Display panel and display equipment

Abstract

The utility model relates to the technical field of display, in particular to a display panel and a display device.The display panel comprises a display area, a back film layer, a packaging area and a wiring area, the packaging area is located on the first side of the back film layer, the wiring area is located on the second side of the back film layer, and the packaging area and the wiring area are connected through a flexible bendable area; or, the packaging area is bent from the first side of the back film layer to the second side of the back film layer, the wiring area is located on the second side of the back film layer, the packaging area and the wiring area are connected through a flexible bendable area, and the display panel can achieve an ultra-narrow frame.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display panel and display device. Background Technology

[0002] With the development of terminal technology, the industry has seen the emergence of many mobile terminals such as smartphones, tablets, and personal digital assistants. These mobile terminals typically have bezels on their screens, which can negatively impact their appearance. The industry strives for ultra-narrow bezel designs to increase the screen-to-body ratio. However, limitations in screen packaging technology and overall device architecture have led to bottlenecks in reducing the bezels of mobile terminal screens.

[0003] Therefore, how to achieve extremely narrow bezels is a problem that needs to be addressed. Summary of the Invention

[0004] This application provides a display panel that can achieve an extremely narrow bezel.

[0005] In a first aspect, embodiments of this application provide a display panel, which includes a display area, a back film layer, an encapsulation area, and a wiring area. The encapsulation area is located on a first side of the back film layer, and the wiring area is located on a second side of the back film layer. The encapsulation area and the wiring area are connected by a flexible bendable area. Alternatively, the encapsulation area bends from the first side of the back film layer to the second side of the back film layer, the wiring area is located on the second side of the back film layer, and the encapsulation area and the wiring area are connected by a flexible bendable area.

[0006] The display panel provided in this application embodiment connects the packaging area and the wiring area by designing a flexible and bendable area between the packaging area and the wiring area. The wiring area is bent to the back of the display area using the flexible and bendable area. The packaging area can be located in the display area or a part of the packaging area can be bent to the back of the display area, which can significantly narrow the bezel.

[0007] In some possible implementations, the inorganic material filling the panel layer can be removed and replaced with organic material between the encapsulation area and the wiring area, thereby increasing the flexible transition area. This allows for extremely small radius bending of the frame, ultimately reducing the size of the top / left / right bezel of the phone.

[0008] By bending the encapsulation area and placing the wiring area on the second side of the back film layer, the top, left, and right bezels of the display panel can be reduced by 0.5-0.7mm. That is, from the original 0.6-0.8mm width of the top, left, and right bezels, a reduction of 0.5-0.7mm is achieved, ultimately resulting in a width of 0.1mm for the top, left, and right bezels of the display panel.

[0009] In another possible implementation, the inorganic material of the panel layer is removed and replaced with organic material between the encapsulation area and the wiring area to create a flexible wiring transition area. This flexible wiring transition area can achieve a very small bending radius of the frame. Since the encapsulation area contains inorganic layers such as SiO, it is prone to breakage when bent. Therefore, in this embodiment, the encapsulation area can be left unbent, and only the flexible wiring transition area can be bent, ultimately reducing the size of the top / left / right frame of the phone.

[0010] By bending the encapsulation area and placing the wiring area on the second side of the back film layer, the top, left, and right bezels of the display panel can be reduced by 0.3-0.5mm. That is, from the original 0.6-0.8mm width of the top, left, and right bezels, a reduction of 0.3-0.5mm is achieved, ultimately resulting in a width of 0.3mm for the top, left, and right bezels of the display panel.

[0011] In conjunction with the first aspect, in the first possible implementation of the first aspect, the flexible bendable area is filled with organic matter.

[0012] It should be noted that the embodiments of this application do not specifically limit the types of organic materials filled in the flexible and bendable area.

[0013] In this implementation, organic material is filled between the encapsulation area and the wiring area to achieve a flexible transition between them. This flexible transition area allows for minimal bending of the bezel, which is beneficial for achieving a narrow bezel. Furthermore, the flexible transition separates the encapsulation area and the wiring area, bending the wiring area to the back of the display screen without using other connectors to fix the wiring area. This achieves a narrow bezel without increasing the thickness of the display panel.

[0014] In conjunction with the first possible implementation of the first aspect, in the second possible implementation of the first aspect, the flexible bendable region is a strip structure.

[0015] Alternatively, the flexible bendable area can be other structures, which are not specifically limited in this application embodiment.

[0016] In combination with the first or second possible implementation of the first aspect, in the third possible implementation of the first aspect, the sum of the lengths of the encapsulation area and the display area is equal to the length of the back film layer.

[0017] In this implementation, the wiring area is set on one side of the back film layer, and the display layer includes an encapsulation area and a display area. The sum of the lengths of the encapsulation area and the display area can be equal to the length of the back film layer.

[0018] In conjunction with the first or second possible implementation of the first aspect, in the fourth possible implementation of the first aspect, the length of the display area is greater than or equal to the length of the back film layer.

[0019] In this implementation, the wiring area is set on one side of the back film layer, and the encapsulation area is also bent from one side of the back film layer to the other side. The display layer mainly includes the display area. In this case, the length of the display area is greater than or equal to the length of the back film layer.

[0020] In a fifth possible implementation of the first aspect, in combination with the first to fourth possible implementations of the first aspect, the wiring area is located at the middle position on the second side of the backsheet layer.

[0021] In this implementation, in order to narrow the bezel, the wiring area is bent to the middle position of the second side of the back film layer through a flexible and bendable area.

[0022] In conjunction with the first to fifth possible implementations of the first aspect, in the sixth possible implementation of the first aspect, the width of the bezel of the display panel is 0.1mm-0.3mm.

[0023] In a second aspect, a display device is provided, the electronic device including a display panel as described in any implementation of the first aspect.

[0024] For example, the display device can be a mobile phone, tablet computer, laptop computer, wearable device, car-related electronic device or other device with display function. Wearable device can be a smartwatch, VR (Virtual Reality) wearable device or the like. Attached Figure Description

[0025] Figure 1 A schematic diagram of the bezel of a display screen in a display device provided in related technologies;

[0026] Figure 2 A schematic diagram of the bezel of a display screen of an example display device provided in an embodiment of this application;

[0027] Figure 3 This is a schematic diagram of the bezel of a display screen of another example of a display device provided in an embodiment of this application.

[0028] Figure label:

[0029] 111-Cover glass layer; 112-Optical transparent adhesive layer; 113-Polarizing layer; 114-Panel layer; 1141-Way trace area; 1142-Encapsulation area; 1143-Display area; 115-Back film layer; 116-Flexible bendable area. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] In the description of the embodiments of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" and "second" may explicitly or implicitly include at least one of that feature.

[0032] In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise expressly and specifically limited.

[0033] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0034] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0035] In the description of this application, it should be understood that the terms "inner", "outer", "side", "upper", "bottom", "front", "rear", etc., indicating the orientation or positional relationship are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0036] In the description of this application, it should be noted that the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0037] It should also be noted that in the embodiments of this application, the same reference numerals are used to represent the same component or part. For the same part in the embodiments of this application, the reference numerals may only be used to mark one part or component as an example. It should be understood that the reference numerals are also applicable to other identical parts or components.

[0038] The technical solutions provided in the embodiments of this application will be described below with reference to the accompanying drawings.

[0039] Ultra-narrow bezels have always been the development trend of mobile phone screens. The narrow bezel design reduces the unused area around the screen, resulting in a larger screen-to-body ratio and providing a more immersive experience when watching videos, playing games, or multitasking. By reducing the bezel size, manufacturers can increase the screen size without increasing the overall size of the product, which means users can get a larger display area while keeping the device compact and portable. In addition to smartphones and tablets, narrow bezel displays are also widely used in laptops, TVs, and other display devices to meet the needs of different scenarios.

[0040] However, due to limitations in screen packaging technology and overall device architecture, narrowing the bezels of mobile phone screens has reached a bottleneck, making further significant improvements difficult. Below are some existing methods for achieving narrow bezels.

[0041] Traditional screen driver circuits are typically located at the edge of the screen, occupying considerable space. However, using COF technology, the driver IC can be directly packaged on a flexible film and folded to the back of the screen, thereby reducing the width of the screen bezel. Alternatively, to further reduce the top bezel, under-display camera technology can be used. This technology hides the front-facing camera under the screen, only revealing it through a transparent area when in use, achieving a true full-screen effect. Or, current OLED screens and micro-LEDs, due to their self-emissive characteristics, do not require a backlight layer, thus allowing them to be made thinner, which helps reduce bezel thickness. Alternatively, the internal component layout of the display can be redesigned and optimized, such as relocating antennas, sensors, and other components or adopting new design schemes, to reduce the requirements for screen bezel width.

[0042] Figure 1 A schematic diagram of the bezel of a display device in the related art is shown, such as... Figure 1As shown, the display device includes a cover glass (CG) layer 111, an optically clear adhesive (OCA) layer 112, a polarizer (POL) layer 113, a panel layer 114, and a back film layer 115.

[0043] Among them, the CG layer 111 is located on the outermost layer of the display panel and plays a role in protecting the display panel. It is usually made of reinforced glass material.

[0044] OCA layer 112 is used to tightly bond different display components together, such as seamlessly combining CG layer 111 with touch panel and display panel, ensuring optical performance while providing structural stability.

[0045] The POL layer 113 can control the direction of light passing through, allowing only light from specific directions to pass through. This controls the direction of light transmission, reduces reflection, and improves contrast, thereby achieving the key function of image display.

[0046] Panel layer 114 refers to the display panel layer, which contains key components such as the liquid crystal layer and color filter, and is responsible for displaying images.

[0047] The back film layer 115 is located below the panel layer 114 and serves to provide support and protection.

[0048] Furthermore, panel layer 114 also includes wiring area 1141, encapsulation area 1142, and display area 1143.

[0049] It should be understood that the wiring area 1141 is typically located on the periphery of the display area and is mainly composed of conductive materials (such as metal). The wiring area 1141 is used to connect the various components on the display area 1143 to the driving circuit. Signal lines connecting each pixel to the driving circuit are arranged in the wiring area 1141. These lines transmit the electrical signals from the display controller to the corresponding pixels to control their brightness and color. Since the wiring area 1141 does not directly participate in image display, this area is usually invisible or obscured by the bezel.

[0050] To protect the precision electronic components inside the display panel from the influence of the external environment and ensure their long-term stability and service life, the encapsulation area 1142 typically uses sealant, desiccant, and multi-layer encapsulation materials to achieve an effective barrier effect.

[0051] Common encapsulation methods include glass encapsulation and thin-film encapsulation (TFE). Thin-film encapsulation is particularly suitable for flexible display panels. It uses multiple layers of organic and inorganic materials to form a barrier layer, effectively preventing the intrusion of external moisture and oxygen.

[0052] Display area 1143 is the part of the screen that actually displays the image. It contains all the pixels that make up the image. Each pixel is composed of three sub-pixels: red, green, and blue. Various colors are produced by adjusting the intensity of these three colors.

[0053] Depending on the display technology, the materials used in the display area 1143 also differ. For example, in LCD (Liquid Crystal Display), liquid crystal materials are mainly used; while in OLED (Organic Light Emitting Diode) display panels, organic light-emitting materials are used. In addition, there are emerging display technologies such as Mini LED and Micro LED, each with its own unique material and structural characteristics.

[0054] The presence of the wiring area 1141 and the packaging area 1142 results in a black border on the display screen, typically around 0.6-0.8mm. Furthermore, the wiring area 1141 and the packaging area 1142 are made of inorganic materials, which are brittle and cannot be bent at small angles, preventing a significant reduction in the black border.

[0055] Therefore, how to achieve ultra-narrow bezels or even bezel-less designs is a key issue that display devices need to address.

[0056] In view of this, this application provides a display panel including a display area and a non-display area. The non-display area includes a back film layer, an encapsulation area, and a wiring area. The encapsulation area is located on a first side of the back film layer, and the wiring area is located on a second side of the back film layer. The encapsulation area and the wiring area are connected by a flexible bendable area. Alternatively, the encapsulation area bends from the first side of the back film layer to the second side of the back film layer, the wiring area is located on the second side of the back film layer, and the encapsulation area and the wiring area are connected by a flexible bendable area.

[0057] The display panel provided in this application embodiment connects the packaging area and the wiring area by designing a flexible and bendable area between the packaging area and the wiring area. The wiring area is bent to the back of the display area using the flexible and bendable area. The packaging area can be located in the display area or a part of the packaging area can be bent to the back of the display area, which can significantly narrow the bezel.

[0058] The display panel in the display device provided in this application embodiment can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), or a micro-LED, etc.

[0059] The display panel provided in this application will be described in detail below with reference to the accompanying drawings.

[0060] In some embodiments, the inorganic material filling the panel layer can be removed and replaced with organic material between the encapsulation area and the wiring area, thereby increasing the flexible transition area. This allows for extremely small radius bending of the frame, ultimately reducing the size of the top / left / right bezel of the phone.

[0061] For example, Figure 2 A schematic diagram of a display panel provided in an embodiment of this application is shown, such as... Figure 2 As shown, the display panel includes a display area 1143, a back film layer 115, an encapsulation area 1142, and a wiring area 1141. The encapsulation area 1142 is curved from a first side of the back film layer 115 to a second side of the back film layer 115 (e.g., ...). Figure 2 (As shown by the arrow in the image), the wiring area 1141 is located on the second side of the back film layer 115, and the encapsulation area 1142 and the wiring area 1141 are connected by the flexible bendable area 116.

[0062] The display panel provided in this embodiment adds a flexible, bendable area 116 between the encapsulation area 1142 and the wiring area 1141. This flexible, bendable area 116 can bend the wiring area 1141 to the back film layer 115. This flexible, bendable area 116 can achieve minimal bending of the bezel, thus significantly narrowing the bezel. Furthermore, in this example, the bent design of the encapsulation area 1142 further reduces the width of the bezel.

[0063] In some embodiments, the flexible bendable region 116 is filled with an organic material that enables the flexible bendable region 116 to be bent.

[0064] It should be noted that the embodiments of this application do not specifically limit the type of organic material filled in the flexible and bendable area 116.

[0065] In this implementation, organic material is filled between the encapsulation area 1142 and the wiring area 1141, which can achieve a flexible transition between the encapsulation area 1142 and the wiring area 1141. This flexible transition can achieve minimal bending of the bezel, which is beneficial for achieving a narrow bezel. Furthermore, by using a flexible transition to separate the encapsulation area 1142 and the wiring area 1141, the wiring area 1141 is bent to the back of the back film layer 115 without using other connectors to fix the wiring area 1141. This achieves a narrow bezel without increasing the thickness of the display panel.

[0066] In some possible implementations, the flexible bendable region 116 can be a strip structure.

[0067] Alternatively, the flexible bendable area 116 can be other structures, which are not specifically limited in this application embodiment.

[0068] In some possible implementations, the length of the display area 1143 is greater than or equal to the length of the back film layer 115.

[0069] In this implementation, the wiring area 1141 is set on one side of the back film layer 115, and the encapsulation area 1142 is also bent from one side of the back film layer 115 to the other side. Then the display layer 114 mainly includes the display area 1143. In this case, the length of the display area 1143 can be set to be greater than or equal to the length of the back film layer 115.

[0070] In some possible implementations, the wiring area 1141 is located at the middle position on the second side of the back film layer 115.

[0071] In this implementation, in order to narrow the bezel, the wiring area 1141 is bent to the middle position of the second side of the back film layer 115 through the flexible bendable area 116.

[0072] By bending the encapsulation area 1142 and placing the wiring area 1141 on the second side of the back film layer 115 in the above embodiments, the top, left, and right bezels of the display panel can be reduced by 0.5-0.7mm. That is, by reducing the original top, left, and right bezels of the display panel from 0.6-0.8mm to 0.5-0.7mm, the width of the top, left, and right bezels of the display panel is finally reduced to 0.1mm, thereby achieving a narrow bezel for the display panel.

[0073] In other embodiments, between the encapsulation area and the wiring area, the inorganic material of the panel layer is removed and filled with organic material to increase the flexible wiring transition area. This flexible wiring transition area can achieve a very small bending radius of the frame. Since the encapsulation area contains inorganic layers such as SiO, it is easy to break when bent. Therefore, in this embodiment, the encapsulation area does not need to be bent, and only the flexible wiring transition area is bent. This embodiment has the top / left / right frame.

[0074] For example, Figure 3 Another example of a display panel provided in an embodiment of this application is shown, such as... Figure 3 As shown, the display panel includes a display area 1143, a back film layer 115, an encapsulation area 1142, and a wiring area 1141. The encapsulation area 1142 is located on the first side of the back film layer 115, and the wiring area 1141 and the display area 1143 are located on the second side of the back film layer 115. The encapsulation area 1141 and the wiring area 1142 are connected by a flexible bendable area 116.

[0075] The display panel provided in this application embodiment adds a flexible bendable area 116 between the encapsulation area 1142 and the wiring area 1141. This flexible bendable area 116 can bend the wiring area 1141 to one side of the back film layer 115. This flexible bendable area 116 can achieve minimal bending of the bezel, thus significantly narrowing the bezel. Since the encapsulation area 1142 has an inorganic layer, in this example, the encapsulation area 1142 is not bent.

[0076] In some embodiments, the flexible bendable region 116 is filled with an organic material that enables the flexible bendable region 116 to be bent.

[0077] It should be noted that the embodiments of this application do not specifically limit the type of organic material filled in the flexible and bendable area 116.

[0078] In some possible implementations, the flexible bendable region 116 can be a strip structure.

[0079] Alternatively, the flexible bendable area 116 can be other structures, which are not specifically limited in this application embodiment.

[0080] In some possible implementations, the sum of the lengths of the encapsulation region 1142 and the display region 1143 is equal to the length of the back film layer 115.

[0081] In this implementation, the wiring area 1141 is set on one side of the back film layer 115, and the display layer 114 includes an encapsulation area 1142 and a display area 1143. The sum of the lengths of the encapsulation area 1142 and the display area 1143 can be set to be equal to the length of the back film layer 115.

[0082] In some possible implementations, the encapsulation region 1142 is located at the middle position on the second side of the back film layer 115.

[0083] In this implementation, in order to narrow the bezel, the wiring area 1141 is bent to the middle position of the second side of the back film layer 115 through the flexible bendable area 116.

[0084] In the above embodiments, with the display area 1143 and the encapsulation area 1141 located on one side of the back film layer, and the wiring area 1142 located on the other two sides of the back film layer 115, the top, left, and right bezels of the display panel can be reduced by 0.3-0.5mm. That is, based on the original 0.6-0.8mm width of the top, left, and right bezels of the display panel, a reduction of 0.3-0.5mm is achieved, ultimately resulting in a width of 0.3mm for the top, left, and right bezels of the display panel, thus realizing a narrow bezel design for the display panel.

[0085] The above embodiments describe a display panel. This application also provides a display device, which includes the aforementioned display panel. This display device can be a mobile phone, tablet computer, laptop computer, wearable device, automotive-related electronic device, or other device with display functionality. Wearable devices can be smartwatches, VR (Virtual Reality) wearable devices, etc.

[0086] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0087] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, The display panel includes a display area, a back film layer, an encapsulation area, and a wiring area. The encapsulation area is located on the first side of the back film layer, and the wiring area is located on the second side of the back film layer. The encapsulation area and the wiring area are connected by a flexible bendable area. Alternatively, the encapsulation region bends from the first side of the back film layer to the second side of the back film layer, the wiring region is located on the second side of the back film layer, and the encapsulation region and the wiring region are connected through the flexible bendable region.

2. The display panel according to claim 1, characterized in that, The flexible, bendable area is filled with organic matter.

3. The display panel according to claim 1, characterized in that, The flexible, bendable area has a strip-shaped structure.

4. The display panel according to any one of claims 1-3, characterized in that, The sum of the lengths of the encapsulation area and the display area is equal to the length of the back film layer.

5. The display panel according to any one of claims 1-3, characterized in that, The length of the display area is greater than or equal to the length of the back film layer.

6. The display panel according to any one of claims 1-3, characterized in that, The wiring area is located in the middle of the second side of the back film layer.

7. The display panel according to any one of claims 1-3, characterized in that, The width of the bezel of the display panel is 0.1mm-0.3mm.

8. A display device, characterized in that, The display device includes the display panel according to any one of claims 1 to 7.

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