Ceramic electronic component
The ceramic electronic component design addresses parasitic L component issues by shortening wiring distances through a laminate structure with a GND terminal covering side surfaces and internal conductors, enhancing GND properties and reducing waveform distortion.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- MURATA MFG CO LTD
- Filing Date
- 2025-11-28
- Publication Date
- 2026-06-11
AI Technical Summary
Existing ceramic electronic components face issues with increased parasitic L components due to extended wiring distances between external electrodes and shield films, leading to weakened GND properties and waveform distortion in high-frequency regions.
A ceramic electronic component design featuring a laminate structure with a GND terminal covering over 80% of the side surfaces, a flat bottom surface, and IO terminals positioned away from the periphery, reducing wiring distances and incorporating shield films connected to the GND terminal via internal conductors or ridge lines.
This configuration minimizes undesired L components, thereby suppressing waveform distortion and enhancing GND properties in high-frequency operations.
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