A power electronic assembly cooling structure

Abstract

This utility model relates to the field of vehicle power electronics technology and discloses a cooling structure for a power electronic component, comprising: a cover plate assembly with a first cooling channel inside; a cooling plate assembly with a second cooling channel inside; a power electronic component sandwiched between the cover plate assembly and the cooling plate assembly; and a flow divider adapted to connect the first and second cooling channels in parallel. This utility model synchronously and parallelly inputs refrigerant into the independent channels of the cover plate assembly and the cooling plate assembly through the flow divider, achieving dual-sided parallel active cooling, eliminating the problem of coolant temperature rise on the outlet side of the series flow channels, and realizing efficient dual-sided synchronous cooling of the power electronic component.

Description

Technical Field

[0001] This utility model relates to the field of vehicle power electronics technology, and specifically to a cooling structure for power electronic components. Background Technology

[0002] Vehicle power electronic components are a series of parts used in vehicles to realize functions such as power conversion, control, and management through power electronics technology. These components include, but are not limited to, power semiconductor devices, inverters, DC-DC converters, and motor controllers. Vehicle power electronic components play a key role in improving the energy efficiency, performance, and intelligence of vehicles, and are particularly important in the development of electric and hybrid vehicles.

[0003] Vehicle power electronic components generate heat during operation. If not dissipated in time, excessively high temperatures may affect component performance and lifespan, or even cause malfunctions. Therefore, when installing vehicle power electronic components, a specialized cooling structure is needed to reduce the component temperature, dissipate the heat generated, and ensure that the components operate normally in a suitable temperature environment.

[0004] Current cooling structures can cool vehicle power electronic components from both sides, but the cooling channels are designed in a series configuration. The refrigerant first flows through one cooling channel and then connects in series to the other channel, forming a single loop. The refrigerant has a low temperature at the inlet and high cooling efficiency; however, the temperature rises after flowing through the first channel, and the heat dissipation capacity decreases significantly when entering the second channel, resulting in reduced cooling efficiency at the outlet and a significant heat dissipation bottleneck. Utility Model Content

[0005] In view of this, the present invention provides a cooling structure for power electronic components to solve the problem of reduced cooling efficiency at the outlet of existing cooling structures.

[0006] This utility model provides a cooling structure for power electronic components, including:

[0007] A cover plate assembly, wherein a first cooling channel is provided inside the cover plate assembly;

[0008] A cooling plate assembly, wherein a second cooling channel is provided inside the cooling plate assembly;

[0009] A power electronic component, the power electronic component being sandwiched between the cover plate assembly and the cooling plate assembly;

[0010] A flow divider channel is provided, wherein the flow divider channel is adapted to connect the first cooling channel and the second cooling channel in parallel.

[0011] The beneficial effects of the aforementioned power electronic component cooling structure are as follows: By simultaneously and in parallel inputting the refrigerant into the independent flow channels of the cover plate assembly and the cooling plate assembly through a split channel, dual-sided parallel active cooling is achieved, eliminating the problem of coolant temperature rise on the outlet side of the series flow channel and realizing efficient dual-sided synchronous cooling of the power electronic component. Both the first cooling flow channel of the cover plate assembly and the second cooling flow channel of the cooling plate assembly are active cooling flow channels. Both sides of the power electronic component are directly cooled by the coolant simultaneously, significantly improving the dual-sided heat transfer efficiency and avoiding the thermal resistance defects of the passive cooling surface. In parallel mode, the temperature change of the refrigerant in the two flow channels is more consistent, the temperature difference at the outlet is reduced, and the overall heat dissipation performance is more stable. The split channel can rationally distribute the refrigerant to the first and second cooling flow channels, ensuring consistent cooling efficiency on both sides and avoiding the problem of refrigerant flow attenuation towards the later stage in the traditional series mode.

[0012] The cooling channels of the cover plate assembly and the cooling plate assembly are connected in parallel through a split channel, and the flow is split in a specific ratio to achieve synchronous active cooling of the two assemblies. The parallel structure can flexibly distribute the refrigerant flow by adjusting the size of the split channel or the valves to match the heat load changes of the power electronic components under different operating conditions.

[0013] The aforementioned power electronic component cooling structure is simple in structure, consumes few parts, and has low cost.

[0014] In one optional embodiment, the cover plate assembly is provided with a first coolant inlet and a first coolant outlet, the first coolant inlet and the first coolant outlet being respectively connected to the first cooling channel;

[0015] The cooling plate assembly is provided with a second coolant inlet and a second coolant outlet, and the second coolant inlet and the second coolant outlet are respectively connected to the second cooling channel;

[0016] The first coolant inlet and the second coolant inlet are connected in parallel to receive coolant through the diversion channel, and the first coolant outlet and the second coolant outlet are connected in parallel to output coolant.

[0017] The beneficial effects of the above technical solution are as follows: Two coolants are injected independently and synchronously with the same inlet temperature. The small temperature difference at the inlet of the two-sided flow channels ensures balanced heat dissipation on both sides of the power electronic component 7, completely resolving the heat dissipation bottleneck on the outlet side. The refrigerant is simultaneously distributed to the first and second cooling channels through a split channel, ensuring the initial temperature of both coolants is consistent and avoiding the problem of progressively increasing refrigerant temperature in series mode. The coolant in both flow channels remains at a low temperature, enabling more efficient absorption of heat generated on both sides of the power electronic component and reducing the risk of localized overheating. The high-temperature coolant from both cooling channels flows in parallel and is discharged at the outlet, avoiding localized pressure or temperature overheating caused by concentrated high temperatures at a single outlet.

[0018] In one alternative embodiment, the cover assembly includes a cover and a cooling ring, the cover being connected to the cooling ring and forming the first cooling channel with the cooling ring.

[0019] In one optional embodiment, the cover plate has a circumferential rib on the wall surface opposite to the cooling ring, and a first groove structure is formed on the inner side of the circumferential rib. The circumferential rib is adapted to the shape of the cooling ring, and the cooling ring is positioned on the circumferential rib and surrounds the circumferential rib to form the first cooling channel.

[0020] In one optional embodiment, at least one fluid cavity is provided on the wall surface of the cooling ring facing the cover plate, and at least one first heat dissipation column array group is provided on the wall surface of the first groove structure. The first heat dissipation column array group includes at least one first heat dissipation column, which faces the fluid cavity and extends into the fluid cavity.

[0021] The beneficial effects of the above technical solution are as follows: the first heat dissipation column is directly immersed in the coolant, shortening the heat transfer path from the heat source to the coolant. The first heat dissipation column forms a three-dimensional heat dissipation network inside the fluid cavity, increasing the effective heat dissipation area and significantly accelerating heat dissipation, thereby better transferring heat from the high-temperature contact surface to the coolant.

[0022] In one alternative embodiment, at least one heat dissipation rib is provided on the wall surface of the cooling ring facing away from the cover plate. The heat dissipation rib contacts the power electronic component and faces the heat-generating area of ​​the power electronic component. The fluid cavity extends into the heat dissipation rib.

[0023] The beneficial effects of the above technical solution are as follows: The heat dissipation fins are in direct contact with the heat-generating areas of the power electronic components. The high thermal conductivity of the metal material rapidly transfers heat from the chip / module to the surface of the heat dissipation fins, significantly reducing thermal resistance. Heat from the heat-generating areas can be quickly transferred to the heat dissipation fins, preventing localized high-temperature accumulation. The heat dissipation fins are positioned directly opposite the heat-generating areas, ensuring the shortest heat transfer path and prioritizing the guidance of high-density heat to the fluid cavities inside the heat dissipation fins. Precise heat dissipation is achieved for the core heat-generating areas, improving overall temperature uniformity.

[0024] In one optional embodiment, the cooling plate assembly includes a cooling plate and a flat plate, the cooling plate being connected to the flat plate, and a second groove structure being provided on the wall surface of the cooling plate facing the flat plate. The flat plate is sealed and covered by the second groove structure and surrounds the cooling plate to form a second cooling channel.

[0025] In one alternative embodiment, at least one second heat dissipation column array group is provided on the wall surface of the second groove structure, the second heat dissipation column array group includes at least one second heat dissipation column, and the second heat dissipation column abuts against the plate.

[0026] The beneficial effects of the above technical solution are as follows: through the close contact of the high thermal conductivity materials, the heat of the plate is quickly transferred to the wall of the groove structure, and the heat of the heating area can be transferred from the plate to the second heat dissipation column more efficiently, thereby better conducting the heat from the high temperature contact surface to the coolant and avoiding heat accumulation.

[0027] In one alternative embodiment, the plate is provided with at least one first opening, the cooling plate is provided with at least one column, the column is positioned corresponding to and extends through the first opening, and the column and the cooling plate are provided with a second opening, the second opening being positioned corresponding to the signal terminal of the power electronic component.

[0028] In one optional embodiment, the cover assembly has at least one first mounting point on the side away from the power electronic components, the first mounting point being used to mount external accessories and components; and / or the cover assembly has a first through hole and a second through hole, the first through hole being used to allow the negative terminal to pass through and the second through hole being used to allow the positive terminal to pass through; and / or the cover assembly has a third through hole, the third through hole being used to connect an electrical connector; the cooling plate assembly has a fourth through hole, the fourth through hole being positioned corresponding to the third through hole, the fourth through hole being used to allow the electrical connector to pass through.

[0029] In one alternative embodiment, the cover plate assembly and the cooling plate assembly are detachably connected, and a sealing ring is provided between their contact surfaces, with the power electronic components located inside the sealing ring. Attached Figure Description

[0030] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0031] Figure 1 This is an exploded view of the present invention;

[0032] Figure 2 This is a schematic diagram of the structure of the cover plate and cooling ring of this utility model;

[0033] Figure 3 This is a schematic diagram of the structure of the cover plate of this utility model;

[0034] Figure 4 This is a schematic diagram of the cooling ring structure of this utility model;

[0035] Figure 5 This is a schematic diagram of the structure of the cooling plate and flat plate of this utility model;

[0036] Figure 6 This is a schematic diagram of the structure of the cooling plate of this utility model;

[0037] Figure 7 This is an exploded view of the present invention;

[0038] Figure 8 This is a schematic diagram of the overall external structure of this utility model;

[0039] Figure 9 This is a cross-sectional view of the present invention.

[0040] Explanation of reference numerals in the attached figures:

[0041] 1. Cover plate, 1a. Cover plate contact surface, 1b. First heat dissipation column, 1c. First positioning hole, 1d. Second positioning hole, 1e. First mounting point, 1f. Second mounting point, 1i. First through hole, 1j. Second through hole, 1h. Third through hole, 1g. Circumferential rib;

[0042] 2. Cooling ring, 2a. Heat dissipation fin, 2b. Second contact surface of cooling ring, 2c. First locating pin, 2d. First coolant inlet, 2e. First coolant outlet, 2f. Second locating pin, 2g. Fluid cavity;

[0043] 3. Flat plate, 3a. Flat plate contact surface, 3b. Cooling plate assembly contact surface, 3c. First opening, 3d. First through hole, 3e. Second through hole;

[0044] 4. Cooling plate, 4a. Cooling plate contact surface, 4b. Second heat dissipation column, 4c. Column body, 4d. Second coolant inlet, 4e. Second coolant outlet, 4f. Second opening, 4g. Third mounting point, 4h. Fourth through hole, 4i. Fourth mounting point, 4j. Additional mounting point;

[0045] 5. Cover plate assembly;

[0046] 6. Cooling plate assembly;

[0047] 7. Power electronic components, 7a. PCB top surface, 7b. PCB bottom surface;

[0048] 8. First cooling channel;

[0049] 9. Second cooling channel. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0051] Combination Figures 1 to 9 As shown, according to an embodiment of the present invention, a cooling structure for a power electronic component is provided, including a cover plate assembly 5, a cooling plate assembly 6, a power electronic component 7, and a flow distribution channel. A first cooling channel 8 is provided inside the cover plate assembly 5. A second cooling channel 9 is provided inside the cooling plate assembly 6. The power electronic component 7 is sandwiched between the cover plate assembly 5 and the cooling plate assembly 6. Both the cover plate assembly 5 and the cooling plate assembly 6 are in contact with the power electronic component 7 through multiple contact points, achieving double-sided cooling. The flow distribution channel is adapted to connect the first cooling channel 8 and the second cooling channel 9 in parallel.

[0052] It should be noted that the above-mentioned power electronic component cooling structure can be widely used in the integration of various power electronic components in commercial vehicles and passenger vehicles. Power electronic components include, but are not limited to, power semiconductor devices, inverters, DC-DC converters, and motor controllers.

[0053] The aforementioned power electronic component cooling structure synchronously and in parallel inputs the refrigerant into the independent flow channels of the cover plate assembly and the cooling plate assembly through a diversion channel, thereby achieving dual-sided parallel active cooling, eliminating the problem of coolant temperature rise on the outlet side of the series flow channel, and realizing dual-sided synchronous and efficient cooling of the power electronic component 7.

[0054] Both the first cooling channel of the cover plate assembly 5 and the second cooling channel of the cooling plate assembly 6 are active cooling channels (forced circulation of coolant). Both sides of the power electronic component 7 are directly cooled by coolant simultaneously, which greatly improves the heat transfer efficiency on both sides and avoids the thermal resistance defects of passive cooling surfaces.

[0055] In the traditional series configuration, the refrigerant temperature rises after flowing through the first channel, resulting in a significant decrease in the cooling efficiency of the second channel. The parallel design, however, allows the refrigerant to flow simultaneously through both the first cooling channel (cover assembly 5) and the second cooling channel (cooling plate assembly 6). Both channels maintain a low refrigerant temperature, enabling uniform and efficient absorption of heat from both sides of the component, thus avoiding uneven heat dissipation caused by a gradual increase in refrigerant temperature.

[0056] In parallel mode, the temperature change of the refrigerant in the two channels is more consistent, the temperature difference at the outlet is reduced, and the overall heat dissipation performance is more stable.

[0057] The split channel can rationally distribute the refrigerant to the first and second cooling channels, ensuring consistent cooling efficiency on both sides and avoiding the problem of refrigerant flow attenuation in the later stages in the traditional series mode.

[0058] The cooling channels of the cover plate assembly 5 and the cooling plate assembly 6 are connected in parallel through a split channel, and the flow is split in a specific ratio to achieve synchronous active cooling of the two assemblies. The parallel structure can flexibly distribute the refrigerant flow by adjusting the size of the split channel or the valve (if dynamic control is required) to match the heat load changes of the power electronic components under different operating conditions.

[0059] In some embodiments, the cover plate assembly 5 is provided with a first coolant inlet 2d and a first coolant outlet 2e, which are respectively connected to a first cooling channel. The cooling plate assembly 6 is provided with a second coolant inlet 4d and a second coolant outlet 4e, which are respectively connected to a second cooling channel. The first coolant inlet 2d and the second coolant inlet 4d are connected in parallel to receive coolant through a split channel, and the first coolant outlet 2e and the second coolant outlet 4e are connected in parallel to output coolant.

[0060] In this embodiment, the two coolants are injected independently and synchronously with the same inlet temperature. The temperature difference at the inlet of the double-sided flow channel is small, which makes the heat dissipation capacity of the power electronic component 7 balanced on both sides and completely solves the heat dissipation bottleneck on the outlet side.

[0061] The refrigerant is simultaneously distributed to the first cooling channel (cover plate assembly 5) and the second cooling channel (cooling plate assembly 6) via a split channel, ensuring that the initial temperature of the two refrigerant streams is consistent, thus avoiding the problem of gradual temperature increases in the refrigerant during series operation. The coolant in both channels remains at a low temperature, enabling more efficient absorption of heat generated on both sides of the power electronic components and reducing the risk of localized overheating.

[0062] The high-temperature coolant from the two cooling channels flows out in parallel at the outlet, avoiding the problem of excessive local pressure or temperature caused by concentrated high temperature at a single outlet.

[0063] In some embodiments, combined with Figure 2 As shown, the cover plate assembly 5 includes a cover plate 1 and a cooling ring 2. The cover plate 1 and the cooling ring 2 form a single unit. The cover plate 1 is connected to the cooling ring 2 and surrounds the cooling ring 2 to form a first cooling flow channel.

[0064] A circumferential rib 1g is provided on the wall surface of the cover plate 1 facing the cooling ring 2. A first groove structure is formed on the inner side of the circumferential rib 1g. The circumferential rib 1g is adapted to the shape of the cooling ring 2. The cooling ring 2 is positioned on the circumferential rib 1g and surrounds the circumferential rib 1g to form a first cooling flow channel.

[0065] The cover plate 1 has multiple first positioning holes 1c on its circumferential rib 1g wall surface, and the cooling ring 2 has multiple first positioning pins 2c, with the positions of the first positioning pins 2c corresponding to the positions of the first positioning holes 1c. The cover plate 1 also has multiple second positioning holes 1d on its circumferential rib 1g wall surface, and the cooling ring 2 has multiple second positioning pins 2f, with the positions of the second positioning pins 2f corresponding to the positions of the second positioning holes 1d. The first positioning pins 2c and second positioning pins 2f are arranged diagonally. When connecting the cover plate 1 and the cooling ring 2, the first positioning pins 2c are inserted into the first positioning holes 1c, and the second positioning pins 2f are inserted into the second positioning holes 1d. The cover plate contact surface 1a and the cooling ring second contact surface 2b are brazed to form the cover plate assembly 5.

[0066] In this embodiment, the inner groove structure of the circumferential rib 1h is precisely adapted to the shape of the cooling ring 2 (e.g., corresponding shape and size), forming a mechanical positioning reference. This ensures that the cooling ring 2 is quickly aligned with the cover plate 1 during assembly, avoiding flow channel offset or uneven gap problems caused by manual alignment errors in traditional assembly. Enhanced sealing performance: The circumferential rib 1g fits tightly with the cooling ring 2, forming a closed first cooling flow channel to prevent coolant leakage. Compared to planar fitting, the three-dimensional fit of the rib and groove increases the sealing contact area, significantly reducing the risk of leakage, especially in high-pressure coolant scenarios.

[0067] When the circumferential rib 1g is brazed to the cooling ring 2, the three-dimensional structure of the rib increases the welding area and improves the connection strength. Compared with planar welding, the rib-groove interlocking welding can withstand greater mechanical stress (such as vibration and thermal expansion stress) and avoids the cracking risk that may occur in traditional planar welding.

[0068] The first coolant inlet 2d and the first coolant outlet 2e are provided on the cooling ring 2, through which coolant enters the fluid cavity 2g and flows out through the first coolant outlet 2e.

[0069] The cover plate 1 has multiple first mounting points 1e for mounting external accessories and components. The cover plate 1 has a first through hole 1i and a second through hole 1j, where the first through hole 1i allows the negative terminal to pass through, and the second through hole 1j allows the positive terminal to pass through. The cover plate 1 also has a third through hole 1h for connecting an electrical connector. The cooling plate assembly 6 has a fourth through hole 4h, which corresponds to the third through hole 1h, and is used for the electrical connector to pass through.

[0070] In some embodiments, combined with Figure 3 As shown, at least one fluid cavity 2g is provided on the wall surface of the cooling ring 2 facing the cover plate 1, and at least one first heat dissipation column array group is provided on the wall surface of the first groove structure. The first heat dissipation column array group includes at least one first heat dissipation column 1b, which faces the fluid cavity 2g and extends into the fluid cavity 2g.

[0071] In this embodiment, the first heat dissipation column 1b is directly immersed in the coolant, shortening the heat transfer path from the heat source to the coolant. The first heat dissipation column 1b forms a three-dimensional heat dissipation network inside the fluid cavity, increasing the effective heat dissipation area and significantly accelerating heat removal, thereby better transferring heat from the high-temperature contact surface to the coolant. The first heat dissipation column 1b forms a turbulence structure within the fluid cavity 2g, disrupting the laminar flow layer of the coolant and forcing the fluid to generate vortices and cross-flows, improving convective heat transfer efficiency. The heat dissipation column array guides the coolant to flow evenly through all areas of the cavity, eliminating flow dead zones in traditional flow channels and temperature uniformity deviations on the heat dissipation surface.

[0072] In some embodiments, at least one heat dissipation fin 2a is provided on the wall surface of the cooling ring 2 facing away from the cover plate 1. The heat dissipation fin 2a contacts the power electronic component 7 and faces the heat-generating area of ​​the power electronic component 7. The fluid cavity 2g extends into the heat dissipation fin 2a. The end face of the heat dissipation fin 2a is the contact surface of the cooling ring.

[0073] In this embodiment, the heat dissipation fin 2a is in direct contact with the heat-generating area of ​​the power electronic component 7. The high thermal conductivity of the metal material rapidly transfers heat from the chip / module to the surface of the heat dissipation fin, significantly reducing thermal resistance. Heat from the heat-generating area can be quickly transferred to the heat dissipation fin, preventing localized high-temperature accumulation. The heat dissipation fin is positioned directly opposite the heat-generating area to ensure the shortest heat transfer path, prioritizing the guidance of high-density heat to the fluid cavity inside the heat dissipation fin. Precise heat dissipation is achieved for the core heat-generating area, improving overall temperature uniformity.

[0074] In some embodiments, the cooling plate assembly 6 includes a cooling plate 4 and a flat plate 3. The cooling plate 4 is connected to the flat plate 3, and the cooling plate 4 and the flat plate 3 form another single unit. A second groove structure is provided on the wall surface of the cooling plate 4 facing the flat plate 3. The flat plate 3 seals and covers the second groove structure and surrounds the cooling plate 4 to form a second cooling channel. The contact surface 3a of the flat plate and the contact surface 4a of the cooling plate are brazed to form the cooling plate assembly 6.

[0075] In some embodiments, at least one second heat dissipation column array is provided on the wall surface of the second groove structure. The second heat dissipation column array includes at least one second heat dissipation column 4b, which abuts against the plate 3. Through the close contact of the highly thermally conductive materials, the heat of the plate is quickly transferred to the wall surface of the groove structure. The heat in the heat-generating area can be transferred more efficiently from the plate 3 to the second heat dissipation column 4b, thereby better conducting the heat from the high-temperature contact surface to the coolant and avoiding heat accumulation.

[0076] In some embodiments, the plate 3 is provided with at least one first opening 3c, and the cooling plate 4 is provided with at least one column 4c. The column 4c is positioned corresponding to the first opening 3c and extends through the first opening 3c. A second opening 4f is provided through the column 4c and the cooling plate 4. The second opening 4f is positioned corresponding to the signal terminal of the power electronic component 7.

[0077] After the column 4c passes through the first opening 3c, the second opening 4f directly connects to the signal terminal of the power electronic component 7, allowing wires to precisely connect to the signal terminal through channels inside the cooling plate or the column. For example, the signal terminal passes through multiple first openings 3c on the cooling plate 4. This avoids the complex path required by traditional designs where wires need to bypass the plate or cooling plate, reducing wiring length and space occupation; it also maintains the structural integrity of the plate and cooling plate, avoiding the impact of additional openings on heat dissipation performance. The standardized design of the second opening 4f can adapt to different signal terminal layouts, supporting rapid assembly and maintenance, simplifying the wiring process, and improving assembly efficiency.

[0078] The column 4c serves as both a heat conduction channel and a support structure for the wiring path, achieving multiple functions in one structure and solving the problem of conflict between wiring and heat dissipation structure in traditional heat dissipation design; through the heat conduction effect of the column, the local temperature near the signal terminal is indirectly reduced.

[0079] In some embodiments, the cover plate assembly 5 and the cooling plate assembly 6 are detachably connected, and a sealing ring is provided between their contact surfaces, with the power electronic component 7 located inside the sealing ring. The sealing ring, located between the contact surfaces of the cover plate assembly and the cooling plate assembly, forms a physical isolation barrier, effectively preventing external dust, moisture, and liquids from penetrating into the power electronic component area inside the sealing ring, thereby achieving a high level of protection. This prevents short circuits, corrosion, or insulation failure, and is particularly suitable for harsh environments. A closed cooling circulation system may be formed inside the sealing ring, isolating external air through a sealed environment and improving the heat transfer efficiency of the coolant. The detachable connection design of the cover plate assembly 5 and the cooling plate assembly 6 allows for quick inspection or replacement of the sealing ring during disassembly and assembly, preventing seal aging and failure after long-term use.

[0080] Taking power electronic component 7 as an example of an inverter assembly, the power electronic component includes a PCB. The PCB is mounted on... Figure 7 At the third mounting point 4g shown, when the cover plate assembly 5 and the cooling plate assembly 6 are assembled, the contact surface of the cover plate assembly contacts the top surface 7a of the PCB, and the contact surface 3b of the cooling plate assembly contacts the bottom surface 7b of the PCB, forming... Figure 8The inverter assembly shown. The first coolant inlet 2d on the cover plate assembly 5 overlaps and contacts the second coolant inlet 4d on the cooling plate assembly 6, and the first coolant outlet 2e on the cover plate assembly 5 overlaps and contacts the second coolant outlet 4e on the cooling plate assembly 6. Fastening screws are installed from the second mounting point 1f of the cover plate assembly 5 to the fourth mounting point 4i of the cooling plate assembly 6, completing the final assembly of the inverter assembly. In some embodiments, the back of the cooling plate 4 has an additional mounting point 4j for mounting... Figure 6 The additional PCB shown.

[0081] The cooling structure for the aforementioned power electronic components has the following specific coolant flow direction: the coolant enters from the second coolant inlet 4d and flows into... Figure 9 The first cooling channel of the cooling plate assembly 6 shown enters the second cooling channel of the cover plate assembly 5 through the first coolant inlet 2d on the cover plate assembly 5. The contact surface of the cooling plate assembly contacts the bottom surface 7b of the PCB, and the contact surface of the cover plate assembly contacts the top surface 7a of the PCB, thereby realizing double-sided parallel active cooling of the PCB.

[0082] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A cooling structure for a power electronic component, characterized in that, include: Cover assembly (5), wherein a first cooling channel (8) is provided inside the cover assembly (5); Cooling plate assembly (6), wherein a second cooling channel (9) is provided inside the cooling plate assembly (6); Power electronic component (7), the power electronic component (7) being sandwiched between the cover plate assembly (5) and the cooling plate assembly (6); A flow divider channel is provided, wherein the flow divider channel is adapted to connect the first cooling channel and the second cooling channel in parallel.

2. The power electronic component cooling structure according to claim 1, characterized in that, The cover plate assembly (5) is provided with a first coolant inlet (2d) and a first coolant outlet (2e), and the first coolant inlet (2d) and the first coolant outlet (2e) are respectively connected to the first cooling channel; The cooling plate assembly (6) is provided with a second coolant inlet (4d) and a second coolant outlet (4e), and the second coolant inlet (4d) and the second coolant outlet (4e) are respectively connected to the second cooling channel; The first coolant inlet (2d) and the second coolant inlet (4d) are connected in parallel to receive coolant through the diversion channel, and the first coolant outlet (2e) and the second coolant outlet (4e) are connected in parallel to output coolant.

3. The power electronic component cooling structure according to claim 1, characterized in that, The cover plate assembly (5) includes a cover plate (1) and a cooling ring (2), wherein the cover plate (1) is connected to the cooling ring (2) and surrounds the cooling ring (2) to form the first cooling channel.

4. The power electronic component cooling structure according to claim 3, characterized in that, The cover plate (1) has a circumferential rib (1g) on ​​the wall surface opposite to the cooling ring (2). The inner side of the circumferential rib (1g) forms a first groove structure. The circumferential rib (1g) is adapted to the shape of the cooling ring (2). The cooling ring (2) is positioned on the circumferential rib (1g) and surrounds the circumferential rib (1g) to form the first cooling channel.

5. The power electronic component cooling structure according to claim 4, characterized in that, The cooling ring (2) has at least one fluid cavity (2g) on ​​the wall surface opposite to the cover plate (1), and at least one first heat dissipation column array group is provided on the wall surface of the first groove structure. The first heat dissipation column array group includes at least one first heat dissipation column (1b), and the first heat dissipation column (1b) is opposite to the fluid cavity (2g) and extends into the fluid cavity (2g).

6. The power electronic component cooling structure according to claim 5, characterized in that, The cooling ring (2) has at least one heat dissipation fin (2a) protruding on the wall surface opposite to the cover plate (1). The heat dissipation fin (2a) is in contact with the power electronic component (7) and faces the heat-generating area of ​​the power electronic component (7). The fluid cavity (2g) extends into the heat dissipation fin (2a).

7. The power electronic component cooling structure according to claim 1, characterized in that, The cooling plate assembly (6) includes a cooling plate (4) and a flat plate (3). The cooling plate (4) is connected to the flat plate (3). The cooling plate (4) has a second groove structure on the wall surface of the flat plate (3) facing the wall surface. The flat plate (3) seals and covers the second groove structure and surrounds the cooling plate (4) to form the second cooling channel.

8. The power electronic component cooling structure according to claim 7, characterized in that, At least one second heat dissipation column array group is provided on the wall surface of the second groove structure. The second heat dissipation column array group includes at least one second heat dissipation column (4b), and the second heat dissipation column (4b) abuts against the plate (3).

9. The power electronic component cooling structure according to claim 7, characterized in that, The plate (3) is provided with at least one first opening (3c), and the cooling plate (4) is provided with at least one column (4c). The column (4c) is positioned corresponding to the first opening (3c) and extends through the first opening (3c). The column (4c) and the cooling plate (4) are provided with a second opening (4f), and the second opening (4f) is positioned corresponding to the signal terminal of the power electronic component (7).

10. The power electronic component cooling structure according to any one of claims 1-9, characterized in that, The cover assembly (5) has at least one first mounting point (1e) on the side away from the power electronic components (7), the first mounting point (1e) being used to mount external accessories and components; and / or The cover plate assembly (5) is provided with a first through hole (1i) and a second through hole (1j), the first through hole (1i) being used to allow the negative terminal to pass through, and the second through hole (1j) being used to allow the positive terminal to pass through; and / or The cover plate assembly (5) is provided with a third through hole (1h), which is used to connect an electrical connector; the cooling plate assembly (6) is provided with a fourth through hole (4h), which is positioned corresponding to the third through hole (1h), and is used to allow the electrical connector to pass through.

11. The power electronic component cooling structure according to any one of claims 1-9, characterized in that, The cover plate assembly (5) is detachably connected to the cooling plate assembly (6), and a sealing ring is provided between the contact surfaces of the two, with the power electronic component (7) located inside the sealing ring.

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