Solar cell printing line
By integrating the drying equipment into a three-layer structure and optimizing the equipment layout, the problems of large space occupation and high energy consumption in solar cell printing lines have been solved, achieving more efficient production and quality control.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TONGWEI SOLAR ENERGY (MEISHAN) CO LTD
- Filing Date
- 2025-06-24
- Publication Date
- 2026-06-12
AI Technical Summary
Existing solar cell printing lines occupy a large space and consume a lot of energy, resulting in insufficient utilization of production line space and waste of energy.
The three chambers of the drying equipment are integrated into a three-layer device along the height direction. The integrated design and the use of a flipping mechanism to automatically switch the silicon wafer surface reduce manual flipping. The slurry feeding pipe is shared, and a buffer device and lifting mechanism are set up to optimize the equipment layout and operation process.
It saves production line space, reduces energy consumption, improves production efficiency and silicon wafer quality, reduces manual monitoring time, and ensures printing quality.
Smart Images
Figure CN224348586U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of solar cell silicon wafer production, and more particularly to a solar cell printing line. Background Technology
[0002] Silicon wafer printing lines are essential equipment used in the screen printing of silicon wafers. Silicon wafers for solar cells can be screen printed using these lines, allowing for the printing of intricate circuits on both the front and back sides. This process directs photogenerated electrons out of the cell, thus enabling the solar cell to convert electrical energy into electricity.
[0003] Currently, in the actual production process of silicon wafer printing lines, the silicon wafers need to undergo multiple circuit printing processes with long intervals and the drying process of conductive paste after printing. This not only occupies a large production line space, but also requires a lot of energy, which is not conducive to the space utilization of the production line and easily leads to energy waste. Utility Model Content
[0004] This application discloses a solar cell printing line that can save production line space and energy consumption.
[0005] To achieve the above objectives, this application discloses a solar cell printing line, comprising: a feeding mechanism, a first printing device, a second printing device, a third printing device, a fourth printing device, a flipping mechanism, and a drying device;
[0006] The feeding mechanism is used to receive and print silicon wafers;
[0007] The first printing device is located downstream of the feeding mechanism, and the first printing device is used to perform the first printing on the first surface of the silicon wafer;
[0008] The second printing device is located downstream of the first printing device, and the second printing device is used to perform a second printing on the first surface of the silicon wafer;
[0009] The third printing device is located downstream of the flipping mechanism, and the third printing device is used to perform a third printing on the second surface of the silicon wafer;
[0010] The fourth printing device is located downstream of the third printing device, and the fourth printing device is used to perform a fourth printing on the second surface of the silicon wafer.
[0011] The flipping mechanism is located downstream of the second printing equipment and is configured to flip the silicon wafer to switch the positions of the first and second surfaces of the silicon wafer.
[0012] The drying equipment is located downstream of the first printing equipment and between the first printing equipment and the second printing equipment. The drying equipment has a drying chamber, which includes a first chamber, a second chamber, and a third chamber arranged sequentially at intervals along the height direction of the first printing equipment. The first chamber is configured to dry the silicon wafer printed by the first printing equipment, the second chamber is configured to dry the silicon wafer printed by the second printing equipment, and the third chamber is configured to dry the silicon wafer printed by the third printing equipment.
[0013] As an alternative implementation, along the height direction of the first printing device, the third printing device is located above the first printing device and is disposed corresponding to the first printing device; and / or,
[0014] Along the height direction of the first printing device, the fourth printing device is located above the second printing device and is arranged correspondingly to the second printing device.
[0015] In one optional implementation, the first cavity is located between the first printing device and the second printing device, and the third cavity is located between the third printing device and the fourth printing device. The solar cell printing line further includes a first buffer device, a second buffer device, and a third buffer device, wherein the first buffer device is located downstream of the first cavity, the second buffer device is located upstream of the third printing device, and the third buffer device is located downstream of the third cavity.
[0016] Along the height direction of the first printing device, the third buffer device is located above the first buffer device and is configured correspondingly to the first buffer device, and the second buffer device is located above the feeding mechanism.
[0017] As an optional implementation, the solar cell printing line further includes a lifting mechanism, wherein multiple lifting mechanisms are provided and respectively located downstream of the second printing device 113, downstream of the second cavity of the drying device, and downstream of the fourth printing device 115.
[0018] As an optional implementation, both the first printing device and the third printing device are configured to print the first gate line of the silicon wafer, and the first printing device and the third printing device are provided with feed pipes that are interconnected.
[0019] Both the second printing device and the fourth printing device are configured to print the second gate line of the silicon wafer, and the second printing device and the fourth printing device are provided with feed pipes that are interconnected.
[0020] The first gate line and the second gate line are different gate lines.
[0021] As an optional implementation, the solar cell printing line further includes a platform layer having a first side and a second side opposite to each other. Along the height direction of the first printing equipment, the feeding mechanism, the first printing equipment, the first cavity, and the second printing equipment are all located on the first side of the platform layer, and the flipping mechanism, the third printing equipment, the second cavity, the third cavity, and the fourth printing equipment are all located on the second side of the platform layer.
[0022] As an alternative implementation, the solar cell printing line also includes an escalator configured to connect the ground to the platform layer.
[0023] As an optional implementation, the drying equipment includes: a chamber, multiple heating mechanisms, an air supply mechanism, and an exhaust mechanism;
[0024] The housing contains a first cavity, a second cavity, and a third cavity, and the housing is provided with vents that communicate with the first cavity, the second cavity, and the third cavity.
[0025] Multiple heating mechanisms are respectively disposed in the first cavity, the second cavity, and the third cavity, and the heating mechanisms are configured to dry the silicon wafers in the corresponding cavities;
[0026] The air supply mechanism is disposed above the third cavity, and the air supply mechanism is configured to supply air to the first cavity, the second cavity and the third cavity through the air hole;
[0027] The exhaust mechanism is disposed above the third cavity, and the exhaust mechanism is configured to exhaust air into the first cavity, the second cavity, and the third cavity through the air hole.
[0028] As an optional implementation, a temperature sensor is provided below the heating mechanism to detect the temperature inside the drying chamber.
[0029] Compared with the prior art, the beneficial effects of this application are:
[0030] This application provides a solar cell printing line comprising two layers of equipment. The first layer includes a feeding mechanism, a first printing device, a first cavity of a drying device, and a second printing device. The second layer includes a third printing device, a third cavity of a drying device, and a fourth printing device, with the second cavity of the drying device located between the two layers. The solar cell printing line disclosed in this application, by configuring the drying device with a first cavity, a second cavity, and a third cavity arranged sequentially along the height direction, allows the first cavity to dry the silicon wafers printed by the first printing device, the second cavity to dry the silicon wafers printed by the second printing device, and the third cavity to dry the silicon wafers printed by the third printing device. In other words, by integrating three drying cavities into the drying device, multiple separate drying devices are eliminated, saving space on the production line and shortening the production line layout length. Attached Figure Description
[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0032] Figure 1 This is a schematic diagram of the structure of the solar cell printing line disclosed in the embodiments of this application;
[0033] Figure 2 yes Figure 1 A magnified view of a section at point A in the middle;
[0034] Figure 3 yes Figure 1 A magnified view of a section at point B in the middle;
[0035] Figure 4 yes Figure 1 A magnified view of a section at point C;
[0036] Figure 5 This is an internal schematic diagram of the drying equipment disclosed in the embodiments of this application;
[0037] Figure 6 yes Figure 5 A diagram from another perspective;
[0038] Figure 7 yes Figure 6 A magnified view of a section at point D;
[0039] Figure 8 This is a schematic diagram of the structure of a solar cell printing line with a platform layer disclosed in the embodiments of this application;
[0040] Figure 9 yes Figure 8 A magnified view of a section at point E in the middle.
[0041] Explanation of reference numerals in the attached figures:
[0042] 1-Solar cell printing line; 111-Feeding mechanism; 112-First printing equipment; 1121-Feeding pipe; 113-Second printing equipment; 114-Third printing equipment; 115-Fourth printing equipment; 116-Tilting mechanism; 117-Drying equipment; 1171-First cavity; 1172-Second cavity; 1173-Third cavity; 1174-Box; 1175-Heating mechanism; 1176-Air supply mechanism; 1177-Exhaust mechanism; 1178-Temperature sensor; 118-First buffer device; 119-Second buffer device; 120-Third buffer device; 121-Lifting mechanism; 122-Platform layer; 1221-First side; 1222-Second side; 1223-Escalator. Detailed Implementation
[0043] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0044] In this application, the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.
[0045] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.
[0046] Furthermore, the terms "installation," "setting," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.
[0047] Furthermore, the terms "first," "second," "third," "fourth," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.
[0048] The silicon wafer in a solar cell is the core component of the solar cell. Its main function is to convert the photon energy in sunlight into electrical energy, achieving photoelectric conversion through the semiconductor properties. In order to output the electrical energy as current to an external circuit after photoelectric conversion, grid lines need to be formed on the silicon wafer to collect the current.
[0049] Currently, electrodes on silicon wafers are primarily formed using screen printing, specifically by pressing a conductive paste containing metal (such as silver or aluminum paste) through the mesh of a screen onto the surface of the silicon wafer. The precision of the screen printing process directly affects the precision of the resulting grid lines. For example, fine screen printing ensures that the conductive paste uniformly fills the mesh and is accurately printed onto the silicon wafer, forming continuous and uniform grid lines, thereby improving conductivity. However, if defects such as broken grid lines or incomplete printing occur during the printing process, it will lead to discontinuous grid lines or poor contact, increasing resistance and directly affecting conductivity. Therefore, on solar cell printing production lines, manual monitoring of the printing equipment is frequently required to ensure production quality.
[0050] In related technologies, the working positions of the various printing equipment in a solar cell printing line are relatively dispersed. This requires operators to expend a lot of physical strength and time to monitor the production status of different processes, which is not conducive to improving work efficiency and ensuring product quality.
[0051] Furthermore, since solar cells are typically printed on both sides, and the printed grid lines include main grids and sub-grids, the pastes used for the main grids and sub-grids are different. Specifically, the main grid primarily serves to connect the fine grids, collect current, and assist in welding, and needs to withstand the mechanical stress during the welding process. Non-burn-through pastes do not penetrate the passivation layer on the silicon wafer surface during sintering; instead, they bind the silver powder together through the curing of an organic system, forming a conductive network. When used for printing main grids, this results in higher mechanical strength and better welding performance.
[0052] The main function of the secondary gate is to collect photocurrent and transfer it to the primary gate, requiring good electrical contact with the silicon wafer surface. The burn-through paste contains glass powder, which reacts chemically with the passivation layer during sintering, penetrating the passivation layer and forming good ohmic contact with the underlying silicon substrate. When used as a secondary gate, this ensures effective current collection and transmission.
[0053] This paste application method not only maintains the integrity of the passivation layer at the main gate, helping to improve the open-circuit voltage, but also penetrates the passivation layer at the secondary gate to form a good ohmic contact with the silicon substrate, reducing contact resistance and improving current collection efficiency. At the same time, since non-burn-through pastes are generally less expensive, the amount of silver used can be reduced, thereby lowering production costs.
[0054] Therefore, related technologies often require four printing processes during printing, and to ensure the quality of the printed grid lines, a drying operation is required after each printing process. These technologies necessitate at least three drying devices, each positioned after each printing process, to facilitate drying after each printing step.
[0055] However, this setup requires a large number of drying devices and occupies a significant amount of production line space, resulting in a longer overall solar cell printing line design, which is not conducive to space saving. Furthermore, because the drying devices are distributed across different locations, each printing cycle requires a separate drying unit, leading to high electricity consumption and hindering energy conservation.
[0056] Based on this, this application discloses a solar cell printing line, which aims to improve the original linear printing line into a vertically layered printing line, facilitating operator monitoring of the printing equipment and ensuring the quality of silicon wafer printing. Specifically, the original three drying chambers are integrated into a drying device with three drying chambers along the height direction. During operation, the three drying chambers inside the device can be heated simultaneously, improving heating efficiency. Furthermore, by reducing the contact area between the drying chambers and the external environment, heat loss during the drying process is also reduced, resulting in energy savings.
[0057] The technical solution of this application will be further described below with reference to examples and accompanying drawings.
[0058] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of the solar cell printing line disclosed in the embodiments of this application.
[0059] This application provides a solar cell printing line 1, which can be applied to the production process of solar cells, specifically to the screen printing process of solar cells, to realize the grid line printing and drying operations of silicon wafers.
[0060] Specifically, the solar cell printing line 1 disclosed in this application includes: a feeding mechanism 111, a first printing device 112, a second printing device 113, a third printing device 114, a fourth printing device 115, a flipping mechanism 116, and a drying device 117.
[0061] The feeding mechanism 111 is used to receive the silicon wafer to be printed. The first printing equipment 112 is located downstream of the feeding mechanism 111 and is used to perform the first printing on the first surface of the silicon wafer.
[0062] The second printing device 113 is located downstream of the first printing device 112, and the second printing device 113 is used to perform a second printing on the first surface of the silicon wafer.
[0063] The third printing device 114 is located downstream of the flipping mechanism 116 and is used to perform a third printing on the second surface of the silicon wafer.
[0064] The fourth printing device 115 is located downstream of the third printing device 114, and the fourth printing device 115 is used to perform a fourth printing on the second surface of the silicon wafer.
[0065] The flipping mechanism 116 is located downstream of the second printing equipment 113 and is configured to flip the silicon wafer to switch the positions of the first and second surfaces of the silicon wafer.
[0066] The drying device 117 is located downstream of the first printing device 112 and between the first printing device 112 and the second printing device 113. The drying device 117 has a drying chamber, which includes a first chamber 1171, a second chamber 1172, and a third chamber 1173 arranged sequentially at intervals along the height direction of the first printing device 112. The first chamber 1171 is configured to dry the silicon wafers printed by the first printing device 112, the second chamber 1172 is configured to dry the silicon wafers printed by the second printing device 113, and the third chamber 1173 is configured to dry the silicon wafers printed by the third printing device 114.
[0067] It is understandable that the solar cell can be a Topcon (Tunnel Oxide Passivated Contact). Therefore, when printing grid lines on the silicon wafer, grid lines are usually printed on both the front and back sides of the silicon wafer to collect and export photogenerated electrons, thereby realizing power output.
[0068] That is, the first and second surfaces mentioned above can be the front and back sides of the silicon wafer. For example, the first surface can be the front side of the silicon wafer, or it can be the back side of the silicon wafer. Similarly, the second surface mentioned above can be the back side of the silicon wafer, or it can be the front side of the silicon wafer.
[0069] The solar cell printing line 1 disclosed in this application integrates the three drying chambers originally required into a single drying device 117 with three drying chambers along the height direction, making it easier for operators to uniformly control the internal temperature of the drying chambers, ensuring that the internal temperature of each heating chamber is the same and stable, which helps to improve the screen printing quality of silicon wafers.
[0070] It is understood that, as mentioned above, the solar cell of this application can be a Topcon cell. Therefore, two of the first printing equipment 112, the second printing equipment 113, the third printing equipment 114 and the fourth printing equipment 115 can be used to print the main grid, and the other two equipment can be used to print the sub-grid.
[0071] Considering that the silicon wafer is printed with gate lines on both the front and back sides, one of the first printing equipment 112 and the second printing equipment 113 is used to print, for example, the main gate on the front side, and the other is used to print the sub-gate on the front side. Correspondingly, one of the third printing equipment 114 and the fourth printing equipment 115 is used to print, for example, the main gate on the back side, and the other is used to print the sub-gate on the back side. This will be explained in detail later.
[0072] Please see Figure 2 , Figure 2 yes Figure 1 A magnified view of a portion at point A. In some embodiments, after the first printing equipment 112 and the second printing equipment 113 have completed printing on the first surface of the silicon wafer, the silicon wafer can be flipped using the flipping mechanism 116, switching the positions of the first and second surfaces. This allows the third printing equipment 114 and the fourth printing equipment 115 to print on the second surface of the silicon wafer. In this way, the flipping mechanism 116 automatically switches the surface of the silicon wafer, eliminating the need for manual flipping. This reduces the time required for manual flipping and the potential contamination of the silicon wafer, thereby improving the overall efficiency of the printing line and the quality of the silicon wafer.
[0073] Optionally, the flipping mechanism 116 may include a motor and a clamping component (e.g., a clamp or a clamping plate). The output shaft of the motor is connected to the clamping component, which can be used to clamp the silicon wafer. Under the driving action of the motor, the output shaft of the motor drives the clamping component to flip, thereby realizing the flipping of the silicon wafer.
[0074] In some embodiments, along the height direction of the first printing apparatus 112, the third printing apparatus 114 is located above the first printing apparatus 112 and is disposed corresponding to the first printing apparatus 112. And / or, along the height direction of the first printing apparatus 112, the fourth printing apparatus 115 is located above the second printing apparatus 113 and is disposed corresponding to the second printing apparatus 113.
[0075] That is, along the height direction of the first printing equipment 112, the third printing equipment 114 is located above the first printing equipment 112 and is correspondingly arranged to the first printing equipment 112. Alternatively, along the height direction of the first printing equipment 112, the fourth printing equipment 115 is located above the second printing equipment 113 and is correspondingly arranged to the second printing equipment 113. Alternatively, along the height direction of the first printing equipment 112, the third printing equipment 114 is located above the first printing equipment 112 and is correspondingly arranged to the first printing equipment 112. And, along the height direction of the first printing equipment 112, the fourth printing equipment 115 is located above the second printing equipment 113 and is correspondingly arranged to the second printing equipment 113.
[0076] Considering the actual printing sequence, generally speaking, after the main gate and sub-gate on the first surface of the silicon wafer are printed, the silicon wafer is flipped over to print the main gate and sub-gate on the second surface.
[0077] Please see Figure 4 , Figure 4 yes Figure 1 A magnified view of a portion at point C. Therefore, by placing the third printing device 114 above the first printing device 112 and the fourth printing device 115 above the second printing device 113, the distance between the devices can be shortened. Furthermore, the first and third printing devices 112 and 114 can be configured to print the same type of grid lines. For example, the first and third printing devices 112 and 114 can both print the first grid lines (e.g., main grids), while the second and fourth printing devices 113 and 115 can print the second grid lines (e.g., sub-grids). This shortens the distance between the two devices when printing the same type of grid lines and allows the first and third printing devices 112 and 114 to share a single slurry feed pipe 1121. For instance, a single slurry feed pipe 1121 can be used to transport slurry to both devices, thereby reducing the number of devices in the solar cell printing line 1, lowering costs, and reducing space requirements. Similarly, the second printing equipment 113 and the fourth printing equipment 115 can also share a set of slurry feed pipe 1121, which will not be elaborated here.
[0078] In addition, by placing the third printing device 114 above the first printing device 112 and the fourth printing device 115 above the second printing device 113, operators can easily move to each printing device to check the printing status of the silicon wafers. For example, when moving to the first printing device 112, they can move to the third printing device 114 in terms of height, so that they can conduct centralized inspections. This not only saves the operator's physical strength and time, but also helps to ensure the printing quality of the silicon wafers due to timely and centralized inspections.
[0079] It is understandable that the printing paste used for the first grid line and the second grid line are different. When the first grid line is the main grid line, the first grid line can use a non-burn-through type paste, and when the second grid line is the sub-grid line, the second grid line can use a burn-through type paste.
[0080] In some embodiments, the first cavity 1171 is located between the first printing device 112 and the second printing device 113, and the third cavity 1173 is located between the third printing device 114 and the fourth printing device 115. That is, the first cavity 1171 can dry the silicon wafer printed by the first printing device 112, and then directly convey it to the second printing device 113 for the second printing pass; the third cavity 1173 can dry the silicon wafer printed by the third printing device 114, and then directly convey it to the fourth printing device 115 for the fourth printing pass. This shortens the transport path between the first cavity 1171 and the second printing device 113, saving space and improving transport efficiency.
[0081] On the other hand, setting the first printing equipment 112 and the second printing equipment 113 at the same height as the first cavity 1171 of the drying equipment 117, and setting the third printing equipment 114 and the fourth printing equipment 115 at the same height as the fourth cavity of the drying equipment 117, is beneficial to place the more important equipment of the solar cell printing line 1 at the same height. Operators can detect all equipment by moving back and forth between the two height positions, which facilitates the monitoring of the equipment operation and saves the time of operators moving between different positions.
[0082] In some embodiments, the solar cell printing line 1 further includes a first buffer device 118, a second buffer device 119, and a third buffer device 120. The first buffer device 118 is located downstream of the first cavity 1171, the second buffer device 119 is located upstream of the third printing device 114, and the third buffer device 120 is located downstream of the third cavity 1173. Along the height direction of the first printing device 112, the third buffer device 120 is located above the first buffer device 118 and is correspondingly arranged to the first buffer device 118, while the second buffer device 119 is located above the feeding mechanism 111.
[0083] Considering that some equipment may require maintenance during the silicon wafer printing process, and that maintenance may necessitate pausing the wafer conveying on the production line, if some wafers remain stuck in the drying chamber, they may be subjected to prolonged baking and potentially become unusable. Therefore, buffer devices can be installed downstream of each drying chamber. These buffer devices facilitate the timely removal of dried wafers from the drying equipment 117, preventing the continued heating of fully dried wafers within the drying chamber due to equipment malfunctions and resulting in wafer scrap. This allows the solar cell printing line 1 sufficient time to flexibly respond to potential equipment failures, ensuring stable wafer printing quality.
[0084] Furthermore, when some equipment malfunctions or shuts down, the silicon wafers can be temporarily stored in the buffer device without having to stop all the equipment on the entire solar cell printing line 1. After the equipment maintenance is completed, the silicon wafers can be moved directly from the buffer device to the downstream process, and the drying equipment 117 does not need to be restarted, saving heating time and greatly improving production efficiency.
[0085] Similarly, the buffer devices are all on the same plane at the same height as the equipment that operators need to focus on, which improves the operators' ability to monitor the equipment on the solar cell printing line 1.
[0086] Optionally, the buffer device can be in the form of a conveyor belt, which can transport the battery cells from one process to the next and achieve buffering during the transport process.
[0087] Please see Figure 3 , Figure 3 yes Figure 1 A partial enlarged view at point B. In some embodiments, the solar cell printing line 1 further includes a lifting mechanism 121. Multiple lifting mechanisms 121 are provided, respectively located downstream of the second printing device 113, downstream of the second cavity 1172 of the drying device 117, and downstream of the fourth printing device 115. This lifting mechanism is used to lift the silicon wafer between the various devices at different heights.
[0088] By setting up a lifting mechanism 121 between different equipment height planes on the solar printing line, silicon wafers can be transferred between equipment at different heights. For example, this lifting mechanism can be used to lift silicon wafers from the second printing equipment 113 to the height of the second chamber 1172 of the drying equipment 117 for the drying process after the second printing process. After drying, the lifting mechanism 121 can lift the silicon wafers from the height of the second chamber 1172 to the height of the third printing equipment 114 for subsequent printing and drying processes. After the fourth printing process, the lifting mechanism 121 can send the silicon wafers back to the height plane of the second printing equipment 113, and then send them into the sintering furnace for sintering (the sintering furnace can be located at the same height as the second printing equipment).
[0089] Understandably, after the fourth printing process is completed, the lifting mechanism 121 can be connected to the sintering furnace so that the silicon wafer sintering process can be carried out directly after the grid line printing is completed.
[0090] The lifting mechanism 121 can be a lifting mechanism, for example, it can include a motor, a sprocket, a chain and a guide rail. The motor shaft is connected to the sprocket, and the chain is connected to the sprocket. Thus, the motor drives the sprocket to rotate, and the chain passes around the sprocket and is connected to the lifting plate used to carry the silicon wafer. As the sprocket rotates, the chain drives the lifting plate to move vertically along the guide rail, thereby realizing the vertical transfer of the silicon wafer between the various devices.
[0091] Of course, as another example, the lifting mechanism 121 may also include a motor, a synchronous pulley, a synchronous belt, and a guide rail. The motor shaft is connected to the synchronous pulley, and the synchronous belt is connected to the synchronous pulley around it. Thus, the motor drives the synchronous pulley, which in turn drives the synchronous belt. The synchronous belt is connected to the lifting plate relative to the outside of the synchronous pulley. As the synchronous pulley rotates, the synchronous belt drives the lifting plate, which carries the silicon wafer, to move vertically along the guide rail. This achieves the vertical transfer of silicon wafers between various devices to subsequent processes.
[0092] Please refer to the following: Figures 5 to 7 , Figure 5 This is a schematic diagram of the internal structure of the drying equipment 117 disclosed in the embodiments of this application. Figure 6 yes Figure 5 Another perspective diagram Figure 7 yes Figure 5 A partial enlarged view at point D. In some embodiments, the drying device 117 includes: a housing 1174, multiple heating mechanisms 1175, an air supply mechanism 1176, and an exhaust mechanism 1177.
[0093] The housing 1174 has a first cavity 1171, a second cavity 1172 and a third cavity 1173 inside, and the housing 1174 is provided with air vents that connect the first cavity 1171, the second cavity 1172 and the third cavity 1173.
[0094] Multiple heating mechanisms are respectively disposed in the first cavity 1171, the second cavity 1172 and the third cavity 1173, and the heating mechanism 1175 is configured to dry the silicon wafer in the corresponding cavity.
[0095] An air supply mechanism 1176 is disposed above the third cavity 1173, and is configured to supply air to the first cavity 1171, the second cavity 1172, and the third cavity 1173 through air vents. An exhaust mechanism 1177 is also disposed above the third cavity 1173, and is configured to exhaust air to the first cavity 1171, the second cavity 1172, and the third cavity 1173 through air vents.
[0096] The enclosure 1174 contains a first cavity 1171, a second cavity 1172, and a third cavity 1173. Each cavity is equipped with a heating mechanism 1175. These multiple heating mechanisms 1175 work together to raise the temperature inside each cavity of the enclosure 1174, effectively improving the heating efficiency of the enclosure 1174. Furthermore, the integration of all heating cavities within the enclosure 1174 facilitates centralized maintenance and repair by operators, reducing the time and difficulty of maintenance work.
[0097] In addition, the drying equipment 117 can simultaneously dry silicon wafers after different printing processes, improving the overall drying efficiency of the printing line and shortening the production cycle.
[0098] In addition, the multiple heating mechanisms 1175 are respectively set in each cavity, which can also ensure that the heat distribution in each cavity is uniform, so that the silicon wafer is heated evenly during the drying process, avoiding silicon wafer quality defects caused by local overheating or uneven drying.
[0099] Optionally, the heating mechanism 1175 may be an infrared heating lamp or an electric heating tube; this embodiment does not specifically limit this.
[0100] Optionally, the air supply mechanism 1176 and the exhaust mechanism 1177 can be axial flow fans. Axial flow fans can generate a large air volume, which can quickly introduce air into the housing 1174 or quickly exhaust the air inside the housing 1174, ensuring smooth airflow inside the housing 1174.
[0101] Optionally, a dust collection tray can be installed in the air supply direction of the air supply mechanism 1176 to block dust, particles, and other contaminants from entering the housing 1174 along with the airflow, thereby ensuring the cleanliness of the air inside the drying equipment 117 and reducing potential contamination of the silicon wafers. At the same time, the dust collection tray is convenient and flexible to place and use, facilitating maintenance and cleaning by operators. Of course, the filter element can also be a filter cartridge or other components installed in the air inlet direction of the air supply mechanism 1176.
[0102] As can be seen, the air supply mechanism 1176 and the exhaust mechanism 1177 can accelerate the flow of hot air inside the drying equipment 117. Specifically, the air supply mechanism 1176 can quickly and evenly deliver heated air into the drying chamber, allowing the hot air to fully contact the material and accelerate the evaporation of moisture. The exhaust mechanism 1177, on the other hand, promptly exhausts the hot and humid air, reducing the humidity inside the drying chamber and creating good ventilation circulation, thereby improving drying efficiency.
[0103] In some embodiments, a temperature sensor 1178 is provided below the heating mechanism 1175 to detect the temperature inside the drying chamber. By setting the temperature sensor 1178, the temperature inside the drying chamber can be monitored in real time, and the data can be fed back to the control unit electrically connected to it. This allows the heating mechanism 1175 to adjust according to the deviation between the actual temperature and the set temperature, ensuring that the temperature inside the chamber is always kept within the optimal drying range, thereby improving the drying quality of the silicon wafers.
[0104] Understandably, please refer to Figure 8 and Figure 9 , Figure 8 This application discloses a schematic diagram of the structure of a solar cell printing line 1 having a platform layer 122. Figure 9 yes Figure 8 A magnified view of a section at point E in the middle.
[0105] In some embodiments, the solar cell printing line 1 further includes a platform layer 122, which has a first side 1221 and a second side 1222 opposite to each other. Along the height direction of the first printing device 112, the feeding mechanism 111, the first printing device 112, the first cavity 1171 and the second printing device 113 are all located on the first side 1221 of the platform layer 122, and the flipping mechanism 116, the third printing device 114, the second cavity 1172, the third cavity 1173 and the fourth printing device 115 are all located on the second side 1222 of the platform layer 122.
[0106] This layout allows operators to more easily monitor and manage equipment on the same side, promptly identifying and addressing problems that arise during production to ensure smooth operation. Furthermore, when equipment requires maintenance or repair, operators can manage multiple related devices on the same side, reducing the time and complexity of maintenance work.
[0107] Optionally, the platform layer 122 of this solar cell printing line 1 is designed with a certain gap between itself and the ground, so that the equipment located on the first side 1221 of the platform layer 122 has enough space for installation, debugging and maintenance, avoiding the problem of difficulty in daily work activities or inconvenience in maintenance caused by insufficient space.
[0108] In some embodiments, the solar cell printing line also includes an escalator 1223, with both ends of the escalator 1223 connected to the platform layer 122 and the ground, respectively. The escalator 1223 is configured to connect the ground and the platform layer 122, providing operators with walking space from the ground to the platform layer 122.
[0109] The following is a brief description of the equipment inspection process performed by operators on the solar cell printing line 1 using this application:
[0110] In the height direction of the first printing device 112, the feeding mechanism 111, the first printing device 112, the first cavity 1171, and the second printing device 113 are all located on the first side 1221 of the platform layer 122, while the flipping mechanism 116, the third printing device 114, the second cavity 1172, the third cavity 1173, and the fourth printing device 115 are all located on the second side 1222 of the platform layer 122. Operators can use the ladder 1223 connected to the platform layer 122 to travel between the first side 1221 and the second side 1222 of the platform layer 122 to quickly and conveniently monitor the printing devices in the same height direction. At the same time, the interval between the two double-layer printing devices is greatly shortened because the drying device 117 integrates the three drying cavities, saving operators time in monitoring the equipment.
[0111] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
Claims
1. A solar cell printing line, characterized in that, include: The feeding mechanism is used to receive silicon wafers for printing; The first printing device is located downstream of the feeding mechanism and is used to perform a first printing on the first surface of the silicon wafer. The second printing device is located downstream of the first printing device and is used to perform a second printing on the first surface of the silicon wafer; A flipping mechanism is disposed downstream of the second printing equipment and is configured to flip the silicon wafer to switch the positions of the first and second surfaces of the silicon wafer. The third printing device is located downstream of the flipping mechanism and is used to perform a third printing on the second surface of the silicon wafer; A fourth printing device, located downstream of the third printing device, is used to perform a fourth printing pass on the second surface of the silicon wafer; A drying device is provided downstream of the first printing device and located between the first printing device and the second printing device. The drying device has a drying chamber, which includes a first chamber, a second chamber, and a third chamber arranged sequentially at intervals along the height direction of the first printing device. The first chamber is configured to dry the silicon wafer printed by the first printing device, the second chamber is configured to dry the silicon wafer printed by the second printing device, and the third chamber is configured to dry the silicon wafer printed by the third printing device.
2. The solar cell printing line according to claim 1, characterized in that, Along the height direction of the first printing device, the third printing device is located above the first printing device and is correspondingly arranged to the first printing device; and / or, Along the height direction of the first printing device, the fourth printing device is located above the second printing device and is arranged correspondingly to the second printing device.
3. The solar cell printing line according to claim 2, characterized in that, The first cavity is located between the first printing device and the second printing device, and the third cavity is located between the third printing device and the fourth printing device.
4. The solar cell printing line according to claim 3, characterized in that, The solar cell printing line also includes a first buffer device, a second buffer device, and a third buffer device. The first buffer device is located downstream of the first cavity, the second buffer device is located upstream of the third printing device, and the third buffer device is located downstream of the third cavity. Along the height direction of the first printing device, the third buffer device is located above the first buffer device and is configured correspondingly to the first buffer device, and the second buffer device is located above the feeding mechanism.
5. The solar cell printing line according to any one of claims 2-4, characterized in that, The solar cell printing line also includes a lifting mechanism, and multiple lifting mechanisms are provided, respectively located downstream of the second printing equipment, downstream of the second cavity of the drying equipment, and downstream of the fourth printing equipment.
6. The solar cell printing line according to any one of claims 2-4, characterized in that, Both the first printing device and the third printing device are configured to print the first gate line of the silicon wafer, and the first printing device and the third printing device are provided with feed pipes that are interconnected. Both the second printing device and the fourth printing device are configured to print the second gate line of the silicon wafer, and the second printing device and the fourth printing device are provided with feed pipes that are interconnected. The first gate line and the second gate line are different gate lines.
7. The solar cell printing line according to any one of claims 1-4, characterized in that, The solar cell printing line also includes a platform layer, which has a first side and a second side. Along the height direction of the first printing equipment, the feeding mechanism, the first printing equipment, the first cavity, and the second printing equipment are all located on the first side of the platform layer, and the flipping mechanism, the third printing equipment, the second cavity, the third cavity, and the fourth printing equipment are all located on the second side of the platform layer.
8. The solar cell printing line according to claim 7, characterized in that, The solar cell printing line also includes an escalator configured to connect the ground to the platform layer.
9. The solar cell printing line according to any one of claims 1-4, characterized in that, The drying equipment includes: The housing has a first cavity, a second cavity, and a third cavity inside, and the housing has vents that communicate with the first cavity, the second cavity, and the third cavity. Multiple heating mechanisms are respectively disposed in the first cavity, the second cavity, and the third cavity, and the heating mechanisms are configured to dry the silicon wafers in the corresponding cavities; An air supply mechanism, disposed above the third cavity, is configured to supply air to the first cavity, the second cavity, and the third cavity through the air vents; and A ventilation mechanism is disposed above the third cavity, and the ventilation mechanism is configured to exhaust air into the first cavity, the second cavity, and the third cavity through the air vent.
10. The solar cell printing line according to claim 9, characterized in that, The chamber is also equipped with a temperature sensor located below the heating mechanism. The temperature sensor is used to detect the temperature inside the drying chamber.