A multi-channel radio frequency transceiver assembly

Abstract

The application provides a multi-channel radio frequency transceiving assembly, and relates to the technical field of active phased array radars.The application improves the power amplifier heat dissipation efficiency of the high-power transmitting link by separately integrating the circulators and power amplifiers involved in the high-power transmitting link in a closed metal box on a molybdenum copper heat dissipation carrier, so as to fully exert the maximum working efficiency of the bare chip, improve the working efficiency of the transceiving assembly, and use the SIP packaging technology to package other radio frequency devices of the transceiving assembly except the circulators and power amplifiers in the same circuit board in the closed metal box, so as to improve the overall integration of the transceiving assembly, reduce the radio frequency line loss of the transceiving assembly, and reduce the repair difficulty of the transceiving assembly by replacing the SIP packaging module, so that the corresponding multi-channel radio frequency transceiving assembly has the characteristics of high integration, low line loss, low repair difficulty, high airtightness, high working efficiency and the like.

Description

Technical Field

[0001] This application relates to the field of active phased array radar technology, and more specifically, to a multi-channel radio frequency transceiver component. Background Technology

[0002] With the development of modern radar technology, active phased array radar technology has been widely used in military and civilian fields due to its significant advantages such as fast scanning, high reliability, and multi-target tracking. As the core component of active phased array radar system, the performance, size, integration, repairability, and heat dissipation of the radio frequency TR (Transmitter and Receiver) component directly affect the overall performance of the radar system.

[0003] Currently, conventional RF TR components on the market are mainly assembled using discrete components. They have drawbacks such as large physical size, high RF line loss, low heat dissipation efficiency of high-power transmission links, and difficulty in equipment repair, which cannot guarantee the radar performance of the corresponding active phased array radar. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a multi-channel RF transceiver component that can improve the heat dissipation efficiency of the high-power transmit link by integrating the circulator and power amplifier involved in the high-power transmit link separately on a molybdenum-copper heat sink within a sealed metal box. This allows the maximum operating efficiency of the bare chip to be fully utilized, thereby improving the operating efficiency of the transceiver component. Furthermore, by using SIP (System-in-Package) packaging technology within the sealed metal box to package other RF devices of the transceiver component, except for the circulator and power amplifier, on the same circuit board, the overall integration of the transceiver component can be improved, thereby reducing the RF line loss of the transceiver component. At this time, the difficulty of rework of the transceiver component can be reduced by replacing the SIP package module. Thus, the multi-channel RF transceiver component provided by this application has the characteristics of high integration, low line loss, low rework difficulty, high airtightness, and high operating efficiency.

[0005] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows:

[0006] In a first aspect, this application provides a multi-channel radio frequency transceiver assembly, which includes a metal housing, a carrier circuit board, multiple radio frequency antenna connectors, multiple molybdenum-copper heat sinks, multiple circulators, and multiple power amplifiers, as well as a multi-channel scheduling SIP package module, multiple transmit modulation SIP package modules, and multiple receive modulation SIP package modules deployed on the carrier circuit board; wherein each molybdenum-copper heat sink individually carries one circulator and one power amplifier; the multiple radio frequency antenna connectors are all embedded on the outer surface of the metal housing and are each individually connected to the first port of one of the circulators;

[0007] The carrier circuit board is connected to the multiple molybdenum-copper heat sinks via a common ground and is installed in the internal carrier cavity of the metal housing; wherein, the multiple single-channel RF transmit ports of the multi-channel scheduling SIP package module are respectively connected to the second port of the circulator via a transmit modulation SIP package module and a power amplifier, and the multiple single-channel RF receive ports of the multi-channel scheduling SIP package module are respectively connected to the third port of the circulator via a receive modulation SIP package module.

[0008] In an optional embodiment, a heat dissipation auxiliary cavity is further provided inside the metal box, the heat dissipation auxiliary cavity surrounds the internal support cavity and is spaced apart from the internal support cavity;

[0009] The heat dissipation auxiliary cavity is filled with phase change material to assist in heat dissipation of various radio frequency devices within the internal carrier cavity.

[0010] In an optional embodiment, the metal housing includes a metal cover plate, a cavity structure, and a sealing back plate. The cavity structure has a device accommodating groove on the surface of a first structure and an auxiliary heat dissipation groove on the surface of a second structure that is opposite to the surface of the first structure. The auxiliary heat dissipation groove is separate from the device accommodating groove. The bottom shape of the auxiliary heat dissipation groove matches the bottom shape of the device accommodating groove to completely surround the device accommodating groove.

[0011] The metal cover plate covers the surface of the first structural component of the cavity structure to cooperate with the device receiving groove to form the internal bearing cavity;

[0012] The sealing back plate covers the surface of the second structural component of the cavity structure to cooperate with the auxiliary heat dissipation groove to form the heat dissipation auxiliary cavity.

[0013] In an optional embodiment, a plurality of the molybdenum-copper heat dissipation carrier plates are sintered and mounted on the cavity sidewall of the internal support cavity to be connected to the metal box body.

[0014] Multiple molybdenum-copper heat sinks are in contact with the carrier circuit board, and the contact surfaces between each molybdenum-copper heat sink and the carrier circuit board are electrically connected by conductive silver paste.

[0015] In an optional embodiment, the transceiver assembly further includes a plurality of cavity partition covers, all of which are disposed within the internal bearing cavity;

[0016] Each cavity partition cover is individually covered with one of the molybdenum-copper heat sinks, so as to divide the internal supporting cavity into an approximately sealed cavity that covers the molybdenum-copper heat sink.

[0017] In an optional implementation, each of the near-sealed cavities has a cavity sidewall covered with an absorbing coating to provide anti-self-oscillation functionality for the power amplifier within the near-sealed cavity.

[0018] In an optional embodiment, each of the transmit modulation SIP package modules is packaged with a driver amplifier and a transmit power modulation chip, wherein the transmit power modulation chip is used to modulate the operating voltage of the driver amplifier;

[0019] The input terminal of the driver amplifier is connected to a single-channel RF transmit port of the multi-channel scheduling SIP package module, and the output terminal of the driver amplifier is connected to a second port of the circulator via a power amplifier.

[0020] In an optional implementation, each of the receive modulation SIP package modules is packaged with a low-noise amplifier, a limiter, and a receive power modulation chip, wherein the receive power modulation chip is used to modulate the operating voltages of the low-noise amplifier and the limiter, respectively.

[0021] The input of the limiter is connected to a third port of the circulator, the output of the limiter is connected to the input of the low-noise amplifier, and the output of the low-noise amplifier is connected to a single-channel RF receiver port of the multi-channel scheduling SIP package module.

[0022] In an optional implementation, the multi-channel scheduling SIP encapsulation module is encapsulated from a multi-channel amplitude and phase control chip and multiple single-channel transceiver switching switches;

[0023] The first stationary contact of each single-channel transceiver switch serves as a single-channel RF transmitting port, the second stationary contact of each single-channel transceiver switch serves as a single-channel RF receiving port, and the moving contact of each single-channel transceiver switch is connected to a single-channel amplitude and phase control port of the multi-channel amplitude and phase control chip.

[0024] In an optional embodiment, the transceiver assembly further includes a first low-frequency interface, a second low-frequency interface, and an RF main port connector embedded on the outer surface of the metal housing.

[0025] The first low-frequency interface, the second low-frequency interface, and the RF main port connector are all electrically connected to the multi-channel scheduling SIP package module. The first low-frequency interface is used to connect an external power supply, the second low-frequency interface is used to receive RF control signals for the multi-channel scheduling SIP package module, and the RF main port connector is used to connect an external RF device to realize the RF signal transmission function between the transceiver component and the external RF device.

[0026] In this case, the beneficial effects of the embodiments of this application may include:

[0027] This application improves the heat dissipation efficiency of the high-power transmit links by integrating the circulators and power amplifiers involved in multiple high-power transmit links separately on a molybdenum-copper heat sink within a sealed metal box. This allows the maximum efficiency of the bare chip to be fully utilized, thereby improving the overall efficiency of the transceiver components. Furthermore, by using SiP packaging technology within the sealed metal box to package the other RF devices of the transceiver components (excluding the circulators and power amplifiers) onto the same circuit board, the overall integration of the transceiver components is improved, reducing RF line losses. The difficulty of rework can be reduced by replacing the SiP packaged modules. Therefore, the multi-channel RF transceiver components provided by this application possess characteristics such as high integration, low line loss, low rework difficulty, high airtightness, and high operating efficiency.

[0028] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1This is a schematic diagram of the assembly of a multi-channel radio frequency transceiver component provided in an embodiment of this application;

[0031] Figure 2 This is one of the component exploded view diagrams of the multi-channel radio frequency transceiver component provided in the embodiments of this application;

[0032] Figure 3 A schematic diagram of the component circuit connection of the multi-channel radio frequency transceiver component provided in the embodiments of this application;

[0033] Figure 4 A second exploded view of the multi-channel radio frequency transceiver component provided in the embodiments of this application;

[0034] Figure 5 The metal housing provided in the embodiments of this application is in Figure 4 A schematic diagram of the decomposition observation in the diagram;

[0035] Figure 6 This is the third exploded view of the multi-channel radio frequency transceiver component provided in the embodiments of this application.

[0036] Icons: 10-Multi-channel RF transceiver assembly; 11-Metal housing; 12-Carrier circuit board; 13-RF antenna connector; 14-Molybdenum copper heat sink; 15-Circulator; 16-Power amplifier; 17-Multi-channel scheduling SIP package module; 18-Transmit modulation SIP package module; 19-Receive modulation SIP package module; 21-First low-frequency interface; 22-Second low-frequency interface; 23-RF main port connector; 111-Metal cover plate; 112-Cavity structure component; 113-Sealed backplate; 114-Device housing recess; 115-Auxiliary heat dissipation recess; 31-Phase change material; 32-Cavity segmentation cover plate; 33-Absorbing coating; 171-Multi-channel amplitude and phase control chip; 172-Single-channel transmit / receive switch; 181-Driver amplifier; 182-Transmit power modulation chip; 191-Low noise amplifier; 192-Limiter; 193-Receive power modulation chip. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0038] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0039] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0040] In the description of this application, it should be understood that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are used only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the equipment or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0041] Furthermore, the terms "first," "second," and "third" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0042] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0043] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0044] Please refer to the reference. Figure 1 , Figure 2 and Figure 3 ,in Figure 1 This is a schematic diagram of the assembly of the multi-channel radio frequency transceiver component 10 provided in the embodiments of this application. Figure 2 This is one of the component exploded view diagrams of the multi-channel radio frequency transceiver component 10 provided in the embodiments of this application. Figure 3This is a schematic diagram of the component circuit connection of the multi-channel RF transceiver assembly 10 provided in this application embodiment. In this application embodiment, the multi-channel RF transceiver assembly 10 may include a metal housing 11, a carrier circuit board 12, multiple RF antenna connectors 13, multiple molybdenum-copper heat sinks 14, multiple circulators 15 and multiple power amplifiers 16, as well as a multi-channel scheduling SIP package module 17, multiple transmit modulation SIP package modules 18 and multiple receive modulation SIP package modules 19 deployed on the carrier circuit board 12. The metal housing 11 may include a metal cover plate 111 and a cavity structure 112. The cavity structure 112 has a device receiving groove 114 on its first structural surface. The metal cover plate 111 is fixed (e.g., threaded or welded) to the first structural surface of the cavity structure 112 to form an internal support cavity for accommodating various RF devices related to RF transceiver functions, and to ensure good airtightness of the metal housing 11. The number of RF antenna connectors, molybdenum-copper heat sinks, circulators, power amplifiers, transmit modulation SIP packages, and receive modulation SIP packages in the multi-channel RF transceiver assembly 10 is consistent. Any RF transceiver channel of the multi-channel RF transceiver assembly 10 (e.g., Figure 3 The four-channel RF transceiver assembly shown herein is maintained by the multi-channel scheduling SIP package module 17 in conjunction with a single circulator 15, a single power amplifier 16, a single transmit modulation SIP package module 18, and a single receive modulation SIP package module 19. The high-power RF transmit link involved in any one of the RF transceiver channels is composed of the multi-channel scheduling SIP package module 17, a single circulator 15, a single power amplifier 16, and a single transmit modulation SIP package module 18, while the RF receive link involved in the same RF transceiver channel is composed of the multi-channel scheduling SIP package module 17, a single circulator 15, and a single receive modulation SIP package module 19.

[0045] In this embodiment, each of the molybdenum-copper heat sinks 14 in the multi-channel RF transceiver assembly 10 individually carries a circulator 15 and a power amplifier 16. This utilizes the high heat dissipation efficiency of the molybdenum-copper alloy material to achieve high-efficiency power amplifier heat dissipation for the RF transmission links under each RF transceiver channel. This allows the RF transmission links of each RF transceiver channel to fully utilize the maximum bare chip efficiency of the power amplifier 16 during the use of the assembly, thereby effectively improving the overall operating efficiency of the multi-channel RF transceiver assembly 10.

[0046] In this embodiment, the multi-channel RF transceiver assembly 10, comprising multiple molybdenum-copper heat sinks 14 and a carrier circuit board 12, is mounted in the internal carrier cavity of the metal housing 11 with mutual ground connection. The multi-channel RF transceiver assembly 10 includes multiple RF antenna connectors 13, each embedded on the outer surface of the metal housing 11 and extending into the internal carrier cavity to connect to the first port of a circulator 15. This allows each circulator 15's first port to be individually connected to an external RF antenna (e.g., via an RF antenna connector 13). Figure 3 (Any one of the four RF antennas ANT1 to ANT4 in the configuration). Multiple molybdenum-copper heat sinks 14 are sintered and mounted on the sidewalls of the internal support cavity to share a common ground with the metal housing 11. Simultaneously, each molybdenum-copper heat sink 14 contacts the support circuit board 12, and the contact surfaces between each molybdenum-copper heat sink 14 and the support circuit board 12 are electrically connected using conductive silver paste. This ensures that each power amplifier 16 in the multi-channel RF transceiver assembly 10 achieves a complete and continuous grounding effect with the metal housing 11 and the support circuit board 12, thereby reducing the risk of self-oscillation in each power amplifier 16.

[0047] In this embodiment of the application, the multi-channel scheduling SIP encapsulation module 17 in the multi-channel RF transceiver component 10 may include multiple single-channel RF transmit ports (e.g., Figure 3 The TX1 to TX4 ports) and multiple single-channel RF receiver ports (e.g., Figure 3 The RX1 to RX4 ports in the multi-channel RF transceiver component 10, wherein each of the multiple RF transceiver channels corresponds to a single-channel RF transmit port and a single-channel RF receive port (e.g., ports RX1 to RX4 in the multi-channel RF transceiver component 10). Figure 3Each RF transceiver channel in the multi-channel scheduling SIP encapsulation module 17 corresponds to a separate TX1 port and an RX1 port. Therefore, the multiple single-channel RF transmit ports of the multi-channel scheduling SIP encapsulation module 17 are each connected to a second port of the circulator 15 via a transmit modulation SIP encapsulation module 18 and a power amplifier 16, respectively, to form RF transmit links for each of the multiple RF transceiver channels. Similarly, the multiple single-channel RF receive ports of the multi-channel scheduling SIP encapsulation module 17 are each connected to a third port of the circulator 15 via a receive modulation SIP encapsulation module 19, respectively, to form RF receive links for each of the multiple RF transceiver channels. The multi-channel RF transceiver component 10 can be used to control the link switching operation of the RF transmit and receive links of the multiple RF transceiver channels, and can also be used to regulate the operating status of the power amplifier 16 and / or transmit modulation SIP encapsulation module 18 in each RF transmit link, or to regulate the operating status of the receive modulation SIP encapsulation module 19 in each RF receive link.

[0048] In this embodiment, each transmit modulation SIP package module 18 in the multi-channel RF transceiver component 10 can be designed using DPC (Direct Plating Copper) technology and packaged using BGA (Ball Grid Array) technology, consisting of a driver amplifier 181 and a transmit power modulation chip 182. The transmit power modulation chip 182 is used to modulate the operating voltage of the driver amplifier 181 (including the gate voltage and / or drain voltage of the driver amplifier 181) to regulate the actual driving performance of the corresponding driver amplifier 181 on the RF transmit link. At the same time, the transmit power modulation chip 182 can also be used to modulate the operating voltage of the power amplifier 16 in the corresponding RF transmit link (including the gate voltage and / or drain voltage of the corresponding power amplifier 16) to regulate the actual power amplifier performance of the corresponding power amplifier 16 on the RF transmit link.

[0049] For any transmit modulation SIP package module 18, the input terminal of the driver amplifier 181 included in the transmit modulation SIP package module 18 is connected to a single-channel RF transmit port of the multi-channel scheduling SIP package module 17 (e.g., Figure 3 The input of the driver amplifier 181 involved in the RF transceiver channel is connected to the TX1 port of the multi-channel scheduling SIP package module 17, and the output of the driver amplifier 181 is connected to the second port of the circulator 15 via a power amplifier 16.

[0050] In this embodiment, each receive modulation SIP package module 19 in the multi-channel RF transceiver component 10 can be designed using DPC technology and packaged using BGA technology with a low-noise amplifier 191, a limiter 192 and a receive power modulation chip 193. The receive power modulation chip 193 is used to modulate the operating voltage of the corresponding low-noise amplifier 191 and the limiter 192 to regulate the actual operating performance of the corresponding low-noise amplifier 191 and the limiter 192 on the RF receive link.

[0051] For any one of the receive modulation SIP package modules 19, the input of the limiter 192 included in the receive modulation SIP package module 19 is individually connected to the third port of the circulator 15, the output of the limiter 192 is connected to the input of the corresponding low noise amplifier 191, and the output of the low noise amplifier 191 is connected to a single-channel RF receiver port of the multi-channel scheduling SIP package module 17 (e.g., Figure 3 The output of the low-noise amplifier 191 involved in the mid-frequency transceiver channel 4 is connected to the RX4 port of the multi-channel scheduling SIP package module 17.

[0052] In this embodiment, the multi-channel scheduling SIP package module 17 in the multi-channel RF transceiver component 10 can be designed using DPC technology and packaged using BGA technology by a multi-channel amplitude and phase control chip 171 and multiple single-channel transceiver switching switches 172. Each single-channel transceiver switching switch 172 individually implements the switching operation function between the RF transmit link and the RF receive link under one RF transceiver channel. The multi-channel amplitude and phase control chip 171 can be used to perform signal amplitude modulation processing and / or signal phase modulation processing on the RF signals flowing through the multiple RF transceiver channels during RF signal transmission / reception. In addition, the multi-channel amplitude and phase control chip 171 can be used to regulate the working status of different transmit modulation SIP package modules 18 and / or receive modulation SIP package modules 19.

[0053] In the multi-channel scheduling SIP encapsulation module 17, the first stationary contact of each single-channel transceiver switch 172 serves as a single-channel RF transmit port, the second stationary contact of each single-channel transceiver switch 172 serves as a single-channel RF receive port, and the moving contact of each single-channel transceiver switch 172 is connected to a single-channel amplitude and phase control port of the multi-channel amplitude and phase control chip 171 (e.g., ...). Figure 3 Connect to any one of the AP1 to AP4 ports.

[0054] In one embodiment of this invention, the multi-channel amplitude and phase control chip 171 integrates multiple amplitude and phase modulation branches and a multi-channel power divider. Each branch of the multi-channel power divider is connected to one end of an amplitude and phase modulation branch. The other end of each amplitude and phase modulation branch serves as a single-channel amplitude and phase control port of the multi-channel amplitude and phase control chip 171, allowing each amplitude and phase modulation branch to independently perform amplitude modulation and / or phase modulation processing on the received or transmitted RF signal under a single RF transceiver channel. The converging end of the multi-channel power divider serves as the RF transmission port of the multi-channel amplitude and phase control chip 171 (i.e.,...). Figure 3 The RFT port of the multi-channel amplitude and phase control chip 171 (i.e., the multi-channel RF transceiver assembly 10) is connected to an external RF device via the RF main port connector 23 to realize the RF signal transmission function between the multi-channel amplitude and phase control chip 171 and the external RF device. The RF main port connector 23 is embedded on the outer surface of the metal housing 11 and extends into the internal support cavity before connecting to the multi-channel scheduling SIP package module 17; each amplitude and phase control branch can be integrated from a phase shifter, attenuator, and multiple signal amplifiers.

[0055] Therefore, this application improves the heat dissipation efficiency of the high-power transmit links by integrating the circulators 15 and power amplifiers 16 involved in each of the multiple high-power transmit links separately on the molybdenum-copper heat sink 14 within a sealed metal box. This allows the maximum operating efficiency of the bare chip to be fully utilized, thereby improving the operating efficiency of the transceiver components. At the same time, by using SIP packaging technology to package other RF devices of the transceiver components, except for the circulators 15 and power amplifiers 16, on the same circuit board within the sealed metal box, the overall integration of the transceiver components is improved, thereby reducing the RF line loss of the transceiver components. This allows for the reduction of the difficulty of rework by replacing the SIP packaged modules, thus ensuring that the multi-channel RF transceiver component 10 provided by this application has the characteristics of high integration, low line loss, low rework difficulty, high airtightness, and high operating efficiency.

[0056] Optionally, please refer to again Figure 1 and Figure 2In this embodiment, the multi-channel RF transceiver assembly 10 may further include a first low-frequency interface 21 and a second low-frequency interface 22 embedded on the outer surface of the metal housing 11. Both the first low-frequency interface 21 and the second low-frequency interface 22 extend into the internal support cavity and are electrically connected to the multi-channel scheduling SIP package module 17. The first low-frequency interface 21 is used to connect to an external power supply to power the multi-channel RF transceiver assembly 10. The second low-frequency interface 22 is used to receive externally input RF control signals for the multi-channel scheduling SIP package module 17, thereby regulating the operational status of the multi-channel scheduling SIP package module 17, the multiple transmit modulation SIP package modules 18, and the multiple receive modulation SIP package modules 19.

[0057] Optionally, please refer to the following: Figure 4 and Figure 5 ,in Figure 4 This is the second exploded view of the multi-channel radio frequency transceiver component 10 provided in the embodiments of this application. Figure 5 The metal box 11 provided in this application embodiment is in Figure 4 A schematic diagram of the decomposition observation in the example. In the embodiments of this application, as shown... Figure 5 (a) and Figure 5 As shown in (b), the metal box 11 may also include a sealing back plate 113 in addition to the metal cover plate 111 and the cavity structure 112. The cavity structure 112 has an auxiliary heat dissipation groove 115 on the second structure surface that is opposite to the surface of the first structure. The auxiliary heat dissipation groove 115 is separate from the device receiving groove 114. At the same time, the bottom shape of the auxiliary heat dissipation groove 115 matches the bottom shape of the device receiving groove 114 to completely surround the device receiving groove 114. When the sealing back plate 113 is covered and fixed to the second structure surface of the cavity structure 112, it can cooperate with the auxiliary heat dissipation groove 115 to form a heat dissipation auxiliary cavity surrounding the internal bearing cavity. This heat dissipation auxiliary cavity will be spaced apart from the internal bearing cavity.

[0058] At this time, phase change material 31 can be filled into the heat dissipation auxiliary cavity to assist in heat dissipation of each radio frequency device in the internal carrier cavity, thereby improving the heat dissipation efficiency of the transceiver component and facilitating the improvement of the working efficiency of the transceiver component.

[0059] Alternatively, please refer to Figure 6 , Figure 6This is the third exploded view of the multi-channel RF transceiver assembly 10 provided in this application embodiment. In this application embodiment, the multi-channel RF transceiver assembly 10 may further include multiple cavity partition covers 32 made of metal material. The multiple cavity partition covers 32 are all disposed in the internal support cavity, wherein each cavity partition cover 32 separately covers a molybdenum-copper heat sink 14 in the internal support cavity, so as to divide the internal support cavity into an approximately sealed cavity covering the molybdenum-copper heat sink 14. By utilizing the metallic properties of the corresponding cavity partition cover 32 and the cavity structure 112, the signal isolation and shielding effect of the power amplifier 16 on the molybdenum-copper heat sink 14 is achieved, thereby reducing the risk of self-oscillation of the power amplifier 16.

[0060] Optionally, in this embodiment, each nearly sealed cavity formed by the cavity partition cover plate 32 is covered with a microwave absorbing coating 33 (which is formed by preparing a microwave absorbing material) on the cavity sidewall to achieve anti-self-oscillation function for the power amplifier 16 in the nearly sealed cavity and improve the component stability of the multi-channel radio frequency transceiver assembly 10.

[0061] The above descriptions are merely various embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A multi-channel radio frequency transceiver component, characterized in that, The transceiver assembly includes a metal housing, a carrier circuit board, multiple RF antenna connectors, multiple molybdenum-copper heat sinks, multiple circulators, and multiple power amplifiers, as well as a multi-channel scheduling SIP package module, multiple transmit modulation SIP package modules, and multiple receive modulation SIP package modules deployed on the carrier circuit board; wherein each molybdenum-copper heat sink individually carries one circulator and one power amplifier; the multiple RF antenna connectors are all embedded on the outer surface of the metal housing and are individually connected to the first port of one of the circulators; The carrier circuit board is connected to the multiple molybdenum-copper heat sinks via a common ground and is installed in the internal carrier cavity of the metal housing; wherein, the multiple single-channel RF transmit ports of the multi-channel scheduling SIP package module are respectively connected to the second port of the circulator via a transmit modulation SIP package module and a power amplifier, and the multiple single-channel RF receive ports of the multi-channel scheduling SIP package module are respectively connected to the third port of the circulator via a receive modulation SIP package module.

2. The transceiver component according to claim 1, characterized in that, The metal box is also provided with a heat dissipation auxiliary cavity, which surrounds the internal support cavity and is spaced apart from the internal support cavity. The heat dissipation auxiliary cavity is filled with phase change material to assist in heat dissipation of various radio frequency devices within the internal carrier cavity.

3. The transceiver component according to claim 2, characterized in that, The metal housing includes a metal cover plate, a cavity structure, and a sealing back plate. The cavity structure has a device accommodating groove on the surface of a first structure and an auxiliary heat dissipation groove on the surface of a second structure that is opposite to the surface of the first structure. The auxiliary heat dissipation groove is separate from the device accommodating groove. The bottom shape of the auxiliary heat dissipation groove matches the bottom shape of the device accommodating groove to completely surround the device accommodating groove. The metal cover plate covers the surface of the first structural component of the cavity structure to cooperate with the device receiving groove to form the internal bearing cavity; The sealing back plate covers the surface of the second structural component of the cavity structure to cooperate with the auxiliary heat dissipation groove to form the heat dissipation auxiliary cavity.

4. The transceiver component according to claim 1, characterized in that, Multiple molybdenum-copper heat dissipation carrier plates are sintered and installed on the cavity sidewall of the internal support cavity to be connected to the metal box body. Multiple molybdenum-copper heat sinks are in contact with the carrier circuit board, and the contact surfaces between each molybdenum-copper heat sink and the carrier circuit board are electrically connected by conductive silver paste.

5. The transceiver component according to claim 1, characterized in that, The transceiver assembly also includes multiple cavity partition covers, all of which are disposed within the internal bearing cavity; Each cavity partition cover is individually covered with one of the molybdenum-copper heat sinks, so as to divide the internal supporting cavity into an approximately sealed cavity that covers the molybdenum-copper heat sink.

6. The transceiver component according to claim 5, characterized in that, Each of the near-sealed cavities has a wave-absorbing coating on its cavity sidewalls to provide anti-self-oscillation functionality for the power amplifiers within the near-sealed cavities.

7. The transceiver component according to any one of claims 1-6, characterized in that, Each of the transmit modulation SIP package modules is packaged with a driver amplifier and a transmit power modulation chip, wherein the transmit power modulation chip is used to modulate the operating voltage of the driver amplifier. The input terminal of the driver amplifier is connected to a single-channel RF transmit port of the multi-channel scheduling SIP package module, and the output terminal of the driver amplifier is connected to a second port of the circulator via a power amplifier.

8. The transceiver component according to any one of claims 1-6, characterized in that, Each of the receive modulation SIP package modules is packaged with a low-noise amplifier, a limiter and a receive power modulation chip, wherein the receive power modulation chip is used to modulate the operating voltage of the low-noise amplifier and the limiter respectively. The input of the limiter is connected to a third port of the circulator, the output of the limiter is connected to the input of the low-noise amplifier, and the output of the low-noise amplifier is connected to a single-channel RF receiver port of the multi-channel scheduling SIP package module.

9. The transceiver component according to any one of claims 1-6, characterized in that, The multi-channel scheduling SIP encapsulation module is encapsulated from a multi-channel amplitude and phase control chip and multiple single-channel transceiver switching switches. The first stationary contact of each single-channel transceiver switch serves as a single-channel RF transmitting port, the second stationary contact of each single-channel transceiver switch serves as a single-channel RF receiving port, and the moving contact of each single-channel transceiver switch is connected to a single-channel amplitude and phase control port of the multi-channel amplitude and phase control chip.

10. The transceiver component according to any one of claims 1-6, characterized in that, The transceiver assembly also includes a first low-frequency interface, a second low-frequency interface, and an RF main port connector embedded on the outer surface of the metal housing. The first low-frequency interface, the second low-frequency interface, and the RF main port connector are all electrically connected to the multi-channel scheduling SIP package module. The first low-frequency interface is used to connect an external power supply, the second low-frequency interface is used to receive RF control signals for the multi-channel scheduling SIP package module, and the RF main port connector is used to connect an external RF device to realize the RF signal transmission function between the transceiver component and the external RF device.

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