A top-surface heat-dissipation microwave light emitting component for on-board

Abstract

The utility model relates to a light emitting assembly, concretely relates to a top surface heat dissipation microwave light emitting assembly for on-board, including the pipe shell, the wall body of pipe shell bottom is nested and is used for the interboard connector of PCB board connection with external device, is provided with the control panel connected with the interboard connector in the pipe shell, is provided with the laser on the control panel, and the heat dissipation surface of laser faces the side away from the bottom of pipe shell, and the top of pipe shell is provided with the heat dissipation cover plate heat conduction connection with laser. The emitting assembly can be attached to the PCB board or other radio frequency medium board, and the bottom surface does not need to be heat-conducting, and the internal space utilization of user end equipment has been improved. The utility model innovates the heat dissipation form of microwave light emitting assembly, breaks through the limitation that the traditional emitting assembly can only rely on the bottom heat dissipation, and the heat is dissipated from the top of emitting assembly, and more extensive installation application scene can be provided.

Description

Technical Field

[0001] This utility model relates to a light emitting component, specifically a top-surface heat dissipation microwave light emitting component for onboard use. Background Technology

[0002] Microwave optical transmission systems offer advantages such as high operating frequency, wide bandwidth, transparent transmission, simple architecture, high reliability, and strong anti-interference capabilities, making them widely used in defense applications, including electronic warfare, radar communication, and remote sensing. The microwave optical transmitter, as a core component in the microwave optical link, modulates the input signal onto an optical carrier for transmission. To improve transmission efficiency, multiple wavelengths are typically multiplexed onto a single optical fiber. Therefore, microwave optical transmitters have stringent requirements for wavelength control. Wavelength control is generally achieved by adding a TEC (Transducer Array) inside the packaged component. The chip inside the laser is mounted on top of the TEC. By consuming electrical energy, a temperature difference is created across the TEC, ultimately ensuring a constant temperature for the chip on top of the TEC under high and low temperature conditions, thus achieving wavelength control. However, this structure has certain limitations in some specific applications.

[0003] Currently, the TEC (Transducer Electrode) inside microwave optical emitting components is typically mounted on the bottom inner wall of the encapsulation shell. This allows heat generated at the bottom of the TEC to be quickly transferred to the bottom of the encapsulation shell, which is then bonded to the metal casing of the user-end equipment. This requires direct contact between the bottom of the encapsulation shell and the metal casing of the user-end equipment. This application method has the following main disadvantages:

[0004] 1) Difficulty in PCB layout inside user-end equipment: When arranging the microwave light emitting component array, it needs to be fitted to the metal housing of the equipment, which can easily divide the PCB control board inside the user system, resulting in difficulty in PCB layout and low utilization rate; if the microwave light emitting component can conduct heat from the top surface, it can be directly installed on the PCB board without worrying about the PCB board's low thermal conductivity causing poor heat dissipation.

[0005] 2) Space occupied by radio frequency transmission: Due to the bottom heat conduction structure of the microwave optical transmitter, the radio frequency modulation signal cannot be transmitted to the inside of the microwave optical transmitter through the bottom PCB board and the board-to-board connector (contacts such as button and spring pin). Instead, the radio frequency coaxial cable is used, which occupies a lot of wiring space.

[0006] 3) Low air cooling efficiency: The installation environment of microwave optical emission components is generally equipped with an air cooling system. When the bottom of the product dissipates heat, the cold air is not easy to reach it, and the heat dissipation efficiency of convection heat transfer is low. Utility Model Content

[0007] To solve the above-mentioned technical problems, this utility model provides a top-surface heat dissipation microwave light emitting component for onboard applications.

[0008] The purpose of this utility model is achieved by the following technical solution. According to this utility model, a top-surface heat dissipation microwave light emitting assembly for onboard use includes a housing. An inter-board connector for connecting to an external device PCB is nested in the bottom wall of the housing. A control board connected to the inter-board connector is disposed inside the housing. A laser is disposed on the control board, with the heat dissipation surface of the laser facing away from the bottom of the housing. A heat dissipation cover plate thermally connected to the laser is disposed on the top of the housing.

[0009] Furthermore, the heat dissipation surface of the laser is fitted with an interface heat-conducting sheet, and the inner wall of the heat dissipation cover plate is provided with a groove that matches and contacts the interface heat-conducting sheet.

[0010] Furthermore, the interface heat-conducting sheet is in the shape of an arc, and the groove on the inner wall of the heat dissipation cover is an arc-shaped groove.

[0011] Furthermore, the outer surface of the heat dissipation cover is distributed with heat dissipation teeth.

[0012] Furthermore, the laser is a TO-packaged coaxial laser.

[0013] Furthermore, the laser integrates a semiconductor cooler.

[0014] Furthermore, the inter-board connector is a button connector or an LGA connector.

[0015] Furthermore, the laser has pins at its tail end. One end of the pin is connected to the chip inside the laser, and the other end extends out of the tail end of the laser and is bent in the direction away from the heat dissipation surface of the laser. The other end of the pin faces the control board and is connected to the control board.

[0016] Compared with the prior art, the advantages of this utility model are:

[0017] 1) This transmitter assembly can be mounted on a PCB board or other RF media board without the need for bottom heat conduction, thus improving the internal space utilization of the user terminal equipment. After the bottom of the transmitter assembly is directly mounted on the PCB board, it can use inter-board connectors to transmit electrical and RF signals, replacing the traditional coaxial cable signal interconnection method. This can significantly optimize the extra space introduced by the bending of the coaxial cable, and facilitate the integration and modular design of the system.

[0018] 2) The bottom of the transmitter assembly integrates an inter-board connector for the transmission of radio frequency signals, avoiding coaxial cable adapters, saving a lot of bending space, and resulting in a shorter signal transmission path and lower loss.

[0019] 3) This utility model innovates the heat dissipation method of microwave optical emitting components, breaking through the limitation of traditional emitting components that can only rely on the bottom for heat dissipation. It dissipates heat from the top of the emitting component, providing a wider range of installation and application scenarios. The top surface of the emitting component serves as a heat dissipation surface, which is more conducive to additional heat dissipation design on the top of the emitting component (such as setting heat dissipation fins or adding a cold plate), making the heat dissipation method more flexible.

[0020] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0021] Figure 1 This is a three-dimensional schematic diagram of an embodiment of a top-surface heat dissipation microwave light emitting component for onboard use according to the present invention;

[0022] Figure 2 for Figure 1 A three-dimensional diagram showing a partial cross-section;

[0023] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0024] Figure 4 for Figure 1 A schematic diagram of its breakdown.

[0025] Figure label:

[0026] 1-Inter-board connector;

[0027] 2-Tube shell;

[0028] 201 - Laser insertion hole

[0029] 3-Laser;

[0030] 301-TEC

[0031] 302-pin,

[0032] 4-Control panel;

[0033] 5-Interface thermal conductive sheet;

[0034] 6-Heat dissipation cover,

[0035] 601 - Heat dissipation teeth. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0038] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0039] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0040] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0041] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0042] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0043] The following detailed description, in conjunction with embodiments, further illustrates the features and performance of a top-surface heat-dissipating microwave optical emitting assembly suitable for onboard use.

[0044] This utility model provides an embodiment of a top-surface heat dissipation microwave optical emitting component for onboard applications, such as... Figures 1 to 4 As shown, hereinafter referred to as the transmitting assembly. This transmitting assembly can be mounted on the PCB board surface of the user terminal equipment. Through improved internal structure and heat dissipation, the transmitting assembly can ensure efficient heat transfer to the top surface of the transmitting assembly. This transmitting assembly is suitable for mounting on the PCB board, especially when there is a signal input. It can directly transmit the RF signal from the PCB board to the inside of the transmitting assembly through the board-to-board connector 1, shortening the signal transmission path and saving the space occupied by wiring.

[0045] The emitting assembly includes a housing 2, a control board 4, a TO-packaged laser 3, a heat sink 6, an inter-board connector 1, and an interface heat-conducting sheet 5. In this embodiment, the laser 3 can be a coaxial laser.

[0046] An inter-board connector 1 is nested within the bottom wall of the housing 2. One end of the inter-board connector 1 connects to the control board 4 inside the housing 2, and the other end can be used to connect to an external PCB board. This transmitting assembly can be mounted on the PCB board of the user terminal equipment, and the inter-board connector 1 transmits signals from the lower PCB board into the transmitting assembly.

[0047] The housing 2 and heat sink 6 of the launch assembly are made of materials with good heat dissipation performance, including but not limited to aluminum alloy, copper, etc.

[0048] In this embodiment, the board connector 1 can be a button connector, an LGA connector, or the like.

[0049] The side wall of the tube shell 2 is provided with a laser insertion hole 201. The tail of the laser 3 is set inside the tube shell 2, and its head extends out of the laser insertion hole 201 to output the light signal emitted by the laser 3 to the tube shell 2.

[0050] The laser 3 integrates a TEC (semiconductor cooler) 301. The heat source inside the laser 3 (such as the chip inside the laser 3) is integrated with the TEC. When the laser 3 is installed inside the housing 2, the heat source inside the laser 3 is concentrated upwards (i.e., on the side away from the bottom of the housing 2). The side of the laser 3 away from the bottom of the housing is the heat dissipation surface.

[0051] The laser 3 has a pin 302 at its tail. One end of the pin 302 is connected to the chip inside the laser 3, and the other end extends out of the tail of the laser and is bent in the direction away from the heat dissipation surface of the laser 3.

[0052] A control board 4 is installed on the bottom inner wall of the casing 2. Before installing the laser 3 inside the casing 2, the pin 302 should face the control board 4 and be connected to the control board 4 to achieve the connection between the laser 3 and the control board 4. The heat dissipation surface of the laser 3 should face upwards. Then, the control board 4 and the laser 3 are installed inside the casing 2. The pin 302 and the control board 4 are connected by direct soldering.

[0053] A heat dissipation cover plate 6 is provided on the upper part of the tube shell 2 to enclose the tube shell 2. Multiple heat dissipation teeth 601 are distributed on the outer surface of the heat dissipation cover plate 6 to increase the heat dissipation area of ​​the heat dissipation cover plate 6.

[0054] The interface between the laser 3 and the heat dissipation cover 6 is filled with an interface heat-conducting sheet 5 made of a high thermal conductivity material, which can efficiently conduct the heat of the emitting component to the top of the emitting component, dissipate heat through the heat dissipation cover 6, and dissipate heat through the internal air cooling of the device.

[0055] The interface heat-conducting sheet 5 matches the outer contour of the heat dissipation surface of the laser 3 and is in the shape of an arc plate. The inner wall of the heat dissipation cover plate 6 is provided with an arc-shaped groove that can fully contact the interface heat dissipation sheet 5, thereby increasing the heat dissipation area of ​​the interface heat-conducting sheet 5.

[0056] The materials of the interface heat-conducting sheet 5 include, but are not limited to, Ion, SnPb, thermal pads, etc.

[0057] After the internal assembly of the launch component is completed, the heat dissipation cover 6 is assembled with the tube shell 2. The heat dissipation cover 6 can be installed by means of laser welding, screw fixing or other methods.

[0058] The advantages of this utility model are summarized as follows:

[0059] 1) This transmitter assembly can be mounted on a PCB board or other RF media board without the need for bottom heat conduction, thus improving the internal space utilization of the user terminal equipment. After the bottom of the transmitter assembly is directly mounted on the PCB board, it can use the board-to-board connector 1 to transmit electrical and RF signals, replacing the traditional coaxial cable signal interconnection method. This can significantly optimize the extra space introduced by the bending of the coaxial cable, and facilitate the integration and modular design of the system.

[0060] 2) The bottom of the transmitting component integrates an inter-board connector 1 for the transmission of radio frequency signals, avoiding coaxial cable conversion, saving a lot of bending space, and the signal transmission path is shorter and the loss is lower.

[0061] 3) This utility model innovates the heat dissipation method of microwave optical emitting components, breaking through the limitation of traditional emitting components that can only rely on the bottom for heat dissipation. It dissipates heat from the top of the emitting component, providing a wider range of installation and application scenarios. The top surface of the emitting component serves as a heat dissipation surface, which is more conducive to additional heat dissipation design on the top of the emitting component (such as setting heat dissipation fins or adding a cold plate), making the heat dissipation method more flexible.

[0062] The installation process for this launch component is as follows:

[0063] Step 1: The shell 2 is milled from a material with good thermal conductivity such as aluminum alloy or copper alloy. A groove is reserved at the bottom of the shell for mounting the inter-board connector 1. The wall thickness at the bottom of the shell 2 can be determined according to the thickness of the inter-board connector 1. Then, the inter-board connector 1 is installed into the groove.

[0064] Step 2: The pins 302 of the laser 3 are pre-formed before assembly to ensure that the heat dissipation surface of the laser 3 faces upward after the pins 302 of the laser 3 are assembled on the control board 4. After the laser 3 is connected to the control board 4, the control board 4 together with the laser 3 is assembled inside the housing 2. The control board 4 is fixed with screws. The bottom surface of the control board 4 is aligned with the pads of the inter-board connector 1 to ensure that the signal can be transmitted to the internal control board 4 through the inter-board connector 1.

[0065] Step 3: Cover the upper part of the circular metal shell of the laser 3 with an interface heat-conducting sheet 5. The interface heat-conducting sheet 5 is pre-formed into an arc shape to maximize the contact area of ​​the interface heat-conducting sheet 5. At the same time, the interface heat-conducting sheet 5 needs to have a certain degree of plasticity so that it can produce slight plastic deformation after being subjected to the pressure of the heat dissipation cover plate 6 to ensure that the interface filling is uniform and reliable. The interface heat-conducting sheet 5 is recommended, but not limited to, materials such as INPb sheets, SnPb sheets, and thermal pads.

[0066] Step 4: After the internal assembly of the emission component is completed, install the heat dissipation cover plate 6. During the processing, the lower part of the heat dissipation cover plate 6 retains a groove that matches the laser 3. The groove contacts the interface heat conduction sheet 5, ultimately ensuring that after the heat dissipation cover plate 6 is assembled, the heat dissipation surface of the laser 3 and the bottom groove of the heat dissipation cover plate 6 are tightly fitted through the interface heat dissipation sheet 5 to achieve thermal connection.

[0067] Step 5: The heat dissipation cover 6 and the tube shell 2 are welded by laser sealing or fixed with screws. The upper part of the heat dissipation cover 6 can be reserved with heat dissipation teeth 601 during processing. If there is a cold plate inside the application environment, the cold plate can be directly attached to the upper part of the heat dissipation cover to increase the heat dissipation capacity of the emitting component.

[0068] In other embodiments, based on the above embodiments, a heat dissipation plate in the form of a cold plate or the like can be provided on the outer side of the heat dissipation teeth 601 on the heat dissipation cover 6 to quickly conduct away the heat.

[0069] In other embodiments, based on the above embodiments, the heat dissipation cover 6 can be directly set as a cold plate, and the interface heat sink 5 can be omitted, so that the heat dissipation surface of the laser 6 is directly connected to the cold plate in a thermally conductive contact.

[0070] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A top-surface heat dissipation microwave light emitting assembly for onboard use, comprising a housing (2), characterized in that: The bottom wall of the tube shell (2) is nested with an inter-board connector (1) for connecting with the PCB board of an external device. A control board (4) connected to the inter-board connector (1) is provided inside the tube shell (2). A laser (3) is provided on the control board (4). The heat dissipation surface of the laser (3) faces away from the bottom of the tube shell (2). A heat dissipation cover plate (6) that is thermally connected to the laser (3) is provided on the top of the tube shell (2).

2. The microwave light emitting assembly for onboard top surface heat dissipation according to claim 1, characterized in that: The heat dissipation surface of the laser (3) is fitted with an interface heat-conducting sheet (5), and the inner wall of the heat dissipation cover plate (6) is provided with a groove that matches and contacts the interface heat-conducting sheet (5).

3. A top-surface heat dissipation microwave light emitting assembly for onboard use according to claim 2, characterized in that: The interface heat-conducting sheet (5) is in the shape of an arc sheet, and the groove on the inner wall of the heat dissipation cover is an arc groove.

4. A top-surface heat dissipation microwave light emitting assembly for onboard use according to claim 1, characterized in that: The outer surface of the heat dissipation cover (6) is distributed with heat dissipation teeth (601).

5. A top-surface heat dissipation microwave light emitting assembly for onboard use according to claim 1, characterized in that: The laser (3) is a TO-packaged coaxial laser.

6. A top-surface heat dissipation microwave light emitting assembly for onboard use according to claim 1, characterized in that: The laser (3) has an internally integrated semiconductor cooler.

7. A top-surface heat dissipation microwave optical emitting assembly for onboard use according to claim 1, characterized in that: The board connector (1) is a button connector or an LGA connector.

8. A top-surface heat dissipation microwave optical emitting assembly for onboard use according to claim 1, characterized in that: The laser (3) has a pin (302) at its tail. One end of the pin (302) is connected to the chip inside the laser (3), and the other end extends out of the tail of the laser and is bent in the direction away from the heat dissipation surface of the laser (3). The other end of the pin (302) faces the control board (4) and is connected to the control board (4).

Images