Low pressure injection molded battery packaging structure
By setting injection-molded structural components and outer pads on the outside of the battery protection board and adjusting the position of the flexible circuit board, the problem of insufficient space on the rigid circuit board of the protection board is solved, thereby improving the encapsulation utilization rate and heat dissipation capacity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SCUD FUJIAN ELECTRONICS
- Filing Date
- 2025-04-21
- Publication Date
- 2026-06-19
AI Technical Summary
The bending area of the existing battery protection board occupies the space at the head of the cell, resulting in insufficient space for the rigid board of the protection board, which affects the packaging utilization rate and heat dissipation capacity.
The low-voltage injection-molded battery packaging structure is adopted. By setting an injection-molded structural component on the outside of the rigid protective board, the flexible board extends out of the injection-molded structural component and covers the outer pad at the protrusion position of the flexible board. The bending position of the flexible board is adjusted to avoid occupying the space of the rigid protective board, thereby improving the packaging utilization rate and increasing the heat dissipation capacity.
This provides ample space for the rigid protection board, improves packaging utilization and heat dissipation, and ensures the packaging strength of the cell head.
Smart Images

Figure CN224384485U_ABST