Electroplating solution diluting and recycling device

Abstract

The utility model relates to an electroplating solution diluting and recycling device. The electroplating solution diluting and recycling device comprises an electroplating sub-tank, a backflow diluting module and a liquid absorbing module, the backflow dilution module comprises an atomizing nozzle, a first booster pump connected with the atomizing nozzle and an air pump connected with the atomizing nozzle. The liquid absorption module comprises a water absorption support, a first water absorption roll shaft installed on the water absorption support and a second water absorption roll shaft installed on the water absorption support. The waste water containing the electroplating solution in the pure water flushing tank is recycled into the electroplating sub-tank in an atomization spraying mode, and the residual electroplating solution on the surface of the material belt is diluted while water supplementing is completed. And then, most of the diluted electroplating solution is recycled through the water absorption roll shaft, so that the problem that the electroplating solution is brought out by the material belt is relieved, and the loss rate of the electroplating solution containing precious metal is reduced.

Description

Electroplating solution dilution and recovery device Technical Field

[0001] This utility model relates to the field of electroplating technology, and in particular to an electroplating solution dilution and recovery device. Background Technology

[0002] During electroplating, a metal ion plating layer is applied to designated areas of a metal part's surface through ionization. For example, multiple metal terminals are connected in series to form a strip, which is then fed in a roll. After each designated area of ​​the strip is electroplated in the electroplating tank, it needs to be rinsed with pure water to remove any residual plating solution adhering to its surface. In actual production, to ensure the conductivity of the metal terminals, the designated areas are typically plated with precious metals, such as gold. Therefore, during the post-plating pure water rinsing, the plating solution containing a large amount of precious metal ions is treated as wastewater and discharged, resulting in significant waste. Currently, to address this waste of precious metals, manufacturers typically install air nozzles at the outlet of the electroplating tank, using airflow to impact the surface of the strip and wash away the plating solution adhering to it. However, considering factors such as the structural shape of the metal terminals and the orientation of the air nozzles, blind spots are unavoidable during operation. This results in a significant amount of plating solution being carried out of the sub-plating tank along with the conveyor belt. The plating solution in the sub-tank needs to be returned to the main plating tank, reducing the amount of solution ultimately returning to the main tank. Simultaneously, the plating solution needs to be maintained at 55℃–60℃, resulting in a rapid evaporation rate. Ultimately, the combined effect of the conveyor belt carrying out the plating solution and the rapid evaporation of the solution leads to a high rate of solution loss in the main plating tank, requiring continuous replenishment and resulting in high production costs.

[0003] Therefore, it is necessary to propose corresponding solutions to address the problem of excessively rapid loss of electroplating solutions containing precious metals due to the material strip carrying out the electroplating solution and the rapid evaporation of the electroplating solution. Summary of the Invention

[0004] Based on this, the present invention provides an electroplating solution dilution and recovery device, which uses atomized spraying to recover wastewater containing electroplating solution from the pure water rinsing tank into the electroplating sub-tank, completing water replenishment while diluting the electroplating solution remaining on the surface of the material strip. Then, the majority of the diluted electroplating solution is recovered by a water suction roller, thereby alleviating the problem of the material strip carrying away the electroplating solution and reducing the loss rate of electroplating solutions containing precious metals.

[0005] An electroplating solution dilution and recovery device, comprising:

[0006] Electroplating sub-tank; one end of the electroplating sub-tank is provided with a feed inlet, and the other end of the electroplating sub-tank is provided with a discharge outlet;

[0007] A reflux dilution module is connected to the electroplating sub-tank. The reflux dilution module includes: an atomizing nozzle installed inside the electroplating sub-tank and near the outlet; a first booster pump connected to the atomizing nozzle; and an air pump connected to the atomizing nozzle. The first booster pump draws wastewater generated from the pure water rinsing tank and delivers it to the atomizing nozzle. The air pump supplies airflow to the atomizing nozzle. The atomizing nozzle atomizes the refluxed wastewater and sprays it onto the inner cavity of the electroplating sub-tank, causing some of the refluxed wastewater to adhere to the surface of the electroplated strip, thereby replenishing the electroplating sub-tank and diluting the concentration of the electroplating solution on the surface of the strip.

[0008] A liquid suction module connected to an electroplating sub-tank; the liquid suction module includes: a water suction bracket installed inside the electroplating sub-tank and located between the outlet and the atomizing nozzle, a first water suction roller shaft installed on the water suction bracket, and a second water suction roller shaft installed on the water suction bracket; after the material strip is sprayed by the atomizing nozzle, it enters between the first water suction roller shaft and the second water suction roller shaft to recover the electroplating solution adhering to the surface of the material strip.

[0009] In the aforementioned electroplating solution dilution and recovery device, during operation, a first booster pump draws wastewater from the pure water rinsing tank to an atomizing nozzle. Simultaneously, an air pump supplies airflow to the atomizing nozzle, causing the returned wastewater to be atomized into droplets and sprayed onto the surface of the conveyor belt, mixing with the electroplating solution originally adhering to the belt. This reduces the concentration of the electroplating solution on the belt surface. Furthermore, the atomization method replenishes the electroplating sub-tank, indirectly replenishing the main electroplating tank and recovering precious metal ions from the wastewater. After the electroplating solution on the belt surface is diluted by spraying, it is then adsorbed by the first and second suction rollers, resulting in the recovery of most of the electroplating solution. Through this design, wastewater containing electroplating solution from the pure water rinsing tank is recovered into the electroplating sub-tank via atomized spraying, completing water replenishment while simultaneously diluting the residual electroplating solution on the belt surface. Then, most of the diluted electroplating solution is recovered by the absorbent roller, thereby alleviating the problem of the material belt carrying out the electroplating solution and reducing the loss rate of electroplating solution containing precious metals.

[0010] In one embodiment, the electroplating sub-tank includes an upper liquid tank and a lower liquid tank; both the inlet and outlet are located in the upper liquid tank; the bottom of the upper liquid tank has a guide hole connecting to the lower liquid tank; the atomizing nozzle and the water suction bracket are both located in the upper liquid tank; the lower liquid tank is used to connect to the electroplating master tank to return the electroplating solution. The electroplating solution falling into the upper liquid tank is guided to the lower liquid tank through the guide hole, and then returns to the electroplating master tank via the lower liquid tank, using gravity to increase the return speed of the electroplating solution.

[0011] In one embodiment, the reflux dilution module further includes a second booster pump connected to the electroplating sub-tank; the second booster pump pumps the electroplating solution in the electroplating sub-tank back to the electroplating master tank. The second booster pump is used to increase the rate at which the electroplating solution refluxes to the electroplating master tank.

[0012] In one embodiment, the reflux dilution module further includes: a spray bracket located within the electroplating sub-tank and a mounting platform slidably mounted on the spray bracket; the atomizing nozzle is located on the mounting platform. By sliding and adjusting the mounting platform, the position of the atomizing nozzle can be adjusted to accommodate material strips of different sizes.

[0013] In one embodiment, the reflux dilution module further includes: a shelf separate from the electroplating sub-tank; both the first booster pump and the air pump are mounted on the shelf. The shelf is separate from the electroplating sub-tank to prevent vibrations generated by the first booster pump and the air pump from interfering with the operation of the electroplating sub-tank.

[0014] In one embodiment, the reflux dilution module further includes an air filter connected to the air inlet of the air pump. The air filter can improve the purity of the airflow entering the atomizing nozzle and reduce the risk of the electroplating solution being contaminated by impurities in the airflow.

[0015] In one embodiment, at least one of the first and second absorbent roller shafts is slidably adjustable. A slidably adjustable absorbent roller shaft can easily accommodate material strips of different sizes.

[0016] In one embodiment, both the first and second absorbent rollers are sponge rollers. Sponges are inexpensive and have good absorbency.

[0017] In one embodiment, both the first and second absorbent rollers are vertically oriented. This vertical orientation allows liquid to drip naturally from the absorbent rollers under gravity, extending their working cycle without requiring replacement. Attached Figure Description

[0018] Figure 1 is a perspective view of an electroplating solution dilution and recovery device according to an embodiment of the present invention;

[0019] Figure 2 is a perspective view of the electroplating solution dilution and recovery device shown in Figure 1 from another angle;

[0020] Figure 3 is a perspective view of the electroplating solution dilution and recovery device shown in Figure 1 after the liquid tank is hidden.

[0021] Figure 4 is a perspective view of the reflux dilution module in the electroplating solution dilution and recovery device shown in Figure 3;

[0022] Figure 5 is a three-dimensional view of the reflux dilution module shown in Figure 4 after the stage is hidden.

[0023] Figure 6 is a perspective view of the liquid suction module in the electroplating solution dilution and recovery device shown in Figure 3;

[0024] Figure 7 is a schematic diagram of the working principle of the electroplating solution dilution and recovery device shown in Figure 1.

[0025] The meanings of the labels in the attached diagram are as follows:

[0026] 100-Electroplating solution dilution and recovery device;

[0027] 10-Electroplating sub-tank, 11-Inlet, 12-Outlet, 13-Upper liquid tank, 14-Lower liquid tank;

[0028] 20-Recirculation dilution module, 21-Atomizing nozzle, 22-First booster pump, 23-Air pump, 24-Shelf, 25-Second booster pump, 26-Spray bracket, 27-Mounting platform;

[0029] 30-Liquid absorption module, 31-Water absorption bracket, 32-First water absorption roller shaft, 33-Second water absorption roller shaft;

[0030] 200-material strip. Detailed Implementation

[0031] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0032] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0035] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0036] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0037] As shown in Figures 1 to 7, this is an embodiment of the electroplating solution dilution and recovery device 100 of this utility model.

[0038] As shown in Figures 1 to 3, the electroplating solution dilution and recovery device 100 includes: an electroplating sub-tank 10, a reflux dilution module 20 connected to the electroplating sub-tank 10, and a liquid suction module 30 connected to the electroplating sub-tank 10. The electroplating sub-tank 10 is used to install an electroplating mechanism (e.g., a spot plating machine). During operation, the electroplating sub-tank 10 obtains electroplating solution from the electroplating master tank (the electroplating master tank is used to load the electroplating solution and serves as a storage mechanism for the electroplating solution; as the consumption of the electroplating solution increases, the electroplating master tank needs to be replenished to maintain the liquid level within a preset range) and supplies it to the electroplating mechanism. Excess electroplating solution in the electroplating sub-tank 10 is returned to the electroplating master tank. The reflux dilution module 20 is used to recover wastewater (a mixture of pure water and electroplating solution remaining on the surface of the strip 200) from the subsequent pure water rinsing tank, and sprays the recovered wastewater into the electroplating sub-tank 10 in an atomized form. This not only dilutes the concentration of the residual electroplating solution on the surface of the strip 200, but also replenishes the electroplating sub-tank 10. The electroplating sub-tank 10 is indirectly replenished by utilizing the reflux mechanism between the electroplating sub-tank 10 and the main electroplating tank. Since the concentration of the electroplating solution on the surface of the strip 200 is diluted but the volume of liquid increases after the atomized wastewater is sprayed, the liquid suction module 30 performs liquid suction treatment on the surface of the strip 200 to recover the residual electroplating solution. This significantly reduces the amount of residual electroplating solution when the strip 200 leaves the electroplating sub-tank 10, and even if a small amount of electroplating solution is carried out, its concentration is very low.

[0039] The electroplating solution dilution and recovery device 100 described above will be further explained below with reference to Figures 1 to 7.

[0040] As shown in Figure 2, the electroplating sub-tank 10 has a feed inlet 11 at one end and a discharge outlet 12 at the other end. The feed inlet 11 and the discharge outlet 12 are located on the same straight line and correspond to the preset forward trajectory of the material belt 200. It should be noted that in actual operation, the electroplating sub-tank 10 is also equipped with guide rollers for the material belt 200, electroplating mechanisms, etc. These mechanisms are not related to the technical problem to be solved in this solution, and therefore are not described in this solution.

[0041] Referring to Figures 1, 4, and 5, the recirculation dilution module 20 includes: an atomizing nozzle 21 installed inside the electroplating sub-tank 10 and near the outlet 12; a first booster pump 22 connected to the atomizing nozzle 21; and an air pump 23 connected to the atomizing nozzle 21. The first booster pump 22 draws wastewater generated from the pure water rinsing tank and delivers it to the atomizing nozzle 21. The air pump 23 delivers airflow to the atomizing nozzle 21. The recirculated wastewater mixes with the airflow, and the atomizing nozzle 21 atomizes the recirculated wastewater and sprays it onto the inner cavity of the electroplating sub-tank 10, causing some of the recirculated wastewater to adhere to the surface of the electroplated strip 200, thereby replenishing the electroplating sub-tank 10 and diluting the concentration of the electroplating solution on the surface of the strip 200.

[0042] In this embodiment, the electroplating area of ​​the strip 200 is on the top surface of the strip; therefore, there is only one atomizing nozzle 21. During operation, the water mist sprayed from the atomizing nozzle 21 falls onto the top surface of the strip 200. In other embodiments, the number of atomizing nozzles 21 and their relative positions to the strip need to be adjusted according to the electroplating area of ​​the strip 200.

[0043] It should be noted that in this scheme, the reason for using atomized spraying for the returned wastewater is that, while diluting the electroplating solution on the surface of the material strip 200, it is necessary to control the replenishment rate of the electroplating sub-tank 10. Atomization has a large area coverage capability, and the amount of replenishment provided to the electroplating sub-tank 10 per unit time is small, making it easier to match the consumption rate of the electroplating solution in the electroplating mother tank. This makes the replenishment rate and consumption rate tend to be the same, so that the liquid level of the electroplating mother tank is maintained within the preset range (or the frequency of replenishment of the electroplating mother tank is greatly reduced).

[0044] Considering the vibration generated during pump operation, and to improve the stability of equipment operation, as shown in Figures 2 and 4, in this embodiment, the reflux dilution module 20 may further include a shelf 24 separately disposed from the electroplating sub-tank 10. The first booster pump 22 and the air pump 23 are both mounted on the shelf 24. The shelf 24 is separated from the electroplating sub-tank 10 to prevent vibrations generated by the first booster pump 22 and the air pump 23 from interfering with the operation of the electroplating sub-tank 10.

[0045] In some embodiments, the shelf 24 may be designed to be movable for easy adjustment of the equipment, for example, the bottom of the shelf 24 may be provided with casters. In addition, a vibration damping platform (e.g., a rubber pad) may be provided on the shelf 24 for mounting the booster pump and the air pump 23.

[0046] In other embodiments, the reflux dilution module 20 may also include an air filter connected to the air inlet of the air pump 23. The air filter can improve the purity of the airflow entering the atomizing nozzle 21 and reduce the risk of the electroplating solution being contaminated by impurities in the airflow.

[0047] As shown in Figure 6, the liquid absorption module 30 includes: a water absorption bracket 31 installed inside the electroplating sub-tank 10 and located between the discharge port 12 and the atomizing nozzle 21; a first water absorption roller 32 mounted on the water absorption bracket 31; and a second water absorption roller 33 mounted on the water absorption bracket 31. After the material belt 200 passes through the spray treatment of the atomizing nozzle 21, it enters between the first water absorption roller 32 and the second water absorption roller 33 to recover the electroplating solution adhering to the surface of the material belt 200.

[0048] Preferably, in this embodiment, both the first absorbent roller 32 and the second absorbent roller 33 are sponge rollers. Sponges are inexpensive and have good water absorption. It should be noted that during operation, there is mutual compression between the first absorbent roller 32 and the second absorbent roller 33, which forces some of the absorbed solution to drip into the electroplating sub-tank 10. However, considering that the water absorption capacity of the sponge roller can reach saturation, it is necessary to periodically replace the first absorbent roller 32 and / or the second absorbent roller 33 (replacing with a dry sponge roller).

[0049] Furthermore, in this embodiment, both the first absorbent roller shaft 32 and the second absorbent roller shaft 33 are arranged horizontally. In other embodiments, both the first absorbent roller shaft 32 and the second absorbent roller shaft 33 can be arranged vertically. Vertical arrangement allows the liquid inside the absorbent roller shaft to drip naturally under gravity, extending the working cycle of the absorbent roller shaft without needing to replace it.

[0050] Further improvements can be made to increase the efficiency of the electroplating solution returning to the electroplating master bath.

[0051] For example, as shown in Figure 2, in this embodiment, the electroplating sub-tank 10 may include an upper liquid tank 13 and a lower liquid tank 14. Both the inlet 11 and outlet 12 are located in the upper liquid tank 13. The bottom of the upper liquid tank 13 is provided with a guide hole connecting to the lower liquid tank 14. The atomizing nozzle 21 and the water suction bracket 31 are both located in the upper liquid tank 13. The lower liquid tank 14 is used to connect to the electroplating master tank to return the electroplating solution. The electroplating solution falling into the upper liquid tank 13 is guided to the lower liquid tank 14 through the guide hole, and then returns to the electroplating master tank via the lower liquid tank 14, utilizing gravity to increase the return speed of the electroplating solution.

[0052] For example, as shown in Figures 4 and 5, in this embodiment, the reflux dilution module 20 may further include a second booster pump 25 connected to the electroplating sub-tank 10 (taking Figure 2 as an example, in this embodiment, the inlet of the second booster pump 25 is connected to the lower liquid tank 14). The second booster pump 25 pumps the electroplating solution in the electroplating sub-tank 10 back to the electroplating master tank. The second booster pump 25 is used to increase the rate at which the electroplating solution refluxes to the electroplating master tank.

[0053] Brief description of working principle:

[0054] As shown in Figure 7, during operation, the first booster pump 22 draws wastewater generated from the pure water rinsing tank to the atomizing nozzle 21. Simultaneously, the air pump 23 supplies airflow to the atomizing nozzle 21, causing the returned wastewater to be atomized into droplets and sprayed onto the surface of the material belt 200, mixing with the electroplating solution originally adhering to the material belt 200, thereby reducing the concentration of the electroplating solution adhering to the surface of the material belt 200. Furthermore, the atomization method replenishes the electroplating sub-tank 10, indirectly replenishing the electroplating master tank and recovering precious metal ions from the wastewater. After the electroplating solution on the surface of the material belt 200 is diluted by spraying, it is then adsorbed by the first suction roller 32 and the second suction roller 33, resulting in the recovery of most of the electroplating solution. After suction, the remaining electroplating solution can be further blown into the electroplating sub-tank 10 using an air nozzle.

[0055] To improve the versatility of the equipment, the following improvements can also be made.

[0056] For example, as shown in Figures 1 and 5, in this embodiment, the reflux dilution module 20 may further include: a spray bracket 26 located within the electroplating sub-tank 10 and a mounting platform 27 slidably mounted on the spray bracket 26. The atomizing nozzle 21 is located on the mounting platform 27. By sliding and adjusting the mounting platform 27, the position of the atomizing nozzle 21 can be adjusted to accommodate material strips 200 of different sizes.

[0057] For example, as shown in Figure 6, in this embodiment, at least one of the first absorbent roller shaft 32 and the second absorbent roller shaft 33 is slidably adjustable. A slidably adjustable absorbent roller shaft can easily adapt to material strips 200 of different sizes.

[0058] The aforementioned electroplating solution dilution and recovery device 100 uses atomized spraying to recover wastewater containing electroplating solution from the pure water rinsing tank into the electroplating sub-tank 10. While replenishing water, it also dilutes the residual electroplating solution on the surface of the material strip 200. Then, a water-absorbing roller recovers most of the diluted electroplating solution, thereby alleviating the problem of the material strip 200 carrying away the electroplating solution and reducing the loss rate of electroplating solutions containing precious metals.

[0059] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The above embodiments only illustrate preferred implementations of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An electroplating solution dilution and recovery device, characterized in that, include: Electroplating sub-tank; One end of the electroplating sub-tank is provided with a feed inlet, and the other end of the electroplating sub-tank is provided with a discharge outlet; The reflux dilution module is connected to the electroplating sub-tank; The reflux dilution module includes: an atomizing nozzle mounted inside the electroplating sub-tank and near the outlet; a first booster pump connected to the atomizing nozzle; and an air pump connected to the atomizing nozzle. The first booster pump draws wastewater generated from the pure water rinsing tank and delivers it to the atomizing nozzle. The air pump supplies airflow to the atomizing nozzle. The atomizing nozzle atomizes the refluxed wastewater and sprays it onto the inner cavity of the electroplating sub-tank, causing some of the refluxed wastewater to adhere to the surface of the electroplated strip, thereby diluting the electroplating sub-tank. The system includes a liquid replenishment and dilution module for the electroplating solution on the surface of the strip; a liquid suction module connected to the electroplating sub-tank; the liquid suction module includes a water suction bracket installed in the electroplating sub-tank and located between the outlet and the atomizing nozzle, a first water suction roller shaft installed on the water suction bracket, and a second water suction roller shaft installed on the water suction bracket; after the strip passes through the spray treatment of the atomizing nozzle, it enters between the first water suction roller shaft and the second water suction roller shaft to recover the electroplating solution adhering to the surface of the strip.

2. The electroplating solution dilution and recovery device according to claim 1, characterized in that, The electroplating sub-tank includes an upper liquid tank and a lower liquid tank; the inlet and the outlet are both located in the upper liquid tank; the bottom of the upper liquid tank is provided with a guide hole that connects to the lower liquid tank; the atomizing nozzle and the water absorption bracket are both located in the upper liquid tank; the lower liquid tank is used to connect to the electroplating master tank to return the electroplating solution.

3. The electroplating solution dilution and recovery device according to claim 1, characterized in that, The reflux dilution module further includes a second booster pump connected to the electroplating sub-tank; the second booster pump pumps the electroplating solution in the electroplating sub-tank back to the electroplating master tank.

4. The electroplating solution dilution and recovery device according to claim 1, characterized in that, The reflux dilution module further includes: a spray bracket located in the electroplating sub-tank and a mounting platform slidably mounted on the spray bracket; the atomizing nozzle is located on the mounting platform.

5. The electroplating solution dilution and recovery device according to claim 1, characterized in that, The reflux dilution module further includes: a shelf that is separate from the electroplating sub-tank; the first booster pump and the air pump are both installed on the shelf.

6. The electroplating solution dilution and recovery device according to claim 1, characterized in that, The reflux dilution module also includes an air filter connected to the air inlet of the air pump.

7. The electroplating solution dilution and recovery device according to claim 1, characterized in that, At least one of the first and second absorbent roller shafts is adjustable by sliding.

8. The electroplating solution dilution and recovery device according to claim 1, characterized in that, Both the first and second absorbent roller shafts are sponge shafts.

9. The electroplating solution dilution and recovery device according to claim 1, characterized in that, Both the first and second water-absorbing roller shafts are vertically arranged.

Images