A semiconductor tank cleaning device with double-cavity anti-overflow structure

Abstract

This utility model discloses a semiconductor tank cleaning device with a dual-cavity anti-overflow structure, relating to the technical field of semiconductor cleaning devices. The semiconductor tank cleaning device includes a tank housing, with a cleaning cavity and an overflow cavity inside. A partition baffle is provided between the cleaning cavity and the overflow cavity, and the partition baffle is an integral structure with the tank housing. An overflow hole is provided at the top of the partition baffle. It also includes a water outlet valve, which is connected to the bottom center of the overflow cavity. A filter is provided on one side of the water outlet valve, and a water storage tank is provided on one side of the filter. A support plate is provided at the bottom of the water storage tank. This invention solves the problem that existing semiconductor cleaning devices, which filter cleaning agents for recycling through a filter assembly, lack an effective anti-overflow mechanism during the cleaning process, leading to overflow problems during cleaning and water injection.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor cleaning device technology, specifically a semiconductor tank cleaning device with a dual-cavity anti-overflow structure. Background Technology

[0002] Semiconductor cleaning equipment is a key piece of equipment used to remove contaminants from the surface of wafers. It is designed to ensure cleanliness and yield in the semiconductor manufacturing process. Its main functions include removing contaminants, ensuring yield, and supporting critical processes.

[0003] For example, the announcement number CN222402550U (named "A Semiconductor Cleaning Device") includes a main body, a cleaning assembly, a support assembly, and an adjustment mechanism. A drain tank is fixedly connected to the bottom of the cleaning assembly. The adjustment mechanism is installed outside the drain tank. The support assembly is fixedly connected to the bottom of the main body, and a reserved opening is provided on the bottom of the main body, inside the support assembly. The cleaning assembly facilitates the cleaning of semiconductor wafers, ensuring the removal of adhesive residue and impurities for subsequent wafer processing. The support assembly provides positioning support for the main body. The adjustment mechanism allows for easy adjustment of the cleaning agent using different filter assemblies. The drain tank allows the cleaning agent to drain from the outlet on the side of the drain tank. The reserved opening facilitates the replacement of the filter assemblies. The adjustment mechanism prevents cleaning agent leakage and flow interruption during switching between different filter assemblies, ensuring the integrity of the cleaning agent filtration process and improving the efficiency of cleaning agent recovery.

[0004] The aforementioned semiconductor cleaning device filters the cleaning agent through a filter assembly for recycling. However, it lacks an effective overflow prevention mechanism during the cleaning process, which easily leads to overflow problems during cleaning and water injection. To address this, we provide a semiconductor tank cleaning device with a dual-chamber overflow prevention structure. Utility Model Content

[0005] The purpose of this invention is to provide a semiconductor tank cleaning device with a dual-cavity anti-overflow structure, in order to solve the problem mentioned in the background art that the existing semiconductor cleaning devices filter the cleaning agent through the filter components for recycling, but lack an effective anti-overflow mechanism during the cleaning process, which easily leads to overflow during cleaning and water injection.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor tank cleaning device with a dual-cavity anti-overflow structure, comprising a device tank, wherein a cleaning cavity and an overflow cavity are provided inside the device tank, a partition baffle is provided between the cleaning cavity and the overflow cavity, the partition baffle is integral with the device tank, and an overflow hole is provided on the top of the partition baffle.

[0007] Also includes:

[0008] The outlet valve is connected to the bottom center of the overflow cavity, and a filter is provided on one side of the outlet valve. A water storage tank is provided on one side of the filter. A support plate is provided at the bottom of the water storage tank. The inlet and outlet of the filter are sealed to the outlet valve and the water storage tank respectively through pipes.

[0009] A diversion pump is installed at the front end of the water storage tank, and a return water pipe is installed above the diversion pump. A pumping pipe and a water supply pipe are respectively installed at the inlet and outlet ends of the diversion pump, and the pumping pipe and the water supply pipe are respectively connected to the water storage tank and the return water pipe.

[0010] A bottom cavity is located at the bottom of the cleaning cavity, and transducers are arranged inside the bottom cavity.

[0011] Preferably, four corner blocks are welded to the inner wall of the overflow cavity, and a filter screen frame is placed abutting against the upper end of the four corner blocks.

[0012] Preferably, a water injection conduit is provided on one side of the return water pipe, a first support frame is provided at the connection position between the water injection conduit and the device tank, and a flange is provided at the end of the water injection conduit.

[0013] Preferably, an ultrasonic generator is provided on one outer wall of the device tank, and the output end of the ultrasonic generator is electrically connected to the input end of the transducer.

[0014] Preferably, a second support frame is provided at the connection position between the return water pipe and the device tank, and both the first and second support frames are welded to the device tank.

[0015] Preferably, a drain valve is connected to the outer wall of the other side of the device tank, and the drain valve is connected to the interior of the overflow cavity.

[0016] Preferably, four support brackets are provided on the outer walls of the device tank, and the four support brackets are integral with the device tank. The support plate is welded to two of the support brackets.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] This invention allows water to overflow into the overflow cavity. After pre-filtration and impurity removal by the filter screen, the water outlet valve is opened to discharge the water. After further filtration by the filter, the water enters the water storage tank. Finally, the water in the storage tank is pumped out by the diversion pump and discharged through the water inlet and outlet pipes for reuse in the cleaning cavity. This achieves the purpose of reusing overflow water, reducing the consumption of cleaning water. It overcomes the shortcomings of existing semiconductor cleaning devices that use filter components to filter cleaning agents for recycling, but lack an effective overflow prevention mechanism during the cleaning process, which easily leads to overflow problems during cleaning and water injection. Attached Figure Description

[0019] Figure 1 This is a front view of the semiconductor tank cleaning device with a dual-cavity anti-overflow structure according to the present invention.

[0020] Figure 2 This is a top view of the semiconductor tank cleaning device with a dual-cavity anti-overflow structure according to the present invention.

[0021] Figure 3 This is a bottom view of the semiconductor tank cleaning device with a dual-cavity anti-overflow structure according to the present invention.

[0022] Figure 4 This is a cross-sectional view of the internal structure of the semiconductor tank cleaning device with a dual-cavity anti-overflow structure according to this utility model.

[0023] In the diagram: 1. Device tank; 2. Cleaning cavity; 3. Overflow cavity; 4. Support bracket; 5. Water injection pipe; 6. First support bracket; 7. Flange; 8. Return water pipe; 9. Second support bracket; 10. Filter screen frame; 11. Corner block; 12. Ultrasonic generator; 13. Support plate; 14. Water storage tank; 15. Diversion pump; 16. Pumping pipe; 17. Water supply pipe; 18. Dividing baffle; 19. Overflow hole; 20. Drain valve; 21. Outlet valve; 22. Filter; 23. Bottom cavity; 24. Transducer. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0025] Please see Figure 1-4 An embodiment of this utility model is provided: a semiconductor tank cleaning device with a dual-cavity anti-overflow structure, including a device tank 1, the inside of the device tank 1 is provided with a cleaning cavity 2 and an overflow cavity 3, a partition baffle 18 is provided between the cleaning cavity 2 and the overflow cavity 3, the partition baffle 18 is an integral structure with the device tank 1, and an overflow hole 19 is provided on the top of the partition baffle 18.

[0026] Also includes:

[0027] The outlet valve 21 is connected to the bottom center of the overflow cavity 3, and a filter 22 is provided on one side of the outlet valve 21. A water storage tank 14 is provided on one side of the filter 22. A support plate 13 is provided at the bottom of the water storage tank 14. The inlet and outlet of the filter 22 are sealed to the outlet valve 21 and the water storage tank 14 respectively through pipes.

[0028] A diversion pump 15 is installed at the front end of the water storage tank 14, and a return water pipe 8 is installed above the diversion pump 15. A pumping pipe 16 and a water supply pipe 17 are respectively installed at the inlet and outlet ends of the diversion pump 15. The pumping pipe 16 and the water supply pipe 17 are respectively connected to the water storage tank 14 and the return water pipe 8.

[0029] The bottom cavity 23 is located at the bottom of the cleaning cavity 2, and transducers 24 are arranged inside the bottom cavity 23.

[0030] In use, the semiconductor to be cleaned is placed inside the cleaning cavity 2. Then, the water injection pipe 5 is connected to the water source pipe, and water is injected into the cleaning cavity 2 through the water injection pipe 5 to assist in cleaning. Afterwards, the ultrasonic generator 12 drives the transducer 24 to work, generating ultrasonic waves through high-frequency oscillation signals. The "cavitation effect" in the liquid forms microbubbles. When the bubbles burst, the instantaneous high pressure and high temperature shock waves generated destroy the adsorption of dirt on the semiconductor surface, thereby achieving efficient cleaning. During the cleaning process, the water injection pipe 5 continuously injects water. When the water reaches the water level of the overflow hole 19, the water overflows into the overflow cavity 3. After pre-filtration and impurity removal by the filter screen frame 10, the water outlet valve 21 is opened to discharge the water. After filtration by the filter 22, the water enters the water storage tank 14. The filter 22 is model S160. Finally, the water in the water storage tank 14 is pumped out by the diversion pump 15 and discharged through the water inlet pipe 17 and the water return pipe 8, and reused to supply the cleaning cavity 2, achieving the purpose of reusing the overflow water.

[0031] Please see Figure 1 Four corner blocks 11 are welded to the inner wall of the overflow cavity 3. A filter frame 10 is placed abutting against the upper end of each of the four corner blocks 11. The four corner blocks 11 welded to the inner wall of the overflow cavity 3 serve to support the filter frame 10. Please refer to [link / reference]. Figure 1 A water injection conduit 5 is provided on one side of the return water pipe 8. A first support bracket 6 is provided at the connection position between the water injection conduit 5 and the device tank 1. A flange 7 is provided at the end of the water injection conduit 5. The water injection conduit 5 provided on one side of the return water pipe 8 facilitates the injection of water into the device tank 1. Please refer to [link / reference]. Figure 1 and Figure 4An ultrasonic generator 12 is installed on one outer wall of the device tank 1. The output end of the ultrasonic generator 12 is electrically connected to the input end of the transducer 24. The ultrasonic generator 12 installed on one outer wall of the device tank 1 serves to provide a high-frequency oscillation signal for the transducer 24. Please refer to [link to relevant documentation]. Figure 2 A second support bracket 9 is installed at the connection point between the return water pipe 8 and the device tank 1. Both the first support bracket 6 and the second support bracket 9 are welded to the device tank 1. The second support bracket 9 at the connection point between the return water pipe 8 and the device tank 1 serves to support the connection of the return water pipe 8. Please refer to [link / reference]. Figure 2 A drain valve 20 is connected to the outer wall of the other side of the device tank 1. The drain valve 20 is connected to the interior of the overflow cavity 3. The drain valve 20 connected to the outer wall of the other side of the device tank 1 serves to facilitate the discharge of excess water from the overflow cavity 3. Please refer to the figure. Four support brackets 4 are provided on the outer walls of the device tank 1. The four support brackets 4 are all integral with the device tank 1. The support plate 13 is welded to two support brackets 4. The four support brackets 4 provided on the outer walls of the device tank 1 serve to support the device tank 1.

[0032] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A semiconductor tank cleaning device with a dual-cavity anti-overflow structure, comprising a device tank (1), wherein the device tank (1) is provided with a cleaning cavity (2) and an overflow cavity (3), and a partition baffle (18) is provided between the cleaning cavity (2) and the overflow cavity (3), the partition baffle (18) and the device tank (1) are integrally formed, and an overflow hole (19) is provided on the top of the partition baffle (18); characterized in that Also includes: The outlet valve (21) is connected to the bottom center of the overflow cavity (3), and a filter (22) is provided on one side of the outlet valve (21). A water storage tank (14) is provided on one side of the filter (22). A support plate (13) is provided at the bottom of the water storage tank (14). The inlet and outlet of the filter (22) are sealed to the outlet valve (21) and the water storage tank (14) respectively through the pipe. A diversion pump (15) is located at the front end of the water storage tank (14), and a return water pipe (8) is provided above the diversion pump (15). A pumping pipe (16) and a water supply pipe (17) are respectively provided on the inlet and outlet ends of the diversion pump (15). The pumping pipe (16) and the water supply pipe (17) are respectively connected to the water storage tank (14) and the return water pipe (8). A bottom cavity (23) is located at the bottom of the cleaning cavity (2), and transducers (24) are arranged inside the bottom cavity (23).

2. The semiconductor tank cleaning apparatus of claim 1, wherein: Four corner blocks (11) are welded to the inner wall of the overflow cavity (3), and a filter screen frame (10) is placed on the upper end of the four corner blocks (11).

3. The semiconductor tank cleaning apparatus of claim 1, wherein: A water injection pipe (5) is provided on one side of the return water pipe (8), a first support frame (6) is provided at the connection position between the water injection pipe (5) and the device tank (1), and a flange (7) is provided at the end of the water injection pipe (5).

4. The semiconductor tank cleaning apparatus of claim 1, wherein: An ultrasonic generator (12) is provided on one side of the outer wall of the device tank (1), and the output end of the ultrasonic generator (12) is electrically connected to the input end of the transducer (24).

5. The semiconductor tank cleaning device with a dual-cavity anti-overflow structure according to claim 1, characterized in that: A second support frame (9) is provided at the connection position between the return water pipe (8) and the device tank (1). Both the first support frame (6) and the second support frame (9) are welded to the device tank (1).

6. The twin chamber anti-overflowing semiconductor tank cleaning apparatus of claim 1, wherein: A drain valve (20) is connected to the outer wall of the other side of the device tank (1), and the drain valve (20) is connected to the interior of the overflow cavity (3).

7. The twin chamber anti-overflowing semiconductor tank cleaning apparatus of claim 1, wherein: Four support brackets (4) are provided on the outer walls of the device tank (1). All four support brackets (4) are integral with the device tank (1). The support plate (13) is welded to two support brackets (4).

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