A dual-mode energy-saving LED light source device

Abstract

The utility model relates to an energy -conserving LED light source device of bimodality, specifically, the sealing body containing noctilucent powder is made by mixing noctilucent powder, fluorescent powder and LED encapsulation glue according to certain proportion, at least one LED light source chip is arranged on the metal electrode of LED support, the positive and negative electrodes of LED light source chip are respectively arranged on the metal electrode of LED support through conductive glue or bonding wire, a layer of sealing body containing noctilucent powder is covered around LED light source chip, and the energy -conserving LED light source device of bimodality is made after baking and solidification of sealing body, and the state of LED light source device electrification and light emission is power consumption state, and the state of LED light source device power failure and noctilucent powder light release is energy -conserving state.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging, specifically to a dual-mode energy-saving LED light source device. Background Technology

[0002] LED beads have advantages such as high brightness, low energy consumption, and long lifespan. They respond quickly when powered on and also respond quickly when powered off, immediately stopping the light emission. Therefore, LED beads can only emit light when powered on, and they will continuously consume power at the same time.

[0003] LED lights normally provide illumination when powered on. However, in the event of a sudden power outage, without emergency lights, it is difficult to determine direction. Emergency lights are mainly installed in public facilities and are not widely used in daily life in every household.

[0004] To address this problem, this invention employs the following method to fabricate a dual-mode energy-saving LED light source device, thus overcoming this technical challenge, as detailed below:

[0005] A sealing colloid containing luminescent powder is prepared by mixing luminescent powder, phosphor, and LED encapsulating adhesive in a certain proportion, or by mixing luminescent powder and LED encapsulating adhesive in a certain proportion. At least one LED light source chip is placed on the metal electrode of the LED bracket. The positive and negative electrodes of the LED light source chip are respectively set on the metal electrode of the LED bracket through conductive adhesive or bonding wire. A layer of sealing colloid containing luminescent powder is covered around the LED light source chip. The sealing colloid containing luminescent powder naturally covers the area around the LED light source chip. After baking to cure the sealing colloid, a dual-mode energy-saving LED light source device is formed. The state in which the LED light source device emits light when powered on is the power-consuming state, and the state in which the LED light source device emits light when powered off is the energy-saving state.

[0006] Alternatively, a sealing colloid A can be prepared by mixing phosphor with LED encapsulating adhesive, or a sealing colloid A can be prepared by mixing phosphor with LED encapsulating adhesive and phosphor-containing sealing colloid B. At least one LED light source chip is placed on the metal electrode of the LED bracket. The positive and negative electrodes of the LED light source chip are respectively placed on the metal electrode of the LED bracket through conductive adhesive or bonding wire. A layer of sealing colloid A is covered around the LED light source chip. After the surface of sealing colloid A dries, sealing colloid B is covered on the outer surface of sealing colloid A. After baking to cure sealing colloid A and sealing colloid B, a dual-mode energy-saving LED light source device is formed. The state in which the LED light source device emits light when powered on is the power-consuming state, and the state in which the phosphor emits light when the LED light source device is powered off is the energy-saving state. Sealing colloid A is placed between sealing colloid B and the LED light source chip to reduce the impact of the high temperature generated during the LED light source chip's light emission process on the performance of the phosphor.

[0007] A dual-mode energy-saving LED light source device manufactured using the above two methods, coupled with a customized control power supply, allows different chips of the LED light source device to emit monochromatic or multi-color light when powered on. Different colors or different color temperatures of light are emitted through LED encapsulant or encapsulant containing phosphor. When powered off, the phosphor releases the stored light. The customized control power supply controls the LED light source device to continuously emit light in both powered-on and powered-off states. The duty cycle during the power-off period is the energy saved by the LED light source device.

[0008] If an LED light source device is suddenly powered off after operating normally for a period of time, it will continue to emit light for more than 40 minutes. In the event of a sudden power outage, the LED light source device can serve as a clear identification marker. Summary of the Invention

[0009] According to this utility model, a dual-mode energy-saving LED light source device is also provided, comprising: a sealing colloid; an LED bracket; an LED light source chip; and conductive adhesive or bonding wire; characterized in that the sealing colloid is a sealing colloid containing luminescent powder prepared by mixing luminescent powder, phosphor, and LED encapsulating adhesive in a certain proportion, or a sealing colloid containing luminescent powder prepared by mixing luminescent powder and LED encapsulating adhesive in a certain proportion; the LED bracket is composed of a material comprising at least two metal electrodes and a fixed metal electrode; the LED light source chip is disposed on the LED bracket; one end of the conductive adhesive or bonding wire is disposed on the positive or negative electrode of the LED light source chip, and the other end is disposed on the metal electrode of the LED bracket; and the sealing colloid is disposed around the LED light source chip.

[0010] According to this utility model, a dual-mode energy-saving LED light source device is also provided, comprising: a sealing colloid A; a sealing colloid B; an LED bracket; an LED light source chip; and conductive adhesive or bonding wire. The sealing colloid A is an LED encapsulating adhesive, or a mixture of LED encapsulating adhesive and phosphor; the sealing colloid B is a uniform mixture of phosphorescent powder and LED encapsulating adhesive; the LED bracket is composed of a material containing at least two metal electrodes and a fixed metal electrode; the LED light source chip is disposed on the metal electrode of the LED bracket; one end of the conductive adhesive or bonding wire is disposed on the positive or negative electrode of the LED light source chip, and the other end is disposed on the metal electrode of the LED bracket; the sealing colloid A is disposed around the LED light source chip; and the sealing colloid B is disposed around the sealing colloid A.

[0011] According to a preferred embodiment of the present invention, the dual-mode energy-saving LED light source device is characterized in that the dual-mode refers to the LED light source device emitting monochromatic or polychromatic light when powered on, and releasing light through the encapsulating adhesive containing phosphorescent powder in the LED light source device when powered off. The dual-mode refers to the continuous light emission that can cycle between the two states of power-on and power-off.

[0012] According to a preferred embodiment of the present invention, the dual-mode energy-saving LED light source device is characterized in that the energy saving is that the power outage time of the control power supply of the dual-mode LED light source device accounts for a% of the total time, during which the LED light source device emits light but does not consume electrical energy.

[0013] According to a preferred embodiment of the present invention, the dual-mode energy-saving LED light source device is characterized in that the luminescent powder is a phosphorescent material aluminate system SrAl2O4:Eu 2+ ,Dy 3+ CaAl2O4:Eu ²+ ,Nd ³+ Or, the sulfur oxide system Y2O2S:Eu 3+ Or a silicate system Sr2MgSi2O7:Eu 2+ ,Dy 3+ It consists of one or more systems.

[0014] According to a preferred embodiment of the present invention, the dual-mode energy-saving LED light source device is characterized in that the bonding wire is one of gold wire, alloy wire, or copper-palladium wire.

[0015] According to a preferred embodiment of the present invention, the dual-mode energy-saving LED light source device is characterized in that the LED encapsulating adhesive is a transparent or semi-transparent colloid made of one or more of epoxy resin, silicone, polyurethane, or organic adhesives.

[0016] According to a preferred embodiment of the present invention, the dual-mode energy-saving LED light source device is characterized in that the LED light source chip is a conventional structure chip, a vertical structure chip, or a flip-chip structure chip.

[0017] According to a preferred embodiment of the present invention, the dual-mode energy-saving LED light source device is characterized in that the material on which the LED light source chip is disposed on the metal electrode is conductive adhesive or insulating adhesive.

[0018] According to a preferred embodiment of the present invention, the dual-mode energy-saving LED light source device is characterized in that the material of the fixed metal electrode is one or more of ceramic, aluminum, insulating colloid, and insulating plastic.

[0019] According to a preferred embodiment of the present invention, the dual-mode energy-saving LED light source device is characterized in that the LED support is composed of a ceramic substrate or an aluminum substrate and an insulating colloid, and the ceramic substrate or aluminum substrate contains at least two metal electrodes.

[0020] Details of one or more embodiments of the present invention will be set forth in the following description of the accompanying drawings and specific embodiments. Attached Figure Description

[0021] The features, objectives, and advantages of this invention will become more apparent from reading this specification in conjunction with the following accompanying drawings, which are briefly described below.

[0022] Figure 1 This is a three-dimensional schematic diagram of an LED bracket.

[0023] Figure 2 A cross-sectional schematic diagram of a dual-mode energy-saving LED light source device made of a chip with a conventional structure.

[0024] Figure 3 A cross-sectional schematic diagram of a dual-mode energy-saving LED light source device made of a vertically structured chip.

[0025] Figure 4 A cross-sectional schematic diagram of a dual-mode energy-saving LED light source device made from a flip-chip structure.

[0026] Figure 5 A cross-sectional schematic diagram of a dual-mode energy-saving LED light source device made of a chip with a conventional structure.

[0027] Figure 6 This is a three-dimensional schematic diagram of an LED bracket.

[0028] Figure 7 A cross-sectional schematic diagram of a dual-mode energy-saving LED light source device made from a chip with a conventional structure.

[0029] Figure label:

[0030] 1. LED bracket; 1.1 Metal electrodes; 1.1a. Positive metal electrode; 1.1b. Negative metal electrode; 1.1c. Metal electrode for bonding chips; 1.2 Material for fixing metal electrodes; 1.2a. Ceramic substrate; 1.2b. Insulating colloid damming adhesive;

[0031] 2a. Chip with upright structure; 2b. Chip with vertical structure; 2c. Chip with flip structure; 2.1a. Insulating adhesive; 2.1b. Conductive adhesive; 2.2. Gold wire;

[0032] 3. Encapsulating adhesive containing phosphorescent powder; 3A. Encapsulating adhesive without phosphorescent powder; 3B. Encapsulating adhesive containing phosphorescent powder but without fluorescent powder; Detailed Implementation

[0033] The present invention will now be described in detail using preferred embodiments as examples.

[0034] However, those skilled in the art should understand that the following description is merely illustrative and describes some preferred embodiments, and does not impose any limitations on the claims of this utility model.

[0035] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0036] Examples of embodiments of this utility model Figure 1 and Figure 2 The image shows a dual-mode energy-saving LED light source device made of a front-mounted chip, comprising: an LED bracket 1, a front-mounted blue LED chip 2a, an insulating adhesive 2.1a, a gold wire 2.2, and an encapsulating adhesive 3 containing phosphorescent powder. The LED bracket 1 is composed of a metal electrode 1.1 and an insulating material PPA 1.2. The encapsulating adhesive 3 containing phosphorescent powder is made of 20% by weight of SrAl2O4:Eu 2+ ,Dy 3+ The blue LED chip 2a with a positive structure is uniformly mixed with 80% by weight of transparent epoxy resin encapsulant. The chip is bonded to the metal electrode 1.1 with insulating adhesive 2.1a. The positive and negative electrodes of the blue LED chip 2a with a positive structure are respectively soldered to two different metal electrodes 1.1 with gold wire. Then, a layer of encapsulant 3 containing phosphorescent powder is covered on the chip. After standing for 20 minutes to allow the air bubbles in the encapsulant 3 to rise, it is baked at 60~100℃ for 2 hours to cure the encapsulant 3. This produces a dual-mode energy-saving LED light source device with a positive structure chip. When the power is on, the LED light source device emits blue light (power-consuming state), and the phosphorescent powder stores light energy. When the power is off, the LED light source device emits green light (power-saving state). When the power is continuously on for 2 seconds and off for 1 second, the LED light source device emits blue light for 2 seconds and green light for 1 second. Compared with conventional LED devices, it saves 33% of power and provides an additional light-emitting effect with one chip.

[0037] Examples of embodiments of this utility model Figure 1 and Figure 3 The image shows a dual-mode energy-saving LED light source device made of a vertically structured chip, comprising: an LED bracket 1, a vertically structured blue light chip 2b, conductive adhesive 2.1b, gold wire 2.2, and an encapsulating adhesive 3 containing phosphorescent powder. The LED bracket 1 is composed of a metal electrode 1.1 and an insulating material PPA 1.2. The encapsulating adhesive 3 containing phosphorescent powder is made of 20% by weight of SrAl2O4:Eu 2+ ,Dy 3+ The blue LED chip 2b with a vertical structure is uniformly mixed with 80% by weight of transparent epoxy resin encapsulant. The negative electrode at the bottom of the chip is bonded to the metal electrode 1.1 with conductive adhesive 2.1b. The positive electrode at the top of the chip is soldered to another metal electrode 1.1 with gold wire. Then, a layer of encapsulant 3 containing phosphorescent powder is covered on the chip. After standing for 20 minutes to allow the air bubbles in the encapsulant 3 to rise, the chip is baked at 60~100℃ for 2 hours to cure the encapsulant 3, thus producing a dual-mode energy-saving LED light source device with a vertical structure chip.

[0038] Examples of embodiments of this utility model Figure 1 and Figure 4 The image shows a dual-mode energy-saving LED light source device fabricated using a flip-chip structure, comprising: an LED support 1, a flip-chip blue LED 2c, conductive adhesive 2.1b, and an encapsulating adhesive 3 containing phosphorescent powder. The LED support 1 is composed of a metal electrode 1.1 and an insulating material PPA 1.2. The encapsulating adhesive 3 containing phosphorescent powder is made of 20% by weight of SrAl2O4:Eu 2+ ,Dy 3+ The flip-chip blue LED chip 2c is made by uniformly mixing 80% by weight of transparent epoxy resin encapsulant. The positive and negative electrodes at the bottom of the chip are bonded to the unconnected metal electrodes 1.1 with conductive adhesive 2.1b. Then, a layer of encapsulant 3 containing phosphorescent powder is covered on the chip. After standing for 20 minutes to allow the air bubbles in the encapsulant 3 to rise, it is baked at 60~100℃ for 2 hours to cure the encapsulant 3, thus making a dual-mode energy-saving LED light source device with a flip-chip structure.

[0039] Examples of embodiments of this utility model Figure 1 and Figure 5The image shows a dual-mode energy-saving LED light source device made of a front-mounted chip, comprising: an LED bracket 1, a front-mounted blue LED chip 2a, an insulating adhesive 2.1a, a gold wire 2.2, an encapsulating adhesive 3A containing phosphor, and an encapsulating adhesive 3B containing phosphor. The LED bracket 1 is composed of a metal electrode 1.1 and an insulating material PPA 1.2. The phosphor-containing encapsulating adhesive 3A is prepared by uniformly mixing 11% by weight of YAG phosphor and 89% by weight of epoxy resin encapsulating adhesive. The phosphor-containing encapsulating adhesive 3B is prepared by uniformly mixing 20% ​​by weight of SrAl2O4:Eu 2+ ,Dy 3+ The blue LED chip 2a with a positive structure is uniformly mixed with 80% by weight of transparent epoxy resin encapsulant. The chip is bonded to the metal electrode 1.1 with insulating adhesive 2.1a. The positive and negative electrodes of the blue LED chip 2a with a positive structure are respectively soldered to two unconnected metal electrodes 1.1 with gold wire 2.2. Then, a layer of encapsulant 3A containing phosphor is covered on the chip. After standing for 10 minutes to allow the surface of encapsulant 3A to dry, a layer of encapsulant 3B containing phosphor is superimposed on it. After standing for 20 minutes to allow the air bubbles in the encapsulant to float, it is baked at 60~100℃ for 2 hours to cure encapsulants 3A and 3B, thus making a dual-mode energy-saving LED light source device with a positive structure chip.

[0040] Examples of embodiments of this utility model Figure 6 and Figure 7 As shown, a dual-mode energy-saving LED light source device made of a conventionally mounted chip is described, comprising: an LED bracket, a conventionally mounted blue light chip 2a, an insulating adhesive 2.1a, a gold wire 2.2, and an encapsulating adhesive 3 containing phosphorescent powder. The LED support consists of a ceramic substrate 1.2a, a positive metal electrode 1.1a, a negative metal electrode 1.1b, a metal electrode 1.1c for bonding chips, and an insulating damming adhesive 1.2b. Six upright blue LED chips 2a are bonded to the metal electrodes 1.1c using insulating adhesive 2.1a. Then, the positive and negative electrodes of the upright blue LED chips 2a are connected in series using gold wires 2.2. The first and last electrodes of the series-connected chips are connected to the positive metal electrode 1.1a and the negative metal electrode 1.1b, respectively. Then, encapsulating adhesive 3 containing phosphorescent powder is applied to the chips. After standing for 20 minutes to allow air bubbles in the encapsulating adhesive to rise, the chips are baked at 60~100℃ for 2 hours. After the encapsulating adhesive 3 is cured, a dual-mode energy-saving LED light source device made of upright structure chips is formed.

[0041] In the above embodiments, the color of the light emitted after being powered on is determined by the material of the chip itself. By adding a certain proportion of phosphor to the encapsulating adhesive containing phosphor as needed, the light emitted by the chip after being powered on can be converted into white light.

[0042] The present invention has been described in detail above with reference to the accompanying drawings, illustrating a specific embodiment of a dual-mode energy-saving LED light source device. However, those skilled in the art should understand that the above description is merely illustrative and describes some specific embodiments, particularly the scope of the claims, and is not intended to limit the scope of the invention. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A dual-mode energy-saving LED light source device, comprising: Sealing colloid; LED bracket; LED light source chip; Conductive adhesive or bonding wire; The feature is that the sealing colloid (3) is wrapped around the LED light source chip, the sealing colloid (3) is a sealing colloid layer containing phosphorescent powder, or a mixed sealing colloid layer containing phosphorescent powder and fluorescent powder, the LED bracket is composed of a material (1.2) containing at least two metal electrodes (1.1) and fixing metal electrodes, the LED light source chip is disposed on the LED bracket, one end of the conductive adhesive (2.1b) or bonding wire (2.2) is disposed on the positive or negative electrode of the LED light source chip (2a or 2b or 2c), and the other end is disposed on the metal electrode (1.1) of the LED bracket, and the sealing colloid (3) is disposed around the LED light source chip (2a or 2b or 2c).

2. A dual-mode energy-saving LED light source device, comprising: Sealing colloid A; Sealing compound B; LED bracket; LED light source chip; Conductive adhesive or bonding wire; The invention is characterized in that the sealing colloid A (3A) is an LED encapsulating adhesive, or a mixture of LED encapsulating adhesive and phosphor; the sealing colloid B (3B) is a uniform mixture of phosphorescent powder and LED encapsulating adhesive; the LED bracket is composed of a material (1.2) containing at least two metal electrodes (1.1) and fixing metal electrodes; the LED light source chip is disposed on the metal electrode (1.1) of the LED bracket; one end of the conductive adhesive (2.1b) or bonding wire (2.2) is disposed on the positive or negative electrode of the LED light source chip, and the other end is disposed on the metal electrode (1.1) of the LED bracket; the sealing colloid A (3A) is disposed around the LED light source chip; and the sealing colloid B (3B) is disposed around the sealing colloid A (3A).

3. A dual-mode energy-saving LED light source device according to claim 1 or 2, characterized in that, The aforementioned dual-mode refers to the LED light source device emitting monochromatic or multi-color light when powered on, and releasing light from the encapsulating adhesive containing phosphorescent powder in the LED light source device when powered off. It can continuously emit light by cyclically switching between the two states of power-on and power-off.

4. A dual-mode energy-saving LED light source device according to claim 1 or 2, characterized in that, The energy saving mentioned refers to the fact that the power supply of the dual-mode LED light source device is cut off for a% of the time, during which the LED light source device emits light without consuming electrical energy.

5. A dual-mode energy-saving LED light source device according to claim 1 or 2, characterized in that, The sealing colloid (3) is doped with one or more of the following systems: aluminate system, sulfur oxide system, or silicate system.

6. A dual-mode energy-saving LED light source device according to claim 1 or 2, characterized in that, The bonding wire is one of gold wire, alloy wire, or copper-palladium wire.

7. A dual-mode energy-saving LED light source device according to claim 1 or 2, characterized in that, The LED encapsulating adhesive is a transparent or semi-transparent colloid doped with epoxy resin or silicone.

8. A dual-mode energy-saving LED light source device according to claim 1 or 2, characterized in that, The LED light source chip is a chip with a regular structure (2a), a chip with a vertical structure (2b), or a chip with a flip structure (2c).

9. A dual-mode energy-saving LED light source device according to claim 1 or 2, characterized in that, The material on which the LED light source chip is placed on the metal electrode is either conductive adhesive (2.1b) or insulating adhesive (2.1a).

10. A dual-mode energy-saving LED light source device according to claim 1 or 2, characterized in that, The material of the fixed metal electrode is one or more of ceramic, aluminum, insulating colloid, and insulating plastic.

11. A dual-mode energy-saving LED light source device according to claim 1 or 2, characterized in that, The LED support is composed of a ceramic substrate or an aluminum substrate (1.2a) and an insulating colloid (1.2b), and the ceramic substrate or the aluminum substrate contains at least two metal electrodes.

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