A multifunctional optical chip testing device

Abstract

This utility model discloses a multifunctional optical chip testing device, which connects to an external laser and an external PCB to form a test circuit. It includes a main control board, a main unit housing, an optical power detection module, a photocurrent detection module, a DC voltage output module, a pulse output module, and a main control external module. The main control board is located inside the main unit housing. The optical power detection module, photocurrent detection module, DC voltage output module, pulse output module, and main control external module are all located on the front end of the main unit housing and are electrically connected to the main control board. This utility model, through standardized module interface design and integrated structure, can achieve simultaneous testing of multiple parameters such as optical power, electrical signals, and control signals, improving testing efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a multifunctional optical chip testing device. Background Technology

[0002] Existing optical chip testing systems generally employ test platforms built from multiple discrete test devices with single functions. These platforms are prone to connection instability, require large test spaces, have complex setup processes, and exhibit low overall reusability, severely limiting testing efficiency and the system's scalability. For example, different types of optical chips, due to their significantly different functional structures, require different supporting test circuits: high-speed germanium detector chips require high-sensitivity transimpedance amplifiers, silicon-based photonic chips require integrated thermal tuning circuits to compensate for thermo-optical effects, pulse modulator chips require high-speed pulse drive circuits, multi-wavelength emission chips require multi-channel parallel readout circuits, and optical phased array chips rely on phase calibration feedback circuits. To meet these diverse needs, traditional test systems often require stacking multiple functional devices, resulting in high system setup costs, difficult device maintenance, and significant functional redundancy and module idleness.

[0003] Furthermore, as the integration of optical chips continues to increase, their testing requirements are becoming increasingly complex, necessitating the simultaneous measurement of multiple physical parameters, including optical power, electrical signal response, and thermal stability. Existing discrete testing systems have limited capabilities in the coordinated control of multiple physics fields, making synchronous testing difficult and resulting in test coverage below the industry yield baseline. In complex testing scenarios, frequent manual intervention and debugging are also required, further reducing the level of automation and efficiency of testing. Utility Model Content

[0004] The purpose of this invention is to provide a multifunctional optical chip testing device, which aims to solve the problem that existing optical chip testing systems have dispersed functions and cannot achieve synchronous testing of multiple parameters.

[0005] To solve the above-mentioned technical problems, the purpose of this utility model is achieved through the following technical solution: A multifunctional optical chip testing device is provided, which is connected to an external laser and an external PCB to form a test circuit. The device includes a main control board, a main chassis, an optical power detection module, a photocurrent detection module, a DC voltage output module, a pulse output module, and a main control external module. The main control board is located inside the main chassis. The optical power detection module, photocurrent detection module, DC voltage output module, pulse output module, and main control external module are all located on the front end of the main chassis and are all electrically connected to the main control board.

[0006] Furthermore, it also includes a LAN interface for connecting to a remote control terminal, a DB9 interface for serial communication, and a main power interface for powering the device. The LAN interface, DB9 interface, and main power interface are all located on the rear end of the host chassis and are all electrically connected to the main control board.

[0007] Furthermore, the main control external module includes a touch screen, a device switch for controlling the main control board, a power indicator for indicating the device's operating status, a USB interface for connecting to an external storage device, an SFP interface for connecting to the external PCB, and a laser interface for connecting to the external laser.

[0008] Furthermore, the main unit housing has multiple receiving slots for fixing modules, and the optical power detection module, photocurrent detection module, DC voltage output module and pulse output module are respectively disposed in the receiving slots.

[0009] Furthermore, the optical power detection module is provided with multiple FC-APC interfaces for testing optical power, and the FC-APC interfaces are connected to the pigtails of the external PCB.

[0010] Furthermore, the photocurrent detection module is provided with multiple first banana head interfaces for testing photocurrent signals, and the first banana head interfaces are connected to the photodetector interface of the external PCB.

[0011] Furthermore, the DC voltage output module is provided with multiple second banana head interfaces for outputting DC voltage signals, and the second banana head interfaces are connected to the modulator interface of the external PCB.

[0012] Furthermore, the pulse output module is provided with multiple BNC interfaces for outputting pulse signals, and the BNC interfaces are connected to the modulator interface of the external PCB.

[0013] Furthermore, the side of the main unit housing is provided with multiple heat dissipation holes.

[0014] Furthermore, the bottom of the main unit housing is provided with multiple support feet at intervals.

[0015] This invention provides a multifunctional optical chip testing device, which connects to an external laser and an external PCB to form a test circuit. The device includes a main control board, a main chassis, an optical power detection module, a photocurrent detection module, a DC voltage output module, a pulse output module, and a main control external module. The main control board is located inside the main chassis, while the optical power detection module, photocurrent detection module, DC voltage output module, pulse output module, and main control external module are all located on the front end of the main chassis and electrically connected to the main control board. This invention, through standardized module interface design and integrated structure, enables simultaneous testing of multiple parameters such as optical power, electrical signals, and control signals, improving testing efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A schematic diagram of the structure of a multifunctional optical chip testing device provided in this embodiment of the utility model. Figure 1 ;

[0018] Figure 2 A schematic diagram of the structure of a multifunctional optical chip testing device provided in this embodiment of the utility model. Figure 2 .

[0019] Explanation of the markings in the image:

[0020] 1. Main unit chassis; 11. Ventilation holes; 12. Support feet;

[0021] 2. Optical power detection module; 21. FC-APC interface;

[0022] 3. Photocurrent detection module; 31. First banana head interface;

[0023] 4. DC voltage output module; 41. Second banana plug interface;

[0024] 5. Pulse output module; 51. BNC interface;

[0025] 6. Main control external module; 61. Touch screen display; 62. Device switch; 63. Power indicator light; 64. USB interface; 65. SFP interface; 66. Laser interface;

[0026] 7. LAN interface; 8. DB9 interface; 9. Main power interface. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0028] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0029] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0030] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0031] Combination Figure 1 As shown, this utility model embodiment provides a multifunctional optical chip testing device, which is connected to an external laser and an external PCB to form a test circuit. It includes a main control board, a main unit housing 1, an optical power detection module 2, an optical current detection module 3, a DC voltage output module 4, a pulse output module 5, and a main control external module 6. The main control board is located inside the main unit housing 1. The optical power detection module 2, the optical current detection module 3, the DC voltage output module 4, the pulse output module 5, and the main control external module 6 are all located on the front end of the main unit housing 1 and are all electrically connected to the main control board.

[0032] In this embodiment, the multifunctional optical chip testing device is used to connect to an external laser and an external PCB to form a closed test loop, enabling comprehensive testing of multiple parameters of the optical chip. The main unit 1 serves as the structural support of the device and is made of metal. Inside, it houses a main control board (not shown in the figure) for coordinating the operation of various functional modules. The main control board can communicate with multiple functional modules via a bus and is used to control the working status of each module, receive test data, and process and provide feedback. The optical power detection module 2, photocurrent detection module 3, DC voltage output module 4, pulse output module 5, and main control external module 6 are all modularly arranged on the front face of the main unit 1. Each module can be electrically connected to the main control board via an interface board to transmit signals and power. All modules are fixed to the main unit 1 with front panel screws, and electrical connections are managed uniformly through the back panel of the main control board. This integrated device not only meets the testing needs of various types of optical chips but also effectively improves test reuse rate, reduces the complexity of test system setup, and enhances testing efficiency.

[0033] Combination Figure 2 As shown, in one embodiment, the multifunctional optical chip testing device further includes a LAN interface 7 for connecting to a remote control terminal, a DB9 interface 8 for serial communication, and a main power interface 9 for powering the device. The LAN interface 7, DB9 interface 8, and main power interface 9 are all located on the rear end of the host chassis 1 and are all electrically connected to the main control board.

[0034] In this embodiment, the LAN interface 7 is used to connect the multifunctional optical chip testing device to an external computer or network control system to achieve remote control, parameter configuration, and remote transmission of test data. The LAN interface 7 connects to external network devices via a network cable and is led out through an opening on the rear panel of the chassis. Internally, it establishes an electrical connection with the main control board to ensure the stability and reliability of remote data transmission. The DB9 interface 8 is a standard RS232 serial communication interface, suitable for command interaction and data transmission between the multifunctional optical chip testing device and external serial devices. The DB9 interface 8 is installed on the rear face of the main chassis 1 using screws and is electrically connected to the main control board via a ribbon cable, providing good mechanical strength and electrical connection stability. The main power interface 9 is used to connect the power cord, providing unified power supply to all modules inside the multifunctional optical chip testing device. The main power interface 9 is located at the bottom rear of the main chassis 1 and is equipped with an independent power switch for overall device power management. The main power interface 9 is fixed with screws and power is distributed through the power management circuit on the main control board to ensure voltage stability and system safety during module operation.

[0035] The three interfaces mentioned above are all reasonably arranged in the rear area of ​​the main unit chassis 1 to avoid interference from the front operation area. Each interface is electrically connected to the main control board, thereby realizing the remote control, serial communication and unified power supply functions of the multi-functional optical chip testing device, effectively improving the operation convenience, control flexibility and system integration of the testing device.

[0036] In one embodiment, the main control external module 6 includes a touch screen 61, a device switch 62 for controlling the main control board, a power indicator 63 for indicating the device's operating status, a USB interface 64 for connecting to an external storage device, an SFP interface 65 for connecting to the external PCB, and a laser interface 66 for connecting to the external laser.

[0037] In this embodiment, the main control external module 6 is configured at the front end of the main unit chassis 1, and is used to realize user interaction, status indication, and signal connection functions with external devices. The main control external module 6 includes: a touch screen display 61, a device switch 62, a power indicator light 63, a USB interface 64, an SFP interface 65, and a laser interface 66. Each component can be fixed and installed by screws or through holes, and is electrically connected to the main control board. The touch screen display 61 can be a five-inch LCD capacitive touch screen, fixedly installed on the upper left side of the front of the main unit chassis 1, and connected to the main control board through an FPC cable. It supports functions such as operation menu display, parameter setting, and module control, providing users with a graphical interactive interface. The device switch 62 is located at the lower left of the touch screen display 61, adopts a self-locking button structure, is installed on the main control board and led out through the chassis through hole, and is used to realize the power-on and power-off control of the whole device, ensuring the safety and controllability of system operation. The power indicator light 63 is located to the right of the device switch 62, and is fixed through the chassis through hole by the indicator light assembly. It is commonly used to indicate the working status of the device. When the device is powered on, the power indicator light 63 is illuminated, allowing users to quickly determine if the device is operational. The USB interface 64, located to the right of the power indicator light 63, is directly soldered to the main control board and leads out through a through-hole in the chassis. It supports connecting external storage devices such as USB flash drives to enable functions such as importing and exporting test data, updating programs, and backing up logs. The SFP interface 65, located to the right of the USB interface 64, is fixed to the main control board and embedded inside the main chassis 1. The SFP interface 65 is used to connect to an external PCB, supporting signal transmission from modulation modules or attenuator modules to meet the requirements of high-speed data communication. The laser interface 66, located to the right of the SFP interface 65, uses an FC-APC standard flange structure and is fixed to the through-hole in the chassis with screws. This interface is used for fiber optic connection to an external laser, ensuring stable laser input signals are connected to the internal modules of the device for testing.

[0038] By using the various functional units of the aforementioned main control external module 6 in conjunction, the multifunctional optical chip testing device achieves comprehensive functional support in terms of function control, status monitoring, data communication, and peripheral connection, thereby improving the overall operability, adaptability, and user experience of the device.

[0039] In one embodiment, the main unit housing 1 has multiple receiving slots for fixing modules, and the optical power detection module 2, photocurrent detection module 3, DC voltage output module 4 and pulse output module 5 are respectively disposed in the receiving slots.

[0040] In this embodiment, each receiving slot (not shown in the figure) is a rectangular opening structure with two through holes on its upper and lower edges for installing fixing screws to mechanically fix the front panel of the module. The interior of the receiving slot corresponds to the back panel inside the main unit chassis 1. The back panel is provided with multiple standardized electrical connection interfaces for electrical connection with the motherboards of each functional module, ensuring stable transmission of data, control signals, and power between the main control board and each module. In this embodiment, there are four receiving slots. The optical power detection module 2 is installed in the designated first receiving slot to receive the optical signal transmitted from the external PCB; the photocurrent detection module 3 is installed in the adjacent second receiving slot to collect the current signal output by the photodetector in the external PCB; the DC voltage output module 4 and the pulse output module 5 are installed in their corresponding third and fourth receiving slots, respectively, to output DC bias voltage and adjustable pulse signals to the external PCB. Each functional module can be combined, installed, or replaced as needed, and the accommodating slots can also be added or removed as needed. The modules do not interfere with each other, which facilitates the maintenance, upgrading, and functional expansion of the device. This significantly improves the versatility and flexibility of the testing device and meets the structural compatibility requirements of various types of optical chip testing applications.

[0041] In one embodiment, the optical power detection module 2 is provided with multiple FC-APC interfaces 21 for testing optical power, and the FC-APC interfaces 21 are connected to the pigtails of the external PCB.

[0042] In this embodiment, the front panel of the optical power detection module 2 is equipped with multiple FC-APC interfaces 21 for testing optical power signals. In this embodiment, the FC-APC interfaces 21 adopt a standard flange structure, arranged in a 2×4 pattern, with a total of eight interfaces. All are fixed to the exterior of the front panel of the optical power detection module 2 with screws, ensuring good mechanical strength and fiber optic connection stability during use. Each FC-APC interface 21 is electrically connected to the photodetector inside the module and the module's mainboard, capable of receiving optical signals transmitted from an external laser via an external PCB and converting them into electrical signals for subsequent testing and analysis.

[0043] During actual testing, the FC-APC interface 21 is connected to the pigtail on the external PCB via optical fiber, forming a stable optical signal input channel. The connection structure effectively ensures that the optical signal is input from the laser, modulated by the external PCB, and then guided into the device, whereby the optical power detection module 2 performs real-time acquisition and feedback of the optical power.

[0044] In one embodiment, the photocurrent detection module 3 is provided with a plurality of first banana head interfaces 31 for testing photocurrent signals, and the first banana head interfaces 31 are connected to the photodetector interface of the external PCB.

[0045] In this embodiment, the front panel of the photocurrent detection module 3 is provided with multiple first banana-head interfaces 31 for testing photocurrent signals. In this embodiment, the first banana-head interfaces 31 adopt a standard 4mm structure, arranged in a 2×4 pattern, with a total of eight. All are fixed to the inner side of the module's front panel with screws, ensuring good contact performance and mechanical stability during high-frequency insertion and removal. As an important sub-module of the testing device, the photocurrent detection module 3 is internally configured with a high-precision sampling circuit and a signal conditioning circuit. Each first banana-head interface 31 is electrically connected to the module's main board to receive the photodetector output signal transmitted from the external PCB, and to transmit the acquired photocurrent signal to the main control board for data processing and display.

[0046] In practical applications, the first banana-head interface 31 is connected to the photodetector interface on the external PCB via a wire, forming a complete signal sampling path. When the laser signal is injected into the optical chip under test through the external laser, its response signal is converted into a current output by the on-chip photodetector. The photocurrent detection module 3 collects this current signal through the first banana-head interface 31, thereby realizing the testing and analysis of the electrical response characteristics of the optical chip.

[0047] In one embodiment, the DC voltage output module 4 is provided with a plurality of second banana head interfaces 41 for outputting DC voltage signals, and the second banana head interfaces 41 are connected to the modulator interface of the external PCB.

[0048] In this embodiment, the front panel of the DC voltage output module 4 is provided with multiple second banana-head interfaces 41 for outputting DC voltage signals. In this embodiment, the second banana-head interfaces 41 adopt a standard 2mm structure, arranged in a 4×10 pattern, with a total of 40 interfaces. They are compactly distributed and orderly arranged, and are all fixed to the inner side of the module's front panel with screws, and electrically connected to the module's main board through internal circuitry. The DC voltage output module 4 is mainly used to provide adjustable DC bias voltage to an external PCB. It has a multi-channel voltage output circuit internally, with each second banana-head interface 41 corresponding to one output channel, supporting independent voltage amplitude setting to meet the bias power supply requirements of different modulator units. The DC voltage output module 4 is inserted into the corresponding receiving slot at the front of the main unit chassis 1 and interfaces with the standardized backplane interface, thereby achieving unified electrical connection and control management with the main control board.

[0049] In practical applications, users can connect wires to the modulator interface on an external PCB via the second banana-head connector 41 to provide the necessary DC drive voltage to the modulator, thereby activating the modulation function or adjusting its operating status. The output parameters of this voltage signal can be set and monitored in real time on the main control interface via a touch screen, offering excellent ease of operation and control precision.

[0050] In one embodiment, the pulse output module 5 is provided with a plurality of BNC interfaces 51 for outputting pulse signals, and the BNC interfaces 51 are connected to the modulator interface of the external PCB.

[0051] In this embodiment, the front panel of the pulse output module 5 is provided with multiple BNC interfaces 51 for outputting pulse signals. In this embodiment, the BNC interfaces 51 adopt a standard coaxial connector structure, arranged in a 2×4 pattern, with a total of eight interfaces. All are fixed to the outer side of the front panel of the module with screws and electrically connected to the main board of the module via internal wiring. The pulse output module 5 internally contains a multi-channel high-speed pulse signal generation circuit. Each BNC interface 51 corresponds to one pulse output channel, capable of outputting pulse signals with adjustable pulse width and adjustable amplitude. The pulse output module 5 is fixed to the receiving slot at the front of the main unit chassis 1 via a plug-in method and achieves communication and control connection with the main control board through a standardized backplane interface.

[0052] In practical applications, the BNC interface 51 is used to output the generated pulse signal to the modulator interface on the external PCB, driving the modulator to complete the pulse modulation operation. Users can set the parameters of each pulse signal, including pulse width, amplitude, and frequency, through the touchscreen display 61 in the main control external module 6, achieving precise control of different types of modulators. The pulse output module 5 supports parallel operation of multiple modulation channels, adapting to the testing needs of various high-speed modulation devices. Furthermore, the BNC interface 51 provides a stable connection and strong anti-interference capability, making it suitable for high-speed pulse signal transmission.

[0053] In one embodiment, the side of the main unit housing 1 is provided with a plurality of heat dissipation holes 11.

[0054] In this embodiment, the heat dissipation holes 11 are circular through-hole structures, distributed along the left and right side panels of the main unit chassis 1, forming an effective natural ventilation channel to promptly dissipate heat generated during device operation. Under normal operating conditions, each functional module (including the optical power detection module 2, photocurrent detection module 3, DC voltage output module 4, pulse output module 5, etc.) and the main control board continuously consume power, thereby generating heat. To prevent internal electronic components from experiencing performance degradation or damage due to excessive heat accumulation, heat dissipation holes 11 are provided on both sides of the main unit chassis 1. This improves air convection efficiency and effectively enhances heat dissipation performance without requiring additional active cooling devices. The size and number of heat dissipation holes 11 are optimized based on the overall power consumption and heat dissipation requirements, ensuring both good ventilation and structural strength of the main unit chassis.

[0055] In one embodiment, the bottom of the main unit housing 1 is provided with a plurality of support feet 12 at intervals.

[0056] In this embodiment, the support feet 12 are symmetrically arranged at the four corners of the bottom of the main unit housing 1 and are fixed to the base plate with screws. The support feet 12 are made of high-strength anti-slip material, possessing good shock absorption performance and anti-slip capability, which can effectively prevent the device from shifting or tilting due to external forces or vibrations during operation. At the same time, by providing a certain bottom clearance from the ground, the support feet 12 provide space for ventilation and heat dissipation at the bottom of the main unit housing 1, which helps to improve the thermal management efficiency of the entire machine.

[0057] In addition, the support feet 12 make it easier for users to place the device stably in different application scenarios such as desktops and experimental benches, and provide effective protection for the bottom of the main unit during transportation and handling, preventing structural damage caused by collisions or friction.

[0058] In summary, the multifunctional optical chip testing device is used for functional testing of optical programmable gate array (OFPGA) chips. The testing procedure is as follows:

[0059] The output of the external laser is connected via optical fiber to the laser interface 66 (FC-APC flange) at the front end of the multifunctional optical chip testing device to input optical signals. An external printed circuit board (PCB) establishes a communication connection with the multifunctional optical chip testing device via an SFP interface 65. Simultaneously, the pigtail fiber from the external PCB is connected to the FC-APC interface 21 on the optical power detection module 2 to collect the optical signal output of the OFPGA chip. The modulator control terminal on the external PCB is connected via wire to the DC voltage output module 4 or pulse output module 5 of the multifunctional optical chip testing device, specifically to the corresponding banana plug interface or BNC interface 51, to input voltage or pulse drive signals to the modulators in the OFPGA chip. The photodetector interface inside the OFPGA chip is connected via wire to the photocurrent detection module 3 of the multifunctional optical chip testing device to collect the electrical response signal of the OFPGA chip.

[0060] After the above connections are completed, the external laser, external PCB, and multifunctional optical chip testing device together form a complete test loop. During the test, the optical signal emitted by the external laser is input into the multifunctional optical chip testing device via optical fiber. After photoelectric conversion, the multifunctional optical chip testing device outputs an electrical signal to the external PCB. The external PCB then converts the received electrical signal back into an optical signal and introduces it into the OFPGA chip. The output signal of the OFPGA chip after response is transmitted back to the optical power detection module 2 of the multifunctional optical chip testing device via a pigtail. At the same time, the electrical response signal of the OFPGA chip is also sampled by the photocurrent detection module 3.

[0061] Users can select function module channels and set parameters via the touch screen 61 (LCD), controlling the DC voltage output module 4 and pulse output module 5 to output the set DC bias voltage and pulse signal (pulse width and amplitude adjustable) respectively, which are used to excite different modulator units in the OFPGA chip. Throughout the testing process, the optical power detection module 2 and photocurrent detection module 3 can acquire and provide feedback on the optical signal output and electrical signal response of the OFPGA chip in real time, thereby enabling the testing of key performance indicators of the OFPGA chip, including parameters such as half-wave voltage, modulation response characteristics, and photodetector responsivity.

[0062] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A multifunctional optical chip testing device, which is connected to an external laser and an external PCB to form a test circuit, characterized in that, It includes a main control board, a main unit chassis, an optical power detection module, a photocurrent detection module, a DC voltage output module, a pulse output module, and a main control external module. The main control board is located inside the main unit chassis, and the optical power detection module, photocurrent detection module, DC voltage output module, pulse output module, and main control external module are all located on the front end of the main unit chassis and are all electrically connected to the main control board.

2. The multifunctional optical chip testing device according to claim 1, characterized in that, It also includes a LAN interface for connecting to a remote control terminal, a DB9 interface for serial communication, and a main power interface for powering the device. The LAN interface, DB9 interface, and main power interface are all located on the rear end of the host chassis and are all electrically connected to the main control board.

3. The multifunctional optical chip testing device according to claim 1, characterized in that, The main control external module includes a touch screen, a device switch for controlling the main control board, a power indicator for indicating the device's operating status, a USB interface for connecting to an external storage device, an SFP interface for connecting to the external PCB, and a laser interface for connecting to the external laser.

4. The multifunctional optical chip testing device according to claim 1, characterized in that, The main unit housing has multiple receiving slots for fixing modules, and the optical power detection module, photocurrent detection module, DC voltage output module and pulse output module are respectively set in the receiving slots.

5. The multifunctional optical chip testing device according to claim 1, characterized in that, The optical power detection module has multiple FC-APC interfaces for testing optical power, and the FC-APC interfaces are connected to the pigtails of the external PCB.

6. The multifunctional optical chip testing device according to claim 1, characterized in that, The photocurrent detection module has multiple first banana head interfaces for testing photocurrent signals, and the first banana head interfaces are connected to the photodetector interface of the external PCB.

7. The multifunctional optical chip testing device according to claim 1, characterized in that, The DC voltage output module has multiple second banana head interfaces for outputting DC voltage signals, and the second banana head interfaces are connected to the modulator interface of the external PCB.

8. The multifunctional optical chip testing device according to claim 1, characterized in that, The pulse output module has multiple BNC interfaces for outputting pulse signals, and the BNC interfaces are connected to the modulator interface of the external PCB.

9. The multifunctional optical chip testing device according to claim 1, characterized in that, The main unit chassis has multiple ventilation holes on its side.

10. The multifunctional optical chip testing device according to claim 1, characterized in that, The bottom of the main unit housing is provided with multiple support feet at intervals.

Images