A inclined air guide heat dissipation structure of a compact electromagnetic oven

Abstract

This utility model discloses a slanted airflow cooling structure for a compact induction cooker, comprising: an induction cooker body, a accommodating cavity at the lower part of the induction cooker body, the accommodating cavity including a first region with an air outlet and a second region with an air inlet, a cooling mechanism between the first region and the second region, the cooling mechanism including a first fan, a heat-conducting block with a slant on the air outlet side of the first fan, the slant facing the first fan, a first mounting position on the lower side of the slant, and a second mounting position on the upper side of the slant. This application achieves efficient cooling of two high-heat components—a bridge rectifier and an IGBT—by using a slanted heat-conducting block on the air outlet side of the first fan and cleverly utilizing the slanted space to arrange the first and second mounting positions, respectively. This allows for the coordinated cooling of two high-heat components by a single fan, achieving dual-target cooling through a single slanted structure, perfectly meeting the space-constrained requirements of ultra-thin, miniaturized induction cookers.

Description

Technical Field

[0001] This utility model relates to the field of induction cookers, and in particular to a slanted airflow heat dissipation structure for a compact induction cooker. Background Technology

[0002] As a highly efficient and clean modern kitchen appliance, the induction cooker works by using electromagnetic induction to generate eddy currents at the bottom of the cookware, causing it to heat up. Inside the induction cooker, electronic components generate a significant amount of heat during operation, especially the bridge rectifier responsible for converting alternating current to direct current and the insulated-gate bipolar transistor (IGBT), the core power switching element. These are the main heat sources within the induction cooker. With increasing consumer demand for miniaturized, portable, and desktop products, compact induction cooker designs are becoming increasingly popular. However, this compact design means extremely limited internal space, posing a significant challenge to heat dissipation of critical heating components. Poor heat dissipation directly leads to a sharp increase in the operating temperature of the bridge rectifier and IGBTs, which can range from affecting the stability of the induction cooker's power output and shortening component lifespan, to triggering overheat protection shutdowns or even component burnout, severely impacting product reliability and safety.

[0003] Compact induction cookers generally employ forced air cooling systems, which use cooling fans to draw in cool external air, which then flows over the surface of the heating elements to remove heat. However, existing cooling designs suffer from several problems: Common airflow designs are often simple or dispersed. The bridge rectifier and IGBTs, as the main heat sources, are typically positioned near the fan outlet. Due to a lack of effective airflow guidance, the airflow from the fan cannot be concentrated, efficiently directed, and simultaneously cover these two critical heating elements. Some airflow may be wasted in non-critical areas, while only certain areas of the bridge rectifier or IGBT may be effectively cooled, or even have "dead zones," resulting in poor overall cooling. To ensure sufficient airflow for both the bridge rectifier and IGBTs, traditional designs sometimes require relatively dispersed placement or more complex multi-channel structures, which undoubtedly occupies more valuable internal space, contradicting the goal of a compact design. Utility Model Content

[0004] The purpose of this invention is to provide a slanted airflow cooling structure for a compact induction cooker to solve the above-mentioned problems.

[0005] According to one aspect of the present invention, a slanted airflow heat dissipation structure for a compact induction cooker is provided, comprising: an induction cooker body, wherein a receiving cavity is provided at the lower part of the induction cooker body, the receiving cavity including a first region with an air outlet and a second region with an air inlet, a heat dissipation mechanism being provided between the first region and the second region, the heat dissipation mechanism including a first fan, a heat-conducting block with an inclined surface being provided on the air outlet side of the first fan, the inclined surface facing the first fan, a first mounting position for mounting a bridge rectifier or IGBT being provided on the lower side of the inclined surface, and a second mounting position for mounting a bridge rectifier or IGBT being provided on the upper side of the inclined surface.

[0006] In some embodiments, the heat-conducting block is made of copper, aluminum, or silver.

[0007] In some embodiments, multiple heat dissipation grooves are provided on both sides of the inclined surface.

[0008] In some embodiments, a circuit board and an electromagnetic coil are provided in the first region.

[0009] In some embodiments, the heat dissipation mechanism further includes a second fan, the exhaust side of which faces the electromagnetic coil.

[0010] In some embodiments, the first fan is provided with an air guide shroud, the width of which on the air outlet side is equal to the width of the heat-conducting block.

[0011] In some implementations, a windbreak is provided between the first region and the second region.

[0012] Compared with the prior art, the beneficial effects of this application are as follows:

[0013] This application provides a sloping airflow cooling structure for a compact induction cooker. By setting a heat-conducting block with a slope on the air outlet side of the first fan, and cleverly utilizing the space of the slope to arrange the first and second mounting positions, the core heating components, a bridge rectifier and an IGBT, are respectively installed. This achieves efficient and coordinated cooling of two high-heat components by a single fan. The airflow generated by the first fan is forcibly guided by the slope, forming a "one wind, two blows" effect. The heat-conducting block itself has a certain heat capacity, which can absorb some of the heat from the components and accelerate the heat exchange of the airflow through the slope, forming a dual cooling mechanism of "air cooling + conduction". The bridge rectifier and IGBT are arranged in layers in the vertical direction using the space of the slope, breaking through the area occupied by the traditional horizontally dispersed layout, making the layout of key components highly integrated. Dual-target cooling is achieved through a single slope structure, perfectly meeting the space-constrained requirements of ultra-thin and miniaturized induction cookers. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0015] Figure 2 This is a schematic diagram of the structure of the accommodating cavity of this utility model;

[0016] Figure 3 This is a side view of the heat-conducting block of this utility model.

[0017] Figure 4 This is a three-dimensional structural diagram of the heat-conducting block of this utility model. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] refer to Figures 1 to 4 This application provides a slanted airflow heat dissipation structure for a compact induction cooker, comprising: an induction cooker body 1, a accommodating cavity at the lower part of the induction cooker body 1, the accommodating cavity including a first region 3 with an air outlet 2 and a second region 5 with an air inlet 4, a heat dissipation mechanism between the first region 3 and the second region 5, the heat dissipation mechanism including a first fan 6, a heat-conducting block 7 with an inclined surface on the air outlet side of the first fan 6, the inclined surface facing the first fan 6, a first mounting position 8 for mounting a bridge rectifier or IGBT on the lower side of the inclined surface, and a second mounting position 9 for mounting a bridge rectifier or IGBT on the upper side of the inclined surface.

[0020] Both the bridge rectifier and the IGBT can be installed in either the first mounting position 8 or the second mounting position 9; the specific installation location is not limited.

[0021] In some implementations, the heat-conducting block 7 is made of copper, aluminum, or silver, all of which have relatively high thermal conductivity.

[0022] In some embodiments, multiple heat dissipation grooves 10 are provided on both sides of the inclined surface to enhance the heat dissipation capacity of the heat-conducting block 7.

[0023] In some embodiments, a circuit board and an electromagnetic coil 11 are provided in the first region 3.

[0024] In some embodiments, the heat dissipation mechanism further includes a second fan 12, the exhaust side of which faces the electromagnetic coil 11.

[0025] In some embodiments, the first fan 6 is provided with an air guide shroud, the width of which is equal to the width of the heat-conducting block 7, to ensure that the air blown out by the first fan 6 can contact the heat-conducting block 7 to the greatest extent.

[0026] In some embodiments, a windbreak 13 is provided between the first region 3 and the second region 5.

[0027] This invention provides a sloping airflow cooling structure for a compact induction cooker. By setting a sloping heat-conducting block 7 on the air outlet side of the first fan 6, and cleverly utilizing the sloping space to arrange the first mounting position 8 and the second mounting position 9, the core heating components, bridge rectifier and IGBT, are respectively installed. This achieves efficient and coordinated cooling of two high-heat components by a single fan. The airflow generated by the first fan 6 is forcibly guided by the sloping surface, forming a "one wind, two blows" effect. The heat-conducting block 7 itself has a certain heat capacity, which can absorb some of the heat from the components and accelerate the heat exchange of the airflow through the sloping surface, forming a dual cooling mechanism of "air cooling + conduction". The bridge rectifier and IGBT are arranged in layers in the vertical direction using the sloping space, breaking through the area occupied by the traditional horizontally dispersed layout, making the layout of key components highly integrated. Dual-target cooling is achieved through a single sloping structure, perfectly meeting the space-constrained requirements of ultra-thin and miniaturized induction cookers.

[0028] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A slanted airflow cooling structure for a compact induction cooker, characterized in that, include: The induction cooker body has a accommodating cavity at its lower part. The accommodating cavity includes a first area with an air outlet and a second area with an air inlet. A heat dissipation mechanism is provided between the first area and the second area. The heat dissipation mechanism includes a first fan. A heat-conducting block with an inclined surface is provided on the air outlet side of the first fan. The inclined surface faces the first fan. A first mounting position for mounting a bridge rectifier or IGBT is provided on the lower side of the inclined surface. A second mounting position for mounting a bridge rectifier or IGBT is provided on the upper side of the inclined surface.

2. The inclined airflow cooling structure of the compact induction cooker according to claim 1, characterized in that, The heat-conducting block is made of copper, aluminum, or silver.

3. The inclined airflow cooling structure of the compact induction cooker according to claim 1, characterized in that, Multiple heat dissipation grooves are provided on both sides of the inclined surface.

4. The inclined airflow cooling structure of the compact induction cooker according to claim 1, characterized in that, A circuit board and an electromagnetic coil are provided in the first area.

5. The inclined airflow cooling structure of the compact induction cooker according to claim 4, characterized in that, The heat dissipation mechanism also includes a second fan, the exhaust side of which faces the electromagnetic coil.

6. The inclined airflow cooling structure of the compact induction cooker according to claim 1, characterized in that, The first fan is provided with an air guide shroud, the width of which on the air outlet side is equal to the width of the heat-conducting block.

7. The inclined airflow cooling structure of the compact induction cooker according to claim 1, characterized in that, A windbreak is installed between the first area and the second area.

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