Capacitive module and capacitive cell

Abstract

The utility model provides a kind of capacitor module and capacitor unit.Capacitor module can include: pedestal, with at least one cavity;At least two capacitor cores, directly placed in the cavity, the capacitor core is electrolytic capacitor core;Sealing layer, corresponding sealing the cavity;Explosion-proof layer, opposite the sealing layer, including with the explosion-proof groove corresponding to the cavity;Wherein, the pin of the capacitor core passes through the sealing layer and is exposed to the outside of the cavity.The utility model can improve the yield of capacitor module, reduce the temperature rise of capacitor core.

Description

Technical Field

[0001] This utility model relates to an electronic component, and more particularly to a capacitor module, a capacitor unit, and a method for assembling the capacitor module. Background Technology

[0002] Capacitors are widely used in power converters; for example, they can be used as bus capacitors between AC / DC converters and DC / DC converters to stabilize the bus voltage. However, in a power system, the failure rate of capacitors is second only to switching devices. The main cause of capacitor failure is overheating due to excessive ripple current.

[0003] To reduce capacitor temperature rise, existing technology provides a capacitor module solution. A single capacitor cell, without an insulating sleeve but including an aluminum shell, is placed inside a cavity of a base by extrusion to form a modular product. However, the aforementioned capacitor module solution often requires an interference fit between the cavity diameter and the outer diameter of the capacitor cell to ensure a tight fit between the aluminum shell of the capacitor cell and the inner wall of the base cavity, reducing the contact thermal resistance between the capacitor cell and the base and achieving better heat dissipation. This assembly method places higher precision requirements on the cavity diameter, increasing the difficulty and cost of base manufacturing. More specifically, if the cavity diameter is too small, the capacitor cell will be subjected to excessive force during extrusion into the base, potentially causing damage; that is, strict requirements are placed on the extrusion assembly force, making assembly difficult. If the cavity diameter is too large, after the capacitor cell is placed in the base, an air gap exists between the aluminum shell of the capacitor cell and the inner wall of the cavity due to the mechanical fit between the outer aluminum shell and the base cavity. This air gap introduces additional thermal resistance. This air gap can also affect heat dissipation, preventing the capacitor module from achieving the expected heat dissipation effect. In addition, due to the tolerance of the aluminum shell of the individual capacitor, problems such as the capacitor not being able to be placed in the base or the gap between the capacitor and the base being too large can occur. This places high demands on the precision of the aluminum shell of the individual capacitor, increasing the difficulty and cost of manufacturing the individual capacitor. Utility Model Content

[0004] The purpose of this invention is to provide a capacitor module and capacitor unit that can effectively solve at least one defect of the prior art.

[0005] To achieve the above objectives, this utility model provides a capacitor module, comprising: a base having at least one cavity; at least two capacitor cores placed directly within the cavity, wherein the capacitor cores are electrolyte capacitor cores; a sealing layer corresponding to and sealing the cavity; and an explosion-proof layer opposite to the sealing layer, including an explosion-proof groove corresponding to the cavity; wherein the leads of the capacitor cores pass through the sealing layer and are exposed on the outside of the cavity.

[0006] In some embodiments of this utility model, there is a gap of 0.2mm to 1.5mm between the inner wall of the cavity and the outer wall of the capacitor core placed therein.

[0007] In some embodiments of this utility model, the base includes a first surface and a second surface disposed opposite to each other along a first direction, and the axial direction of the at least one cavity is the same as the first direction; the sealing layer is located on the first surface of the base, and the first surface has an opening that penetrates the cavity; the explosion-proof layer achieves directional pressure relief through the second surface of the base.

[0008] In some embodiments of this utility model, the sealing layer is inserted into the opening by an interference fit.

[0009] In some embodiments of this utility model, the sealing layer is fixed to the opening by a casting and curing method.

[0010] In some embodiments of this utility model, the capacitor module further includes a heat sink, thermally connected to the base.

[0011] In some embodiments of the present invention, the heat sink includes: a first heat sink disposed on at least one circumferential surface of the base; and / or a second heat sink disposed on a portion of the first surface and / or the second surface of the base.

[0012] In some embodiments of this utility model, the projection of the first heat sink and / or the second heat sink onto their corresponding surfaces extends beyond their corresponding surfaces.

[0013] In some embodiments of this utility model, the radiator is integrated with the base, or the radiator is attached to the base.

[0014] In some embodiments of this utility model, the first radiator and the second radiator are heat sinks or cold plates.

[0015] In some embodiments of this utility model, the radiator further includes a third radiator, which is disposed in a non-cavity area inside the base, and the third radiator passes through the base to form a cooling pipe.

[0016] In some embodiments of this utility model, the cooling pipe is connected to an external heat exchange device, and a cooling medium is provided in the cooling pipe, which is a liquid or a gas.

[0017] In some embodiments of this utility model, the explosion-proof layer is integrally formed with the base, the cavity does not penetrate the second surface of the base, and the explosion-proof layer includes the explosion-proof groove formed on the second surface.

[0018] In some embodiments of this utility model, the explosion-proof layer is attached to the second surface, the cavity penetrates the second surface of the base, and the explosion-proof groove is formed on the outer surface of the explosion-proof layer.

[0019] In some embodiments of this utility model, the explosion-proof layer is embedded in the cavity and close to the second surface of the base, the cavity penetrates the second surface of the base, and the explosion-proof groove is formed on the outer surface of the explosion-proof layer.

[0020] In some embodiments of this utility model, at least two capacitor cores are disposed in one cavity, and the outer potentials of the at least two capacitor cores placed in the same cavity are equal.

[0021] In some embodiments of this invention, the output terminals of at least two capacitor cores are connected in parallel.

[0022] In some embodiments of this utility model, the capacitor module further includes a busbar for connecting the pins of at least two capacitor cores in the capacitor module, and the busbar has a set of positive and negative output terminals.

[0023] In some embodiments of this utility model, the capacitor module further includes: a voltage ripple compensation circuit, which is connected in series with a set of positive and negative output terminals of the busbar; the voltage ripple compensation circuit includes an input source, an output filter, and a switching circuit disposed between the input source and the output filter.

[0024] In some embodiments of this utility model, the voltage ripple compensation circuit is disposed on a PCB board, and the PCB board further includes at least one of a switch, an inductor, a capacitor, and a controller.

[0025] In some embodiments of this utility model, the capacitor module further includes an insulating layer disposed on at least one outer surface of the base.

[0026] In some embodiments of this utility model, a plurality of capacitor cores are arranged in a strip, triangle, square or ring shape on a base.

[0027] In some embodiments of this utility model, the base is an annular base, and the plurality of capacitor cores are arranged in an annular pattern along the annular base.

[0028] In some embodiments of this utility model, the capacitor module further includes: a fourth heat sink, thermally connected to the annular base and correspondingly disposed on the inner circumferential surface of the annular base, wherein the fourth heat sink is a heat sink fin or a cold plate.

[0029] In some embodiments of this utility model, the base is a pure aluminum base or an aluminum alloy base.

[0030] To achieve the above objectives, the present invention also provides a capacitor unit, which includes the capacitor modules as described above, wherein at least two capacitor modules are arranged closely to form a capacitor unit, and in a capacitor unit, an insulating layer is provided on the surface of each capacitor module adjacent to other capacitor modules.

[0031] Compared to existing technologies that extrude individual capacitor cells into an aluminum base, this invention's method of placing the capacitor core into the base further improves the yield rate of the capacitor module and reduces the temperature rise of the capacitor core.

[0032] This invention improves the capacitor's heat dissipation capacity by sealing the capacitor core and base together. Under the same electrolytic capacitor losses, it reduces the temperature rise of the capacitor core, thus improving the reliability of the electrolytic capacitor. At the same temperature rise, this capacitor module can absorb more ripple current, reducing the amount of bus capacitors required for the entire power converter and increasing the power density of the power supply.

[0033] Furthermore, the decrease in capacitance and the increase in ripple current lead to a corresponding increase in ripple voltage across the capacitor. This invention integrates an active capacitor module with a voltage ripple compensation circuit, providing a reverse ripple voltage to offset the voltage ripple on the capacitor. Ultimately, compared to a single capacitor, the active capacitor module can absorb more than twice the ripple current, and the ripple voltage across the capacitor is significantly reduced. Thus, the power density of the capacitor is increased to more than twice that of a single capacitor.

[0034] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0035] The above and other features and advantages of this invention will become more apparent from a detailed description of exemplary embodiments with reference to the accompanying drawings.

[0036] Figure 1 This is a schematic diagram of the structure of a single electrolytic capacitor;

[0037] Figure 2 It shows Figure 1 The equivalent thermal resistance model of a single electrolytic capacitor in a given process;

[0038] Figure 3 This is a schematic diagram of the capacitor module of this utility model;

[0039] Figure 4AThis is a flowchart illustrating the assembly method of the capacitor module of this utility model;

[0040] Figure 4B It shows according to Figure 4A The assembly process of assembling a capacitor module using assembly methods;

[0041] Figure 5A The structure of the capacitor module according to the first preferred embodiment of the present invention is shown, wherein the heat sink is a heat sink and is integrated with the base;

[0042] Figure 5B The structure of the capacitor module according to the second preferred embodiment of the present invention is shown, wherein the heat sink is a cold plate and is attached to the base;

[0043] Figure 6 The equivalent thermal resistance model after adopting the capacitor module of this invention is shown;

[0044] Figure 7A A schematic diagram of the heat sink-free aluminum base structure of the capacitor module of this utility model is shown.

[0045] Figure 7B A schematic diagram of the enlarged heat sink aluminum base structure of the capacitor module of this utility model is shown;

[0046] Figure 8A The simulated temperature distribution of the heat sink-free aluminum base of the capacitor module of this invention is shown.

[0047] Figure 8B The simulated temperature distribution results of the enlarged heat sink aluminum base of the capacitor module of this utility model are shown.

[0048] Figure 9 The diagram illustrates the ripple current capability of a single capacitor core under different wind speeds in two schemes of the capacitor module of this invention: one with an aluminum base without a heat sink and the other with an aluminum base with an enlarged heat sink, when the power supply is working.

[0049] Figure 10A The circuit topology of this invention, which integrates the capacitor module and voltage ripple compensation circuit into an active capacitor module, is shown.

[0050] Figure 10B The structure of the capacitor module and voltage ripple compensation circuit of this utility model integrated into an active capacitor module is shown.

[0051] Figure 11 The voltage V of the capacitor module in the active capacitor module of this invention is shown. E-cap Reference voltage V f Bus voltage V dc The waveform;

[0052] Figure 12 The control block diagram of the voltage ripple compensation circuit of this utility model is shown;

[0053] Figure 13 The comparison of capacitor ripple voltage before and after compensation is shown for the active capacitor module of this utility model.

[0054] Figure 14 The structure of the capacitor module according to the third preferred embodiment of the present invention is shown;

[0055] Figure 15 Parts (A), (B), and (C) respectively show the structure of the capacitor module in the fourth, fifth, and sixth preferred embodiments of this utility model, and respectively show several different capacitor core arrangement methods;

[0056] Figure 16 The structure of the capacitor module according to the seventh preferred embodiment of the present invention is shown;

[0057] Figure 17 The structure of the capacitor module according to the eighth preferred embodiment of the present invention is shown;

[0058] Figure 18 The structure of the capacitor module according to the ninth preferred embodiment of this utility model is shown;

[0059] Figure 19 The structure of the capacitor module according to the tenth preferred embodiment of this utility model is shown;

[0060] Figure 20 The structure of the capacitor unit of this invention, which consists of multiple capacitor modules, is shown.

[0061] Figure 21 It shows Figure 20 The structure of a capacitor module. Detailed Implementation

[0062] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore their detailed description will be omitted.

[0063] In describing the elements / components / etc. described and / or illustrated herein, the terms “a,” “an,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc. The terms “comprising,” “including,” and “having” are used to indicate an open-ended inclusion and to mean that additional elements / components / etc. may exist in addition to those listed. Furthermore, the terms “first,” “second,” etc., in the claims are used only as designations and are not intended to limit the number of objects to which they pertain.

[0064] It should be understood that the wording or terminology used herein is for descriptive purposes and not for limitation, so that those skilled in the art can interpret the terms or wording of this specification based on the teachings herein.

[0065] Different embodiments or examples are provided below for implementing different features of the subject matter provided by this utility model. Of course, these are merely examples and are not intended to be limiting. For example, the following description of "a first feature forming on or above a second feature" may, in embodiments, include direct contact between the first and second features, and may also include the formation of an additional feature between the first and second features such that the first and second features do not have direct contact. Furthermore, element symbols and / or letters may be repeated in various embodiments or examples of this utility model. This repetition is for simplicity and clarity and does not in itself limit the relationship between the various embodiments and / or configurations discussed.

[0066] Furthermore, spatial relative terms, such as “above,” “over,” “above,” “upper,” “under,” “below,” “lower,” “lower,” and similar expressions, are used herein to simplify the description of the relationship between one element or feature structure and another, as illustrated in the accompanying figures. In addition to the orientations depicted in the figures, spatial relative terms are intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative terms used herein may be interpreted accordingly.

[0067] Capacitors include film capacitors, electrolytic capacitors, and ceramic capacitors. Electrolytic capacitors contain an electrolyte and electrolytic paper, therefore their ESR (Equivalent Series Resistance) is often greater than that of film and ceramic capacitors. Electrolytic capacitors have weaker ripple current capability than film capacitors; under the same ripple current, their ESR loss and heat generation are greater, but they have higher energy density. Compared to supercapacitors with even higher energy density, electrolytic capacitors have higher voltage withstand capability. Considering both capacitance and voltage withstand capability, electrolytic capacitors are widely used in industrial equipment, new energy, and consumer power applications.

[0068] like Figure 1 The diagram shows the structure of a single electrolytic capacitor. The electrolytic capacitor 10 contains a capacitor core 11 (sometimes called a "capacitor core package"), which includes an anode foil, a cathode foil, and electrolytic paper wound together with electrolyte. A rubber stopper 14 (e.g., sealing rubber) seals the capacitor core 11 within an aluminum casing 12 to prevent electrolyte leakage. An insulating sleeve 13 is provided on the outside of the aluminum casing 12. Aluminum leads 15 are connected inside the capacitor core 11 to the anode and cathode foils respectively, and extend through the rubber stopper 14 to the outside of the capacitor 10 to form pins 151 for electrical connection to external circuitry.

[0069] like Figure 2 The diagram shows the equivalent thermal resistance model of a single electrolytic capacitor. Ripple current flows through the electrolytic capacitor, generating heat inside the capacitor core 11. Figure 2 In the process, heat is mainly transferred axially from the capacitor core 11 to the top of the aluminum shell 12, then diffuses to the periphery of the aluminum shell 12, and finally is transferred to the air through the insulating sleeves 13 around the periphery. Figure 2 The dashed line indicates the main heat transfer path (i.e., Ra (1.3 K / W) → Ra1 (2.5 K / W) → R3a (2.7 K / W) → R4 (0.29 K / W) → Rre (31.6 K / W)). From Figure 2 It can be seen that the thermal resistance Rre (31.6 K / W) from the insulating sleeve 13 to the air is the largest thermal resistance on this main heat transfer path. Where Ra is the axial thermal resistance of the capacitor core 11, Ra1 is the thermal resistance from the top to the sides of the aluminum shell 12, R3a is the thermal resistance around the aluminum shell 12, R4 is the thermal resistance from the aluminum shell 12 to the insulating sleeve 13, Rre is the thermal resistance from the insulating sleeve 13 to the air, and R1 (28.4 K / W) is the lateral thermal resistance of the capacitor core. The large value of R1 indicates that the lateral thermal resistance of the capacitor core 11 is high. Most of the heat from the capacitor is transferred to the aluminum shell 12 through the contact between the top (bottom) of the capacitor core 11 and the aluminum base. Therefore, the dashed line indicates that the main heat transfer path is the optimal heat transfer path.

[0070] like Figure 3 The diagram illustrates the structure of the capacitor module 30 of this invention. In this invention, the capacitor module 30 mainly includes a base 31, at least two capacitor cores 32, a sealing layer 33, and an explosion-proof layer 34. The base 31 may have at least one cavity 311. The capacitor cores 32 may be electrolyte capacitor cores and are placed directly within the cavity 311. The sealing layer 33 seals the cavity 311. The explosion-proof layer 34 is disposed on the surface opposite to the sealing layer 33, and the explosion-proof layer 34 includes an explosion-proof groove 341 corresponding to the cavity 311 (see reference). Figure 4B ).like Figure 4BAs shown, the explosion-proof groove 341 can be, for example, a Y-shaped groove, or a cross-shaped groove; the shape of the explosion-proof groove 341 is not limited to the shapes described above. When an abnormal situation occurs with the capacitor, the explosion-proof groove 341 facilitates the release of pressure inside the cavity. Furthermore, the leads 321 of the capacitor core 32 pass through the sealing layer 33 and are exposed on the outside of the cavity 311 (see reference). Figure 4B This facilitates circuit connection.

[0071] In some embodiments, in conjunction with reference Figure 3 The base 31 of this invention may include, for example, a first surface 31a (e.g., an upper surface) and a second surface 31b (e.g., a lower surface) disposed opposite each other along a first direction D1 (e.g., a vertical direction), and the axial direction of at least one cavity 311 is the same as that of the first direction D1. Furthermore, a sealing layer 33 may be disposed on the first surface 31a of the base 31, and an opening 311a penetrating the cavity 311 is formed on the first surface 31a; an explosion-proof layer 34 may be disposed on the second surface 31b of the base 31, and the explosion-proof layer 34 achieves directional pressure relief through the second surface 31b of the base 31. Preferably, the base 31 of this invention may be made of pure aluminum (i.e., aluminum purity greater than 99.6%) or an aluminum alloy, such as an Al-Mn alloy. These materials are corrosion-resistant, dissipate heat easily, and are lighter than other metal materials. It is understood that the material of the base 31 of this invention is not limited to the above-mentioned materials.

[0072] exist Figure 3 In the illustrated embodiment, a base 31 has three independent cavities 311, and three capacitor cores 32 are respectively placed within these cavities 311. Of course, it is understood that in other embodiments, a base 31 may also have only one cavity 311 (e.g., Figure 17 and Figure 18 (as shown), or having other numbers of cavities 311, these are not intended to limit the present invention.

[0073] In some embodiments, the inner wall of the cavity 311 on the base 31 of this invention and the outer wall of the capacitor core 32 placed therein are in a clearance fit, with a gap of 0.2mm to 1.5mm between them. More preferably, this gap is, for example, 0.5mm to 1.0mm. This gap not only ensures that the capacitor core can be placed into the cavity of the aluminum base without obstruction, but also provides space for the thermal expansion of the capacitor core during operation. This gap allows the capacitor core 32 and the cavity 311 to be assembled without precision, reducing the requirements for assembly force and simplifying the assembly process. The bottom of the capacitor core 32 is in close contact with the bottom of the corresponding cavity 311 without any gap, which facilitates heat conduction from the capacitor core 32 to the base 31.

[0074] In some embodiments, the capacitor core 32 of this invention comprises an anode foil, a cathode foil, and electrolytic paper wound together. Specifically, the capacitor core 32 of this invention does not include an aluminum shell or an insulating sleeve disposed outside the aluminum shell.

[0075] In some embodiments, the sealing layer 33 of this invention can be inserted into the opening 311a via an interference fit. For example, in Figure 3 In the illustrated embodiment, after the capacitor core 32 is placed inside the cavity 311, these cavities 311 can be sealed by three independent sealing elements 331. These sealing elements 331 form the sealing layer 33 of this invention, which can prevent electrolyte leakage and fix the capacitor core 32. Furthermore, the leads 321 of these capacitor cores 32 are exposed on the outside of each sealing element 331 after sealing. Preferably, these sealing elements 331 can be, for example, rubber stoppers, which can meet the requirements of sealing performance, insulation, high temperature resistance, aging resistance, and solvent resistance. The rubber stoppers are elastic and are sealed by interference fit, simplifying the process. The sealing elements 331 can be made of at least one or more of the following materials: natural rubber, ethylene propylene rubber, or butyl rubber.

[0076] In other embodiments, the sealing layer 33 of this invention can also be fixed to the opening 311a by casting and curing. Using an integral casting and curing method will result in better sealing.

[0077] In other embodiments, the sealing layer 33 of this invention can be inserted into the opening 311a via an interference fit, and then fixed to the opening 311a or its surroundings via a casting and curing method. Alternatively, the sealing layer 33 can be inserted into the opening 311a via an interference fit, and then fixed to the opening 311a or its surroundings via a localized adhesive application and curing method. This multi-layer sealing approach, combining the sealing layer with the casting and curing method, enhances the sealing performance.

[0078] It is understood that the material and forming method of the sealing layer 33 of this utility model are not limited to the above-mentioned material and forming method. According to different design requirements, other feasible materials and forming methods can also be used to manufacture the sealing layer. Casting and curing can use materials such as epoxy. These are not intended to limit this utility model.

[0079] Please refer to the reference. Figure 4A and Figure 4B ,in Figure 4A This illustration shows a schematic flow of the assembly method 30P for the capacitor module of this invention. Figure 4B It schematically shows the following according to Figure 4A The assembly method assembles to form a such Figure 3 The specific assembly process 30Q of the capacitor module 30 of this utility model is shown.

[0080] like Figure 4A As shown, the assembly method 30P of the capacitor module of this utility model may include: step S1, hollowing out the base 31 to form at least one cavity 311; step S2, forming an explosion-proof layer 34 on the base 31, the explosion-proof layer 34 including an explosion-proof groove 341 corresponding to the cavity 311; step S3, placing at least two capacitor cores 32 directly into the cavity 311, and sealing the cavity 311 correspondingly through the sealing layer 33 to form a capacitor module 30, wherein the capacitor cores 32 are electrolyte capacitor cores, and the leads of the capacitor cores 32 pass through the sealing layer 33 and are exposed on the outside of the cavity 311.

[0081] like Figure 4B As shown, one as Figure 3 The specific assembly process 30Q of the capacitor module 30 of this utility model includes: first, hollowing out the base 31 to form three cavities 311; then, forming an explosion-proof layer 34 at the bottom of the base 31, including explosion-proof grooves 341 disposed at positions corresponding to the cavities 311; then, directly placing three capacitor cores 32 into the cavities 311 and sealing them with a sealing member 331, thereby forming a capacitor module 30.

[0082] It is understood that, depending on the structure of the capacitor module of this utility model, the assembly method and assembly process of the capacitor module of this utility model may further include other assembly steps, which are not intended to limit this utility model. For example, the assembly steps may also be: step S1, forming an explosion-proof layer 34 on the base 31; step S2, hollowing out the base 31 to form at least one cavity 311, the cavity 311 corresponding to the explosion-proof groove 341 of the explosion-proof layer 34; step S3, directly placing at least two capacitor cores 32 into the cavity 311, and sealing the cavity 311 through the sealing layer 33 to form a capacitor module 30, wherein the capacitor core 32 is an electrolyte capacitor core, and the leads of the capacitor core 32 pass through the sealing layer 33 and are exposed on the outside of the cavity 311.

[0083] In some embodiments, in conjunction with reference Figure 3 and Figure 4B Preferably, the explosion-proof layer 34 of this utility model can be integrated with the base 31. The integrated explosion-proof layer can achieve better sealing performance, and the cavity 311 does not penetrate the second surface 31b of the base 31. The explosion-proof layer 34 includes an explosion-proof groove 341 formed on the second surface 31b.

[0084] In some other embodiments, the explosion-proof layer of this invention can be attached to the second surface of the base, and the cavity penetrates the second surface of the base, wherein an explosion-proof groove is formed on the outer surface of the explosion-proof layer.

[0085] In some other embodiments, the explosion-proof layer of the present invention can be embedded in the cavity and close to the second surface of the base, and the cavity penetrates the second surface of the base, wherein an explosion-proof groove is formed on the outer surface of the explosion-proof layer.

[0086] It is understood that the structure and formation method of the explosion-proof layer of this utility model are not limited to the above-mentioned methods. Depending on different design requirements, other feasible structures and formation methods can also be used to manufacture the explosion-proof layer, and these are not intended to limit this utility model.

[0087] In some embodiments, such as Figure 3 As shown, the capacitor module 30 of this utility model may further include a heat sink 35, which can be thermally connected to the base 31.

[0088] In some embodiments, the radiator 35 includes a first radiator and a second radiator, which may be, for example, heat sinks or cold plates. Furthermore, the first and second radiators may be integrally formed with the base 31 or fitted onto the base 31.

[0089] Reference Figure 3In this invention, the heat sink 35 may include, for example, a first heat sink disposed on at least one circumferential surface 31c of the base 31; and / or, a second heat sink (not shown) disposed on a portion of the first surface 31a and / or the second surface 31b of the base 31.

[0090] Preferably, the projections of the first and / or second radiators onto their respective mounting surfaces extend beyond those surfaces. Such radiators extending beyond the surface of the base are called "enlarged radiators," and by incorporating enlarged radiators, the volume of the radiators can be further increased, thereby improving heat dissipation.

[0091] Typically, the first radiator can be provided on the circumferential surface with the largest surface area among all the circumferential surfaces of the base 31. However, it is understood that the first radiator can also be provided on at least two or all of the circumferential surfaces, which is not intended to limit the present invention.

[0092] Typically, a second heat sink can be provided on a portion of the first surface 31a (i.e., the upper surface) and / or the second surface 31b (i.e., the lower surface) of the base 31. For example, the second heat sink can be provided at a position on the second surface 31b (i.e., the lower surface) of the base 31 that does not correspond to the cavity 311, or the second heat sink can be provided at a position on the first surface 31a (i.e., the upper surface) of the base 31 that does not correspond to the cavity 311. Alternatively, heat sinks can be provided on the first surface 31a (i.e., the upper surface), the second surface 31b (i.e., the lower surface), and at least one circumferential surface of the base 31.

[0093] More specifically, such as Figure 5A As shown, it illustrates the structure of the capacitor module 30-1 according to a first preferred embodiment of the present invention. Figure 5A In the illustrated embodiment, the first heat sink 35a is, for example, a heat sink fin and is integrated with the base 31. This integrated structure reduces the contact thermal resistance between the capacitor module and the external heat sink.

[0094] More specifically, such as Figure 5B As shown, it illustrates the structure of the capacitor module 30-2 according to a second preferred embodiment of the present invention. Figure 5B In the illustrated embodiment, the first heat sink 35b is, for example, a cold plate and is fitted to the base 31, and the projection of the first heat sink 35b onto its corresponding surface extends beyond that surface. This fitted structure effectively increases the heat dissipation area of ​​the base (e.g., an aluminum base). Furthermore, in Figure 5B In the illustrated embodiment, coolant (e.g., water) can be supplied from the inlet end P of the first radiator 35b (e.g., a cold plate). IN Enter, and exit from P OUTThe liquid flows out and circulates within the cold plate, allowing for faster heat dissipation from the capacitor module. This method of heat removal through "liquid circulation within the cold plate" can even reduce the thermal resistance Rre between the base 31 (e.g., aluminum base) and air (see reference). Figure 6 It decreased to around 0.

[0095] Figure 6 The equivalent thermal resistance model after employing the capacitor module of this invention is shown. From Figure 6 Based on the optimal heat transfer path shown (i.e., Ra→Ra1→R3a→R4→Rre), theoretical calculations show that, before using the capacitor module of this invention, the specific thermal resistance data could be, for example, Ra=1.3K / W, Ra1=2.5K / W, Rae1=0.012K / W, Rae=276K / W, Rb=58K / W, Rbe=283K / W, R3a=2.7K / W, R1=28.4K / W, R2=22.7K / W, R3=0.1K / W, R4=0.29K / W, and Rre=31.6K / W. Therefore, the total thermal resistance R of this optimal heat transfer path is... TOTAL For Ra + Ra1 + R3a + R4 + Rre, R TOTAL = 1.3kW + 2.5kW + 2.7kW + 0.29kW + 31.6kW = 38.39kW. Where Ra is the axial thermal resistance of the capacitor core 11, Ra1 is the thermal resistance from the top to the sides of the aluminum shell 12, R3a is the thermal resistance around the aluminum shell 12, R4 is the thermal resistance from the aluminum shell 12 to the insulating sleeve 13, and Rre is the thermal resistance from the insulating sleeve 13 to the air. However, after adopting the capacitor module of this invention, since there is no aluminum shell or insulating sleeve on the outside of the capacitor core, and multiple capacitor cores are directly set in the base cavity to form a capacitor module, and no insulating sleeve is set on the outside of the capacitor module, the thermal resistance from the base (e.g., aluminum base) to the air can also be reduced to about 0. Thus, in this optimal heat transfer path, R4 + Rre = 0. Therefore, the total thermal resistance R of this optimal heat transfer path is... TOTAL This can be reduced to 1.3 + 2.5 + 2.7 = 6.5 kW. Therefore, it can be seen that, after adopting the capacitor module of this invention, theoretical calculations show that the total thermal resistance of this optimal heat transfer path can be reduced by 6 times, significantly improving the capacitor's heat dissipation capacity.

[0096] Therefore, compared to existing technologies that involve squeezing individual capacitor cells with aluminum shells into the cavity of an aluminum base, this invention places the electrolytic capacitor core directly within the cavity of the base (e.g., an aluminum base). This not only eliminates the need for an aluminum shell around the capacitor core but also avoids the interference fit between the individual electrolytic capacitor and the cavity of the aluminum base, fundamentally solving the problem of capacitor damage when squeezing the capacitor into the aluminum base. Furthermore, this invention incorporates a gap between the capacitor core and the inner wall of the cavity, eliminating the need for precise assembly and reducing the required assembly strength and difficulty. The gap also meets the heat dissipation requirements of the capacitor module, reducing thermal resistance. By eliminating the aluminum shell of the individual capacitor cells, this invention also saves on the manufacturing cost of high-precision aluminum shells. Moreover, in this invention, the base (e.g., an aluminum base) does not need to be machined with precise cavity dimensions to fit the capacitor core, thus reducing the manufacturing difficulty and cost of the base (e.g., the aluminum base). From a thermal model perspective, this invention eliminates the additional thermal resistance of the aluminum shell of a single capacitor by placing the capacitor core directly inside the cavity of the base (e.g., an aluminum base), and also avoids the additional thermal resistance of the air gap between the aluminum shell and the inner wall of the cavity of the aluminum base.

[0097] Figure 7A and Figure 7B The diagrams show two structural schemes of the capacitor module of this utility model: one with a heat sink-less aluminum base and the other with an enlarged heat sink base. Table 1 shows the simulation temperature rise comparison results of the two schemes of the capacitor module of this disclosure. In the simulation process, the initial temperature of each capacitor core was set to 20°C, that is, the ambient temperature was 20°C. The data in the table are the temperature rise values ​​(i.e., "temperature rise"). Figure 7A The structure of the heat sink-free aluminum base of this utility model is shown; Figure 7B The structure of the enlarged aluminum base for the heat sink of this utility model is shown. Figure 8A and Figure 8B Simulated temperature distribution results for two schemes of the capacitor module of this utility model are shown: one with an aluminum base without a heat sink and the other with an enlarged aluminum base with a heat sink. Figure 8A The simulated temperature distribution results of the heat sink-free aluminum base structure of this utility model are shown under natural convection and under the condition of cooling fan wind speed Vx = 2m / s. Figure 8B The simulated temperature distribution results of the enlarged aluminum base of the heat sink according to this invention are shown under natural convection and under the condition of cooling fan wind speed Vx = 2m / s.

[0098] like Figure 7A and Figure 7BAs shown, five capacitor cores (e.g., #1 to #5) are placed inside the cavity of an aluminum base, with each core receiving a ripple current loss of 1W. The temperature rise of the capacitor cores under different wind speeds is compared between aluminum bases without heat sinks and those with enlarged heat sinks (ambient temperature 20℃). When the wind speed Vx = 2m / s, the temperature rise data in Table 1 shows that with the enlarged heat sink, the temperature rise of each capacitor core is less than 5℃. With the enlarged heat sink, the overall thermal resistance from the capacitor core to the air in this capacitor module is 5kΩ / W ((5℃ rise) / 1W). TOTAL =5K / W (close to the theoretical analysis value). As analyzed above, at this point, the thermal resistance from the aluminum base to the air in the capacitor module of this invention is reduced to 0 (i.e., R4 + Rre = 0). Compared with the solution without a heat sink aluminum base, the solution with a larger heat sink aluminum base can more effectively reduce the temperature rise of the capacitor.

[0099] Table 1: Temperature rise data of each capacitor core in the capacitor module (unit: °C)

[0100]

[0101] In addition to effectively reducing the temperature rise of capacitors, such as Figure 8A and Figure 8B As shown in the simulation temperature distribution results and the temperature rise data in Table 1, by using a larger aluminum base for the heat sink, not only is the overall thermal resistance of the capacitor module reduced, but there is also virtually no temperature difference between different capacitor cores inside the capacitor module of this invention, and the aluminum base has a good temperature uniformity effect.

[0102] Figure 9 This demonstrates the ripple current handling capability of a single capacitor core under different wind speeds in two schemes of the capacitor module of this invention: one with an aluminum base without a heat sink and the other with an aluminum base with an enlarged heat sink, both when the power supply is operating. Figure 9 As shown, when the power supply is operating, with a cooling fan speed of 1 m / s and an ambient temperature of 40°C, if the maximum allowable temperature of the capacitor core is 75°C, then each capacitor core can withstand a temperature rise of 35°C (maximum allowable temperature minus ambient temperature). Simulation calculations are used to obtain the maximum power without a heatsink and the maximum power with a heatsink. Figure 9 As shown, for the capacitor module of this invention that adopts an enlarged aluminum heat sink base, the R of a single capacitor core within the module... TOTAL =5K / W, assigning a ripple current loss of 1W to each capacitor core, with a temperature rise of 5℃ for each core. If the allowable temperature rise for each core is 35℃, the loss of each core in the capacitor module can be increased from 1W to 6W. The right-hand axis represents the maximum power, where the maximum power without a heatsink and the maximum power with a heatsink are calculated using simulation. Figure 9The graph shows a broken line. The left axis represents the temperature rise (i.e., "temperature increase"). The ambient temperature is 40℃, and the loss of each capacitor core is 1W. Under different wind speeds, blue represents the temperature rise without a heatsink aluminum base, and green represents the temperature rise with an enlarged heatsink aluminum base. Figure 9 The columnar shape in the middle.

[0103] Since losses are proportional to the square of the effective value of the ripple current, the ripple current of a single capacitor core can be increased by up to 2.5 times. From the perspective of ripple current absorption, to absorb the same ripple current, the number of electrolytic capacitors used can be reduced by 2.5 times, significantly reducing the volume occupied by the bus capacitors and increasing the power density of the power supply.

[0104] In summary, the capacitor module of this invention improves heat dissipation. Under the same ripple current and ESR loss, it can reduce the temperature rise of the electrolytic capacitor core and improve the reliability of the electrolytic capacitor. Furthermore, under the same temperature rise, the electrolytic capacitor can handle more ripple current.

[0105] In some embodiments of the present invention, the output terminals of at least two capacitor cores are connected in parallel. The at least two capacitor cores may be located in the same cavity, or at least two capacitor cores located in different cavities.

[0106] In some embodiments, the capacitor module of this invention may further include a busbar for connecting the pins of at least two capacitor cores in a capacitor module. Furthermore, the busbar may have a set of positive and negative output terminals for connecting to external circuits (including but not limited to, voltage ripple compensation circuits). More specifically, when multiple capacitor cores are packaged in a module, each capacitor core has a set of lead terminals (i.e., including both positive and negative leads). For example, when five capacitor cores are packaged in a module, the module has five sets of lead terminals. These five sets of lead terminals can be connected together by a busbar, which can also provide a set of positive and negative output terminals for connecting to external circuits. Preferably, this busbar can be implemented using multilayer copper foil or a PCB board.

[0107] In some embodiments, in conjunction with reference Figure 10A and Figure 10B The capacitor module of this invention may further include a voltage ripple compensation circuit 38. The voltage ripple compensation circuit 38 may be connected in series with a set of positive and negative output terminals of the busbar. Preferably, the voltage ripple compensation circuit 38 may include, for example, an input source (e.g., V...). aux ), output filter (e.g., L) inv C inv ), and a switching circuit disposed between the input source and the output filter, such as Figure 10AThe circuit topology shown schematically illustrates the voltage ripple compensation circuit 38 and capacitor module 30 of this invention. Figure 10A C E-cap A series-connected circuit topology. A switching circuit, for example, may include multiple switches. Figure 10B In the illustrated embodiment, the voltage ripple compensation circuit 38 may, for example, be disposed on a PCB board 39, which may also include at least one of a switch, an inductor, a capacitor, and a controller. Figure 10B As shown, in this invention, a PCB board 39 can be placed close to one side of a capacitor module 30. The PCB board 39 may include a voltage ripple compensation circuit 38 and a busbar. The capacitor module 30 and the voltage ripple compensation circuit 38 can be integrated into an active capacitor module 30M. By setting switches, inductors, capacitors, controllers, and other devices on the PCB board 39, the voltage compensation circuit 38 can be placed close to the PCB board 39, thereby enabling local sampling and compensation of the capacitor voltage.

[0108] In this invention, the capacitor module scheme can reduce the bus capacitor capacity and increase the power density of the power supply. If the total bus ripple current remains unchanged, the ripple voltage on the bus increases: Vripple = Iripple * 1 / (jωC). Where Vripple is the voltage ripple, Iripple is the current ripple, j is the imaginary unit, ω is the angular frequency (rad / s), C is the capacitance (farad (F)), and 1 / (jωC) is the capacitive reactance. It can be seen that the smaller the capacitance, the larger the ripple voltage while the total ripple current flowing through the capacitor module remains constant. Increased ripple voltage requires additional voltage tolerance margin when selecting power devices and may increase the power supply's regulation range, potentially affecting efficiency. Figure 11 It shows Figure 10A Medium capacitor module 30 (i.e. Figure 10A C E-cap The voltage V across the terminals E-cap Reference voltage V f Bus voltage V dc The waveform. When the capacitor module 30 (i.e. Figure 10A C E-cap When voltage ripple is generated on the capacitor module 30, the voltage ripple compensation circuit 38 samples the voltage ripple of the capacitor module 30 in real time, and simultaneously outputs a reverse ripple voltage to cancel the voltage ripple of the capacitor module C. E-cap This reduces voltage ripple on the bus, such as... Figure 11 As shown, the bus voltage is V. dc . Figure 12 A schematic control block diagram of a preferred voltage compensation circuit of this invention is shown. Figure 12 It can be seen that V E-cap As the controlled object, the reference voltage V of the voltage ripple compensation circuit 38 f and the reverse capacitor module voltage V E-cap Comparisons are made to implement closed-loop control. The real-time performance and accuracy of capacitor ripple voltage sampling are crucial so that the voltage compensation circuit can accurately provide reverse ripple.

[0109] To sample capacitor ripple voltage in real time and with greater accuracy, the sampling circuit and compensation circuit can be positioned near the capacitor being compensated, the closer the better. (Refer to the reference...) Figure 10B As shown, this utility model integrates the voltage ripple compensation circuit 38 and the busbar on a PCB board 39, and places the PCB board 39 close to one side of the capacitor module 30, thereby integrating it into an active capacitor module 30M. In this way, the sampling circuit and the compensation circuit can be minimized, the parasitic parameters of the sampling circuit and the compensation circuit can be reduced, and the ripple compensation effect can be improved. Figure 13 The comparison of capacitor ripple voltage before and after compensation is shown for the active capacitor module 30M of this invention. Figure 13 Part (A) represents the ripple voltage of the capacitor module before compensation. Figure 13 Part (B) is the compensated capacitor module ripple voltage, which is... Figure 13 It can be seen that after ripple compensation, the capacitor module 30 of this utility model (such as...) Figure 10A As shown, the active capacitor module 30M can absorb a larger ripple current while significantly reducing the ripple voltage. In some embodiments, the active capacitor module 30M can integrate all the components in the voltage ripple compensation circuit 38, or it can integrate only some power switches, inductors, capacitors, or controllers, etc., which is not intended to limit the present invention.

[0110] Figure 14 The structure of the capacitor module 30-3 according to the third preferred embodiment of this utility model is shown. For example... Figure 14 As shown, two capacitor cores 32 are encapsulated within a base 31 (e.g., an aluminum base) to form a capacitor module 30-3.

[0111] In some embodiments of the present invention, multiple capacitor cores may be arranged in a strip, triangle, square or ring shape on a base.

[0112] like Figure 15 As shown, sections (A), (B), and (C) respectively illustrate the structure of the capacitor module in the fourth, fifth, and sixth preferred embodiments of this utility model. Taking the placement of three capacitor cores within a base (e.g., an aluminum base) as an example, several different capacitor core arrangement methods are illustrated. For instance, as... Figure 15As shown in part (A), three capacitor cores are arranged in a row at intervals within a long strip base 31, thus forming a capacitor module 30-4; as Figure 15 As shown in part (B), three capacitor cores are arranged in a right-angled triangle within a square base 31, thus forming a capacitor module 30-5; as Figure 15 As shown in section (C), three capacitor cores are arranged in an isosceles triangle within a square base 31, forming a capacitor module 30-6. In this invention, a suitable arrangement can be selected based on different application scenarios. For example, a long, narrow arrangement offers high space utilization and can be placed within a compact power converter; however, if heat sinks are installed on multiple surfaces of the base, the heat dissipation area of ​​this long, narrow arrangement is not optimal. Conversely, a square arrangement occupies relatively more space, but the surface area available for heat dissipation is optimal.

[0113] In this invention, the capacitor module can be set in a square shape, or in other shapes, such as a circle, triangle, or other irregular shapes.

[0114] like Figure 16 The diagram illustrates the structure of a capacitor module 30-7 according to a seventh preferred embodiment of the present invention. The base 31 of the capacitor module 30-7 is an annular base, and multiple capacitor cores 32 are arranged in a ring along the annular base. Preferably, the capacitor module 30-7 may further include a fourth heat sink 35c, which is thermally connected to the annular base and correspondingly disposed on the inner circumferential surface 31e of the annular base. The fourth heat sink 35c is a heat sink fin or a cold plate, and can be integrated with the base 31 or attached to the base 31. For specific power supply space structures, the capacitor module can be combined with air ducts, etc., offering heat dissipation advantages.

[0115] In some embodiments of the present invention, at least two capacitor cores may be provided in a cavity, and the outer potentials of the at least two capacitor cores placed in the same cavity are equal, so that even if these capacitor cores placed in the same cavity come into contact, the electrical function will not be affected.

[0116] For example, such as Figure 17The diagram illustrates the structure of a capacitor module 30-8 according to an eighth preferred embodiment of the present invention. In this capacitor module 30-8, a cavity 311 is formed within a base 31. This cavity 311 includes a first cavity portion 311a and a second cavity portion 311b that are connected. Two capacitor cores 32a and 32b are respectively placed within the first cavity portion 311a and the second cavity portion 311b. The outer layer potentials of the two capacitor cores 32a and 32b placed within the same cavity 311 are equal. Figure 17 In the illustrated embodiment, the gap d between the outer wall of the capacitor core 32 placed in the cavity and the inner wall of the cavity 311 is also schematically shown. This gap d is preferably, for example, 0.2 mm to 1.5 mm, and more preferably, for example, 0.5 mm to 1.0 mm.

[0117] For example, such as Figure 18 The diagram illustrates the structure of a capacitor module 30-9 according to a ninth preferred embodiment of the present invention. In this capacitor module 30-9, a cavity 311 is formed within a base 31. This cavity 311 includes a first cavity portion 311a, a second cavity portion 311b, and a third cavity portion 311c that are connected. Three capacitor cores 32a, 32b, and 32c are respectively placed within the first cavity portion 311a, the second cavity portion 311b, and the third cavity portion 311c. The outer layer potentials of the three capacitor cores 32a, 32b, and 32c placed within the same cavity 311 are equal.

[0118] Compared to Figure 3 The embodiment shown depicts multiple capacitor cores placed into their respective independent cavities, such as... Figure 17 and 18 The embodiment shown, in which multiple cavity sections are connected to form a large cavity, can further reduce the overall size of the capacitor module without affecting heat dissipation performance.

[0119] Reference Figure 19 This illustrates the structure of the capacitor module 30-10 according to the tenth preferred embodiment of the present invention. In this invention, the heat sink 35 may further include a third heat sink 35d corresponding to a non-cavity region disposed inside the base 31. The third heat sink 35d penetrates the base 31 to form a cooling pipe, which is connected to an external heat exchange device to improve cooling efficiency. The inlet end P of the cooling pipe... IN With export end P OUT They can be located on the same surface or on different surfaces. A cooling medium is provided in the cooling pipes, preferably a liquid, but it can also be a gas or other form. However, it is understood that the shape of the cooling pipes formed by the third radiator 35d is not necessarily... Figure 19The shape shown is for illustrative purposes only. Compared to the first and second heat sink configurations, the third heat sink 35d, located inside the base 31, allows for more efficient heat dissipation. Cooling pipes inside the base can serve as a single heat dissipation method, or they can be combined with heat dissipation methods such as the first and / or second heat sinks to further improve heat dissipation efficiency. Preferably, as shown... Figure 19 As shown, the cooling channels formed by the third heat sink 35d within the base 31 can be disposed adjacent to the sidewalls of each capacitor core (i.e., for example, forming...). Figure 19 The meandering structure shown in the figure is designed to evenly reduce the heat of each capacitor core and improve heat dissipation efficiency. Different flow channel designs can also be matched according to the different heat generation of different capacitor cores to better balance the temperature rise of different capacitor cores.

[0120] In this invention, when a circuit requires multiple capacitor modules with different potentials, an insulating layer can be provided on the outside of each capacitor module to prevent short circuits between the aluminum bases of the capacitor modules. The insulating layer can be placed only at the interface between two adjacent capacitor modules, or it can be pre-covered to adapt to various application scenarios.

[0121] like Figure 20 The diagram illustrates the structure of a capacitor unit 30U composed of multiple capacitor modules, as shown in this invention. Figure 20 In the illustrated embodiment, three capacitor modules 30A, 30B, and 30C are arranged closely together to form a capacitor unit 30U. Within a capacitor unit 30U, each capacitor module has an insulating layer 36 covering its adjacent surface. For example, referring to the reference... Figure 21 In this capacitor unit 30U, a first insulating layer 361 is coated on the outer surface of capacitor module 30A adjacent to capacitor module 30B, and a second insulating layer 362 is coated on the outer surface of capacitor module 30A adjacent to capacitor module 30C. It is understood that in other embodiments, the number of capacitor modules constituting one capacitor unit 30U may be two, four, or more, and these are not intended to limit the present invention.

[0122] like Figure 21 As shown, for capacitor module 30A, since the bottom of the base 31 of capacitor module 30A is an explosion-proof groove, and a heat sink 35 needs to be added on one side (e.g., the left side), the preset insulating layer 36 can cover up to three outer surfaces of the base 31 (i.e., except for the outer surface on the left side).

[0123] Compared to the existing technology that extrudes individual capacitor cells into an aluminum base, the present invention directly places the capacitor core into the base, which can not only further improve the yield of capacitor modules, but also further reduce the temperature rise of the capacitor core.

[0124] The capacitor module of this invention significantly reduces the thermal resistance between the capacitor core and the air by directly embedding the capacitor core and combining it with heat dissipation methods such as increasing the heat dissipation area or circulating liquid cooling, thereby improving the absorption capacity of ripple current.

[0125] The capacitor module of this invention can also be better compensated for ripple voltage by integrating a voltage ripple compensation circuit, ultimately making the capacitor module an ideal capacitor that can absorb large ripple circuits and output low ripple voltage.

[0126] This invention improves the capacitor's heat dissipation capacity by sealing the capacitor core and base together. Under the same electrolytic capacitor losses, it reduces the temperature rise of the capacitor core, thus improving the reliability of the electrolytic capacitor. At the same temperature rise, this capacitor module can absorb more ripple current, reducing the amount of bus capacitors required for the entire power converter and increasing the power density of the power supply.

[0127] Furthermore, the decrease in capacitance and the increase in ripple current lead to a corresponding increase in ripple voltage across the capacitor. This invention integrates an active capacitor module with a voltage ripple compensation circuit, providing a reverse ripple voltage to offset the voltage ripple on the capacitor. Ultimately, compared to a single capacitor, the active capacitor module can absorb more than twice the ripple current, and the ripple voltage across the capacitor is significantly reduced. Thus, the power density of the capacitor is increased to more than twice that of a single capacitor.

[0128] Exemplary embodiments of the present invention have been specifically shown and described above. It should be understood that the present invention is not limited to the disclosed embodiments; rather, the present invention is intended to cover various modifications and equivalent arrangements contained within the spirit and scope of the appended claims.

Claims

1. A capacitor module, characterized in that, include: The base has at least one cavity; At least two capacitor cores are placed directly inside the cavity, and the capacitor cores are electrolyte capacitor cores; A sealing layer is used to seal the cavity. An explosion-proof layer, opposite to the sealing layer, includes an explosion-proof groove corresponding to the cavity; The leads of the capacitor core pass through the sealing layer and are exposed to the outside of the cavity.

2. The capacitor module according to claim 1, characterized in that, There is a gap of 0.2 mm to 1.5 mm between the inner wall of the cavity and the outer wall of the capacitor core placed therein.

3. The capacitor module according to claim 1, characterized in that, The base includes a first surface and a second surface disposed opposite to each other along a first direction, and the axial direction of the at least one cavity is the same as that of the first direction; The sealing layer is located on the first surface of the base, and the first surface has an opening that penetrates the cavity; The explosion-proof layer achieves directional pressure relief through the second surface of the base.

4. The capacitor module according to claim 3, characterized in that, The sealing layer is inserted into the opening via an interference fit.

5. The capacitor module according to claim 3 or 4, characterized in that, The sealing layer is fixed to the opening by a casting and curing method.

6. The capacitor module according to claim 3, characterized in that, Also includes: The heat sink is thermally connected to the base.

7. The capacitor module according to claim 6, characterized in that, The heat sink includes: A first heat sink is disposed on at least one circumferential surface of the base; and / or, The second heat sink is disposed on a portion of the first surface and / or the second surface of the base.

8. The capacitor module according to claim 7, characterized in that, The projection of the first heat sink and / or the second heat sink onto its corresponding surface extends beyond the corresponding surface.

9. The capacitor module according to claim 6, characterized in that, The radiator is integrated with the base, or the radiator is attached to the base.

10. The capacitor module according to claim 7, characterized in that, The first radiator and the second radiator are heat sinks or cold plates.

11. The capacitor module according to claim 6, characterized in that, The heat sink includes: The third radiator is disposed in the non-cavity area inside the base, and the third radiator passes through the base to form a cooling pipe.

12. The capacitor module according to claim 11, characterized in that, The cooling pipe is connected to an external heat exchange device, and a cooling medium, which is either liquid or gas, is provided in the cooling pipe.

13. The capacitor module according to claim 3, characterized in that, The explosion-proof layer is integrally formed with the base, the cavity does not penetrate the second surface of the base, and the explosion-proof layer includes the explosion-proof groove formed on the second surface.

14. The capacitor module according to claim 3, characterized in that, The explosion-proof layer is attached to the second surface, the cavity penetrates the second surface of the base, and the explosion-proof groove is formed on the outer surface of the explosion-proof layer.

15. The capacitor module according to claim 3, characterized in that, The explosion-proof layer is embedded in the cavity and close to the second surface of the base. The cavity penetrates the second surface of the base, and the explosion-proof groove is formed on the outer surface of the explosion-proof layer.

16. The capacitor module according to claim 1, characterized in that, At least two capacitor cores are disposed within one cavity, and the outer potentials of the at least two capacitor cores placed in the same cavity are equal.

17. The capacitor module according to claim 1, characterized in that, The output terminals of at least two of the capacitor cores are connected in parallel.

18. The capacitor module according to claim 1, characterized in that, Also includes: A busbar is used to connect the pins of at least two capacitor cores in one of the capacitor modules, and the busbar has a set of positive and negative output terminals.

19. The capacitor module according to claim 18, characterized in that, Also includes: A voltage ripple compensation circuit is connected in series with a set of positive and negative output terminals of the busbar; The voltage ripple compensation circuit includes an input source, an output filter, and a switching circuit disposed between the input source and the output filter.

20. The capacitor module according to claim 19, characterized in that, The voltage ripple compensation circuit is disposed on a PCB board, and the PCB board also includes at least one of a switch, an inductor, a capacitor, and a controller.

21. The capacitor module according to claim 1, characterized in that, Also includes: An insulating layer is disposed on at least one outer surface of the base.

22. The capacitor module according to claim 1, characterized in that, Multiple capacitor cores are arranged in a strip, triangle, square or ring shape on a base.

23. The capacitor module according to claim 1, characterized in that, The base is an annular base, and the multiple capacitor cores are arranged in a ring along the annular base.

24. The capacitor module according to claim 23, characterized in that, Also includes: The fourth heat sink is thermally connected to the annular base and is correspondingly disposed on the inner circumferential surface of the annular base. The fourth heat sink is a heat sink fin or a cold plate.

25. The capacitor module according to claim 1, characterized in that, The base is a pure aluminum base or an aluminum alloy base.

26. A capacitor unit, characterized in that, The capacitor includes at least two capacitor modules as described in claim 1, wherein the at least two capacitor modules are arranged closely together to form a capacitor unit, and in the capacitor unit, an insulating layer is provided on the surface of each capacitor module adjacent to the other capacitor modules.

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