Heat dissipation structure, electric control box and heating and ventilation equipment

Abstract

This application provides a heat dissipation structure, an electrical control box, and HVAC equipment. The heat dissipation structure includes a heat dissipation plate and heat dissipation channels. The heat dissipation plate includes a first plate and a second plate stacked together. The first plate has a first surface facing the second plate, and the second plate has a second surface facing the first plate. The heat dissipation channels are formed by a portion of the first plate surface and a portion of the second plate surface, and are used for the flow of heat exchange medium. The heat dissipation structure of this application has high heat dissipation efficiency and strong heat dissipation stability.

Description

Technical Field

[0001] This application relates to the field of air conditioning technology, and in particular to a heat dissipation structure, an electrical control box using the heat dissipation structure, and a heating and ventilation equipment using the electrical control box. Background Technology

[0002] The electrical control box of the outdoor unit of an air conditioner serves as the mounting carrier for core electrical components, integrating high-power electrical components such as compressor drivers and fan drivers. During long-term operation, the heat generated by these components can easily lead to performance degradation or even malfunction, thus requiring a heat sink structure for thermal management.

[0003] In related technologies, heat sinks are typically fixed to the surface of the electrical control box housing, exchanging heat with the external environment through thermal conduction. Specifically, heat sinks often employ a single-layer metal plate structure, such as aluminum or aluminum alloy plates, with heat dissipation efficiency improved by adding heat dissipation fins, thermally conductive coatings, or perforations to their surface. In some solutions, thermally conductive silicone grease is filled between the heat sink and the electrical components to reduce contact thermal resistance, or a stamping process is used to create a localized uneven structure to increase the heat dissipation area.

[0004] However, due to their inherent shape limitations, the aforementioned heat sinks can only achieve planar heat dissipation in a single direction, leading to heat accumulation on their surface. Furthermore, relying on natural convection and ambient temperature, they are prone to thermal saturation under high loads or high temperatures. Consequently, the heat sinks exhibit low heat dissipation efficiency and poor heat dissipation stability. Utility Model Content

[0005] This application provides a heat dissipation structure, an electrical control box, and HVAC equipment. The heat dissipation structure has high heat dissipation efficiency and strong heat dissipation stability.

[0006] In a first aspect, this application provides a heat dissipation structure, including a heat dissipation plate and a heat dissipation channel. The heat dissipation plate includes a first plate and a second plate stacked together. The first plate has a first plate surface facing the second plate, and the second plate has a second plate surface facing the first plate. The heat dissipation channel is formed by a portion of the first plate surface and a portion of the second plate surface, and the heat dissipation channel is used for the flow of heat exchange medium.

[0007] As an optional implementation, the heat dissipation structure provided in this application further includes an inlet pipe and an outlet pipe; the heat dissipation channel has an inlet hole and an outlet hole arranged at intervals, the inlet pipe is connected to the inlet hole, and the outlet pipe is connected to the outlet hole.

[0008] As an optional implementation, the heat dissipation structure provided in this application further includes two pipe connectors, which are connected to the first plate or the second plate; wherein, the liquid inlet pipe is connected to the liquid inlet hole through a pipe connector, and the liquid outlet hole is connected to the liquid outlet pipe through a pipe connector.

[0009] As an optional implementation, a channel is formed inside the pipe connector; in the pipe connector connected to the inlet pipe, the first end of the channel is connected to the inlet hole, and the second end of the channel is connected to the inlet pipe; in the pipe connector connected to the outlet pipe, the first end of the channel is connected to the outlet hole, and the second end of the channel is connected to the outlet pipe.

[0010] As an optional implementation, the channel includes a first channel segment and a second channel segment that are perpendicular to each other and connected to each other; in the pipe connector connected to the inlet pipe, the first channel segment is connected to the inlet hole and the second channel segment is connected to the inlet pipe; in the pipe connector connected to the outlet pipe, the first channel segment is connected to the outlet hole and the second channel segment is connected to the outlet pipe.

[0011] As an optional implementation, the axial direction of both the liquid inlet and the liquid outlet is aligned with the thickness direction of the heat sink; in the pipe connector connected to the liquid inlet pipe, the extension direction of the first channel section is aligned with the axial direction of the liquid inlet; in the pipe connector connected to the liquid outlet pipe, the extension direction of the second channel section is aligned with the axial direction of the liquid outlet.

[0012] As an optional implementation, a flow channel groove is provided on the first plate surface, and the second plate surface and the flow channel groove are enclosed to form a heat dissipation flow channel.

[0013] As an optional implementation, the liquid inlet and liquid outlet are formed on the second plate and penetrate through the second plate; the flow channel groove has a liquid inlet section and a liquid outlet section, the liquid inlet section is opposite to the liquid inlet and the shape is adapted, and the liquid outlet section is opposite to the liquid outlet and the shape is adapted.

[0014] As an optional implementation, the thickness of the first plate is greater than the thickness of the second plate.

[0015] As an optional implementation, a flow channel groove is provided on the second plate surface, and the first plate surface and the flow channel groove are enclosed to form a heat dissipation flow channel.

[0016] As an optional implementation, the liquid inlet and liquid outlet are formed on the first plate and penetrate through the first plate; the flow channel groove has a liquid inlet section and a liquid outlet section, the liquid inlet section is opposite to the liquid inlet and the shape is adapted, and the liquid outlet section is opposite to the liquid outlet and the shape is adapted.

[0017] As an optional implementation, the thickness of the second plate is greater than the thickness of the first plate.

[0018] As an optional implementation, the longitudinal cross-sectional shape of the heat dissipation channel is semi-circular.

[0019] As an optional implementation, a first flow channel groove is provided on the first plate surface, and a second flow channel groove is provided on the second plate surface opposite to the first flow channel groove; wherein, the first flow channel groove and the second flow channel groove are engaged together to form a heat dissipation flow channel.

[0020] As an alternative implementation, the thickness of the first plate is equal to the thickness of the second plate.

[0021] As an optional implementation, the longitudinal cross-sectional shape of the heat dissipation channel is circular or elliptical.

[0022] As an optional implementation, the inlet hole is located below the outlet hole.

[0023] As an optional implementation, the heat sink is defined to have a first extending direction and a second extending direction that are perpendicular to each other, both of which are perpendicular to the thickness direction of the heat sink; the dimension of the heat sink in the first extending direction is larger than the dimension of the heat sink in the second extending direction; wherein, the heat dissipation channel includes an inlet channel section, a plurality of first channel sections, a plurality of second channel sections, and an outlet channel section, the first end of the inlet channel section forms an inlet hole, and the second end of the inlet channel section is connected to a first channel section; the plurality of first channel sections are arranged at intervals along the first extending direction, and two adjacent first channel sections are connected by a second channel section; the first end of the outlet channel section is connected to a second channel section, and the second end of the outlet channel section forms an outlet hole.

[0024] As an alternative implementation, the first flow channel section extends along the second extension direction.

[0025] As an optional implementation, the second flow channel section extends along the first extension direction.

[0026] As an alternative implementation, at least one bend is formed on the second flow channel section.

[0027] As an optional implementation, the bending portion is an arc-shaped bending portion.

[0028] As an alternative implementation, the liquid outlet flow channel section extends along the second extension direction.

[0029] As an optional implementation, the heat dissipation channel is a spiral heat dissipation channel.

[0030] As an optional implementation, the first plate and the second plate are welded together; the heat dissipation structure also includes a positioning component for defining the relative position between the first plate and the second plate.

[0031] As an optional implementation, the positioning assembly includes a positioning pin, a first positioning hole on a first plate, and a second positioning hole on a second plate corresponding to the first positioning hole; the positioning pin passes through the first positioning hole and the second positioning hole to assemble the first plate and the second plate together.

[0032] As an optional implementation, the first plate has a second sealing plate surface disposed opposite to the first plate surface, and the first plate surface and the second sealing plate surface are connected by a plurality of sequentially connected first side surfaces; the second plate has a first sealing plate surface disposed opposite to the second plate surface, and the second plate surface and the first sealing plate surface are connected by a plurality of sequentially connected second side surfaces, and the plurality of second side surfaces are disposed in one-to-one correspondence with the plurality of first side surfaces; wherein, at least one first side surface and the corresponding second side surface are on the same plane.

[0033] As an optional implementation, a stop portion is provided on the heat sink plate to prevent liquid outside the heat sink plate from flowing to the heat sink plate.

[0034] As an optional implementation, the stop portion is a raised rib provided on the outer edge of the heat sink, and the raised rib extends in a closed shape along the circumference of the heat sink.

[0035] As an alternative implementation, the stop portion is a groove provided on the outer edge of the heat sink, and the groove extends in a closed shape along the circumference of the heat sink.

[0036] Secondly, this application provides an electrical control box, including a main box body, a first power module and the aforementioned heat dissipation structure; the heat dissipation structure is connected to the main box body and forms a first cavity with the main box body, and the first power module is disposed in the first cavity; wherein, the first power module is thermally connected to the heat dissipation structure.

[0037] As an optional implementation, the first power module includes at least one first power component and at least one second power component; the power of the first power component is greater than the power of the second power component, and the first power component and the second power component are configured with corresponding heat dissipation channels.

[0038] As an optional implementation, the volume of the heat dissipation channel corresponding to the first power component is greater than the volume of the heat dissipation channel corresponding to the second power component.

[0039] As an optional implementation, the longitudinal cross-sectional area of ​​the heat dissipation channel corresponding to the first power component is larger than the longitudinal cross-sectional area of ​​the heat dissipation channel corresponding to the second power component.

[0040] As an optional implementation, the extension length of the heat dissipation channel corresponding to the first power component is greater than the extension length of the heat dissipation channel corresponding to the second power component.

[0041] As an optional implementation, the first power module includes a drive board, which includes a first drive module and a second drive module. The first drive module is used to drive the compressor, and the second drive module is used to drive the fan. The heat sink is configured to receive the heat generated by the first drive module and / or the second drive module.

[0042] As an optional implementation, both the first drive module and the second drive module are attached to the heat sink.

[0043] As an optional implementation, the main body includes a first enclosure plate and a first main board connected together, with the first enclosure plate connected to a heat sink plate; the heat sink plate, the first enclosure plate, and the first main board together enclose a first cavity.

[0044] As an optional implementation, the first enclosure plate and the first main plate are an integral structure.

[0045] As an optional implementation, the electrical control box provided in this application further includes a second power module; the main box also includes a second enclosure plate and a second main board connected to each other, the second enclosure plate and the first enclosure plate are respectively connected to opposite sides of the heat sink, and the heat sink, the second enclosure plate and the second main board together enclose a second cavity; wherein, the second power module is disposed in the second cavity.

[0046] As an optional implementation, the second enclosure and the second main board are an integral structure.

[0047] As an optional implementation, the second power module includes a filter board and a reactor, the filter board including a common-mode inductor; both the common-mode inductor and the reactor are attached to a heat sink.

[0048] As an optional implementation, the electrical control box provided in this application further includes a power terminal block; the heat sink includes a main body and a first connecting portion connected to the main body, the main body forming a heat dissipation channel, and the power terminal block is installed on the first connecting portion; the first end of the power terminal block extends into the second cavity and is electrically connected to the second power module; the second end of the power terminal block and the first cavity are located on the same side of the heat sink, and the power terminal block is located outside the first cavity, and the second end of the power terminal block is used for electrical connection with an external power cord; wherein, a first blocking groove is provided on the first connecting portion, and the first blocking groove is located between the main body and the power terminal block.

[0049] As an optional implementation, the electrical control box provided in this application further includes a third power module. The main box body has a height direction and a thickness direction. The main box body also includes a third enclosure plate, a third main board, and a box cover. The third main board and the box cover are both connected to the third enclosure plate. The third enclosure plate and the third main board are both connected to the first enclosure plate. The third main board and the first main board are arranged at intervals in the height direction and at intervals in the thickness direction. A portion of the first enclosure plate, the third enclosure plate, the third main board, and the box cover together form a third cavity, and the third power module is disposed in the third cavity.

[0050] As an optional implementation, the third enclosure, the third main board, and the first enclosure are an integral structure.

[0051] As an optional implementation, the third power module is the main control module.

[0052] As an optional implementation, the heat sink includes a main body and a second connecting portion connected to the main body. The main body forms a heat dissipation channel, and the second connecting portion is connected to a third main board. The second connecting portion is provided with a second blocking groove, which is located between the main body and the third power module.

[0053] Thirdly, this application provides a heating and ventilation device, including a housing and the aforementioned electrical control box, wherein the electrical control box is installed inside the housing; the housing has an access port, and the first main board of the electrical control box is disposed facing the access port.

[0054] The heat dissipation structure, electrical control box, and HVAC equipment provided in this application include a heat dissipation plate and a heat dissipation channel. The heat dissipation plate includes a first plate and a second plate stacked together. The first plate has a first plate surface facing the second plate, and the second plate has a second plate surface facing the first plate. A portion of the first plate surface and a portion of the second plate surface enclose each other to form a heat dissipation channel for the flow of heat exchange medium.

[0055] This overcomes the limitations of unidirectional heat dissipation in related technologies. By utilizing the three-dimensional heat dissipation channel between the first and second plates to guide the active flow of the heat exchange medium, static heat conduction is transformed into dynamic convection heat dissipation, thereby improving the efficiency of heat transfer from electrical components to the external environment.

[0056] Secondly, the heat exchange medium that flows continuously within the heat dissipation channel can quickly remove the heat accumulated inside the heat sink, which to some extent avoids the performance degradation caused by thermal saturation in planar heat dissipation in related technologies. Especially under high temperature or high load conditions, it can maintain stable heat dissipation capacity through forced convection.

[0057] Furthermore, the heat dissipation channel formed by the enclosing part of the first plate and part of the second plate increases the heat dissipation area and achieves uniform diffusion and efficient transfer of heat through the optimization of the medium flow path. Compared with the surface improvement of fins or coatings in related technologies, the heat dissipation structure provided in this application reconstructs the heat dissipation mechanism from the heat conduction path, thereby enhancing the reliability of the electrical control box and HVAC equipment while improving heat dissipation efficiency. Attached Figure Description

[0058] Figure 1 A three-dimensional structural diagram of a first partial structure of the electrical control box provided in an embodiment of this application;

[0059] Figure 2 for Figure 1 The diagram shown is a structural schematic along direction A.

[0060] Figure 3 for Figure 1 A schematic diagram of the structure shown along direction B;

[0061] Figure 4 for Figure 1 A three-dimensional structural diagram of a partial structure shown;

[0062] Figure 5 A schematic diagram of a partial structure of the module board in the electrical control box provided in an embodiment of this application;

[0063] Figure 6 This is a schematic diagram of a partial structure of the HVAC equipment provided in an embodiment of this application;

[0064] Figure 7 An exploded view of a second partial structure of the electrical control box provided in an embodiment of this application;

[0065] Figure 8 for Figure 7 A structural diagram from another perspective;

[0066] Figure 9 This is a three-dimensional structural diagram of the heat dissipation structure provided in the embodiments of this application;

[0067] Figure 10 A three-dimensional structural diagram of the first plate in the heat dissipation structure provided in the embodiment of this application;

[0068] Figure 11 A three-dimensional structural diagram of the second plate in the heat dissipation structure provided in the embodiment of this application;

[0069] Figure 12 A three-dimensional structural diagram of the third partial structure of the electrical control box provided in an embodiment of this application;

[0070] Figure 13 A three-dimensional structural diagram of the pipe connector in the heat dissipation structure provided in the embodiments of this application;

[0071] Figure 14 This is a cross-sectional view of the pipe connector in the heat dissipation structure provided in the embodiment of this application.

[0072] Explanation of reference numerals in the attached figures:

[0073] 1. Module base plate; 2. Driver board; 3. Variable frequency drive cavity; 4. Main housing; 5. Heat dissipation structure;

[0074] 21. First drive module; 22. Second drive module; 31. First cavity; 41. First enclosure plate; 42. First main board; 43. Second enclosure plate; 44. Second main board; 45. Third enclosure plate; 46. Third main board; 47. Cover; 48. Hanging component; 49. Third cavity; 51. Heat sink; 52. Heat dissipation channel; 53. Liquid inlet pipe; 54. Liquid outlet pipe; 55. Pipe connector;

[0075] 511. First plate; 512. Second plate; 513. Plate body; 514. First connecting part; 515. Second connecting part; 521. Liquid inlet; 522. Liquid outlet; 523. Liquid inlet flow channel section; 524. First flow channel section; 525. Second flow channel section; 526. Liquid outlet flow channel section; 551. Channel; 552. Base; 553. Connecting part; 100. Shell;

[0076] 5111, First plate surface; 5112, Second sealing plate surface; 5113, Flow channel groove; 5114, Liquid inlet section; 5115, Liquid outlet section; 5116, First positioning hole; 5117, First side surface; 5121, Second plate surface; 5122, First sealing plate surface; 5123, Second positioning hole; 5124, Second side surface; 5131, First plate portion; 5132, Second plate portion; 5141, First blocking groove; 5142, First connecting sub-part; 5143, Second connecting sub-part; 5144, First groove section; 5145, Second groove Section; 5146, First connecting hole; 5147, First sub-groove; 5148, Second sub-groove; 5149, Third sub-groove; 5151, Second blocking groove; 5152, First sub-section; 5153, Second sub-section; 5154, Second connecting hole; 5155, First sub-segment; 5156, Second sub-segment; 5231, First liquid inlet section; 5232, First straight section; 5233, First inclined section; 5234, First liquid outlet section; 5251, Bend; 5511, First channel section; 5512, Second channel section; 1001, Inspection port. Detailed Implementation

[0077] Please combine Figures 1 to 4 , Figure 1 This is a three-dimensional structural diagram of a first partial structure of the electrical control box provided in an embodiment of this application. Figure 2 for Figure 1 The diagram shows the structure along direction A. Figure 3 for Figure 1 The diagram shown is a structural schematic along direction B. Figure 4 for Figure 1 A three-dimensional structural diagram of a partial structure shown.

[0078] As shown in the figure, this embodiment provides an electrical control box, including a box structure, a main control module, a frequency converter drive module, and a central module. The box structure forms an installation space to accommodate the main control module, the frequency converter drive module, and the central module.

[0079] The main control module includes a main control power supply board and a main control board that are electrically connected; the frequency conversion drive module includes a module board, a filter board and a reactor. The filter board and the reactor are both electrically connected to the module board. The module board includes a module base plate 1. The compressor, the main control power supply board and the filter board are all electrically connected to the module base plate 1. The filter board includes a filter base plate and a common mode inductor is provided on the filter base plate.

[0080] Please continue to combine Figure 5 , Figure 5 This is a schematic diagram of a partial structure of the module board in the electrical control box provided in this application embodiment. In order to realize the driving function of the frequency converter drive module, the module board also includes a drive board 2. The drive board 2 includes a first chip, a second chip, a first drive module 21 and a second drive module 22 disposed on the module substrate 1. The first chip and the first drive module 21 are used to drive the compressor, and the second chip and the second drive module 22 are used to drive the fan.

[0081] Of course, each module has its own specific functions. Specifically, the main control module receives user commands from the indoor unit (such as setting the temperature or operating mode) and real-time data from various sensors and valves transmitted from the central module (such as ambient temperature and pressure values). Through its built-in control algorithm, it dynamically calculates the required cooling or heating intensity and generates corresponding control signals. The inverter drive module receives commands from the main control module and converts the input DC power into adjustable AC power to control the compressor and / or fan speed. The central module transmits real-time data from various sensors and valves to the main control module and also distributes stable power to other components.

[0082] It should be noted that one module board can control two fans and one compressor, while an outdoor unit can be configured with more than two fans and more than one compressor. For example, if the outdoor unit is configured with four fans and two compressors, then the above-mentioned module board can be set to two. In this case, an electrical connection is required between the two module boards.

[0083] In related technologies, the main control module, frequency converter drive module, and central module are all housed in the same cavity. This arrangement has adverse effects on the electrical isolation between modules, the overall structural compactness of the control box, heat dissipation, wiring, and the overall connection of the outdoor unit.

[0084] Therefore, in this embodiment, the main control module, the frequency converter drive module, and the central module are placed in separate cavities. That is, the installation space can include a main control cavity (the third cavity 49 below), a frequency converter drive cavity 3, and a central cavity, with the main control module installed in the main control cavity, the frequency converter drive module installed in the frequency converter drive cavity 3, and the central module installed in the central cavity.

[0085] Understandably, since the central module needs to be connected to the system valve body, placing it near the valve body is beneficial for the overall installation layout of the electrical control box in the outdoor unit. Therefore, in some embodiments, the box structure may include a main box 4 and a second box that are independent of each other. The main box 4 forms the main control cavity and the frequency converter drive cavity 3, and the second box forms the central cavity.

[0086] Because the module board and the filter board have different electrical components, their power outputs differ significantly. Furthermore, during outdoor unit operation, the module board is more prone to malfunctions. Therefore, to achieve separation of strong and weak currents and to facilitate future maintenance of the electrical control box provided in this embodiment, the module board and the filter board can be housed in different cavities. In a specific implementation of this embodiment, the frequency converter drive cavity 3 may include a first cavity 31 and a second cavity (not shown in the figure), which are independent of each other. The first cavity 31 and the second cavity are arranged along the thickness direction of the main housing 4. The module board is installed in the first cavity 31, and the filter board is installed in the second cavity. The first cavity 31 is located closer to the inspection port 1001 of the housing 100 than the second cavity; that is, the first cavity 31 and the second cavity are arranged along the thickness direction of the main housing 4. This configuration, while taking into account the separation of strong and weak currents and facilitating maintenance, also improves the structural compactness of the electrical control box provided in this embodiment in both the width and height directions of the main box body compared to the flat design of module boards and filter boards in related technologies.

[0087] Regarding the positional relationship between the first cavity 31 and the main control cavity, the main control cavity and the first cavity 31 can be spaced apart and arranged side by side. This balances structural compactness with partitioned arrangement. Please continue to consider... Figure 6 , Figure 6 This is a schematic diagram of a partial structure of the HVAC equipment provided in this embodiment. Specifically, when the electrical control box provided in this embodiment is installed on the housing 100, with the side where the inspection port 1001 is located as the front of the housing 100, the first cavity 31 is located below the main control cavity and in front of the second cavity.

[0088] It should be noted that the thickness direction of the main box 4 mentioned above is parallel to... Figures 1 to 4 The XX axis direction is consistent with the width direction of the main box 4 mentioned above. Figures 1 to 4The YY axis direction is consistent with that of the main box 4 mentioned above, and the height direction of the main box 4 is consistent with that of the main box 4 mentioned above. Figures 1 to 4 The ZZ axes are aligned.

[0089] In other words, the module board and the filter board are respectively housed in two cavities arranged opposite to each other. In the specific implementation of this embodiment, there are two module boards, and both module boards need to be electrically connected to the filter board. If the areas of the two module boards that are electrically connected to the filter board can be arranged adjacent to each other, the filter board can be made smaller, thereby further improving the structural compactness of the electrical control box provided in this embodiment.

[0090] Based on this, in some optional embodiments, the two module boards are arranged symmetrically at the center, so that the areas of the two module boards that are electrically connected to the filter board can be concentrated in the same area, so as to facilitate the compact design of the electrical control box provided in this embodiment.

[0091] Understandably, the control box generates a significant amount of heat during the operation of the outdoor unit. Therefore, appropriate heat dissipation measures are typically implemented to cool the control box. Most related technologies utilize heat sinks, which are usually fixed to the surface of the control box housing and exchange heat with the external environment through thermal conduction. Specifically, heat sinks often employ a single-layer metal plate structure, such as aluminum or aluminum alloy plates, with surface enhancements such as fins, thermally conductive coatings, or perforations to improve heat dissipation efficiency. In some solutions, thermally conductive grease is filled between the heat sink and electrical components to reduce contact thermal resistance, or a stamping process is used to create a locally textured structure to increase the heat dissipation area.

[0092] However, due to their inherent shape limitations, the aforementioned heat sinks can only achieve planar heat dissipation in a single direction, leading to heat accumulation on their surface. Furthermore, relying on natural convection and ambient temperature, they are prone to thermal saturation under high loads or high temperatures. Consequently, the heat sinks exhibit low heat dissipation efficiency and poor heat dissipation stability.

[0093] Based on this, please continue to combine Figures 7 to 9 , Figure 7 This is an exploded view of a second partial structure of the electrical control box provided in an embodiment of this application. Figure 8 for Figure 7 A structural diagram from another perspective. Figure 9 This is a three-dimensional structural diagram of the heat dissipation structure provided in an embodiment of this application. This embodiment also provides a heat dissipation structure 5, which includes a heat sink 51 and heat dissipation channels 52. The heat sink 51 includes a first plate 511 and a second plate 512 stacked together.

[0094] Please continue to combine Figure 10 and Figure 11 , Figure 10This is a three-dimensional structural diagram of the first plate in the heat dissipation structure provided in the embodiment of this application. Figure 11 This is a three-dimensional structural diagram of the second plate in the heat dissipation structure provided in the embodiment of this application. Specifically, the first plate 511 has a first plate surface 5111 facing the second plate 512, and the second plate 512 has a second plate surface 5121 facing the first plate 511; the heat dissipation channel 52 is formed by a portion of the first plate surface 5111 and a portion of the second plate surface 5121, and the heat dissipation channel 52 is used for the flow of heat exchange medium. The heat exchange medium can be a refrigerant flowing in the system; here, the type of heat exchange medium is not specifically limited.

[0095] This overcomes the limitation of unidirectional heat dissipation in related technologies. By using the three-dimensional heat dissipation channel 52 between the first plate 511 and the second plate 512 to guide the active flow of the heat exchange medium, static heat conduction is transformed into dynamic convection heat dissipation, thereby improving the efficiency of heat transfer from electrical components to the external environment.

[0096] Secondly, the heat exchange medium that flows continuously within the heat dissipation channel 52 can quickly remove the heat accumulated inside the heat sink 51, which to some extent avoids the performance degradation caused by thermal saturation in planar heat dissipation in related technologies. Especially under high temperature or high load conditions, it can maintain stable heat dissipation capacity through forced convection.

[0097] Furthermore, the heat dissipation channel 52 formed by the enclosing part of the first plate surface 5111 and part of the second plate surface 5121 increases the heat dissipation area and achieves uniform diffusion and efficient transfer of heat through the optimization of the medium flow path. Compared with the surface improvement of fins or coatings in related technologies, the heat dissipation structure 5 provided in this embodiment reconstructs the heat dissipation mechanism from the heat conduction path, thereby enhancing the reliability of the electrical control box and HVAC equipment while improving heat dissipation efficiency.

[0098] Furthermore, the first plate 511 also has a second sealing plate surface 5112 disposed opposite to the first plate surface 5111, and the second plate 512 also has a first sealing plate surface 5122 disposed opposite to the second plate surface 5121.

[0099] The connection between the first plate 511 and the second plate 512 can be welding. If the relative positions of the first plate 511 and the second plate 512 can be determined before welding, the assembly efficiency of the first plate 511 and the second plate 512 can be improved.

[0100] Therefore, in some optional embodiments, the heat dissipation structure 5 further includes a positioning component for defining the relative position between the first plate 511 and the second plate 512. In this way, by providing the positioning component, the relative position of the first plate 511 and the second plate 512 can be defined before welding, thereby improving the welding efficiency of the first plate 511 and the second plate 512.

[0101] Specifically, the positioning assembly may include a positioning pin (not shown in the figure), a first positioning hole 5116 on the first plate 511, and a second positioning hole 5123 corresponding to the first positioning hole 5116 on the second plate 512. The positioning pin passes through the first positioning hole 5116 and the second positioning hole 5123 to assemble the first plate 511 and the second plate 512 together. In this way, the relative position of the first plate 511 and the second plate 512 can be defined before welding them together, thereby improving the efficiency of welding the first plate 511 and the second plate 512 together.

[0102] More specifically, the first plate surface 5111 and the second sealing plate surface 5112 are connected by a plurality of sequentially connected first side surfaces 5117; the second plate surface 5121 and the first sealing plate surface 5122 are connected by a plurality of sequentially connected second side surfaces 5124, and the plurality of second side surfaces 5124 are arranged in a one-to-one correspondence with the plurality of first side surfaces 5117. In this embodiment, both the first plate body 511 and the second plate body 512 are rectangular plates, that is, there are four first side surfaces 5117 and four second side surfaces 5124.

[0103] To minimize the volume occupied by the heat sink 51 and achieve a compact design for the overall control box, at least one first side 5117 and the corresponding second side 5124 are on the same plane. In other words, at least one edge of the first plate 511 is flush with the corresponding edge of the second plate 512. This reduces the space occupied by the heat sink 51 and improves the compactness of the control box provided in this embodiment.

[0104] In order to achieve heat dissipation of the power module inside the main body 4 of the electrical control box by the heat dissipation structure 5, in some specific embodiments, the main body 4 includes a first enclosure 41, a first main board 42, a second enclosure 43, a second main board 44, a third enclosure 45, a third main board 46 and a box cover 47 connected together. The first enclosure 41 and the second enclosure 43 are connected to opposite sides of the heat dissipation plate 51. In order to facilitate the disassembly and maintenance of the power module installed inside the main body 4 in the future, in this embodiment, the first main board 42 is set facing the inspection port 1001.

[0105] For ease of description, the part connected to the first plate 511 is designated as the first enclosure 41, and the part connected to the second plate 512 is designated as the second enclosure.

[0106] The first main board 42 is connected to the first surrounding plate 41. The second sealing plate surface 5112 of the first plate 511, the first surrounding plate 41, and the first main board 42 together form the first cavity 31. The second main board 44 is connected to the second surrounding plate 43. The first sealing plate surface 5122 of the second plate 512, the second surrounding plate 43, and the second main board 44 together form the second cavity. The third main board 46 and the box cover 47 are both connected to the third surrounding plate 45. The third surrounding plate 45 and the third main board 46 are both connected to the first surrounding plate 41. The third main board 46 and the first main board 42 are arranged at intervals in the height direction of the main box 4 and at intervals in the thickness direction of the main box 4. A portion of the first surrounding plate 41, the third surrounding plate 45, the third main board 46, and the box cover 47 together form the third cavity 49.

[0107] It should be noted that, in this embodiment, since the second plate 512 needs to be connected to the second enclosure 43, the dimension of the second plate 512 in the first extending direction is larger than the dimension of the first plate 511 in the first extending direction. Thus, in the specific implementation of this embodiment, the three first side surfaces 5117 and the corresponding three second side surfaces 5124 are on the same plane.

[0108] It is understandable that, since the first plate 511 is connected to the first enclosure 41 and the second plate 512 is connected to the second enclosure 43, a connection gap will be generated between the second sealing plate surface 5112 and the first enclosure 41, and between the first sealing plate surface 5122 and the second enclosure 43. External liquids may enter the first cavity 31 and / or the second cavity through the formed gaps.

[0109] To mitigate the aforementioned issues to some extent, in some optional embodiments, a stop (not shown in the figure) is provided on the heat sink 51 to prevent liquid from flowing from outside the heat sink 51 to the heat sink 51. This improves the sealing performance of the first cavity 31 and the second cavity, thereby enhancing the operational stability of the power module inside the control box.

[0110] In some optional embodiments, the stop portion is a raised rib provided on the outer edge of the heat sink 51, the raised rib extending circumferentially along the heat sink 51 in a closed shape; in other optional embodiments, the stop portion is a groove provided on the outer edge of the heat sink 51, the groove extending circumferentially along the heat sink 51 in a closed shape. Of course, the stop portion can also be other shapes, as long as the structure can achieve the function of stopping external liquids, the purpose of this embodiment can be achieved, and the shape of the stop portion is not specifically limited here.

[0111] Please continue to combine Figure 12 , Figure 12 This is a three-dimensional structural diagram of the third partial structure of the electrical control box provided in the embodiment of this application. In order to facilitate the processing and manufacturing of the main box 4, and to facilitate the installation and subsequent disassembly and maintenance of the power module installed in the main box 4, in some optional embodiments, the first enclosure plate 41, the first main board 42, the third enclosure plate 45 and the third main board 46 are an integral structure.

[0112] Furthermore, the second enclosure 43 and the second main board 44 are an integral structure, meaning that the second enclosure 43 and the second main board 44 can be connected to form a cover structure. This facilitates the manufacturing of the main box 4 and also makes it easier to install and disassemble.

[0113] The electrical control box provided in this embodiment can also be hung on the inner wall of the housing 100. Therefore, in this embodiment, the main housing 4 can also include a mounting piece 48 connected to the heat dissipation structure 5 and the back of the third motherboard 46. The first end of the mounting piece 48 is connected to the second plate 512 by screws or other threaded fasteners, and the second end of the mounting piece 48 extends to the top of the main housing 4 and is connected to the third enclosure 45.

[0114] To achieve effective heat dissipation for the frequency converter drive module, in some specific embodiments, both the first drive module 21 and the second drive module 22 are attached to the first plate 511, while the common-mode inductor and reactance are attached to the second plate 512. Thus, through direct contact between the first plate 511 and the first drive module 21, and between the first plate 511 and the second drive module 22, the heat generated by the first drive module 21 and the second drive module 22 can be directly transferred to the first plate 511, and then to the heat exchange medium flowing within the heat dissipation channel 52, thereby dissipating the heat generated by the first drive module 21 and the second drive module 22. Similarly, through direct contact between the second plate 512 and the common-mode inductor, and between the second plate 512 and the reactance, the heat generated by the common-mode inductor and the reactance can be directly transferred to the second plate 512, and then to the heat exchange medium flowing within the heat dissipation channel 52, thereby dissipating the heat generated by the common-mode inductor and the reactance.

[0115] As can be seen from the above, the first driving module 21, the first chip, the second driving module 22, and the second chip are all located in the first cavity 31. In order to achieve effective heat dissipation for the first driving module 21, the first chip, the second driving module 22, and the second chip, the first driving module 21, the first chip, the second driving module 22, and the second chip are all provided with heat dissipation channels 52.

[0116] It is understood that the power of the first driving module 21 is greater than the power of the first chip, and the power of the second driving module 22 is greater than the power of the second chip. Therefore, in order to further improve the heat dissipation effect on the driving board, in some embodiments, the volume of the heat dissipation channel 52 corresponding to the first driving module 21 is greater than the volume of the heat dissipation channel 52 corresponding to the first chip, and the volume of the heat dissipation channel 52 corresponding to the second driving module 22 is greater than the volume of the heat dissipation channel 52 corresponding to the second chip. This results in the flow rate of the heat exchange medium flowing through the location of the first driving module 21 being greater than the flow rate of the heat exchange medium flowing through the location of the first chip, and the flow rate of the heat exchange medium flowing through the location of the second driving module 22 being greater than the flow rate of the heat exchange medium flowing through the location of the second chip. Therefore, per unit time, the heat transferred from the first driving module 21 to the heat dissipation structure 5 is greater than the heat transferred from the first chip to the heat dissipation structure 5, and the heat transferred from the second driving module 22 to the heat dissipation structure 5 is greater than the heat transferred from the second chip to the heat dissipation structure 5. In this way, by matching the power, on the one hand, the heat dissipation of the components can be combined with the heat dissipation requirements of the components themselves, so as to avoid the loss of heat dissipation resources to a certain extent. On the other hand, high-efficiency heat dissipation can be achieved for both high-power and low-power components.

[0117] It should be noted that the first driving module 21 and the first chip mentioned above can be combinations of other components, and the second driving module 22 and the second chip can also be combinations of other components. For example, the component with higher power is referred to as the first power component, and the component with lower power is referred to as the second power component. The heat dissipation channels 52 corresponding to the first power component and the second power component are configured to meet the above requirements. Of course, the following limitations on the heat dissipation channels 52 corresponding to the first driving module 21 (second driving module 22) and the first chip (second chip) still apply.

[0118] Based on the power ratings of the first driving module 21 and the first chip, as well as the power ratings of the second driving module 22 and the second chip, in order to further achieve effective heat dissipation, in some optional embodiments, the longitudinal cross-sectional area of ​​the heat dissipation channel 52 corresponding to the first driving module 21 is greater than the longitudinal cross-sectional area of ​​the heat dissipation channel 52 corresponding to the first chip, and the longitudinal cross-sectional area of ​​the heat dissipation channel 52 corresponding to the second driving module 22 is greater than the longitudinal cross-sectional area of ​​the heat dissipation channel 52 corresponding to the second chip.

[0119] With this configuration, for both the first drive module 21 and the first chip, within the same timeframe, the heat exchange medium flows to the first position in the heat dissipation channel 52 corresponding to the first drive module 21, and to the second position in the heat dissipation channel 52 corresponding to the first chip. The flow rate of the heat exchange medium at the first position is greater than that at the second position. This allows more heat from the higher-power first drive module 21 to be transferred to the heat dissipation channel 52, while less heat from the lower-power first chip is transferred, thus improving the heat dissipation efficiency and adaptability of the heat dissipation structure 5.

[0120] For the second drive module 22 and the second chip, within the same time frame, the heat exchange medium flows to the first position in the heat dissipation channel 52 corresponding to the second drive module 22, and to the second position in the heat dissipation channel 52 corresponding to the second chip. The flow rate of the heat exchange medium at the first position is greater than that at the second position. This allows more heat from the higher-power second drive module 22 to be transferred to the heat dissipation channel 52, while less heat from the lower-power second chip is transferred, thus improving the heat dissipation efficiency and adaptability of the heat dissipation structure 5.

[0121] To further improve the heat dissipation effect on the components located within the first cavity 31, such as the high-power first driving module 21 and second driving module 22, and the low-power first chip and second chip, in some optional embodiments, the extension length of the heat dissipation channel 52 corresponding to the first driving module 21 is greater than the extension length of the heat dissipation channel 52 corresponding to the first chip, and the extension length of the heat dissipation channel 52 corresponding to the second driving module 22 is greater than the extension length of the heat dissipation channel 52 corresponding to the second chip.

[0122] With this configuration, the total flow rate of the heat exchange medium flowing through the heat dissipation channel 52 corresponding to the first driving module 21 is greater than the total flow rate of the heat exchange medium flowing through the heat dissipation channel 52 corresponding to the first chip, and the total flow rate of the heat exchange medium flowing through the heat dissipation channel 52 corresponding to the second driving module 22 is greater than the total flow rate of the heat exchange medium flowing through the heat dissipation channel 52 corresponding to the second chip. This ensures that the heat dissipation channel 52 corresponding to the first driving module 21 receives more heat than the heat dissipation channel 52 corresponding to the first chip, and the heat dissipation channel 52 corresponding to the second driving module 22 receives more heat than the heat dissipation channel 52 corresponding to the second chip, thereby improving the heat dissipation efficiency and adaptability of the heat dissipation structure 5.

[0123] To facilitate the inflow and outflow of the heat exchange medium into and from the heat dissipation channel 52, the heat dissipation structure 5 provided in this embodiment further includes an inlet pipe 53 and an outlet pipe 54. The heat dissipation channel 52 has an inlet hole 521 and an outlet hole 522 spaced apart. The inlet pipe 53 is connected to the inlet hole 521, and the outlet pipe 54 is connected to the outlet hole 522. This allows the heat exchange medium to flow into the heat dissipation channel 52 through the inlet pipe 53 and out of the heat dissipation channel 52 through the outlet pipe 54.

[0124] In some specific embodiments, in conjunction with other components or modules within the HVAC equipment, the relative positions of the inlet port 521 and the outlet port 522 can be defined to facilitate heat dissipation, provided that the flow of the heat exchange medium is convenient. Based on this, in some optional embodiments, the inlet port 521 can be located below the outlet port 522; that is, a portion of the inlet pipe 53 communicating with the inlet port 521 is located below a portion of the outlet pipe 54 communicating with the outlet port 522. This facilitates the layout of components or modules within the HVAC equipment.

[0125] It is understandable that, due to limitations in material and shape, the inlet pipe 53 is difficult to directly connect with the inlet hole 521, and the outlet pipe 54 is difficult to directly connect with the outlet hole 522. Therefore, in some optional embodiments, the heat dissipation structure 5 provided in this embodiment further includes two pipe connectors 55, which are connected to the first sealing plate surface 5122 or the second sealing plate surface 5112. In a specific embodiment of this embodiment, the pipe connectors 55 are connected to the second plate body 512.

[0126] The inlet pipe 53 and the inlet hole 521 are connected by a pipe connector 55, and the outlet hole 522 and the outlet pipe 54 are connected by a pipe connector 55. This allows the heat exchange medium to flow from the inlet pipe 53 into the heat dissipation channel 52 and from the heat dissipation channel 52 into the outlet pipe 54. Furthermore, the pipe connector 55 improves the smoothness of the heat exchange medium's flow.

[0127] Please continue to combine Figure 13 and Figure 14 , Figure 13 This is a three-dimensional structural diagram of the pipe connector in the heat dissipation structure provided in the embodiments of this application. Figure 14This is a cross-sectional view of the pipe connector in the heat dissipation structure provided in this application embodiment. A channel 551 is formed within the pipe connector 55. In the pipe connector 55 connected to the liquid inlet pipe 53, the first end of the channel 551 communicates with the liquid inlet hole 521, and the second end of the channel 551 communicates with the liquid inlet pipe 53. In the pipe connector 55 connected to the liquid outlet pipe 54, the first end of the channel 551 communicates with the liquid outlet hole 522, and the second end of the channel 551 communicates with the liquid outlet pipe 54. Thus, the liquid inlet pipe 53 and the heat dissipation channel 52 can be connected through the pipe connector 55, and the liquid outlet pipe 54 can be connected to the heat dissipation channel 52, thereby realizing the inflow and outflow of the heat exchange medium.

[0128] Since the outlet orientation of the liquid inlet pipe 53 is inconsistent with the orientation of the liquid inlet hole 521, and the inlet orientation of the liquid outlet pipe 54 is inconsistent with the orientation of the liquid outlet hole 522, the shape of the channel 551 needs to be defined in order to connect the liquid inlet pipe 53 with the heat dissipation channel 52 and the liquid outlet pipe 54 with the heat dissipation channel 52 through the channel 551.

[0129] In some embodiments, channel 551 includes a first channel segment 5511 and a second channel segment 5512 that are perpendicular to and connected to each other; in the pipe connector 55 connected to the inlet pipe 53, the first channel segment 5511 is connected to the inlet hole 521, and the second channel segment 5512 is connected to the inlet pipe 53; in the pipe connector 55 connected to the outlet pipe 54, the first channel segment 5511 is connected to the outlet hole 522, and the second channel segment 5512 is connected to the outlet pipe 54.

[0130] Furthermore, the pipe connector 55 includes a base 552 and a connecting portion 553 connected together. The base 552 is connected to a first sealing plate surface 5122 or a second sealing plate surface 5112. A portion of the first channel segment 5511 is formed on the base 552, and another portion is formed on the connecting portion 553. The second channel segment 5512 is formed on the connecting portion 553.

[0131] like Figure 11 As shown, in some embodiments, the axial direction of both the liquid inlet 521 and the liquid outlet 522 is aligned with the thickness direction of the heat sink 51. It should be noted that the thickness direction of the heat sink 51 is aligned with the thickness direction of the main housing 4, i.e. Figure 11 The XX axis direction in the diagram.

[0132] To improve the flow smoothness of the heat exchange medium from the inlet pipe 53 into the heat dissipation channel 52, and from the heat dissipation channel 52 out to the outlet pipe 54, in this embodiment, in the pipe connector 55 connected to the inlet pipe 53, the extension direction of the first channel section 5511 is consistent with the axial direction of the inlet hole 521; in the pipe connector 55 connected to the outlet pipe 54, the extension direction of the second channel section 5512 is consistent with the axial direction of the outlet hole 522. That is, during the flow of the heat exchange medium, the flow direction remains unchanged when the heat exchange medium flows from the inlet pipe 53 into the heat dissipation channel 52, and also remains unchanged when the heat exchange medium flows from the heat dissipation channel 52 out to the outlet pipe 54, thereby improving the smoothness of the heat exchange medium flow.

[0133] The shape of the heat dissipation channel 52 can be semi-circular, circular, or elliptical. When the shape of the heat dissipation channel 52 is semi-circular, there are two implementation methods for its formation; when the shape of the heat dissipation channel 52 is circular or elliptical, there is another implementation method. These will be described separately below.

[0134] When the shape of the heat dissipation channel 52 is semi-circular, please combine with Figure 10 and Figure 11 As shown, in one optional embodiment, a flow channel groove 5113 is provided on the first plate surface 5111, and the second plate surface 5121 and the flow channel groove 5113 enclose to form a heat dissipation flow channel 52. The base 552 of the pipe connector 55 is connected to the first sealing plate surface 5122. The inlet hole 521 and outlet hole 522 of the heat dissipation flow channel 52 are formed on the second plate body 512, penetrating the second plate body 512. An inlet groove section 5114 and an outlet groove section 5115 are formed on the flow channel groove 5113. The inlet groove section 5114 is opposite to the inlet hole 521 and its shape is adapted, and the outlet groove section 5115 is opposite to the outlet hole 522 and its shape is adapted.

[0135] In other words, the flow channel groove 5113 needs to be machined on the first plate 511, but not on the second plate 512. Therefore, this would affect the structural strength of the first plate 511. To mitigate the significant impact of machining the flow channel groove 5113 on the structural strength of the first plate 511, in some embodiments, the thickness of the first plate 511 is greater than the thickness of the second plate 512. This ensures that even after machining the flow channel groove 5113 on the first plate 511, the first plate 511 still possesses strong structural strength.

[0136] In another optional embodiment, when the heat dissipation channel 52 is semi-circular, a channel groove is provided on the second plate surface 5121, and the first plate surface 5111 and the channel groove enclose to form the heat dissipation channel 52. The pipe connector 55 is connected to the second sealing plate surface 5112. The heat dissipation channel 52 has an inlet hole and an outlet hole formed on the first plate body 511, penetrating the first plate body 511. The channel groove has an inlet section and an outlet section, the inlet section being opposite to and shape-matched with the inlet hole, and the outlet section being opposite to and shape-matched with the outlet hole.

[0137] In other words, flow channel grooves need to be machined on the second plate 512, but not on the first plate 511. This would affect the structural strength of the second plate 512. To mitigate the significant impact of flow channel groove machining on the structural strength of the second plate 512, in some embodiments, the thickness of the second plate 512 is greater than the thickness of the first plate 511. This ensures that the second plate 512 maintains strong structural strength even after the flow channel grooves are machined on it.

[0138] In some other embodiments, the longitudinal cross-sectional shape of the heat dissipation channel 52 can also be circular or elliptical. In this case, a first channel groove is provided on the first plate surface 5111, and a second channel groove is provided on the second plate surface 5121 opposite to the first channel groove; wherein, the first channel groove and the second channel groove are engaged together to form the heat dissipation channel 52. That is, groove structures are machined on both the first plate 511 and the second plate 512 to form the heat dissipation channel 52.

[0139] At this point, in order to reduce the processing cost and difficulty of the heat sink 51, the thickness of the first plate 511 and the second plate 512 can be made equal. Of course, even with equal thickness, the structural strength of the first plate 511 and the second plate 512 must be guaranteed.

[0140] In this embodiment, the heat sink 51 also has a first extending direction and a second extending direction that are perpendicular to each other. Both the first extending direction and the second extending direction are perpendicular to the thickness direction of the heat sink 51. The dimension of the heat sink 51 in the first extending direction is larger than the dimension of the heat sink 51 in the second extending direction. It should be noted that the first extending direction is consistent with the height direction of the main housing 4, and the second extending direction is consistent with the width direction of the main housing 4.

[0141] The specific shape of the heat dissipation channel 52 will be described in detail below. It should be noted that regardless of the molding method of the channel groove 5113, its shape is adapted to the shape of the heat dissipation channel 52. Furthermore, since the overall shape of the heat dissipation channel 52 is not shown in the figure, it will be inferred from the following description. Figure 10The heat dissipation channel 52 is marked on the flow channel groove 5113.

[0142] like Figure 10 As shown, the heat dissipation channel 52 includes an inlet channel section 523, multiple first channel sections 524, multiple second channel sections 525, and an outlet channel section 526. The first end of the inlet channel section 523 forms an inlet hole 521, and the second end of the inlet channel section 523 is connected to a first channel section 524. The multiple first channel sections 524 are arranged at intervals along a first extending direction, and adjacent first channel sections 524 are connected by a second channel section 525. The first end of the outlet channel section 526 is connected to a second channel section 525, and the second end of the outlet channel section 526 forms an outlet hole 522. In this way, the heat dissipation channel 52 can cover a larger area of ​​the heat sink 51, allowing the power modules located in both the first cavity 31 and the second cavity to be effectively cooled.

[0143] Specifically, the liquid inlet flow channel section 523 includes a first liquid inlet section 5231, a first straight section 5232, a first inclined section 5233, and a first liquid outlet section 5234; the first end of the first liquid inlet section 5231 forms a liquid inlet hole 521, the second end of the first liquid inlet section 5231 is connected to a first straight section 5232, the extension direction of the first liquid inlet section 5231 forms an angle with a first extension direction, and the extension direction of the first liquid inlet section 5231 forms an angle with a second extension direction; the first straight section 5232 and the first inclined section 5233 are connected between the first liquid inlet section 5231 and the first liquid outlet section 5234, and the first straight section 5232 and the first inclined section 5233 are staggered; the first end of the first liquid outlet section 5234 is connected to a first inclined section 5233, and the second end of the first liquid outlet section 5234 is connected to a first flow channel section 524. In this way, by limiting the shape of the liquid inlet channel section 523, we can ensure the heat dissipation effect on the one hand, and avoid some components on the other hand.

[0144] Furthermore, the first straight segment 5232 extends along the first extending direction; the extending direction of the first inclined segment 5233 forms an angle with the first extending direction, and the extending direction of the first inclined segment 5233 forms an angle with the second extending direction. This extends the length of the liquid inlet channel segment 523, thereby increasing the flow rate of the heat exchange medium flowing through the liquid inlet channel segment 523 and improving the heat dissipation effect of the liquid inlet channel segment 523 on the power module.

[0145] Of course, to facilitate the processing of the flow channel 5113 or the first and second flow channel, the first flow channel segment 524 extends along the second extension direction, a portion of the second flow channel segment 525 extends along the first extension direction, and the liquid outlet flow channel segment 526 extends along the second extension direction. This reduces the processing difficulty of the first flow channel segment 524, a portion of the second flow channel segment 525, and the liquid outlet flow channel segment 526, improves the manufacturing efficiency of the heat sink 51, and consequently improves the manufacturing efficiency of the electrical control box provided in this embodiment.

[0146] In other words, in this embodiment, the heat dissipation channel 52 is a spiral heat dissipation channel, meaning that the extension direction of the heat dissipation channel 52 is bent and detoured as much as possible to extend its length. This improves the heat dissipation effect of the heat dissipation channel 52 on the power module housed within the main housing 4.

[0147] Therefore, the heat dissipation channel 52 can correspond to the area where many components in the frequency converter drive module are located, so that the heat generated by many components in the frequency converter drive module can be directly transferred to the heat dissipation channel to improve the heat dissipation effect and thus improve the stability of the electrical control box provided in this embodiment.

[0148] Understandably, the second flow channel section 525 may correspond to some high-power components. In this case, at least one bend 5251 can be formed on the second flow channel section 525. This can extend the length of the second flow channel section 525, increase the flow rate of the heat exchange medium flowing through the second flow channel section 525, and improve the heat dissipation effect on some high-power components.

[0149] The shape of the bend 5251 can be arc-shaped; it can also be formed by connecting a flow channel segment extending along the first extending direction with an inclined extending flow channel segment, or by connecting a flow channel segment extending along the second extending direction with an inclined extending flow channel segment, or by connecting two inclined extending flow channel segments with different inclination angles. It should be noted that the inclined extension here refers to having an angle with both the first and second extending directions. The shape of the bend 5251 is not specifically limited here.

[0150] It is understandable that, since the filter board needs to be electrically connected to an external power supply line to achieve the corresponding function, the electrical control box provided in this embodiment also includes a power connector (not shown in the figure). The heat sink 51 includes a board body 513 and a first connecting part 514 connected to the board body 513. The board body 513 forms a heat dissipation channel 52, and the power connector is installed on the first connecting part 514. The first end of the power connector extends into the second cavity and is electrically connected to the filter board. The second end of the power connector is located on the same side of the heat sink 51 as the first cavity 31, and the power connector is located outside the first cavity 31. The second end of the power connector is used to be electrically connected to an external power supply line.

[0151] Since a heat dissipation channel 52 is formed on the main body 513, and the temperature of the heat dissipation channel 52 is low, in order to avoid the low temperature from being transferred to the power connector to a certain extent, condensation is formed on the surface of the power connector. In some embodiments, a first blocking groove 5141 is provided on the first connecting part 514, and the first blocking groove 5141 is located between the main body 513 and the power connector.

[0152] The plate body 513 includes a first plate portion 5131 and a second plate portion 5132 stacked together, the first plate portion 5131 being formed on the first plate body 511 and the second plate portion 5132 being formed on the second plate body 512; the first connecting portion 514 includes a first connecting sub-portion 5142 and a second connecting sub-portion 5143 stacked together, the first connecting portion 514 being formed on the first plate body 511 and the second connecting sub-portion 5143 being formed on the second plate body 512; the first blocking groove 5141 includes a first groove segment 5144 and a second groove segment 5145 that are opposite to each other and have matching shapes, the first groove segment 5144 being formed on the first connecting sub-portion 5142 and the second groove segment 5145 being formed on the second connecting sub-portion 5143.

[0153] The first connecting sub-part 5142 and the second connecting sub-part 5143 are each provided with a plurality of first connecting holes 5146 through which the power terminal of the power supply terminal block passes.

[0154] In order to improve the temperature barrier effect of the first blocking groove 5141, in this embodiment, the first groove segment 5144 and the second groove segment 5145 both include a first sub-groove 5147, a second sub-groove 5148 and a third sub-groove 5149 connected in sequence. The first sub-groove 5147 and the third sub-groove 5149 are arranged at intervals along the second extension direction and are located on both sides of the power terminal block. The first sub-groove 5147 and the third sub-groove 5149 both extend along the first extension direction. The second sub-groove 5148 is located above the power terminal block and extends along the second extension direction, so that the first blocking groove 5141 is inverted "U" shape.

[0155] Furthermore, the first blocking groove 5141 can be configured as multiple, one of which is in the shape of the inverted "U" described above, and the remaining first blocking grooves 5141 are arranged along the second extending direction. At the same position of the heat sink 51 along the first extending direction, multiple first blocking grooves 5141 arranged at intervals can be provided. Here, there are no specific limitations on the number and shape of the first blocking grooves 5141.

[0156] In order to connect with the third motherboard 46, the heat sink 51 also includes a second connecting part 515 connected to the board body 513, and the second connecting part 515 is connected to the third motherboard 46.

[0157] Similarly, in order to avoid condensation on the surface of the main control module to a certain extent, a second blocking groove 5151 is provided on the second connection part 515, and the second blocking groove 5151 is located between the board body 513 and the main control module.

[0158] Specifically, the second connecting part 515 includes a first sub-part 5152 and a second sub-part 5153 stacked together. The first sub-part 5152 is formed on the first plate 511, and the second sub-part 5153 is formed on the second plate 512. The second sub-part 5153 has a second connecting hole 5154 for connecting with the third main plate 46.

[0159] The second blocking groove 5151 includes a first sub-segment 5155 and a second sub-segment 5156 that are arranged opposite to each other and have a matching shape. The first sub-segment 5155 is formed on the first sub-part 5152, and the second sub-segment 5156 is formed on the second sub-part 5153.

[0160] In this embodiment, the second blocking groove 5151 extends along the second extending direction. Here, the shape of the second blocking groove 5151 is not specifically limited.

[0161] This embodiment also provides an indoor unit and an outdoor unit. The outdoor unit includes the aforementioned electrical control box, and a detachable maintenance cover (not shown in the figure) is also provided at the inspection port 1001 of the outdoor unit's housing 100 to facilitate future maintenance of the electrical control box. The electrical control box has already been described in detail in the above embodiments and will not be repeated here.

[0162] The outdoor unit's casing 100 houses a fan (not shown in the figure), and the casing 100 defines an air outlet duct. Generally, to improve heat dissipation for the electrical control box, the control box can be placed within the air outlet duct. Of course, the outdoor unit also includes other modules and components. The structure of the indoor unit and the other modules or components included in the outdoor unit will not be described in detail here.

[0163] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation structure, characterized in that, include: A heat sink includes a first plate and a second plate stacked together, the first plate having a first surface facing the second plate, and the second plate having a second surface facing the first plate. as well as The heat dissipation channel is formed by a portion of the first plate surface and a portion of the second plate surface, and the heat dissipation channel is used to supply the flow of heat exchange medium.

2. The heat dissipation structure according to claim 1, characterized in that, It also includes an inlet pipe and an outlet pipe; The heat dissipation channel has an inlet hole and an outlet hole spaced apart. The inlet pipe is connected to the inlet hole, and the outlet pipe is connected to the outlet hole.

3. The heat dissipation structure according to claim 2, characterized in that, It also includes two pipe connectors, which are connected to the first plate or the second plate; The inlet pipe is connected to the inlet hole via a pipe connector, and the outlet hole is connected to the outlet pipe via a pipe connector.

4. The heat dissipation structure according to claim 3, characterized in that, The pipe connector has a channel formed inside; In the pipe connector connected to the liquid inlet pipe, the first end of the channel is connected to the liquid inlet hole, and the second end of the channel is connected to the liquid inlet pipe; In the pipe connector connected to the liquid outlet pipe, the first end of the channel is connected to the liquid outlet hole, and the second end of the channel is connected to the liquid outlet pipe.

5. The heat dissipation structure according to claim 4, characterized in that, The channel includes a first channel segment and a second channel segment that are perpendicular to each other and connected; In the pipe connector connected to the liquid inlet pipe, the first channel section is connected to the liquid inlet hole, and the second channel section is connected to the liquid inlet pipe; In the pipe connector connected to the liquid outlet pipe, the first channel section is in communication with the liquid outlet hole, and the second channel section is in communication with the liquid outlet pipe.

6. The heat dissipation structure according to claim 5, characterized in that, The axial direction of the liquid inlet and the axial direction of the liquid outlet are both consistent with the thickness direction of the heat sink. In the pipe connector connected to the inlet pipe, the extension direction of the first channel section is consistent with the axial direction of the inlet hole; In the pipe connector connected to the liquid outlet pipe, the extension direction of the second channel section is consistent with the axial direction of the liquid outlet hole.

7. The heat dissipation structure according to claim 2, characterized in that, The first plate surface is provided with a flow channel groove, and the second plate surface and the flow channel groove are enclosed to form the heat dissipation flow channel.

8. The heat dissipation structure according to claim 7, characterized in that, The liquid inlet and the liquid outlet are formed on the second plate and penetrate through the second plate. The flow channel has an inlet section and an outlet section. The inlet section is opposite to the inlet hole and is adapted in shape, and the outlet section is opposite to the outlet hole and is adapted in shape.

9. The heat dissipation structure according to claim 7, characterized in that, The thickness of the first plate is greater than the thickness of the second plate.

10. The heat dissipation structure according to claim 2, characterized in that, The second plate surface is provided with a flow channel groove, and the first plate surface and the flow channel groove are enclosed to form the heat dissipation flow channel.

11. The heat dissipation structure according to claim 10, characterized in that, The liquid inlet and the liquid outlet are formed on the first plate and penetrate through the first plate. The flow channel has an inlet section and an outlet section. The inlet section is opposite to the inlet hole and is adapted in shape, and the outlet section is opposite to the outlet hole and is adapted in shape.

12. The heat dissipation structure according to claim 10, characterized in that, The thickness of the second plate is greater than the thickness of the first plate.

13. The heat dissipation structure according to any one of claims 7 to 12, characterized in that, The longitudinal cross-sectional shape of the heat dissipation channel is semi-circular.

14. The heat dissipation structure according to claim 2, characterized in that, The first plate surface is provided with a first flow channel groove, and the second plate surface is provided with a second flow channel groove opposite to the first flow channel groove; The first flow channel groove and the second flow channel groove are engaged together to form the heat dissipation flow channel.

15. The heat dissipation structure according to claim 14, characterized in that, The thickness of the first plate is equal to the thickness of the second plate.

16. The heat dissipation structure according to claim 14 or 15, characterized in that, The longitudinal cross-sectional shape of the heat dissipation channel is circular or elliptical.

17. The heat dissipation structure according to any one of claims 2 to 12, 14 to 15, characterized in that, The inlet hole is located below the outlet hole.

18. The heat dissipation structure according to any one of claims 2 to 12, 14 to 15, characterized in that, The heat sink is defined to have a first extending direction and a second extending direction that are perpendicular to each other, and both the first extending direction and the second extending direction are perpendicular to the thickness direction of the heat sink. The dimension of the heat sink in the first extending direction is larger than the dimension of the heat sink in the second extending direction; The heat dissipation channel includes an inlet channel section, multiple first channel sections, multiple second channel sections, and an outlet channel section. The first end of the inlet channel section forms the inlet hole, and the second end of the inlet channel section is connected to a first channel section. Multiple first flow channel segments are arranged at intervals along the first extension direction, and two adjacent first flow channel segments are connected by a second flow channel segment. The first end of the liquid outlet channel section is connected to a second channel section, and the second end of the liquid outlet channel section forms the liquid outlet hole.

19. The heat dissipation structure according to claim 18, characterized in that, The first flow channel segment extends along the second extension direction.

20. The heat dissipation structure according to claim 18, characterized in that, The second flow channel section extends along the first extension direction.

21. The heat dissipation structure according to claim 18, characterized in that, At least one bend is formed on the second flow channel section.

22. The heat dissipation structure according to claim 21, characterized in that, The bending section is an arc-shaped bending section.

23. The heat dissipation structure according to claim 18, characterized in that, The liquid outlet flow channel section extends along the second extension direction.

24. The heat dissipation structure according to any one of claims 19 to 23, characterized in that, The heat dissipation channel is a spiral heat dissipation channel.

25. The heat dissipation structure according to any one of claims 1 to 12, 14 to 15, and 19 to 23, characterized in that, The first plate is welded to the second plate; The heat dissipation structure also includes a positioning component, which is used to define the relative position between the first plate and the second plate.

26. The heat dissipation structure according to claim 25, characterized in that, The positioning component includes a positioning pin, the first plate has a first positioning hole, and the second plate has a second positioning hole corresponding to the first positioning hole. The positioning pin passes through the first positioning hole and the second positioning hole to assemble the first plate and the second plate together.

27. The heat dissipation structure according to any one of claims 1 to 12, 14 to 15, 19 to 23, and 26, characterized in that, The first plate has a second sealing plate surface disposed opposite to the first plate surface, and the first plate surface and the second sealing plate surface are connected by a plurality of first side surfaces connected in sequence; The second plate has a first sealing plate surface that is opposite to the second plate surface. The second plate surface and the first sealing plate surface are connected by a plurality of second side surfaces that are connected in sequence. The plurality of second side surfaces are arranged in a one-to-one correspondence with the plurality of first side surfaces. In this case, at least one of the first side and the corresponding second side are on the same plane.

28. The heat dissipation structure according to any one of claims 1 to 12, 14 to 15, 19 to 23, and 26, characterized in that, The heat sink is provided with a stop portion, which is used to prevent liquid outside the heat sink from flowing to the heat sink.

29. The heat dissipation structure according to claim 28, characterized in that, The stop portion is a raised rib provided on the outer edge of the heat sink, the raised rib extending circumferentially along the heat sink in a closed shape; or, The stop portion is a groove provided on the outer edge of the heat sink, and the groove extends in a closed shape along the circumference of the heat sink.

30. An electrical control box, characterized in that, It includes a main housing, a first power module, and a heat dissipation structure as described in any one of claims 1 to 29; The heat dissipation structure is connected to the main box and forms a first cavity with the main box, and the first power module is disposed in the first cavity; The first power module is thermally connected to the heat dissipation structure.

31. The electrical control box according to claim 30, characterized in that, The first power module includes at least one first power component and at least one second power component; The power of the first power component is greater than the power of the second power component, and the first power component and the second power component are configured corresponding to the heat dissipation channel.

32. The electrical control box according to claim 31, characterized in that, The volume of the heat dissipation channel corresponding to the first power component is greater than the volume of the heat dissipation channel corresponding to the second power component.

33. The electrical control box according to claim 32, characterized in that, The longitudinal cross-sectional area of ​​the heat dissipation channel corresponding to the first power component is greater than the longitudinal cross-sectional area of ​​the heat dissipation channel corresponding to the second power component; and / or, The extension length of the heat dissipation channel corresponding to the first power component is greater than the extension length of the heat dissipation channel corresponding to the second power component.

34. The electrical control box according to any one of claims 30 to 33, characterized in that, The first power module includes a drive board, which includes a first drive module and a second drive module. The first drive module is used to drive the compressor, and the second drive module is used to drive the fan. The heat sink is configured to receive heat generated by the first drive module and / or the second drive module.

35. The electrical control box according to claim 34, characterized in that, Both the first driving module and the second driving module are attached to the heat sink.

36. The electrical control box according to any one of claims 30 to 33, characterized in that, The main body includes a first enclosure and a first main board connected together, and the first enclosure is connected to the heat sink. The heat sink, the first enclosure plate, and the first main board together form the first cavity.

37. The electrical control box according to claim 36, characterized in that, The first enclosure and the first main board are an integral structure.

38. The electrical control box according to claim 36, characterized in that, It also includes a second power module; The main box also includes a second enclosure plate and a second main plate connected to each other. The second enclosure plate and the first enclosure plate are respectively connected to opposite sides of the heat sink. The heat sink, the second enclosure plate and the second main plate together enclose and form a second cavity. The second power module is disposed within the second cavity.

39. The electrical control box according to claim 38, characterized in that, The second enclosure and the second main board are an integral structure.

40. The electrical control box according to claim 38, characterized in that, The second power module includes a filter board and a reactor, wherein the filter board includes a common-mode inductor; Both the common-mode inductor and the reactance are attached to the heat sink.

41. The electrical control box according to claim 40, characterized in that, It also includes a power connector; The heat sink includes a main body and a first connecting portion connected to the main body. The main body forms the heat dissipation channel, and the power terminal is installed on the first connecting portion. The first end of the power connector extends into the second cavity and is electrically connected to the second power module; the second end of the power connector is located on the same side of the heat sink as the first cavity, and the power connector is located outside the first cavity, and the second end of the power connector is used to electrically connect to an external power cord. The first connecting part is provided with a first blocking groove, which is located between the board body and the power terminal block.

42. The electrical control box according to claim 38, characterized in that, It also includes a third power module, and the main housing has a height direction and a thickness direction; The main box body also includes a third side panel, a third main board and a box cover. The third main board and the box cover are both connected to the third side panel. The third side panel and the third main board are both connected to the first side panel. The third main board and the first main board are arranged at intervals in the height direction and at intervals in the thickness direction. The first enclosure, the third enclosure, the third main board, and the box cover together form a third cavity, and the third power module is disposed in the third cavity.

43. The electrical control box according to claim 42, characterized in that, The third enclosure, the third main board, and the first enclosure are an integral structure.

44. The electrical control box according to claim 42, characterized in that, The third power module is the main control module.

45. The electrical control box according to claim 44, characterized in that, The heat sink includes a main body and a second connecting portion connected to the main body. The main body forms the heat dissipation channel, and the second connecting portion is connected to the third main board. The second connecting part is provided with a second blocking groove, which is located between the board body and the third power module.

46. ​​A heating, ventilation, and air conditioning (HVAC) device, characterized in that, It includes a housing and an electrical control box as described in any one of claims 30 to 45, wherein the electrical control box is installed within the housing; The housing has an access port, and the first main board of the electrical control box is positioned facing the access port.

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