Liquid cooling plate based on memory alloy flow channel, liquid cooling assembly
By dynamically adjusting the flow rate through the shape memory alloy flow channel, the problem of insufficient heat dissipation and thermal balance of traditional liquid cooling plates is solved, achieving efficient and reliable heat dissipation regulation, reducing energy consumption and leakage risk, and making it suitable for thermal management of batteries and high-power electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUIZHOU DESAY INTELLIGENT ENERGY STORAGE CO LTD
- Filing Date
- 2025-07-08
- Publication Date
- 2026-06-12
AI Technical Summary
Traditional liquid cooling plate flow channel designs suffer from insufficient static heat dissipation capacity, difficulty in achieving local thermal equilibrium, and high costs, complex control, and leakage risks due to reliance on external control devices, making it difficult to achieve dynamic and balanced heat dissipation regulation.
A liquid cooling plate based on shape memory alloy flow channels is adopted. The flow rate is adjusted by the deformation of the first and second shape memory alloy flow channels in different areas to achieve dynamic heat dissipation adjustment. Combined with the liquid cooling base plate, a liquid cooling assembly is formed, avoiding complex control devices.
It enables differentiated heat dissipation adjustment in the middle and edge areas of the product, reduces energy waste and the risk of local overheating, improves the response speed and reliability of heat dissipation adjustment, and reduces the risk of coolant leakage.
Smart Images
Figure CN224356528U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of liquid cooling plate technology, specifically to a liquid cooling plate and liquid cooling assembly based on shape memory alloy flow channels. Background Technology
[0002] As a core component of thermal management systems for batteries, high-power electronic devices, and other electronic devices, the flow channel design of liquid cooling plates directly affects the product's heat dissipation efficiency and temperature uniformity. Traditional liquid cooling plates often feature fixed flow channel structures, which typically have the following limitations:
[0003] 1. Insufficient static heat dissipation capacity: The heat generated by batteries or electronic devices varies significantly under different operating conditions (such as fast charging and high-load operation). Fixed flow channels cannot dynamically adjust the heat dissipation intensity, which can easily lead to redundant coolant flow at low loads, resulting in energy waste, while insufficient flow at high loads can cause local overheating of the product.
[0004] 2. Difficulty in achieving localized thermal equilibrium: Fixed flow channels cannot achieve differentiated flow rate adjustment based on temperature gradients within the product. This can easily lead to excessively large temperature differences (e.g., >5℃) due to uniform flow distribution, resulting in "overcooled" or "overheated" areas within the product, thus accelerating performance degradation. For example, the active working components of a battery pack are mainly concentrated in its central region. Therefore, during battery pack operation, the central region often has a higher temperature, while the edge regions have a lower temperature. If a fixed flow channel without differentiation is used for heat dissipation, the central region may experience "overheating" due to insufficient flow, or the edge regions may experience "overcooling" due to redundant flow.
[0005] 3. Reliance on external control: Dynamic adjustment schemes are used to regulate the coolant temperature to achieve heat dissipation and cooling. For example, devices such as electrically controlled valves and variable flow pumps, which require complex sensors and control systems to regulate the coolant temperature, are used. This heat dissipation method is not only costly and complex to control, but also relies on the synchronous response of electrical signal transmission and mechanical action. The response speed and accuracy are lacking, making it difficult to match the transient thermal shock of the product in real time. Moreover, the added external control devices are prone to leakage due to vibration or material fatigue failure after long-term use, resulting in low system reliability. Utility Model Content
[0006] To address the shortcomings of the existing technology, this invention provides a liquid cooling plate based on shape memory alloy flow channels. Utilizing a first and second shape memory alloy flow channel, it achieves zoned and dynamic heat dissipation adjustment of the product. This not only effectively balances the differentiated heat dissipation adjustment between the central and edge areas of the product, preventing overheating or undercooling and extending the product's lifespan, but also allows the shape memory alloy flow channels to deform in real time according to the temperature of the coolant they contact, achieving dynamic flow regulation. This avoids situations where there is redundant coolant flow at low loads, resulting in energy waste, or insufficient flow at high loads, causing localized overheating.
[0007] This utility model also provides a liquid cooling component based on a shape memory alloy flow channel, which is formed by combining the above-mentioned liquid cooling plate and liquid cooling base plate. It can achieve the purpose of heat dissipation regulation without the need to add a complex control device. The overall structure is simple and low in cost. The heat dissipation regulation response speed is fast and the heat dissipation uniformity is good. Moreover, the heat dissipation regulation control method is highly reliable and can effectively reduce the risk of coolant leakage.
[0008] The technical effects to be achieved by this utility model are realized through the following technical aspects:
[0009] In a first aspect, this utility model provides a liquid cooling plate based on a shape memory alloy flow channel, comprising:
[0010] Liquid cooling plate body;
[0011] The first shape memory alloy flow channel is located in the middle region of the liquid cooling plate body to achieve heat dissipation in the middle region of the electronic product;
[0012] And a second shape memory alloy flow channel is provided in the edge area of the liquid cooling plate body to achieve heat dissipation in the edge area of the electronic product;
[0013] Both the first and second memory alloy flow channels control the flow rate through the deformation of the memory alloy to achieve heat dissipation for electronic products; and the thixotropic temperature of the memory alloy in the first memory alloy flow channel is greater than that in the second memory alloy flow channel.
[0014] As a preferred embodiment, both the first shape memory alloy flow channel and the second shape memory alloy flow channel include:
[0015] The flow channel cavity is used for the flow of coolant to achieve heat dissipation for electronic products;
[0016] And shape memory alloy components are disposed on the flow channel cavity to trigger deformation by contacting the coolant, so as to achieve overall flow control of the flow channel.
[0017] As one preferred embodiment, the shape memory alloy component is disposed on the top and / or sidewall of the flow channel cavity.
[0018] As one preferred embodiment, when the shape memory alloy component is disposed on the top and sidewall of the flow channel cavity, the flow channel cross-section of the first shape memory alloy flow channel and the second shape memory alloy flow channel without deformation is a trapezoidal flow channel cross-section structure, and the flow channel cross-section of the first shape memory alloy flow channel and the second shape memory alloy flow channel after deformation is a semi-circular flow channel cross-section structure.
[0019] As one preferred embodiment, the shape memory alloy part is a nickel-titanium shape memory alloy part or a copper-based shape memory alloy part.
[0020] As one preferred embodiment, the thixotropic temperature of the memory alloy component on the first memory alloy flow channel is 40℃-45℃, and the reset temperature is 30℃-35℃.
[0021] As one preferred embodiment, the thixotropic temperature of the memory alloy component on the second memory alloy flow channel is 30℃-35℃, and the reset temperature is 25℃-27℃.
[0022] As one preferred embodiment, the shape memory alloy component has a corrosion-resistant coating on the side in contact with the coolant to prevent erosion by the coolant.
[0023] As one preferred embodiment, the flow channel cavity includes:
[0024] The flow channel cavity body;
[0025] And a shape memory alloy assembly groove is formed on the flow channel cavity body to realize the assembly of the shape memory alloy parts.
[0026] Secondly, this utility model provides a liquid cooling component based on a shape memory alloy flow channel, comprising:
[0027] The liquid cooling plate based on shape memory alloy flow channels, as described above, is used to control the flow rate of the flow channels in order to achieve heat dissipation for electronic products.
[0028] And a liquid-cooled base plate, which is assembled with the liquid-cooled plate based on the shape memory alloy flow channel to realize the installation of the whole component and the product to be cooled.
[0029] In summary, this utility model has at least the following advantages:
[0030] 1. The liquid cooling plate based on shape memory alloy flow channels provided by this utility model utilizes a first shape memory alloy flow channel and a second shape memory alloy flow channel to achieve zoned and dynamic heat dissipation adjustment of the product. This not only effectively balances the differentiated heat dissipation adjustment between the central and edge areas of the product, preventing the product from being "overheated" or "overcooled" and thus extending the product's service life, but also allows the shape memory alloy flow channel to deform in a timely manner according to the temperature of the coolant it contacts, thereby achieving dynamic flow adjustment of the flow channel. This avoids situations where there is redundant coolant flow when the product is under low load, resulting in energy waste, or insufficient flow when the product is under high load, resulting in local overheating of the product.
[0031] 2. The liquid cooling component based on shape memory alloy flow channel provided by this utility model is formed by combining the above-mentioned liquid cooling plate and liquid cooling base plate. It can achieve the purpose of heat dissipation adjustment without adding a complicated control device. The overall structure is simple and low cost. The heat dissipation adjustment response speed is fast and the heat dissipation balance is good. Moreover, the heat dissipation adjustment control method is highly reliable and can effectively reduce the risk of coolant leakage. Attached Figure Description
[0032] Figure 1 This is a top view schematic diagram of the overall structure of the liquid cooling plate based on the shape memory alloy flow channel in an embodiment of this utility model.
[0033] Figure 2 This is a side view of the overall structure of the liquid cooling plate based on the shape memory alloy flow channel in an embodiment of this utility model.
[0034] Figure 3 for Figure 2 An enlarged schematic diagram of the shape memory alloy component in section A when it is not deformed.
[0035] Figure 4 for Figure 2 An enlarged schematic diagram of the shape memory alloy component in section A after deformation.
[0036] Figure 5 This is a partial structural diagram of the flow channel cavity in an embodiment of this utility model.
[0037] Figure 6 This is a schematic diagram of the overall structure of the liquid cooling component based on the shape memory alloy flow channel in this embodiment of the present invention.
[0038] Figure label:
[0039] 100. Liquid cooling plate based on shape memory alloy flow channel; 110. Liquid cooling plate body; 120. First shape memory alloy flow channel; 130. Second shape memory alloy flow channel; 121. Flow channel cavity; 1211. Flow channel cavity body; 1212. Shape memory alloy assembly groove; 122. Shape memory alloy component;
[0040] 200. Liquid-cooled base plate. Detailed Implementation
[0041] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are some, but not all, of the embodiments of this utility model.
[0042] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0043] Example 1:
[0044] Please see the appendix Figure 1 and 2 In this embodiment of the invention, a liquid cooling plate 100 based on a shape memory alloy flow channel includes a liquid cooling plate body 110; a first shape memory alloy flow channel 120 disposed in the central region of the liquid cooling plate body 110 for heat dissipation of the central region of the electronic product; and a second shape memory alloy flow channel 130 disposed in the edge region of the liquid cooling plate body 110 for heat dissipation of the edge region of the electronic product. Both the first shape memory alloy flow channel 120 and the second shape memory alloy flow channel 130 control the flow rate through the deformation of the shape memory alloy to achieve heat dissipation of the electronic product; and the thixotropic temperature of the shape memory alloy in the first shape memory alloy flow channel 120 is greater than the thixotropic temperature of the shape memory alloy in the second shape memory alloy flow channel 130.
[0045] In this embodiment of the utility model, the liquid cooling plate 100 based on shape memory alloy channels utilizes the first shape memory alloy channel 120 and the second shape memory alloy channel 130 to achieve zoned and dynamic heat dissipation adjustment of the product. This not only effectively balances the differentiated heat dissipation adjustment between the central and edge areas of the product, preventing the product from being "overheated" or "overcooled" and thus extending the product's service life, but also allows the shape memory alloy channels to deform in a timely manner according to the temperature of the coolant they come into contact with, thereby achieving dynamic flow regulation of the channels. This avoids situations where there is redundant coolant flow at low loads, resulting in energy waste, or insufficient flow at high loads, causing localized overheating of the product.
[0046] Taking a battery pack as an example, the active working components of the battery pack are mainly concentrated in its central region. Therefore, when the battery pack is working, the temperature in the central region is often higher and the temperature in the edge region is lower. When using the liquid cooling plate 100 based on the shape memory alloy flow channel in this embodiment for heat dissipation, it can not only perform zoned heat dissipation according to the different temperatures of each region, effectively realizing differentiated heat dissipation adjustment between the central region and the edge region of the battery pack, so as to prevent the phenomenon of "overheating" in the central region of the battery pack due to insufficient flow or "overcooling" in the edge region due to redundant flow; but also the flow rate of the flow channel in each region can be dynamically adjusted in a timely manner according to the temperature of the coolant it is in contact with, avoiding the situation of redundant coolant flow when the battery pack is under low load, resulting in energy waste, and insufficient flow when the battery pack is under high load, resulting in local overheating of the battery pack.
[0047] Please refer to the appendix for further details. Figure 3 and 4 Both the first shape memory alloy flow channel 120 and the second shape memory alloy flow channel 130 include a flow channel cavity 121 and a shape memory alloy component 122 disposed on the flow channel cavity 121. The flow channel cavity 121 is used for the flow of coolant to achieve heat dissipation for electronic products. The shape memory alloy component 122 is used to trigger deformation by contacting the coolant to achieve overall flow control of the flow channel. Please refer to the appendix for further details. Figure 5 The flow channel cavity 121 includes a flow channel cavity body 1211 and a shape memory alloy assembly groove 1212 formed on the flow channel cavity body 1211 for assembling the shape memory alloy part 122. Preferably, the shape memory alloy assembly groove 1212 can be formed on the top or side wall of the flow channel cavity body 1211, or simultaneously on the top and side wall of the flow channel cavity body 1211. The length of the shape memory alloy assembly groove 1212 can be selected according to actual needs, and is at least 1 / 2 the length of the flow channel cavity body 1211.
[0048] Furthermore, the shape memory alloy component 122 is disposed on the top or side wall of the flow channel cavity 121, or simultaneously disposed on the top and side wall of the flow channel cavity 121. The specific design can be selected according to actual needs. Preferably, the shape memory alloy component 122 is a shape memory alloy sheet or shape memory alloy block, which can be first embedded in the shape memory alloy assembly groove 1212, and then fixedly connected to the flow channel cavity body 1211 by welding or gluing to ensure the sealing of the connection between the flow channel cavity 121 and the shape memory alloy component 122, and prevent coolant leakage in the flow channel.
[0049] Please refer to the appendix for further details. Figure 3 and 4 In some embodiments, the shape memory alloy component 122 is disposed on the top and sidewall of the flow channel cavity 121, and the undeformed flow channel cross-sections of the first shape memory alloy flow channel 120 and the second shape memory alloy flow channel 130 are trapezoidal flow channel cross-section structures, as shown in the attached figure. Figure 3As shown in the attached diagram; the cross-section of the first shape memory alloy channel 120 and the second shape memory alloy channel 130 after deformation is a semi-circular cross-section structure. Figure 4 As shown. When the coolant temperature is within the preset temperature range for the deformation of the shape memory alloy flow channel, the cross-section of the entire flow channel is a trapezoidal structure; when the coolant temperature reaches the preset temperature for the deformation of the shape memory alloy flow channel, the shape memory alloy part 122 deforms, causing the cross-section of the entire flow channel to deform into a semi-circular structure, thereby increasing the cross-sectional area of the entire flow channel and achieving the purpose of increasing the flow rate.
[0050] Furthermore, the shape memory alloy part 122 is either a nickel-titanium shape memory alloy part 122 or a copper-based shape memory alloy part 122. Before deformation, the shape memory alloy part 122 is dominated by the martensitic phase, and the temperature is below the "martensite completion temperature". The crystal structure of the martensitic phase consists of a large number of "twin variants". Under the action of external force, the twin boundaries will move, causing the crystal structure to rearrange, thereby producing macroscopic deformation (such as bending and stretching). This deformation is reversible. After the external force is removed, the crystal structure maintains the deformed state due to the stability of the twin boundaries, rather than elastically rebounding like ordinary metals. When the temperature rises to the "austenite initiation temperature", the shape memory alloy part 122 transforms from the martensitic phase to the austenitic phase. The crystal structure of the austenitic phase has higher symmetry. When the temperature exceeds the phase transformation critical value, the twin structure of the martensitic phase will be destroyed, and the crystal will automatically "reconstruct" into a high-temperature stable austenitic structure, which macroscopically manifests as complete deformation recovery (i.e., the "memory effect").
[0051] Preferably, the thixotropic temperature of the shape memory alloy component 122 on the first shape memory alloy channel 120 is 40℃-45℃, and the reset temperature is 30℃-35℃; the thixotropic temperature of the shape memory alloy component 122 on the second shape memory alloy channel 130 is 30℃-35℃, and the reset temperature is 25℃-27℃. That is, when the "austenite initiation temperature" of the shape memory alloy component 122 on the first shape memory alloy channel 120 reaches 40℃-45℃, deformation occurs; when the "martensite termination temperature" of the shape memory alloy component 122 on the first shape memory alloy channel 120 is lower than 30℃-35℃, deformation recovers. When the "austenite initiation temperature" of the shape memory alloy component 122 on the second shape memory alloy channel 130 reaches 30℃-35℃, deformation occurs; when the "martensite termination temperature" of the shape memory alloy component 122 on the second shape memory alloy channel 130 is lower than 25℃-27℃, deformation recovers. The thixotropic temperature and reset temperature can be selected adaptively according to the actual needs of the product.
[0052] Furthermore, a corrosion-resistant coating is provided on the side of the shape memory alloy part 122 that is in contact with the coolant to prevent the coolant from corroding it, extend the overall service life of the liquid cooling plate, and reduce the deformation friction loss of the shape memory alloy part 122.
[0053] Example 2:
[0054] Please see the appendix Figure 6 The liquid cooling assembly based on shape memory alloy flow channels in this embodiment includes the liquid cooling plate 100 based on shape memory alloy flow channels as described in Embodiment 1, and a liquid cooling base plate 200 integrally assembled with the liquid cooling plate 100. The liquid cooling plate controls the flow rate of the flow channels to achieve heat dissipation for the electronic product; the liquid cooling base plate 200 is used to mount the assembly to the product to be cooled. Preferably, the liquid cooling base plate 200 is an aluminum substrate base plate.
[0055] Furthermore, the liquid cooling plate and the liquid cooling base plate 200 are assembled into one piece using sheet metal brazing technology. Specifically, after spraying flux solution onto the liquid cooling plate, the liquid cooling base plate 200 is assembled onto the liquid cooling plate and fixed by spot welding. Then, brazing is performed using brazing fixtures. After brazing is completed, the liquid cooling component is naturally cooled to room temperature to complete the overall assembly.
[0056] In this embodiment, the liquid cooling component based on the shape memory alloy flow channel is formed by combining the liquid cooling plate and the liquid cooling base plate in Embodiment 1. It can achieve the purpose of heat dissipation adjustment without adding a complex control device. The overall structure is simple and low-cost, with fast heat dissipation adjustment response speed and good heat dissipation uniformity. Moreover, the heat dissipation adjustment control method has high reliability and can effectively reduce the risk of coolant leakage.
[0057] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0058] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0059] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0060] In this invention, unless otherwise expressly specified and limited, "above or below" the first feature may include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on" the first feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the first feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0061] Although the description of this utility model has been given in conjunction with the specific embodiments described above, it is obvious to those skilled in the art that many substitutions, modifications, and variations can be made based on the above description. Therefore, all such substitutions, modifications, and variations are included within the spirit and scope of the appended claims.
Claims
1. A liquid cooling plate based on shape memory alloy flow channels, characterized in that, include: Liquid cooling plate body (110); The first shape memory alloy flow channel (120) is disposed in the middle region of the liquid cooling plate body (110) to achieve heat dissipation in the middle region of the electronic product; And a second shape memory alloy flow channel (130) is provided in the edge region of the liquid cooling plate body (110) to achieve heat dissipation in the edge region of the electronic product; Both the first memory alloy flow channel (120) and the second memory alloy flow channel (130) control the flow rate of the flow channel through the deformation of the memory alloy to achieve heat dissipation for electronic products; and the thixotropic temperature of the memory alloy on the first memory alloy flow channel (120) is greater than the thixotropic temperature of the memory alloy on the second memory alloy flow channel (130).
2. The liquid cooling plate based on shape memory alloy flow channels according to claim 1, characterized in that, Both the first shape memory alloy flow channel (120) and the second shape memory alloy flow channel (130) include: The flow channel cavity (121) is used for the flow of coolant to achieve heat dissipation for electronic products; And a shape memory alloy component (122) is disposed on the flow channel cavity (121) for triggering deformation by contacting the coolant to achieve overall flow control of the flow channel.
3. The liquid cooling plate based on shape memory alloy flow channels according to claim 2, characterized in that, The shape memory alloy component (122) is disposed on the top and / or sidewall of the flow channel cavity (121).
4. The liquid cooling plate based on shape memory alloy flow channels according to claim 3, characterized in that, When the shape memory alloy component (122) is disposed on the top and side wall of the flow channel cavity (121), the flow channel cross-section of the first shape memory alloy flow channel (120) and the second shape memory alloy flow channel (130) without deformation is a trapezoidal flow channel cross-section structure, and the flow channel cross-section of the first shape memory alloy flow channel (120) and the second shape memory alloy flow channel (130) after deformation is a semi-circular flow channel cross-section structure.
5. The liquid cooling plate based on shape memory alloy flow channels according to claim 2, characterized in that, The shape memory alloy part (122) is a nickel-titanium shape memory alloy part (122) or a copper-based shape memory alloy part (122).
6. The liquid cooling plate based on shape memory alloy flow channels according to claim 2, characterized in that, The thixotropic temperature of the memory alloy component (122) on the first memory alloy flow channel (120) is 40℃-45℃, and the reset temperature is 30℃-35℃.
7. The liquid cooling plate based on shape memory alloy flow channels according to claim 2, characterized in that, The thixotropic temperature of the memory alloy component (122) on the second memory alloy flow channel (130) is 30℃-35℃, and the reset temperature is 25℃-27℃.
8. The liquid cooling plate based on shape memory alloy flow channels according to claim 2, characterized in that, The shape memory alloy part (122) has a corrosion-resistant coating on the side that contacts the coolant to prevent corrosion from the coolant.
9. The liquid cooling plate based on shape memory alloy flow channels according to claim 2, characterized in that, The flow channel cavity (121) includes: Flow channel cavity body (1211); And a shape memory alloy assembly groove (1212) is provided on the flow channel cavity body (1211) to realize the assembly of the shape memory alloy part (122).
10. A liquid cooling assembly based on shape memory alloy flow channels, characterized in that, include: The liquid cooling plate (100) based on the shape memory alloy flow channel as described in any one of claims 1-9 is used to control the flow rate of the flow channel in order to achieve heat dissipation for electronic products; And a liquid cooling base plate (200), which is assembled with the liquid cooling plate (100) based on the memory alloy flow channel to realize the installation of the whole component and the product to be cooled.