Battery cover assembly and electronic device

Abstract

The application discloses a battery cover assembly and an electronic device, and relates to the field of electronic devices. The battery cover assembly is applied to an electronic device and comprises a battery cover body, a flexible circuit board mounted on the battery cover body, and an installation part of the flexible circuit board, which is used for mounting a functional module. In this way, the flexible circuit board capable of mounting the functional module is arranged on the battery cover assembly, the functional module can be mounted on a corresponding position of the battery cover assembly, the functional module can move synchronously with the battery cover assembly, the positions of the functional modules relative to the battery cover assembly do not change, the problems of floating height and deviation between the functional modules and the battery cover assembly caused by assembly tolerance of the battery cover assembly are improved, and the use performance of the functional modules is ensured.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and more particularly to a battery cover assembly and an electronic device. Background Technology

[0002] With the booming development of the electronic device market, electronic devices integrate a large number of modules with different functions to meet the diversified needs of users, such as one or more of the following: camera module, microphone (MIC), laser, infrared module, and flash module. Furthermore, these functional components are typically mounted on a motherboard bracket and electrically connected to the motherboard. During the production and assembly of electronic devices, the motherboard bracket must first be fixed to the mid-frame assembly, then the motherboard and various functional modules are assembled onto the motherboard bracket, and finally the battery cover assembly is installed on the mid-frame assembly to cover the back and sides of the electronic device.

[0003] However, during the production and assembly of electronic devices, assembly tolerances may occur when the battery cover assembly is assembled to the mid-frame assembly. This can cause deviations between the battery cover assembly and the ideal state, potentially resulting in issues such as misalignment or floating between the battery cover assembly and the functional modules mounted on the motherboard bracket. Consequently, the functional modules may not align with the pre-drilled openings or positioning structures on the battery cover, affecting their normal operation and, in severe cases, even causing them to malfunction. Utility Model Content

[0004] Embodiments of this application provide a battery cover assembly and an electronic device. The battery cover assembly is used to install functional modules, so that the functional modules can move synchronously with the battery cover assembly. The position of each functional module relative to the battery cover assembly will not change, thereby improving the problems of floating and misalignment between the functional modules and the battery cover assembly caused by the assembly tolerance of the battery cover assembly, and ensuring the performance of each functional module.

[0005] In a first aspect, this application provides a battery cover assembly for use in electronic devices. The battery cover assembly includes: a battery cover body, the battery cover body having a positioning member; and a flexible circuit board mounted on the battery cover body, the flexible circuit board having a mounting portion for mounting a functional module, such that the functional module is positioned to match the positioning member.

[0006] In this embodiment, a flexible circuit board for mounting functional modules is provided on the battery cover assembly. This allows the functional modules to be installed on the battery cover assembly. Each functional module can be pre-aligned with positioning elements (such as pre-drilled holes or positioning structures on the battery cover body) and installed onto the flexible circuit board, ensuring that the relative positions of each functional module and the battery cover assembly remain unchanged during assembly. Thus, although assembly tolerance issues may arise when assembling the battery cover assembly to the mid-frame assembly, the pre-installed functional modules can move synchronously with the battery cover assembly during assembly. This mitigates issues such as floating or misalignment between the functional modules and the battery cover assembly that may be caused by assembly tolerances, thereby reducing the impact of assembly tolerances on the normal use of each functional module, ensuring the performance of each functional module, and ultimately improving the user experience.

[0007] In some embodiments, the flexible circuit board is further provided with connectors for connecting to functional modules and for connecting to the motherboard of an electronic device.

[0008] In this embodiment, the connectors disposed on the flexible circuit board can be used to realize the electrical connection between the flexible circuit board and the motherboard of the electronic device. This allows for the transmission of signals, power, and data between the functional module and the motherboard when the connectors on the flexible circuit board are connected to the motherboard after the functional module is mounted on the mounting portion of the flexible circuit board. Furthermore, if multiple mounting portions on the flexible circuit board are connected to the same connector via internal wiring, and the flexible circuit board uses a single connector to connect to the motherboard, the assembly efficiency of the electronic device can be improved.

[0009] In some embodiments, the aforementioned connectors include board-to-board connectors or conductive springs.

[0010] In some embodiments, the battery cover assembly further includes a decorative element fixedly connected to the battery cover body, which is used to mount a flexible circuit board.

[0011] In this embodiment, a decorative element is provided in the battery cover assembly to fix the battery cover body and to install the flexible circuit board. The precise mold positioning of the decorative element can improve the assembly accuracy of the flexible circuit board, and the decorative element can act as a physical barrier to protect the flexible circuit board from damage caused by squeezing and vibration.

[0012] In some embodiments, the fixing connection between the decorative element and the battery cover body includes at least one of the following: snap fasteners, screws, and adhesives.

[0013] In some embodiments, the installation method of the above-mentioned flexible circuit board and decorative parts includes at least one of clips, screws and adhesives.

[0014] In some embodiments, the mounting portion includes solder pads.

[0015] Secondly, embodiments of this application provide an electronic device, which includes a mid-frame assembly, a screen assembly, a motherboard, a functional module, and a battery cover assembly as described above; the screen assembly is mounted on one side of the mid-frame assembly, and the battery cover assembly is mounted on the other side of the mid-frame assembly; the mid-frame assembly encloses and forms an accommodating space, and the motherboard is disposed within the accommodating space; the functional module is mounted on the battery cover assembly, and the functional module is used to connect to the motherboard through a connector of the battery cover assembly.

[0016] In some implementations, the aforementioned functional modules include one or more of a camera module, a microphone, a laser, an infrared module, and a flash module.

[0017] In this embodiment, when integrating modules with different functions into the electronic device, the functional modules are pre-installed on the battery cover assembly and then assembled into the electronic device along with the battery cover assembly. This decouples each functional module from the mid-frame assembly, mitigating the impact of assembly tolerances between the battery cover assembly and the mid-frame assembly on the functional modules. In this case, when each functional module is assembled into the electronic device, it can be pre-aligned with the corresponding reserved openings or positioning structures on the battery cover assembly, and can move synchronously with the battery cover assembly when it is assembled into the mid-frame assembly. This significantly improves the issues of floating and misalignment between the functional modules and the battery cover assembly caused by assembly tolerances, ensuring the performance of each functional module and thus enhancing the user experience.

[0018] In this embodiment, the beneficial effects of the second aspect can also be referred to the description of the first aspect and any of its implementations, which will not be repeated here. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of an electronic device;

[0020] Figure 2 for Figure 1 An assembly diagram of the provided electronic equipment;

[0021] Figure 3 This is a schematic diagram of the structure of a battery cover assembly provided in an embodiment of this application;

[0022] Figure 4 This is a schematic diagram of another battery cover assembly provided in an embodiment of this application;

[0023] Figure 5 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] For ease of understanding, the technical terms used in this application will be explained and described below.

[0026] Flexible printed circuit board (FPC): also known as flexible board, is a type of printed circuit board made of flexible insulating substrates such as polyimide or polyester. It has high reliability and flexibility, and features such as bendability, thinness, and fold resistance. It is widely used in electronic devices with high requirements for compactness and reliability.

[0027] Sub-board: This usually refers to an auxiliary circuit board that is connected to the main board via a flexible or rigid circuit board, used to expand specific functions or optimize space layout.

[0028] Solder pads: Metal areas on a circuit board used for soldering the pins or wires of electronic components; they are critical nodes for circuit connections. Solder pads are connected to the internal circuitry of the circuit board via conductive layers (such as copper foil), serving to secure components and transmit electrical signals.

[0029] Board-to-board connector (BTB): An electronic component used to connect different circuit boards in electronic devices, enabling electrical connections between circuit boards and allowing reliable transmission of signals, power and data between the two circuit boards.

[0030] Decoupling refers to reducing or eliminating the mutual influence and dependencies between multiple components or systems through design or technical means, preventing changes in one component (such as positional shift, vibration, electrical interference, etc.) from being directly transmitted to other components, making them relatively independent in function, structure, or performance, thereby improving the stability, flexibility, and reliability of the overall system.

[0031] In related technologies, electronic devices integrate numerous modules with varying functions to meet diverse user needs, including one or more of the following: camera modules, microphones, lasers, infrared modules, and flash modules. For example, a camera module records images, a microphone ensures clear call quality, a flash provides illumination in low-light environments, a laser is used for precise distance measurement, and an infrared transmitter supports remote control functions. These functional modules each perform their specific roles, collectively building a rich user experience. Against this backdrop, the performance and reliability of the functional modules, as well as the overall user experience, have become core factors that consumers consider when making purchasing decisions.

[0032] In this embodiment, the electronic device can be a mobile phone, tablet computer, laptop computer, smartwatch, etc. For ease of explanation, the following embodiments all use a mobile phone as an example for illustration.

[0033] In some implementations, such as Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the structure of an electronic device 1. Figure 2 for Figure 1 An assembly diagram of the provided electronic device 1. The electronic device 1 provided in this embodiment includes a screen assembly 10, a mid-frame assembly 20, a motherboard 30, a functional module 40, and a battery cover assembly 50.

[0034] In this embodiment, a motherboard bracket is typically also provided. Figure 1 (Not shown in the image) As a structural component directly supporting the motherboard 30, it typically has screw holes, clips, or slots on its surface to fix the position of the motherboard 30 and provide physical support for it. Various functional components designed to meet diverse user needs are usually mounted on multiple flexible circuit boards or sub-boards mounted on the motherboard bracket and electrically connected to the motherboard 30. However, because the functional modules 40 are arranged on multiple flexible circuit boards or sub-boards, there are numerous interfaces between the assembled functional modules 40 and the motherboard 30, leading to assembly difficulties.

[0035] In addition, the mid-frame assembly 20, as an important component in the structure of the electronic device 1, plays the role of connecting and fixing the various components of the electronic device 1. The motherboard bracket is fixed on the mid-frame assembly 20. After the motherboard 30 and various functional modules 40 are assembled to the motherboard bracket and the battery is fixed to the motherboard bracket or the mid-frame assembly 20, the battery cover assembly 50 is then installed on the mid-frame assembly 20 by means of clips, screws and adhesives, covering the back and sides of the electronic device 1, so as to fix the position of the built-in functional modules 40, battery and other components of the electronic device 1, and provide safety protection for each component.

[0036] In this embodiment, the front view of the assembled electronic device 1 is as follows: Figure 2As shown in (A), the electronic device 1 requires a production assembly process where the screen assembly 10 is assembled to one side of the mid-frame assembly 20, and the battery cover assembly 50 is assembled to the other side of the mid-frame assembly 20. The assembly diagram of the electronic device 1 is shown below. Figure 2 As shown in (B) in the diagram.

[0037] However, in the production and assembly stage of electronic device 1, the screen assembly 10, motherboard 30, and battery cover assembly 50 need to be assembled into the mid-frame assembly 20. When assembling or fitting the battery cover assembly 50 into the mid-frame assembly 20, assembly tolerances may occur during the assembly of the battery cover assembly 50. That is, the precision of the design, processing, and assembly of the battery cover assembly 50 and the mid-frame assembly 20 may affect the state of the battery cover assembly 50 assembled into the mid-frame assembly 20, which may deviate from the ideal state.

[0038] When the battery cover assembly 50 is assembled to the middle frame assembly 20, each functional module 40 needs to be aligned with the positioning parts (such as the pre-drilled openings or positioning structures on the battery cover body) provided on the battery cover assembly to ensure the normal use of each functional module 40. However, when the battery cover assembly 50 has a positional deviation due to assembly tolerances, it may cause problems such as floating or misalignment between the battery cover assembly 50 and the functional modules 40 mounted on the motherboard bracket. This prevents the functional modules 40 from aligning with the corresponding pre-drilled openings or positioning structures on the battery cover assembly 50. In other words, the floating and misalignment between the battery cover assembly 50 and the functional modules 40 may affect the normal use of each functional module 40. Floating, specifically uneven gaps or suspension between the battery cover assembly 50 and the functional modules 40, will affect the sealing and operational stability between the functional modules 40 and the battery cover assembly 50, increasing the risk of dust and moisture entering the electronic device 1, and potentially causing short circuits and performance degradation in the functional modules 40. Misalignment, or offset between the opening on the battery cover assembly 50 and the functional module 40, will affect the physical alignment between the functional module 40 and the opening (such as the optical path and the path of sound waves), and may even cause the functional module 40 and the battery cover assembly 50 to be squeezed, resulting in damage to the internal circuitry or poor contact.

[0039] For example, in the case of a camera module, such as the rear camera of electronic device 1, if the camera module experiences a floating issue due to the assembly tolerance of the battery cover assembly 50—that is, if there is an uneven gap or suspension between the battery cover assembly 50 and the camera module—the fixation between the lens and the battery cover assembly 50 may become loose. Even slight shaking during shooting can cause blurry images, and dust and moisture can more easily enter the camera module through the gap between the camera module and the opening in the battery cover assembly 50, potentially damaging the camera module. Conversely, if the camera module experiences a misalignment issue due to the assembly tolerance of the battery cover assembly 50—that is, if the camera opening on the battery cover assembly 50 is misaligned with the camera module—the lens of the camera module may be obstructed, causing distortion or image loss during imaging, or even damaging the camera module.

[0040] In some implementations, if the microphone floats due to assembly tolerance issues in the battery cover assembly 50, it may compromise the microphone's hermeticity, causing sound leakage during input and affecting recording or call quality. If the microphone is misaligned due to assembly tolerance issues in the battery cover assembly 50, i.e., the microphone opening on the battery cover assembly 50 is misaligned with the microphone, the sound transmission path is obstructed, and external sounds cannot accurately enter the microphone, resulting in low volume and unclear sound quality during recording or calls. Furthermore, external airflow (such as wind noise) or mechanical vibrations can easily enter through gaps, causing crosstalk.

[0041] In some implementations, if the laser experiences a floating issue due to assembly tolerances of the battery cover assembly 50, the optical alignment accuracy between the laser and the battery cover assembly 50 decreases. This can cause the laser beam emitted by the laser to overflow into the sensor of the adjacent functional module 40, resulting in ranging data errors due to optical crosstalk. If the laser experiences a misalignment issue due to assembly tolerances of the battery cover assembly 50, i.e., the laser emission aperture on the battery cover assembly 50 is misaligned with the laser emission area, it can easily block the emitted laser beam, leading to a decrease in laser emission efficiency.

[0042] In some implementations, if the infrared module experiences a floating issue due to assembly tolerances of the battery cover assembly 50, the battery cover assembly 50 may obstruct the transmitter or receiver within the infrared module, affecting its remote control functionality. If the infrared module experiences misalignment due to assembly tolerances of the battery cover assembly 50, the center of the infrared beam emitted by the infrared module may be misaligned with the center of the infrared module's emission aperture on the battery cover assembly 50, resulting in "eccentricity." This not only reduces the strength of the infrared signal emitted by the infrared module but may also cause the infrared module's remote control function for external infrared devices to malfunction.

[0043] In some implementations, if the flash module experiences a floating issue due to assembly tolerances of the battery cover assembly 50, since the flash module typically includes a light source and a condenser lens, and relies on the condenser lens to converge the divergent light emitted from the light source into parallel light, the floating issue disrupts the seal between the condenser lens and the flash output aperture on the battery cover assembly 50, leading to increased diffuse reflection and affecting the focusing effect of the condenser lens on the light beam, resulting in non-conformance (NC) lighting performance of the flash module. If the flash module experiences a misalignment issue due to assembly tolerances of the battery cover assembly 50, i.e., the flash output aperture on the battery cover assembly 50 is misaligned with the light output area of ​​the flash module, it can easily block part of the light beam emitted by the flash module, causing uneven flash intensity.

[0044] Therefore, when the various functional components used to meet the diverse needs of users are installed on the motherboard bracket of the electronic device 1, if there are assembly tolerances in the production and assembly process of the electronic device 1, it is easy to cause problems such as floating or misalignment between the battery cover assembly 50 and the functional module 40, which will affect the normal use of each functional module 40, or even cause the functional module 40 to fail, thereby affecting the user's experience.

[0045] To address the aforementioned issues, this application provides a battery cover assembly. By providing a flexible circuit board on the battery cover assembly that can mount functional modules, the functional modules can be mounted at corresponding positions on the battery cover assembly. Furthermore, the functional modules can move synchronously with the battery cover assembly, and the positions of each functional module relative to the battery cover assembly remain unchanged. This improves the problems of floating and misalignment between the functional modules and the battery cover assembly caused by assembly tolerances, thus ensuring the performance of each functional module.

[0046] Please see Figure 3 , Figure 3 This is a schematic diagram of the structure of a battery cover assembly 50 provided in an embodiment of this application. Figure 3 As shown, the battery cover assembly 50 provided in this application embodiment is applied to electronic device 1, and the battery cover assembly 50 includes at least a battery cover body 510 and a flexible circuit board 520.

[0047] In this embodiment, the battery cover assembly 50 includes a battery cover body 510 and a flexible circuit board 520 mounted on the battery cover body 510, and the battery cover body 510 is provided with a positioning member. Figure 3 (Not shown in the image), for example, camera openings, microphone openings, laser emission holes, etc. on the battery cover body 510. The flexible circuit board 520 has a mounting portion 521 for mounting... Figure 1The aforementioned functional module 40 is used to match the position of the positioning component. The functional module 40 is designed to meet diverse user needs. The functional module 40, mounted on the flexible circuit board 520, includes one or more of a camera module, microphone, laser, infrared module, and flash module. When the functional module 40 is mounted on the flexible circuit board 520 via the mounting part 521, it enables functions such as aligning the camera module with the camera opening and the microphone with the microphone opening. Additionally, the functional module 40 may also include a fingerprint recognition module, a facial recognition module, a motor module, etc., but this is not limited in the embodiments of this application.

[0048] In some embodiments, the mounting part 521 may include solder pads. This application embodiment does not limit the specific form and implementation of the mounting part 521. The mounting part 521 may also include interface components such as conductive coatings for realizing the electrical connection between the functional module 40 and the flexible circuit board 520.

[0049] Furthermore, this application embodiment does not limit the shape of the battery cover assembly 50, which is related to the shape of the electronic device. Therefore, the shape of the battery cover assembly 50 can be set according to the design of the electronic device in which it is located. For example, when the electronic device is a mobile phone, tablet computer, etc., the battery cover assembly 50 can be rectangular; when the electronic device is a smartwatch, the battery cover assembly 50 can be square or circular. Moreover, this application embodiment does not limit the material of the battery cover assembly 50; the material of the battery cover assembly 50 can be glass, metal, plastic, etc.

[0050] In this embodiment, the flexible circuit board 520 is further provided with a connector 522. When each functional module 40 is mounted on the flexible circuit board 520, the connector 522 is connected to the functional module 40 and is used to connect to the motherboard 30 of the electronic device. That is, after the mounting part 521 and the connector 522 on the flexible circuit board 520 are first connected through the internal circuitry (such as copper foil circuitry, vias, etc.) of the flexible circuit board 520, the connector 522 on the flexible circuit board 520 can be used to realize the electrical connection between the flexible circuit board 520 and the motherboard 30 of the electronic device, so that the flexible circuit board 520 and the motherboard 30 on the battery cover body 510 can transmit signals, power and data. Thus, after the functional module 40 is mounted to the mounting part 521 of the flexible circuit board 520, when the connector 522 on the flexible circuit board 520 is connected to the motherboard 30 of the electronic device, the functional module 40 and the motherboard 30 can realize the transmission of signals, power and data. The connector 522 may include a board-to-board connector or a conductive spring, which is not limited here.

[0051] As an example, the number of connectors 522 provided on the flexible circuit board 520 is one. That is, the flexible circuit board 520 realizes full-function transmission of signals, power and data with the motherboard 30 through a single connector 522. By consolidating multiple mounting parts 521 (used to connect functional modules 40) on the flexible circuit board 520 to the same connector 522 through internal circuitry, the assembly complexity caused by multiple interfaces can be reduced. Furthermore, during the assembly of electronic devices, a single connector 522 facilitates the assembly of the flexible circuit board 520 provided on the battery cover assembly 50 to the motherboard 30, thereby improving assembly efficiency.

[0052] In related solutions, each functional module 40 is arranged on multiple flexible circuit boards 520 or sub-boards, resulting in numerous interfaces between the functional modules 40 and the main board 30 after assembly, leading to assembly difficulties. This embodiment integrates each functional module 40 onto a single flexible circuit board 520 provided in the battery cover assembly 50, reducing the use of flexible circuit boards 520 and sub-boards in the electronic device. This not only facilitates assembly but also reduces the size of the electronic device. Furthermore, while multiple functional modules 40 are integrated onto the flexible circuit board 520, the flexible circuit board 520 can be connected to the main board 30 via a single connector 522, significantly reducing the interfaces required for the functional modules 40 to connect to the main board 30, further improving assembly efficiency.

[0053] In some implementations, such as Figure 4 As shown, Figure 4 This is a schematic diagram of another battery cover assembly 50 provided in an embodiment of this application. The battery cover assembly 50 provided in this embodiment includes not only the battery cover body 510 and the flexible circuit board 520, but may also include a decoration (DECO) 530.

[0054] In this embodiment, the decorative element 530 is fixedly connected to the battery cover body 510, and the decorative element 530 is used to mount the flexible circuit board 520. In electronic devices, the decorative element 530 is a decorative component or process layer installed on the surface or edge of the battery cover assembly 50. The decorative element 530 is not only a core element for enhancing the appearance of electronic devices, but also, through the combination of different materials, processes, and functions, can give electronic devices more practical value. For example, the metal decorative element 530 around the rear camera module (such as a lens protection ring) can prevent the lens from being scratched, and the "micro-arc treatment" on the edge of the metal decorative element 530 around the camera module can improve the drop resistance of the electronic device.

[0055] Furthermore, the fixing connection between the decorative component 530 and the battery cover body 510 can include at least one of clips, screws, and adhesives. Similarly, the mounting method between the flexible circuit board 520 and the decorative component 530 can also include at least one of clips, screws, and adhesives; no limitation is imposed here. Moreover, there are no restrictions on the specific form and implementation of the adhesive. The adhesive can be a backing layer formed by pasting a pre-made adhesive layer of a specific shape onto a preset position, a dispensing layer formed by a dispensing process, or a combination of a dispensing layer and a backing layer.

[0056] In some embodiments, the decorative element 530 in the battery cover assembly 50 is gradually integrated with the battery cover body 510 using a one-piece molding process (such as one-piece metal / glass cutting) to reduce seams. The integrated design of the decorative element 530 and the battery cover body 510 can reduce the number of components and assembly steps in electronic devices, and can also reduce the risk of liquids, dust, moisture, etc., entering electronic devices, thereby enhancing the strength and reliability of the battery cover assembly 50.

[0057] In this embodiment, during the installation of functional modules 40 into the electronic device, each functional module 40 needs to be aligned with the reserved openings or positioning structures corresponding to the battery cover assembly 50. However, assembly tolerance issues may arise when the battery cover assembly 50 is assembled into the mid-frame assembly 20. When using the battery cover assembly 50 provided in this embodiment, the functional modules 40 are directly installed into the flexible circuit board 520 of the battery cover assembly 50. Each functional module 40 can be pre-aligned with the reserved openings or positioning structures corresponding to the battery cover assembly 50, allowing each functional module 40 to move synchronously with the battery cover assembly 50 when it is assembled into the mid-frame assembly 20. This significantly improves the problems of floating and misalignment between the functional modules 40 and the battery cover assembly 50 caused by assembly tolerances.

[0058] For example, if the camera module is pre-installed on the battery cover assembly 50 and then assembled into the electronic device along with the battery cover assembly 50, it can improve the problems of floating and misalignment between the camera module and the battery cover assembly 50 caused by the assembly tolerance of the battery cover assembly 50, reduce the probability of the camera module having problems such as blurry, distorted or missing images, and ensure the performance of the camera module.

[0059] In some implementations, if the microphone is pre-installed on the battery cover assembly 50 and then assembled into the electronic device along with the battery cover assembly 50, problems such as the microphone's height and misalignment between the microphone and the battery cover assembly 50 due to assembly tolerances can be improved, reducing the probability of leakage, missing sound, or crosstalk during sound input and ensuring the microphone's performance.

[0060] In some implementations, if the laser is pre-mounted on the battery cover assembly 50 and then assembled into the electronic device along with the battery cover assembly 50, problems such as floating height and misalignment between the laser and the battery cover assembly 50 caused by assembly tolerances of the battery cover assembly 50 can be improved, reducing the probability of optical crosstalk and decreased emission efficiency of the laser, and ensuring the performance of the laser.

[0061] In some implementations, if the infrared module is pre-installed on the battery cover assembly 50 and then assembled into the electronic device along with the battery cover assembly 50, it can improve problems such as floating height and misalignment between the infrared module and the battery cover assembly 50 caused by assembly tolerances of the battery cover assembly 50, reduce the probability of problems such as the transmitter or receiver being blocked or misaligned in the infrared module, and ensure the performance of the infrared module.

[0062] In some implementations, if the flash module is pre-installed on the battery cover assembly 50 and then assembled into the electronic device along with the battery cover assembly 50, it can improve problems such as floating and misalignment between the flash module and the battery cover assembly 50 caused by assembly tolerances of the battery cover assembly 50, reduce the probability of problems such as unqualified lighting effect and uneven flash intensity of the flash module, and ensure the performance of the flash module.

[0063] Therefore, by setting a flexible circuit board 520 on the battery cover assembly 50 for mounting the functional modules 40, the functional modules 40 can be installed at the corresponding positions on the battery cover assembly 50, aligned with the positioning parts pre-set on the battery cover body 510, and can move synchronously with the battery cover assembly 50 when the battery cover assembly 50 is assembled to the middle frame assembly 20. The positions of each functional module 40 relative to the battery cover assembly 50 will not change, reducing the impact of assembly tolerances on the normal use of each functional module 40, ensuring the performance of each functional module 40, and thus improving the user experience.

[0064] In some implementations, such as Figure 5 As shown, Figure 5 This is a schematic diagram of the structure of an electronic device 1 provided in an embodiment of this application. The electronic device 1 provided in this embodiment may include a mid-frame assembly 20, a screen assembly 10, a motherboard 30, a functional module 40, and a battery cover assembly 50 provided in the above embodiment.

[0065] In this embodiment, the mid-frame assembly 20 is an important component in the structure of the electronic device 1, serving to connect and fix the various components of the electronic device 1. Furthermore, the screen assembly 10 is mounted on one side of the mid-frame assembly 20, and the battery cover assembly 50 is mounted on the other side of the mid-frame assembly 20. The mid-frame assembly 20 encloses and forms an accommodating space, and the motherboard 30 is disposed within this accommodating space; that is, the motherboard 30 is located between the screen assembly 10 and the battery cover assembly 50 within the accommodating space formed by the mid-frame assembly 20.

[0066] As an example, to fix the position of the motherboard 30 and the mid-frame assembly 20, the electronic device 1 also includes a motherboard bracket. Figure 5 (Not shown in the image), the motherboard bracket is fixed to the mid-frame assembly 20. As a structural component directly supporting the motherboard 30, it typically has screw holes, clips, or slots on its surface for fixing the position of the motherboard 30. During the production and assembly of the electronic device 1, the pre-processed motherboard 30 (with motherboard bracket) is usually placed in the corresponding position on the mid-frame assembly 20 and fixed with screws, clips, etc. After the screen assembly 10 and battery are assembled onto the mid-frame assembly 20 and fixed with screws, clips, slots, etc., the screen assembly 10 and battery are respectively connected to the motherboard 30 via connectors 522, enabling the transmission of signals, power, and data between the screen assembly 10, battery, and motherboard bracket. The display screen of the screen assembly 10 faces the side away from the mid-frame assembly 20.

[0067] In addition, during the assembly of the battery cover assembly 50 provided in the above embodiment, after the decorative part 530 is fixed to the battery cover body 510, the flexible circuit board 520 for mounting the functional module 40 is then fixed to the decorative part 530.

[0068] In some embodiments, the functional module 40 is used to meet diverse user needs. The functional module 40 mounted on the flexible circuit board 520 includes one or more of a camera module, microphone, laser, infrared module, and flash module. Additionally, the functional module 40 may also include a fingerprint recognition module, facial recognition module, motor module, etc., and is not limited in the embodiments of this application.

[0069] Furthermore, before fixing the battery cover assembly 50 to the other side of the middle frame assembly 20, each functional component is mounted on the flexible circuit board 520 of the battery cover assembly 50, and the flexible circuit board 520 is connected to the motherboard 30 of the electronic device 1 through the connector 522 provided on the flexible circuit board 520, so as to realize the connection between the functional module 40 and the motherboard 30, so that the functional components mounted on the flexible circuit board 520 and the motherboard 30 can transmit signals, power and data. Finally, the battery cover assembly 50 is fixed to the other side of the middle frame assembly 20 by at least one of the clips, screws and adhesives, completing the assembly of the electronic device 1.

[0070] In this embodiment, if assembly tolerances occur in the battery cover assembly 50 during the production and assembly of the electronic device 1, the functional modules 40 in the electronic device 1 are pre-installed at corresponding positions on the battery cover assembly 50, aligned with the positioning components pre-set in the battery cover body 510, and then assembled into the electronic device 1 along with the battery cover assembly 50. This decouples each functional module 40 from the middle frame assembly 20, improving the impact of assembly tolerances between the battery cover assembly 50 and the middle frame assembly 20 on each functional module 40 when the battery cover assembly 50 is assembled into the electronic device 1 via the middle frame assembly 20. Specifically, when each functional module 40 is assembled into the electronic device 1, it can be pre-aligned with the corresponding reserved openings or positioning structures on the battery cover assembly 50, allowing each functional module 40 to move synchronously with the battery cover assembly 50 when it is assembled into the middle frame assembly 20. The position of each functional module 40 relative to the battery cover assembly 50 will not change, thereby greatly improving the problems of floating and misalignment between the functional modules 40 and the battery cover assembly 50 caused by assembly tolerances, ensuring the performance of each functional module 40, and thus improving the user experience.

[0071] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A battery cover assembly, characterized in that, The battery cover assembly, used in electronic devices, includes: A battery cover body, wherein the battery cover body is provided with a positioning element; A flexible circuit board is mounted on the battery cover body. The flexible circuit board has a mounting part for mounting a functional module, so that the functional module matches the position of the positioning component.

2. The battery cover assembly according to claim 1, characterized in that, The flexible circuit board is also provided with a connector for connecting to the functional module and for connecting to the motherboard of the electronic device.

3. The battery cover assembly according to claim 2, characterized in that, The connectors include board-to-board connectors or conductive springs.

4. The battery cover assembly according to any one of claims 1 to 3, characterized in that, The battery cover assembly also includes a decorative element, which is fixedly connected to the battery cover body and is used to mount the flexible circuit board.

5. The battery cover assembly according to claim 4, characterized in that, The decorative element is fixedly connected to the battery cover body by at least one of the following methods: snap fasteners, screws, and adhesives.

6. The battery cover assembly according to claim 4, characterized in that, The flexible circuit board and the decorative component are installed using at least one of the following methods: clips, screws, and adhesives.

7. The battery cover assembly according to any one of claims 1 to 3, characterized in that, The mounting section includes solder pads.

8. An electronic device, characterized in that, The electronic device includes a mid-frame assembly, a screen assembly, a motherboard, a functional module, and a battery cover assembly as described in any one of claims 1 to 7; The screen assembly is mounted on one side of the mid-frame assembly, and the battery cover assembly is mounted on the other side of the mid-frame assembly; The mid-frame assembly encloses and forms an accommodating space, and the motherboard is disposed within the accommodating space; The functional module is installed on the battery cover assembly, and the functional module is used to connect to the motherboard through the connector of the battery cover assembly.

9. The electronic device according to claim 8, characterized in that, The functional modules include one or more of the following: camera module, microphone, laser, infrared module, and flash module.

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