Battery device and electric appliance

Abstract

The application provides a battery device and an electric device. The battery device comprises: a plurality of battery cells; at least one chip, each chip being connected to at least one battery cell, and the chip being used for collecting and processing state information of the connected battery cell; and a data transmission component, which is electrically connected to the chip and is used for transmitting the collected state information of the battery cell. Each chip is in heat-conducting connection with a battery cell surface of the connected at least one battery cell through a first heat-emitting surface of the chip close to the battery cell surface, so as to perform heat transfer to the battery cell surface of the connected at least one battery cell. In this way, the chip can perform heat transfer to the battery cell surface, the heat dissipation effect of the chip in the battery device is improved, the service life and reliability of the chip are improved, and the reliability and stability of the battery device are improved.

Description

Technical Field

[0001] This application relates to the field of battery technology, and in particular to battery devices and electrical equipment. Background Technology

[0002] This section is intended to provide background or context for embodiments of this application. The description herein is not intended to imply that it is prior art simply because it is included in this section.

[0003] New energy batteries are being used more and more widely in daily life and industry. For example, new energy vehicles equipped with batteries are already widely used. In addition, batteries are being used more and more in the field of energy storage.

[0004] In battery devices, chips are typically used to collect and process state information such as voltage and temperature of the battery cells. As the requirements for the accuracy and real-time performance of battery cell data acquisition increase, the integration density of chips is gradually increasing. Packing too many components into the chip can lead to overheating issues during prolonged use, affecting the chip's lifespan. Utility Model Content

[0005] In view of this, the present application aims to provide a battery device and electrical equipment that can improve the heat dissipation effect of the chip in the battery device, thereby improving the chip life and reliability, and thus improving the reliability and stability of the battery device.

[0006] The technical solution of this application embodiment is implemented as follows:

[0007] This application provides a battery device, including:

[0008] Multiple battery cells;

[0009] At least one chip, each chip is connected to at least one battery cell, and the chip is used to collect and process the status information of the connected battery cell;

[0010] The data transmission component is electrically connected to the chip and is used to transmit the collected status information of the battery cell.

[0011] In this configuration, the first heating surface of each chip near the surface of the battery cell is thermally connected to the surface of at least one connected battery cell to conduct heat transfer to the surface of the at least one connected battery cell.

[0012] In the battery device of this application embodiment, a chip used to collect and process cell status information is thermally connected to the surface of at least one connected cell. Since the cell surface typically contains materials with high thermal conductivity, such as metals, and has a relatively large surface area, its thermal conductivity is high. By setting the chip to be thermally connected to the cell surface, heat can be transferred from the chip to the cell surface, improving the heat dissipation effect of the chip in the battery device, thereby increasing chip lifespan and reliability, and ultimately improving the reliability and stability of the battery device.

[0013] In some embodiments, the data transmission component includes:

[0014] Sampling lines;

[0015] A circuit board is used to carry chips and sampling lines so that the chips can be connected to at least one battery cell via the sampling lines.

[0016] In the above embodiments, since the circuit board usually contains components with high thermal conductivity such as metal pads and circuit traces, the overall thermal conductivity of the circuit board is also relatively high. By carrying the chip and sampling lines on the circuit board, heat can be transferred to the circuit board, further improving the heat dissipation effect of the chip.

[0017] In some embodiments, the chip has a second heating surface away from the surface of the battery cell, and the second heating surface of the chip is thermally connected to the circuit board to transfer heat to the circuit board.

[0018] In the above embodiments, the chip is thermally connected to the surface of the battery cell and the circuit board through a first heating surface close to the surface of the battery cell and a second heating surface far away from the surface of the battery cell, respectively. This can achieve heat dissipation from at least two heating surfaces, which is more conducive to the heat dissipation of the chip and can further improve the heat dissipation effect of the chip.

[0019] In some embodiments, the circuit board includes one of the following: a flexible circuit board with single-layer traces, a flexible DC cable with single-layer traces, or a printed circuit board with multi-layer traces.

[0020] In the above embodiments, on the one hand, since the fewer the number of trace layers of a flexible circuit board or flexible DC cable, the faster the heat dissipation, setting a flexible circuit board or flexible DC cable with a single layer of traces can accelerate the efficiency of chip heat dissipation through the circuit board and improve the chip heat dissipation effect. On the other hand, since the more trace layers a printed circuit board has, the more components with high thermal conductivity such as metal pads and circuit traces it contains, the higher the overall thermal conductivity of the circuit board. Therefore, setting a printed circuit board with multiple layers of traces can further accelerate the efficiency of chip heat dissipation through the circuit board and improve the chip heat dissipation effect.

[0021] In some embodiments, the circuit board has at least one opening containing a thermally conductive medium, through which the chip transfers heat to the surface of the battery cell.

[0022] In the above embodiments, since the circuit board may contain a lot of materials with low thermal conductivity such as resin and polyimide, if the chip comes into contact with these materials with low thermal conductivity, it will affect the heat dissipation efficiency of the chip. Therefore, by opening an opening in the circuit board and allowing the chip to transfer heat to the thermally conductive medium contained in at least one opening of the circuit board, the heat dissipation effect of the chip can be further improved.

[0023] In some embodiments, the first heating surface is the surface with the largest area among the multiple surfaces of the chip.

[0024] In the above embodiments, by setting the surface with the largest area among the multiple surfaces of the chip to be thermally connected to the surface of the battery cell, the heat dissipation area of ​​the chip can be increased, thereby increasing the heat transfer efficiency from the chip to the surface of the battery cell and further improving the heat dissipation effect of the chip.

[0025] In some embodiments, the first heating surface is the surface with the highest operating temperature among the multiple surfaces of the chip.

[0026] In the above embodiments, on the one hand, since the surface with the highest operating temperature among the multiple surfaces of the chip has a higher heat dissipation requirement, setting the surface with the highest operating temperature to be thermally connected to the surface of the battery cell can better meet the heat dissipation requirements of the chip; on the other hand, since the temperature difference between the surface with the highest operating temperature and the surface of the battery cell is greater, setting the surface with the highest operating temperature to be thermally connected to the surface of the battery cell can achieve a better heat dissipation effect.

[0027] In some embodiments, the battery cell includes a prismatic battery cell, and the surface of the battery cell on which the first heating surface is thermally connected includes the end face of the prismatic battery cell where the electrodes are disposed.

[0028] In the above embodiments, since a certain amount of space is usually left at the end face where the electrodes of the prismatic battery cell are set, the chip is thermally connected to this end face, which is beneficial for chip heat dissipation. Furthermore, placing the chip at this end face allows the distance between the chip and the electrodes of the prismatic battery cell to be closer, thereby improving the chip's heat dissipation effect and also facilitating the chip's acquisition of the prismatic battery cell's status information.

[0029] In some embodiments, the battery cell includes a cylindrical battery cell, and the surface of the battery cell on which the first heating surface is thermally connected includes the end face of the cylindrical battery cell where the negative electrode is disposed.

[0030] In the above embodiments, since the positive electrode of the cylindrical cell will generate heat when it is working, and the positive electrode and negative electrode of the cylindrical cell are respectively located on the two end faces of the cylindrical cell, the first heating surface of the chip is thermally connected to the end face of the cylindrical cell where the negative electrode is located, so that the chip can be moved away from the positive electrode, thereby improving the heat dissipation effect of the chip.

[0031] In some embodiments, the battery cell includes a blade battery cell, a first end face of which is provided with a positive electrode, and the battery cell surface thermally connected to the first heating surface includes a second end face of the blade battery cell, the second end face being opposite to the first end face.

[0032] In the above embodiments, since the positive electrode of the blade battery cell will generate heat when it is working, and the second end face of the blade battery cell is opposite to the first end face where the positive electrode is located, by thermally connecting the first heating surface of the chip to the second end face of the blade battery cell, the chip can be moved away from the positive electrode, thereby improving the heat dissipation effect of the chip.

[0033] In some embodiments, the battery device includes at least one row of multiple battery cells arranged along a first direction, and at least two chips arranged along the first direction, each chip being connected to the multiple battery cells.

[0034] In the above embodiments, since the chip and the cell surface are thermally connected, the chip's heat dissipation effect is improved, thereby also improving the chip's data processing capability. In this way, the chip can collect and process more cell status information. By setting each chip to connect to multiple cells, the total number of chips required in the battery device can be reduced while taking into account the chip's heat dissipation requirements, thus reducing costs and increasing the energy density of the battery device.

[0035] In some embodiments, the chip integrates at least one of the following:

[0036] A protective component is connected between the battery cell and the target component in the chip to absorb interference signals superimposed on the signal entering the target component; the target component includes a power management component integrated in the chip and / or an information acquisition and processing component integrated in the chip.

[0037] The filtering component is connected between the battery cell and the information acquisition and processing component, and is used to filter the status information of the battery cell entering the information acquisition and processing component.

[0038] The equalization component includes equalization resistors and corresponding switching components for at least one battery cell connected to the information acquisition and processing component. Each battery cell is connected in series with its corresponding equalization resistor and corresponding switching component. The equalization component is used to equalize the voltage of at least one battery cell connected to the information acquisition and processing component.

[0039] In the above embodiments, since the chip and the cell surface are thermally connected, the heat dissipation effect of the chip is improved, thereby allowing more processing components to be integrated into the chip. By integrating protection components, filtering components and / or equalization components into the chip, the number of peripheral devices can be reduced while taking into account the chip's heat dissipation requirements, reducing the space occupied by peripheral devices, increasing the energy density of the battery device, and reducing the impact of environmental factors such as moisture on protection components, filtering components and / or equalization components, reducing the aging rate of the corresponding devices, thereby improving the reliability and stability of the battery device.

[0040] This application provides an electrical device that includes the battery device described in the above embodiments. Attached Figure Description

[0041] Figure 1 A schematic diagram of the composition structure of a battery device provided in this application embodiment. Figure 1 ;

[0042] Figure 2 A schematic diagram of the composition structure of a battery device provided in this application embodiment. Figure 2 ;

[0043] Figure 3 This is a schematic diagram of the circuit structure of a battery device provided in an embodiment of this application;

[0044] Figure 4 A schematic diagram of the composition structure of a battery device provided in this application embodiment. Figure 3 ;

[0045] Figure 5 A schematic diagram of the connection relationship between the battery cell, chip, and circuit board in a battery device provided in this application embodiment. Figure 1 ;

[0046] Figure 6 A schematic diagram of the connection relationship between the battery cell, chip, and circuit board in a battery device provided in this application embodiment. Figure 2 ;

[0047] Figure 7 A schematic diagram of the connection relationship between the battery cell, chip, and circuit board in a battery device provided in this application embodiment. Figure 3 ;

[0048] Figure 8 A schematic diagram of the connection relationship between the battery cell, chip, and circuit board in a battery device provided in this application embodiment. Figure 4 ;

[0049] Figure 9 A schematic diagram showing the placement of a chip on the surface of a square-shell battery cell in a battery device according to an embodiment of this application;

[0050] Figure 10 This application provides a schematic diagram of the chip placement position on the surface of a cylindrical battery cell in a battery device. Figure 1 ;

[0051] Figure 11 This application provides a schematic diagram of the chip placement position on the surface of a cylindrical battery cell in a battery device. Figure 2 ;

[0052] Figure 12 This application provides a schematic diagram of the chip placement position on the surface of a blade cell in a battery device. Figure 1 ;

[0053] Figure 13 This application provides a schematic diagram of the chip placement position on the surface of a blade cell in a battery device. Figure 2 ;

[0054] Figure 14 This application provides a schematic diagram of the chip placement position on the surface of a blade cell in a battery device. Figure 3 ;

[0055] Figure 15 This application provides a schematic diagram of the chip structure in a battery device. Figure 1 ;

[0056] Figure 16 This application provides a schematic diagram of the chip structure in a battery device. Figure 2 ;

[0057] Figure 17 This application provides a schematic diagram of the chip structure in a battery device. Figure 3 ;

[0058] Figure 18 This is a schematic diagram of the composition structure of an electrical device provided in an embodiment of this application. Detailed Implementation

[0059] It should be noted that, unless otherwise specified, the embodiments and technical features in the embodiments of this application can be combined with each other, and the detailed descriptions in the specific implementation should be understood as explanations of the purpose of this application and should not be regarded as undue limitations on this application.

[0060] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having” and any variations thereof are intended to cover non-exclusive inclusion.

[0061] In the description of the embodiments of this application, technical terms such as "first," "second," and "third" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0062] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0063] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects are in an "or" relationship.

[0064] In the description of the embodiments of this application, the technical terms "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "circumferential", "height direction", "first direction", "second direction", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed, operated or used in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0065] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0066] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical term "contact" should be interpreted broadly, and can be direct contact, contact through an intermediate medium layer, contact between two contacting parties with substantially no interaction force, or contact between two contacting parties with interaction force.

[0067] With the development of clean energy, more and more devices are using electricity as their driving force, leading to the rapid development of power batteries, such as lithium-ion batteries, which can store large amounts of electrical energy and can be repeatedly charged and discharged. These power batteries are not only used in energy storage systems such as hydropower, thermal power, wind power, and solar power plants, but also widely used in electric vehicles such as electric bicycles, electric motorcycles, and electric cars, as well as in aerospace and other fields. As the application areas of power batteries continue to expand, the market demand is also constantly increasing.

[0068] In this embodiment, the battery device can be manufactured from battery cells and / or battery modules. A battery cell refers to a single battery cell, which is the basic unit capable of converting chemical energy into electrical energy. It can be used to manufacture battery modules or battery devices to supply power to electrical devices. A single battery cell can be a primary battery or a secondary battery. A secondary battery is a battery cell that can be recharged after discharge to reactivate its active materials and continue to be used. Battery cells can be lithium-ion batteries, sodium-ion batteries, sodium-lithium-ion batteries, lithium metal batteries, sodium metal batteries, lithium-sulfur batteries, magnesium-ion batteries, nickel-metal hydride batteries, nickel-cadmium batteries, or lead-acid batteries, etc., and this embodiment is not limited to these types. A single battery cell can be cylindrical, cuboid, or other shapes.

[0069] A battery cell includes an electrode assembly, which comprises a positive electrode, a negative electrode, and a separator. During the charging and discharging process of the battery cell, active ions (such as lithium ions) repeatedly insert and extract between the positive and negative electrodes. The separator is positioned between the positive and negative electrodes to prevent short circuits while allowing active ions to pass through.

[0070] In some embodiments, the separator is a separator membrane. This application does not impose any particular limitation on the type of separator membrane; any known porous separator membrane with good chemical and mechanical stability can be selected.

[0071] As an example, the main material of the separator can be selected from at least one of glass fiber, non-woven fabric, polyethylene, polypropylene, polyvinylidene fluoride, and ceramic. The separator can be a single-layer film or a multi-layer composite film, without particular limitation. When the separator is a multi-layer composite film, the materials of each layer can be the same or different, without particular limitation. The separator can be a separate component located between the positive and negative electrodes, or it can be attached to the surfaces of the positive and negative electrodes.

[0072] In some embodiments, the separator is a solid electrolyte. The solid electrolyte is disposed between the positive and negative electrodes, serving both to transport ions and to isolate the positive and negative electrodes.

[0073] In some embodiments, the battery cell also includes an electrolyte, which acts as a conductor of ions between the positive and negative electrodes. This application does not impose specific limitations on the type of electrolyte; it can be selected according to requirements. The electrolyte can be liquid, gel, or solid.

[0074] Liquid electrolytes include electrolyte salts and solvents.

[0075] In some embodiments, the electrolyte salt may be selected from at least one of lithium hexafluorophosphate, lithium tetrafluoroborate, lithium perchlorate, lithium hexafluoroarsenate, lithium bis(fluorosulfonyl)imide, lithium bis(trifluoromethanesulfonyl)imide, lithium trifluoromethanesulfonate, lithium difluorophosphate, lithium difluorooxalate borate, lithium dioxalate borate, lithium difluorodioxalate phosphate, and lithium tetrafluorooxalate phosphate.

[0076] In some embodiments, the solvent may be selected from at least one of ethylene carbonate, propylene carbonate, methyl ethyl carbonate, diethyl carbonate, dimethyl carbonate, dipropyl carbonate, methyl propyl carbonate, ethyl propyl carbonate, butyl carbonate, fluoroethylene carbonate, methyl formate, methyl acetate, ethyl acetate, propyl acetate, methyl propionate, ethyl propionate, propyl propionate, methyl butyrate, ethyl butyrate, 1,4-butyrolactone, sulfolane, dimethyl sulfone, methyl ethyl sulfone, and diethyl sulfone. The solvent may also be an ether solvent. Ether solvents may include one or more of ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, 1,3-dioxolane, tetrahydrofuran, methyl tetrahydrofuran, diphenyl ether, and crown ethers.

[0077] Among them, the gel electrolyte includes a polymer as the electrolyte backbone network, combined with an ionic liquid - lithium salt.

[0078] Solid electrolytes include polymer solid electrolytes, inorganic solid electrolytes, and composite solid electrolytes.

[0079] In some implementations, the electrode assembly is a wound structure. The positive and negative electrode sheets are wound into a wound structure.

[0080] In some implementations, the electrode assembly is a stacked structure.

[0081] In battery devices, chips are typically used to collect and process state information such as voltage and temperature of the battery cells. As the requirements for the accuracy and real-time performance of battery cell data acquisition increase, the integration density of chips is gradually increasing. Packing too many components into the chip can lead to overheating issues during prolonged use, affecting chip lifespan and consequently impacting the stability and reliability of the battery device.

[0082] This application provides a battery device, such as... Figure 1 As shown, the battery device 10 includes:

[0083] Multiple battery cells 11;

[0084] At least one chip 12, each chip 12 is connected to at least one battery cell 11, and the chip 12 is used to collect and process the status information of the connected battery cell 11;

[0085] The data transmission component 19 is electrically connected to the chip 12 and is used to transmit the collected status information of the battery cell 12.

[0086] In this configuration, the first heating surface of each chip 12 near the cell surface 11a is thermally connected to the cell surface 11a of at least one connected cell 11, so as to transfer heat to the at least one thermally connected cell surface 11a.

[0087] Here, the battery device 10 may include, but is not limited to, a power battery device and / or an energy storage battery device, etc., and the embodiments of this application do not limit this.

[0088] The battery cell 11 can be in any suitable form, and this application embodiment does not limit it. For example, the battery cell 11 can be at least one of the following: prismatic battery cell, cylindrical battery cell, blade battery cell, and pouch battery cell.

[0089] Chip 12 can be any suitable sampling chip. For example, chip 12 can be, but is not limited to, an analog front end (AFE) chip, also known as a battery sampling chip, which can be used to collect information such as the voltage and temperature of the battery cell.

[0090] The shape of chip 12 may include, but is not limited to, at least one of square, circular, irregular shapes, etc.

[0091] It is understood that the thermally conductive connection between the chip 12 and the cell surface 11a described herein, as well as other thermally conductive connections described below, can all be achieved through direct contact between the two components to be thermally connected, or through indirect contact between the two components to be thermally connected. This application embodiment does not limit this. It should be noted that the method of achieving thermally conductive connection through indirect contact between the chip 12 and the cell surface 11a does not include the case where the chip 12 is mounted on a circuit board, and the circuit board and cell surface are thermally connected.

[0092] For example, see Figure 6The surface 11a of the battery cell is the top cover, which is usually made of aluminum and has a thermal conductivity of 237 watts per (m·K). The chip 12 is directly attached to the top cover of at least one connected battery cell 11 to form a thermally conductive connection. When the chip temperature is 40 degrees Celsius (°C) and the top cover temperature is 20°C with a thermal conductivity of 237 W / (m·K), the chip dissipates heat quickly through direct contact with the top cover.

[0093] For example, see Figure 8 The surface 11a of the battery cell is the top cover of the battery cell, which is usually made of aluminum and has a thermal conductivity of 237 W / (m·K). A thermally conductive medium 16 is provided between the chip 12 and the surface 11a of at least one connected battery cell 11. The thermally conductive medium 16 may include solder and has a thermal conductivity of 67 W / (m·K). The chip 12 is directly attached to the thermally conductive medium 16 and indirectly contacts the top cover of the at least one connected battery cell 11 through the thermally conductive medium 16 to form a thermally conductive connection. When the chip temperature is 45°C, the top cover temperature is 20°C, the thermal conductivity of the thermally conductive medium 16 is 67 W / (m·K), and the thermal conductivity of the battery cell surface is 237 W / (m·K), the chip 12 achieves rapid heat dissipation through the indirect contact between the thermally conductive medium 16 and the top cover.

[0094] The status information of cell 11 may include, but is not limited to, at least one of voltage, temperature, current, etc.

[0095] In some implementations, each chip 12 can be connected to a battery cell 11 for collecting and processing the status information of the battery cell 11. Each chip 12 can be disposed on the surface of the connected battery cell 11 and thermally connected to the surface of the battery cell.

[0096] In some embodiments, each chip 12 can connect to at least two battery cells 11 for collecting and processing the status information of the at least two battery cells 11. Each chip 12 can be disposed on the surface of any one or more of the connected at least two battery cells 11 and is thermally connected to the surface of the connected one or more battery cells. The number of battery cells 11 connected to a single chip 12 can be set according to actual conditions, and this application embodiment does not limit this. For example, each chip 12 can connect to 2 to 5 battery cells 11. As another example, the number of battery cells 11 connected to each chip 12 can be 3, 4, 6, 8, etc.

[0097] In some embodiments, chip 12 is connected to at least two battery cells 11 and electrically connected to the electrical signal acquisition points of at least two battery cells 11. The difference in distance between chip 12 and any two connected electrical signal acquisition points is within a target difference range. Here, the target difference range can be determined according to the actual situation and can characterize the difference range that makes the distance between chip 12 and any two connected electrical signal acquisition points tend to be consistent. For example, the target difference range can be 0 or a small range of values ​​including 0. The electrical signal acquisition points of battery cells 11 can be, but are not limited to, at least one of positive signal acquisition points, negative signal acquisition points, etc. The positive signal acquisition point can be, for example, a positive terminal, and the negative signal acquisition point can be, for example, a negative terminal, the battery cell casing serving as the negative electrode of the battery cell, etc. It is understandable that by setting the difference between the distance between the chip 12 and any two connected electrical signal acquisition points to be within the target difference range, the distance between the chip 12 and any two connected electrical signal acquisition points can be made to be consistent. This makes the parasitic parameters (such as parasitic capacitance) between the chip 12 and each connected electrical signal acquisition point more consistent, thereby making the acquired cell status information more reliable.

[0098] In some implementations, the number of chips 12 may be one. For example, in the battery device 10, all the battery cells 11 are connected by a single chip 12, which is used to collect and process the status information of all the battery cells 11 in the battery device 10.

[0099] In some embodiments, there may be multiple chips 12, which are spaced apart and physically independent of each other. Each chip 12 can be connected to one or more battery cells 11. The multiple chips 12 may or may not be integrated on the same circuit board; this application does not limit this.

[0100] In some implementations, such as Figure 2 and Figure 3 As shown, the battery device 10 may also include a battery management unit (BMU) 13, and the chip 12 may communicate with the battery management unit 13 and / or other chips 12 via wired or wireless means.

[0101] In some implementations, see also Figure 2 and Figure 3 The battery device 10 may also include a communication link 14, through which the chip 12 can communicate with the battery management unit 13 to transmit the collected cell status information to the battery management unit. For example, the communication link 14 may include, but is not limited to, a daisy-chain communication line, which can transmit the cell status information collected by the chip 12 to the battery management unit 13.

[0102] In some implementations, when there are multiple chips 12, the multiple chips 12 can also be connected to each other via a communication link 14. For example, the communication link 14 includes a daisy-chain communication line that connects the individual chips 12 in series and connects the series-connected chips 12 to the battery management unit 13.

[0103] For example, the battery management unit 13 can obtain the temperature, voltage, current and other status information of each cell in real time through the daisy-chain communication line. It can use this status information to estimate the state of charge (SOC) and state of health (SOH) of the cells, estimate the overall SOC and SOH of the battery device, monitor the battery working status, and control the charging and discharging of the connected cells. When the cell parameters are abnormal, the fault is reported to the vehicle controller.

[0104] Specifically, chip 12 can collect the status information of cell 11 through data transmission component 19, and / or transmit the collected status information of cell 11 to other chips or BMU. For example, data transmission component 19 may include, but is not limited to, at least one of circuit board, sampling line, communication link 14, etc.

[0105] In some implementations, the surface temperature of the battery cell is lower than the minimum operating temperature of the chip. This creates a temperature difference between the chip and the battery cell surface, which facilitates heat transfer from the chip to the battery cell surface, thus improving the chip's heat dissipation. The chip operating temperature refers to the temperature of the chip surface when the chip is operating. In some implementations, the minimum operating temperature of the chip can be determined by testing it.

[0106] In some implementations, the thermal conductivity of the cell surface is higher than a thermal conductivity threshold. This thermal conductivity threshold can be an empirical value determined based on actual conditions, and this application does not limit this. Thus, due to the higher thermal conductivity of the cell surface, the heat transfer efficiency from the chip to the cell surface can be accelerated, improving the heat dissipation effect.

[0107] In some implementations, the thermal conductivity threshold is higher than or equal to the thermal conductivity of air.

[0108] In some implementations, the thermal conductivity threshold is higher than or equal to the thermal conductivity of the chip surface material. The chip surface material may include, but is not limited to, plastic, metal, and ceramic materials.

[0109] In some implementations, the surface of the battery cell contains a metallic material. For example, the metallic material may include, but is not limited to, at least one of aluminum, steel, etc. It is understood that since metallic materials generally have high thermal conductivity, including a metallic material on the surface of the battery cell can improve the thermal conductivity of the cell surface, thereby enhancing the heat dissipation effect of the chip through the cell surface.

[0110] In some embodiments, the battery device 10 has a housing compartment for accommodating a plurality of battery cells 11 and at least one chip 12. The housing compartment also includes a cooling assembly for cooling the battery cells 11. It is understood that because the housing compartment contains the cooling assembly, the temperature within the housing compartment is typically low, and placing the chip 12 and battery cells 11 within this housing compartment can further improve the heat dissipation of the chip 12. Furthermore, since the cooling assembly can be used to cool the battery cells 11, the heat dissipation of the chip can also be further improved by establishing a thermally conductive connection between the chip and the surface of the at least one connected battery cell.

[0111] In some embodiments, the battery device 10 includes a housing, within which a high-voltage compartment and a battery compartment are disposed. The battery compartment can serve as a housing for accommodating multiple battery cells 11 and at least one chip 12, as described in the above embodiments. The high-voltage compartment can house devices such as a BMU, relays, fuses, pre-charge resistors, current sensors, and / or DC-to-DC converters. It is understood that because heat-generating devices such as relays and fuses are housed in the high-voltage compartment, the temperature inside the high-voltage compartment is typically higher than that inside the battery compartment. Therefore, placing the chip 12 within the battery compartment facilitates heat dissipation for the chip 12, thereby extending its lifespan and improving the overall stability and reliability of the battery device.

[0112] In the battery device of this application embodiment, a chip used to collect and process cell status information is electrically connected to the surface of at least one connected cell. Since the cell surface typically contains materials with high thermal conductivity, such as metals, and has a relatively large surface area, its thermal conductivity is high. By setting the chip to be electrically connected to the cell surface, heat can be transferred from the chip to the cell surface, improving the heat dissipation effect of the chip in the battery device, thereby increasing chip lifespan and reliability, and ultimately improving the reliability and stability of the battery device.

[0113] In some embodiments, the battery device 10 includes a power battery device.

[0114] It is understandable that the overall size of the power battery device is limited by the application scenario, and the application scenario requires the power battery device to have a large energy density. As a result, the arrangement of the various components inside the power battery device is usually quite compact, which leads to a high heat dissipation requirement for each chip in the battery device. Furthermore, the placement of the chip in the battery device also has a significant impact on the heat dissipation effect of the chip.

[0115] In this embodiment of the application, by setting a chip in the power battery device to be electrically connected to the surface of the cell, heat can be transferred from the chip to the surface of the cell, thereby improving the heat dissipation effect of the chip in the power battery device. On this basis, the possibility of further compressing the overall volume of the power battery device can be increased, thereby further increasing the energy density improvement space of the power battery device while taking into account the reliability and stability of the power battery device.

[0116] In some embodiments, such as Figure 4 As shown, the data transmission component 19 includes:

[0117] Sampling line 17;

[0118] Circuit board 15 is used to carry chip 12 and sampling line 17 so that chip 12 is connected to at least one cell 11 through sampling line 17.

[0119] Here, the circuit board 15 may include, but is not limited to, at least one of the following: printed circuit board (PCB), flexible printed circuit (FPC), flexible DC cable (FDC).

[0120] In some implementations, the sampling line 17 may include metal traces disposed in the circuit board 15.

[0121] In some embodiments, the battery device 10 may include a circuit board 15, on which multiple chips 12 and sampling lines 17 corresponding to the chips 12 may be mounted.

[0122] In some embodiments, the battery device 10 may include a plurality of circuit boards 15, each circuit board 15 being used to carry at least one chip 12 and a sampling line 17 corresponding to the chip 12.

[0123] In some implementations, the chip 12 carried on the circuit board 15 can be electrically connected to the sampling line 17 in the circuit board 15 via pins, so as to connect at least one battery cell 11 via the sampling line 17.

[0124] The heat dissipation surface of chip 12 may or may not be in contact with circuit board 15; this embodiment does not limit this.

[0125] In some implementations, such as Figure 5 As shown, chip 12 only contacts circuit board 15 through pin 12p, and the third heat dissipation surface 12c in chip 12 does not contact circuit board 15. For example, the heat dissipation surface 12c in chip 12 can be hollowed out from circuit board 15 so that heat dissipation surface 12c can form heat transfer with air for heat dissipation.

[0126] In the above embodiments, since the circuit board usually contains components with high thermal conductivity such as metal pads and metal traces, the overall thermal conductivity of the circuit board is also relatively high. By mounting the chip on the circuit board, heat can be transferred to the circuit board, further improving the heat dissipation effect of the chip.

[0127] In some embodiments, such as Figure 6 As shown, the chip 12 is thermally connected to the side 15a of the circuit board 15 near the surface 11a of the battery cell to transfer heat to the circuit board 15.

[0128] Here, the chip 12 and the side 15a of the circuit board 15 near the surface 11a of the battery cell can be in direct or indirect contact to form a thermally conductive connection. This application embodiment does not limit this.

[0129] In some embodiments, chip 12 is in direct contact with the side 15a of circuit board 15 near the cell surface 11a. For example, see... Figure 6 The side 15a of the circuit board 15 closest to the surface 11a of the battery cell typically contains components with high thermal conductivity, such as metal pads and metal traces. For example, the thermal conductivity of copper pads or copper traces is 386.4 W / (m·K). The chip 12 is directly bonded to the side of the circuit board 15 closest to the surface 11a of the battery cell to form a thermally conductive connection. When the chip temperature is 40 degrees Celsius (°C) and the temperature of the copper pads or copper traces on the surface 15a of the circuit board 15 is 20°C with a thermal conductivity of 386.4 W / (m·K), the chip dissipates heat quickly through direct contact with the copper pads or copper traces on the surface 15a of the circuit board 15.

[0130] In some embodiments, the chip 12 is in indirect contact with the side 15a of the circuit board 15 near the surface 11a of the battery cell. For example, the side 15a of the chip 12 and the side of the circuit board 15 near the surface 11a of the battery cell can be in indirect contact through a thermally conductive medium such as thermally conductive adhesive or solder, so as to transfer heat to the circuit board 15 through the thermally conductive medium such as thermally conductive adhesive or solder.

[0131] In some embodiments, the chip 12 and the side 15a of the circuit board 15 near the cell surface 11a can be in indirect contact through a thermally conductive medium with a higher thermal conductivity than the circuit board. This indirect contact between the chip 12 and the side 15a of the circuit board 15 near the cell surface 11a via a thermally conductive medium with higher thermal conductivity can accelerate heat dissipation from the chip 12 and improve the heat dissipation effect. For example, see... Figure 7 The side 15a of the circuit board 15 near the surface 11a of the battery cell typically includes components with high thermal conductivity, such as metal pads and metal traces. For example, copper pads or copper traces have a thermal conductivity of 386.4 W / (m·K). There is a thermally conductive medium 18 between the chip 12 and the side 15a of the circuit board 15 near the surface 11a of the battery cell. The thermally conductive medium 18 may include solder with a thermal conductivity of 67 W / (m·K). Chip 12 is directly bonded to the thermally conductive medium 18 and indirectly contacts the surface 15a of the circuit board 15 through the thermally conductive medium 18 to form a thermally conductive connection. When the chip temperature is 45°C, and the temperature of the copper pads or copper traces on the surface 15a of the circuit board 15 is 20°C, the thermal conductivity of the thermally conductive medium 18 is 67 W / (m·K), and the thermal conductivity of the copper pads or copper traces is 386.4 W / (m·K), chip 12 indirectly contacts the copper pads or copper traces on the surface 15a of the circuit board 15 through the thermally conductive medium 18 to achieve rapid heat dissipation.

[0132] In the above embodiments, the chip is thermally connected to the side of the circuit board closest to the surface of the battery cell. That is, the chip is placed between the circuit board and the surface of the battery cell, and is thermally connected to both the surface of the battery cell and the circuit board. In this way, the chip can transfer heat to the surface of the battery cell and the circuit board respectively, thereby further improving the heat dissipation effect of the chip.

[0133] In some embodiments, see continue to see Figure 6 The chip 12 has a second heating surface 12b that is away from the surface 11a of the battery cell; the second heating surface 12a of the chip 12 is thermally connected to the circuit board 15 to transfer heat to the circuit board 15.

[0134] Among them, the first heating surface 12a of the chip 12 near the surface 11a of the cell is thermally connected to the surface 11a of the cell.

[0135] In some implementations, see also Figure 6 The second heating surface 12b of the chip 12 is thermally connected to the side 15a of the circuit board 15 near the surface 11a of the battery cell.

[0136] In some embodiments, the first heating surface 12a and the second heating surface 12b can be two back-to-back surfaces of the chip 12. For example, when the chip 12 is a circular chip, the first heating surface 12a and the second heating surface 12b can be two end faces of the circular chip. As another example, when the chip 12 is a square chip, the first heating surface 12a and the second heating surface 12b can be any two back-to-back surfaces of the square chip.

[0137] In the above embodiments, the chip is thermally connected to the surface of the battery cell and the circuit board through a first heating surface close to the surface of the battery cell and a second heating surface far away from the surface of the battery cell, respectively. This can achieve heat dissipation from at least two heating surfaces, which is more conducive to the heat dissipation of the chip and can further improve the heat dissipation effect of the chip.

[0138] In some embodiments, the circuit board 15 includes one of the following: a flexible circuit board with single-layer traces, a flexible DC cable with single-layer traces, or a printed circuit board with multi-layer traces.

[0139] In the above embodiments, on the one hand, since the fewer the number of trace layers of a flexible circuit board or flexible DC cable, the faster the heat dissipation, setting a flexible circuit board or flexible DC cable with a single layer of traces can accelerate the efficiency of chip heat dissipation through the circuit board and improve the chip heat dissipation effect. On the other hand, since the more trace layers a printed circuit board has, the more components with high thermal conductivity such as metal pads and circuit traces it contains, the higher the overall thermal conductivity of the circuit board. Therefore, setting a printed circuit board with multiple layers of traces can further accelerate the efficiency of chip heat dissipation through the circuit board and improve the chip heat dissipation effect.

[0140] In some embodiments, such as Figure 8 As shown, the circuit board 15 has at least one opening containing a thermally conductive medium 16, through which the chip 12 transfers heat to the cell surface 11a.

[0141] Here, the opening can penetrate the circuit board 15, and the chip 12 can indirectly contact the surface 11a of the battery cell through the thermally conductive medium 16 contained inside the opening, so as to form a thermally conductive connection with the surface 11a of the battery cell and transfer heat.

[0142] The number, shape, cross-sectional area, etc. of the openings in the circuit board 15 can be set according to the actual situation, and this application embodiment does not limit them.

[0143] In the above embodiments, since the circuit board may contain a lot of materials with low thermal conductivity such as resin and polyimide, if the chip comes into contact with these materials with low thermal conductivity, it will affect the heat dissipation efficiency of the chip. Therefore, by opening an opening in the circuit board and allowing the chip to transfer heat to the thermally conductive medium contained in at least one opening of the circuit board, the heat dissipation effect of the chip can be further improved.

[0144] In some embodiments, the thermal conductivity of the cell surface 11a is higher than that of the circuit board 15; the thermal conductivity of the thermally conductive medium 16 is higher than that of the circuit board 15.

[0145] It is understandable that the higher the thermal conductivity of an object, the higher its heat transfer efficiency. Therefore, when the thermal conductivity of the cell surface 11a is higher than that of the circuit board 15, and the thermal conductivity of the heat-conducting medium 16 is higher than that of the circuit board 15, the heat transfer efficiency of the cell surface 11a and the heat-conducting medium 16 is higher than that of the circuit board 15.

[0146] In the above embodiments, the thermal conductivity of the cell surface and the thermal conductivity of the thermally conductive medium contained in the opening of the circuit board are both higher than the thermal conductivity of the circuit board. In this way, the chip can transfer heat through the cell surface and the thermally conductive medium with higher thermal conductivity, which is more conducive to heat dissipation and can further improve the heat dissipation effect of the chip.

[0147] In some embodiments, the thermally conductive medium 16 includes at least one of the following: air, solder, thermally conductive adhesive, and metal pads on a circuit board.

[0148] Among them, metal pads may include, but are not limited to, at least one of copper pads, aluminum pads, etc.

[0149] In the above embodiments, since air, solder, thermally conductive adhesive, and metal pads on the circuit board can all effectively transfer heat to the battery cell, using air, solder, thermally conductive adhesive, and / or metal pads on the circuit board as the heat transfer medium can improve the heat dissipation effect of the chip.

[0150] In some embodiments, the first heating surface is the surface with the largest area among the plurality of surfaces of the chip 12.

[0151] In the above embodiments, by setting the surface with the largest area among the multiple surfaces of the chip to be thermally connected to the surface of the battery cell, the heat dissipation area of ​​the chip can be increased, thereby increasing the heat transfer efficiency from the chip to the surface of the battery cell and further improving the heat dissipation effect of the chip.

[0152] In some embodiments, the first heating surface is the surface with the highest operating temperature among the plurality of surfaces of the chip 12.

[0153] It is understandable that the operating temperature of each surface of a chip refers to the temperature of the corresponding surface when the chip is working.

[0154] In some implementations, the temperature of each of the multiple faces of the chip 12 during operation can be tested experimentally to determine the face with the highest operating temperature among the multiple faces of the chip 12.

[0155] In some implementations, the surface with the highest operating temperature among multiple surfaces of chip 12 can be determined based on the distribution of the electronic components integrated inside chip 12 and the heating characteristics of each electronic component.

[0156] In the above embodiments, on the one hand, since the surface with the highest operating temperature among the multiple surfaces of the chip has a higher heat dissipation requirement, setting the surface with the highest operating temperature to be thermally connected to the surface of the battery cell can better meet the heat dissipation requirements of the chip; on the other hand, since the temperature difference between the surface with the highest operating temperature and the surface of the battery cell is greater, setting the surface with the highest operating temperature to be thermally connected to the surface of the battery cell can achieve a better heat dissipation effect.

[0157] In some embodiments, such as Figure 9 As shown, the battery cell 11 includes a square-shell battery cell 111, and the surface of the battery cell connected to the first heating surface 12a includes the end face 1111a of the square-shell battery cell 111 where electrodes (such as positive electrode 1112 and / or negative electrode 1113) are disposed.

[0158] Chip 12 can be disposed at any suitable position on the end face 1111a of at least one connected square-shell battery cell, and this embodiment of the application does not limit this.

[0159] In some implementations, see also Figure 9 The positive electrode 1112 and negative electrode 1113 of the prismatic battery cell 111 are both disposed on the top cover surface 1111a, that is, the end face 1111a of the prismatic battery cell 111 where the electrodes (such as the positive electrode 1112 and / or the negative electrode 1113) are disposed includes the top cover surface. The chip 12 can be disposed at any suitable position on the top cover 1111 of at least one connected prismatic battery cell 111, and is thermally connected to the top cover surface 1111a. This embodiment of the application does not limit this.

[0160] In some implementations, see also Figure 9 The positive electrode 1112 and negative electrode 1113 of the prismatic battery cell 111 are both disposed on the end face 1111a. The chip 12 can be disposed on the side of the end face 1111a of at least one connected prismatic battery cell 111 near the negative electrode. In this way, the influence of the heat generated by the positive electrode on the chip temperature during the operation of the battery cell can be reduced, and the heat dissipation effect of the chip can be improved.

[0161] In the above embodiments, since a certain amount of space is usually left at the end face where the electrodes of the prismatic battery cell are set, the chip is thermally connected to this end face, which is beneficial for chip heat dissipation. Furthermore, placing the chip at this end face allows the distance between the chip and the electrodes of the prismatic battery cell to be closer, thereby improving the chip's heat dissipation effect and also facilitating the chip's acquisition of the prismatic battery cell's status information.

[0162] In some embodiments, such as Figure 10 and Figure 11 As shown, the battery cell 11 includes a cylindrical battery cell 112. The surface of the battery cell that is thermally connected to the first heating surface includes the end face 112a of the cylindrical battery cell 112 where a positive electrode is disposed, or the end face 112b of the cylindrical battery cell 112 where a negative electrode is disposed.

[0163] In the above embodiments, the chip is disposed at the end of the cylindrical cell and is thermally connected to the end surface, which can improve the chip's heat dissipation effect and facilitate the chip to collect the status information of the cylindrical cell.

[0164] In some embodiments, such as Figure 11 As shown, the battery cell 11 includes a cylindrical battery cell 112, and the surface of the battery cell that is thermally connected to the first heating surface includes the end face 112b of the cylindrical battery cell 112 where the negative electrode is disposed.

[0165] In the above embodiments, since the positive electrode of the cylindrical cell will generate heat when it is working, and the positive electrode and negative electrode of the cylindrical cell are respectively located on the two end faces of the cylindrical cell, the first heating surface of the chip is thermally connected to the end face of the cylindrical cell where the negative electrode is located, so that the chip can be moved away from the positive electrode, thereby improving the heat dissipation effect of the chip.

[0166] In some embodiments, such as Figure 12 As shown, the battery cell 11 includes a blade battery cell 113. A positive electrode 1131 is provided on the first end face 113a of the blade battery cell 113. The battery cell surface thermally connected to the first heating surface includes the second end face 113b of the blade battery cell 113, and the second end face 113b is opposite to the first end face 113a.

[0167] In the above embodiments, since the positive electrode of the blade battery cell will generate heat when it is working, and the second end face of the blade battery cell is opposite to the first end face where the positive electrode is located, by thermally connecting the first heating surface of the chip to the second end face of the blade battery cell, the chip can be moved away from the positive electrode, thereby improving the heat dissipation effect of the chip.

[0168] In some embodiments, such as Figure 13 and Figure 14As shown, the battery cell 11 includes a blade battery cell 113. Each chip 12 is thermally connected to the target surface of at least one blade battery cell 113. The target surface of the blade battery cell 113 includes a first end face 113a where the positive electrode 1131 of the blade battery cell 113 is located, and / or a third end face 113c adjacent to the first end face 113a.

[0169] In the above embodiments, the chip is thermally connected to the first surface where the positive terminal of the blade battery cell is located, and / or to the second surface adjacent to the first surface, which can improve the chip's heat dissipation effect and facilitate the chip to collect the status information of the blade battery cell.

[0170] In some embodiments, see continue to see Figure 1 The battery device 10 includes at least one row of multiple battery cells 11 arranged along a first direction X, and at least two chips 12 arranged along the first direction X, each chip 12 being connected to multiple battery cells 11.

[0171] For example, the battery device 10 includes multiple chips 12, each of which can be used to collect and process the status information of the multiple connected battery cells 11.

[0172] In the above embodiments, since the chip and the cell surface are thermally connected, the chip's heat dissipation effect is improved, thereby also improving the chip's data processing capability. In this way, the chip can collect and process more cell status information. By setting each chip to connect to multiple cells, the total number of chips required in the battery device can be reduced while taking into account the chip's heat dissipation requirements, thus reducing costs and increasing the energy density of the battery device.

[0173] In some implementations, such as Figure 15 As shown, chip 12 integrates an information acquisition and processing component 120 and a power management component 123.

[0174] Information acquisition and processing component 120 is connected to at least one battery cell 11 and is used to acquire and process the status information of the connected battery cell 11;

[0175] The power management component 123 is connected to the positive terminal of the target cell with the highest potential in at least one of the cells 11 connected to the information acquisition and processing component 120, and is used to supply power to the chip 12.

[0176] In some embodiments, the information acquisition and processing component 120 includes an information acquisition component 121 and an information processing component 122. The information acquisition component 121 is used to acquire the status information of the connected battery cells, and the information processing component 122 is used to process the status information of the battery cells acquired by the information acquisition component. The information processing may include, but is not limited to, at least one of fault diagnosis, communication transmission, etc. The information acquisition component 121 and the information processing component 122 may be implemented as the same component or as two separate components; this application embodiment does not limit this.

[0177] In some implementations, the information acquisition component 121 may include at least one of the following:

[0178] A voltage acquisition component is used to acquire the voltage of at least one battery cell connected to the chip;

[0179] A current acquisition component is used to acquire the current of at least one battery cell connected to the chip.

[0180] A temperature acquisition component is used to acquire the temperature of at least one battery cell connected to the chip.

[0181] The power management component 123 can supply power to the chip using the voltage of the highest-potential cell (i.e., the highest-potential cell) among at least one battery cell connected to the chip as input. The power management component may include a boost circuit and / or a buck circuit. If the input voltage is lower than the chip's target operating voltage, the boost circuit can increase the input voltage to the target operating voltage. If the input voltage is higher than the chip's target operating voltage, the buck circuit can decrease the input voltage to the target operating voltage.

[0182] In some implementations, the operating voltage of chip 12 is higher than the sum of the available voltage limits of each battery cell 11 connected to chip 12, and the power management component 123 includes a boost circuit. For example, if chip 12 is connected to two battery cells 11, the available voltage limit of a single battery cell 11 is 2V, and the operating voltage of chip 12 is 5V, then the power management component 123 includes a boost circuit.

[0183] In some implementations, the operating voltage of chip 12 is lower than the sum of the lower limits of the available voltages of the individual battery cells 11 connected to chip 12, and the power management component 123 includes a step-down circuit. For example, if chip 12 is connected to three battery cells 11, the lower limit of the available voltage of a single battery cell 11 is 2V, and the operating voltage of chip 12 is 5V, then the power management component 123 includes a step-down circuit.

[0184] In some embodiments, if the operating voltage of chip 12 is lower than the sum of the upper limits of the available voltages of each cell 11 connected to chip 12 and higher than the sum of the lower limits of the available voltages of each cell 11 connected to chip 12, then the power management component includes a boost circuit and a buck circuit.

[0185] In some implementations, such as Figure 16 As shown, chip 12 may also integrate communication components 124, etc.

[0186] The communication component 124 can be used to send the status information of the battery cell to other chips or BMU.

[0187] In some implementations, communication component 124 may include an isolation communication component. For example, communication between chips may be isolated using capacitors or transformers. Similarly, communication between chips in different modules may also be isolated using transformers or capacitors.

[0188] For example, the cell status signal (analog signal) corresponding to the cell's voltage, current, and / or temperature status information passes through the protection component and the filtering component, and then enters the information acquisition component 121. The information acquisition component 121 converts the cell status signal (analog signal) into a digital signal corresponding to the status information and then transmits it to the information processing component 122. The information processing component 122 can store the received digital signal corresponding to the status information and transmit it to the BMU through the communication component 124.

[0189] In some embodiments, such as Figure 17 As shown, chip 12 integrates at least one of the following components:

[0190] The protection component 125 is connected between the battery cell 11 and the target component to absorb the interference signal superimposed on the signal entering the target component; the target component includes a power management component 123 integrated in the chip and / or an information acquisition and processing component 120 integrated in the chip.

[0191] The filter component 126 is connected between the battery cell 11 and the information acquisition and processing component 120, and is used to filter the status information of the battery cell entering the information acquisition and processing component 120.

[0192] The equalization component 127 includes an equalization resistor R1 and a corresponding switch component K1 corresponding to at least one battery cell 11 connected to the information acquisition and processing component 120. Each battery cell 11 is connected in series with the corresponding equalization resistor R1 and the corresponding switch component K1. The equalization component 127 is used to equalize the voltage of at least one battery cell connected to the information acquisition and processing component 120.

[0193] Understandably, in related technologies, due to insufficient chip heat dissipation, integrating protection components, filtering components, and equalization components into the chip would lead to excessive heat generation, affecting the chip's reliability and stability. Therefore, protection components, filtering components, and equalization components are typically placed as peripheral devices in the chip's peripheral circuitry. However, in this embodiment, because the chip is thermally connected to the battery cell surface, the chip's heat dissipation is improved, allowing for the integration of more processing components. Therefore, protection components, filtering components, and / or equalization components can be integrated into the chip.

[0194] Signals entering the target component may include, but are not limited to, power signals, cell status signals corresponding to cell status information, etc. These signals may be superimposed with interference signals such as electrostatic discharge (ESD) signals and / or surge signals when they enter the chip. The protection component 125 can be used to absorb the interference signals superimposed on the signals entering the target component, thereby reducing damage to the chip caused by the interference signals. For example, the protection component may include, but is not limited to, at least one of an anti-static circuit, a surge protection circuit, etc.

[0195] In some implementations, the surge protection circuitry within the protection component can be located externally to the chip. This allows for adjustments to the surge protection circuitry model to suit the surge protection requirements of different application scenarios, thereby improving system reliability.

[0196] In some implementations, the cell status signal corresponding to the cell status information acquired by the chip enters the information acquisition and processing component 120 via a sampling line. Noise may be present in the cell status signal entering the information acquisition and processing component 120. This cell status signal may include, but is not limited to, voltage signals, current signals, and / or temperature signals. The filtering component 126 can be used to suppress and filter noise in the voltage, current, and / or temperature signals of the cell entering the information acquisition and processing component 120.

[0197] In some implementations, the filtering components can be located externally to the chip. This allows for easier matching of the circuit structure and / or device model of the filtering components to different application scenarios, and adjustment of the filter cutoff frequency.

[0198] When the voltage difference between the multiple cells 11 connected to the information acquisition and processing component 120 is too large, or when the voltage difference between at least one cell 11 connected to the information acquisition and processing component 120 and cells connected to other chips is too large, the battery management unit 13 can control the equalization component 127 to perform equalization processing on the voltage of at least one cell 11 connected to the information acquisition and processing component 120, so as to reduce or eliminate the voltage difference between the cells 11. For example, the battery management unit 13 can receive the voltage of each cell transmitted by the information acquisition and processing component 120, determine the cell to be equalized based on the voltage of each cell, and control the equalization component in the chip connected to the cell to be equalized to operate.

[0199] In some implementations, the information acquisition and processing component 120 can control the closing of the switch component K1 corresponding to the battery cell 11 to form a circuit consisting of the battery cell 11 and the corresponding equalizing resistor R1. In this way, when the switch component K1 corresponding to the battery cell 11 is closed, the battery cell 11 and the corresponding equalizing resistor R1 form a series circuit. The battery cell's electrical energy can be consumed through the equalizing resistor, causing the battery cell's voltage to drop, thereby reducing or eliminating the voltage difference between the individual battery cells 11.

[0200] In some embodiments, the balancing component 127 may include, but is not limited to, at least one of an active balancing component and a passive balancing component. The active balancing component is used to achieve voltage balance among the cells when the voltage difference between the cells in the battery device is too large. This is done by combining the opening and closing of the switching components of different cells, allowing the higher-voltage cell to charge the lower-voltage cell, or enabling the cell to exchange energy with a balancing capacitor or balancing inductor, thereby achieving voltage balance among the cells. The active balancing component may include, but is not limited to, at least one of a capacitive active balancing circuit and an inductive active balancing circuit. The passive balancing component is used to close the switching component corresponding to the higher-voltage cell when the voltage difference between the cells in the battery device is too large. This causes the cell's voltage to decrease after consuming electrical energy through the balancing resistor, thereby reducing the voltage difference between the cells.

[0201] It should be noted that the specific circuit structure and device model used in the protection component, filtering component, and equalization component can be flexibly selected by those skilled in the art according to the actual situation, and the embodiments of this application do not limit this.

[0202] In the above embodiments, since the chip and the cell surface are thermally connected, the heat dissipation effect of the chip is improved, thereby allowing more processing components to be integrated into the chip. By integrating protection components, filtering components and / or equalization components into the chip, the number of peripheral devices can be reduced while taking into account the chip's heat dissipation requirements, reducing the space occupied by peripheral devices, increasing the energy density of the battery device, and reducing the impact of environmental factors such as moisture on protection components, filtering components and / or equalization components, reducing the aging rate of the corresponding devices, thereby improving the reliability and stability of the battery device.

[0203] In some implementations, the power devices in the equalization assembly can be located outside the chip. These power devices may include, but are not limited to, at least one of equalization resistors, equalization capacitors, and equalization inductors. Since the power devices in the equalization assembly generate significant heat during operation, placing them outside the chip can reduce the chip's own heat generation and improve the accuracy of the cell's status information acquisition.

[0204] In some implementations, the equalization component may include a filtering device to filter out noise across the switching component, reducing the likelihood of the switching component malfunctioning due to noise. The filtering device may include, but is not limited to, a filter capacitor. The filtering device in the equalization component can be located externally to the chip, facilitating adjustment of its filtering capability. For example, different filter capacitors can be matched to different equalization resistors to adjust the filter cutoff frequency.

[0205] This application provides an embodiment of an electrical device, such as... Figure 18 As shown, the electrical device 200 includes the battery device 10 described in the above embodiments.

[0206] Here, electrical equipment can be any electrical equipment, including but not limited to automobiles, airplanes, electric bicycles, electric motorcycles, electric boats, and / or ships.

[0207] It should be noted that the descriptions of the various embodiments above tend to emphasize the differences between them, while their similarities or commonalities can be referred to interchangeably. The descriptions of the electrical equipment embodiments above are similar to those of the battery device embodiments above, and have similar beneficial effects. For technical details not disclosed in the electrical equipment embodiments of this application, please refer to the descriptions of the battery device embodiments of this application for understanding.

[0208] It should be understood that in the description of this application, the reference to terms such as "in one embodiment," "in some embodiments," "in other embodiments," "yet another embodiment," "in some implementations," "in other implementations," or "exemplary," etc., refers to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the embodiments of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine the different embodiments or examples described in this application, as well as the features of the different embodiments or examples.

[0209] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0210] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and devices can be implemented in other ways. The apparatus and device embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods, such as: multiple units or components may be combined, or integrated into another system, or some features may be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the various components shown or discussed may be through some interfaces, and the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0211] The above are merely exemplary embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application are included within the protection scope of this application.

Claims

1. A battery device, characterized in that, include: Multiple battery cells; At least one chip, each of the chips being connected to at least one of the battery cells, the chips being used to collect and process the status information of the connected battery cells; A data transmission component, electrically connected to the chip, is used to transmit the collected status information of the battery cell; In this configuration, the first heating surface of each chip near the surface of the battery cell is thermally connected to the surface of at least one connected battery cell to conduct heat transfer to the surface of the at least one connected battery cell.

2. The battery device according to claim 1, characterized in that, The data transmission component includes: Sampling lines; A circuit board for carrying the chip and the sampling line, so that the chip is connected to at least one of the battery cells through the sampling line.

3. The battery device according to claim 2, characterized in that, The chip has a second heating surface away from the surface of the battery cell, and the second heating surface of the chip is thermally connected to the circuit board to transfer heat to the circuit board.

4. The battery device according to claim 2 or 3, characterized in that, The circuit board includes one of the following: a flexible circuit board with single-layer traces, a flexible DC cable with single-layer traces, or a printed circuit board with multi-layer traces.

5. The battery device according to any one of claims 2 to 4, characterized in that, The circuit board has at least one opening containing a thermally conductive medium, through which the chip transfers heat to the surface of the battery cell.

6. The battery device according to any one of claims 1 to 5, characterized in that, The first heating surface is the surface with the largest area among the multiple surfaces of the chip.

7. The battery device according to any one of claims 1 to 6, characterized in that, The first heating surface is the surface with the highest operating temperature among the multiple surfaces of the chip.

8. The battery device according to any one of claims 1 to 7, characterized in that, The battery cell includes a prismatic battery cell, and the surface of the battery cell on which the first heating surface is thermally connected includes the end face of the prismatic battery cell where the electrodes are disposed.

9. The battery device according to any one of claims 1 to 8, characterized in that, The battery cell includes a cylindrical battery cell, and the surface of the battery cell that is thermally connected to the first heating surface includes the end face of the cylindrical battery cell where the negative electrode is disposed.

10. The battery device according to any one of claims 1 to 9, characterized in that, The battery cell includes a blade battery cell, a positive electrode is provided on the first end face of the blade battery cell, and the battery cell surface thermally connected to the first heating surface includes the second end face of the blade battery cell, the second end face being opposite to the first end face.

11. The battery device according to any one of claims 1 to 10, characterized in that, The battery device includes at least one row of multiple battery cells arranged along a first direction, and at least two chips arranged along the first direction, each chip being connected to multiple battery cells.

12. The battery device according to any one of claims 1 to 11, characterized in that, The chip integrates at least one of the following: A protective component, connected between the battery cell and the target component, is used to absorb interference signals superimposed on the signals entering the target component; the target component includes a power management component integrated in the chip and / or an information acquisition and processing component integrated in the chip; A filtering component, connected between the battery cell and the information acquisition and processing component, is used to filter the status information of the battery cell entering the information acquisition and processing component; The equalization component includes equalization resistors and corresponding switching components for at least one battery cell connected to the information acquisition and processing component. Each battery cell is connected in series with its corresponding equalization resistor and its corresponding switching component. The equalization component is used to equalize the voltage of at least one battery cell connected to the information acquisition and processing component.

13. An electrical appliance, characterized in that, The electrical equipment includes the battery device according to any one of claims 1 to 12.

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