Heat dissipation device for stage moving head lamp
By adopting a tapered air intake and a tapered air exhaust design in the stage moving head light, combined with bidirectional air-cooling components and modular heat sinks, the problem of low heat dissipation efficiency is solved, achieving efficient and quiet heat dissipation, and supporting independent heat dissipation paths for multiple light sources.
Patent Information
- Application Number
- CN202520765874.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-21
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-04-21
AI Technical Summary
In existing stage moving head light heat dissipation solutions, there is a lateral gap between the traditional fan and the heat sink, resulting in airflow loss, low heat dissipation efficiency, and an inability to effectively cope with the heat accumulation of high-power light sources.
The design incorporates a tapered air intake section and a tapered air outlet section, combined with a bidirectional air-cooling component and a modular heat sink to optimize airflow distribution, enhance heat dissipation efficiency, and ensure airtightness through sealing strips to reduce lateral airflow loss.
It improves heat dissipation efficiency, prevents light sources from overheating, ensures stable equipment operation, meets the quiet requirements of stage equipment, supports independent heat dissipation paths for multiple light sources, and achieves balanced heat transfer and rapid heat dissipation.
Smart Images
Figure CN223939400U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of stage lighting technology, and more particularly to a heat dissipation device for a stage moving head light. Background Technology
[0002] Moving head lights, as professional stage equipment, typically employ high-power light sources to provide a variety of lighting effects. However, high-power light sources generate a significant amount of heat. If this heat cannot be dissipated in time, it will lead to decreased light source efficiency, thermal corrosion of electronic components, and even burnout. Current technologies often rely on single-channel air cooling or heat pipe cooling systems. Traditional fan-heat sinks have lateral gaps between them, resulting in some airflow loss and low cooling efficiency. Utility Model Content
[0003] To overcome the problems existing in related technologies, this application provides a heat dissipation device for stage moving head lights. By gradually reducing the size of the air inlet port of the air inlet guide and gradually expanding the size of the air outlet port of the air outlet guide, the air volume is concentrated and the airflow distribution is optimized, thus solving the problem of low heat dissipation efficiency caused by lateral airflow loss in traditional solutions.
[0004] This application provides a heat dissipation device for a stage moving head light, comprising:
[0005] A heat sink with two ends for attaching to a light source, the heat sink having several gaps forming a heat dissipation duct, and air-cooling components provided on both the air inlet and air outlet sides of the heat dissipation duct.
[0006] An airflow guiding structure is located between the heat dissipation duct and the air-cooling component. The airflow guiding structure includes an inlet airflow guide and an outlet airflow guide. The two ends of the inlet airflow guide respectively surround the circumferential edge of the inlet side and the air-cooling component. The inlet airflow guide has an inlet air duct, and the size of the inlet port of the inlet air duct is larger than the size of the outlet port of the inlet air duct. The two ends of the outlet airflow guide respectively surround the circumferential edge of the outlet side and the air-cooling component. The outlet airflow guide has an outlet air duct, and the size of the inlet port of the outlet air duct is smaller than the size of the outlet port of the outlet air duct.
[0007] In the implementation of this application, by designing a gradually narrowing air duct in the air inlet guide and a gradually expanding air duct in the air outlet guide, the airflow is concentrated and the air volume distribution is optimized, reducing lateral airflow loss and improving overall heat dissipation efficiency. The synergistic effect of the bidirectional air-cooling component and the heat dissipation air duct enables rapid heat transfer from the light source bonding end to the fin heat dissipation module, shortening the heat dissipation response time.
[0008] In some embodiments, the cross-sectional shape of the air inlet duct in a first direction is trapezoidal, and the first direction is the airflow direction of the air-cooled component. The trapezoidal cross-section design of the air inlet duct can reduce turbulence resistance, reduce air pressure loss, and further improve airflow utilization efficiency.
[0009] In some embodiments, the air guide structure is sealed to the radiator and air-cooling components via a sealing strip. That is, in the implementation of this application, the sealing strip ensures the airtightness of the air duct system, thereby eliminating lateral air leakage and improving the airflow utilization rate of the air-cooling components.
[0010] In some embodiments, the air-cooled assembly includes a silent centrifugal fan, the outer periphery of which is wrapped with a sound-absorbing cotton layer. The silent centrifugal fan, combined with the sound-absorbing cotton layer, effectively controls operating noise and meets the stringent requirements of stage equipment for silent performance.
[0011] In some embodiments, the heat sink includes a finned heat dissipation module, a first copper base plate, a second copper base plate, a first heat pipe module, and a second heat pipe module;
[0012] The first copper base plate and the second copper base plate are respectively located at both ends of the fin heat dissipation module;
[0013] The evaporation end of the first heat pipe module is located between the first copper base plate and the fin heat dissipation module;
[0014] The evaporation end of the second heat pipe module is located between the second copper base plate and the fin heat dissipation module;
[0015] The condenser ends of the first heat pipe module and the second heat pipe module are fitted with finned heat dissipation modules.
[0016] The first copper base plate, the second copper base plate, and the finned heat dissipation module form the heat dissipation airflow channel.
[0017] In some embodiments, the heat sink further includes a third copper base plate, a fourth copper base plate, a third heat pipe module, and a straight heat pipe module;
[0018] The third copper base plate is attached to the first copper base plate, and the fourth copper base plate is attached to the second copper base plate;
[0019] The evaporation end of the third heat pipe module is located between the third copper base plate and the first copper base plate. The condensation end of the third heat pipe module is provided with a finned heat dissipation module. The condensation end of the third heat pipe module is located between the condensation end and the evaporation end of the second heat pipe module.
[0020] The linear heat pipe module is located between the fourth copper base plate and the second copper base plate;
[0021] The third copper base plate is used to bond the white light source;
[0022] The fourth copper base plate is used to attach the colored light source.
[0023] In the implementation of this application, the modular heat sink design can support independent heat dissipation paths for dual light sources, thereby improving heat dissipation uniformity.
[0024] In some embodiments, the finned heat dissipation module includes a plurality of heat dissipation fins arranged side by side and spaced apart, the heat dissipation fins being made of aluminum or copper sheets.
[0025] In some embodiments, a heat-conducting layer is also provided at the joint of the first copper base plate, the second copper base plate and the third copper base plate.
[0026] In some embodiments, the thermally conductive layer is thermally conductive silicone, which can reduce contact thermal resistance and improve the heat transfer efficiency between modules.
[0027] In some embodiments, the first heat pipe module, the second heat pipe module, and the third heat pipe module all include multiple annular heat pipes arranged side by side. Each annular heat pipe includes two symmetrically arranged U-shaped copper tubes. A vacuum chamber is provided inside each U-shaped copper tube. The vacuum chamber contains a liquid working fluid and a discretely distributed, strip-shaped capillary structure. The capillary structure is used to guide the liquid working fluid.
[0028] The technical solution provided in this application may include the following beneficial effects:
[0029] When this utility model's technical solution is applied to a stage moving head light, two different lighting effects can be switched by using light sources attached to both ends of the heat sink. The gaps between the heat sinks form a heat dissipation channel, which, combined with the bidirectional air cooling function of the air-cooling component, accelerates the transfer of heat from the light source's attachment end to the finned heat dissipation module, effectively preventing overheating damage to the high-power light source. Furthermore, the air inlet and outlet guide sections surround the circumferential edges of the air inlet and outlet sides, respectively. The air inlet port of the air inlet guide section gradually decreases in size, while the air outlet port of the air outlet guide section gradually increases in size, which concentrates airflow and reduces lateral airflow loss. Attached Figure Description
[0030] The above and other objects, features and advantages of this application will become more apparent from the more detailed description of exemplary embodiments thereof in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments thereof.
[0031] Figure 1 This is a schematic diagram of the structure of a heat dissipation device for a stage moving head light, as shown in an embodiment of this application;
[0032] Figure 2 This is a schematic diagram of the structure of the air inlet guide section shown in the embodiment of this application;
[0033] Figure 3 This is a schematic diagram of the structure of the air outlet guide section shown in the embodiment of this application;
[0034] Figure 4 This is an exploded schematic diagram of a heat dissipation device for a stage moving head light, as shown in an embodiment of this application.
[0035] Figure label:
[0036] 1. Heat sink; 10. Fin heat dissipation module; 11. First copper base plate; 12. Second copper base plate; 13. First heat pipe module; 14. Second heat pipe module; 15. Third copper base plate; 16. Fourth copper base plate; 17. Third heat pipe module; 18. Linear heat pipe module; 2. Air cooling assembly; 3. Air guide structure; 31. Inlet air guide section; 32. Outlet air guide section; 4. Light source. Detailed Implementation
[0037] Preferred embodiments of the present application will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.
[0038] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.
[0039] It should be understood that although the terms "first," "second," "third," etc., may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0040] This embodiment provides a heat dissipation device suitable for stage moving head lights. Through the synergistic effect of multi-stage heat conduction and optimized airflow distribution, it achieves efficient heat dissipation of the high-power light source 4.
[0041] The technical solutions of the embodiments of this application are described in detail below with reference to the accompanying drawings.
[0042] Please see Figures 1 to 4The heat dissipation device provided in Embodiment 1 of this application includes a heat sink 1, an air-cooling component 2 and an air guiding structure 3. The heat sink 1 adopts a modular design and is composed of a fin heat dissipation module 10, a first copper base plate 11, a second copper base plate 12, a third copper base plate 15, a fourth copper base plate 16, a first heat pipe module 13, a second heat pipe module 14, a third heat pipe module 17 and a straight heat pipe module 18.
[0043] The finned heat dissipation module 10 has a cuboid structure with a top surface, a bottom surface, and four sides. The top and bottom surfaces are used to attach the first copper base plate 11 and the second copper base plate 12, respectively. The two light sources 4 are located on the top and bottom surfaces of the heat sink 1, respectively. The finned heat dissipation module 10 consists of several parallel and spaced heat dissipation fins made of copper or aluminum. The spacing between the heat dissipation fins is 2-4 mm, and the thickness is 0.8 mm. The first copper base plate 11 and the second copper base plate 12 form gaps with the heat dissipation fins. These gaps form airflow channels for heat dissipation. The air inlet and outlet sides of the airflow channels are located on two opposite sides of the finned heat dissipation module 10, respectively. The third copper base plate 15 and the fourth copper base plate 16 are fastened to the first copper base plate 11 and the second copper base plate 12 by bolts. Thermally conductive silicone is filled between the layers. The thickness of the thermally conductive silicone is 0.25 mm, and the thermal conductivity is greater than 1 W / m·K, to eliminate assembly gaps and reduce contact thermal resistance.
[0044] The first heat pipe module 13, the second heat pipe module 14, and the third heat pipe module 17 are all composed of multiple annular heat pipes arranged in parallel. Each annular heat pipe is composed of symmetrically arranged U-shaped copper tubes. The U-shaped copper tubes have a vacuum chamber inside, which is filled with a liquid working fluid, such as alcohol or acetone. The liquid working fluid is sintered in the vacuum chamber by powder sintering to form a strip-shaped capillary structure. The porosity of the capillary structure is 65%, and the pore size is 50-100 μm. The straight heat pipe module 18 is composed of multiple straight heat pipes. Its internal structure is the same as that of the U-shaped copper tubes. The cross-section of both the U-shaped copper tubes and the straight copper tubes is circular.
[0045] The first copper base plate 11, the second copper base plate 12, the third copper base plate 15, and the fourth copper base plate 16 are all provided with several semi-cylindrical grooves. The evaporation end of the first heat pipe module 13 is embedded between the first copper base plate 11 and the finned heat dissipation module 10, and the condensation end passes through the finned heat dissipation module 10; the evaporation end of the second heat pipe module 14 is embedded between the second copper base plate 12 and the finned heat dissipation module 10, and its condensation end passes through the finned heat dissipation module 10; the evaporation end of the third heat pipe module 17 is embedded between the third copper base plate 15 and the first copper base plate 11, and its condensation end passes through the finned heat dissipation module 10 and is staggered with the condensation end of the second heat pipe module 14; the straight heat pipe module 18 is embedded between the fourth copper base plate 16 and the second copper base plate 12. The straight heat pipe module 18 forms a horizontal heat dissipation path, which is used to perform heat homogenization treatment for the color LED light source 4, converting the high heat flux density heat into a low heat flux density heat before transferring it to the second copper base plate 12, thereby improving the heat transfer efficiency of the second copper base plate 12 to the second heat pipe module 14.
[0046] The moving head light's light source 4 can be divided into a colored LED light source 4 and a white LED light source 4. When the luminous efficacy of the colored LED light source 4 is matched with that of the white LED light source 4, the power of the colored LED light source 4 is generally 800W, while the power of the white LED light source 4 is 1000W. The colored LED light source 4 is attached to the fourth copper base plate 16. When the colored LED light source 4 is working, the linear heat pipe module 18 evenly distributes the high heat flux density to the second copper base plate 12, and then conducts it to the fin heat dissipation module 10 through the second heat pipe module 14, where it is forcibly cooled by the air-cooling component 2. The white LED light source 4 is attached to the third copper base plate 15. When the white light source 4 is working, most of the heat is transferred to the third heat pipe module 17 through the third copper base plate 15, and a small portion of the heat is transferred to the first heat pipe module 13 through the first copper base plate 11. After the liquid working fluid inside the first heat pipe module 13 and the third heat pipe module 17 vaporizes, the heat is rapidly diffused through the staggered condensation ends. The hierarchical design of the first heat pipe module 13 and the third heat pipe module 17 utilizes the first heat pipe module 13 to transfer heat with high heat flux density and the third heat pipe module 17 to transfer heat with low heat flux density. Furthermore, the distance between the condensation end of the first heat pipe module 13 and the white LED light source is greater than that of the condensation end of the third heat pipe module 17. With this setting, the space of the fin heat dissipation module 10 can be fully utilized to achieve balanced heat transfer and dissipation.
[0047] The air-cooling components 2 are respectively located on the inlet and outlet sides of the heat dissipation duct. The air-cooling components 2 use silent centrifugal fans. To reduce the noise level of the air-cooling components 2, the outer periphery of the silent centrifugal fans can also be wrapped with a layer of sound-absorbing cotton. The number of silent centrifugal fans located on the inlet and outlet sides of the heat dissipation duct can be selected according to the size of the heat sink 1 to ensure that the silent centrifugal fans can cover both sides of the heat sink 1.
[0048] The air guide structure 3 is located between the air-cooled component 2 and the radiator 1. The air guide structure 3, the radiator 1, and the air-cooled component 2 are connected by a rubber seal to ensure the airtightness of the air duct system. The air guide structure 3 is used to reduce wind loss and increase the airflow speed. The air guide structure 3 includes an inlet guide section 31 and an outlet guide section 32. The inlet guide section 31 is provided between the air inlet side of the radiator 1 and the air-cooled component 2, and the outlet guide section 32 is provided between the air outlet side of the radiator 1 and the air-cooled component 2. The two ends of the inlet guide section 31 respectively surround the circumferential edge of the air inlet side and the circumferential edge of the air-cooled component 2. The size of the air inlet port of the air inlet duct of the air inlet guide section 31 is larger than the size of the air outlet port, that is, the air inlet duct has a gradually narrowing trapezoidal cross-section structure to concentrate the airflow and reduce lateral loss. The two ends of the air outlet guide section 32 respectively surround the circumferential edge of the air outlet side and the air-cooling component 2. The air inlet size of the internal air outlet duct is smaller than the air outlet size, that is, the air outlet duct has a gradually expanding trapezoidal cross section to accelerate the discharge of hot air and reduce backflow. Based on the above specific implementation, the air guide structure 3 is sealed to the radiator 1 and the air-cooling component 2 through rubber strips, which can completely eliminate the problem of lateral air leakage and ensure that the air outlet of the air-cooling component 2 can be fully utilized.
[0049] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.
Claims
1. A heat dissipation device for a stage moving head light, characterized in that, include: Heat sink (1) with its two ends for attaching to light source (4), the heat sink (1) has several gaps, the gaps form heat dissipation air ducts, and the air inlet side and outlet side of the heat dissipation air duct are provided with air cooling components (2). The air guide structure (3) is located between the heat dissipation duct and the air-cooling component (2). The air guide structure (3) includes an air inlet guide section (31) and an air outlet guide section (32). The two ends of the air inlet guide section (31) respectively surround the circumferential edge of the air inlet side and the air-cooling component (2). The air inlet guide section (31) has an air inlet duct. The size of the air inlet port of the air inlet duct is larger than the size of the air outlet port of the air inlet duct. The two ends of the air outlet guide section (32) respectively surround the circumferential edge of the air outlet side and the air-cooling component (2). The air outlet guide section (32) has an air outlet duct. The size of the air inlet port of the air outlet duct is smaller than the size of the air outlet port of the air outlet duct.
2. The heat dissipation device for a stage moving head light according to claim 1, characterized in that, The cross-sectional shape of the air inlet duct in the first direction is trapezoidal, and the first direction is the blowing direction of the air-cooled component (2).
3. The heat dissipation device for a stage moving head light according to claim 2, characterized in that, The air guide structure (3) is sealed to the radiator (1) and the air-cooling assembly (2) by a sealing strip.
4. The heat dissipation device for a stage moving head light according to claim 3, characterized in that, The air-cooled assembly (2) includes a silent centrifugal fan, the outer periphery of which is wrapped with a sound-absorbing cotton layer.
5. The heat dissipation device for a stage moving head light according to claim 1, characterized in that, The radiator (1) includes a finned heat dissipation module (10), a first copper base plate (11), a second copper base plate (12), a first heat pipe module (13), and a second heat pipe module (14); The first copper base plate (11) and the second copper base plate (12) are respectively disposed at both ends of the fin heat dissipation module (10); The evaporation end of the first heat pipe module (13) is located between the first copper base plate (11) and the fin heat dissipation module (10); The evaporation end of the second heat pipe module (14) is located between the second copper base plate (12) and the fin heat dissipation module (10); The condensation ends of the first heat pipe module (13) and the second heat pipe module (14) are provided with fin heat dissipation modules (10); The first copper base plate (11), the second copper base plate (12), and the fin heat dissipation module (10) form the heat dissipation air duct.
6. The heat dissipation device for a stage moving head light according to claim 5, characterized in that, The radiator (1) also includes a third copper base plate (15), a fourth copper base plate (16), a third heat pipe module (17), and a straight heat pipe module (18); The third copper base plate (15) is attached to the first copper base plate (11), and the fourth copper base plate (16) is attached to the second copper base plate (12); The evaporation end of the third heat pipe module (17) is located between the third copper base plate (15) and the first copper base plate (11). The condensation end of the third heat pipe module (17) is connected to the fin heat dissipation module (10). The condensation end of the third heat pipe module (17) is located between the condensation end and the evaporation end of the second heat pipe module (14). The linear heat pipe module (18) is located between the fourth copper base plate (16) and the second copper base plate (12); The third copper base plate (15) is used to bond the white light source (4); The fourth copper base plate (16) is used to attach the colored light source (4).
7. The heat dissipation device for a stage moving head light according to claim 6, characterized in that, The finned heat dissipation module (10) includes several heat dissipation fins arranged side by side and spaced apart, the heat dissipation fins being made of aluminum or copper sheets.
8. The heat dissipation device for a stage moving head light according to claim 7, characterized in that, A heat-conducting layer is also provided at the joint of the first copper base plate (11), the second copper base plate (12) and the third copper base plate (15).
9. The heat dissipation device for a stage moving head light according to claim 8, characterized in that, The thermally conductive layer is thermally conductive silicone.
10. The heat dissipation device for a stage moving head light according to claim 6, characterized in that, The first heat pipe module (13), the second heat pipe module (14) and the third heat pipe module (17) each include multiple annular heat pipes arranged side by side. Each annular heat pipe includes two symmetrically arranged U-shaped copper tubes. A vacuum chamber is provided inside the U-shaped copper tubes. The vacuum chamber contains a liquid working fluid and a discretely distributed, strip-shaped capillary structure. The capillary structure is used to guide the liquid working fluid.