron beam can be more concentrated, thereby improving the directionality and concentration of the electron flow and reducing the electron flow. The electrons are in direct contact with the inner wall of the vacuum tube 3 and other non-target surfaces, thereby reducing the electron sputtering phenomenon. When some electrons collide with the sputtering protection layer 7, the first film 70 can effectively absorb the electrons, and the second film 71 can reflect some of the electrons passing through the first film 70, and can reflect some of the electrons back, thereby reducing the possibility of electron sputtering. The third film 72 absorbs and buffers a small amount of electrons that still move at high speed through the first two layers, which can not only further absorb electrons and reduce the sputtering effect, but also weaken the thermal effect caused by the electron impact, thereby protecting the internal structure of the electron tube, thereby extending the service life of the vacuum electron tube.

[0055] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A vacuum electron tube for preventing electron sputtering, comprising a base (1), a plurality of pins (2) being provided at the bottom of the base (1), and a vacuum tube (3) being provided at the top of the base (1), characterized in that: The vacuum tube (3) is provided with a first mica sheet (4), a second mica sheet (5) and a third mica sheet (6) in sequence from bottom to top; four fixed vertical rods (8) arranged in a matrix are provided between the first mica sheet (4) and the third mica sheet (6); the second mica sheet (5) is close to the bottom of the third mica sheet (6); the second mica sheet (5) is fixedly connected to the four fixed vertical rods (8); a cathode rod (10) is provided in the middle of the top of the first mica sheet (4); a plurality of cathode sheets (11) are arranged equidistantly up and down on the cathode rod (10); two grid rods (12) are symmetrically arranged on the top of the first mica sheet (4); the two grid rods (12) are connected to a grid (13); two anode rods (15) are symmetrically arranged in front and back on the top of the first mica sheet (4); two anode plates (16) are connected to the two anode rods (15); and two sputtering protection layers (7) are symmetrically arranged in front and back on the inner wall of the vacuum tube (3).

2. The vacuum electron tube for preventing electron sputtering according to claim 1, characterized in that: A getter disk (9) is provided on the top of the third mica sheet (6).

3. The vacuum electron tube for preventing electron sputtering according to claim 1, characterized in that: The tops of the cathode rod (10), the grid rod (12) and the anode rod (15) are all fixedly connected to the bottom of the second mica sheet (5).

4. The vacuum electron tube for preventing electron sputtering according to claim 1, characterized in that: Two beam screens (14) are provided between the two anode plates (16) and are arranged symmetrically on the left and right. The bottom of the beam screen (14) is fixedly connected to the top of the first mica sheet (4), and the top of the beam screen (14) is fixedly connected to the bottom of the second mica sheet (5).

5. The vacuum electron tube for preventing electron sputtering according to claim 1, characterized in that: Heat sinks (17) are welded to the front and rear sides of the anode plate (16) at the positions where electrons bombard.

6. The vacuum electron tube for preventing electron sputtering according to claim 1, characterized in that: The top of the sputtering protection layer (7) is located above the second mica sheet (5), and the bottom of the sputtering protection layer (7) is located below the first mica sheet (4).

7. The vacuum electron tube for preventing electron sputtering according to claim 1, characterized in that: The sputtering protection layer (7) comprises a first film layer (70), a second film layer (71) and a third film layer (72) which are arranged in sequence from the inside to the outside.

8. The vacuum electron tube for preventing electron sputtering according to claim 7, characterized in that: The concave surface of the first film (70) is close to the anode plate (16), and the first film (70) is made of a heavy metal material with a high electron absorption rate, and the heavy metal material with a high electron absorption rate is tungsten.

9. The vacuum electron tube for preventing electron sputtering according to claim 7, characterized in that: The second thin film (71) is made of a high reflectivity material, and the high reflectivity material is aluminum.

10. The vacuum electron tube for preventing electron sputtering according to claim 7, characterized in that: The third layer of film (72) is made of a polymer material with a buffering function, wherein the polymer material with a buffering function is polyimide, and the convex surface of the third layer of film (72) is bonded to the inner wall of the vacuum tube (3).

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