Radio frequency chip test seat and radio frequency chip test device

Abstract

This application relates to the field of radio frequency (RF) technology, and more particularly to an RF chip test socket and an RF chip testing device. The RF chip test socket includes: a socket body, a first surface of which has a first mounting groove and a first groove structure, the first mounting groove being used to accommodate a chip to be tested, and the first groove structure communicating with the first mounting groove; and a cover, which is closably connected to the socket body, and when closed, the cover is used to press the chip to be tested into the first mounting groove; wherein, the first surface of the socket body is the surface facing the cover when the cover is closed. This application can effectively improve heat dissipation.

Description

Technical Field

[0001] This application relates to the field of radio frequency technology, and in particular to a radio frequency chip test socket and a radio frequency chip test device. Background Technology

[0002] When testing an RF chip, the chip needs to be placed in a test socket, which is mounted on and electrically connected to a test board. The test board is connected to external testing equipment via an interface. The test signal output from the testing equipment is transmitted sequentially through the test board and the test socket to the chip under test, thereby performing the test on the chip.

[0003] A test socket typically consists of a base and a top cover. The base holds the chip under test (DUT) and is electrically connected to the test board, while the top cover clamps the DUT securely. During reliability testing of high-power chips, the chips generate significant heat, and existing test sockets have inadequate heat dissipation, which can affect chip performance and test results. Utility Model Content

[0004] In view of the above problems, this application provides an RF chip test socket and an RF chip test device to improve the heat dissipation performance of the test socket.

[0005] This application provides an embodiment of an RF chip test socket, including:

[0006] A base body, wherein a first surface of the base body has a first mounting groove and a first groove structure, the first mounting groove being used to accommodate a chip to be tested, and the first groove structure communicating with the first mounting groove; and

[0007] A cover is closable and connected to the base, and when closed, the cover is used to press the chip to be tested into the first mounting slot.

[0008] The first surface of the seat is the surface facing the cover when the cover is closed.

[0009] Optionally, the first groove structure extends along a first direction, and the first groove structure is disposed on both sides of the first mounting groove in the first direction.

[0010] Optionally, the first groove structure includes a first groove extending along a first direction and a second groove extending along a second direction, the first direction and the second direction intersecting each other, the first groove being disposed on both sides of the first mounting groove in the first direction, and the second groove being disposed on both sides of the first mounting groove in the second direction.

[0011] Optionally, the seat is rotatably connected to the cover at one end in the second direction, the first groove is a through groove that penetrates the seat in the first direction, and the second groove is a blind groove that does not penetrate the seat in the second direction.

[0012] Optionally, the seat body includes:

[0013] A first main body portion, the second surface of which has a receiving groove, the first main body portion being made of metal, and the second surface being the surface of the first main body portion facing the cover when the cover is closed; and

[0014] The mounting part is installed in the receiving slot, and the mounting part is made of insulating material;

[0015] The first mounting groove is formed on the third surface of the mounting part, and the third surface is the surface of the mounting part facing the cover when the cover is closed;

[0016] The first groove structure is formed on the second surface of the first main body and the third surface of the mounting part.

[0017] Optionally, the first groove structure includes a first groove segment and a second groove segment. The first groove segment is formed on the second surface of the first main body, and the second groove segment is formed on the third surface of the mounting part. The second groove segment connects the first mounting groove and the first groove segment.

[0018] Optionally, the base is provided with a plurality of first mounting slots at intervals, and the chip to be tested is installed in the first mounting slot one by one;

[0019] The base is also provided with a second groove structure, and multiple first mounting grooves are connected through the second groove structure.

[0020] Optionally, the base is mounted on a test plate;

[0021] The RF chip test socket also includes a probe, which is fixed to the socket body. The first end of the probe extends into the corresponding first mounting slot to electrically connect to the chip under test, and the second end of the probe protrudes from the socket body to electrically connect to the test board.

[0022] Optionally, the inner surface of the cover is provided with a pressing part. When the cover is closed, the fourth surface of the pressing part protrudes toward the base to fix the chip to be tested in the first mounting groove.

[0023] Optionally, the pressing part is provided with a third groove structure, which penetrates the pressing part in a third direction parallel to the fourth surface.

[0024] Optionally, the cover further includes a heat dissipation section, which is connected to the pressing section and protrudes from the outer surface of the cover.

[0025] Optionally, the heat dissipation part and the clamping part are integrally formed.

[0026] Optionally, a heat-conducting groove is formed on the fifth surface of the heat dissipation part, and the fifth surface is the surface of the heat dissipation part away from the base when the cover is closed.

[0027] Optionally, the number of heat-conducting grooves is multiple; the multiple heat-conducting grooves are spaced apart in the fourth direction and penetrate the heat dissipation part along the fifth direction; wherein the fourth direction and the fifth direction intersect.

[0028] Optionally, the cover further includes a second main body, on which a second mounting groove is formed on a sixth surface. The second mounting groove penetrates the second main body in a direction perpendicular to the sixth surface. The sixth surface is the surface of the second main body facing the base when the cover is closed.

[0029] The heat dissipation part is fixed in the second mounting groove, and both ends of the heat dissipation part are exposed in the second mounting groove.

[0030] Optionally, a through hole is provided on the inner surface of the cover body, and the through hole penetrates the cover body in a direction perpendicular to the inner surface of the cover body.

[0031] This application provides an RF chip testing device, including a test board and at least one RF chip test socket provided in any of the above embodiments, wherein the RF chip test socket is disposed on the test board and electrically connected to the test board.

[0032] The RF chip test socket and RF chip test apparatus provided in this application include: a socket body, a first mounting groove and a first groove structure formed on the first surface of the socket body, the first mounting groove being used to accommodate the chip to be tested, and the first groove structure communicating with the first mounting groove; and a cover body, which is closably connected to the socket body, and the cover body, when closed, is used to press the chip to be tested into the first mounting groove; wherein, the first surface of the socket body is the surface facing the cover body when the cover body is closed. Through the above method, the first groove structure formed on the first surface of the socket body is connected to the first mounting groove, which can effectively improve heat dissipation, avoid heat accumulation during testing that could affect chip performance, thereby ensuring that the chip can maintain a stable working state during testing and improving the accuracy of test results. In addition, the first groove structure also facilitates quick placement and removal of the chip to be tested by testers, improving testing efficiency.

[0033] These or other aspects of this application will become more apparent in the following description of the embodiments. Attached Figure Description

[0034] Figure 1 A perspective view of the RF chip test socket in the open state provided in an embodiment of this application is shown.

[0035] Figure 2 It shows Figure 1 The right view shows the RF chip test socket in the open state.

[0036] Figure 3 It shows Figure 1 The image shows a top view of the RF chip test socket with the cover closed.

[0037] Figure 4 It shows Figure 1 The right view shows the RF chip test socket with the cover closed.

[0038] Figure 5 It shows Figure 1 The top view of the RF chip test socket with the cover removed is shown.

[0039] Figure 6 It shows Figure 5 AA sectional view.

[0040] Figure 7 A top view of the RF chip test socket provided in an embodiment of this application with the cover removed is shown.

[0041] Figure 8 A top view of the RF chip test socket provided in an embodiment of this application with the cover removed is shown.

[0042] Figure 9 A top view of the radio frequency chip testing apparatus provided in an embodiment of this application is shown. Detailed Implementation

[0043] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0044] To enable those skilled in the art to better understand the solutions of this application, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0045] In the embodiments of this application, it should be noted that, in this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0046] Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0047] In the description of the embodiments of this application, the words "example" or "for example" are used to indicate exemplification, illustration, or description. Any embodiment or design described as "example" or "for example" in the embodiments of this application is not to be construed as being more preferred or having more advantages than another embodiment or design. The use of the words "example" or "for example" is intended to present relative concepts in a clear manner.

[0048] Furthermore, in the embodiments of this application, "multiple" refers to two or more. Therefore, in the embodiments of this application, "multiple" can also be understood as "at least two". "At least one" can be understood as one or more, such as one, two, or more. For example, including at least one means including one, two, or more, and is not limited to which ones are included. For example, including at least one of A, B, and C, then it could include A, B, C, A and B, A and C, B and C, or A and B and C.

[0049] It should be noted that in the embodiments of this application, "connection" can be understood as electrical connection. The connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components.

[0050] Please refer to Figures 1 to 4 One embodiment of this application provides an RF chip test socket 100, including a socket body 1 and a cover body 2. The first surface 11 of the socket body 1 has a first mounting groove 12 and a first groove structure 13. The first mounting groove 12 is used to accommodate the chip to be tested, and the first groove structure 13 communicates with the first mounting groove 12. The cover body 2 is closably connected to the socket body 1, and when closed, the cover body 2 is used to press the chip to be tested into the first mounting groove 12. The first surface 11 of the socket body 1 is the surface facing the cover body 2 when the cover body 2 is closed.

[0051] In this embodiment, the first groove structure 13 on the first surface 11 of the base 1 is connected to the first mounting groove 12, which can effectively improve the heat dissipation effect and avoid the accumulation of heat during the test, thus ensuring that the chip can maintain a stable working state during the test and improving the accuracy of the test results. In addition, the first groove structure 13 also makes it easier for testers to quickly pick up and put down the chip to be tested, improving the test efficiency.

[0052] In some implementation methods, please refer to Figure 5 and Figure 7 The first slot structure 13 includes a first slot body 131 and a second slot body 132. The first slot body 131 extends along a first direction, and the second slot body 132 extends along a second direction. The first and second directions intersect. The first slot body 131 is located on both sides of the first mounting slot 12 in the first direction, and the second slot body 132 is located on both sides of the first mounting slot 12 in the second direction. In this embodiment, the base 1 has a first slot body 131 and a second slot body 132 extending in different directions, resulting in a larger heat dissipation area and forming a multi-path heat dissipation channel. This allows heat to be conducted simultaneously along multiple different directions, achieving more uniform and rapid heat dissipation, which is suitable for high-power or heat-dissipating chips. In addition, the first slot body 131 and the second slot body 132 provide more dimensional operating space for chip placement and removal, making it easier to handle chips and further improving testing efficiency.

[0053] As an example, the first direction is perpendicular to the second direction, so that the first groove 131 and the second groove 132 form an orthogonal grid-like heat dissipation path, ensuring that the heat of each area of ​​the high-power or heat-dissipating chip is evenly dissipated.

[0054] In some implementation methods, please refer to Figure 8 The first groove structure 13 extends along a first direction and is disposed on both sides of the first mounting groove 12 in the first direction. In this embodiment, the first groove structure 13 extends along a single direction, which has little impact on the strength of the base 1 and is easy to process, reducing the processing cost of the base 1. It is suitable for chips with concentrated heat in one direction.

[0055] It should be noted that in other embodiments, the first groove structure can also be other structures, which can be set according to the actual situation. For example, the first groove structure 13 may include multiple grooves, which can extend in different directions and radiate outward from the edge of the base 1 with the first mounting groove 12 as the center. For example, the multiple grooves can be arranged in a V-shape, Y-shape, or star-shaped manner.

[0056] As one implementation method, please refer to Figure 1The seat 1 is rotatably connected to the cover 2 at one end in the second direction. The first groove 131 is a through groove that penetrates the seat 1 in the first direction, and the second groove 132 is a blind groove that does not penetrate the seat 1 in the second direction.

[0057] In this embodiment, the base 1 and the cover 2 are rotatably connected at one end in the second direction via a rotating connector or similar structure. The second groove 132 is a blind groove that does not penetrate the base 1 in the second direction. The blind groove structure of the second groove 132 is isolated from the rotating connector, and the blind groove structure of the second groove 132 does not affect the fastening effect of the base 1 and the cover 2, thus ensuring not only the reliability of the rotatable connection but also the reliability of the fastening. The first groove 131 is a through groove that penetrates the base 1 in the first direction. This not only ensures heat dissipation but also allows moisture generated by heat to be transferred to the outside of the RF chip test socket 100 through the first groove 131, preventing moisture accumulation and damage to the chip under test.

[0058] As an example, please refer to Figures 1 to 4 The base 1 and the cover 2 are rotatably connected by a pin 3. In some examples, a torsion spring 4 is also fitted over the pin 3. The torsion spring 4 can assist the cover 2 in opening and prevent the cover 2 from being stuck to the base 1, which would prevent the cover 2 from being unable to open.

[0059] It should be noted that this embodiment does not limit the specific structure of the pin and torsion spring; standard models available on the market can be used, or they can be customized as needed, which will not be elaborated here. In other embodiments, the base and cover can also be rotatably connected by other structures or without a torsion spring, which can be set according to the actual situation, and will not be elaborated here.

[0060] As one implementation method, please refer to Figure 3 and Figure 5 The pin 3 is located at the first end of the base 1 in the second direction. The base 1 is provided with a slot 14 at the second end in the second direction. The cover 2 is provided with a buckle 21 that engages with the slot 14. When the cover 2 is closed, the buckle 21 engages with the slot 14, thereby securely fixing the cover 2 and the base 1, preventing the cover 2 from opening accidentally during the test, and further ensuring the test accuracy.

[0061] In some implementation methods, please refer to Figure 1 as well as Figures 5 to 8The base 1 includes a first main body 15 and a mounting part 16. A receiving groove 17 is formed on the second surface 151 of the first main body 15. The first main body 15 is made of metal, and the second surface 151 is the surface of the first main body 15 facing the cover 2 when the cover 2 is closed. The mounting part 16 is installed in the receiving groove 17 and is made of insulating material. A first mounting groove 12 is formed on the third surface 161 of the mounting part 16, which is the surface of the mounting part 16 facing the cover 2 when the cover 2 is closed. A first groove structure 13 is formed on both the second surface 151 of the first main body 15 and the third surface 161 of the mounting part 16.

[0062] In this embodiment, the insulated mounting portion 16 is housed within the metal first main body portion 15, and the chip to be tested is mounted within the mounting portion 16. The mounting portion 16 can isolate the electrical contact between the first main body portion 15 and the chip, thus preventing short circuits. At the same time, the metal first main body portion 15 is not only strong but also has strong anti-aging ability, which can provide stable support for the mounting portion 16 and extend the service life of the base 1.

[0063] In one implementation, the first main body 15 is made of aluminum. The aluminum first main body 15 is lightweight, high-strength, and corrosion-resistant, which can ensure the service life of the base 1. Moreover, the aluminum first main body 15 has a high thermal conductivity, which can effectively and quickly conduct the heat generated during chip testing to the outside, avoiding local overheating that could affect chip performance and further ensuring the accuracy of the test.

[0064] It should be noted that in other embodiments, the first main body can also be made of other metal materials, such as at least one metal or metal alloy such as gold, silver, copper, or tungsten. The specific material can be set according to the actual situation, and will not be elaborated here.

[0065] In some implementation methods, please refer to Figure 1 , Figure 5 , Figure 7 and Figure 8 The first groove structure 13 includes a first groove segment 133 and a second groove segment 134. The first groove segment 133 is formed on the second surface 151 of the first main body portion 15, and the second groove segment 134 is formed on the third surface 161 of the mounting portion 16. The second groove segment 134 connects the first mounting groove 12 and the first groove segment 133. In this embodiment, the first groove segment 133 and the second groove segment 134 are connected to form a through groove, which helps to dissipate heat and moisture.

[0066] In some implementation methods, please refer to Figure 7The base 1 is provided with multiple first mounting slots 12, which are spaced apart. The chips to be tested are installed in the first mounting slots 12 one by one. In this embodiment, the base 1 can accommodate multiple chips to be tested at the same time, thereby enabling simultaneous testing of multiple chips and improving testing efficiency.

[0067] As one implementation method, please refer to Figure 7 The base 1 is also provided with a second groove structure 18, through which multiple first mounting grooves 12 are connected. In this embodiment, the second groove structure 18 connects the heat dissipation paths of each first mounting groove 12 in series, forming a heat dissipation channel connecting multiple first mounting grooves 12. Heat can flow and diffuse rapidly along the heat dissipation channel, ensuring the heat dissipation effect.

[0068] In some embodiments, the base 1 is mounted on such a Figure 9 The test board 200 is shown below. Please refer to... Figure 5 and Figure 6 The RF chip test socket 100 also includes a probe 19, which is fixed to the socket 1. The first end of the probe 19 extends into the corresponding first mounting slot 12 to electrically connect to the chip under test, and the second end of the probe 19 protrudes from the socket 1 to electrically connect to the test board 200. After the chip under test is installed into the socket 1, the test board 200 is electrically connected to the chip under test via the probe 19. The test signal output by the test equipment is transmitted sequentially through the internal circuitry of the test board 200 and the probe 19 to the corresponding port of the chip under test. The test data output by the chip is transmitted sequentially through the probe 19 and the test board 200 to the test equipment.

[0069] In some implementation methods, please refer to Figure 1 and Figure 2 The inner surface of the cover 2 is provided with a pressing part 22. When the cover 2 is closed, the fourth surface 221 of the pressing part 22 protrudes towards the base 1, and the pressing part 22 can fix the chip to be tested in the first mounting groove 12, thereby preventing the chip from moving during the test and ensuring effective electrical connection between the probe 19 and the chip to be tested. The inner surface of the cover 2 is the surface facing the base 1 when closed, and the outer surface of the cover 2 is the surface opposite to the inner surface of the cover 2.

[0070] As one implementation method, please refer to Figure 1 and Figure 2 The clamping part 22 has a third groove structure 23, which penetrates the clamping part 22 in a third direction parallel to the fourth surface 221. When the clamping part 22 presses against the chip to be tested, the heat generated by the chip can be dissipated through the third groove structure 23, further improving the heat dissipation effect of the RF chip test socket 100.

[0071] In some implementation methods, please refer to Figures 1 to 4 The cover 2 also includes a heat dissipation part 24, which is connected to the pressing part 22 and protrudes from the outer surface of the cover 2.

[0072] In this embodiment, the heat dissipation part 24 is connected to the clamping part 22, and the heat generated by the chip can be conducted to the outside of the RF chip test socket 100 through the clamping part 22 and the heat dissipation part 24 in sequence. Moreover, the heat dissipation part 24 protrudes from the outer surface of the cover 2, increasing the contact area between the heat dissipation part 24 and the outside air, further ensuring the heat dissipation effect.

[0073] As one implementation method, the heat dissipation part 24 and the clamping part 22 are integrally formed, which avoids stress concentration problems at the connection interface such as threaded connections in split structures, ensuring the connection stability between the heat dissipation part 24 and the clamping part 22. Furthermore, the integral forming of the heat dissipation part 24 and the clamping part 22 means that they are tightly fitted without gaps, allowing the heat generated by the chip to be directly conducted along the interior of the integral structure to the outside of the RF chip test socket 100, effectively improving heat transfer efficiency. In addition, the integral forming of the heat dissipation part 24 and the clamping part 22 eliminates the need for assembly, simplifying the manufacturing process of the RF chip test socket 100, reducing manufacturing costs, and ensuring the dimensional accuracy of the heat dissipation part 24 and the clamping part 22.

[0074] As an example, the heat dissipation part 24 and the clamping part 22 are made of copper. Copper has a high thermal conductivity, which can quickly conduct the heat generated by the chip from the clamping part 22 to the heat dissipation part 24 and then to the outside of the RF chip test socket 100, thereby improving the heat dissipation efficiency.

[0075] In one implementation, the heat dissipation part 24 can be a solid structure. A solid heat dissipation part 24 not only has high overall strength, but also has no gaps inside the solid structure, so heat can be directly conducted along the interior of the heat dissipation part 24 to the surface of the heat dissipation part 24, ensuring heat dissipation efficiency.

[0076] As one implementation method, please refer to Figures 1 to 4 A heat-conducting groove 25 is provided on the fifth surface 241 of the heat dissipation part 24. The fifth surface 241 is the surface of the heat dissipation part 24 away from the base 1 when the cover 2 is closed. The heat-conducting groove 25 is provided on the surface of the heat dissipation part 24 away from the base 1, which increases the contact area between the heat dissipation part 24 and the air, so that heat can be transferred to the surrounding air through the surface of the heat-conducting groove 25 more fully.

[0077] As an example, please refer to Figures 1 to 4The heat-conducting grooves 25 are multiple, which can further increase the contact area between the heat dissipation part 24 and the air. The multiple heat-conducting grooves 25 are spaced apart in the fourth direction and extend through the heat dissipation part 24 along the fifth direction, wherein the fourth and fifth directions intersect. In some examples, when the cover 2 is closed, the fourth and second directions are parallel, and the fifth and first directions are parallel; or, when the cover 2 is closed, the fourth and first directions are parallel, and the fifth and second directions are parallel.

[0078] In some implementation methods, please refer to Figure 1 The cover 2 also includes a second main body 26. A second mounting groove 27 is formed on the sixth surface 261 of the second main body 26. The second mounting groove 27 penetrates the second main body 26 in a direction perpendicular to the sixth surface 261. The sixth surface 261 is the surface of the second main body 26 facing the base 1 when the cover 2 is closed. The heat dissipation part 24 is fixed in the second mounting groove 27, and both ends of the heat dissipation part 24 are exposed in the second mounting groove 27.

[0079] In some implementation methods, please refer to Figure 1 The inner surface of the cover 2 has a through hole 28, which penetrates the cover 2 in a direction perpendicular to the inner surface of the cover 2. When the cover 2 is closed, the heat generated by the chip and the moisture generated by the heat can be discharged to the outside of the RF chip test socket 100 through the through hole 28, which helps to dissipate heat and moisture. As an example, the through hole 28 penetrates the pressing part 22 and the heat dissipation part 24 in a direction perpendicular to the inner surface of the cover 2.

[0080] In one implementation, a temperature probe for detecting temperature can be inserted into the through-hole 28 to measure the temperature of the chip under test.

[0081] Please refer to Figure 9 This application provides an RF chip testing device 1000, including a test board 200 and at least one RF chip test socket 100 provided in any of the above embodiments. The RF chip test socket 100 is disposed on the test board 200 and is electrically connected to the test board 200.

[0082] In this embodiment, the first groove structure 13 on the first surface 11 of the base 1 is connected to the first mounting groove 12, which can effectively improve the heat dissipation effect and avoid the accumulation of heat during the test, thus ensuring the performance of the chip and enabling the chip to maintain a stable working state during the test, thereby improving the accuracy of the test results. In addition, the first groove structure 13 also facilitates the test personnel to quickly pick up and put down the chip to be tested, improving the test efficiency.

[0083] The above description is merely an embodiment of this application. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this application, but these improvements all fall within the protection scope of this application.

Claims

1. A radio frequency chip test socket, characterized by, include: The base has a first mounting groove and a first groove structure on its first surface. The first mounting groove is used to accommodate the chip to be tested, and the first groove structure is connected to the first mounting groove. and A cover is closable and connected to the base, and when closed, the cover is used to press the chip to be tested into the first mounting slot. The first surface of the seat is the surface facing the cover when the cover is closed.

2. The radio frequency chip test socket of claim 1, wherein, The first groove structure extends along a first direction and is disposed on both sides of the first mounting groove in the first direction.

3. The radio frequency chip test socket of claim 1, wherein, The first groove structure includes a first groove extending along a first direction and a second groove extending along a second direction. The first direction and the second direction intersect. The first groove is disposed on both sides of the first mounting groove in the first direction, and the second groove is disposed on both sides of the first mounting groove in the second direction.

4. The radio frequency chip test socket of claim 3, wherein, The seat is rotatably connected to the cover at one end in the second direction. The first groove is a through groove that penetrates the seat in the first direction, and the second groove is a blind groove that does not penetrate the seat in the second direction.

5. The radio frequency chip test socket of claim 1, wherein, The seat body includes: A first main body portion, the second surface of which has a receiving groove, the first main body portion being made of metal, and the second surface being the surface of the first main body portion facing the cover when the cover is closed; and The mounting part is installed in the receiving slot, and the mounting part is made of insulating material; The first mounting groove is formed on the third surface of the mounting part, and the third surface is the surface of the mounting part facing the cover when the cover is closed; The first groove structure is formed on the second surface of the first main body and the third surface of the mounting part.

6. The radio frequency chip test socket of claim 5, wherein, The first groove structure includes a first groove segment and a second groove segment. The first groove segment is formed on the second surface of the first main body, and the second groove segment is formed on the third surface of the mounting part. The second groove segment connects the first mounting groove and the first groove segment.

7. The RF chip test socket as described in claim 1, characterized in that, The base is provided with a plurality of first mounting slots at intervals, and the chip to be tested is installed in the first mounting slot one by one; The base is also provided with a second groove structure, and multiple first mounting grooves are connected through the second groove structure.

8. The RF chip test socket as described in claim 1, characterized in that, The base is mounted on the test board; The RF chip test socket also includes a probe, which is fixed to the socket body. The first end of the probe extends into the corresponding first mounting slot to electrically connect to the chip under test, and the second end of the probe protrudes from the socket body to electrically connect to the test board.

9. The RF chip test socket as described in claim 1, characterized in that, The inner surface of the cover is provided with a pressing part. When the cover is closed, the fourth surface of the pressing part protrudes toward the base to fix the chip to be tested in the first mounting groove.

10. The RF chip test socket as described in claim 9, characterized in that, The pressing part is provided with a third groove structure, which penetrates the pressing part in a third direction parallel to the fourth surface.

11. The RF chip test socket as described in claim 9, characterized in that, The cover also includes a heat dissipation section, which is connected to the pressing section and protrudes from the outer surface of the cover.

12. The RF chip test socket as described in claim 11, characterized in that, The heat dissipation part and the clamping part are integrally formed.

13. The RF chip test socket as described in claim 11, characterized in that, A heat-conducting groove is formed on the fifth surface of the heat dissipation part, and the fifth surface is the surface of the heat dissipation part away from the base when the cover is closed.

14. The RF chip test socket as described in claim 13, characterized in that, The number of heat-conducting grooves is multiple; the multiple heat-conducting grooves are spaced apart in the fourth direction and penetrate the heat dissipation part along the fifth direction; wherein, the fourth direction and the fifth direction intersect.

15. The RF chip test socket as described in claim 11, characterized in that, The cover also includes a second main body, on which a second mounting groove is formed on a sixth surface. The second mounting groove penetrates the second main body in a direction perpendicular to the sixth surface. The sixth surface is the surface of the second main body facing the base when the cover is closed. The heat dissipation part is fixed in the second mounting groove, and both ends of the heat dissipation part are exposed in the second mounting groove.

16. The RF chip test socket as described in claim 1, characterized in that, A through hole is provided on the inner surface of the cover body, and the through hole penetrates the cover body in a direction perpendicular to the inner surface of the cover body.

17. A radio frequency chip testing device, characterized in that, It includes a test board and at least one radio frequency chip test socket as described in any one of claims 1-16, wherein the radio frequency chip test socket is disposed on the test board and electrically connected to the test board.

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