Chip wireless test seat
The chip wireless testing seat addresses single-chip testing limitations by enabling dual-chip wireless communication and efficient signal transmission, enhancing precision and reducing costs through a closed cavity design and low-loss materials.
Patent Information
- Application Number
- CN202422103743.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-08-29
AI Technical Summary
The existing chip test base can only accommodate one chip and cannot simulate a test environment where dual chips work, resulting in large signal transmission losses, high delays, low test accuracy, and high production costs.
A chip wireless test base is designed, including a closed test cavity and wireless connection assembly, which uses wireless communication between the two test boards and a board-to-board mezzanine connector to achieve electrical connection, reduce signal loss, improve transmission rate, and uses a low dielectric constant material indenter and an aluminum base to reduce signal interference.
It realizes efficient and low-loss signal transmission in a simulated dual-chip test environment, improves test accuracy and speed, reduces production costs, and adapts to the market demand of high-frequency and high-speed signal transmission and intelligent automation.
Smart Images
Figure CN223107985U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a wireless test socket for chips, belonging to the technical field of chip aging test equipment. Background Art
[0002] A chip test socket, also known as an IC test socket or a DUT (Device Under Test) socket, is a product used to test IC chips. It can provide a reliable and repeatable test environment to ensure that the functions and performances of chips meet the design requirements. During the production process, the test socket is used to check whether the pins, functions, and performances of chips meet the specifications.
[0003] A radio frequency chip is an integrated circuit that can convert electrical signals into radio frequency signals or convert radio frequency signals into electrical signals. It mainly consists of two parts: a radio frequency front-end module and a radio frequency signal processing module. Among them, the radio frequency front-end module is mainly responsible for receiving and transmitting radio frequency signals; the radio frequency signal processing module is mainly responsible for processing and decoding radio frequency signals.
[0004] The test principle during radio frequency chip testing is that the chip to be tested is placed in a test device, and a supporting chip is provided in the test device to test the reception, transmission, processing, and decoding of radio frequency signals of the chip to be tested. The existing chip test sockets mainly consist of a guide frame, a body, probes, a PCB, and a manual test cover assembly. During chip testing, only one chip can be accommodated in the existing test socket, resulting in an inability to simulate a test environment for dual-chip operation. Only a conventional chip test socket can be used for chip signal testing. During testing, the chip to be tested is inserted into the test socket, and the test socket will make electrical connections to the pins of the chip and send test signals to the chip. Then, the test socket will read the output signals of the chip and transmit these signals to the test device for analysis. In this way, it can be determined whether the functions and performances of the chip meet the specifications. Using such a test method, the transmission of chip test signals can only be connected through physical wires, resulting in excessive loss of test signals during transmission and a problem of high transmission signal delay, leading to a low accuracy of chip test results. Therefore, there is an urgent need for a wireless test socket for chips to solve the problems in the prior art that when testing radio frequency chips, the existing single-chip test socket cannot simulate a test environment for dual-chip operation, resulting in a single transmission path for the existing test socket, signals relying on physical connections, high production costs of the test socket, large loss of test signals, high delay, and low test accuracy. Summary of the Utility Model
[0005] The purpose of the utility model is to provide a wireless test socket for chips to solve the problems raised in the above background art.
[0006] To achieve the above object, the present utility model provides the following technical solutions: A wireless test socket for a chip, comprising a test socket and a non-wired connection component. The test socket internally has a closed test cavity. Inside the test cavity, there are two opposite test boards. One of the two test boards is provided with a chip mounting groove for placing the chip to be tested, forming the main test board, and the other test board is provided with a matching chip, forming the sub-test board. Wireless communication components are respectively provided on the two test boards, and wireless communication is formed between the two chips, and the two test boards are electrically connected through the non-wired connection component.
[0007] Specifically, the test socket includes an upper cover, a base, and a pressing head; the base is provided with an installation cavity, and the base is installed on the main test board mounting groove through the installation cavity, and the upper cover covers the base, and a closed test cavity is formed among the three; the sub-test board is installed on the side of the upper cover facing the base, and a pressing head is fixedly installed on the upper cover between the sub-test board and the main test board; one end of the pressing head extends towards the main test board direction, forming a abutting end.
[0008] Specifically, test probes are provided in the mounting groove of the main test board. The chip to be tested is placed in the mounting groove and abuts against the main test board through the abutting end of the pressing head, forming an electrical connection with the test probes of the main test board.
[0009] Specifically, the non-wired connection component includes a board-to-board sandwiched connector; the main test board is electrically connected to the sub-test board through the board-to-board sandwiched connector; the upper connecting board of the board-to-board sandwiched connector is electrically connected to the sub-test board, and the lower connecting board is electrically connected to the main test board.
[0010] Specifically, connection probes and an intermediate transition test board are provided between the upper connecting board and the sub-test board; the intermediate transition test board is fixedly installed on the upper connecting board, and an electrical connection is formed between the two; the connection probes are installed on the intermediate transition test board, and the intermediate transition test board is electrically connected to the sub-test board through the connection probes.
[0011] Specifically, the number of the board-to-board sandwiched connectors is two, and the two board-to-board sandwiched connectors are oppositely installed on both sides of the base, and both ends of the two board-to-board sandwiched connectors are respectively electrically connected to the main test board and the sub-test board.
[0012] Specifically, an installation groove is formed at a position on the pressing head corresponding to the matching chip of the sub-test board for accommodating the matching chip.
[0013] Specifically, the pressing head is made of a material with a low dielectric constant.
[0014] Specifically, the base is made of aluminum material.
[0015] Specifically, both sides of the upper cover are snap-connected to the base through hinge members, and a snap is provided at the other end away from the hinge point. When the upper cover covers the base, it forms a snap connection with the base and becomes an integrated body through the snap.
[0016] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0017] 1. In this application, a test base with a closed test cavity is provided. Two test boards are arranged in the test cavity to place the chip to be tested and the matching chip, so as to simulate a dual-chip test environment. At the same time, two opposite test boards are provided in the test cavity of this application. One of the two test boards is provided with a chip installation groove for placing the chip to be tested, forming a main test board, and the other test board is provided with a matching chip, forming a sub-test board. Wireless communication components are respectively provided on the two test boards, and wireless communication is formed between the two chips to realize the test of receiving and transmitting radio frequency signals for the chip to be tested and processing and decoding the radio frequency signals, thereby improving the test rate. In addition, in this application, a wire-free connection component is provided to realize the electrical connection between the two test boards, so as to solve the problems of high manufacturing cost, large transmission signal loss, and high delay when the existing test base conducts tests, where the transmitted signal can only be physically connected.
[0018] 2. On the basis of the above, the wire-free connection component of this application includes a board-to-board interposer and an intermediate transition test board to realize the electrical connection between the two test boards, ensure the efficient transmission of the transmitted signal, reduce the transmission loss, and also improve the signal transmission rate.
[0019] 3. On the basis of the above, the main test board of the test base of this application is electrically connected to the chip to be tested through the setting of probes, and a connection probe is provided between the main test board and the intermediate transition test board for electrical connection, so as to ensure small transmission signal loss and stable electrical connection contact. In particular, the main test board and the chip to be tested are connected by setting the pressing head to abut, which not only ensures the firmness of the connection but also enables the chip to be tested to be quickly clamped, facilitating the rapid detection of the chip and improving the test rate. In addition, since the pressing head is located between the two chips, in order to reduce the interference and loss of the pressing head on the wireless signal transmission, the pressing head of this application is made of a material with a low dielectric constant, so that the signal transmission is efficient and stable.
[0020] 4. On the basis of the above, the base of this application is made of aluminum material, so that the closed test cavity formed by the upper cover, the base and the main test board forms a test environment with low signal interference, so as to ensure the efficient, low-loss and low-interference transmission of wireless signals, provide a good signal transmission channel for chip testing, realize high signal transmission efficiency, low delay, and improve the test accuracy.
[0021] 5. On the basis described above, the upper cover and the base of the test socket of the present application are connected by snap fasteners, achieving a compact structure design of the test socket, with many integrated modules, which can effectively save the space occupation ratio and reduce costs. Description of the Drawings
[0022] Figure 1 Schematic structural diagram of the wireless test socket for chips in the embodiment;
[0023] Figure 2 Schematic structural diagram of the base of the wireless test socket for chips in the embodiment;
[0024] Figure 3 Cross-sectional view of the structure of the wireless test socket for chips in the embodiment. Detailed Embodiment
[0025] In order to make the purpose and advantages of the present utility model clearer, the present utility model will be specifically described below in conjunction with embodiments. It should be understood that the following text is only used to describe one or several specific implementation manners of the present utility model, and does not strictly limit the scope of protection specifically claimed by the present utility model.
[0026] Please refer to Figures 1 - 3 , a wireless test socket for chips, including a test socket and a non-wired connection component. A sealed test cavity is provided inside the test socket. There are two opposite test boards in the test cavity. One of the two test boards is provided with a chip installation groove for placing the chip 40 to be tested, constituting the main test board 4. The other test board is provided with a supporting chip 50, constituting the auxiliary test board 5. Wireless communication components are respectively provided on the two test boards, and wireless communication is formed between the two chips, and the two test boards are electrically connected through the non-wired connection component.
[0027] The test socket of this embodiment includes an upper cover 1, a base 2 and a pressure head 3; the base 2 is provided with an installation cavity, and the base is installed on the main test board installation groove through the installation cavity. The two sides of the upper cover 1 are snap-connected to the base through a hinge 6, and a snap fastener is provided at the other end far from the hinge point. When the upper cover covers the base, it is snap-connected to the base to form a whole, and a sealed test cavity is formed among the three; the auxiliary test board 5 is installed on the side of the upper cover facing the base, and a pressure head 3 is fixedly installed on the upper cover between the auxiliary test board 5 and the main test board 4; one end of the pressure head extends towards the main test board direction to form a abutting end. And the pressure head of this embodiment is made of a material with a low dielectric constant to reduce the wireless signal interference between the two chips. At the same time, the base of this embodiment is made of an aluminum material, which not only improves the bearing strength of the test socket, but also provides a sealed, low-interference and high-transmission test environment.
[0028] Furthermore, a test probe 7 is provided in the installation groove of the main test board 4 of this embodiment. The chip to be tested is placed in the installation groove and abuts against the main test board through the pressing head abutting end, forming an electrical connection with the test probe of the main test board.
[0029] The wire-free connection component of this embodiment includes a board-to-board mezzanine connector 8; the main test board 4 is electrically connected to the secondary test board 5 through the board-to-board mezzanine connector 8; the upper connecting board of the board-to-board mezzanine connector is electrically connected to the secondary test board, and the lower connecting board is electrically connected to the main test board. In addition, a connection probe 9 and an intermediate transition test board 10 are provided between the upper connecting board and the secondary test board of this embodiment; the intermediate transition test board 10 is fixedly installed on the upper connecting board and forms an electrical connection therebetween; the connection probe 9 is installed on the intermediate transition test board, and the intermediate transition test board is electrically connected to the secondary test board 5 through the connection probe. The number of board-to-board mezzanine connectors in this embodiment is two, and the two board-to-board mezzanine connectors are oppositely installed on both sides of the base, and both ends of the two board-to-board mezzanine connectors are electrically connected to the main test board and the secondary test board respectively.
[0030] Considering that the pressing head of this embodiment is located between the supporting chip and the chip to be tested, in order to avoid the installation conflict of the pressing head with the supporting chip, an installation groove is provided at the position of the pressing head corresponding to the supporting chip of the secondary test board, for accommodating the supporting chip.
[0031] Working principle: When the wireless test socket for chips of this embodiment is in use, the operator first solders the supporting chip at the top on the secondary test board of the upper cover, and then uses screws to pass through the secondary test board and lock the pressing head to the upper cover, thus completing the installation of the main components of the upper cover. Then the operator assembles the base components. The main test board at the bottom serves as the bearing board of the test socket, and all components are installed on it. In the middle area of the main test board at the bottom, there is an installation groove for placing the chip to be tested, and a probe is provided in the installation groove for making an electrical connection with the chip to be tested. The operator installs the base made of aluminum material on the main test board at the bottom, then installs board-to-board mezzanine connectors on the main test boards on both sides of the base respectively, and welds the intermediate transition test board on the upper part of the board-to-board mezzanine connectors. At the same time, connection probes are installed on both sides of the top of the base for the electrical connection between the intermediate transition test board and the secondary test board. In this way, two wire-free connection channels will be formed between the main test board and the secondary test board. After completing the installation of the components of the test socket, finally the operator makes an electrical connection between the external test equipment and the main test board.
[0032] When working, the test signal of the test equipment starts from the main test board at the bottom, and is transmitted to the chip to be tested through the test probe. The chip to be tested outputs a wireless signal according to the test signal. The wireless signal is transmitted to the supporting chip in the closed test cavity. After the supporting chip receives the signal, it outputs a feedback signal. Then the feedback signal is transmitted to the intermediate transition test board through the wireless connection channel on both sides, that is, through the connection probes on both sides, and then transmitted back to the main test board by the board-to-board interlayer connector to complete the transmission of a signal loop. Finally, the test equipment performs signal analysis to test the performance of the chip to be tested. Since the output wireless signal of the chip to be tested is transmitted in the closed test cavity, and the pressure head is also in the test cavity, in order to reduce the interference of the pressure head to the wireless signal, the pressure head of the present embodiment is made of a material with a low dielectric constant to ensure low-loss and low-interference transmission of the wireless signal. In addition, the feedback signal of the present embodiment is transmitted through the connection probe, the intermediate transition test board and the board-to-board interlayer connector, which is efficient and low-latency, provides a good signal transmission channel for chip testing, and improves chip testing accuracy.
[0033] The chip wireless test socket of this embodiment has the following development trends under the application requirements of the future market that the test socket has intelligence and integration: 1) High-frequency and high-speed signal transmission: With the development of 5G and high-speed data transmission technology, the requirements for high-frequency and high-speed signal transmission capabilities of chip test sockets are getting higher and higher. The chip wireless test socket will develop in the direction of supporting higher frequencies and faster data transmission. 2) Higher integration: The increased integration means that the chip test socket needs to have higher precision and smaller size. 3) Automation and intelligence: With the development of artificial intelligence technology, the chip wireless test socket will introduce more intelligent and automated elements to further improve test efficiency and accuracy and reduce errors caused by human operation. 4) Reproducibility and consistency: Ensuring the reproducibility and consistency of each test is a major concern of the chip test socket. New designs and materials will be used in the manufacture of test sockets to further improve the reliability of test results. As a bridge connecting semiconductor chips and test equipment, the chip wireless test socket plays a vital role in the entire semiconductor production test process.
[0034] The implementation methods of the utility model are described in detail above in conjunction with the embodiments, but the utility model is not limited to the above-mentioned implementation methods. For ordinary technicians in this technical field, after knowing the contents recorded in the utility model, they can make several equivalent changes and substitutions thereto without departing from the principle of the utility model. These equivalent changes and substitutions should also be regarded as belonging to the protection scope of the utility model.
Claims
1. A wireless test socket for a chip, comprising a test socket and a wire-free connection component, characterized in that: The interior of the test socket is provided with a closed test cavity. Inside the test cavity, there are two opposite test boards. One of the two test boards is provided with a chip installation groove for placing the chip to be tested, forming the main test board, and the other test board is provided with a matching chip, forming the auxiliary test board. Wireless communication components are respectively arranged on the two test boards, wireless communication is formed between the two chips, and the two test boards are electrically connected through a wireless connection component.
2. The wireless test socket for a chip according to claim 1, characterized in that: The test socket includes an upper cover, a base, and a pressing head; the base is provided with an installation cavity, the base is installed on the main test board installation groove through the installation cavity, and the upper cover covers the base, and a closed test cavity is formed among the three; the auxiliary test board is installed on the side of the upper cover facing the base, and the pressing head is fixedly installed on the upper cover between the auxiliary test board and the main test board; one end of the pressing head extends towards the main test board direction to form a abutting end.
3. The wireless test socket for a chip according to claim 2, characterized in that: Test probes are arranged in the installation groove of the main test board. The chip to be tested is placed in the installation groove and abuts against the main test board through the abutting end of the pressing head, and is electrically connected to the test probes of the main test board.
4. A wireless test socket for a chip according to claim 2, characterized in that: The wireless connection component includes a board-to-board sandwiched connector; the main test board is electrically connected to the auxiliary test board through the board-to-board sandwiched connector; the upper connecting board of the board-to-board sandwiched connector is electrically connected to the auxiliary test board, and the lower connecting board is electrically connected to the main test board.
5. The wireless test socket for a chip according to claim 4, characterized in that: A connecting probe and an intermediate transition test board are arranged between the upper connecting board and the auxiliary test board; the intermediate transition test board is fixedly installed on the upper connecting board, and an electrical connection is formed between the two; the connecting probe is installed on the intermediate transition test board, and the intermediate transition test board is electrically connected to the auxiliary test board through the connecting probe.
6. The wireless test socket for a chip according to claim 4, characterized in that: The number of the board-to-board sandwiched connectors is two. The two board-to-board sandwiched connectors are oppositely installed on both sides of the base, and both ends of the two board-to-board sandwiched connectors are electrically connected to the main test board and the auxiliary test board respectively.
7. The wireless test socket for a chip according to claim 2, characterized in that: An installation groove is formed at a position on the pressing head corresponding to the matching chip of the auxiliary test board for accommodating the matching chip.
8. The wireless test socket for a chip according to claim 2, characterized in that: The pressing head is made of a material with a low dielectric constant.
9. The wireless test socket for a chip according to claim 2, characterized in that: The base is made of an aluminum material.
10. The wireless test socket for a chip according to claim 2, wherein: Both sides of the upper cover are snap-connected to the base through hinge parts, and a snap is provided at the other end far away from the hinge point. When the upper cover covers the base, it is snap-connected to the base as a whole through the snap.