Electronic device

Abstract

This application relates to the field of electronic product technology, and more particularly to an electronic device, comprising: a motherboard bracket on which conductive structural components are disposed; a metal decorative component disposed on one side of the motherboard bracket; a motherboard disposed on the other side of the motherboard bracket, on which a shielding cover is disposed; and a plurality of conductive components, wherein at least one conductive component is disposed between the metal decorative component and the conductive structural components, and at least one conductive component is disposed between the conductive structural components and the shielding cover, thereby realizing an electrical connection between the metal decorative component and the shielding cover. In this electronic device, the metal decorative component is electrically connected to the shielding cover through the conductive components and the conductive structural components disposed on the motherboard bracket. The grounding characteristics of the shielding cover are utilized to ground the metal decorative component. Compared with the prior art, there is no need to set a grounding spring on the motherboard, thus avoiding the occupation of motherboard area.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and more particularly to an electronic device. Background Technology

[0002] Currently, mobile phones typically have metal decorative parts in the camera area. To prevent these metal decorative parts from affecting the phone's communication performance, grounding posts are usually installed on them. These grounding posts pass through the phone's motherboard bracket and contact the grounding spring on the motherboard, thus grounding the metal decorative parts. However, the grounding spring occupies area on the motherboard, affecting the arrangement of other electronic components. Utility Model Content

[0003] To address the aforementioned technical problems, this application provides an electronic device.

[0004] This application provides an electronic device, including:

[0005] The motherboard bracket has conductive structural components mounted on it;

[0006] A metal decorative component is disposed on one side of the motherboard bracket;

[0007] A motherboard is located on the other side of the motherboard bracket, and a shielding cover is provided on the motherboard.

[0008] A plurality of conductive elements are provided, wherein at least one of the conductive elements is disposed between the metal decorative element and the conductive structural element, and at least one of the conductive elements is disposed between the conductive structural element and the shielding cover, thereby realizing an electrical connection between the metal decorative element and the shielding cover.

[0009] In some embodiments, the conductive element includes a conductive spring, one end of which is fixed relative to the conductive structural element, and the other end of which elastically abuts against the metal decorative element or the shielding cover.

[0010] In some embodiments, the other end of the conductive spring is provided with a locking head, and the metal decorative part or the shielding cover is provided with a locking groove, and the locking head is locked in the locking groove.

[0011] In some embodiments, the conductive element includes a conductive spring, one end of which is fixed relative to the metal decorative element or the shielding cover, and the other end is elastically abutted against the conductive structural element.

[0012] In some embodiments, the conductive element includes conductive foam, and the conductive foam is in a compressed state.

[0013] In some embodiments, the conductive element is embedded within the motherboard bracket;

[0014] Alternatively, the motherboard bracket is provided with a through hole, through which the conductive structural component passes and is fixed relative to the motherboard bracket.

[0015] In some embodiments, the conductive structural component includes a first sheet, a second sheet, and a third sheet connected in sequence, wherein the first sheet has a welding connection surface parallel to the third sheet, and the second sheet passes through the motherboard bracket;

[0016] At least one of the conductive elements is welded to each of the weld joint surfaces.

[0017] In some embodiments, the metal decorative element has a grounding post extending toward the motherboard bracket, and the conductive element abuts against or is connected to the grounding post.

[0018] In some embodiments, the electronic device further includes a camera cover and a rear cover, the rear cover and the metal decorative element being located on the same side of the motherboard bracket, and the metal decorative element being mounted on the rear cover, and the camera cover being mounted on the metal decorative element.

[0019] In some embodiments, a plurality of metal decorative elements are provided, and a plurality of shielding covers are provided on the motherboard, wherein at least one metal decorative element corresponds to at least one shielding cover.

[0020] In some embodiments, the electronic device is a mobile phone.

[0021] The technical solution provided in this application has the following advantages compared with the prior art:

[0022] This electronic device achieves electrical connection between the metal decorative parts and the shielding cover through conductive structural components and conductive structural components set on the motherboard bracket. By utilizing the grounding characteristics of the shielding cover, the metal decorative parts are grounded, eliminating the need to set grounding springs on the motherboard and thus avoiding occupying motherboard area. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a partial structural schematic diagram of the electronic device described in an embodiment of this application;

[0026] Figure 2 for Figure 1 A partial side view of the electronic equipment in the diagram;

[0027] Figure 3 for Figure 2 A disassembly diagram of the electronic devices in the diagram.

[0028] Among them, 1. Motherboard bracket;

[0029] 2. Conductive structural components; 2a. Welded connection surface;

[0030] 3. Metal decorative parts; 31. Grounding post;

[0031] 4. Shielding cover;

[0032] 5. Conductive components. Detailed Implementation

[0033] To better understand the above-mentioned objectives, features, and advantages of this application, the solution of this application will be further described below. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0034] Many specific details are set forth in the following description in order to provide a full understanding of this application, but this application may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only some embodiments of this application, and not all embodiments.

[0035] like Figures 1 to 3 As shown in the figure, this application provides an electronic device, which may be a mobile phone, tablet, wearable device or other electronic device.

[0036] Specifically, the electronic device includes a motherboard bracket 1, a metal decorative component 3, and conductive components 5. The motherboard bracket 1 has a conductive structural component 2. The metal decorative component 3 is located on one side of the motherboard bracket 1. The motherboard is located on the other side of the motherboard bracket 1, and a shielding cover 4 is provided on the motherboard. Multiple conductive components 5 are provided, with at least one conductive component 5 located between the metal decorative component 3 and the conductive structural component 2, and at least one conductive component 5 located between the conductive structural component 2 and the shielding cover 4, thereby achieving an electrical connection between the metal decorative component 3 and the shielding cover 4.

[0037] Understandably, in this electronic device, the metal decorative part 3 is electrically connected to the shielding cover 4 through the conductive part 5 and the conductive structural part 2 set on the motherboard bracket 1. By utilizing the grounding characteristics of the shielding cover 4, the metal decorative part 3 is grounded. Compared with the prior art, there is no need to set a grounding spring on the motherboard, thereby avoiding the occupation of the motherboard area.

[0038] Moreover, by setting the conductive component 5, the grounding post on the metal decorative component 3 can be shortened or even eliminated, which can reduce the processing difficulty of the metal decorative component 3 and reduce processing costs.

[0039] It should be noted that the aforementioned metal decorative part 3 is electrically connected to the conductive structural part 2 through at least one conductive element 5. In other words, the metal decorative part 3 can be electrically connected to the conductive structural part 2 through one conductive element 5, such as... Figure 2 As shown. The metal decorative part 3 can also be electrically connected to the conductive structural part 2 through two or more conductive parts 5, in which case each conductive part 5 is disposed between the metal decorative part 3 and the conductive structural part 2.

[0040] Furthermore, the aforementioned shielding cover 4 achieves electrical connection with the conductive structural component through at least one conductive element. That is, the shielding cover 4 can be electrically connected to the conductive structural component 2 through a conductive element 5, such as... Figure 2 As shown. The shielding cover 4 can also be electrically connected to the conductive structural component 2 through two or more conductive elements 5, in which case each conductive element 5 is disposed between the shielding cover 4 and the conductive structural component 2.

[0041] In some embodiments, the above-described electronic device has a camera component (not shown in the figure).

[0042] The electronic device also includes a camera cover (not shown in the figure) and a back cover (not shown in the figure). The back cover and the metal decorative piece 3 are located on the same side of the motherboard bracket 1, and the metal decorative piece 3 is mounted on the back cover, while the camera cover is mounted on the metal decorative piece 3.

[0043] Understandably, the aforementioned metal decorative piece 3 is used to support the camera cover and also serves a decorative purpose.

[0044] Taking a mobile phone as an example, the back cover is the back cover of the mobile phone, the camera cover is placed on the camera component of the electronic device, and the metal decorative part 3 surrounds the camera cover, playing a supporting and decorative role.

[0045] In some embodiments, refer to Figure 1 The aforementioned metal decorative parts 3 are provided in multiple quantities, and multiple shielding covers 4 are provided on the main board, with at least one metal decorative part 3 corresponding to at least one shielding cover 4.

[0046] Understandably, each metal decorative piece 3 is electrically connected to the shielding cover 4 through the conductive structural piece 2 and the conductive piece 5. At this time, one metal decorative piece 3 can correspond to one shielding cover 4, one metal decorative piece 3 can correspond to multiple shielding covers 4, or multiple metal decorative pieces 3 can correspond to the same shielding cover 4.

[0047] For example, refer to Figure 1The aforementioned metal decorative piece 3 is provided in three parts, and the three metal decorative pieces 3 correspond to the three shielding covers 4 respectively. Each metal decorative piece 3 is electrically connected to the corresponding shielding cover 4 through a conductive structural piece 2 and two conductive pieces 5.

[0048] At this point, taking a mobile phone as an example, the three metal decorative pieces 3 are arranged at intervals along the same circumference, and the three metal decorative pieces 3 are used together to support the camera cover of the mobile phone.

[0049] Of course, in other embodiments, the metal decorative element 3 may also be provided, for example, the metal decorative element 3 may be ring-shaped.

[0050] In some embodiments, refer to Figure 2 and Figure 3 The aforementioned metal decorative component 3 has a grounding post 31 extending toward the motherboard bracket 1, and the conductive component 5 abuts against or is connected to the grounding post 31.

[0051] Understandably, a grounding post 31 is provided extending from the metal decorative part 3, and an electrical connection can be achieved by the conductive part 5 contacting the grounding post 31.

[0052] Furthermore, the aforementioned electronic device includes a camera cover plate, which is mounted on the grounding post 31. In other words, the grounding post 31 is not only used to contact the conductive component 5 to ground the metal decorative component 3, but also serves as a support post to support the camera cover plate, thereby improving the stability of the camera cover plate.

[0053] It should be noted that although a grounding post 31 is provided on the metal decorative part 3, the length of the grounding post 31 is greatly shortened compared with the prior art. This allows the thickness of the blank of the metal decorative part 3 to be reduced, which not only reduces the processing difficulty of the metal decorative part 3, but also reduces the processing cost of the metal decorative part 3.

[0054] In some embodiments, refer to Figure 2 and Figure 3 The aforementioned conductive structural component 2 is embedded within the motherboard bracket 1. In other words, the conductive component 5 and the motherboard bracket 1 are not detachable. For example, if the motherboard bracket 1 is injection molded, the conductive component 5 is directly wrapped by the motherboard bracket 1 during its molding process. This ensures the structural stability of the conductive component 5 and prevents it from detaching from or shifting relative to the motherboard bracket 1, which would affect the electrical connection between the metal decorative component 3 and the shielding cover 4.

[0055] For example, in one specific implementation, the conductive structural component 2 includes a first piece, a second piece, and a third piece connected in sequence. The first piece has a welding connection surface 2a parallel to the third piece, and the second piece passes through the main board bracket 1. At least one conductive component 5 is welded to each welding connection surface 2a.

[0056] In this case, the conductive structural component 2 is embedded in the motherboard bracket 1 and connected to the conductive component 5 by welding. The welding connection surface 2a is set to ensure the stability of the welding, thereby enabling the conductive component 5 and the conductive structural component 2 to maintain stable contact.

[0057] Of course, in other embodiments, the motherboard bracket 1 may have a through hole, through which the conductive structural component 2 passes and is fixed relative to the motherboard bracket 1. That is, in this case, the motherboard bracket 1 and the conductive structural component 2 are separate components, and the conductive structural component 2 is fixed to the motherboard bracket 1 by means of adhesive, screws, or other fixing methods.

[0058] In some embodiments, refer to Figure 2 and Figure 3 The conductive component 5 includes a conductive spring, one end of which is fixed relative to the conductive structural component 2, and the other end is elastically abutted against the metal decorative component 3 or the shielding cover 4.

[0059] Understandably, by setting a conductive spring, one end of the conductive spring is fixed, and the other end is made into contact by utilizing the elasticity of the conductive spring, thereby achieving electrical connection between the metal decorative part 3 and the conductive structural part 2, as well as between the shielding cover 4 and the conductive structural part 2.

[0060] It should be noted that since the metal decorative part 3, the shielding cover 4, and the motherboard bracket 1 are independent structural components, during the assembly of electronic equipment, the contact position between the conductive spring and the metal decorative part 3 can be flexibly adjusted according to the position of the metal decorative part 3 relative to the motherboard bracket 1, and the contact position between the conductive spring and the shielding cover 4 can also be flexibly adjusted according to the position of the shielding cover 4 relative to the motherboard bracket 1, so as to avoid the problem that the conductive spring and the metal decorative part 3 or the shielding cover 4 are difficult to contact or have unstable contact due to processing and / or installation errors.

[0061] Specifically, in one implementation, the conductive spring and the conductive structural member 2 are welded together. Alternatively, the conductive spring can also be fixed to the conductive structural member 2 with screws.

[0062] Optionally, in one specific implementation, the other end of the conductive spring is provided with a locking head, and the metal decorative part 3 or the shielding cover 4 is provided with a locking groove, in which the locking head is locked. In this way, the other end of the conductive spring is fixed by the cooperation of the locking head and the locking groove, further improving the stability of the contact.

[0063] For ease of installation, the card slot can be set to be relatively larger than the card head. This allows the position of the card head to be adjusted according to the position of the metal decorative piece 3 or the shielding cover 4 relative to the motherboard bracket 1. Alternatively, multiple card slots can be provided, and the card head can be selected to be mounted in one of the card slots according to the position of the metal decorative piece 3 or the shielding cover 4 relative to the motherboard bracket.

[0064] In other embodiments, the conductive element 5 includes a conductive spring, one end of which is fixed relative to the metal decorative element 3 or the shielding cover 4, and the other end is elastically abutted against the conductive structural element 2.

[0065] Understandably, at this time, the conductive spring is fixed relative to the metal decorative part 3 or the shielding cover 4, and the other end uses the elasticity of the conductive spring to abut against the motherboard bracket 1. At this time, the conductive spring and the metal decorative part 3 can be fixed by welding, screws, etc., and the conductive spring and the shielding cover 4 can be fixed by welding, screws, etc.

[0066] It should be noted that, in this case, a slot can also be provided on the conductive structural component 2, and a clip can be provided on the conductive spring. The clip is engaged in the slot, thereby using a snap-fit ​​method to further achieve stable contact between the conductive structural component 2 and the conductive spring.

[0067] In some embodiments, the conductive element 5 includes conductive foam, and the conductive foam is in a compressed state.

[0068] Understandably, the conductive component 5 is selected as conductive foam, and the conductive foam is sandwiched between the metal decorative component 3 and the conductive structural component 2, and the conductive foam is sandwiched between the conductive structural component 2 and the shielding cover 4. In this way, the electrical connection between the metal decorative component 3 and the shielding cover 4 can be achieved, and the grounding of the metal decorative component 3 can be achieved.

[0069] For example, refer to Figures 1 to 3 Taking mobile phones as an example, we can take electronic devices as an example.

[0070] The mobile phone includes a motherboard bracket 1, a metal decorative component 3, a motherboard, and conductive components 5. The motherboard bracket 1 has a conductive structural component 2. The metal decorative component 3 is located on one side of the motherboard bracket 1. The motherboard is located on the other side of the motherboard bracket 1, and a shielding cover 4 is provided on the motherboard. Two conductive components 5 are provided; one conductive component 5 is located between the metal decorative component 3 and the conductive structural component 2, and the other conductive component 5 is located between the conductive structural component 2 and the shielding cover 4, achieving an electrical connection between the metal decorative component 3 and the shielding cover 4.

[0071] Furthermore, the conductive component 5 is selected as a conductive spring, one end of which is welded to the conductive structural component 2, and the other end is elastically abutted against the metal decorative component 3. The other conductive spring is welded to the conductive structural component 2, and the other end is elastically abutted against the shielding cover 4.

[0072] The conductive structural component 2 includes a first piece, a second piece, and a third piece connected in sequence. The first piece and the third piece each have a welding connection surface 2a. The second piece passes through the main board bracket 1. Two conductive springs are welded to the two welding connection surfaces 2a respectively.

[0073] Furthermore, the aforementioned electronic device includes a camera assembly, a camera cover, and a rear cover. The rear cover and the metal decorative piece 3 are located on the same side of the motherboard bracket 1, with the metal decorative piece 3 resting on the rear cover and the camera cover resting on the metal decorative piece 3. The aforementioned metal decorative piece 3 serves to support the camera cover and also functions as a decoration.

[0074] The metal decorative piece 3 has a grounding post 31 extending toward the motherboard bracket 1, and the conductive piece 5 elastically abuts against the grounding post 31. The grounding post 31 also supports the camera cover. Furthermore, by employing a conductive spring, the length of the grounding post 31 is reduced by 60%-70% compared to the length of grounding posts in the prior art.

[0075] Furthermore, the aforementioned conductive structural component 2 is embedded within the motherboard bracket 1. In other words, the conductive component 5 and the motherboard bracket 1 are not detachable. For example, if the motherboard bracket 1 is injection molded, the conductive component 5 is directly wrapped by the motherboard bracket 1 during its molding process. This ensures the structural stability of the conductive component 5 and prevents it from detaching from or shifting relative to the motherboard bracket 1, thus avoiding any impact on the electrical connection between the metal decorative component 3 and the shielding cover 4.

[0076] Furthermore, three metal decorative pieces 3 are provided, each corresponding to one of the three shielding covers 4. Each metal decorative piece 3 is electrically connected to its corresponding shielding cover 4 through one conductive structural member 2 and two conductive members 5. The three metal decorative pieces 3 are spaced apart along the same circumference and collectively support the camera cover of the mobile phone.

[0077] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0078] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electronic device, characterized in that, include: A motherboard bracket (1) is provided with conductive structural components (2); A metal decorative piece (3) is disposed on one side of the motherboard bracket (1); The motherboard is located on the other side of the motherboard bracket (1), and a shielding cover (4) is provided on the motherboard; Multiple conductive elements (5), wherein at least one of the conductive elements (5) is disposed between the metal decorative element (3) and the conductive structural element (2), and at least one of the conductive elements (5) is disposed between the conductive structural element (2) and the shielding cover (4), thereby realizing the electrical connection between the metal decorative element (3) and the shielding cover (4).

2. The electronic device according to claim 1, characterized in that, The conductive component (5) includes a conductive spring, one end of which is fixed relative to the conductive structural component (2), and the other end is elastically abutted against the metal decorative component (3) or the shielding cover (4).

3. The electronic device according to claim 2, characterized in that, The other end of the conductive spring is provided with a clip, and the metal decorative part (3) or the shielding cover (4) is provided with a slot, and the clip is engaged in the slot.

4. The electronic device according to claim 1, characterized in that, The conductive component (5) includes a conductive spring, one end of which is fixed relative to the metal decorative component (3) or the shielding cover (4), and the other end is elastically abutted against the conductive structural component (2).

5. The electronic device according to claim 1, characterized in that, The conductive component (5) includes conductive foam, and the conductive foam is in a compressed state.

6. The electronic device according to claim 1, characterized in that, The conductive component (5) is embedded in the motherboard bracket (1); Alternatively, the motherboard bracket (1) is provided with a through hole, and the conductive structural member (2) passes through the through hole and is fixed relative to the motherboard bracket (1).

7. The electronic device according to claim 1, characterized in that, The conductive structural component (2) includes a first piece, a second piece, and a third piece connected in sequence. The first piece has a welding connection surface (2a) parallel to the third piece, and the second piece passes through the motherboard bracket. Each of the welded joint surfaces (2a) is welded to at least one of the conductive elements (5).

8. The electronic device according to claim 1, characterized in that, The metal decorative element (3) has a grounding post (31) extending toward the motherboard bracket (1), and the conductive element (5) abuts against or is connected to the grounding post (31).

9. The electronic device according to claim 1, characterized in that, The electronic device also includes a camera cover and a rear cover. The rear cover and the metal decorative piece (3) are located on the same side of the motherboard bracket (1), and the metal decorative piece (3) is mounted on the rear cover. The camera cover is mounted on the metal decorative piece (3).

10. The electronic device according to claim 1, characterized in that, Multiple metal decorative parts (3) are provided, and multiple shielding covers (4) are provided on the main board. At least one metal decorative part (3) corresponds to at least one shielding cover (4).

11. The electronic device according to claim 1, characterized in that, The electronic device is a mobile phone.

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