LED driving chip, LED device and decorative lamp

Abstract

This invention provides an LED driver chip, an LED device, and a decorative lighting fixture. The LED driver chip includes a first power input pin, a second power input pin, and at least one drive pin. The LED driver chip integrates a rectifier circuit and a logic circuit. The first and second power input pins receive voltages with changing direction and are connected to the input terminal of the rectifier circuit. The rectifier circuit converts the voltages with changing direction into DC voltage and supplies power to the logic circuit. The output terminal of the logic circuit provides an LED drive signal through the drive pin. The LED driver chip also includes a ground pin and / or a power output pin connected to the output terminal of the rectifier circuit. Applying the LED driver chip provided by this invention to an LED device can improve the situation where electrolytic reactions occur on the conductive pins of the LED device.

Description

Technical Field

[0001] This utility model relates to the field of LED technology, and in particular to an LED driver chip, an LED device, and a decorative lighting fixture. Background Technology

[0002] With the development of the decorative lighting industry and the demand for diverse functions, more and more LED (Light Emitting Diode) devices on the market are using encapsulated LED devices with integrated circuit (IC) chips. These LED devices, with their built-in or externally controlled flashing patterns, greatly enrich the functionality of lighting products. However, due to the DC characteristics of the encapsulated IC chips, these LED devices generally operate under DC power. In actual product applications, for LED devices operating under DC power, the metal leads may undergo electrolytic reactions when immersed in water or exposed to moisture, thus affecting the lifespan and reliability of the LED device. Utility Model Content

[0003] The technical problem to be solved by this utility model is to overcome the defect in the existing technology that the metal pins of LED devices operating under DC power supply will undergo electrolytic reaction when working in water or humid environments, and to provide an LED driver chip, LED device and decorative lamp.

[0004] The present invention solves the above-mentioned technical problems through the following technical solution:

[0005] The first aspect of this utility model provides an LED driver chip, including a first power input pin, a second power input pin, and at least one driver pin, wherein the LED driver chip integrates a rectifier circuit and a logic circuit.

[0006] The first power input pin and the second power input pin are used to receive voltages with changing direction and are connected to the input terminal of the rectifier circuit; the rectifier circuit is used to convert the voltages with changing direction into DC voltages and to power the logic circuit; the output terminal of the logic circuit provides LED driving signals through the driving pin.

[0007] The LED driver chip also includes a ground pin and / or a power output pin connected to the output terminal of the rectifier circuit.

[0008] Optionally, the LED driver chip further includes a first capacitor, which is connected in parallel to the output terminal of the rectifier circuit.

[0009] Optionally, the LED driver chip also integrates an oscillation circuit to provide a clock signal for the logic circuit.

[0010] Optionally, the LED driver chip also integrates a reset circuit.

[0011] The second aspect of this utility model provides an LED device, including an LED driver chip as described in the first aspect and at least one LED light-emitting chip;

[0012] The LED driver chip is used to provide LED driving signals to the LED light-emitting chip;

[0013] The driving pin and ground pin of the LED driver chip are respectively connected to the two ends of the LED light-emitting chip, or the driving pin and power output pin of the LED driver chip are respectively connected to the two ends of the LED light-emitting chip.

[0014] Optionally, the LED device further includes at least two support platforms and two conductive pins extending outside the package structure;

[0015] The LED driver chip and the LED light-emitting chip are fixed on at least one support platform;

[0016] One of the conductive pins is connected to the first power input pin of the LED driver chip through the first carrier platform, and the other conductive pin is connected to the second power input pin of the LED driver chip through the second carrier platform;

[0017] The first carrier platform and the second carrier platform are different carrier platforms.

[0018] Optionally, the LED device further includes a second capacitor, wherein the power output pin and ground pin of the LED driver chip are respectively connected to the two electrodes of the second capacitor.

[0019] Optionally, the two electrodes of the second capacitor are connected to the power output pin and the ground pin of the LED driver chip via two carrier platforms, respectively.

[0020] Optionally, the two conductive pins are connected to the two electrodes of the third capacitor, respectively.

[0021] Optionally, the LED device is packaged in either through-hole or surface-mount packaging.

[0022] Optionally, the at least one LED light-emitting chip includes multiple LED light-emitting chips connected in series, in parallel, or in a mixed connection.

[0023] A third aspect of this utility model provides a decorative lighting fixture, including an LED device as described in the second aspect.

[0024] Based on common knowledge in the field, the above-mentioned preferred conditions can be combined arbitrarily to obtain various preferred embodiments of this utility model.

[0025] The significant advantages of this invention are as follows: The LED driver chip provided by this invention integrates a rectifier circuit and has two additional power input pins compared to existing LED driver chips, which are used to receive voltages with changing direction. When the LED driver chip provided by this invention is applied to LED devices, under extreme high humidity conditions such as immersion in water or moisture, the change in the direction of the input voltage makes it difficult for electrolytic products to accumulate stably on the conductive pins of the LED device. Therefore, it can effectively improve the electrolytic reaction on the conductive pins, thereby extending the service life of the LED device and improving its reliability. Attached Figure Description

[0026] Figure 1 This is an application circuit diagram of an LED driver chip provided in Embodiment 1 of this utility model.

[0027] Figure 2 This is an application circuit diagram of another LED driver chip provided in Embodiment 1 of this utility model.

[0028] Figure 3 This is an application circuit diagram of another LED driver chip provided in Embodiment 1 of this utility model.

[0029] Figure 4 This is a schematic diagram of the internal structure of an LED driver chip provided in Embodiment 1 of this utility model;

[0030] Figure 5 This is a schematic diagram of the pad distribution of an LED driver chip provided in Embodiment 1 of this utility model.

[0031] Figure 6 This is a structural diagram of a through-hole packaged LED device provided in Embodiment 2 of this utility model.

[0032] Figure 7 This is a structural diagram of a surface-mount packaged LED device provided in Embodiment 2 of this utility model.

[0033] Figure 8 This is a structural diagram of an LED device using a hybrid surface mount and through-hole package, as provided in Embodiment 2 of this utility model.

[0034] Figure 9 This is a structural diagram of another through-hole packaged LED device provided in Embodiment 2 of this utility model.

[0035] Figure 10 for Figure 6 The diagram shows the structure of the LED device excluding the colloid.

[0036] Figure 11 for Figure 7 Top view.

[0037] Figure 12 for Figure 6 A schematic diagram of the LED driver chip in the LED device shown.

[0038] Figure 13 This is a structural diagram of another through-hole packaged LED device provided in Embodiment 2 of this utility model. Detailed Implementation

[0039] The present invention will be further illustrated by way of embodiments below, but the present invention is not limited to the scope of the embodiments described herein.

[0040] In this embodiment of the invention, prefixes such as "first" and "second" are used merely to distinguish different descriptive objects and do not limit the position, order, priority, quantity, or content of the described objects. The use of ordinal numbers and other prefixes to distinguish descriptive objects in this embodiment of the invention does not constitute a limitation on the described objects. The description of the described objects is found in the claims or the context of the embodiments, and the use of such prefixes should not constitute unnecessary limitations. Furthermore, in the description of this embodiment, unless otherwise stated, "multiple" means two or more.

[0041] Example 1

[0042] This embodiment provides an LED driver chip, including a first power input pin, a second power input pin, a ground pin, a power output pin, and at least one driver pin. The LED driver chip integrates a rectifier circuit and a logic circuit.

[0043] The first power input pin and the second power input pin are used to receive voltages with changing direction and are connected to the input terminal of the rectifier circuit; the rectifier circuit is used to convert the voltages with changing direction into DC voltages and to power the logic circuit. The output terminal of the logic circuit provides an LED driving signal through the driving pin.

[0044] The LED driver chip also includes a ground pin and / or a power output pin connected to the output terminal of the rectifier circuit.

[0045] In one optional embodiment, the LED driver chip includes a first power input pin, a second power input pin, a power output pin, and a driver pin. In such a case... Figure 1In the example shown, the LED driver chip includes a first power input pin AC1, a second power input pin AC2, a power output pin VDD, and a driver pin L1. The first power input pin AC1 and the second power input pin AC2 are used to receive voltages that change direction externally. The power output pin VDD is connected to the positive terminal of the LED chip LED1, and the driver pin L1 is connected to the negative terminal of the LED chip LED1, thus forming a negative drive circuit for LED1. LED1 blinks under the influence of the LED drive signal output from the driver pin.

[0046] In another optional embodiment, the LED driver chip includes a first power input pin, a second power input pin, a ground pin, and a drive pin. In such a case... Figure 2 In the example shown, the LED driver chip includes a first power input pin AC1, a second power input pin AC2, a ground pin VSS, and a driver pin L1. The first power input pin AC1 and the second power input pin AC2 are used to receive voltages that change direction externally. The ground pin VSS is connected to the negative terminal of the LED chip LED2, and the driver pin L1 is connected to the positive terminal of the LED chip LED2, thus forming a forward drive circuit for LED2. LED2 blinks under the influence of the LED drive signal output from the driver pin.

[0047] In another optional embodiment, the LED driver chip includes a first power input pin, a second power input pin, a ground pin, a power output pin, and a drive pin. Figure 3 In the example shown, the LED driver chip includes a first power input pin AC1, a second power input pin AC2, a power output pin VDD, a ground pin VSS, and a driver pin L1. The first power input pin AC1 and the second power input pin AC2 are used to receive voltages that change direction externally. The power output pin VDD is connected to the positive terminal of the LED chip LED1, and the driver pin L1 is connected to the negative terminal of the LED chip LED1, thus forming a negative drive circuit for LED1. LED1 blinks under the influence of the LED drive signal output from the driver pin.

[0048] In practical implementation, the voltage that changes direction can be alternating current (AC), whose direction and magnitude change periodically with time, and whose waveform can be a sine wave, square wave, etc. Alternatively, the voltage can be direct current (DC) with a controlled input voltage that changes direction.

[0049] The aforementioned rectifier circuit is used to rectify the voltage that changes direction, thereby obtaining a DC voltage, which is a voltage whose direction does not change with time. In practical applications, bridge rectifier circuits, full-wave rectifier circuits, etc., can be used.

[0050] The aforementioned logic circuit is an electronic circuit used to implement logical operations. It consists of logic gates and can perform logical operations on binary input signals and generate corresponding output signals. In practical implementation, different logic circuits can be designed according to the actual situation to output different LED driving signals, thereby driving one or more LED chips to automatically blink in a single color or multi-color changing pattern. For example, it can drive LED chips to blink in specific blinking modes such as fast blink, slow blink, breathing blink, four-segment blink, double blink, and seven-color fast and slow blink.

[0051] It should be noted that the number of driving pins in an LED driver chip can be one, two, or even many, and can be designed according to the topology of the external LED light-emitting chip and specific dimming requirements.

[0052] The LED driver chip provided in this embodiment integrates a rectifier circuit and has two more power input pins than existing LED driver chips, which are used to receive voltages with changing direction. When the LED driver chip provided in this embodiment is applied to an LED device, under extreme high humidity conditions such as immersion in water or moisture, the change in the direction of the input voltage makes it difficult for electrolytic products to accumulate stably on the conductive pins of the LED device. Therefore, it can effectively improve the electrolytic reaction on the conductive pins, thereby extending the service life of the LED device and improving its reliability.

[0053] In one optional embodiment, the LED driver chip further includes a first capacitor connected in parallel to the output terminal of the rectifier circuit. The LED driver chip provided in this embodiment integrates a capacitor, which can filter the DC voltage output by the rectifier circuit, thereby obtaining a stable DC voltage.

[0054] In one optional embodiment, the LED driver chip also integrates an oscillation circuit for providing a clock signal to the logic circuit.

[0055] In one optional embodiment, the LED driver chip also integrates a reset circuit. Under the action of the reset circuit, the LED driver chip can be reset upon power-on and power-off.

[0056] The following is combined Figure 4 and Figure 5 The LED driver chip provided in this embodiment will be described in detail.

[0057] In such Figure 4The LED driver chip shown includes a first power input pin 1, a second power input pin 2, a power output pin 3, a ground pin 4, and a driver pin 5. The first power input pin 1 and the second power input pin 2 receive voltages with changing direction. After rectification, these voltages are supplied as DC voltage through the power output pin 3 and the ground pin 4. The output of the logic circuit provides the LED driving signal through the driver pin 5. Figure 5 For showing Figure 4 The pad distribution diagram of the LED driver chip.

[0058] In practical applications, the output of the logic circuit can also provide LED driving signals through driver pins 6 and 7, such as... Figure 4 The dashed line portion is shown in the image.

[0059] Example 2

[0060] This embodiment provides an LED device, including an LED driver chip and at least one LED light-emitting chip. The LED driver chip is used to provide LED driving signals to the LED light-emitting chip.

[0061] In one embodiment, the drive pin and ground pin of the LED driver chip are respectively connected to the two ends of the LED light-emitting chip. Specifically, the drive pin of the LED driver chip is connected to the positive terminal of the LED light-emitting chip, and the ground pin of the LED driver chip is connected to the negative terminal of the LED light-emitting chip. In this embodiment, the DC voltage provided by the LED driver chip when driving the LED light-emitting chip is provided by the ground pin after rectification inside the LED driver chip.

[0062] In another embodiment, the drive pin and power output pin of the LED driver chip are respectively connected to the two ends of the LED light-emitting chip. Specifically, the drive pin of the LED driver chip is connected to the negative terminal of the LED light-emitting chip, and the power output pin of the LED driver chip is connected to the positive terminal of the LED light-emitting chip. In this embodiment, the DC voltage provided by the LED driver chip when driving the LED light-emitting chip is provided by the power output pin after rectification inside the LED driver chip.

[0063] In a specific implementation, the LED device may further include at least two support platforms and two conductive pins extending outside the packaging structure; the LED driver chip and the LED light-emitting chip are fixed on at least one support platform.

[0064] One conductive pin is connected to the first power input pin of the LED driver chip via a first carrier platform, and the other conductive pin is connected to the second power input pin of the LED driver chip via a second carrier platform. The first carrier platform and the second carrier platform are different carrier platforms.

[0065] The LED driver chip involved in this embodiment is the same as the LED driver chip in Embodiment 1. The carrier platform involved in this embodiment is a conductive platform, used to fix the LED driver chip and the LED light-emitting chip, and also to provide electrical connections. Specifically, it can be a metal platform, a conductive ceramic platform, or a surface-metallized insulating platform, etc. The conductive pins involved in this embodiment can be pins made of conductive materials such as metal pins or conductive polymer pins, used to receive input voltage.

[0066] Two conductive pins of the LED device extend outside its package structure to receive voltages with varying directions. One conductive pin is electrically connected to a first carrier platform, which in turn is electrically connected to a first power input pin in the LED driver chip; therefore, this conductive pin can achieve electrical connection with the first power input pin in the LED driver chip. The other conductive pin is electrically connected to a second carrier platform, which in turn is electrically connected to a second power input pin in the LED driver chip; therefore, this conductive pin can achieve electrical connection with the second power input pin in the LED driver chip.

[0067] In practical implementation, the LED driver chip and the LED light-emitting chip can be fixed on the same support platform, for example, both fixed on the first support platform or both fixed on the second support platform. Alternatively, the LED driver chip and the LED light-emitting chip can be fixed on different support platforms, for example, the LED driver chip can be fixed on the first support platform and the LED light-emitting chip can be fixed on the second support platform. When the LED device includes multiple LED light-emitting chips, these chips can be fixed on the same support platform or on different support platforms.

[0068] The LED device provided in this embodiment includes the LED driver chip in embodiment 1. Under extreme conditions of high humidity such as immersion in water or moisture, the change in the direction of the input voltage makes it difficult for electrolytic products to accumulate stably on the conductive pins of the LED device. Therefore, it can effectively improve the situation of electrolytic reaction on its conductive pins, thereby extending the service life of the LED device and improving the reliability of the LED device.

[0069] In specific implementations, the LED device can be packaged using either through-hole or surface-mount packaging. In practical applications, the LED device also includes a protective colloid for the package structure.

[0070] Figure 6 A structural diagram illustrating a through-hole packaged LED device. (In such...) Figure 6 The illustrated LED device includes a metal platform 102, a metal platform 103, an LED driver chip 104, an LED light-emitting chip 100, metal pins 105 and 106. Metal pins 105 and 106 extend outside the protective encapsulation 101. The LED driver chip 104 is fixed to the metal platform 103 using a die-bonding process, and the LED light-emitting chip 100 is fixed to the metal platform 102 using the same process. The first and second power input pins of the LED driver chip 104 are connected to the metal platforms 102 and 103 respectively via wirebonding to allow power to be introduced from the metal pins 105 and 106. In this example, an insulating adhesive is used for the die-bonding process.

[0071] In one example, the driving pin of the LED driver chip 104 is connected to the positive terminal of the LED light-emitting chip 100 via a wirebonding process, and the ground pin of the LED driver chip 104 is connected to the negative terminal of the LED light-emitting chip 100 via a wirebonding process.

[0072] In another example, the drive pin of the LED driver chip 104 is connected to the negative terminal of the LED light-emitting chip 100 via a wirebonding process, and the power output pin of the LED driver chip 104 is connected to the positive terminal of the LED light-emitting chip 100 via a wirebonding process.

[0073] In one optional embodiment, the LED device further includes a second capacitor, wherein the power output pin and ground pin of the LED driver chip are respectively connected to the two electrodes of the second capacitor. In practical applications, the capacitance of the second capacitor is usually larger than that of the first capacitor integrated inside the LED driver chip; specifically, different capacitances and different numbers of capacitors can be used according to different current requirements.

[0074] In a practical implementation, the two electrodes of the second capacitor can be connected to the power output pin and ground pin of the LED driver chip, respectively, via two carrier platforms. In one example, the second capacitor is a blue film capacitor, which can be electrically connected to the two carrier platforms using wirebonding or conductive silver paste. In another example, the second capacitor is a multilayer ceramic capacitor (MLCC), which can be parallel-mounted onto the two carrier platforms using SMT (surface mount technology).

[0075] The LED device provided in this embodiment integrates a second capacitor. Specifically, by connecting a larger capacitor to the DC voltage output terminal of the LED driver chip, the pulsating DC is filtered to obtain a smoother DC voltage, which is suitable for situations where the LED light-emitting chip outputs a large current.

[0076] Figure 7 This diagram illustrates the structure of a surface-mount LED device. Figure 7 The LED device shown includes metal platforms 200, 201, 202, and 203, a capacitor 204, an LED driver chip 205, and an LED light-emitting chip 206. Metal platforms 200 and 201 extend beyond the protective encapsulation structure and connect to two corresponding metal pins to allow power to be introduced from these pins. The LED driver chip 205 and the LED light-emitting chip 206 are fixed on metal platform 203. A capacitor 204 connects between metal platforms 202 and 203, with its two electrodes fixed to metal platforms 202 and 203 respectively using a conductive adhesive die-bonding process. The first and second power input pins of the LED driver chip 205 are connected to metal platforms 200 and 201 respectively using metal wires 207 and 210.

[0077] In one example, the power output pin of the LED driver chip 205 is connected to the metal platform 202 via metal wire 208, the ground pin of the LED driver chip 205 is connected to the metal platform 203 via metal wire 209, the negative terminal of the LED light-emitting chip 206 is connected to the metal platform 203 via metal wire 212, and the positive terminal of the LED light-emitting chip 206 is connected to the drive pin of the LED driver chip 205 via metal wire 211.

[0078] exist Figure 7 In the LED device shown, a larger capacitor 204 is connected to the DC voltage output terminal of the LED driver chip 205 to filter the pulsating DC, thereby obtaining a smoother DC voltage.

[0079] Figure 8 This diagram illustrates the structure of an LED device employing a hybrid surface-mount and through-hole package. (The diagram is used to illustrate this.) Figure 8 The LED device shown includes a metal platform 302, a metal platform 303, metal pins 304 and 305, and Figure 7 The surface-mount LED device 306 is shown. The surface-mount LED device 306 can be electrically connected to its two metal leads via die bonding or surface mount technology (SMT) to metal leads 304 and 305, respectively. Metal leads 304 and 305 extend beyond the colloid 301 protecting the encapsulation structure. Figure 7 Compared to the surface-mount LED device shown, Figure 8 The LED device shown does not require the use of large-span, spatially intersecting wirebonding metal lines to interconnect the various components, which can improve the yield of the finished product.

[0080] Figure 9 This diagram illustrates the structure of another through-hole packaged LED device. Figure 10 for Figure 9 The diagram shows the structure of the LED device excluding the colloid. Figure 11 for Figure 10 Top view, Figure 12 for Figure 9 A schematic diagram of the LED driver chip in the LED device shown. Figure 9 The LED device shown includes metal platforms 401, 402, 403, and 404, a capacitor 405, an LED light-emitting chip 407, and an LED driver chip 408. Metal platforms 401 and 404 extend two long metal leads to introduce power, and these leads extend beyond a colloid 406. The capacitor 405 is a multilayer ceramic capacitor, soldered using SMT technology to two short leads extending from metal platforms 402 and 403. The colloid 406 encapsulates the capacitor 405 and the two short leads extending from metal platforms 402 and 403. Both the LED light-emitting chip 407 and the LED driver chip 408 are fixed to the metal platform 404.

[0081] The first power input pin 409 of the LED driver chip 408 is electrically connected to the metal platform 404 using a wirebonding process. The second power input pin 411 of the LED driver chip 408 is electrically connected to the metal platform 401 using a wirebonding process. The drive pin 412 of the LED driver chip 408 is electrically connected to the negative terminal of the LED light-emitting chip 407 using a wirebonding process, and the positive terminal of the LED light-emitting chip 407 is electrically connected to the metal platform 403 using a wirebonding process. The power output pin 410 of the LED driver chip 408 is electrically connected to the metal platform 403 using a wirebonding process. The ground pin 413 of the LED driver chip 408 is electrically connected to the metal platform 402 using a wirebonding process.

[0082] exist Figure 9-12 In the LED device shown, a larger capacitor 405 is connected to the DC voltage output terminal of the LED driver chip 408 to filter the pulsating DC, thereby obtaining a smoother DC voltage.

[0083] In one optional implementation, the two conductive pins are respectively connected to the two electrodes of the third capacitor. In practical applications, the capacitance of the third capacitor is usually larger than that of the first capacitor integrated inside the LED driver chip; specifically, different capacitances and numbers of capacitors can be used depending on different current requirements.

[0084] In the LED device provided in this embodiment, a third capacitor with a larger capacity is connected to two conductive pins to filter the pulsating DC, so as to obtain a smoother DC voltage, which is suitable for situations where the LED light-emitting chip outputs a large current.

[0085] Figure 13 This diagram illustrates the structure of another type of through-hole packaged LED device. Compared to Figure 6 The LED device shown Figure 13 The LED device shown also includes a capacitor 107. Metal leads 105 and 106 are connected to the two electrodes of capacitor 107, respectively. Figure 13 In the LED device shown, a larger capacitor 107 is connected to the metal pins 105 and 106 to filter the pulsating DC, thereby obtaining a smoother DC voltage.

[0086] In one optional embodiment, the at least one LED light-emitting chip includes multiple LED light-emitting chips connected in series, parallel, or a mixed connection. In practical applications, the LED device provided in this embodiment can also be used to form individual light strings through series and parallel connections.

[0087] Example 3

[0088] This embodiment provides a decorative lighting fixture, including the LED device from embodiment 2.

[0089] The decorative lighting fixture provided in this embodiment includes the LED device in embodiment 2. The LED device in embodiment 2 includes the LED driver chip in embodiment 1. Under extreme conditions such as immersion in water or moisture, the change in the direction of the input voltage makes it difficult for electrolytic products to accumulate stably on the conductive pins of the LED device. Therefore, it can effectively improve the situation of electrolytic reaction on its conductive pins, thereby extending the service life of the LED device and the decorative lighting fixture, and also improving the reliability of the LED device and the decorative lighting fixture.

[0090] While specific embodiments of this utility model have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of this utility model is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of this utility model, but all such changes and modifications fall within the scope of protection of this utility model.

Claims

1. An LED driver chip, characterized in that, The LED driver chip includes a first power input pin, a second power input pin, and at least one driver pin, and integrates a rectifier circuit and a logic circuit. The first power input pin and the second power input pin are used to receive voltages with changing direction and are connected to the input terminal of the rectifier circuit; the rectifier circuit is used to convert the voltages with changing direction into DC voltages and to power the logic circuit; the output terminal of the logic circuit provides LED driving signals through the driving pin. The LED driver chip also includes a ground pin and / or a power output pin connected to the output terminal of the rectifier circuit.

2. The LED driver chip as described in claim 1, characterized in that, The LED driver chip also includes a first capacitor, which is connected in parallel to the output terminal of the rectifier circuit.

3. An LED device, characterized in that, Includes the LED driver chip as described in any one of claims 1-2 and at least one LED light-emitting chip; The LED driver chip is used to provide LED driving signals to the LED light-emitting chip; The driving pin and ground pin of the LED driver chip are respectively connected to the two ends of the LED light-emitting chip, or the driving pin and power output pin of the LED driver chip are respectively connected to the two ends of the LED light-emitting chip.

4. The LED device as described in claim 3, characterized in that, The LED device also includes at least two support platforms and two conductive pins extending outside the package structure; The LED driver chip and the LED light-emitting chip are fixed on at least one support platform; One of the conductive pins is connected to the first power input pin of the LED driver chip through the first carrier platform, and the other conductive pin is connected to the second power input pin of the LED driver chip through the second carrier platform; The first carrier platform and the second carrier platform are different carrier platforms.

5. The LED device as described in claim 4, characterized in that, The LED device also includes a second capacitor, and the power output pin and ground pin of the LED driver chip are respectively connected to the two electrodes of the second capacitor.

6. The LED device as described in claim 5, characterized in that, The two electrodes of the second capacitor are respectively connected to the power output pin and the ground pin of the LED driver chip through two carrier platforms.

7. The LED device as claimed in claim 4, characterized in that, The two conductive pins are connected to the two electrodes of the third capacitor, respectively.

8. The LED device as claimed in claim 4, characterized in that, The LED device is packaged in either through-hole or surface-mount packaging.

9. The LED device as described in any one of claims 3-8, characterized in that, The at least one LED light-emitting chip includes multiple LED light-emitting chips connected in series, in parallel, or in a mixed connection.

10. A decorative lamp, characterized in that, Includes the LED device as described in any one of claims 3-9.

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