Liquid cooling pipeline cooling device and energy storage device
By using a liquid-cooled pipeline cooling device in the energy storage container system and utilizing the sleeve and fin structure for heat exchange, the problem of low cooling efficiency of the high-pressure box is solved, achieving efficient heat conduction and dissipation, and extending the service life of the high-pressure box.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIAOGAN CORNEX NEW ENERGY INNOVATION TECHNOLOGY CO LTD
- Filing Date
- 2025-06-12
- Publication Date
- 2026-06-19
Smart Images

Figure CN224384322U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of energy storage system technology, and in particular to a liquid cooling pipeline cooling device and an energy storage device. Background Technology
[0002] With the rapid development and application of the energy storage industry, fires involving energy storage container systems are frequent. This is because energy storage systems undergo electrical energy conversion and chemical processes during operation, generating a large amount of heat. If this heat cannot be dissipated effectively and promptly, the high temperature will accelerate the internal chemical reactions of the battery, creating a vicious cycle that can lead to thermal runaway. Investigations into the causes of these fires reveal that many originate from uncontrolled battery thermal management, making cooling design paramount.
[0003] Currently, conventional energy storage container battery compartments cool the PACK packs through coolant circulation, such as the novel thermally conductive lithium battery cooling plate disclosed in Chinese patent CN111224192A. However, current cooling systems typically cannot cool the high-voltage box inside the battery compartment. Since the high-voltage box contains numerous electrical components and copper busbar connectors, many of which are prone to heat generation, prolonged high-temperature operation can affect the overall lifespan of the high-voltage box, and the released heat can also impact the PACK, causing excessively high temperatures in the PACK near the high-voltage box. Currently, the conventional cooling methods for the high-voltage box are natural cooling or internal fan cooling, which are relatively traditional and have low heat dissipation efficiency. Utility Model Content
[0004] In view of this, this utility model proposes a liquid cooling pipeline cooling device and an energy storage device to solve the problem that the current conventional cooling methods for high-pressure boxes are natural cooling or internal fan cooling, which are relatively traditional and have low heat dissipation efficiency.
[0005] The technical solution of this utility model is implemented as follows: This utility model provides a liquid cooling pipeline cooling device, including a sleeve sleeved on the liquid cooling pipe; a plurality of fins arranged on the sleeve along the extension direction of the sleeve; a first thermal pad; wherein, the fins are spaced apart, one end of each fin is disposed on the sleeve and the other end extends radially along the sleeve, and the surface of the fin is parallel to the radial section of the sleeve; the first thermal pad is simultaneously laid across and attached to the free ends of the plurality of fins, and the surface of the first thermal pad away from the fins abuts against the surface of the heating element.
[0006] Based on the above technical solutions, preferably, the sleeve includes a base and a cover; the base and the cover form a sleeve and clamp the liquid cooling pipe.
[0007] More preferably, the two sides of the cover are provided with side plates extending toward the base, and the side plates are tightly attached to the side of the base and connected to the side of the base by fastening bolts.
[0008] In a further preferred embodiment, the side plate has a locking block on the surface facing the base, and the base has a locking groove. The locking groove and the locking block are configured to cooperate and restrict the side plate from moving relative to the base along the sleeve axis.
[0009] More preferably, it also includes a second thermal pad, which is laid on the contact surface between the base and the liquid cooling pipe and on the contact surface between the housing and the liquid cooling pipe.
[0010] More preferably, the surfaces of the base and the cover where the second thermal pad is located are both provided with grooves, and the second thermal pad is placed in the grooves.
[0011] Based on the above technical solutions, preferably, each fin has a groove on its free end edge, and the first thermal pad is simultaneously inserted into several grooves.
[0012] Based on the above technical solutions, preferably, a number of through holes are spaced apart on the surface of the fins, and the through holes of each fin are aligned with each other.
[0013] Based on the above technical solutions, preferably, several notches are provided at intervals on both sides of the fin, and the notches of each fin are aligned with each other.
[0014] On the other hand, the energy storage device of this utility model includes a liquid cooling pipe, a heating element, and the aforementioned liquid cooling pipe cooling device. The liquid cooling pipe cooling device is disposed between the liquid cooling pipe and the heating element. The liquid cooling pipe cooling device is in contact with both the liquid cooling pipe and the heating element and is used for heat conduction between the liquid cooling pipe and the heating element.
[0015] The liquid cooling pipeline cooling device and energy storage device of this utility model have the following advantages over the prior art:
[0016] (1) This utility model provides a sleeve with finned assembly on the liquid cooling pipe. The finned assembly contacts the heating component as a heat conduction device to enable heat exchange between the heating component and the liquid cooling pipe, thereby achieving cooling and heat dissipation of the heat-generating module in the high-pressure box through liquid cooling heat conduction, and maximizing the use of coolant to improve heat dissipation effect.
[0017] (2) The present invention sets the base and the cover to form a sleeve, which can effectively clamp the liquid cooling pipe for heat conduction, and by adjusting the thickness of the second heat conduction pad, the cooling device can be adapted to the needs of liquid cooling pipes with different diameters.
[0018] (3) The present invention provides through holes on the surface of the fins and notched holes on the side of the fins, and the through holes and notched holes on each fin are aligned with each other. On the one hand, it increases the contact area between the fins and the external environment, which helps to improve the heat dissipation efficiency. On the other hand, it enables the airflow to quickly convect between adjacent fins through the through holes and notched holes, which also helps to improve the heat dissipation efficiency. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a perspective view of the liquid cooling pipeline cooling device of this utility model;
[0021] Figure 2 This is an exploded perspective view of the liquid cooling pipeline cooling device of this utility model;
[0022] Figure 3 This is a side view of the liquid cooling pipeline cooling device of this utility model;
[0023] Figure 4 This is a front view of the liquid cooling pipeline cooling device of this utility model.
[0024] In the diagram: 1. Sleeve; 11. Base; 12. Cover; 13. Side plate; 14. Locking block; 101. Locking groove; 102. Groove; 2. Fin; 201. Embedded groove; 202. Through hole; 203. Notched hole; 3. First thermal pad; 4. Second thermal pad; 5. Liquid cooling pipe; 6. Heating component. Detailed Implementation
[0025] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.
[0026] like Figure 1 As shown, combined with Figure 4 The present invention provides a liquid cooling pipeline cooling device, comprising a sleeve 1, fins 2 and a first thermal pad 3.
[0027] The sleeve 1 is fitted onto the liquid cooling pipe 5. The sleeve 1 serves two purposes: firstly, it fixes the cooling device onto the liquid cooling pipe 5; secondly, it fits tightly against the entire outer circumference of the liquid cooling pipe, thus effectively conducting and dissipating heat without wasting the cooling capacity of the liquid cooling pipe. The sleeve 1 is a metal cylinder.
[0028] Several fins 2 are arranged on the sleeve 1 along its extending direction; the fins 2 are metal sheets. The fins 2 are spaced apart, with one end of each fin 2 positioned on the sleeve 1 and the other end extending radially along the sleeve 1. The surface of the fin 2 is parallel to the radial cross-section of the sleeve 1. Each fin 2 is in contact with the heating element 6 and serves as the main area for heat conduction and exchange. Therefore, the thinner the fins 2 and the greater their number, the better the heat conduction performance.
[0029] The first thermal pad 3 is simultaneously applied across the free ends of several fins 2, with the surface of the first thermal pad 3 away from the fins 2 abutting against the surface of the heating element 6. The first thermal pad 3 can be a silicone thermal pad or an aluminum nitride thermal pad, the thermal conductivity of which is suitable for low-to-medium power electronic devices and high-power electronic devices, respectively, and can be replaced as needed. By using the first thermal pad 3 to achieve contact between the ends of the fins 2 and the heating element 6, not only can the high thermal conductivity of the thermal pad be utilized to improve heat dissipation efficiency, but the first thermal pad 3 also acts as an elastic buffer, preventing damage to the fins 2 when the heating element 6 comes into direct contact with the thinner fins 2.
[0030] exist Figure 2 In a preferred embodiment shown, in order to facilitate the installation of the sleeve 1 onto the liquid cooling pipe 5, the sleeve 1 includes a base 11 and a cover 12.
[0031] Since the liquid cooling pipe 5 is usually a circular pipe, the base 11 and the cover 12 form a sleeve 1 to clamp the liquid cooling pipe 5. The upper surface of the base 11 is a concave arc surface, while the cover 12 is a semi-cylindrical body. The two form a hollow cylindrical sleeve 1; the fins 2 are generally arranged on the back of the cover 12.
[0032] exist Figure 2 In a preferred embodiment shown, side plates 13 are provided on both sides of the cover 12 extending toward the base 11. Several bolt holes are provided on the side plates 13, so that the side plates 13 are tightly attached to the side of the base 11 and connected to the side of the base 11 by fastening bolts, thereby realizing the detachable fastening connection between the cover 12 and the base 11, which facilitates the disassembly and replacement of the sleeve 1 on the liquid cooling pipe 5.
[0033] exist Figure 2 In a preferred embodiment shown, a locking block 14 is provided on the side surface of the side plate 13 facing the side of the base 11, and a locking groove 101 is provided on the side of the base 11. The locking groove 101 is configured to cooperate with the locking block 14 and restrict the side plate 13 from moving relative to the base 11 along the axial direction of the sleeve 1, thereby preventing the cover 12 from moving relative to the base 11 and losing the connection relationship, which would result in insufficient contact between the sleeve 1 and the liquid cooling pipe 5 and affect the heat dissipation effect.
[0034] exist Figure 1In a preferred embodiment shown, a second thermal pad 4 is further included. The second thermal pad 4 is applied to the contact surface between the base 11 and the liquid cooling pipe 5, and also to the contact surface between the housing 12 and the liquid cooling pipe 5. The function of the second thermal pad 4 is to enhance the heat conduction efficiency between the liquid cooling pipe 5 and the base 11 or the housing 12. The second thermal pad 4 is made of the same material as the first thermal pad 3, except that the first thermal pad 3 is square, while the two second thermal pads 4 are both semi-cylindrical, thus forming a cylindrical shape and clamping it onto the liquid cooling pipe 5.
[0035] exist Figure 2 In a preferred embodiment shown, grooves 102 are formed on the surfaces of the base 11 and the casing 12 where the second heat-conducting pad 4 is disposed. The second heat-conducting pad 4 is disposed within the grooves 102 to prevent the second heat-conducting pad 4 from moving back and forth or rotating inside the sleeve 1, thereby preventing the second heat-conducting pad 4 from detaching from the sleeve and affecting the cooling efficiency of the device. The thickness of the second heat-conducting pad 4 needs to be slightly greater than the depth of the groove 102.
[0036] exist Figure 3 In a preferred embodiment shown, each fin 2 has a groove 201 on its free end edge. The first heat-conducting pad 3 is simultaneously inserted into several grooves 201 to prevent the first heat-conducting pad 4 from shifting back and forth or left and right at the end of the fin 2. This prevents the first heat-conducting pad 3 from detaching from the end of the fin 2 and the heating element 6, thus affecting the cooling efficiency of the device. It also prevents the movement of the first heat-conducting pad 3 from damaging the fin 2.
[0037] exist Figure 3 In a preferred embodiment shown, a plurality of through holes 202 are spaced apart on the surface of the fin 2, and the through holes 202 of each fin 2 are aligned with each other. The through holes 202 have two functions: first, they increase the contact area between the fin 2 and the air, which indirectly improves the heat conduction and heat dissipation efficiency; second, they allow the external airflow to convect between the closely arranged fins 2 through the through holes 202, thereby further improving the heat conduction and heat dissipation efficiency of the device.
[0038] exist Figure 3 In a preferred embodiment shown, a plurality of notches 203 are spaced apart on both sides of the fin 2. The notches 203 of each fin 2 are aligned with each other. The function of the notches 203 is to increase the contact area between the fin 2 and the air, thereby indirectly improving the heat conduction and heat dissipation efficiency.
[0039] like Figure 1 As shown, combined with Figure 4This utility model discloses an energy storage device, comprising a liquid-cooled pipe 5, a heating element 6, and a liquid-cooled pipe cooling device. The liquid-cooled pipe cooling device is disposed between the liquid-cooled pipe 5 and the heating element 6, and is in contact with both the liquid-cooled pipe 5 and the heating element 6, serving to conduct heat between them. The heating element 6 can be a heat-generating module inside a high-voltage box, such as a copper busbar or a circuit breaker.
[0040] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A liquid-cooled pipeline cooling device, characterized in that, include: Sleeve (1) is fitted onto liquid cooling pipe (5); Several fins (2) are arranged on the sleeve (1) along the extending direction of the sleeve (1); First thermal pad (3); The fins (2) are spaced apart, one end of each fin (2) is disposed on the sleeve (1) and the other end extends radially along the sleeve (1), and the surface of the fin (2) is parallel to the radial section of the sleeve (1). The first thermal pad (3) is simultaneously attached across the free ends of several fins (2), and the surface of the first thermal pad (3) away from the fins (2) abuts against the surface of the heating element (6).
2. The liquid cooling pipeline cooling device according to claim 1, characterized in that: The sleeve (1) includes a base (11) and a cover (12); the base (11) and the cover (12) form a sleeve (1) and clamp the liquid cooling pipe (5).
3. The liquid cooling pipeline cooling device according to claim 2, characterized in that: The cover (12) has side plates (13) extending toward the base (11) on both sides. The side plates (13) are closely attached to the side of the base (11) and connected to the side of the base (11) by fastening bolts.
4. The liquid cooling pipeline cooling device according to claim 3, characterized in that: The side plate (13) has a locking block (14) on its side facing the base (11), and the base (11) has a locking groove (101) on its side. The locking groove (101) is configured to cooperate with the locking block (14) and restrict the side plate (13) from moving axially relative to the base (11) along the sleeve (1).
5. A liquid cooling pipeline cooling device according to claim 2, characterized in that: It also includes a second thermal pad (4), which is laid on the contact surface between the base (11) and the liquid cooling pipe (5) and on the contact surface between the cover (12) and the liquid cooling pipe (5).
6. A liquid cooling pipeline cooling device according to claim 5, characterized in that: The base (11) and the cover (12) are provided with grooves (102) on the surface of the second heat-conducting pad (4), and the second heat-conducting pad (4) is provided in the grooves (102).
7. A liquid cooling pipeline cooling device according to claim 1, characterized in that: Each of the fins (2) has a groove (201) at its free end edge, and the first heat-conducting pad (3) is simultaneously inserted into several grooves (201).
8. A liquid cooling pipeline cooling device according to claim 1, characterized in that: A plurality of through holes (202) are spaced apart on the surface of the fin (2), and the through holes (202) of each fin (2) are aligned with each other.
9. A liquid cooling pipeline cooling device according to claim 1, characterized in that: The two sides of the fin (2) are provided with a number of notches (203) spaced apart, and the notches (203) of each fin (2) are aligned with each other.
10. An energy storage device, characterized in that: The invention includes a liquid cooling pipe (5), a heating element (6), and a liquid cooling pipe cooling device as described in any one of claims 1 to 9. The liquid cooling pipe cooling device is disposed between the liquid cooling pipe (5) and the heating element (6). The liquid cooling pipe cooling device is in contact with both the liquid cooling pipe (5) and the heating element (6) and is used for heat conduction between the liquid cooling pipe (5) and the heating element (6).