Semiconductor cleaning apparatus and cleaning method

Abstract

The application belongs to the technical field of semiconductor manufacturing, and provides a semiconductor cleaning device and a cleaning method. The device comprises a tank body, a top cover plate, a spraying assembly and a flow guide assembly. A cleaning tank is arranged in the tank body, a test piece to be cleaned is placed in the cleaning tank, and a plurality of first through holes are arranged in the tank bottom of the cleaning tank. The top cover plate is located above the tank body to cover the cleaning tank. The spraying assembly is connected to one side of the top cover plate facing the cleaning tank, sprays a curtain-shaped water flow in the vertical direction, and uniformly washes the surface of the test piece to be cleaned from top to bottom in all directions without dead angles to assist in cleaning surface impurities. The flow guide assembly is connected to the tank body and covers the first through holes, can guide the cleaning liquid around the first through holes to sink from outside to inside and downward, effectively pushes the pollutants away from the test piece area to be cleaned, and collects the pollutants to the tank bottom of the cleaning tank to realize continuous discharge of the pollutants, avoid secondary floating of the pollutants, and improve the cleaning effect of the test piece to be cleaned.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a semiconductor cleaning apparatus and cleaning method. Background Technology

[0002] In the semiconductor industry, wafer manufacturing involves multiple processes, including crystal pulling, cutting, rounding, slicing, grinding, polishing, and cleaning. After slicing the ingots, wafer cleaning and debinding are crucial steps for enabling single-wafer processing. Currently, in semiconductor manufacturing processes, wafer debinding and cleaning typically employ an overflow cleaning tank structure. This device continuously feeds cleaning fluid into the tank, causing it to overflow from the top or edges, thus renewing the cleaning fluid and removing contaminants. This type of structure offers advantages such as simplicity, low cost, and ease of maintenance, effectively preventing particulate impurities from depositing at the bottom of the tank.

[0003] However, when using existing overflow cleaning tanks to clean wafer ingots after slicing, the cleaning solution easily generates convection circulation within the tank. This causes contaminants such as microbubbles and slurry particles generated during the cleaning process to circulate and remain in the tank for extended periods, making it difficult to effectively remove them through top overflow. When the wafer is extracted from the cleaning tank, impurities are often still present on the wafer surface. Furthermore, the uneven distribution of contaminants within the tank further increases the instability of the cleaning effect, severely impacting the cleanliness of the wafer and the quality of subsequent processes. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of this application is to provide a semiconductor cleaning device and cleaning method that can actively agitate the fluid and collect contaminants during the cleaning process to achieve directional discharge, thereby effectively improving the efficiency of particle aggregation and discharge and enhancing the cleaning cleanliness.

[0005] To achieve the above and other related objectives, in a first aspect, this application provides a semiconductor cleaning apparatus, comprising:

[0006] The tank body is provided with a cleaning tank, the test piece to be cleaned is placed in the cleaning tank, and the bottom of the cleaning tank is provided with a number of first through holes.

[0007] A top cover plate, located above the tank body, is used to cover the cleaning tank;

[0008] A spray assembly, connected to the side of the top cover facing the cleaning tank, is used to spray cleaning liquid onto the test piece to be cleaned;

[0009] A flow guide assembly is connected to the tank body and covers the first through hole, and is used for discharging the cleaning liquid in the cleaning tank. The flow guide assembly comprises a liquid discharging part located at the bottom of the cleaning tank. The liquid discharging part comprises a driving bearing, a flow guide cylinder and a plurality of paddles. The driving bearing is located vertically above the first through hole in the cleaning tank. The paddles are annularly arranged at the outer periphery of the driving bearing. The flow guide cylinder is located outside the cleaning tank and covers the first through hole.

[0010] Optionally, the spraying assembly comprises:

[0011] A spraying pipeline is connected to the top cover plate and has a reciprocating and circuitous serpentine structure. A plurality of spraying holes are arranged in the spraying pipeline.

[0012] A transmission pipeline is arranged with a second through hole in the top cover plate. The spraying pipeline is connected to the transmission pipeline through the second through hole.

[0013] Optionally, a plurality of spraying holes are arranged in the spraying pipeline. The distance between two adjacent spraying holes is 0.8 cm to 1.2 cm. The diameter of the spraying hole is 3 mm to 4 mm.

[0014] Optionally, the liquid discharging part further comprises a first supporting rod, a first driver and a protective filtering structure.

[0015] One end of the first supporting rod is connected to the inner wall of the cleaning tank. The driving bearing has a rotating end and a fixed end. The other end of the first supporting rod is connected to the fixed end to support the driving bearing. The paddles are annularly arranged at the outer periphery of the rotating end. The first driver is used for driving the rotating end of the driving bearing to rotate. The protective filtering structure is located above the paddles and is connected to the inner wall of the cleaning tank.

[0016] Optionally, one end of the flow guide cylinder has a flow guide front end with a horn-shaped structure. The wide mouth end of the flow guide front end is connected to the tank body and covers the first through hole.

[0017] Optionally, the liquid discharging part further comprises a liquid discharging valve. The liquid discharging valve is connected to the outlet of the flow guide cylinder and is used for controlling the flow rate of the cleaning liquid discharged by the flow guide cylinder.

[0018] Optionally, a third through hole is arranged in the driving bearing. The side wall of the flow guide cylinder is provided with a fourth through hole. The flow guide assembly further comprises an air extraction part.

[0019] The air extraction pipeline has an air extraction port and is used for extracting the gas in the cleaning tank. The air extraction port is located above the liquid level of the cleaning liquid contained in the cleaning tank. The air extraction pipeline is connected to an external air extraction system through the third through hole and the fourth through hole.

[0020] a flow cover located above the air suction port;

[0021] a second supporting rod located between the flow cover and the air suction pipeline, used for supporting the flow cover.

[0022] Optionally, the diameter of the third through hole is 40mm-60mm, the outer diameter of the air suction pipeline matches the diameter of the third through hole, and the projection plane of the air suction port is located within the projection plane of the flow cover in the vertical direction.

[0023] Optionally, the groove body has a first direction and a second direction perpendicular to the vertical direction, the first direction is perpendicular to the second direction, and the axis direction of the test piece to be washed is the second direction.

[0024] The semiconductor cleaning device further comprises a blowing assembly, and the blowing assembly comprises:

[0025] a telescopic movement part comprising a telescopic track and a second driver, the telescopic track is connected to one end of the inner wall of the cleaning groove along the first direction, and the second driver is used to drive the telescopic track to perform telescopic movement along the first direction.

[0026] an air pipeline installed on the telescopic track;

[0027] a nozzle array installed to the end of the telescopic track along the first direction and in communication with the air pipeline, used for blowing air to the test piece to be washed.

[0028] Optionally, the semiconductor cleaning device further comprises:

[0029] a liquid level detection assembly used for monitoring the liquid level of the cleaning liquid in the cleaning groove;

[0030] an ultrasonic cleaning assembly used for performing ultrasonic cleaning on the test piece to be washed in the cleaning groove.

[0031] In a second aspect, the application further provides a semiconductor cleaning method, which applies any one of the semiconductor cleaning devices in the foregoing embodiments to clean a test piece to be washed, and comprises the following steps:

[0032] placing the test piece to be washed into the cleaning groove and covering the cleaning groove with the top cover plate;

[0033] spraying cleaning liquid to the test piece to be washed;

[0034] when the liquid level of the cleaning liquid in the cleaning groove reaches a preset height, performing ultrasonic cleaning on the test piece to be washed and discharging the cleaning liquid in the cleaning groove; wherein the flow of the discharged cleaning liquid is less than the flow of the cleaning liquid sprayed to the test piece to be washed.

[0035] After the cleaning is completed, the cleaning liquid in the cleaning tank is exhausted, and the test piece to be cleaned is taken out.

[0036] Optionally, after the top cover plate is closed to cover the cleaning tank, the following step is further included:

[0037] The gas in the cleaning tank is exhausted.

[0038] When the liquid level of the cleaning liquid in the cleaning tank reaches a preset height, a blowing assembly in the semiconductor cleaning device is controlled to be close to the test piece to be cleaned to blow air to the test piece to be cleaned.

[0039] As described above, compared with the prior art, the semiconductor cleaning device and the cleaning method provided by the present application have at least the following beneficial effects:

[0040] In the semiconductor cleaning device, the spraying assembly can spray a curtain-shaped water flow in the vertical direction to cover the surface of the test piece to be cleaned from top to bottom, realizing omnidirectional and dead-angle-free uniform washing of the surface of the test piece to be cleaned and assisting in cleaning the impurities on the surface. The flow guide assembly can guide the cleaning liquid around the first through hole to flow from outside to inside and sink downward from the center, effectively pushing the particulate pollutants away from the test piece to be cleaned and collecting them at the bottom of the cleaning tank, realizing continuous discharge of the pollutants and avoiding secondary floating or circulating flow of the pollutants, thereby effectively improving the cleaning effect of the test piece to be cleaned. The device adopts a modular design of an overall structure, improving the adaptability of the device and facilitating integration and industrial use. The semiconductor cleaning method uses the above-mentioned device to clean the test piece to be cleaned, and therefore also has the above-mentioned beneficial effects. BRIEF DESCRIPTION OF DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be considered as limiting the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0042] Figure 1 Fig. 1 shows a front view structural schematic diagram of a semiconductor cleaning device provided by Embodiment One of the present application.

[0043] Figure 2 Fig. 2 shows a side view structural schematic diagram of a semiconductor cleaning device provided by Embodiment One of the present application.

[0044] Figure 3 Fig. 3 shows a structural schematic diagram of a flow guide assembly in a semiconductor cleaning device provided by Embodiment One of the present application.

[0045] Figure 4A structure schematic diagram of a spraying assembly in a semiconductor cleaning device is shown.

[0046] Figure 5 A structure schematic diagram of a local simulation of a paddle and a guide cylinder is shown.

[0047] Figure 6 A flow schematic diagram of a semiconductor cleaning method is shown.

[0048] Figure 7 A principle schematic diagram of a semiconductor cleaning method is shown.

[0049] Reference signs are shown:

[0050] 11, groove body; 111, cleaning groove; 12, top cover plate; 13, spraying assembly; 131, spraying pipeline; 1311, spraying hole; 14, flow guide assembly; 141, liquid discharge part; 1411, first support rod; 1412, driving bearing; 1413, paddle; 1414, flow guide cylinder; 1401, flow guide front end; 142, protection filter structure; 143, air extraction part; 1431, air extraction pipeline; 1432, flow shielding cover; 1433, second support rod; 15, air blowing assembly; 151, telescopic movement part; 1511, telescopic track; 152, nozzle array; 16, liquid level detection assembly; 17, ultrasonic cleaning assembly. DETAILED DESCRIPTION

[0051] In order to make the technical purposes, technical solutions and technical effects of the present application clearer, the technical solutions in the present application will be described clearly and completely in combination with embodiments. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0052] Therefore, the detailed description of the embodiments of the present application below is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present application. In addition, the terms “first”, “second” are only for description purposes, and cannot be understood as indicating or implying relative importance.

[0053] In the description of the present application, it needs to be explained that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0054] In the description of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, or it can be detachable connection. In addition, the description of the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In the present description, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples as appropriate.

[0055] In the prior art, a overflow type cleaning tank is usually used to clean the sliced crystal rod. In the cleaning process, the cleaning liquid and gas are introduced from the bottom of the cleaning tank and overflow from bottom to top to achieve the cleaning of the wafer. However, this cleaning method is easy to form a convection cycle of the cleaning liquid in the tank, causing the pollutants such as micro-bubbles and mortar particles generated during the cleaning process to circulate and stay in the tank body for a long time, which is difficult to be effectively discharged by the top overflow. When the wafer is extracted from the cleaning tank after cleaning, due to the circulation of the pollutants in the tank body, part of the impurities may still stay on the surface of the wafer, or even be mixed between the wafer pieces, which seriously affects the cleanliness of the wafer and the subsequent process quality. Moreover, due to the uneven distribution of the pollutants and the continuous distribution in the tank body, the instability of the cleaning effect is also increased, which seriously affects the cleaning cleanliness of the wafer and the subsequent process yield.

[0056] In view of the above shortcomings in the prior art, the present application provides a semiconductor cleaning device and a cleaning method, which will be described in detail in conjunction with the following embodiments.

[0057] Embodiment one

[0058] The present embodiment provides a semiconductor cleaning device, referring to Figure 1 and Figure 2 , comprising a tank body 11, a top cover plate 12, a spraying assembly 13 and a flow guide assembly 14.

[0059] The cleaning tank 111 is arranged in the groove body 11, and the test piece to be washed is placed in the cleaning tank 111 to be cleaned. The structure size of the cleaning tank 111 can be set according to actual needs. The cleaning tank 111 can be a rectangular groove or other suitable structure. The test piece to be washed can be, for example, a sliced crystal rod, including multiple wafers arranged at intervals, or other suitable semiconductor structures. The groove bottom of the cleaning tank 111 is provided with a plurality of first through holes. The number of first through holes can be one or more. Optionally, the cleaning tank 111 is a rectangular groove, and the groove bottom of the cleaning tank 111 is provided with four first through holes, respectively located at the four corners of the groove bottom of the cleaning tank 111.

[0060] The top cover plate 12 is located above the groove body 11 and covers the cleaning tank 111 to keep the cleaning tank 111 in a sealed state. Optionally, viewed in the vertical direction, the projection plane of the cleaning tank 111 is completely located in the projection plane of the top cover plate 12 to cover the cleaning tank 111. The top cover plate 12 can be a box-shaped structure with an opening, or other suitable structures. The specific shape can be adapted to the shape of the groove body 11 and the cleaning tank 111 to achieve sealing of the cleaning tank 111. The top cover plate 12 can also be provided with a sealing gasket to improve the sealing effect of the cleaning tank 111.

[0061] The spraying assembly 13 is connected to the side of the top cover plate 12 facing the cleaning tank 111, and is used to spray cleaning liquid to the test piece placed in the cleaning tank 111. Optionally, the spraying assembly 13 is fixedly connected with the top cover plate 12. The spraying assembly 13 can be, for example, detachably fixedly connected to the top cover plate 12, so as to realize the position fixation of the spraying assembly 13 while facilitating the installation and disassembly and maintenance of the spraying assembly 13.

[0062] The flow guide assembly 14 is connected to the groove body 11 and covers the first through hole, and the cleaning liquid in the cleaning tank 111 can be discharged by using the flow guide assembly 14. Specifically, during the cleaning process, when the cleaning liquid in the cleaning tank 111 reaches a preset height, the liquid level control of the cleaning liquid in the cleaning tank 111 can be realized by controlling the flow of the flow guide assembly 14 and the spraying assembly 13.

[0063] In this embodiment, the spraying assembly 13 can spray a vertical curtain-shaped water flow to cover the surface of the test piece to be washed from top to bottom, realizing omnidirectional and dead-angle-free uniform washing of the surface of the test piece to be washed and assisting in cleaning the surface impurities. The cleaning liquid around the first through hole is guided by the flow guide assembly 14 to flow from outside to inside and sink downward from the center, which can effectively push the particulate pollutants away from the test piece area and collect them at the groove bottom of the cleaning tank 111, realizing continuous discharge of the pollutants and avoiding secondary floating or circulating flow of the pollutants, thereby effectively improving the cleaning effect of the test piece to be washed.

[0064] In this embodiment, the cleaning tank 111 is arranged in the groove body 11, and the test piece to be washed is placed in the cleaning tank 111 to be cleaned. The structure size of the cleaning tank 111 can be set according to actual needs. The cleaning tank 111 can be a rectangular groove or other suitable structure. The test piece to be washed can be, for example, a sliced crystal rod, including multiple wafers arranged at intervals, or other suitable semiconductor structures. The groove bottom of the cleaning tank 111 is provided with a plurality of first through holes. The number of first through holes can be one or more. Optionally, the cleaning tank 111 is a rectangular groove, and the groove bottom of the cleaning tank 111 is provided with four first through holes, respectively located at the four corners of the groove bottom of the cleaning tank 111.Figure 4 The spraying assembly 13 comprises a spraying pipeline 131 and a transmission pipeline. The spraying pipeline 131 is connected to the top cover plate 12 and has a reciprocating and winding serpentine structure. A plurality of spraying holes 1311 are arranged in the spraying pipeline 131. By arranging the spraying pipeline 131 in a serpentine structure, the cleaning liquid sprayed through the spraying holes 1311 to the surface of the test piece to be washed can form a curtain water flow in the vertical direction, covering the surface of the test piece to be washed from top to bottom, and realizing uniform and dead angle-free washing of the surface of the test piece to be washed.

[0065] In optional embodiments, also referring to Figure 4 A plurality of spraying holes 1311 are arranged in the spraying pipeline 131. The distance between adjacent two spraying holes 1311 is 0.8 cm to 1.2 cm. The diameter of the spraying hole 1311 is 3 mm to 4 mm. Specifically, the side of the spraying pipeline 131 facing the test piece to be washed is provided with a plurality of spraying holes 1311. The distance between adjacent two spraying holes 1311 can be 0.8 cm, 0.9 cm, 1 cm, 1.1 cm, 1.2 cm or other suitable values. The diameter of the spraying hole 1311 can be 3 mm, 3.2 mm, 3.5 mm, 3.8 mm, 4 mm or other suitable values. By controlling the distance between the spraying holes 1311 and the diameter of the spraying hole 1311, it can be ensured that the sprayed cleaning liquid forms a curtain water flow, realizing sufficient coverage of the surface of the test piece to be washed, while controlling the flow of the cleaning liquid into the cleaning tank 111 to have a suitable flow, ensuring the cleaning effect of the test piece to be washed.

[0066] The top cover plate 12 is provided with a second through hole. The spraying pipeline 131 is connected to the transmission pipeline through the second through hole to provide the cleaning liquid to the spraying pipeline 131 through the transmission pipeline. Optionally, the top cover plate 12 is a box-shaped structure with an opening. The second through hole is arranged on the side of the top cover plate 12. The box-shaped top cover plate 12 can also be provided with a clamping structure. The spraying pipeline 131 is detachably fixedly connected to the top cover plate 12 through the clamping structure to facilitate the installation and disassembly and maintenance of the spraying pipeline 131. The spraying pipeline 131 has air tightness with the side wall of the second through hole to ensure the sealing effect of the cleaning tank 111 during the cleaning process.

[0067] In this embodiment, referring to Figure 1 and Figure 2 The number of the flow guide assembly 14 can be one or more, for example, two, four or other suitable number, Figure 1 Due to the limitation of the number of structural elements, only one flow guide assembly 14 is shown. Further, the cleaning tank 111 has a rectangular structure. The semiconductor cleaning device comprises four flow guide assemblies 14, which are respectively located at the four top corners of the bottom of the cleaning tank 111.

[0068] Referring to Figure 3The flow guide assembly 14 comprises a liquid discharge part 141 located at the bottom of the cleaning tank 111, for example at the top corner of the bottom of the cleaning tank 111 or other suitable positions, for discharging the cleaning liquid in the cleaning tank 111, comprising a first support rod 1411, a driving bearing 1412, a plurality of paddles 1413, a flow guide cylinder 1414 and a first driver.

[0069] One end of the first support rod 1411 is connected to the inner wall of the cleaning tank 111, and the first support rod 1411 can be fixedly connected to the tank body 11, for example, the first support rod 1411 can be fixed on the tank body 11 by welding, or other suitable ways can be used to connect the first support rod 1411 to the tank body 11. The driving bearing 1412 is located in the cleaning tank 111 and vertically above the first through hole, and has a rotating end and a fixed end. The rotating end can rotate relative to the fixed end, and the other end of the first support rod 1411 is connected to the fixed end to support the driving bearing 1412 and fix the driving bearing 1412 in the cleaning tank 111. The first driver is used to drive the rotating end of the driving bearing 1412 to rotate, and the plurality of paddles 1413 are arranged around the outer periphery of the rotating end and can rotate with the rotating end. The first driver and the driving bearing 1412 can form a servo motor, for example, and the rotating end can be sleeved outside the fixed end to drive the paddles 1413 to rotate. Optionally, the paddles 1413 are fixedly connected to the outer periphery of the fixed end of the driving bearing 1412 to improve the stability of the paddles 1413 during rotation, prevent the paddles 1413 from swinging during rotation, and ensure that the eddy current can be generated to eliminate the convection circulation in the cleaning liquid.

[0070] The flow guide cylinder 1414 is located outside the cleaning tank 111, and one end of the flow guide cylinder 1414 has a flow guide front end 1401 with a horn structure. In the sectional view of the flow guide front end 1401 along the axial direction, the side tangent of the flow guide front end 1401 can be a straight line or a smooth curve. The flow guide front end 1401 with a horn structure has a wide end and a narrow end, and the wide end is connected to the tank body 11 and covers the first through hole.

[0071] In this embodiment, the installation angle of the paddle 1413 is inclined downward, and when the paddle 1413 rotates, a strong turbulent flow can be generated, so that the cleaning liquid in the cleaning tank 111 is guided to the central region of the first through hole and is further discharged downward from the center, cooperates with the flow guide cylinder 1414 having the horn-shaped structure flow guide front end 1401, and can guide the cleaning liquid around the flow guide assembly 14 to flow from outside to inside and then to sink downward from the center, forming a structural flow field of central sinking flow. By using the flow field, the pollutants can be effectively pushed away from the area where the test piece to be washed is located and gradually collected at the bottom of the cleaning tank 111, thereby realizing continuous discharge of the pollutants, effectively eliminating the circulation path of the pollutants in the cleaning liquid, realizing the centralized sinking and directional discharge of the pollutants, and improving the cleaning effect of the test piece to be washed.

[0072] Figure 5 A local simulation structure with a paddle and a guide cylinder established in simulation software is shown, and the local simulation structure contains liquid. Through simulation analysis of the local simulation structure, when the paddle rotates, the liquid in the area near the paddle can form a structural flow field of sinking from outside to inside and then from the center downward.

[0073] In optional embodiments, with reference to Figure 1 and Figure 2 , in the horn-shaped structure flow guide front end 1401, the tangent of the side surface of the flow guide front end 1401 along the axial direction is a smooth curve, the conical top angle of the conical structure formed by the contour connecting line of the wide mouth end and the narrow mouth end of the flow guide front end 1401 is 50°-60°, so as to improve the flow guiding effect on the cleaning liquid in the nearby area and ensure that a structural flow field of central sinking can be formed when the paddle rotates. Further, the diameter of the wide mouth end can be, for example, 80mm-160mm, and the diameter of the narrow mouth end can be, for example, 60mm-120mm. It should be noted that the diameter of the wide mouth end and the diameter of the narrow mouth end of the flow guide front end 1401 can be set according to actual needs, and the present embodiment is not limited thereto.

[0074] In optional embodiments, the liquid discharge part 141 further comprises a liquid discharge valve connected to the outlet of the flow guide cylinder 1414, for controlling the flow rate of the cleaning liquid discharged by the flow guide cylinder 1414. In use, the flow rate of the flow guide cylinder 1414 can be controlled by the liquid discharge valve to maintain the stability of the liquid level of the cleaning liquid in the cleaning tank 111, and optionally, the flow rate of the cleaning liquid discharged by the flow guide cylinder 1414 is less than or equal to the flow rate of the cleaning liquid sprayed by the spraying assembly 13, for example, the flow rate of the cleaning liquid discharged by the flow guide cylinder 1414 can be slightly less than the flow rate of the cleaning liquid sprayed by the spraying assembly 13.

[0075] In optional embodiments, with reference to Figure 1 and Figure 2The flow guiding assembly 14 also includes a protective filter structure 142, located above the impeller 1413 and connected to the inner wall of the cleaning tank 111. This structure protects the impeller 1413, preventing fragments from the test specimens during cleaning from falling into the area where the impeller 1413 is located and causing damage, thus improving the safety and operational stability of the equipment. Furthermore, the protective filter structure 142 can be, for example, a stainless steel filter screen. Hooks can be provided on the inner wall of the cleaning tank 111 to connect the protective filter structure 142 to the inner wall of the cleaning tank 111, thus fixing its position.

[0076] In this embodiment, refer to Figure 3 The flow guiding component 14 also includes an air extraction section 143 for extracting and releasing gas from the cleaning tank 111. By providing the air extraction section 143, gas can be continuously extracted from the cleaning tank 111 during the cleaning process, maintaining a slight negative pressure state in the cleaning tank 111, ensuring that the cleaning liquid sprayed by the spray component 13 can flow down evenly, reducing the interference of air resistance, and improving the cleaning effect on the test piece to be cleaned.

[0077] The extraction unit 143 includes an extraction pipe 1431 with an extraction port for extracting gas from the cleaning tank 111. A third through-hole is provided in the drive bearing 1412, extending vertically through it. A fourth through-hole is provided on the side wall of the guide tube 1414. The extraction port is located above the surface of the cleaning liquid contained in the cleaning tank 111. The extraction pipe 1431 is connected to an external extraction system via the third and fourth through-holes, allowing gas to be extracted from the cleaning tank 111 through the extraction port. Optionally, the extraction pipe 1431 and the side wall of the fourth through-hole are airtight to prevent leakage of the discharged cleaning liquid from the fourth through-hole.

[0078] In an optional embodiment, the diameter of the third through hole is 40mm to 60mm. Specifically, the diameter of the third through hole can be, for example, 40mm, 60mm, or other suitable sizes. The outer diameter of the suction pipe 1431 matches the diameter of the third through hole. The suction pipe 1431 passes through the drive bearing 1412 via the third through hole. By matching the outer diameter of the suction pipe 1431 with the diameter of the third through hole, the position of the suction pipe 1431 can be fixed using the drive bearing 1412. By controlling the size of the third through hole, sufficient installation space can be reserved for the blade 1413 in the drive bearing 1412.

[0079] The air extraction part 143 further comprises a flow cover 1432 and a second support rod 1433. The flow cover 1432 is located above the air extraction port of the air extraction pipeline 1431, and is used to prevent the cleaning liquid sprayed by the spraying assembly 13 from entering the air extraction port. The second support rod 1433 is located between the flow cover 1432 and the air extraction pipeline 1431, and is used to support the flow cover 1432. Optionally, the opposite ends of the second support rod 1433 are connected to the flow cover 1432 and the air extraction pipeline 1431 respectively, so as to support the flow cover 1432 and make the flow cover 1432 have a gap with the air extraction pipeline 1431, thereby preventing the air extraction of the gas in the cleaning tank 111 from being affected. In the vertical direction, the projection surface of the air extraction port is located in the projection surface of the flow cover 1432, so that the flow cover 1432 fully covers the air extraction port and prevents the cleaning liquid from entering the air extraction port. Further, the flow cover 1432 can be a conical structure. By using the conical flow cover 1432, the inclined liquid sprayed on the flow cover 1432 can slide into the cleaning tank 111.

[0080] In the embodiment, with reference to Figure 1 and Figure 2 The semiconductor cleaning device further comprises a blowing assembly 15. The blowing assembly 15 is used to blow air to the to-be-cleaned test piece during the cleaning process, so as to improve the cleaning effect of the semiconductor test piece. The blowing assembly 15 comprises a telescopic moving part 151, an air pipeline and a nozzle array 152.

[0081] The telescopic moving part 151 comprises a telescopic track 1511 and a second driver. The tank 11 has a first direction and a second direction which are perpendicular to each other. The first direction and the second direction are perpendicular to the vertical direction respectively. The second direction is the axial direction of the to-be-cleaned test piece. The telescopic track 1511 is connected to one end of the inner wall of the cleaning tank 111 along the first direction. The telescopic track 1511 can perform telescopic movement along the first direction. The second driver is used to control the telescopic movement of the telescopic track 1511. The second driver can be a servo motor, for example. The air pipeline is installed on the telescopic track 1511 and is used to provide air during blowing. The telescopic track 1511 can provide support for the air pipeline. The nozzle array 152 is installed on the end of the telescopic track 1511 along the first direction and is in communication with the air pipeline, and is used to blow air to the to-be-cleaned test piece. Here, the end of the telescopic track 1511 means the end of the telescopic track 1511 close to the to-be-cleaned test piece.

[0082] In use, the blowing assembly 15 is immersed in the cleaning liquid. By arranging the blowing assembly 15, compressed air can pass through the gaps in the to-be-cleaned test piece in multiple directions, such as the interlayer regions between different wafers, during the cleaning process. This can effectively assist the cleaning liquid and ultrasonic waves to dislodge or desorb the pollutants, thereby further enhancing the cleaning effect of the to-be-cleaned test piece, especially the interlayer regions.

[0083] In an optional embodiment, with reference toFigure 1 The nozzle array 152 includes a plurality of blow holes, which are directed towards the axis of the second direction of the wafer to be cleaned, such as a wafer including a plurality of wafers, and the blow holes of the nozzle array 152 are directed towards the central region of the wafers so as to blow towards the gap between the wafers, which can effectively assist the cleaning liquid and the ultrasonic wave to dislodge or desorb the entrained contaminants from the gap. Further, the surface profile of the nozzle array 152 near the side of the wafer to be cleaned can be inclined, so as to increase the number of blow holes of the nozzle array 152 and enhance the auxiliary cleaning effect on the wafer to be cleaned.

[0084] The semiconductor cleaning device can include one or a plurality of blow assemblies 15. Specifically, referring to Figure 2 The number of blow assemblies 15 can be two, for example, and the two blow assemblies 15 are respectively located on the opposite sides of the wafer to be cleaned along the first direction, so as to improve the auxiliary cleaning effect on the wafer to be cleaned. The gas blown by the blow assembly 15 into the cleaning tank 111 is floated on the surface of the cleaning liquid and is then extracted through the extraction port of the extraction pipeline 1431. Optionally, the length of the nozzle array 152 along the second direction is greater than or equal to the length of the wafer to be cleaned along the second direction, so that the range of the blow completely covers the wafer to be cleaned.

[0085] In this embodiment, referring to Figure 1 The semiconductor cleaning device further includes a liquid level detection assembly 16 and an ultrasonic cleaning assembly 17. The liquid level detection assembly 16 is used to monitor the liquid level of the cleaning liquid in the cleaning tank 111. Optionally, the liquid level detection assembly 16 includes a float level gauge installed in the cleaning tank 111 to achieve the detection of the liquid level in the cleaning tank 111, or the liquid level detection assembly 16 can also use other suitable ways to detect the liquid level. The ultrasonic cleaning assembly 17 is used to perform ultrasonic cleaning on the wafer to be cleaned in the cleaning tank 111. Optionally, the semiconductor cleaning device can have two ultrasonic cleaning assemblies 17 arranged on the opposite sides of the wafer to be cleaned along the first direction.

[0086] In summary, in the semiconductor cleaning device of the embodiment, the three-dimensional flow control system of top water outlet, top air outlet and bottom turbulence guide combination is established by using the spray assembly 13, the liquid outlet part 141 and the air outlet part 143 in the flow guide assembly 14, which can effectively control the convection generated in the cleaning process, eliminate the pollutant circulation convection path, realize the centralized settlement and directional discharge of the pollutants by constructing the central sinking type flow guide structure, and accurately control the flow of the discharged cleaning liquid by using the liquid outlet valve, which can keep the liquid level stable in the cleaning process. By setting the protection filter structure 142, the overall protection performance and operation reliability of the equipment are improved. The gas blowing assembly 15 is used to blow the two sides of the to-be-cleaned test piece, especially the pollutants in the interlayer region between the wafers, which further improves the auxiliary cleaning effect. The semiconductor cleaning device of the embodiment improves the adaptability of the device by modular design of the overall structure, is easy to integrate and industrialize, and has high product promotion value.

[0087] Embodiment two

[0088] The embodiment provides a semiconductor cleaning method, referring to Figure 6 Any one of the semiconductor cleaning devices in the application is used to clean the to-be-cleaned test piece, which includes steps S1 to S4, and the details are as follows.

[0089] Firstly, step S1 is performed, the to-be-cleaned test piece is placed in the cleaning tank 111, and the top cover plate 12 covers the cleaning tank 111.

[0090] The semiconductor cleaning device includes the gas blowing assembly 15, and before the to-be-cleaned test piece is placed in the cleaning tank 111 in the execution of step S1, the following step is further included: the second driver is used to control the telescopic rail 1511 to perform a contraction movement, so as to provide a space for placing the to-be-cleaned test piece. After the contraction movement of the telescopic rail 1511 is completed, the to-be-cleaned test piece is placed in the cleaning tank 111, for example, a crystal bar, and the axial direction of the to-be-cleaned test piece is controlled to be the second direction when the to-be-cleaned test piece is placed; after the placing movement is completed, the cleaning tank 111 is covered by the top cover plate 12, so that the cleaning tank 111 forms a sealed space.

[0091] Then, step S2 is performed, and the cleaning liquid is sprayed to the to-be-cleaned test piece.

[0092] The semiconductor cleaning device comprises a spraying assembly 13, which can be connected with an external liquid supply system for supplying cleaning liquid to the spraying assembly 13. After the top cover plate 12 covers the cleaning tank 111, the external liquid supply system is started to supply cleaning liquid to the spraying assembly 13, which has a serpentine spraying pipeline 131. The cleaning liquid covers the to-be-cleaned sample from top to bottom through the spraying holes 1311 in the spraying pipeline 131, so that the to-be-cleaned sample is uniformly and completely washed. The curtain liquid flow formed by the cleaning liquid continuously acts on the to-be-cleaned sample, which helps to remove the contaminants on the surface of the to-be-cleaned sample.

[0093] Then, step S3 is performed. When the liquid level of the cleaning liquid in the cleaning tank 111 reaches a preset height, the to-be-cleaned sample is ultrasonically cleaned, and the cleaning liquid in the cleaning tank 111 is discharged. The flow rate of the discharged cleaning liquid is less than the flow rate of the sprayed cleaning liquid.

[0094] The semiconductor cleaning device comprises a liquid level detection assembly 16 and an ultrasonic cleaning assembly 17. The liquid level detection assembly 16 is used to monitor the liquid level of the cleaning liquid in the cleaning tank 111, and can comprise, for example, a float liquid level gauge installed in the cleaning tank 111. The ultrasonic cleaning assembly 17 is used to ultrasonically clean the to-be-cleaned sample. As the cleaning liquid is continuously sprayed into the cleaning tank 111, the liquid level of the cleaning liquid in the cleaning tank 111 gradually rises. When the float liquid level gauge detects that the liquid level in the cleaning tank 111 rises to a preset height, the ultrasonic cleaning assembly 17 is started to ultrasonically clean the to-be-cleaned sample, so that the contaminants on the surface of the to-be-cleaned sample are detached. The preset height can be set according to actual needs. It can be understood that the to-be-cleaned sample should be completely immersed after the liquid level of the cleaning liquid reaches the preset height.

[0095] The semiconductor cleaning device comprises a flow guide assembly 14, which comprises a liquid discharge portion 141. The liquid discharge portion 141 can be used to discharge the cleaning liquid in the cleaning tank 111. When the liquid level of the cleaning liquid in the cleaning tank 111 reaches a preset height, the liquid discharge portion 141 starts to discharge the cleaning liquid in the cleaning tank 111, and the flow rate of the liquid discharge portion 141 is controlled to be less than the flow rate of the spraying assembly 13, so as to maintain the stability of the liquid level in the cleaning tank 111.

[0096] Specifically, when the liquid level of the cleaning liquid reaches the preset height, the paddle 1413 is controlled to start rotating, and the paddle 1413 generates strong turbulent flow by rotating, eliminates the convection circulation in the cleaning liquid, and guides the cleaning liquid to the central area of the first through hole; the lower part of the first through hole is connected with a flow guide cylinder 1414, the flow guide cylinder 1414 has a flow guide front end 1401 with a horn structure, guides the cleaning liquid around to flow from outside to inside, forms a structural flow field with central sinking, can effectively push the pollutants away from the area where the test piece to be washed is located, and collects to the bottom of the cleaning tank 111, realizes continuous discharge of the pollutants; the outlet of the flow guide cylinder 1414 is provided with a liquid discharge valve, through the liquid discharge valve, the flow of the flow guide cylinder 1414 can be controlled to be slightly smaller than the flow of the spray assembly 13 spraying the cleaning liquid, so that the liquid level in the cleaning tank 111 remains stable.

[0097] In an optional embodiment, referring to Figure 7 , after the step of covering the cleaning tank 111 with the top cover plate 12 in step S1, the following step is further included: pumping out the gas in the cleaning tank 111.

[0098] The flow guide assembly 14 further includes a gas pumping part 143, which can pump out the gas in the cleaning tank 111. When the top cover plate 12 covers the cleaning tank 111, the external gas pumping system is controlled to start, and the gas pumping part 143 is used to pump out the gas in the cleaning tank 111, so that a micro-negative pressure state is formed in the cleaning tank 111. During the process of spraying the cleaning liquid by the spray assembly 13, the influence of air resistance can be reduced, the water uniformity can be improved, and the cleaning effect on the test piece to be washed can be enhanced.

[0099] In an optional embodiment, referring to Figure 7 , after the step of covering the cleaning tank 111 with the top cover plate 12 in step S1, the following step is further included: when the liquid level of the cleaning liquid in the cleaning tank 111 reaches a preset height, the air blowing assembly 15 in the semiconductor cleaning device is controlled to be close to the test piece to be washed, and the test piece to be washed is blown.

[0100] The blowing assembly 15 comprises a telescopic moving part 151, a nozzle array 152 and an air supply pipeline, the telescopic moving part 151 comprises a telescopic track 1511 and a second driver. After the step of spraying the cleaning liquid to the test piece is started, the liquid level detection assembly 16 is used to detect whether the liquid level of the cleaning liquid in the cleaning tank 111 reaches the preset height. After the liquid level of the cleaning liquid reaches the preset height, the cleaning liquid submerges the test piece and the nozzle array 152. The second driver is used to drive the telescopic track 1511 to perform the stretching movement, so that the nozzle array 152 is close to the test piece. The nozzle array 152 has a plurality of blowing holes, the blowing holes are directed to the central area of the test piece. The blowing holes are used to blow air to the test piece, so that the compressed air passes through the gaps in the test piece in multiple directions, which can effectively assist the cleaning liquid and the ultrasonic wave to remove or desorb the trapped pollutants, and further enhances the cleaning effect on the test piece, especially the interlayer area of the test piece.

[0101] Finally, the step S5 is performed. After the cleaning is completed, the cleaning liquid in the cleaning tank 111 is emptied, and the test piece is taken out.

[0102] Specifically, after the cleaning liquid in the cleaning tank 111 is emptied, the telescopic track 1511 is controlled to perform the contraction movement by the second driver, so as to provide the avoidance space for taking out the test piece. When the telescopic track 1511 completes the contraction action, the test piece is taken out from the cleaning tank 111.

[0103] The semiconductor cleaning method of the embodiment adopts any one of the semiconductor cleaning devices in the embodiment one to clean the test piece, and therefore, the method also has the beneficial effects of the embodiment one.

[0104] The above embodiments only exemplarily illustrate the principles and effects of the present application, and are not used to limit the present application. Any person skilled in the art can modify, change or combine the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought of the present application should be covered by the claims of the present application.

Claims

1. A semiconductor cleaning apparatus characterized by comprising: The utility model relates to a cleaning device for test piece, including: a groove body is arranged with the cleaning groove in, and the test piece to be washed is placed in the cleaning groove, and the groove bottom of cleaning groove is provided with a plurality of first through -hole; Top cover plate is located above the groove body for covering the cleaning groove; Spray assembly is connected to the side of top cover plate facing the cleaning groove for spraying cleaning liquid to the test piece to be washed; Flow guide assembly is connected to the groove body and covers the first through -hole for discharging the cleaning liquid in the cleaning groove, and the flow guide assembly includes the liquid discharge part at the bottom of the cleaning groove, the liquid discharge part includes the drive bearing, the flow guide cylinder and a plurality of paddle, the drive bearing is located in the cleaning groove first through -hole directly above in vertical direction, the paddle is ringed and is equipped on the periphery of drive bearing, the flow guide cylinder is located at the outside of cleaning groove, and the flow guide cylinder has the flow guide front end with the horn shape structure in one end, and the wide mouth end of flow guide front end is connected to the groove body and covers the first through -hole; Wherein, the third through -hole is arranged in the drive bearing, the side wall of flow guide cylinder is provided with the fourth through -hole, the flow guide assembly further includes the air extraction part, and the air extraction part includes the air extraction pipeline, and the air extraction pipeline has the air extraction port for extracting the gas in the cleaning groove, and the air extraction port is located above the liquid level of the cleaning liquid filled in the cleaning groove, and the air extraction pipeline is connected to the external air extraction system through the third through -hole and the fourth through -hole.

2. The semiconductor cleaning apparatus according to claim 1, wherein The spray assembly includes: Spray pipeline is connected to the top cover plate and is in the reciprocating circuitous serpentine structure, and a plurality of spray holes are arranged in the spray pipeline; Transmission pipeline, the second through -hole is arranged in the top cover plate, and the spray pipeline is connected to the transmission pipeline through the second through -hole.

3. The semiconductor cleaning apparatus according to claim 2, wherein A plurality of spray holes are arranged in the spray pipeline, the distance between adjacent two spray holes is 0.8cm~1.2cm, and the diameter of the spray hole is 3mm~4mm.

4. The semiconductor cleaning apparatus according to claim 1, wherein The liquid discharge part further includes a first support rod, a first driver and a protective filter structure. One end of the first support rod is connected to the inner wall of the cleaning tank, the drive bearing has a rotating end and a fixed end, the other end of the first support rod is connected to the fixed end to support the drive bearing, the paddle is ringed and equipped on the periphery of the rotating end, the first driver is used to drive the rotating end of the drive bearing to rotate, and the protective filter structure is located above the paddle and is connected to the inner wall of the cleaning tank.

5. The semiconductor cleaning apparatus according to claim 1, wherein The liquid discharge part further includes a liquid discharge valve connected to the outlet of the flow guide cylinder for controlling the flow of the cleaning liquid discharged by the flow guide cylinder.

6. The semiconductor cleaning apparatus according to claim 1, wherein The air extraction part further includes: A flow shield is located above the air extraction port; A second support rod is located between the flow shield and the air extraction pipeline for supporting the flow shield.

7. The semiconductor cleaning apparatus according to claim 6, wherein The diameter of the third through -hole is 40mm~60mm, the outer diameter of the air extraction pipeline matches the diameter of the third through -hole, and the projection plane of the air extraction port is located in the projection plane of the flow shield in vertical direction.

8. The semiconductor cleaning apparatus according to claim 1, wherein The groove body has a first direction and a second direction perpendicular to a vertical direction, the first direction is perpendicular to the second direction, and an axis direction of the test piece to be washed is the second direction; The semiconductor cleaning device further comprises a blowing assembly, the blowing assembly comprising: a telescopic movement part comprising a telescopic track and a second driver, the telescopic track being connected to one end of an inner wall of the cleaning tank along the first direction, and the second driver being used to drive the telescopic track to perform telescopic movement along the first direction; an air passage pipeline installed on the telescopic track; a nozzle array installed to a terminal end of the telescopic track along the first direction and in communication with the air passage pipeline, and used to blow air to the test piece to be washed.

9. The semiconductor cleaning apparatus according to claim 1, wherein Further comprising: a liquid level detection assembly used to monitor a liquid level of a cleaning liquid in the cleaning tank; an ultrasonic cleaning assembly used to perform ultrasonic cleaning on the test piece to be washed in the cleaning tank.

10. A semiconductor cleaning method of cleaning a test piece to be cleaned using the semiconductor cleaning apparatus according to any one of claims 1 to 9, characterized by, The method comprises the following steps: placing the test piece to be washed into the cleaning tank and covering the cleaning tank with the top cover plate; spraying the cleaning liquid to the test piece to be washed; when the liquid level of the cleaning liquid in the cleaning tank reaches a preset height, performing ultrasonic cleaning on the test piece to be washed and discharging the cleaning liquid in the cleaning tank; wherein the flow rate of discharging the cleaning liquid is less than the flow rate of spraying the cleaning liquid to the test piece to be washed; after the cleaning is completed, emptying the cleaning liquid in the cleaning tank and taking out the test piece to be washed.

11. The semiconductor cleaning method according to claim 10, wherein After the step of covering the cleaning tank with the top cover plate is performed, the following steps are further included: pumping and discharging the gas in the cleaning tank; when the liquid level of the cleaning liquid in the cleaning tank reaches the preset height, controlling the blowing assembly in the semiconductor cleaning device to be close to the test piece to be washed to blow air to the test piece to be washed.

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